Indicating Transducer Patents (Class 29/595)
  • Patent number: 7017434
    Abstract: A sensor includes a sensor body with a head having a cavity, a sensor element in the cavity, and a base at a foot of the sensor body. The base has a flange and a protective element of the flange. A thickness of the base, including the protective element, is greater than a width of the cavity.
    Type: Grant
    Filed: December 2, 2002
    Date of Patent: March 28, 2006
    Assignee: Epcos AG
    Inventor: Wolfgang Grundmann
  • Patent number: 7003873
    Abstract: A method of making a gaseous fluid data sensor assembly for acquiring data regarding the ambient environment adjacent a surface of an airframe with adjacent air speeds below 40 knots (or another aerodynamic structure with low speed gaseous fluid flow adjacent thereto) having a flexible substrate adhesively conforming to the airframe surface, a conformable cover layer and a relatively thin air data sensor for sensing air pressure between the substrate and the cover layer. The method includes forming a flexible printed circuit on a polymeric film, attaching thin air data sensor to the printed circuit and attaching a flexible substrate to form a conformal air data sensor. The method may also include attaching a data acquisition circuit to the printed circuit and may still further include providing an optical interconnection between the air data sensor and the data acquisition circuit.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: February 28, 2006
    Assignee: Honeywell International, Inc.
    Inventors: Jeffrey N. Schoess, Mark D. Simons
  • Patent number: 6996891
    Abstract: The invention relates to a method for the manufacture of a sensor element and to a sensor element. In the method, both surfaces of a sensor film are provided with metallic electrodes. The sensor element is produced by cutting it from a larger amount of sensor element material. In the manufacture of the sensor element material, the electrodes are produced as a continuous process from roll to roll and the sensor element material is formed by laminating as a continuous process from roll to roll. At least the signal electrode consists of repeated electrode patterns which are at least partially connected to each other via one or more narrow connecting strips, and a sensor element of a desired length and/or shape is produced by cutting the material across the region of the connecting strips.
    Type: Grant
    Filed: July 3, 2000
    Date of Patent: February 14, 2006
    Assignee: Emfitech Oy
    Inventor: Heikki Räisänen
  • Patent number: 6973706
    Abstract: A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes fanning channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive material can also be formed on the substrate by other impact and non-impact methods. In a preferred embodiment, the method includes cutting the substrate to form a sensor having a connector portion and a transcutaneous portion, the two portions having edges that define one continuous straight line.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: December 13, 2005
    Assignee: TheraSense, Inc.
    Inventors: James Say, Michael F. Tomasco, Adam Heller, Yoram Gal, Behrad Aria, Ephraim Heller, Phillip John Plante, Mark S. Vreeke
  • Patent number: 6959481
    Abstract: A probe for non-destructive determination of complex permittivity of a material and for near field optical microscopy is based on a balanced multi-conductor transmission line structure created on a dielectric substrate member which confines the probing field within a sharply defined sampling volume in the material under study. A method for manufacturing dielectric support member based probes includes anisotropically depositing a 50-100 ? thick underlayer of Cr, Ni, W or Ta onto the dielectric support member, anisotropically depositing conductive material onto the Cr, Ni, W or Ta underlayer, and removing the unwanted conductive material at the sides of the dielectric support member to electrically isolate the created conductive strips.
    Type: Grant
    Filed: March 21, 2003
    Date of Patent: November 1, 2005
    Assignee: Neocera, Inc.
    Inventors: Robert L. Moreland, Hans M. Christen, Vladimir V. Talanov, Andrew R. Schwartz
  • Patent number: 6951047
    Abstract: A SAW element of the present invention includes a plurality of inter-digital transducer (IDT) electrodes on a piezoelectric substrate, grating reflector electrodes disposed on the sides of the IDT electrodes, and a plurality of pad electrodes led from the IDT electrodes and the grating reflector electrodes. A plurality of the pad electrodes includes isolated pad electrodes not directly opposed to the outer periphery of the SAW element, and adjacent pad electrodes directly opposed to the outer periphery thereof A connecting electrode between the isolated pad electrode and the adjacent pad electrode is removed by etching at least before dicing in order to prevent discharge from occurring due to pyroelectricity, and to prevent the electrodes from being damaged.
