With Other Electrical Component Patents (Class 29/601)
  • Patent number: 12255380
    Abstract: A surgical sponge is provided, having a radiofrequency (RF) tag positioned interior thereto. The RF tag has a base layer with at least one tab projecting from an outer perimeter of thereof. The RF tag has a first protective layer with at least one tab projecting from the outer perimeter of the RF tag and generally aligned with the at least one tab of the base layer and an RF identifier laminated between the base layer and the first protective layer. The RF identifier has an antenna, and an electrically responsive member. The antenna can be a metal foil loop antenna etched on to the base layer. The RF identifier can include additional metal foil provided on the base layer when the metal foil loop antenna is etched on to the base layer, the additional metal foil configured to enhance x-ray opacity of the sponge.
    Type: Grant
    Filed: October 25, 2023
    Date of Patent: March 18, 2025
    Assignee: Augustine BioMedical and Design, LLC
    Inventor: Scott D. Augustine
  • Patent number: 12218426
    Abstract: An antenna module and communication device containing the antenna module are disclosed. The antenna module is disposed in a metal cavity. The antenna module includes a switched beam mm-wave antenna array having radiating elements separated by less than a wavelength of the radiating elements. The array is fed by a single transceiver chain. The array is disposed at the focal length of a low-profile mm-wave lens configured to steer the beam. A sub-10 GHz antenna is disposed closer to the opening of the cavity than the lens. The lens is a Fresnel Zone Plate lens having a focal length of less than about the wavelength of the beam, or a Saucer lens having shells of different refractive indexes and having a profile that is more than 6 times smaller than a Luneburg lens with a same focal length.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: February 4, 2025
    Assignee: Intel Corporation
    Inventors: Tae Young Yang, Seong-Youp John Suh, Harry G. Skinner, Ashoke Ravi, Ofir Degani, Ronen Kronfeld
  • Patent number: 12176610
    Abstract: An apparatus comprising a first layer, a second layer and a third layer. The first layer may comprise a plurality of first through via openings, a plurality of first blind openings and a coplanar waveguide input. The second layer may comprise a plurality of second through via openings, a plurality of second blind via openings and an aperture. The third layer may comprise a ground. The coplanar waveguide input may comprise a vertical transition to a waveguide. The first through via openings and the second through via openings may provide a through via between the first, second and third layer. The first blind via openings may provide a blind via from the first to the second layer. The second blind via openings may provide a blind via from the second to the third layer. The coplanar waveguide input may transmit an output from a circuit to the waveguide.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: December 24, 2024
    Assignee: Oculii Corp.
    Inventor: Jun Yao
  • Patent number: 12177971
    Abstract: A wiring board includes an insulating layer comprising organic resin with inorganic particles, a first metal layer on a first surface, and a second metal layer disposed on a second surface. The insulating layer has a thickness of 75-1000 ?m and a storage modulus of 4 GPa-7 GPa. The first metal layer has a thickness of 1.5-10 ?m and a coverage of 5%-25%. The second metal layer has a thickness of 3-10 ?m or 25-100 ?m and a coverage of 85% or more. A surface part of the insulating layer on the first metal layer side has a higher ratio of organic resin than a surface part of the insulating layer on the second metal layer side.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: December 24, 2024
    Assignee: KYOCERA Corporation
    Inventors: Tadashi Nagasawa, Satoshi Yoshiura
  • Patent number: 12170411
    Abstract: An antenna device includes a substrate, a first ground layer, a radiation electrode, and waveguide structures. Each of the waveguide structures has a slit and a conductor wall. The slit is positioned in an electric field direction of the radiation electrode and provided in the first ground layer. The conductor wall surrounds the slit and extends in a thickness direction of the substrate. A dimension of the waveguide structure in a magnetic field direction in plan view is greater than ½ of a wavelength of a radio wave emitted by the radiation electrode in a medium of the substrate. A length from the slit to a terminal portion of the waveguide structure is about ¼ of a wavelength of the radio wave emitted by the radiation electrode in the waveguide structure.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: December 17, 2024
    Assignee: MURATA MANUFACTURING CO, LTD.
