Abstract: A manufacturing method of a thin-film head includes the steps of, laminating and patterning a soft magnetic layer with iron alloy that contains silicon and aluminum through a base layer on a substrate; laminating an insulating layer on the patterned soft magnetic layer; performing a chemical-mechanical polishing of a surface of the laminated insulating layer and the patterned soft magnetic layer with a first acid slurry; forming a lower shield layer by a mechanical polishing with a second weak acid, or neutral slurry with a pH different from that of the first slurry; and forming a lower shield gap layer and a magnetoresistive effect layer on the lower shield layer.

Abstract: In a magnetic head manufacturing method, a floated surface of each block having plural magnetic head elements formed and arranged on a substrate is ground and lapped in a grinding/lapping step. The grinding/lapping step contains an angle adjusting step for adjusting the angle of the floated surface of the block with reference to a magnetic-head-element formed surface of a substrate and grinding the floated surface concerned, and a finishing lapping step of lapping the floated surface at an angle adjusted in the angle adjusting step.

Abstract: A method for manufacturing a magnetic write pole and trailing wrap around magnetic shield for use in a perpendicular magnetic data recording system. The method includes the use of a hard mask structure with end point detection material embedded in a hard mask material. The novel hard mask structure provides the mill resistance of a hard mask, with the end point detection advantages of an end point detection layer.

Abstract: A method for constructing a magnetic write head for use in perpendicular magnetic recording, the write head having a write pole with a trailing shield. After forming a magnetic write pole such as by masking and ion milling a magnetic write pole layer, a thin layer of alumina is deposited. This is followed by the deposition of a thin layer of Rh. Then, a thick layer of alumina is deposited, having a thickness that is preferably at least equal to the height of the write pole layer. A chemical mechanical polish is then performed until a portion of the Rh layer over the top (trailing edge) of the write pole is exposed. A material removal process such as ion milling is then performed to remove the exposed Rh layer exposing the thin alumina layer there beneath. Since the Rh trailing gap layer is electrically conductive it can also serve as a seed layer for electroplating the magnetic trailing shield.

Abstract: A method of temporarily protecting an electrically sensitive component from damage due to electrostatic discharge includes defining a shunt having first and second leads electrically connected in parallel with the component and separated by a gap. A portion of a shield layer is deposited to form the shunt between the first and second leads to span the gap therebetween and form a shunted assembly. The shunted assembly and component are lapped to form the ABS at the location of the component, a sacrificial carbon overcoat is deposited on the ABS, and additional processing is performed on the shunted assembly. A portion of the shunted assembly, the shunt, and portions of the sacrificial carbon overcoat are then removed to form an electrical open for an unshunted assembly having ABS features comprising an air bearing cavity/deep gap at a former location of the shunted assembly.

Abstract: Embodiments of the present invention provide a method of manufacturing a magnetic head slider, the method being adapted so that throat height of a main magnetic pole piece of a perpendicular recording magnetic head can be controlled with high accuracy. According to one embodiment, a first Electrical Lapping Guide element (ELG) is disposed on the same layer as a plated underlayer of a shield of one write head in a row bar, and other ELGs are disposed on the same layer as that of a main magnetic pole piece of another write head. Front end positions (Tops) are detected from changes in resistance values of the other ELGs and an ending position of lapping is calculated. Since the front end positions (Tops) of the other ELGs are accurate, it is possible to assign a correlation to throat height “Th” of the main magnetic pole piece and the resistance value of the first ELG by detecting this resistance value existing when the front end positions (Tops) are detected.

Abstract: Current-perpendicular-to-plane (CPP) read sensors having constrained current paths made of lithographically-defined conductive vias with surrounding oxidized metal sublayers, and methods of making the same, are disclosed. In one illustrative example, at least part of a sensor stack structure which includes an electrically conductive spacer layer is formed. A metal (e.g. Ta) sublayer is then deposited over and adjacent the spacer layer, followed by one of an oxidation process, a nitridation process, and an oxynitridation process, to produce an insulator (e.g. TaOx) from the metal sublayer. The metal sublayer deposition and oxidation/nitridation/oxynitridation processes are repeated as necessary to form the insulator with a suitable thickness. Next, a resist structure which exposes one or more portions of the insulator is formed over the insulator. With the resist structure in place, exposed insulator materials are removed by etching to form one or more apertures through the insulator down to the spacer layer.

