Abstract: The invention relates to a method for producing electronic components consisting in carrying out a first anodization of a carrier material (1) for forming at least one first pore (3) extending in a first direction in said carrier material (1) and in carrying out a second anodization for forming at least one second pore (17) extending in the carrier material (1) in a second direction different from the first direction.

Abstract: A phased array antenna (PAA) is provided. The PAA includes a plurality of layers fabricated using an additive process such that the PAA conforms to a curvilinear surface. The plurality of layers include: a radiating layer placed on a first surface of a first dielectric layer; a feed layer operationally coupled to a second surface of the first dielectric layer; and a second dielectric layer having a first surface operationally coupled a power and control layer and a second surface operationally coupled to a ground layer. An adhesive layer operationally couples the feed layer to the power and control layer.

Abstract: There are provided an antenna using a buildup structure and a method of manufacturing the same. In the antenna, a tag chip is positioned within a dielectric and is connected to a radiator through a connection line or a via-hole, thereby being strong against external environments, decreasing a defective rate and enabling to be used for the special purpose of being positioned within a metal or liquid.

Abstract: A method for installing a grounding clip into an antenna tube, comprising providing the antenna tube having a cylindrical tube, an upper end and an inner end opposite the upper end, a circumferentially extending groove in the cylindrical tube located between the upper end and the inner end and a tapered lip at the inner end of the cylindrical tube, providing the grounding clip having a resilient base ring, the base ring having an outer circumference for contact with the antenna tube and a gap in the base ring and at least one resiliently flexible contact pin being affixed to and extending from a first end of the base ring, deforming the grounding clip, inserting the deformed grounding clip over the circumferentially extending groove and releasing the clip to allow the clip to expand, wherein the expanded clip is held between the circumferentially extending groove and the tapered lip.

Abstract: A method for producing a device having a transponder antenna connected to contact pads. An antenna with terminal connections is provided in contact with a substrate. The contact pads are placed on the substrate and connected to the terminal sections of the antenna. The connection is produced by means of a soldering by introducing energy between the pads and the terminal sections. The pads are placed such as to provide a surface facing an antenna terminal connection section. The section is arranged on the substrate and the soldering energy is directly applied to the pads. The invention also relates to the device obtained.

Abstract: Disclosed is a radio frequency identifier tag having a microchip with first and second contact nodes, an antenna formed by a conductive line connected between the first and second contact nodes, and first and second conductive line segments connected in parallel and to the first and second contact nodes to form a tail capacitance modifying the antenna capacitance.

Abstract: A semiconductor package includes a semiconductor chip, a die pad being mounted with the semiconductor chip with a dielectric interposed therebetween and serving as an antenna, and a molding resin (sealing resin) sealing the semiconductor chip and the die pad. The relative dielectric constant of the dielectric is higher than that of the sealing resin.

Abstract: An antenna arrangement including a first element operable in a first resonant mode at a first resonant frequency band; and a second element arranged to couple with the first element to enable the first element to resonate in a second resonant mode having a second resonant frequency band, the second element having an impedance at the first resonant frequency band which substantially suppresses coupling between the first element and the second element.

Abstract: Wireless devices such as sensors, interactive displays and electronic article surveillance (EAS) and/or radio frequency identification (RFID) tags including integrated circuitry and an antenna and/or inductor printed thereon, and methods for making and using the same, are disclosed. The device generally includes an integrated circuit on a substrate and an antenna, directly on the substrate and/or the integrated circuit, in electrical communication with the integrated circuit. The method of making a wireless device generally includes forming an integrated circuit on the substrate and printing at least part of an antenna or antenna precursor layer on the integrated circuit and/or substrate. The present invention advantageously provides a low cost wireless device capable of operating at MHz frequencies that can be manufactured in a shorter time period than conventional devices.

Abstract: A method of producing antennas for RFID devices includes cutting or otherwise physically separating the antennas from a preformed sheet of conductive material that includes apertures in the conductive material. Cutting locations relative to the apertures may be selected based on desired performance characteristics of the antenna and/or of the RFID device for which the antenna is to be used. The cutting locations may include one or more cuts through the aperture, and other cuts that do not pass through an aperture. The cutting locations may be selected as a function of such parameters as the desired bandwidth of the antenna and the operating frequency of the antenna. The method allows production of antennas with different characteristics, from a previously-prepared supply of sheet conductive material. This facilitates the ability to make small production runs of antennas, and/or to reduce the lead time for providing antennas with specified characteristics.