    Inventor: Hiroshi Nishida
  • Patent number: 12161916
    Abstract: Golf balls having one or more marks for improving the detection and tracking thereof by radar systems and methods of applying the marks to the golf balls are provided. The methods of the present disclosure involve applying the radar detectable marks to a layer of the golf ball by pad printing. The methods described herein utilize a plurality of pad printing stations having multi-impact capabilities and reorientation mechanisms to apply the radar detectable marks to the golf ball layer. The use of the multi-impact pad printers combined with the rotational capabilities of the reorientation mechanisms enables precise delivery of the radar detectable marks in a consistent and repeatable manner over the entire surface of the golf ball layer and multi-pole printing within a wide print area on the golf ball layer.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: December 10, 2024
    Assignee: Acushnet Company
    Inventors: Vincent Simonds, Matthew Hogge, Michael Madson, Michael McNamara, Kenneth Rebello, Jedediah James, Michael Couto
  • Patent number: 12147864
    Abstract: Provided is a method for manufacturing a radiofrequency chip card. The method comprises the steps of: forming a card body comprising a relay antenna and an insulating cover layer on at least one main face of the card, arranging a module equipped with a radiofrequency module antenna on the card body opposite the relay antenna for radiofrequency coupling; forming a metal insert in the card body, the insert extending up to the edges of the card and comprising a space permeable to the radiofrequency field opening on at least one of the two main faces of the insert and comprising the relay antenna inside and/or opposite this space. Provided also is a corresponding card produced by the method.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: November 19, 2024
    Assignee: THALES DIS FRANCE SAS
    Inventors: Lucile Mendez, Frédérick Seban, Claude Colombard, Arek Buyukkalender, Jean-Luc Meridiano
  • Patent number: 12119910
    Abstract: Embodiments of this application provide a communication method, a communication device, a storage medium, and an electronic device. The method is applied to a first device. The first device is provided with a first antenna, a second antenna, and a third antenna. The method includes: receiving, at a first moment, first data from a second device through the first antenna and second data from the second device through the second antenna, where a distance between the first antenna and the second antenna is a first distance, a distance between the first antenna and the third antenna is a second distance, the first distance and the second distance are greater than a first threshold, a distance between the second antenna and the third antenna is a third distance, the third distance is less than a second threshold, and the first threshold is greater than or equal to the second threshold.
    Type: Grant
    Filed: April 30, 2024
    Date of Patent: October 15, 2024
    Assignee: RUIJIE NETWORKS CO., LTD.
    Inventors: Jianxiang Chen, Lei Zheng
  • Patent number: 12100715
    Abstract: Example array substrates are provided. One example array substrate includes an underlying substrate, an antenna and a component layer, where the antenna and the component layer are located on a same side of the underlying substrate, where the component layer and the antenna are disposed at intervals, where the component layer includes a plurality of metal laminates and a plurality of dielectric laminates that are stacked, and where the plurality of metal laminates and the plurality of dielectric laminates are alternately disposed to form a plurality of thin film transistors.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: September 24, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Huajun Cao, Guozhong Ma, Yukun Guo, Yong Lu
  • Patent number: 12050958
    Abstract: The present invention provides a physical card capable of improving authenticity identification and a method of using thereof. The physical card is provided with two electronic tags of different wavebands. When a physical card is to be traded, the purchaser can perform an appearance inspection of the physical card, or use a first reader in the purchaser's mobile phone to directly read a high-frequency electronic tag of the physical card and obtain a card first information, so that purchaser can quickly and automatically determine the authenticity of the physical card. In addition, an UHF electronic tag in the physical card can be read by a second reader of a verification agency, and then a second information of the physical card can be obtained. Since the physical card is used without leaving the holder of the physical card during the whole process, the contactless transaction mode maintains a social safety distance, which can improve the security of the physical card when in use.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: July 30, 2024
    Inventor: Chi-Ching Chen
  • Patent number: 12040534
    Abstract: Provided is an electronic device having a transparent antenna for 5G communication according to the present invention. The electronic device comprises: a transparent antenna embedded in a display to emit a signal to the front surface of the display; and a transmission line for feeding power to the transparent antenna. The transparent antenna includes: a first emitter configured as a first metal mesh grid on a first substrate; and a second emitter configured as a second metal mesh grid on a second substrate disposed above the first substrate.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: July 16, 2024
    Assignee: LG ELECTRONICS INC.