    Type: Grant
    Filed: July 30, 2003
    Date of Patent: October 4, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Muneko Tomioka, Kiyoharu Yamashita, Mitsuhiro Furukawa
  • Patent number: 6944931
    Abstract: The present invention discloses an inertial sensor having an integral resonator. A typical sensor comprises a planar mechanical resonator for sensing motion of the inertial sensor and a case for housing the resonator. The resonator and a wall of the case are defined through an etching process. A typical method of producing the resonator includes etching a baseplate, bonding a wafer to the etched baseplate, through etching the wafer to form a planar mechanical resonator and the wall of the case and bonding an end cap wafer to the wall to complete the case.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: September 20, 2005
    Assignees: The Boeing Company, California Institute of Technology
    Inventors: Kirill V. Shcheglov, A. Dorian Challoner, Ken J. Hayworth, Dean V. Wiberg, Karl Y. Yee
  • Patent number: 6936303
    Abstract: The present invention provides an electric type initiator which can secure a reliability in activation and can be easily manufactured. The electric type initiator is characterized by comprising a header portion formed by using a resin material, a pair of conductive pins having top portions going through the header portion and exposing from an end portion of the header portion, a bridge wire formed by using a conductive body bridging between the top portions of the conductive pins, and a priming arranged in contact with the bridge wire. And, the present invention provides an initiator assembly which can be easily manufactured with less steps of the manufacturing process and can further reduce a manufacturing cost.
    Type: Grant
    Filed: October 27, 2000
    Date of Patent: August 30, 2005
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Nobuyuki Katsuda, Satoshi Kubozuka, Shingo Oda
  • Patent number: 6920681
    Abstract: An electromagnetic actuator includes a stationary member, a movable member magnetically coupled with the stationary member with a gap therebetween, and a support member for displaceably supporting the movable member relative to the stationary member. Both the stationary member and the movable member have a core section carrying a coil wound around its periphery. As the coil of the stationary member and that of the movable member are energized with electric current, the movable member is either attracted toward or repulsed from the stationary member. The electromagnetic actuator can be used for an optical scanner by providing a mirror and a lens on the movable member.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: July 26, 2005
    Assignee: Canon Kabushiki Kaisha
    Inventors: Futoshi Hirose, Takayuki Yagi, Susumu Yasuda, Takahisa Kato
  • Patent number: 6918696
    Abstract: A temperature sensor includes a casing having a first part and a second part, a temperature detector for detecting temperature of fluid and a pair of outside wires connecting to the temperature detector. The casing further includes a mold portion and an insert portion. The mold portion is disposed in the first part of the casing. The insert portion is disposed in the second part of the casing, and includes a pair of holes for inserting the outside wires therein. The temperature detector is disposed in the first part of the casing. Each outside wire extends from the second part of the casing to an outside of the casing through the hole.
    Type: Grant
    Filed: January 8, 2004
    Date of Patent: July 19, 2005
    Assignee: Denso Corporation
    Inventors: Akihiko Hoshisashi, Seizaburou Kawashima
  • Patent number: 6904666
    Abstract: A simplified method for forming passive microwave components, such as a filter, and passive microwave components formed by the method. The method includes forming a ceramic insert having a plurality of resonator regions and then die casting an outer casing of a conductive material about the ceramic insert. Each resonator region has a cavity that may be filled with the conductive material used to die cast the outer casing or, alternatively, may be filled with a resonator rod made of different materials than the encapsulating metal.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: June 14, 2005
    Assignee: Andrew Corporation
    Inventor: James L. Alford
  • Patent number: 6904667
    Abstract: An injection molding process for fabricating a Coriolis flowmeter. The process includes the steps forming a material flow path core using a core mold, placing the formed material flow path core into a wrapper mold having a cavity whose surfaces define the exterior surface of the plastic Coriolis flowmeter structure to be formed, injecting low temperature metal or soluble material into the cavity of the wrapper mold, removing the plastic Coriolis flowmeter structure from the wrapper mold, and removing the material flow path core from the plastic Coriolis flowmeter by melting the low temperature metal core or by dissolving the soluble material using hot water.
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: June 14, 2005
    Assignee: Micro Motion, Inc.
    Inventors: Gregory Treat Lanham, Anthony Pankratz
  • Patent number: 6865799
    Abstract: A method of manufacturing strain-detecting devices is provided. First, plural cylindrical substrates, each of which has one end closed by a diaphragm, are fixedly placed at predetermined positions of a fixing plate. A positioning marker is previously given to the fixing plate. The fixing plate having the substrates is then assembled into a jig. The jig sustains the substrates so that an outer surface of the diaphragm of each substrate is held at the same level. Through positioning the substrates, all the diaphragms are then positioned in place in a plane direction of the fixing plate with reference to the positioning marker. A strain gage portion is simultaneously formed on each of all the diaphragms. The fixing plate is then disassembled from the jig. In this step, the substrates with the strain gage portions, i.e., strain-detecting devices, are separated from the fixing plate.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: March 15, 2005
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Yukihiko Hata, Kunihiro Yamaura, Hiroshi Nagasaka
  • Patent number: 6862795
    Abstract: A method of manufacturing a monolithic silicon acceleration sensor is disclosed. The monolithic silicon acceleration sensor includes one or more sensor cells, each sensor cell having an inertial mass positioned by beam members fixed to a silicon support structure. According to the method, a sandwiched etch-stop layer is formed. First sections of the inertia mass and beam members are also formed. In addition, a second section of the inertial mass is formed. Further, an inertial mass positioned by beam members fixed to a silicon support structure is formed. Also, a first cover plate structure is bonded to a first surface of the silicon support structure.