Abstract: A wireless frequency tag includes a loop-shaped antenna pattern that is electrically connected to a chip connecting section, and a conducting member that electrically couples a part of the antenna pattern.

Abstract: A method is provided for producing a smart card comprising a chip module with at least one contacting area, the chip module arrangeable in a mounting location of a substrate, wherein one contacting loop is formed from a wire connector fed by a wire guiding unit for at least one of the contacting areas, respectively by attaching a first section of the wire conductor to a surface of the substrate outside the mounting location, wherein a second section of the wire conductor proximate to the first section is guided to form the contacting loop along with and protruding from the surface, wherein a subsequent third section of the wire conductor is attached to the surface outside the mounting location, wherein the chip module is inserted into the mounting location and wherein the second section is bent over and electrically contacted to the contacting area.

Abstract: A radio-controlled timepiece in which its reception sensitivity is further enhanced. The radio-controlled timepiece includes: an antenna core 11 made of a magnetic material and formed as a single integrated body including a coiled portion (11a) wound with a coil 19 and extension portions 11b and 11c which are located respectively on the end-portion sides; additional cores 15 and 16 made of a magnetic material; magnetism-collection members 17 and 18 made of a magnetic material; a main plate 31 (timepiece substrate) made of a non-magnetic material; a guide member 33 made of a non-magnetic material; and a liquid-crystal-panel supporting frame 32 (magnetism-collection-member supporting members, pressing member) made of a non-magnetic material and having protrusions 32a and 32b (pressing members) formed thereon. When the main plate 31, the guide member 33, and the liquid-crystal-panel supporting frame 32 are assembled together, the protrusions 32a and 32b press the magnetism-collection members, respectively.

Abstract: A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing.

Abstract: A mobile wireless communications device may include a portable housing, at least one wireless transceiver carried by the portable housing, and a satellite positioning signal receiver carried by the portable housing. Moreover, a satellite positioning antenna may be carried by the portable housing. The satellite positioning antenna may include an active element connected to the satellite positioning signal receiver, and a passive element connected to a voltage reference and positioned in spaced apart relation from the active element and operatively coupled thereto for directing a beam pattern thereof.

Abstract: Methods and systems of attaching a radio transceiver to an antenna. At least some of the illustrative embodiments are systems comprising an antenna and an integrated circuit configured to operate as a radio transceiver. The antenna comprises a ground plane having a first edge surface, and an active element having a second edge surface. The ground plane and the active element are retained together such that the first and second edge surfaces are substantially coplanar and form an antenna edge. The integrated circuit is configured to operate as a radio transceiver, and the integrated circuit is mechanically coupled to the edge of the antenna and electrically coupled to the active element.

Abstract: A balanced patched inverse F antenna comprises a radiation conductor and a balun circuit. The radiation conductor includes a main body, a first branch and a second branch. The balun circuit includes an unbalanced port, a balanced port, and first, second, third and fourth components, with the first, second, third and fourth components being serially connected. A feeding input of the unbalanced port is connected to the second and third components, a grounding wire of the unbalanced port is connected to the first and fourth components, an inverting terminal of the balanced port is connected to the first and second components, a non-inverting terminal of the balanced port is connected to the third and fourth components, and the inverting and non-inverting terminals are respectively connected to the first and second branches.

Abstract: An antenna system adapted for a communication device has a common antenna with a predetermined length, an AM matching circuit matching with the common antenna and an FM matching circuit matching with the common antenna. A switch alternatively electrically connects the common antenna to the AM matching circuit and the FM matching circuit for achieving the AM function and FM function.

Abstract: A manufacturing method of a wiring board and a semiconductor device at low cost and by a simple process, without performing complicated steps many times is proposed. Furthermore, a manufacturing method of a wiring board at low cost and with fewer adverse effects on the environment, and a manufacturing method of a semiconductor device using the wiring board are proposed. A pattern of a conductive material is formed over a first substrate, a conductive film is formed over the pattern by an electrolytic plating process, the pattern and the conductive film are separated, an IC chip including at least one thin film transistor is formed over a second substrate, and the conductive film is electrically connected to the IC chip.