    Inventors: Kukheon Choi, Ilnam Cho, Seungmin Woo, Byeongyong Park
  • Patent number: 12005670
    Abstract: An RFID tag manufacturing system is provided that includes a conveyance device that conveys a base sheet provided with a plurality of antenna patterns to each of which an RFIC module is fixed. The system includes a laminating device that attaches a cover seal on the base sheet to cover the antenna patterns and a punching device that produces RFID tags by punching the cover seal and the base sheet with a punching blade that includes a frame-shaped cutting edge surrounding the antenna patterns to form a frame-shaped cut. The base sheet includes alignment mark in a non-attachment part of the cover seal. The punching device specifies the position of each of the antenna patterns covered with the cover seal based on the alignment mark, and punches the cover seal and the base sheet based on the specified position of the antenna pattern.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: June 11, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshinori Yamawaki, Noboru Kato, Ryosuke Washida
  • Patent number: 11962078
    Abstract: An electronic device includes a plurality of antenna units and a circuit. At least one of the antenna units includes a first electrode, a phase modulation electrode, and a liquid crystal layer located between the first electrode and the phase-shift electrode. The circuit provides a first AC signal directly to the phase modulation electrode, and it provides a second AC signal indirectly to the phase-shift electrode.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: April 16, 2024
    Assignee: INNOLUX CORPORATION
    Inventor: Tsung-Han Tsai
  • Patent number: 11955684
    Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing
  • Patent number: 11953617
    Abstract: A system and method for a multi-panel multi-function active electronically scanned array (AESA) radar operation receives radar commands from individual aircraft systems and segments a plurality of AESA panels fixed (at variable azimuth/elevation about the aircraft) into a plurality of subarrays to carry out each individual function commanded by the individual aircraft system. Dependent on aircraft status and phase of flight, the and individual AESA are designated for use and the subarrays are sized based on desired radar function at the specific phase of flight and specific threat associated with the phase. The system dynamically shifts the designated AESA, subarray size, beam characteristics, power settings, and function to enable multiple simultaneous function of the suite of AESA panels.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: April 9, 2024
    Assignee: Rockwell Collins, Inc.
    Inventors: Jacob G. Teague, Venkata A. Sishtla, Jiwon L Moran, James B. West
  • Patent number: 11948036
    Abstract: A transaction card (smartcard) having a front “continuous” or non-continuous metal layer (ML, CML, DML) with a module opening (MO) for a dual-interface transponder chip module (TCM). Coating polyurethane resin may be used to replace (in lieu of) adhesive film layers and plastic slugs, and to fill module openings, cut-outs and voids in a metal transaction card. The amplifying element (BAC) and magnetic shielding layer may be encapsulated in a polyurethane resin. The resin may further fill and seal the module opening in the front face continuous metal layer and any voids or recesses in subsequent layers. The resin may fill and seal any discontinuity or opening in the rear discontinuous metal layer. The dual interface chip module may be implanted in a milled-out cavity in the polyurethane resin. Removed metal sections may also be encased in polyurethane resin.
    Type: Grant
    Filed: July 17, 2022
    Date of Patent: April 2, 2024
    Assignee: Metaland LLC
    Inventors: David Finn, Darren Molloy, Daniel Pierrard
  • Patent number: 11876292
    Abstract: A slot antenna assembly adapted to a metal case is provided in the disclosure. The slot antenna assembly includes a substrate and a metal wire. The substrate includes a first sheet plate and a second sheet plate. The first sheet plate is conductive and is provided with a slot opposite to an opening of the metal case, a size of the slot being less than or equal to a size of the opening. The second sheet plate is not conductive and is connected to the first sheet plate. The metal wire is located on a surface of the second sheet plate to be connected to a feeding signal. A vertical projection of the metal wire on the first sheet plate crosses the slot, and the metal wire and the slot together excite a low-frequency mode and a high-frequency mode.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: January 16, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Fang-Hsien Chu, Peng-Hao Juan
  • Patent number: 11855731
    Abstract: An antenna offset compensation determination method includes: transmitting, from a first apparatus to a second apparatus, one or more first signals from a first plurality of antenna elements, of a first antenna of the first apparatus, and one or more second signals from a second plurality of antenna elements, of the first antenna; receiving, at the first apparatus from the second apparatus, one or more first indications of a first linear offset of a first signal distinction line relative to a second antenna of the second apparatus, the first signal distinction line corresponding to a first transition between the one or more first signals and the one or more second signals as received by the second antenna; and determining, based on the first linear offset, one or more compensation parameters for compensating for the first linear offset.