    Type: Grant
    Filed: June 17, 2002
    Date of Patent: March 8, 2005
    Assignee: VTY Holding Oy
    Inventor: Geoffrey L. Mahon
  • Patent number: 6851180
    Abstract: A manufacturing method for a gas senor having sensor element on and in which an outer electrode terminal and an inner electrode terminal are press-fitted. The manufacturing method features stability of installation of the outer and inner electrode terminals without causing physical damage to the sensor element. Outer and inner terminal installation jigs are used in the method.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: February 8, 2005
    Assignee: Denso Corporation
    Inventors: Yasuo Hattori, Kazuo Matsubara
  • Patent number: 6848155
    Abstract: A method of manufacturing an edge reflection type surface acoustic wave device using a Shear Horizontal type surface acoustic wave includes the steps of making a first half cut defining a first end surface portions having a smooth surface, that is, opposing two end surfaces which function as reflection end surfaces, from the upper surface of a piezoelectric substrate after at least one of a plurality of IDTs has been formed on the upper surface of the piezoelectric substrate, making a second half cut for forming second end surface portions having a rough surface after making the first cut, and making a full cut for cutting the piezoelectric substrate so as to reach the lower surface of the piezoelectric substrate outside of the second end surface portions in the surface acoustic wave propagation direction.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: February 1, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhiro Kuratani, Takao Mukai, Tomoyasu Miyata, Hideharu Yoshikawa
  • Patent number: 6842965
    Abstract: A strain detector where water does not reach a strain-resistance element and which supplies stable output at all times is provided. In the strain detector, a first protective layer made of glass is disposed to cover an insulating substrate and the strain-resistance element. A second protective layer made of resins or glass for covering the first protective layer, and a thermistor for compensating the resistance of the strain-resistance element are disposed.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: January 18, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshirou Otobe, Takashi Kawai, Yukio Mizukami
  • Publication number: 20040261524
    Abstract: Devices and methods are disclosed for sensing the level of a fluid in a reservoir. The device comprises a generator for generating symmetrical pulses of electric potential, a ground generator in communication with the above generator, means for sensing resistance, and a latch circuit in communication with the above means for sensing resistance. In a method of the invention, a first electric potential is applied to an electrode within the reservoir. The first electric potential has a predetermined value and duration. The resistance of fluid within the reservoir is measured during application of the first electric potential. A second electric potential is applied to the electrode after the measurement for a period of time substantially equivalent to the duration of the first electric potential and of a value substantially equivalent to and opposite to the predetermined value of the first electric potential.
    Type: Application
    Filed: June 25, 2003
    Publication date: December 30, 2004
    Inventor: William G. Chesk
  • Publication number: 20040261251
    Abstract: There is provided methods for producing an ultrasonic transducer assembly. The methods generally comprise the steps of creating a multi-layered rigid or flexible printed circuit board, having a top surface and bottom surface; creating a patterned conducting layer upon each of the top and bottom surface; creating at least one patterned backplate electrode on the board or as part of a discreet component which is then attached to the board; creating at least one conductive through-hole via integral with the board; roughening at least a portion of each of the at least one backplate to introduce gas pockets in that portion of a surface of the backplate; and attaching thin insulating or dielectric single or multi-layer film on a portion of the board in which the film has an integral conducting surface and in which the conducting surface is configured so as to form a capacitive structure with the at least one backplate.
    Type: Application
    Filed: April 22, 2004
    Publication date: December 30, 2004
    Inventor: David W Schindel
  • Patent number: 6826816
    Abstract: A method of manufacturing multiple dimension transducer arrays of multiple layer elements from modules is provided. A plurality of multiple layer strips are formed. The strips are separate, such as an elongated strip corresponding in size to one row of elements. Connections between the electrodes of various layers or separate connections from the various electrodes to a bottom of the strip are formed on the separate multiple layer strips. The separate strips are then aligned within a frame and bonded together. The resulting sheet of multiple layer transducer material is then diced to form elements. Due to the previous interconnection of electrodes, each element includes electrical connections for each of the layer electrodes, avoiding the need for vias or high aspect ratio sputtering.
    Type: Grant
    Filed: September 18, 2002
    Date of Patent: December 7, 2004
    Assignee: Siemens Medical Solutions USA, Inc.