Abstract: A method of making a magnetoresistive sensor includes defining a track width of a magnetoresistive element stack of the sensor. Further, processes of the method enable depositing of hard magnetic bias material on each side of the stack. These processes may permit both milling of excess depositions of the material outside of regions where the hard magnetic bias material is desired via use of a photoresist and making the material have a planar surface via chemical mechanical polishing, which also removes the material on top of the stack. The method includes removing excess material outside of the photoresist, wherein the excess material includes part of the hard bias layer, while a portion of the hard bias layer remains directly above the MR sensor stack.

Abstract: A reticle having a convex portion and a concave portion is used to form a convex portion and concave portion in the resist pattern for magnetic detection element and conductive layer, respectively. Then, with each resist pattern as a mask, unnecessary portions are removed to determine an initial height and to form a convex portion and concave portion in the magnetic detection element layer and in the conductive layer, respectively. Then, based on a ratio between widths of the convex portion and of the concave portion of the magnetic detection element layer, a deviation of the magnetic detection element layer is obtained, and a deviation of the conductive layer is obtained in a similar way, and based on these deviations the medium facing surface is ground with the conductive layer as a resistance sensor so that the height of the magnetic detection element layer be a desired value.

Abstract: Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, seed layers having anti-reflective properties are utilized, eliminating the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.

Abstract: A method of manufacturing a slider includes forming a slider material containing a portion to be the slider body and a head element. The slider material is processed to form an air bearing surface by lapping a surface to be a medium facing surface of the slider material to form a lapped surface that includes a third surface. Selectively etching the lapped surface for form a second surface and after the selectively etching, lapping a part of the lapped surface to form the first surface, the third surface and a border part.

Abstract: Methods for making devices comprise forming a plurality of transducers on a major surface of a wafer, including forming a plurality of solid layers each having a thickness that is less than one micron; dividing the wafer and the attached transducers into a plurality of units such that each of the units includes a portion of the layers and a substantially planar surface that is substantially perpendicular to the portion of the layers; and removing at least part of the substantially planar surface, including creating, for each transducer, at least one flexible element that is attached the transducer. Conventional problems of connecting a head to the flexure and/or gimbal are eliminated. The heads can be made thinner than is conventional and gimbals and flexures can be more closely aligned with forces arising from interaction with the media surface and from seeking various tracks, reducing torque and dynamic instabilities.

Abstract: Concerns about inadequate electromigration robustness in CCP CPP GMR devices have been overcome by adding magnesium to the current confining structures that are presently in use. In one embodiment the alumina layer, in which the current carrying copper regions are embedded, is fully replaced by a magnesia layer. In other embodiments, alumina is still used but a layer of magnesium is included within the structure before it is subjected to ion assisted oxidation.

Abstract: A vertical recording magnetic head and a method of manufacturing the same is provided. The magnetic head includes a main magnetic pole layer on a surface opposite to a recording medium and a pair of neck height markers which is exposed on the surface around the main magnetic pole layer and which indicates a neck height position of the main magnetic pole layer by way of inter-exposure area ratios. The neck height markers have one cross sections that increases and the other that decreases even though the cross sections in a plane parallel to the surface are oriented toward forward or backward directions in a neck height direction. The neck height markers have the same cross sections at a specific cross sectional position parallel to the surface.

Abstract: By the method of manufacturing a thin film magnetic head, a magnetic material having a suitable characteristic can be used for manufacturing a magnetic pole and corrosion of the magnetic pole can be prevented. The method comprises: a step of forming a multilayered magnetic pole; a step of forming a stopper layer on the magnetic pole; a step of forming an insulating layer on the stopper layer; a step of polishing the insulating layer, by chemical mechanical polishing process, until an upper face of the stopper layer is exposed; a step of removing the stopper layer, by dry etching process with a reactive gas, until an upper face of the magnetic head is exposed; a step of removing the upper face of the magnetic pole, by dry etching process with an inert gas, until reaching a prescribed depth; and a step of polishing the upper face of the magnetic pole, by chemical mechanical polishing process, until the upper face of the magnetic pole is flattened.

