Electromagnet, Transformer Or Inductor Patents (Class 29/602.1)
  • Patent number: 10665379
    Abstract: An embedded magnetic component device includes a magnetic core located in a cavity extending into an insulating substrate. The cavity and magnetic core are coved with a cover layer. Through holes extend through the cover layer and the insulating substrate, and are plated to define conductive vias. Metallic traces are provided at exterior surfaces of the cover layer and the insulating substrate to define upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a first isolation barrier is provided on the cover layer, and at least a third insulating layer is provided on the substrate. The second and third insulating layers provide additional insulation for the device, and define and function as a circuit board for surface mounted power electronics.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: May 26, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Scott Andrew Parish, Lee Francis
  • Patent number: 10658103
    Abstract: A coil component has a magnetic body of rectangular solid shape, a coil with N turns (N is a positive number of 2 or greater) provided inside the magnetic body, an insulating intermediate part, and external electrodes. The coil has a first conductor layer, a second conductor layer, and an inter-layer connection part. The first conductor layer has a first multiple winding part which is wound around one axis with a first spacing. The second conductor layer has a second multiple winding part which is wound around the one axis with the first spacing and faces the first conductor layer. The insulating intermediate part is provided inside the magnetic body and forms, between the first conductor layer and second conductor layer, a second spacing corresponding to a thickness equal to or less than the product of the first spacing and (N?1).
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: May 19, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Hirotaro Seino, Shinsuke Takeoka, Hitoshi Matsuura, Kenji Otake
  • Patent number: 10658102
    Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is greater than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: May 19, 2020
    Assignee: CYNTEC CO., LTD.
    Inventors: Wen-Hsiung Liao, Roger Hsieh, Hideo Ikuta, Yueh-Lang Chen
  • Patent number: 10643959
    Abstract: An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: May 5, 2020
    Assignee: Intersil Americas LLC
    Inventors: Zaki Moussaoui, Nikhil Vishwanath Kelkar
  • Patent number: 10636556
    Abstract: Disclosed are a bus bar unit capable of being easily manufactured while preventing a bus bar from being separated from a magnetic core and also capable of being reduced in size, and a manufacturing method thereof. The bus bar unit includes a magnetic core having a through-hole and covered with an insulating material, U-phase, V-phase and W-phase bus bars of which main body portions are arranged in parallel with each other in a predetermined direction within the through-hole and one side connecting portions provided on one side in an axial direction of the through-hole from the main body portions are bent in a direction crossing the axial direction, and a base member formed of an insulating material and to which the magnetic core is fixed, wherein the one side connecting portions of the bus bars are held while being disposed between the base member and the magnetic core.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: April 28, 2020
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yuya Ishihara, Tomohiro Fukazu
  • Patent number: 10622144
    Abstract: A method for producing a pair of electrically conductive members assembled into an electrical component assembly provided with a coil. The method includes: forming connection terminal sections provided in the pair of electrically conductive members by arranging them alternately opposite to each other and then performing press punching; and after the press punching, bending the connection terminal sections in the pair of electrically conductive members toward a side departing from the coil into a protruding form.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: April 14, 2020
    Assignee: NISSIN KOGYO CO., LTD.