    Inventors: Charles D. Emery, Martina Vogt, Stephen C. Englund
  • Publication number: 20040237285
    Abstract: In manufacturing a pressure sensor a recess that will form part of the sensor cavity is formed in a lower silicon substrate. An SOI-wafer having a monocrystalline silicon layer on top of a substrate is bonded to the lower silicon substrate closing the recess and forming the cavity. The supporting substrate of the SOI-wafer is then etched away, the portion of the monocrystalline layer located above the recess forming the sensor diaphragm. The oxide layer of the SOI-wafer here acts as an “ideal” etch stop in the case where the substrate wafer is removed by dry (plasma) or wet etching using e.g. KOH. This is due to high etch selectivity between silicon and oxide for some etch processes and it results in a diaphragm having a very accurately defined and uniform thickness. The cavity is evacuated by forming a opening to the cavity and then sealing the cavity by closing the opening using LPCVD.
    Type: Application
    Filed: April 15, 2004
    Publication date: December 2, 2004
    Inventors: Pelle Rangsten, Edvard Kalvesten, Marianne Mechbach
  • Publication number: 20040226162
    Abstract: A method of manufacturing a surface acoustic device that has a surface acoustic wave filter including comb-like electrodes, electrode pads, and wiring patterns formed on a joined substrate produced by joining a piezoelectric substrate and a supporting substrate to each other. This method includes the steps of: activating at least one of the joining surfaces of the piezoelectric substrate and the supporting substrate; and joining the piezoelectric substrate and the supporting substrate in such a manner that the activated joining surfaces face each other.
    Type: Application
    Filed: March 23, 2004
    Publication date: November 18, 2004
    Applicants: FUJITSU MEDIA DEVICES LIMITED, FUJITSU LIMITED, NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Michio Miura, Takashi Matsuda, Yoshio Satoh, Masanori Ueda, Hideki Takagi
  • Publication number: 20040211262
    Abstract: A pressure sensor includes a pressure sensor house assembly which contains a reference cavity, in which a vacuum exists, and a getter capable of being thermally activated. The getter is activated by directly contacting the getter with an exterior heated body, conducting heat from the exterior heated body, maintaining the exterior heated body in direct contact with the getter for a predetermined period of time, and removing the exterior heated body.
    Type: Application
    Filed: February 10, 2004
    Publication date: October 28, 2004
    Applicant: MKS Instruments Inc.
    Inventor: Staffan Jonsson
  • Publication number: 20040200280
    Abstract: The present invention discloses a resonator gyroscope comprising a resonator including two bodies, each with a center of mass and transverse inertia symmetry about an axis that are substantially coincident and each supported by one or more elastic elements and wherein the bodies together forming two differential rocking modes of vibration transverse to the axis with substantially equal frequencies and wherein the two bodies transfer substantially no net momentum to the baseplate when the resonator is excited. The gyroscope further includes a baseplate affixed to the resonator by the one or more elastic elements.
    Type: Application
    Filed: April 2, 2003
    Publication date: October 14, 2004
    Applicant: The Boeing Company
    Inventor: A. Dorian Challoner
  • Publication number: 20040200055
    Abstract: The invention provides a method of manufacturing a cylindrical encoder, molded from rubber material, containing ferromagnetic powders mixed therein, using a pair of metal molds comprising an upper metal mold and a lower metal mold. The lower metal mold has a cylindrical cavity which is provided with a pot portion at an inlet side thereof, a rectification receiving portion at an outlet side thereof opposing to the inlet side, and a rectification portion between the pot portion and the rectification receiving portion at the inside of the pot portion. An annular shaped rubber material using the rubber material is formed, and mounted on the pot portion of the lower metal mold. The annular shaped rubber material is compressed on to the lower metal mold by using the upper metal mold with the applied heating, thereby charged into the cylindrical cavity.
    Type: Application
    Filed: April 8, 2003
    Publication date: October 14, 2004
    Inventors: Yasuo Taniguchi, Kenji Nakagawa
  • Publication number: 20040200056
    Abstract: It is an object of the present invention to provide an ultrasonic transducer, which is so configured as to reduce the variations in characteristics, thereby to enable the stabilization of the precision, as well as to enable the improvement of the durability, and the like, a method for manufacturing the ultrasonic transducer, and an ultrasonic flowmeter. In order to attain this object, in accordance with the present invention, the ultrasonic transducer is so configured as to include a piezoelectric element and an acoustic matching layer, wherein the acoustic matching layer is made of a dry gel of an inorganic oxide or an organic polymer, and a solid skeletal part of the dry gel has been rendered hydrophobic. With this configuration, it is possible to obtain the ultrasonic transducer having an acoustic matching layer 3 which is very lightweight and has a small acoustic impedance due to the solid skeletal part of the dry gel which has been rendered hydrophobic.
