Electromagnet, Transformer Or Inductor Patents (Class 29/602.1)
  • Patent number: 10290414
    Abstract: A substrate includes a first dielectric layer, a magnetic core at least partially in the first dielectric layer, where the magnetic core comprises a first non-horizontal thin film magnetic (TFM) layer. The substrate also includes a first inductor that includes a plurality of first interconnects, where the first inductor is positioned in the substrate to at least partially surround the magnetic core. The magnetic core may further include a second non-horizontal thin film magnetic (TFM) layer. The magnetic core may further include a core layer. The magnetic core may further include a third thin film magnetic (TFM) layer, and a fourth thin film magnetic (TFM) layer that is substantially parallel to the third thin film magnetic (TFM) layer.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: May 14, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Daeik Daniel Kim, David Francis Berdy, Je-Hsiung Jeffrey Lan, Jonghae Kim, Niranjan Sunil Mudakatte, Robert Paul Mikulka
  • Patent number: 10283248
    Abstract: An electronic component including, a first side, a second side, a third side, and a fourth side connected in that order in a predetermined direction so as to demarcate a tetragonal track. A first coil conductor layer lies astride the first side and the second side. A second coil conductor layer lies astride the second side and the third side and is connected to the first coil conductor layer on the second side. A third coil conductor layer lies astride the third side and the fourth side and is connected to the second coil conductor layer on the third side. At least one of the first coil conductor layer and the third coil conductor layer is not disposed at a first corner formed by the first side and the fourth side, when viewed from the stacking direction.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: May 7, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yasushi Takeda
  • Patent number: 10283249
    Abstract: A method for fabricating a magnetic material stack on a substrate includes the following steps. A first dielectric layer is formed. A first magnetic material layer is formed on the first dielectric layer. At least a second dielectric layer is formed on the first magnetic material layer. At least a second magnetic material layer is formed on the second dielectric layer. During one or more of the forming steps, a surface smoothing operation is performed to remove at least a portion of surface roughness on the layer being formed. The magnetic material stack can be used to form a low magnetic loss yoke inductor.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: May 7, 2019
    Assignee: International Business Machines Corporation
    Inventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang
  • Patent number: 10267766
    Abstract: A multi-layer eddy current probe has a large number of flat spiral coils which are arranged in different coil layers of a multi-layer arrangement, wherein a respective insulating layer which is composed of electrically insulating material is arranged between adjacent coil layers of the multi-layer arrangement. Each of the flat coils has an inner terminal and an outer terminal. Selected terminals of selected flat coils of different coil layers are electrically connected to one another by way of vias. The flat coils form at least one coil group which has at least three flat coils which are arranged one above the other in different layers, wherein the inner terminals of the at least three flat coils of the coil group are electrically conductively connected by means of a common inner via.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: April 23, 2019
    Assignee: Magnetische Pruefanlagen GmbH
    Inventor: Timur Kudyakov
  • Patent number: 10269482
    Abstract: Outer terminal electrodes form exposed surfaces that extend in the form of a substantially L shape while at least part thereof are embedded in a component main-body. A loop conductor layer of the coil conductor has a lower side portion, lateral side portions, oblique side portions, and an upper side portion. The lower side portion has a length shorter than a gap between outer terminal electrodes, and is positioned within a range of the gap.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: April 23, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masayuki Yoneda, Keiichi Yoshinaka
  • Patent number: 10262793
    Abstract: A manufacturing method of a surface mounted inductor involves using a coil and a tablet in a molding die. The coil is placed on the tablet. The coil and the tablet are arranged in the molding die and pressurized and compressed to the size of the cavity in the molding die at a first temperature. The coil and the tablet are pressurized in the molding die at a second temperature higher than the first temperature to form a formed body incorporating the coil.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: April 16, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Keita Muneuchi, Makoto Murakami
  • Patent number: 10263590
    Abstract: An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil disposed on the inorganic dielectric layer and electrically connected to the lower electrode or the upper electrode.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: April 16, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Ryo Okura, Hayami Kudo, Kenji Nishiyama
  • Patent number: 10222434
    Abstract: According to some aspects, a portable magnetic resonance imaging system is provided, comprising a magnetics system having a plurality of magnetics components configured to produce magnetic fields for performing magnetic resonance imaging. The magnetics system comprises a permanent B0 magnet configured to produce a B0 field for the magnetic resonance imaging system, and a plurality of gradient coils configured to, when operated, generate magnetic fields to provide spatial encoding of emitted magnetic resonance signals, a power system comprising one or more power components configured to provide power to the magnetics system to operate the magnetic resonance imaging system to perform image acquisition, and a base that supports the magnetics system and houses the power system, the base comprising at least one conveyance mechanism allowing the portable magnetic resonance imaging system to be transported to different locations.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: March 5, 2019
    Assignee: Hyperfine Research, Inc.