    Inventors: Takuro Kodama, Keiichi Tatsuno
  • Patent number: 10598353
    Abstract: Described is an arrangement and system for precise angular and directional positioning of light-emitting diodes (LED). An LED component includes a base body with a light-emitting region, a first connector, and a second connector, where the connectors are electrically conductively connected to the light-emitting region. The base body includes at least two fixing regions and the connectors each include a bending portion and a contact area for surface mounting. Each of the bending portions is arranged between the base body and the contact area. A supporting frame includes a plinth region to align the supporting frame on a surface and includes an outwardly open recess, a support region to receive a component in the supporting frame and at least two fixing elements to fix the component above the support region. A base area of the plinth region and a base area of the support region enclose an acute angle.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: March 24, 2020
    Assignee: Jabil Optics Germany GmbH
    Inventors: Sepehr Baghschomali, Samir Catic
  • Patent number: 10586648
    Abstract: A coil component includes a body portion including a magnetic material, and a coil portion disposed in the body part. The coil portion includes a first coil pattern layer having a planar spiral pattern, an insulating layer formed of an insulating resin embedding at least a portion of the first coil pattern layer, and a second coil pattern layer disposed on the insulating layer and having a planar spiral pattern. The insulating layer includes a core material disposed between the first and second coil pattern layers, and a thickness of a lower region of the insulating layer disposed below the core material is greater than a thickness of an upper region of the insulating layer disposed above the core material.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: March 10, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jae Lee, Youn Soo Seo, Jae Ha Kim, Hye Yeon Cha
  • Patent number: 10581388
    Abstract: Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures, and a power amplifier and switch can be integrated onto a single complementary metal oxide semiconductor die.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: March 3, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yalin Jin, Setu Mohta
  • Patent number: 10571537
    Abstract: A system for multi-slice magnetic resonance imaging (MRI) comprises a gradient coil array comprising a plurality of independent coils distributed about an enclosure; and a controller configured to concurrently actuate said plurality of coils so as to generate a spatially-varying magnetic field within said enclosure such that for at least first and second volumetric slices, a magnetic field magnitude associated with at least one location in the first volumetric slice is substantially equal to a magnetic field magnitude associated with a respective location in the second volumetric slice.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: February 25, 2020
    Assignee: Bilkent University
    Inventors: Ergin Atalar, Niyazi Koray Ertan, Soheil Taraghinia
  • Patent number: 10573803
    Abstract: A semiconductor package includes a semiconductor die. A through hole in the semiconductor package and semiconductor die extends from one side of the semiconductor package and die to an opposite side of the semiconductor package and die. The through hole is configured to receive a current-carrying conductor there through. At least one current sensor is formed in, or on, the semiconductor die and configured to sense current flow in the current-carrying conductor received in the through hole.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: February 25, 2020
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Jefferson W. Hall, Michael J. Seddon, Yenting Wen
  • Patent number: 10566131
    Abstract: A transformer includes a transformer core, and a primary winding and a secondary winding each wound about the transformer core. The primary winding includes a wire wound in multiple primary winding layers, and each primary winding layer includes multiple primary turns arranged in a spiral. The secondary winding includes one or more substantially flat conductors defining multiple secondary winding layers. Each secondary winding layer includes one secondary turn, every two adjacent secondary turns have a single different one of the primary winding layers positioned between the two adjacent secondary turns to interleave the secondary winding and the primary winding, and each secondary turn has a different diameter than an adjacent one of the secondary turns.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: February 18, 2020
    Assignee: Astec International Limited
    Inventor: Kwong Kei Chin
  • Patent number: 10557898
    Abstract: A magnetoelastic tag includes a frame-suspended magnetoelastic resonator that combines a strong resonant response with a relatively small resonator, enabling magnetoelastic sensor use in a variety of inconspicuous applications and/or small packages. The resonator is suspended with respect to a substrate, which reduces, minimizes, or eliminates interaction between the substrate and resonator. Signal strength is thereby enhanced, thereby allowing miniaturization while maintaining a measurable response to the interrogation field. The resonator can have a hexagonal shape and/or be suspended at particular locations about its perimeter to promote signal generation in a direction different from that of the interrogation field. A sensor can include one or more frame-suspended resonators, which can be arranged in an array, stacked, or randomly where a plurality of resonators is employed.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: February 11, 2020
    Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
    Inventors: Yogesh Gianchandani, Jun Tang, Scott Green
  • Patent number: 10559413
    Abstract: A coil electronic component includes a first coil and a second coil disposed on and beneath a main board, respectively, wherein the first coil includes a first coil pattern and a second coil pattern connected to each other through a first via of a first insulating layer and disposed on and beneath the first insulating layer, respectively, and the second coil includes a third coil pattern and a fourth coil pattern connected to each other through a second via of a second insulating layer and disposed on and beneath the second insulating layer, respectively. In this case, the main board, the first insulating layer, and the second insulating layer include through-holes formed in central portions thereof, respectively.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: February 11, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Dong Hwan Lee, Young Ghyu Ahn
  • Patent number: 10553342
    Abstract: A deformable inductive device includes an elastomer material having at least one deformable electrode and a liquid magnetic core formed in the elastomer material and containing a magnetic liquid. Depending on the device's configuration, the deformable element may be embedded in, attached to, or in close proximity with the liquid magnetic core. In some embodiments, the deformable inductive device may be configured as an inductor, solenoid, or transformer and the deformable electrode is at least partially embedded in the liquid magnetic core, for instance. In another embodiment, the deformable inductive device may be configured as part of a wireless power transfer system which includes a coil and a magnetic backplane having the liquid magnetic core with the coil being attached to or in close proximity to the magnetic backplane.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: February 4, 2020
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Nathan S. Lazarus, Christopher D. Meyer
  • Patent number: 10529485
    Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: January 7, 2020
    Assignee: SUMIDA CORPORATION
    Inventors: Shinichi Sakamoto, Douglas James Malcolm
  • Patent number: 10490347
    Abstract: A method for producing a monolithic electromagnetic component includes preparing a precursor from a ferrite material during an initial step; preparing elements including at least one coil having coil turns; embedding the elements including at least one coil having the coil turns in the precursor embedded in a mold; co-sintering the elements including at least one coil having the coil turns and the precursor compressed by the mold under a predetermined pressure, the predetermined pressure being generated under a load, wherein a pulsed electric current is generated during the co-sintering; discharging the pulsed electric current through the mold such that a temperature in the mold rises; and obtaining the monolithic electromagnetic component in which the precursor is secured to the elements including at least one coil having the coil turns.