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: December 26, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Seyong Park, Pinar Sen, Renqiu Wang, Peter Gaal, Naga Bhushan, Krishna Kiran Mukkavilli, Muhammad Sayed Khairy Abdelghaffar, Hwan Joon Kwon, Tingfang Ji
  • Patent number: 11844881
    Abstract: The present invention is directed to a composite material with a high dielectric constant. In certain embodiments, the composite material of the invention is biocompatible and is used in an implantable medical device, such as an implantable antenna, probe, sensor or electrode. In certain embodiments, the present invention comprises a biocompatible conductive or semi-conductive filler comprising filler particles dispersed within a biocompatible electrically insulating material. The filler particles may comprise an electrically insulating coating.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: December 19, 2023
    Assignee: The Curators of the University of Missouri
    Inventors: Kevin O'Connor, Randy D. Curry
  • Patent number: 11782544
    Abstract: An image display device according to an embodiment of the present disclosure includes a display panel, a touch sensor structure and an antenna electrode layer. The display panel includes a panel substrate, and an electrode structure and an insulation structure stacked on the panel substrate. The touch sensor structure is disposed on the display panel. The antenna electrode layer is disposed on the display panel at the same level as that of the touch sensor structure and at least partially overlaps the electrode structure of the display panel in a thickness direction. The antennal electrode layer is disposed in consideration of an electrode construction of the display panel and the touch sensor structure to provide a thin-layered image display device with high reliability.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: October 10, 2023
    Assignees: DONGWOO FINE-CHEM CO., LTD., POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Yoon Ho Huh, Dong Pil Park, Young Jun Lee, Won Bin Hong
  • Patent number: 11764453
    Abstract: A radio-frequency device comprises an encapsulation material and a radio-frequency chip embedded into the encapsulation material, wherein the radio-frequency chip has a first main surface and a second main surface. The radio-frequency device furthermore comprises an electrical redistribution layer arranged over the first main surface of the radio-frequency chip and the encapsulation material, and a radio-frequency antenna formed in the redistribution layer and configured to emit signals in a direction pointing from the second main surface to the first main surface and/or to receive signals in a direction pointing from the first main surface to the second main surface. The radio-frequency device furthermore comprises a microwave component having an electrically conductive wall structure, the microwave component being arranged below the radio-frequency antenna and embedded into the encapsulation material.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: September 19, 2023
    Assignee: Infineon Technologies AG
    Inventors: Walter Hartner, Bernhard Rieder
  • Patent number: 11751337
    Abstract: A functional vehicle component and related methods include a transmitter coil and a molded part. The molded part includes a first thermoformed film, a molded polymeric structural layer arranged under the film, a printed electronic circuit arranged under the film and adjacent the structural layer, an optional second thermoformed film, and graphics on the first film. The electronic circuit includes a receiver coil, conductive traces, and electronic elements. The first film is arranged to cover the polymeric structural layer and the electronic circuit to thereby define an exposed surface of the molded part. The first film and/or the graphics camouflages the circuit. The transmitter coil is connected to an external power source, and is arranged on the molded part such that the receiver coil is inductively coupled to the transmitter coil so as to wirelessly power the electronic elements of the circuit.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: September 5, 2023
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Alex W. Baker, Zainab I. Ali
  • Patent number: 11724112
    Abstract: A biostimulator, such as a leadless cardiac pacemaker, having a header assembly that includes an antenna, is described. The antenna can be integrated into an insulator that separates an electrode of the header assembly from a flange of the header assembly. The antenna includes an antenna loop embedded in a ceramic material of the insulator. The antenna loop is located distal to the flange to reduce the likelihood of signal interference and increase communication range of the antenna. The header assembly is mounted on a housing have an electronics compartment, and an antenna lead extends from the antenna loop to electronic circuitry contained within the electronics compartment. Other embodiments are also described and claimed.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: August 15, 2023
    Assignee: PACESETTER, INC.