    Type: Application
    Filed: May 3, 2004
    Publication date: October 14, 2004
    Applicant: Masushita Electric Industrial Co., Ltd.
    Inventors: Masaaki Suzuki, Takashi Hashida, Masahiko Hashimoto
  • Patent number: 6802113
    Abstract: A position sensor for an electronic control pedal is carried by the pedal mounting bracket and includes a linear potentiometer having a slider operable along a substrate in only a linear direction for providing an output voltage representative of slider displacement. A drive arm is connected to the pedal shaft for rotation during pedal movement. A coupler connected to the slider is slidable within a slot in the drive arm for providing the linear displacement through a rotational movement of the shaft. The drive arm has an inner arm in a telescoping connection with an outer arm for setting the drive arm at a desired length after potentiometer calibration. The longitudinal axis of the slot is at an non-zero angle to the longitudinal axis of the drive arm for desensitizing the sensor calibration and adjustment process.
    Type: Grant
    Filed: August 14, 2002
    Date of Patent: October 12, 2004
    Inventor: William C. Staker
  • Publication number: 20040194546
    Abstract: A capacitive humidity sensor comprising a humidity sensitive film made of an organic polymer resin and provided on a conductive substrate serving as a lower electrode, a moisture permeable upper electrode provided on the humidity sensitive film, and a lead wire electrically connected to the upper electrode is characterized in that the area for the junction of the upper electrode and the lead wire is 2.5 mm2 or less and/or 10% or less of the total area of the upper electrode.
    Type: Application
    Filed: February 20, 2004
    Publication date: October 7, 2004
    Inventor: Masashi Kanehori
  • Publication number: 20040187292
    Abstract: One embodiment disclosed relates to a method for sealing an active area of a surface acoustic wave (SAW) device on a wafer. The method includes providing a sacrificial material over at least the active area of the SAW device, depositing a seal coating over the wafer so that the seal coating covers the sacrificial material, and replacing the sacrificial material with a target atmosphere. Another embodiment disclosed relates to an SAW device sealed at the wafer level (i.e. prior to separation of the die from the wafer). The device includes an active area to be protected, an electrical contact area, and a lithographically-formed structure sealing at least the active area and leaving at least a portion of the electrical contact area exposed.
    Type: Application
    Filed: April 9, 2004
    Publication date: September 30, 2004
    Inventors: Gregory D. Miller, Mike Bruner, Lawrence Henry Ragan, Gary Green
  • Patent number: 6798193
    Abstract: A calibrated, low-profile magnetic sensor and method for forming such a sensor are described herein. Generally, a magnetic sensing device is formed within a housing, wherein the magnetic sensing device comprises at least one magnet. The magnetic sensor includes a compact integrated circuit package such as, for example, a small outline integrated circuit package (SOIC). A magnetic sensing element is generally mounted to the compact integrated circuit package. The magnetic sensing device can be configured to additionally incorporate a printed circuit board (PCB) having a hole formed therein such that the compact integrated circuit package can be surface mounted off-center on the printed circuit board, so that the hole can be located within the printed circuit board to match a shape of the magnet, allowing the magnet to pass through the circuit board adjacent to the SOIC to complete the magnetic circuit.
    Type: Grant
    Filed: August 14, 2002
    Date of Patent: September 28, 2004
    Assignee: Honeywell International Inc.
    Inventors: Mike W. Zimmerman, Lamar F. Ricks, Curtis B. Johnson, Joel D. Stolfus, Douglas L. Mueller
  • Patent number: 6792678
    Abstract: An improved manufacturing method for a gas sensor is provided which is capable of establishing a required hermetic seal in a body of the gas sensor. The method includes preparing a sensor assembly including a housing, an air cover, an insulation porcelain, and a sensor element, pressing the air cover against the housing to fit an end of the air cover on an end of the housing to form an overlap thereof, and welding the air cover to the housing over the overlap. The welding is accomplished while pressing the air cover against the housing, thereby compressing an elastic member in the air cover to establish a hermetic seal between the sensor element and the housing. The air cover may be tack welded to the housing before welding the overlap for securing a positional relation between the air cover and the housing.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: September 21, 2004
    Assignee: Denso Corporation
    Inventors: Hirokazu Yamada, Masato Ozawa
  • Patent number: 6772505
    Abstract: A method of assembling the annular antenna and transponder tag includes formation of the antenna wire with an insulating cover therearound; cutting the covered antenna to length; stripping antenna wire ends; threading one antenna wire end through the transponder; splicing the antenna wire ends together; and injecting an insulating composition around the transponder tag and spliced antenna ends.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: August 10, 2004
    Assignee: The Goodyear Tire & Rubber Company
    Inventors: Brian Matthew Logan, Robert Charles Schisler, James William Prentis, David Scott Persinger, Timothy Joseph Severt
  • Publication number: 20040150413
    Abstract: The present invention provides a cantilever which enables a further improvement of a surface resolution capability of a scanning capacity microscope (SCM) with regard to a cantilever employed for the SCM, as compared with a case of employing a conventional cantilever. As the cantilever applied to the SCM according to the present invention, that cantilever has a probe part 1 scanning a sample and an electrode part 2 supporting that probe part 1. Moreover, that probe part 1 includes an insulator 1a having a square pyramidal shape and a conductive wiring 1b placed only on one surface of that insulator 1a having the square pyramidal shape.