    Type: Grant
    Filed: August 21, 2014
    Date of Patent: November 26, 2019
    Assignee: Centre National de la Recherche Scientifique (C.N.R.S.)
    Inventors: Frédéric Mazaleyrat, Karim Zehani, Vincent Loyau, Eric Laboure
  • Patent number: 10490348
    Abstract: Disclosed is an apparatus including a plurality of vias each having a defined shape, wherein each of the plurality of vias includes a first two-dimensional conductive layer plated on a first side of a substrate, the first two-dimensional conductive layer having the defined shape, a second two-dimensional conductive layer plated on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and a via conductively coupling the first two-dimensional conductive layer to the second two-dimensional conductive layer. The apparatus further includes a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: November 26, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Mario Francisco Velez, Daeik Daniel Kim, Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim, Chengjie Zuo, Yunfei Ma, Robert Paul Mikulka
  • Patent number: 10460865
    Abstract: A vehicle is provided with a transmission having a chamber with fluid therein. The vehicle includes a core and a conductor that are mounted within the chamber. The core includes a pair of elements that are oriented toward each other along a longitudinal axis. Each element includes a base with a post and at least two projections extending longitudinally from the base. The conductor is disposed over the posts and is configured to receive the fluid through an opening formed between adjacent projections.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: October 29, 2019
    Assignee: Ford Global Technologies, LLC
    Inventors: Shahram Zarei, Behzad Vafakhah, Jeremy Richard Ikerd, Vincent Skalski
  • Patent number: 10454235
    Abstract: A metal terminal where a connecting portion has a receiving portion which receives a wire and a contact segment which extends from the receiving portion by way of a bending scheduled portion is prepared. By applying heat and pressure in a state where the wire is placed on the receiving portion for temporarily fixing the wire, the wire is adhered to the receiving portion using a molten or softened insulating resin coating as an adhesive agent. Next, the connecting portion is bent by way of the bending scheduled portion such that the contact segment faces the receiving portion by way of the wire and the contact segment is brought into contact with the wire. Next, by irradiating a laser beam to a portion of the metal terminal, the wire and the metal terminal are welded to each other.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: October 22, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takashi Murakami, Akio Igarashi, Koji Onishi
  • Patent number: 10410782
    Abstract: A coil component is provided with only first and second columnar conductors that are a part of a coil electrode. This can simplify the manufacturing process and reduce the cost of the coil component. A wiring substrate is provided with substrate-side wiring electrode traces that form the remaining part of the coil electrode. In the process of forming the wiring substrate using a substrate forming technique commonly used, the substrate-side wiring electrode traces can be easily formed together with other wiring electrodes. Therefore, when the coil electrode is configured to be formed by placing the coil component on the wiring substrate, a coil module including the coil component can be inexpensively manufactured.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: September 10, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Norio Sakai, Mitsuyoshi Nishide, Shinichiro Banba
  • Patent number: 10404178
    Abstract: An insulation type step-up converter includes a core, first and second primary-side coils, a secondary-side coil, and a switching element. The core includes a middle leg, and first and second outer legs. The switching element is configured such that it can be controlled to be on/off so that electric currents flowing simultaneously in the first and second primary-side coils are opposite in direction to each other.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: September 3, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Nakajima, Takashi Kumagai, Yuji Shirakata, Yujiro Kido
  • Patent number: 10388454
    Abstract: A microfabricated laminated conductor, comprising at least two flat metallic conductors held together parallel by their edges by a first dielectric material anchor, such that there exists a gap of between several nanometers and several micrometers between most of the at least two flat metallic conductors.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: August 20, 2019
    Assignee: HRL Laboratories, LLC
    Inventors: Florian G. Herrault, Melanie S. Yajima
  • Patent number: 10381153
    Abstract: Disclosed herein is a spacer fixing structure including a core member constituting a core to be wound with a coil; and a plate spacer fixed to the core member. The spacer has a loop shape. A communication groove is formed in at least one surface of front and back surfaces of the spacer, and extends radially to communicate with inner and outer peripheries of the spacer. A region of the at least one surface of the spacer other than a grooved portion is left as a flat surface. At least the flat surface of the spacer is adhered to the core member via an adhesive layer made of an adhesive.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: August 13, 2019
    Assignee: TABUCHI ELECTRIC CO., LTD.