    Inventors: Bei Ning Zhang, Brett C. Villavicencio, Perry Li, Souvik Dubey
  • Patent number: 11722211
    Abstract: A closed-loop motion monitoring and control system for structural mode control in a large, flexible space structure. The system uses combined sensor data to detect low-magnitude, low-frequency motion, estimate structure deformation constants, and damp structural vibrations with electromagnetic torque application.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: August 8, 2023
    Assignee: AST & Science, LLC
    Inventors: Darren J. Zanon, Raymond J. Sedwick
  • Patent number: 11721883
    Abstract: A semiconductor package includes a semiconductor die, an encapsulation layer and at least one antenna structure. The encapsulation layer laterally encapsulates the semiconductor die. The at least one antenna structure is embedded in the encapsulation layer aside the semiconductor die. The at least one antenna structure includes a dielectric bulk, and a dielectric constant of the dielectric bulk is higher than a dielectric constant of the encapsulation layer.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: August 8, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Wen-Shiang Liao
  • Patent number: 11707631
    Abstract: An antenna assembly for use with a medical implant includes an antenna that defines at least one turn and an electromagnetic shield.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: July 25, 2023
    Assignee: Advanced Bionics AG
    Inventors: Austin Charles Davis, James George Elcoate Smith
  • Patent number: 11628694
    Abstract: A tire including a rubber sheet which covers an end of the carcass ply which has been folded back and an RFID tag serving as an electronic component provided between the bead filler and the rubber sheet, in which the bead filler is formed in an annular shape, the rubber sheet is formed in an annular shape by one end side and another end side of a long sheet being joined, and the RFID tag serving as the electronic component is disposed between the bead filler and the rubber sheet at a joint part which is a portion of the rubber sheet which is joined.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: April 18, 2023
    Assignee: Toyo Tire Corporation
    Inventor: Harunobu Suita
  • Patent number: 11574881
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: February 7, 2023
    Assignee: MediaTek Inc.
    Inventors: Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu
  • Patent number: 11557567
    Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: January 17, 2023
    Assignee: ASSEMBLEON BV
    Inventors: Rudolphus H. Hoefs, Roy Brewel, Richard A. Van Der Burg
  • Patent number: 11557837
    Abstract: The present disclosure provides a manufacturing method of a flat panel liquid crystal antenna, including the following steps: providing a first substrate, wherein the two sides of the first substrate are provided with a first metal film layer and a third metal film layer respectively; simultaneously patterning the metal film layer on the two sides to obtain a patterned first metal film layer and a patterned third metal film layer; providing a second substrate, wherein one side of the second substrate is provided with a second metal film layer; patterning the second metal film layer to obtain a patterned second metal film layer; and oppositely bonding the first substrate and the second substrate to form a liquid crystal cell, and preparing a liquid crystal layer. The present disclosure also provides a flat panel liquid crystal antenna by using the above method.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: January 17, 2023
    Assignee: TRUWIN OPTO-ELECTRONICS LIMITED
    Inventors: Zhisheng Liu, Xiangzhan Xu, Zhiling Wang, Taitian Lyu, Zhuoqian Lu, Lixiong Wang, Jiqiang He
  • Patent number: 11527826
    Abstract: A display device includes a display panel in which an active area and a peripheral area are defined, and an antenna unit including a main pattern, a first sub-pattern, and an antenna line. The main pattern is disposed on the display panel in the active area, transmits and/or receives a signal, and operates at a first frequency. The first sub-pattern is disposed on the display panel in the active area, is spaced apart from the main pattern in a first direction, is capacitively coupled to the main pattern, and operates at a second frequency different from the first frequency.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: December 13, 2022
    Assignees: SAMSUNG DISPLAY CO., LTD., UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
    Inventors: Gangil Byun, Jae-Kyoung Kim, Kiseo Kim, Wonsang Park, Jinmyeong Heo
  • Patent number: 11519982
    Abstract: A radio frequency (RF) system comprises an RF-array of antenna elements, a regulating arrangement to tune the antenna elements' impedances and a camera system to acquire image information of the RF-array. An analysis module is provided to derive operational settings such as resonant tuning settings, decoupling and impedance matchings of the antenna elements' impedances from the image information. The image information also represents the actual impedances and resonant properties of the RF-array. From the image information appropriate impedance settings can be derived that are the tuning parameters to render the RF-array resonant.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: December 6, 2022
    Assignee: Koninklijke Philips N.V.