    Type: Application
    Filed: August 25, 2003
    Publication date: August 5, 2004
    Applicant: Renesas Technology Corp.
    Inventor: Hitoshi Maeda
  • Patent number: 6769166
    Abstract: A method of making an electrical current sensor having an electrical conducting portion (6; 6a, 6b) of rectangular cross-section being surrounded, on three of its lateral faces, by a magnetic circuit portion (7) which has end portions (7′, 7″) having planar surfaces situated substantially in a plane of a fourth lateral face of the conductor portion (6), a magnetic field detector (3; 24; 26) being arranged opposite the fourth lateral face. The conductor portion (6) is made by photo-lithography and etching in a layer of electrically conducting material applied on a first surface of a flat support member (1; 1′; 1″) or on intermediate layers (8, 9, 10, 11) deposited on the support member. The magnetic circuit portion (7) is made by photo-lithography and etching in a layer of magnetically permeable material applied on the conductor portion (6) on the first surface of the support member (1; 1′, 1″) or of an intermediate layer (8).
    Type: Grant
    Filed: February 14, 2000
    Date of Patent: August 3, 2004
    Assignee: Liaisons Electroniques-Mecaniques LEM SA
    Inventor: Hubert Blanchard
  • Publication number: 20040118227
    Abstract: A sensor includes a sensing portion for sensing physical quantity, a connector portion integrated with the sensing portion for electrically connecting the sensing portion and an outer circuit outside the sensor, a sensor casing for accommodating the sensing portion, and a connector casing for accommodating the connector portion. Both the sensor casing and the connector casing are made of thermoplastic resin. The sensor casing has a predetermined portion exposed outside from the connector casing. The other portion of the sensor casing is covered with the connector casing.
    Type: Application
    Filed: August 11, 2003
    Publication date: June 24, 2004
    Inventors: Masatoshi Tokunaga, Yasuaki Makino
  • Patent number: 6751858
    Abstract: In a method for manufacturing a sensor apparatus having a sensor chip disposed in a recess of a case, after the sensor chip is disposed in the recess of the case, an opening portion of the recess is closed with a sheet member. The sheet member can prevent foreign matters from intruding an inside of the recess during manufacturing steps. After that, a through hole is formed in the sheet member. Accordingly, the inside and outside of the recess communicate with each other, and the sensor chip can detect an external environment of the recess such as atmospheric pressure.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: June 22, 2004
    Assignee: Denso Corporation
    Inventors: Minoru Tokuhara, Yukihiro Kato
  • Publication number: 20040112149
    Abstract: The invention provides a weight sensor (10) which includes a first electrically conductive sheet (12) electrically isolated from a second electrically conductive sheet (14) by inserts of a closed cell foamed polymeric dielectric (16) and an elastic dielectric (18) in spaces (20) formed between the inserts (16) located between the sheets (12, 14). The sensor (10) also includes capacitive measuring means (24), electrically connected between the first sheet (12) and the second sheet (14), which measures a change of capacitance between the sheets (12, 14) when a vehicle passes over the sheets (12, 14). The sensor (10) further includes converting means (26) for converting the change of capacitance to a number related to a weight of the vehicle.
    Type: Application
    Filed: June 12, 2003
    Publication date: June 17, 2004
    Inventor: Rudiger Heinz Gebert
  • Patent number: 6735845
    Abstract: A method of manufacturing a pressure sensor house assembly which contains a reference cavity, in which a vacuum exists, and a getter capable of being thermally activated. The getter is activated by directly contacting the getter with an exterior heated body, conducting heat from the exterior heated body, maintaining the exterior heated body in direct contact with the getter for a predetermined period of time, and removing the exterior heated body.
    Type: Grant
    Filed: August 20, 1999
    Date of Patent: May 18, 2004
    Assignee: MKS Instruments Inc.