Abstract: To provide a method of manufacturing magnetic head slider which is capable of improving the product quality, simplifying the manufacturing process, and reducing the manufacturing time. This method of manufacturing a magnetic head slider, formed by cutting out from a block member, includes the steps of: processing an end face of the block member forming one surface of a magnetic head slider; holding fixedly the end face of the block member processed; and while maintaining a holding state provided by the step of holding, cutting a portion of the end face side of the block member, and processing a cut surface of the cut portion forming another surface of the magnetic head slider.

Abstract: A slider for use in a magnetic data recording system that is constructed from a Si wafer by a method that saves valuable wafer real estate by minimizing kerf related to the cutting of the wafer into slider rows. The sliders are produced from a (110) oriented Si wafer, and the sliders are parsed into rows by a process that involves forming a mask having a trench or opening between the rows of sliders at the location of the desired cut and parallel to a vertical (111) plane of the wafer. The wafer is then exposed to KOH which removes wafer material in the vertical direction through the wafer without removing wafer material in the horizontal direction. The vertical removal of wafer material is due to the extreme preferential removal of the (110) surface Si over that of the (111) surface Si. This results in a narrow straight trench being formed. The KOH etch removal can form a trench or cut having a width of only 30 to 50 um through a 1 mm thick wafer.

Abstract: An optical lapping guide for determining an amount of lapping performed on a row of sliders in a process for manufacturing sliders for magnetic data recording. The optical lapping guide is constructed with a front edge that is at an angle with respect to an air bearing surface plane ABS plane, such that a portion of the lapping guides is in front of the ABS and portion of the lapping guide is behind the ABS. As lapping progresses, an increasing amount of the lapping guide will be exposed at the ABS and visible for inspection. Therefore, after a lapping process has been performed, the optical lapping guide can be inspected to determine the amount of material removed by lapping. The greater the amount of the lapping guide that is exposed and visible, the greater the amount of material removed by lapping.

Abstract: A method for manufacturing a thin film magnetic head having superior overwrite characteristics as well as having a locally minimized pole width includes: forming top pole chip having a first magnetic film that is a top layer portion of the top pole chip; forming a second magnetic film that is a bottom layer portion of the top pole chip; and forming the first and second magnetic films of magnetic material having a high magnetic flux density of 1.5 tesla or more; wherein a thin film magnetic head is produced that does not suffer from saturation of magnetic flux in the top pole chip, even when the pole width is locally minimized to about 0.3 ?m or less, and therefore has superior overwrite characteristics.

Abstract: A method is disclosed for fabricating a read head for a magnetic disk drive having a read head sensor and a hard bias layer, where the read head has a shaped junction between the read head sensor and the hard bias layer. The method includes providing a layered wafer stack to be shaped. A single- or multi-layered photoresist mask having no undercut is deposited upon the layered wafer stack to be shaped. The layered wafer stack is shaped by the output of a milling source, where the shaping includes partial milling to within a partial milling range to form a shaped junction. A hard bias layer is then deposited which is in contact with the shaped junction of the wafer stack.

Abstract: A method for manufacturing a magnetic write head for perpendicular magnetic recording having a write pole with a very narrow track width and well controlled critical dimensions. The write pole is formed by depositing an electrically conductive seed layer over a substrate, and then depositing a photo resist layer over the seed layer. The photo resist layer is photolithographically exposed and developed to form an opening or trench in the photoreist layer, the opening defining the pattern of the write pole. A magnetic material is then plated into the opening in the photoresist layer. The photo resist layer can then be removed by a chemical lift off, and portions of the seed layer that are not covered by the write pole can be removed by ion milling.