    Inventors: George Randall Duensing, Sascha Krueger, Christian Findeklee, Oliver Lips
  • Patent number: 11503719
    Abstract: An electrical component includes an electrical part and a flat carrier on which the electrical part is disposed. A housing accommodates the carrier with the electrical part such that the part on the carrier is situated opposite a housing section to which the carrier is connected. An annular casing composed of a flexible material completely surrounds the electrical part and bears against the carrier by way of its first end and against the housing section by way of its second end. A potting compound surrounds the electrical part within the casing and at least partially fills the free volume. A method for producing an electrical component is also provided.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: November 15, 2022
    Assignee: Vitesco Technologies GmbH
    Inventors: Gregory Drew, Thomas Riepl, Detlev Bagung
  • Patent number: 11385749
    Abstract: Discussed is a touch display device having an antenna disposed in a panel, thereby improving product reliability while reducing manufacturing cost. The touch display device includes a display unit including a plurality of pixels disposed in an active area, an encapsulation unit disposed on the display unit, the encapsulation unit being configured to seal the plurality of pixels, a touch sensor unit including a plurality of touch sensors disposed on the encapsulation unit, an antenna pattern disposed at an edge on the touch sensor unit in the state in which a planarization layer is interposed therebetween, the antenna pattern not overlapping a touch electrode and a touch routing line included in the touch sensor unit, and a ground plane disposed in an identical layer to any one metal layer belonging to the display unit, the ground plane overlapping the antenna pattern.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: July 12, 2022
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Seung-Hyun Youk, Min-Joo Kim, Sang-Hyuk Won
  • Patent number: 11380990
    Abstract: Provided are a liquid crystal phase shifter, a manufacturing method thereof, and a liquid crystal antenna. The liquid crystal phase shifter includes a first substrate, a second substrate, microstrips, a ground electrode, and liquid crystals located between the at least one microstrip and the ground electrode. The microstrip line is disposed on a side of the second substrate facing towards the first substrate and includes a first transmission line and a second transmission line that are each a coil and are nested with each other in a direction perpendicular to a plane of the second substrate. The coiling transmission directions of radio frequency signals transmitted on the first and second transmission lines are opposite. The ground electrode overlaps both the first transmission line and the second transmission line in the direction perpendicular to the plane of the second substrate.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: July 5, 2022
    Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Zhenyu Jia, Kerui Xi, Baiquan Lin, Qinyi Duan, Feng Qin
  • Patent number: 11374305
    Abstract: An antenna structure utilizing metallic frame of electronic device to simultaneously send and receive radio waves on multiple frequencies includes first and second feeding sources and the metallic frame. A notch in the metallic frame creates first and second radiating portions. The first feeding source feeds the first radiating portion, and a first mode and a second mode can be activated simultaneously to generate radiation signals in a first frequency band and a second frequency band. The second feeding source feeds the second radiating portion and a third mode and a fourth mode can be simultaneously activated to generate radiation signals in a third frequency band and a fourth frequency band. A wireless communication device is also provided. The wireless communication device includes a motherboard and the antenna structure.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: June 28, 2022
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventor: Tun-Yuan Tsou
  • Patent number: 11375609
    Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: June 28, 2022
    Assignee: RAYTHEON COMPANY
    Inventors: Thomas V. Sikina, James E. Benedict, John P. Haven, Andrew R. Southworth, Semira M. Azadzoi
  • Patent number: 11138487
    Abstract: A method for manufacturing antenna pattern according to an embodiment includes an adhesive arranging step, a metal sheet arranging step, a cutting step, a removing step, and a pressurizing step. In the adhesive arranging step, an adhesive is arranged inside with respect to a perimeter line of the antenna pattern arranged on a continuous body while conveying the continuous body of a base material.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: October 5, 2021
    Assignee: SATO HOLDINGS KABUSHIKI KAISHA
    Inventor: Yoshimitsu Maeda
  • Patent number: 10599971
    Abstract: Method of producing wire inlaid on a support and inlaid wire obtained. The invention relates to an antenna for radiofrequency transponder, said antenna comprising conducting wire portions which are to a major extent inlaid and conducting wire portions which are to a minor extent non-inlaid on a plane support. The antenna is characterized in that said wire portions which are to a minor extent non-inlaid extend over or cross at least one favoured fold line and/or one fold line predefined according to a standardized folding resistance test. The invention also relates to a portable electronic object comprising said antenna and a corresponding method of production.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: March 24, 2020
    Assignee: THALES DIS FRANCE SA
    Inventors: Sébastien Gaspari, Blandine Alleysson, Elisabeth Kerguen, Olivier Leveque
  • Patent number: 10289945
    Abstract: In one embodiment, a radio-frequency identification (RFID) tag includes a substrate having a top surface including first and second ends, a bottom surface, first and second end surfaces, and opposed lateral surfaces, a passive RFID integrated circuit (IC) chip mounted to the top surface of the substrate, a monopole antenna that includes a planar radiating arm that extends out from the RFID IC chip along the top surface of the substrate to the first end of the top surface of the substrate and a matching loop having two grounded matching stubs that surround the chip and a portion of the radiating arm, each matching stub comprising a longitudinal segment that extends along a longitudinal direction of the substrate and a transverse segment that extends along a transverse direction of the substrate along the top surface of the substrate to the radiating arm at a point located between the RFID IC chip and the first end of the top surface, and a ground plane formed on the bottom surface, the second end surface, and