Abstract: The system of producing an RFID antenna using the silicon in an integrated circuit as the resonant antenna material for the purpose of reducing the cost of an RFID system and for the purpose of increasing the range and selectivity of the RFID system. According to this invention the base silicon sheets which make up the primary building material of the silicon chip (integrated circuit) is subjected to a laser ablation process. This creates three dimensional nano structures on the surface of the silicon thereby raising its absorption rate of electro magnetic signals. On the reverse side of the same silicon sheet a directional antenna is etched using standard photographic reduction techniques and standard semi conductor industry manufacturing methods. The two sides of the silicon are connected through doping aluminum or copper impurities into these same base silicon sheets causing conductivity within the sheet of silicon.

Abstract: A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

Abstract: A radio frequency identification tag includes a substrate, and an antenna pattern disposed on an outer peripheral side surface of the substrate. An electronic device is electrically connected to the antenna pattern, and is mounted on the outer peripheral side surface of the substrate.

Abstract: An antenna apparatus for a printed circuit board including an auxiliary antenna which includes a printed circuit board and mounting components. An antenna pattern is formed on the printed circuit board, and the antenna apparatus includes a first auxiliary antenna unit formed on an upper surface of the printed circuit board; and a second auxiliary antenna unit provided at a location on a lower surface of the printed circuit board that corresponds to location of the first auxiliary antenna unit on the upper surface of the printed circuit board. Efficiency by the antenna apparatus according to the present invention can be increased by approximately 17%.

Abstract: A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.

Abstract: The invention relates to a method of installing a vehicle data-monitoring device and a substitute vehicle data connector into a vehicle having a vehicle data-monitoring system with an existing vehicle data connector, the method comprising the steps of: removing the existing vehicle data connector from a socket in the vehicle; inserting the substitute vehicle data connector into the socket; connecting the vehicle data connectors such that the existing vehicle data connector is in communication with the vehicle data-monitoring device and also in communication with the substitute vehicle data connector.

Abstract: Devices suitable for implantation in a body of a host and systems and methods for their manufacture are provided. The implantable devices include a composite material formed at least from a matrix material and hollow gas-filled beads. In preferred embodiments, the composite material includes a polymeric matrix mixed with hollow air-filled glass beads, which are mixed and cured to form at least a portion of the body of the implantable device. Implantable devices including this composite material have decreased weight and/or overall density as compared to implantable devices without the beads incorporated therein, which is believed to improve the acceptance and function of the implantable device in vivo. Additionally, implantable devices concerned with transmitting and receiving via RF are believed to achieve improved RF performance due to a reduced dielectric constant provided by the incorporation of beads within the composite material.

Abstract: A transponder inlay for a document for personal identification having a transponder substrate, for arrangement of a transponder unit comprising a chip and an antenna, a covering layer, an adhesive layer, wherein the adhesive layer is arranged between the transponder substrate and the covering layer, wherein the transponder substrate has a cutout and the adhesive layer extends at least partly into the cutout.

Abstract: A fabrication method of a radio frequency identification (RFID) antenna coil is provided. First, a substrate is processed by a surface modified procedure, to form a self-assembly membranes (SAMs) on a surface of the substrate. A catalyst is sprayed on the SAMs of the substrate according to patterning. After that, the first electroless plating procedure is first carried out for the substrate to generate a magnetic metal layer corresponding to the wiring pattern on the catalyst, and the second electroless plating procedure is then carried out for the substrate to generate the metal layer on the magnetic metal layer.

Abstract: A tapered meander line antenna is formed by having a conductive material disposed on or in a non-conductive material, in which a length of the conductive material traversing from a proximal end to a distal end meanders in an approximately perpendicular direction from an axis of traversal from the proximal end to the distal end. The spacing between conductive lines that meander are made non-uniform and tapered to have less spacing between the conductors toward the distal end. In one instance the spacing is tapered to have a logarithmic pattern.