    Inventor: Staffan Jonsson
  • Publication number: 20040083804
    Abstract: In a borehole logging tool, the flow of conductive fluid into or out of a wellbore at the wellbore wall is detected and measured with a sensor loop proximate the borehole inner wall. The sensor loop includes a series of contiguous sensors that act as electromagnetic flowmeters and provide fluid measurements covering the entire circumference of the sensor loop. The sensor loop includes an elastic element that forces the sensor loop outward to maintain pressure along the sensor loop circumference against the interior borehole wall. The sensor loop is designed to lie at a non-perpendicular angle to the wellbore axis, and mechanical arms press the top and bottom of the loop against the borehole inner wall.
    Type: Application
    Filed: June 20, 2003
    Publication date: May 6, 2004
    Inventor: Robert E. Maute
  • Publication number: 20040074285
    Abstract: A gas detector and process for detecting a fluorine-containing species in a gas containing same, e.g., an effluent of a semiconductor processing tool undergoing etch cleaning with HF, NF3, etc. The detector in a preferred structural arrangement employs a microelectromechanical system (MEMS)-based device structure and/or a free-standing metal element that functions as a sensing component and optionally as a heat source when elevated temperature sensing is required. The free-standing metal element can be fabricated directly onto a standard chip carrier/device package so that the package becomes a platform of the detector.
    Type: Application
    Filed: October 17, 2002
    Publication date: April 22, 2004
    Inventors: Frank Dimeo, Philip S. H. Chen, Jeffrey W. Neuner, James Welch, Michele Stawasz, Thomas H. Baum, Mackenzie E. King, Ing-Shin Chen, Jeffrey F. Roeder
  • Publication number: 20040074288
    Abstract: In order to establish processing techniques capable of making multi-tip probes with sub-micron intervals and provide such microscopic multi-tip probes, there is provided an outermost surface analysis apparatus for semiconductor devices etc. provided with a function for enabling positioning to be performed in such a manner that there is no influence on measurement in electrical measurements at an extremely small region using this microscopic multi-tip probe, and there are provided the steps of making a cantilever 1 formed with a plurality of electrodes 3 using lithographic techniques, and forming microscopic electrodes 6 minute in pitch by sputtering or gas-assisted etching a distal end of the cantilever 1 using a focused charged particle beam or using CVD.
    Type: Application
    Filed: August 29, 2003
    Publication date: April 22, 2004
    Inventors: Yoshiharu Shirakawabe, Hiroshi Takasashi, Tadashi Arai
  • Publication number: 20040069052
    Abstract: A modified atomic force microscope (AFM) is used to perform contact resistance and/or current-dependent stiction measurements for conductive thin films at controlled values of applied force. The measurements are preferably performed under conditions approximating the operation of the thin films as electrodes in microswitch array fingerprint sensors. A first, planar thin film is contacted with a second, curved thin film deposited over a round ball having a diameter of a few microns to a few tens of microns. The second film is preferably a coating deposited over the ball and over the arm controlling the ball motion. The coating deposited over the arm provides an electrically conductive path to the contact surface of the ball.
    Type: Application
    Filed: July 3, 2003
    Publication date: April 15, 2004
    Inventor: Shiva Prakash
  • Patent number: 6715198
    Abstract: A magnetic sensor of orthogonal flux-gate type is provided with a cylindrical core made of a soft magnetic material; an internal conductor that is placed inside the core; a detection coil wound up on the core; and an external conductor that is placed around the core and electrically connected to the internal conductor. A high-frequency current is allowed to flow through the internal core so that a magnetic field to be measured which resides around the detection coil is changed and the intensity and direction of the magnetic field to be measured is detected on the basis of an output of the detection coil. Since the external conductor is placed on the periphery of the core, it is possible to prevent the magnetic flux formed by the core from magnetizing any space, and consequently to concentrate the magnetic field on the core.
    Type: Grant
    Filed: March 14, 2002
    Date of Patent: April 6, 2004
    Assignee: Sumitomo Special Metals Co., Ltd.
    Inventor: Makoto Kawakami
  • Publication number: 20040055401
    Abstract: A method for manufacturing a flexural plate wave sensor includes the steps of depositing an etch-stop layer over a substrate, depositing a membrane layer over the etch stop layer, depositing a piezoelectric layer over the membrane layer, forming a first transducer on the piezoelectric layer and forming a second transducer on the piezoelectric layer, spaced from the first transducer. The method further includes the steps of etching a cavity through the substrate, the cavity having substantially parallel interior walls, removing the portion of the etch stop layer between the cavity and the membrane layer to expose a portion of the membrane layer, and depositing an absorptive coating on the exposed portion of the membrane layer.