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: May 14, 2019
    Assignee: University of South Florida
    Inventors: Ramiro Augusto Ramirez, Thomas McCrea Weller, Eduardo Antonio Rojas
  • Patent number: 10242966
    Abstract: Methods and systems for a thin bonded interposer package are disclosed and may, for example, include bonding a semiconductor die to a first surface of a substrate, forming contacts on the first surface of the substrate, encapsulating the semiconductor die, formed contacts, and first surface of the substrate using a mold material while leaving a top surface of the semiconductor die not encapsulated by mold material, forming vias through the mold material to expose the formed contacts. A bond line may be dispensed on the mold material and the semiconductor die for bonding the substrate to an interposer. A thickness of the bond line may be defined by standoffs formed on the top surface of the semiconductor die.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: March 26, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Christopher J. Berry, Roger D. St. Amand, Jin Seong Kim
  • Patent number: 9986312
    Abstract: A machine includes a first machine substrate and a second machine substrate and a monitoring system for the machine. The monitoring system includes a sensor subsystem including a sensor substrate integral with the first machine substrate and at least one sensor electromagnetic structure coupled to at least a portion of the sensor substrate. The at least one sensor electromagnetic structure includes at least one sensor conducting sub-component. The at least one sensor electromagnetic structure is configured to regulate electromagnetic fields incident thereto in response to at least one measurement characteristic of a machine measurand. The sensor subsystem is configured to obtain at least one measurement characteristic of the machine measurand proximate a machine sensing position.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: May 29, 2018
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Ertugrul Berkcan, Yongjae Lee
  • Patent number: 9836685
    Abstract: In one embodiment, a radio-frequency identification (RFID) tag including a substrate having a top surface, bottom surface, opposed end surfaces, and opposed lateral surfaces, a passive RFID integrated circuit (IC) chip mounted to the top surface of the substrate, a monopole antenna that includes a planar radiating arm that extends out from the RFID IC chip along the top surface of the substrate and a matching loop having two grounded matching stubs that surround the chip and a portion of the radiating arm, and a ground plane formed on the bottom surface, an end surface, and the top surface of the substrate, the ground plane being electrically coupled to the matching stubs and the radiating arm.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: December 5, 2017
    Assignee: University of South Florida
    Inventors: Ramiro Augusto Ramirez, Thomas McCrea Weller, Eduardo Antonio Rojas
  • Patent number: 9362624
    Abstract: An antenna, including at least one set of conductive arms radiative at a resonant frequency, the at least one set of conductive arms including a first conductive arm having a first terminus and a second conductive arm having a second terminus, the first and second termini being closely spaced so as to form a capacitive gap therebetween, the capacitive gap having a width, a feed connection located on the first conductive arm, a first electrical length being defined along the first conductive arm between the feed connection and the first terminus, a ground connection located on the second conductive arm, a second electrical length being defined along the second conductive arm between the ground connection and the second terminus, the resonant frequency depending at least on the width of the capacitive gap and on the first and second electrical lengths, a total electrical length along the set of conductive arms between the first and second termini being less than or equal to half of a wavelength corresponding to
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: June 7, 2016
    Assignee: GALTRONICS CORPORATION, LTD
    Inventors: Marin Stoytchev, Randell Cozzolino
  • Patent number: 9199397
    Abstract: An injection-molded case and a manufacturing method thereof having antenna patterns are formed in the injection-molded case by only one insert injection molding process, without a second insert injection molding process as required in the conventional manufacture. The injection-molded case preferably includes: one or more antenna patterns fabricated by a press process; and an injection-molded case part having the antenna patterns provided therewithin, which is fabricated by fixing the antenna patterns on an injection mold and carrying out only one insert injection molding process.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: December 1, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hae-Won Ahn, Jae-Ho Oh, Jeong-Woon Koo
  • Publication number: 20150144703
    Abstract: The invention relates to an external connector for the production of an electronic card comprising an insulating support that defines an outside face and an inside face opposite one another and a plurality of external metal contact pads. This external connector additionally comprises a plurality of metal projections located on the side of the inside face of the insulating support and respectively connected electrically to at least one subassembly of the plurality of external metal contact pads and/or to contact pads linked to an electronic unit, which is arranged on the inside face of the insulating support, wherein these metal projections are intended to be inserted into individual cavities of the body of the electronic card, and metal contact pads linked to an electronic unit inside the card body and/or an antenna incorporated in this card body are located at the base of these cavities.