    Inventor: Keisuke Honda
  • Patent number: 10361591
    Abstract: Techniques for wireless power charging of chargeable devices such as electric vehicles are provided. An example of a wireless power transmitting apparatus according to the disclosure includes a first coil structure, at least one second coil structure disposed adjacent to the first coil structure, and a transmitter operably and electrically connected to the first coil structure, such that the transmitter is configured to provide an electrical signal to the first coil structure and such that the at least one second coil structure is a parasitic coil structure and such that at least one of the first and the at least one second coil structure is a double-D coil structure.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: July 23, 2019
    Assignee: WiTricity Corporation
    Inventors: Hans Peter Widmer, Markus Bittner
  • Patent number: 10319519
    Abstract: The invention proposes a method of producing induction components each containing a coil, wherein the coils are wound on a wire-winding plate, containing a multiplicity of wire-winding stubs arranged in rows and columns, using a wire which is continuous for a plurality of coils. The template provided with the coils is then pressed in a molding press with ferromagnetic substrate powder, which embeds the coils. Once the template has been removed, the interiors of the coils are provided with substrate powder, and pressed, once again in a molding press. Electrical contact is then made with the connections and the block is divided up into individual induction components each containing a coil.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: June 11, 2019
    Assignee: Würth Elektronik eiSos GmbH & Co. KG
    Inventors: Markus Stark, Klaus Richter, Dorian Degen
  • Patent number: 10312007
    Abstract: A method and device includes a first conductor formed on a first dielectric layer as a partial turn of a coil. A second conductor is formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil. A vertical interconnect couples the first and second conductors to form a first full turn of the coil. The interconnect coupling can be enhanced by embedding some selective magnetic materials into the substrate.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: June 4, 2019
    Assignee: Intel Corporation
    Inventors: Mihir K Roy, Mathew J Manusharow, Harold Ryan Chase
  • Patent number: 10304620
    Abstract: Disclosed is an inductor and a method of manufacturing the same. The inductor may include a core insulating layer, a coil including at least one coil pattern formed on an upper part of the core insulating layer, at least one coil pattern formed on a lower part of the core insulating layer, and a through via configured to electrically connect the at least one coil pattern on the upper part and the lower part, and an insulating layer formed on the upper part and the lower part of the core insulating layer, the insulating layer embedding the coil.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: May 28, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong-Sam Lee, Youn-Soo Seo
  • Patent number: 10290414
    Abstract: A substrate includes a first dielectric layer, a magnetic core at least partially in the first dielectric layer, where the magnetic core comprises a first non-horizontal thin film magnetic (TFM) layer. The substrate also includes a first inductor that includes a plurality of first interconnects, where the first inductor is positioned in the substrate to at least partially surround the magnetic core. The magnetic core may further include a second non-horizontal thin film magnetic (TFM) layer. The magnetic core may further include a core layer. The magnetic core may further include a third thin film magnetic (TFM) layer, and a fourth thin film magnetic (TFM) layer that is substantially parallel to the third thin film magnetic (TFM) layer.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: May 14, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Daeik Daniel Kim, David Francis Berdy, Je-Hsiung Jeffrey Lan, Jonghae Kim, Niranjan Sunil Mudakatte, Robert Paul Mikulka
  • Patent number: 10283248
    Abstract: An electronic component including, a first side, a second side, a third side, and a fourth side connected in that order in a predetermined direction so as to demarcate a tetragonal track. A first coil conductor layer lies astride the first side and the second side. A second coil conductor layer lies astride the second side and the third side and is connected to the first coil conductor layer on the second side. A third coil conductor layer lies astride the third side and the fourth side and is connected to the second coil conductor layer on the third side. At least one of the first coil conductor layer and the third coil conductor layer is not disposed at a first corner formed by the first side and the fourth side, when viewed from the stacking direction.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: May 7, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yasushi Takeda