Abstract: A method of printing chipless RFID tags with unique features, includes printing a RFID antenna pattern precursor using a first printing process, wherein the RFID antenna pattern precursor includes a plurality of disconnected wire segments; and printing a conductive ink using a second print process to interconnect at least two of the plurality of disconnected wire segments, to produce a final RFID antenna with a unique antenna geometry.

Abstract: An apparatus including an antenna element; a metal part; a ground; and a filter connected between the metal part and the ground that has a frequency dependent impedance.

Abstract: An antenna system for a Radio Frequency Identification (RFID) tag in one embodiment includes a base portion; at least one angled portion oriented to have a tangential angle of between about 1 degree and about 179 degrees from a plane of the base portion; and an antenna trace on the at least one angled portion. An antenna system for an RFID tag in another embodiment includes a base portion; at least one angled portion having at least two sections each oriented to have a tangential angle of between about 1 degree and about 179 degrees from a plane of the base portion, the two sections having different overall angles relative to the base portion; and an antenna trace on the at least one angled portion. Additional systems and methods are presented.

Abstract: In order to offer the technology which can form the pattern of the antenna of the inlet for electronic tags accurately and cheaply, the resist layer at the time of forming the pattern of an antenna by chemical etching is formed using a photogravure printing machine. Let the extending direction of region 16C which has the minimum width in the height of the front surface of a gravure plate be an opposite direction to the direction of rotation of a gravure plate (a doctor's relative direction of movement seen from the gravure plate). The radius of curvature of an inner circumference of the curved part in region 16B is made larger than the radius of curvature of a periphery. The outer edge of region 16D is formed so that it may become forward tapered shape-like toward position D, so that the width of region 16D may become larger than the width of region 16C in position D which the end of height attains.

Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.

Abstract: A method of fabricating an antenna includes the step of stamping an initial set of openings within a metal strip and then plating that metal strip on all exterior surfaces. Initial openings define portions of features of the completed antenna that require plating on all surfaces. Once the metal coil has been plated the metal strips are fed through a final stamping process that makes final cuts that correspond with the initially made openings. The final cuts are on surfaces that do not require plating on all of the exterior surfaces.

Abstract: “The radio-frequency identification device includes embedded in an envelope a substrate on one face of which an antenna is produced and a chip connected to the antenna is positioned, a potting locally covering the substrate face level with the chip, an intermediate layer made of a magnetic superconductor material placed against the substrate on the antenna side, the intermediate layer having dimensions greater than those of the antenna so as to be able to cover the antenna and having a cavity arranged so that the potting and the chip can be approximately completely housed therein.

Abstract: The present invention relates to a portable data carrier (2) and a method for its production, consisting of an apparatus (4) for storing and processing data, an antenna (6) for transmitting energy and information which is connected to the apparatus (4), as well as a plastic surrounding the apparatus (4) and the antenna (6), characterized in that the plastic of the portable data carrier is transparent or partially transparent and the antenna (6) has at least one security feature.

Abstract: Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structure and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.

Abstract: A method for assembling a programmer for a medical device includes assembling a housing member, a first circuit board, a second circuit board, and a plate member in a stacked z-axis configuration.

Abstract: The discone antenna is a small communication antenna with broad voltage standing wave ratio (VSWR) bandwidth. The discone antenna includes a conical antenna element and a disc antenna element adjacent the apex thereof and including a proximal electrically conductive planar member and a spaced apart distal electrically conductive planar member being electrically connected together at respective peripheries thereof defining a folded ground plane. An antenna feed structure is coupled to the disc and conical antenna elements and includes a first conductor coupled to the proximal electrically conductive planar member, and a second conductor coupled to the conical antenna element and to the distal electrically conductive planar member. An impedance element, such as a resistor, may be connected between the second conductor and the distal electrically conductive planar member.

Abstract: A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.

Abstract: A polymorphic antenna, including a metallic template configurable in at least first and second possible different three-dimensional shapes, the antenna, when configured in the at least first and second different three-dimensional shapes, having a common antenna feed point, a common balun coupled to the common antenna feed point; and a common dipole coupled to the common antenna feed point and to the common balun. The antenna operates in a common frequency band when configured in either of the at least first and second different three-dimensional shapes when fed via the common antenna feed point.