    Type: Application
    Filed: May 16, 2013
    Publication date: May 28, 2015
    Inventor: François Droz
  • Publication number: 20150138024
    Abstract: A “thin” and cost-effective three-dimensional antenna assembly and methods of use and manufacturing thereof. In one exemplary embodiment, the solution of the present disclosure is particularly adapted for small form-factor portable radio devices, and comprises an antenna (or array of antennas) deposited on a thin preformed flexible or deformable structure using a conductive fluid. The antenna (array) includes one or more antennas each having a radiator and a plurality of contacts. Use of the thin preformed structure allows, among other things, thinner form factors for the host wireless device, and obviates use of a separate molded carrier or other more costly or involved processes (such as laser direct structuring).
    Type: Application
    Filed: September 19, 2014
    Publication date: May 21, 2015
    Inventors: ESA Kalistaja, Riku Lambacka, Petteri Annamaa
  • Publication number: 20150138022
    Abstract: An antenna device includes: a radio device for radio wave transmission; a primary radiator that has a function to radiates radio waves generated by the radio device; a parabolic reflector that reflects the radio waves radiated from the primary radiator; a shroud that shields against unnecessary radiation radio waves among the radio waves radiated from the primary radiator and reflected by the parabolic reflector; and an antenna mounting mechanism that fits the parabolic reflector to an antenna attachment pole. The shroud is arranged so as to cover at least a right and left of the parabolic reflector, the radio device and the primary radiator are arranged inside the shroud, and the antenna mounting mechanism fits the parabolic reflector to the antenna attachment pole so that the antenna attachment pole is located at a lateral center position of the parabolic reflector.
    Type: Application
    Filed: January 9, 2013
    Publication date: May 21, 2015
    Applicant: NEC Corporation
    Inventor: Yoshihide Takahashi
  • Publication number: 20150138036
    Abstract: There is disclosed an antenna device relating to a single or dual band antenna system for use in mobile telecommunications devices, laptop and tablet computers, USB adapters and electrically small radio platforms comprising a pair of antennas attached to a conductive ground plane, the antennas being separated by free space in which at least one notch is formed in the conductive ground plane between the pair of antennas characterized in that the notch further includes an inductive component and a capacitive component providing good antenna isolation so as to enable MIMO operation or diversity operation.
    Type: Application
    Filed: January 30, 2015
    Publication date: May 21, 2015
    Inventor: Marc Harper
  • Publication number: 20150129664
    Abstract: Disclosed herein are systems and methods for an implantable device comprising a ferromagnetic mass at least partially disposed near a coil, said coil formed of electrically conducting material and having electrical leads, a resonator circuit coupled to the leads and operable to resonate on application of energy from said leads. Some embodiments include an antenna coupled to said resonator circuit, wherein when either the ferromagnetic mass or the coil moves, power is supplied to the resonator circuit. In certain embodiments the device further includes a modulator coupled to said resonator circuit and operable to modulate the output of the resonator circuit where either the ferromagnetic mass or the coil is disposed in an animal such as a human. some embodiments allow for disposing multiple devices in an animal for characterizing different animal motions.
    Type: Application
    Filed: October 17, 2014
    Publication date: May 14, 2015
    Inventor: Gurbinder S. Brar