Abstract: A magnetoresistive reader having a sensor, current contacts with low parasitic resistance and a top shield with substantially planar topology is fabricated by first defining a stripe height back edge of the sensor. Next, a reader width of the sensor is defined. The current contacts are deposited to a thickness such that a top surface of the current contacts is substantially level with a top surface of the sensor. The top shield is deposited over the sensor and the current contacts. Defining the stripe height back edge prior to the reader width results in current contacts with low parasitic resistance and inhibits the formation of magnetic domains in the top shield.

Abstract: A mask structure for fabricating a write pole for a perpendicular write head. The mask structure includes a first and second hard mask structures separated by an image transfer layer, such as DURAMIDE®. The first mask structure may be a bi-layer mask structure that functions as a CMP stop as well as a hard mask for ion milling. The first hard mask is chosen to have a desired resistance to removal by ion milling to maintain excellent track width control during an ion milling process used to form the write pole. Therefore, the first hard mask may be comprises of two layers selected from the group consisting of Rh, alumina, and diamond like carbon (DLC). The second hard mask is constructed of a material that functions as a bottom antireflective coating as well as a hard mask.

Abstract: Methods of lapping rows of recording heads are described after an air bearing surface (ABS) damascene process is performed. The ABS damascene process uses a selective etching process to form voids in the row of recording heads where conductive material forms a feature in the recording head, such as a wrap around shield. The conductive material is then deposited on the ABS of the row to fill the voids, and the row is lapped. According to methods provided herein, the resistance of one or more lapping guides in the row of recording heads is monitored to determine when the conductive material is removed by the lapping process. When the monitored resistance indicates that the conductive material is removed, the lapping process is stopped. The resistance across one or more lapping guides may also be used to control the lapping process to uniformly lap the conductive material from the ABS.

Abstract: A method for manufacturing a write pole for a perpendicular magnetic write head. The method includes forming a mask structure over a full film layer of magnetic write pole material. A layer of hard mask material such as conformally deposited alumina is then deposited full film over the mask and write pole material. An ion mill, such as in an Ar or CHF3 chemistry is then used to preferentially remove horizontally disposed portions of the alumina layer (hard mask layer), thereby forming vertical hard mask walls at the sides of the mask structure. An ion mill is then used to form the write pole, with the alumna side walls providing excellent masking for forming well defined write pole edges. A relatively gentle clean up process can then be performed to remove the remaining mask material and side walls.

Abstract: A method for fabricating magnetic side shields for an MR sensor of a magnetic head. Following the deposition of MR sensor layers, a first DLC layer is deposited. Milling mask layers are then deposited, and outer portions of the milling mask layers are removed such that a remaining central portion of the milling mask layers is formed having straight sidewalls and no undercuts. Outer portions of the sensor layers are then removed such that a relatively thick remaining central portion of the milling mask resides above the remaining sensor layers. A thin electrical insulation layer is deposited, followed by the deposition of magnetic side shields. A second DLC layer is deposited and the remaining mask layers are then removed utilizing a chemical mechanical polishing (CMP) liftoff step. Thereafter, the first DLC layer and the second DLC layer are removed and a second magnetic shield layer is then fabricated thereabove.

Abstract: The present invention relates generally to grids for gating a stream of charged particles and methods for manufacturing the same. In one embodiment, the present invention relates to a Bradbury-Nielson gate having transmission line grid elements. In one embodiment is a feed structure for a gating grid where a drive source is coupled to a feeding transmission line with the same geometry as the chopper and continues with the same geometry to a termination transmission line. Also included is a method for fabricating a gate for charged particles which includes micromachining at least two gate elements from at least one wafer, wherein each gate element includes at least one grid element; metalizing the grid elements; and assembling the gate elements such that the grid elements of the gate elements are interleaved, thereby forming a Bradbury Nielson gate.

Abstract: An improved method for the manufacture of magnetoresistive multilayer sensors is disclosed. The method is particularly advantageous for the production of magnetic tunnel junction (MTJ) sensors, which can be damaged at the air bearing surface by conventional lapping and ion milling. The disclosed process protects the ABS of the magnetoresistive sensor by depositing a diamond like carbon layer which remains in place through ion milling. The DLC layer is removed by oxidation subsequent to the formation of the ABS.