  • Patent number: 10283249
    Abstract: A method for fabricating a magnetic material stack on a substrate includes the following steps. A first dielectric layer is formed. A first magnetic material layer is formed on the first dielectric layer. At least a second dielectric layer is formed on the first magnetic material layer. At least a second magnetic material layer is formed on the second dielectric layer. During one or more of the forming steps, a surface smoothing operation is performed to remove at least a portion of surface roughness on the layer being formed. The magnetic material stack can be used to form a low magnetic loss yoke inductor.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: May 7, 2019
    Assignee: International Business Machines Corporation
    Inventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang
  • Patent number: 10267766
    Abstract: A multi-layer eddy current probe has a large number of flat spiral coils which are arranged in different coil layers of a multi-layer arrangement, wherein a respective insulating layer which is composed of electrically insulating material is arranged between adjacent coil layers of the multi-layer arrangement. Each of the flat coils has an inner terminal and an outer terminal. Selected terminals of selected flat coils of different coil layers are electrically connected to one another by way of vias. The flat coils form at least one coil group which has at least three flat coils which are arranged one above the other in different layers, wherein the inner terminals of the at least three flat coils of the coil group are electrically conductively connected by means of a common inner via.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: April 23, 2019
    Assignee: Magnetische Pruefanlagen GmbH
    Inventor: Timur Kudyakov
  • Patent number: 10269482
    Abstract: Outer terminal electrodes form exposed surfaces that extend in the form of a substantially L shape while at least part thereof are embedded in a component main-body. A loop conductor layer of the coil conductor has a lower side portion, lateral side portions, oblique side portions, and an upper side portion. The lower side portion has a length shorter than a gap between outer terminal electrodes, and is positioned within a range of the gap.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: April 23, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masayuki Yoneda, Keiichi Yoshinaka
  • Patent number: 10262793
    Abstract: A manufacturing method of a surface mounted inductor involves using a coil and a tablet in a molding die. The coil is placed on the tablet. The coil and the tablet are arranged in the molding die and pressurized and compressed to the size of the cavity in the molding die at a first temperature. The coil and the tablet are pressurized in the molding die at a second temperature higher than the first temperature to form a formed body incorporating the coil.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: April 16, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Keita Muneuchi, Makoto Murakami
  • Patent number: 10263590
    Abstract: An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil disposed on the inorganic dielectric layer and electrically connected to the lower electrode or the upper electrode.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: April 16, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Ryo Okura, Hayami Kudo, Kenji Nishiyama
  • Patent number: 10222434
    Abstract: According to some aspects, a portable magnetic resonance imaging system is provided, comprising a magnetics system having a plurality of magnetics components configured to produce magnetic fields for performing magnetic resonance imaging. The magnetics system comprises a permanent B0 magnet configured to produce a B0 field for the magnetic resonance imaging system, and a plurality of gradient coils configured to, when operated, generate magnetic fields to provide spatial encoding of emitted magnetic resonance signals, a power system comprising one or more power components configured to provide power to the magnetics system to operate the magnetic resonance imaging system to perform image acquisition, and a base that supports the magnetics system and houses the power system, the base comprising at least one conveyance mechanism allowing the portable magnetic resonance imaging system to be transported to different locations.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: March 5, 2019
    Assignee: Hyperfine Research, Inc.