Abstract: A tire sensor module having a circuit carrier, on or in which at least one sensor element is attached for measuring a measured variable, an antenna for transmitting sensor signals to a receiving unit of the vehicle, and a housing, in whose housing inner chamber the circuit carrier is received, the antenna being provided in the housing material of the housing or on a housing side of the housing.

Abstract: The present invention relates to a method for manufacturing products comprising transponders. The method comprises introducing a web comprising on its surface sequential structural modules comprising an impedance matching element and an integrated circuit electrically connected to the impedance matching element, the structural modules having a first distance between each other; cutting the web in such a manner that the sequential structural modules are separated from each other; attaching the structural modules to a product substrate, the sequential structural modules having a second distance between each other, the second distance being longer than the first distance; and attaching the impedance matching elements to antennas, the impedance matching elements and the antennas forming an electrical connection.

Abstract: A RFID tag adapted to control goods is provided which has two functions of a magnetic tag and of a RFID tag mounted with an IC chip and can widen the communication range of the RFID tag. The RFID tag is one which is mounted with an IC chip capable of receiving and transferring information from and to the outside in a non-contact fashion. Structurally, the RFID tag comprises a first antenna having electrical conductivity and mounted with the IC chip and a second antenna made of a soft magnetic material and electrically connected to the first antenna.

Abstract: A method of manufacturing a microwave antenna assembly includes the step of providing a proximal portion having an inner conductor and an outer conductor. Each of the inner and outer conductors extend through the proximal portion and the inner conductor is disposed within the outer conductor. The method also includes the step of placing a junction member adjacent to a distal end of the proximal portion such that the inner conductor extends through a channel defined in the junction member. The method also includes the step of placing a proximal end of a distal portion adjacent to a distal end of the junction member such that the inner conductor extends within a channel defined within the distal portion. The method also includes the step of affixing the inner conductor to the distal portion such that the proximal portion and the distal portion apply a compressive force on the junction member.

Abstract: Forming an inlay comprising an antenna wire having two end portions and a site for a transponder chip, comprises: mounting the wire to a surface of substrate; and leaving the end portions of the antenna wire free-standing, as loops adjacent terminal areas of a site on the substrate for the transponder chip. With the transponder chip installed on the substrate, the free-standing loops are repositioned to be substantially directly over the terminals of the transponder chip, in preparation for interconnection of the loops to the terminals of the transponder chip, then are bonded to the terminals. An embedding tool for mounting the wire on the substrate may embed the wire in or adhesively place a self-bonding wire on a surface of the substrate. The substrate may have two transponder chips, and function as a secure inlay. An anti-skimming feature is included in the inlay.

Abstract: The invention relates to an antenna configuration, comprising at least one electrically insulating carrier substrate and at least one electrically conductive layer applied on at least one side of the carrier substrate, the electrically conductive layer having a first area region and a second area region, and the first area region of the electrically conductive layer having the form of at least one antenna structure. The at least one antenna structure is present in a manner electrically insulated from the second area region of the electrically conductive layer, and the second area region of the electrically conductive layer is subdivided, at least in regions directly adjacent to the at least one antenna structure, into island regions that are at least electrically insulated from one another. The at least one antenna configuration is suitable for use for contactlessly coupled transponders, in particular for RFID Tags or Smart Tags.

Abstract: An RFID tag is provided, which has a transponder part with an antenna coil arranged in the transponder part. A mounting part is also provided for fixing the tag in a mounted position. The mounting part has an elongate portion that is engagable with the transponder part so as to be received in the transponder part when the tag is in the mounted position. Further, the tag comprises a magnetic material arranged in the elongate portion of the mounting part.

Abstract: According to embodiments of the present invention, a method for manufacturing a pattern of conductive elements on a substrate is provided. The method includes depositing in a vacuum deposition chamber an electrically conductive material onto the substrate to form a base layer. Then, the method includes selectively applying an electric insulating agent on selective areas of the base layer. Then, areas of the base layer that are not covered with the insulating material are electroplated with a second electrically conductive layer. The electric insulating agent is then removed from the substrate and the base layer is chemically etched thus removing the base layer that was covered with the insulating material and selectively exposing the substrate to create the pattern of conductive objects on the substrate.