Abstract: A method of fabricating a magnetic write head, in accordance with one embodiment, includes forming a beveled write pole. A conformal spacer may be formed upon a portion of a flare length proximate a tip of the write pole. A shield layer may also be formed upon the conformal spacer adjacent the flare length proximate the tip of the write pole.

Abstract: The sensitivity of the ABS shape of a suspension mounted slider to temperature variations can be greatly reduced if the backside of the slider is lapped to a smooth convex contour that is similar to the ABS shape, rather than to a planar shape, prior to mounting the slider on the suspension. When the backside surfaces of sliders are shaped in this manner, the size of changes in the crown height of the ABS shape due to temperature variations are greatly reduced and the ABS shapes are distributed more tightly, thereby increasing disk drive reliability.

Abstract: A method for constructing a magnetic write head for use in perpendicular magnetic recording, the write head having a write pole with a trailing shield that wraps around the write pole. The method allows the trailing shield to be constructed with a very well controlled trailing gap thickness and also allows the write pole to be constructed with a well controlled track width and a straight, flat trailing edge. The method includes depositing a magnetic write pole over a substrate and forming a mask structure over the write pole layer. The mask structure includes an end point detection layer that can be removed by reactive ion etching. An ion mill is performed to form a write pole by removing magnetic write pole material that is not covered by the mask layer. A layer of non-magnetic material is deposited and is ion milled to expose the end point detection layer.

Abstract: In one embodiment, a method of forming a CPP sensor comprises providing a sensor having a hard mask disposed on a left side thereof and a right side with a portion of the sensor material removed therefrom, the hard mask having a vertical surface; forming a right dielectric layer including a vertical surface disposed adjacent the vertical surface of the hard mask; forming a right hard bias layer or right side shields on the right dielectric layer; removing the hard mask to expose the left side of the sensor; forming an electrically conductive layer on the sensor, the electrically conductive layer including a vertical electrically conductive portion disposed adjacent the vertical surface of the right dielectric layer; removing the electrically conductive layer except the vertical electrically conductive portion; removing a portion of the sensor material from the left side of the sensor; forming a left dielectric layer on the left side of the sensor, the left dielectric layer including a vertical surface dispose

Abstract: A read sensor for a magneto resistive head is formed through the use of a bilayer lift-off mask. According to one embodiment, a release layer is formed on top of a sensor layer. A silicon-containing resist layer is formed over the release layer. The resist layer is patterned according to the desired dimensions of the read sensor. Then, plasma etching, such as oxygen plasma etching, is used to remove the portion of the release layer that is exposed by removal of resist material. The release layer may be etched to undercut the patterned resist layer, or may entirely removed beneath the patterned resist layer to provide a bridge of the resist material. In either case, isotropic plasma etching, anisotropic plasma etching, or some combination thereof may be applied.

Abstract: A method for preventing TMR (tunnel magneto-resistance) MRR (magneto-resistance resistance) drop of a slider, comprises steps of: positioning a row bar constructed by a plurality of slider structural bodies on a tray, each slider body having a pole tip with a TMR element; loading the tray into a processing chamber and evacuating the processing chamber to a preset pressure; introducing a processing gas containing oxygen gas into the processing chamber; and exposing the slider structural bodies to an etching means in the atmosphere of the processing gas to oxidize a surface of the TMR element to form an oxidation layer thereon. The invention also discloses a method for forming micro-texture on a surface of slider in same process, and a method for forming such a slider.

Abstract: A method and system for manufacturing a perpendicular magnetic recording transducer by a process that includes plating is described. The method and system include forming a chemical mechanical planarization (CMP) uniformity structure around a perpendicular magnetic recording pole. The CMP uniformity structure has a height substantially equal to a desired pole height. The method and system also include fabricating an insulator on the CMP uniformity structure and performing a CMP to remove a portion of the insulator. The CMP exposes a portion of the perpendicular magnetic recording pole and planarizes an exposed surface of the perpendicular magnetic recording transducer.