    Inventors: Michael Stephen Poole, Cedric Hugon, Hadrien A. Dyvorne, Laura Sacolick, William J. Mileski, Jeremy Christopher Jordan, Alan B. Katze, Jr., Jonathan M. Rothberg, Todd Rearick, Christopher Thomas McNulty
  • Patent number: 10211677
    Abstract: A mobile device includes a housing having a conductive region and a wireless power receiver having a receive coil configured to receive wireless power through the conductive region. The thickness of the conductive region is less than ?/10, wherein ? is a skin depth of the conductive region at a primary frequency of an electromagnetic signal that provides the wireless power.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: February 19, 2019
    Assignee: MediaTek Inc.
    Inventors: Patrick Stanley Riehl, Vladimir A. Muratov
  • Patent number: 10199154
    Abstract: A coil component and a method of manufacturing the coil component are provided. The coil component includes a coil part, a body, and an electrode. The coil part includes a support member, a first coil layer disposed on one surface of the support member, and a second coil layer disposed on the first coil layer. The body includes a magnetic material covering the coil part. The electrode is disposed on the body and is connected to the coil part. The first and second coil layers may each include an insulating layer having a pattern in a planar coil shape and a conductor layer disposed in the pattern and including a seed layer and a plating layer. Additionally, seed layers of the first and second coil layers may be disposed differently in the conductor layers of the first and second coil layers.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: February 5, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seok Il Hong, Jae Yeol Choi, Jong Bong Lim, Ju Hwan Yang
  • Patent number: 10197531
    Abstract: A gate electrode (10A) used as a shutter gate includes a pair of conductive fixture members (131, 132) made of metal and identical in size attached to the inside of a rectangular opening (12) of a ceramic base (11), along with insulating fixture members (141, 142) made of ceramic attached to the inner sides of the conductive fixture members. Two comb electrodes (151, 152) as one pair have connecting portions (151a, 152a) adhered to the conductive fixture members (131, 132) as well as thin-wire electrodes whose distal ends are adhered to the insulating fixture members (141, 142). By setting length L of the opening (12) and width D of the conductive fixture members (131, 132) to appropriate values according to the coefficient of thermal expansion of each of those members, the elongation of the electrodes which accompanies an increase in temperature can be balanced by the increase in the distance between the adhered positions of the electrodes to prevent the electrodes from being excessively taut or slack.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: February 5, 2019
    Assignee: SHIMADZU CORPORATION
    Inventors: Akiko Imazu, Hideaki Izumi
  • Patent number: 10197602
    Abstract: An electric current measuring device that employs a unique mechanical structure and Hall effect sensor array combined with processing of measurements obtained from the current measuring device to accurately measure current flow by cancelling the effects of static or dynamic magnetic noise originating from external sources. The process determines the actual current through the conductor by measuring and subtracting external noise.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: February 5, 2019
    Inventor: Jody Nehmeh
  • Patent number: 10186949
    Abstract: A DC-to-DC power converter device has a common magnetic core structure that serves the functions of both transformer device and output inductor by integrating each into the common core. The transformer device has primary and secondary windings integrated into a first leg structure of the magnetic core, and the output inductor device has an output inductor winding integrated into a second leg structure of the magnetic core, the inductor winding structure for delivering output current to a load when a periodically switched input voltage is applied across the primary winding structure. The winding polarities of the transformer secondary winding structure and of the output inductor winding structure provide oppositely oriented polarities of electromotive force (EMF) to substantially reduce an output current ripple to an output load when delivering power through the transformer, through the output inductor and into the output load.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: January 22, 2019
    Assignee: International Business Machines Corporation
    Inventors: Andrew Ferencz, Todd E. Takken, Xin Zhang, Yuan Yao
  • Patent number: 10181633
    Abstract: Pre-formed non-flexible antenna modules are connected to one another via radio-frequency (“RF”) connectors for downhole applications. The antennas include two or more non-flexible antenna modules having a one or more center conductors extending therethrough. The antenna modules are connected by high frequency RF connectors, thereby forming a single antenna. Accordingly, the illustrative embodiments described herein will reduce the assembly complexity, increase repeatability of the design implementation, and enhance the productivity of the manufacturing process.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: January 15, 2019
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Lay Wei Ang, Agustin Omictin Gubuan
  • Patent number: 10170232