    Type: Application
    Filed: June 6, 2003
    Publication date: March 25, 2004
    Inventors: Brian T. Cunningham, John R. Williams
  • Publication number: 20040055382
    Abstract: Accelerometer offset is reduced by forming mass support structures within an inner periphery of the mass, affixing the mass support structures to the substrate by at least one anchor positioned near the mass' center of mass, and affixing the sensing fingers proximate to the anchor. The mass support structures can be affixed to the substrate using a single anchor or multiple anchors that are positioned close together. The sensing fingers can be affixed to the substrate or to the mass support structures. The mass is typically suspended from within its periphery but toward its outer periphery.
    Type: Application
    Filed: July 18, 2003
    Publication date: March 25, 2004
    Inventors: Howard R. Samuels, David C. Hollocher, Michael Judy, Thor Juneau
  • Publication number: 20040050161
    Abstract: A method of manufacturing a micromechanical component has a substrate (1), a movable sensor structure (6) in a micromechanical functional layer (5) located over the substrate; a first sealing layer (8) on the first micromechanical functional layer (5) which is at least partly structured; a second micromechanical functional layer (10) on the first sealing layer (8), which has at least one sealing function and is anchored at least partly in the first micromechanical functional layer (5); and a second sealing layer (8) on the second micromechanical functional layer (10). The sensor structure (6) is provided with trenches (7) whose width is not larger than a maximum trench width (66), which is sealable by the first sealing layer (8) in the form of plugs (9) which do not extend to the trench bottoms.
    Type: Application
    Filed: August 21, 2003
    Publication date: March 18, 2004
    Inventor: Markus Lutz
  • Publication number: 20040020292
    Abstract: The present invention is directed to a sensing structure comprising four components: a central block proof mass, a continuous belt-shaped membrane (or one having another suitable shape), a piezoelectric sensing layer placed on top of the membrane, and a fixed mounting frame. Electrodes are attached to the top and the underside of the piezoelectric sensing layer. The structure results in an axisymmetric stress distribution.
    Type: Application
    Filed: April 17, 2003
    Publication date: February 5, 2004
    Inventor: Ken Kan Deng
  • Publication number: 20040011130
    Abstract: A micromechanical rotation speed sensor with a gimbals-mounted structure capable of vibration includes two vibration elements (4, 5) which are swivelled about two axes (A, B) oriented perpendicular toward each other. An excitation unit in the form of an electrode (7) sets the first vibration element (4) into a vibration about the first axis of rotation (A). A read out unit in the form of a read out electrode (8) records a tipping or vibration of the second vibration element (5) about the second axis of rotation (B) as a measure for the rotation speed of the sensor. Additional mass elements (6a, 6b) which are symmetrically aligned are situated on the upper side (2a) and the underside (2b) of the first vibration element (4) which form a rocker. The sensor is manufactured of at least three individually processed wafers which are finally joined together and form a top part (1), a midsection (2) and a bottom part (3).
    Type: Application
    Filed: July 23, 2003
    Publication date: January 22, 2004
    Inventors: Karin Bauer, Tanjo Gleissner, Konrad Lentner, Stefan Sassen, Josef Schalk, Ralf Voss
  • Publication number: 20040007053
    Abstract: An SPM sensor having a cantilever, a holding element at one end of the cantilever and a sensor tip at the other end of the cantilever, wherein the holding element is made from a photoresist and the cantilever and/or the tip are made from another material. The photoresist is preferably SU-8, and the other material for the cantilever and/or the tip is preferably silicon, a silicon compound, metals and mixtures thereof. The production of a frame having a plurality of the SPM sensors, wherein both the frame and the holders for the individual SPM sensors and at least the holding element consist of SU-8. The process allows for inexpensive production of the SPM sensors, the sensors being supplied to the user in a frame from which he can detach the sensors.
    Type: Application
    Filed: March 26, 2003
    Publication date: January 15, 2004
    Inventors: Stefan Lutter, Manfred Detterbeck, Theo Hartmann
  • Patent number: 6668467
    Abstract: There is provided a displacement measuring apparatus efficiently productive and easily applicable to high precise measurement of displacement with contact probe detection for hardly-measurable works in the art such as micro-works and deep parts in complicated structures. A scale member includes a spindle and a scale both supported by a parallel leaf spring movable on a scale substrate. The spindle is arranged in coaxial with a measurement axis in the scale member. The L & S slit-processed scale is integrated with the spindle and supported by the parallel leaf spring to move together with the spindle along the measurement axis. The spindle, scale and parallel leaf spring are coupled to the scale substrate interposing an anchor of the parallel leaf spring therebetween. The spindle, scale and parallel leaf spring are formed in an integral structure and only the anchor contacts the scale substrate while the spindle, scale and parallel leaf spring slightly float from the scale substrate.
    Type: Grant
    Filed: July 19, 2001
    Date of Patent: December 30, 2003
    Assignee: Mitutoyo Corporation
    Inventors: Toshitaka Shimomura, Atsushi Tominaga