Abstract: A method for independently controlling track width and bevel angle of a write pole tip having a P3 pole tip for perpendicular recording. The method includes establishing the track width in a portion of the P3 layer material. A portion of this portion having the established track width is protected by providing a temporary masking material to make a protected portion. At least one unprotected portion is left exposed to be shaped. This unprotected portion is then beveled to produce at least one beveled portion having a bevel angle. The protected portion produces a rectangular portion which together with the beveled portion produce a hexagonal pole tip. Also a magnetic head having a hexagonal pole tip, and a disk drive having a magnetic head having a hexagonal pole tip.

Abstract: A method for sample preparation. The method includes mechanically polishing portions of an insulating layer over a main pole of a recording head embedded within a sample structure. The insulating layer is polished top down in planar layers perpendicular to an air bearing surface adjoining the main pole. The method also includes selectively wet etching the remaining portions of the insulating layer to expose the main pole, wherein the insulating layer surrounds the main pole. Etching is made without damaging the main pole.

Abstract: Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, capped seed layers having a dual layer structure are utilized, improving photo resist adhesion and plated shield adhesion, without the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.

Abstract: A fabrication method for thin film magnetic heads, comprises, forming a Current Perpendicular to a Plane (CPP) sensor film over a lower shield and a first chemical mechanical polishing (CMP) stop film over the CPP sensor film, etching the CPP sensor film and forming a track width on the CPP sensor film, and covering at least the etching section of the CPP sensor film with an insulating film. The method further comprises forming a CMP dummy film over the insulating film and a second CMP stop film over the CMP dummy film, exposing the first CMP stop film, and removing the first CMP stop film and the second CMP stop film by oxygen reactive ion etching (RIE) and the CMP dummy film by fluorine RIE, and forming an upper shield film over the insulating film and over the CPP sensor film.

Abstract: A method of fabrication is disclosed for a slider having sites for fabrication of a continuous coil having a set of front coils and a set of back coils and a center tab, where the slider includes underpass leads.

Abstract: A nano-sized CPP aperture is precisely positioned to within a few nanometers of a slider ABS surface to maximize a signal from the disk and to prevent lapping damage to the aperture itself. A linear array of apertures is aligned perpendicular to the ABS plane. The head resistance is monitored during lapping. Each time an aperture is lapped through, there is an increase in head resistance that is equal to the inverse of the total aperture area. There are three equal-sized apertures that are evenly spaced apart. When the first aperture is lapped through, there is a 50% increase in resistance, and a 100% increase in resistance when the second aperture is lapped through. These resistance increases are very large and are easy to distinguish from noise.

Abstract: A free layer functions such that a magnetization direction changes depending on an external magnetic field, and is made up of a multilayer structure including a first Heusler alloy layer, and a fixed magnetization layer takes a form wherein an inner pin layer and an outer pin layer are stacked one upon another with a nonmagnetic intermediated layer sandwiched between them. The inner pin layer is made up of a multilayer structure including a second Heusler alloy layer. The first and second Heusler alloy layers are each formed by a co-sputtering technique using a split target split into at least two sub-targets in such a way as to constitute a Heusler alloy layer composition. When the Heusler alloy layer is formed, therefore, it is possible to bring up a film-deposition rate, improve productivity, and improve the performance of the device.

Abstract: A method for manufacturing a magnetoresistive sensor having improved free layer biasing and track width control. The method includes forming a ferromagnetic pinned layer, and depositing a ferromagnetic film thereover. A layer of Ta is deposited over the ferromagnetic film and a mask is formed over an active sensor area. A reactive ion etch process is performed to remove selected portions of said Ta layer. An etch is then performed to remove selected portions of the ferromagnetic film in unmasked areas and a ferromagnetic refill material is deposited.