    Abstract: A toroid inductor includes a plurality of first turns configured in a first ring shape and a plurality of second turns configured in a second ring shape. The plurality of first turns includes a plurality of first upper interconnects, a plurality of first lower interconnects, and a plurality of first vias coupled to the plurality of first upper interconnects and to the plurality of first lower interconnects. The plurality of second turns is at least partially intertwined with the plurality of first turns. The plurality of second turns includes a plurality of second upper interconnects, a plurality of second lower interconnects, and a plurality of second vias coupled to the plurality of second upper interconnects and to the plurality of second lower interconnects.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: January 1, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Yue Li, Charles David Paynter, Ryan David Lane
  • Patent number: 10170229
    Abstract: There is provided a chip electronic component including: an insulating substrate; a first coil part disposed on one surface of the insulating substrate; a second coil part disposed on the other surface of the insulating substrate opposing one surface of the insulating substrate; a via connecting the first and second internal coil parts to each other while penetrating through the insulating substrate; first and second via pads disposed on one surface and the other surface of the insulating substrate, respectively, so as to cover the via; and a first dummy pattern disposed in a region of one surface of the insulating substrate adjacent to the first via pad and a second dummy pattern disposed in a region of the other surface of the insulating substrate adjacent to the second via pad.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: January 1, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 10163596
    Abstract: The present invention discloses a horizontal-deflection prevention mechanism for an HVDC relay, comprising a moving contact assembly which comprises a moving reed and moving contacts arranged at left and right ends of the moving reed; an upper section of a pushrod is located above a yoke plate and fixed with the moving reed; a positioning plate is provided on the yoke plate; and a left return spring is connected between a left end of the moving reed and the positioning plate, and a right return spring is connected between a right end of the moving reed and the positioning plate.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: December 25, 2018
    Assignee: ZHEJIANG INNUOVO NEW ENERGY TECHNOLOGY CO., LTD.
    Inventors: Wenrong Song, Rongai Yu, Xiaobin Guo, Haiyan Huang, Peng Su, Dejin Du
  • Patent number: 10164128
    Abstract: A composition for solar cell electrodes includes silver powder; a silver alloy (AgX) that includes silver (Ag) and a metal (X), the silver alloy having a eutectic point of about 150° C. to about 900° C.; a glass frit; and an organic vehicle.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: December 25, 2018
    Assignee: Cheil Industries, Inc.
    Inventors: Sang Hee Park, Tae Joon Kim, Hun Hyu Song
  • Patent number: 10158293
    Abstract: A power supply module includes a substrate, a switching control IC and a coil. The coil includes a plurality of metal posts, first ends of which are mounted on a first surface of the substrate, wiring conductors that are in conductive contact with the first ends of the metal posts, and post connection conductors that are in conductive contact with second ends of the metal posts. The power supply module further includes a magnetic core that strengthens magnetic flux generated by the coil, and a sealing resin that seals the metal posts and the magnetic core.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: December 18, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takashi Noma, Keiichi Ichikawa
  • Patent number: 10148233
    Abstract: Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures. A compensation circuit can act to protect the receive path during an RF transmit mode.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: December 4, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yalin Jin, Setu Mohta
  • Patent number: 10148172
    Abstract: A power supply module is disclosed. The power supply module includes: a coil including a coil body and connecting ends; electronic components including at least an integrated circuit chip; a magnetic core which encloses the coil body, wherein at least one side of the magnetic core has a cavity provided therein, and the at least one electronic component is positioned in the cavity; a connector, which abuts against the side of the magnetic core having the cavity therein, covers the surface of the side, and is electronically connected to the coil and the electronic components. The power supply module is able to reduce the damage to the integrated circuit chip, decrease electromagnetic interferences and achieve an excellent cooling effect.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: December 4, 2018
    Assignee: Sumida Electric (H.K.) Company Limited
    Inventors: Douglas James Malcolm, Yanfei Liu, Guoping Zhang, Zhuo Wu, Hongnian Zhang, Xinliang Luo
  • Patent number: 10147533
    Abstract: An inductor includes a body including an organic material and a coil part disposed in the body. External electrodes are disposed on outer surfaces of the body and connected to the coil part. The coil part includes a conductive pattern and a conductive via. An adhesive layer is disposed between the conductive pattern and the conductive via, and the adhesive layer is formed of a material different from materials of the conductive pattern and the conductive via.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: December 4, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soo Hyun Lyoo, Se Woong Paeng, Jung Min Kim, Jeong Gu Yeo, Tae Hoon Kim, Sang Jun Lee, Ji Hyung Jung, Ji Man Ryu, Do Young Jung