Abstract: A method is presented for fabricating a write pole for a magnetic recording head, wherein a photoresist layer is formed on a wafer stack. A target P2 pole configuration is provided, and a photomask having a pattern is produced, and the pattern is transferred to the photoresist to create a patterned photoresist having at least one photoresist channel. A layer of photoresist channel shrinking film used to produce a reduced width photoresist channel in an expanded photoresist. A P2 pole tip is formed within the reduced width photoresist channel. The P2 pole tip is then compared to the target P2 pole configuration to identify distortions, which are then used to produce a distortion-corrected photomask. The distortion-corrected photomask is then used to produce a distortion-corrected expanded photoresist, which is then used to produce a distortion-corrected P2 pole tip.

Abstract: A method for fabricating sliders (magnetic heads) with a recessed surface around a magnetic feature such as the active components of the write head on the air-bearing surface (ABS) is described. An embodiment of the method applies a positive photoresist to the exposed ABS surface, a magnetic field is applied, then liquid ferrofluid is applied on top of the photoresist. The pole pieces around the write gap will interact with the applied magnetic field so that the field gradient is highest around the write gap and the mobile ferrofluid will preferentially collect in the areas of the surface having the highest magnetic field gradient. The opaque magnetic particles in the ferrofluid form an optical ferrofluid mask over the photoresist around the write gap. The unmasked surface of the slider is milled which results in the recession of material around the write gap.

Abstract: A magnetic memory device may include a digit line on a substrate, a first insulating layer on the digit line, and a magnetic tunnel junction memory cell on the first insulating layer so that the first insulating layer is between the digit line and the magnetic tunnel junction memory cell. A second insulating layer may be provided on the magnetic tunnel junction memory cell, wherein the second insulating layer has a hole therein exposing portions of the magnetic tunnel junction memory cell. A bit line may be provided on the second insulating layer and on portions of the magnetic tunnel junction memory cell exposed by the hole in the second insulating layer, and ferromagnetic spacers may be provided on sidewalls of at least one of the digit line and/or the bit line. Related methods are also discussed.

Abstract: A giant magnetoresistive (GMR) head is formed to include a recess in an overcoat layer that reduces stress on the poles. The process includes depositing a seed layer over the overcoat layer prior to plating a metal mask layer with an opening where the recess is to be formed, wet chemical etching the seed layer through the opening in the mask layer and performing an ion milling process to remove any remaining traces of the seed layer. With the seed layer completely removed, a trench having smooth sidewalls and bottom is etched in the overcast layer by a reactive ion etch (RIE) process. The saw that is used to separate the head elements in the wafer can be passed through the clean trench without contacting the overcoat layer, thereby avoiding the chipping and cracking that might otherwise result from the use of a silicon dioxide or silicon nitride overcoat layer.

Abstract: A method of manufacturing a magnetic head is disclosed. The steps of manufacture include the formation of an underlying layer made of a material whose etching rate of ion beam etching is higher than that of a magnetic alloy used to make a pole layer, and the formation of a magnetic layer, which includes a portion of the magnetic layer to be etched that will be formed into a track width defining portion by making its side surfaces sloped through etching. The magnetic layer is formed such that the portion to be etched is disposed on the underlying layer. The side surfaces of the portion to be etched by the ion beam etching are etched so that the magnetic layer is formed into the pole layer and so that the end face of the track width defining portion located in the medium facing surface has a width that decreases with decreasing distance from the substrate.

Abstract: A method for making a write pole in a perpendicular magnetic recording write head uses a metal mask to pattern the primary resist and only ion milling during the subsequent patterning steps. A layer of primary resist is deposited over the magnetic write pole material and a metal mask layer is deposited on the primary resist layer. An imaging resist layer is formed on the metal mask layer and lithographically patterned generally in the desired shape of the write pole. Ion milling without a reactive gas is then performed over the imaging resist pattern to pattern the underlying metal mask layer, which is then used as the mask to define the shape of the primary resist pattern. Ion milling with oxygen is then performed over the metal mask pattern to pattern the underlying primary resist. Ion milling without a reactive gas is then performed over the primary resist pattern to form the underlying write pole.

Abstract: The problem of increased edge sensitivity associated with the reduction of the spacing between bias magnets in a CPP head has been solved by limiting the width of the bias cancellation layer and by adding an extra layer of insulation to ensure that current through the device flows only through its central area, thereby minimizing its edge reading sensitivity.