    Inventors: Michael Stephen Poole, Cedric Hugon, Hadrien A. Dyvorne, Laura Sacolick, William J. Mileski, Jeremy Christopher Jordan, Alan B. Katze, Jr., Jonathan M. Rothberg, Todd Rearick, Christopher Thomas McNulty
  • Patent number: 10211677
    Abstract: A mobile device includes a housing having a conductive region and a wireless power receiver having a receive coil configured to receive wireless power through the conductive region. The thickness of the conductive region is less than ?/10, wherein ? is a skin depth of the conductive region at a primary frequency of an electromagnetic signal that provides the wireless power.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: February 19, 2019
    Assignee: MediaTek Inc.
    Inventors: Patrick Stanley Riehl, Vladimir A. Muratov
  • Patent number: 10199154
    Abstract: A coil component and a method of manufacturing the coil component are provided. The coil component includes a coil part, a body, and an electrode. The coil part includes a support member, a first coil layer disposed on one surface of the support member, and a second coil layer disposed on the first coil layer. The body includes a magnetic material covering the coil part. The electrode is disposed on the body and is connected to the coil part. The first and second coil layers may each include an insulating layer having a pattern in a planar coil shape and a conductor layer disposed in the pattern and including a seed layer and a plating layer. Additionally, seed layers of the first and second coil layers may be disposed differently in the conductor layers of the first and second coil layers.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: February 5, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seok Il Hong, Jae Yeol Choi, Jong Bong Lim, Ju Hwan Yang
  • Patent number: 10197531
    Abstract: A gate electrode (10A) used as a shutter gate includes a pair of conductive fixture members (131, 132) made of metal and identical in size attached to the inside of a rectangular opening (12) of a ceramic base (11), along with insulating fixture members (141, 142) made of ceramic attached to the inner sides of the conductive fixture members. Two comb electrodes (151, 152) as one pair have connecting portions (151a, 152a) adhered to the conductive fixture members (131, 132) as well as thin-wire electrodes whose distal ends are adhered to the insulating fixture members (141, 142). By setting length L of the opening (12) and width D of the conductive fixture members (131, 132) to appropriate values according to the coefficient of thermal expansion of each of those members, the elongation of the electrodes which accompanies an increase in temperature can be balanced by the increase in the distance between the adhered positions of the electrodes to prevent the electrodes from being excessively taut or slack.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: February 5, 2019
    Assignee: SHIMADZU CORPORATION
    Inventors: Akiko Imazu, Hideaki Izumi
  • Patent number: 10197602
    Abstract: An electric current measuring device that employs a unique mechanical structure and Hall effect sensor array combined with processing of measurements obtained from the current measuring device to accurately measure current flow by cancelling the effects of static or dynamic magnetic noise originating from external sources. The process determines the actual current through the conductor by measuring and subtracting external noise.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: February 5, 2019
    Inventor: Jody Nehmeh
  • Patent number: 10186949
    Abstract: A DC-to-DC power converter device has a common magnetic core structure that serves the functions of both transformer device and output inductor by integrating each into the common core. The transformer device has primary and secondary windings integrated into a first leg structure of the magnetic core, and the output inductor device has an output inductor winding integrated into a second leg structure of the magnetic core, the inductor winding structure for delivering output current to a load when a periodically switched input voltage is applied across the primary winding structure. The winding polarities of the transformer secondary winding structure and of the output inductor winding structure provide oppositely oriented polarities of electromotive force (EMF) to substantially reduce an output current ripple to an output load when delivering power through the transformer, through the output inductor and into the output load.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: January 22, 2019
    Assignee: International Business Machines Corporation
    Inventors: Andrew Ferencz, Todd E. Takken, Xin Zhang, Yuan Yao
  • Patent number: 10181633
    Abstract: Pre-formed non-flexible antenna modules are connected to one another via radio-frequency (“RF”) connectors for downhole applications. The antennas include two or more non-flexible antenna modules having a one or more center conductors extending therethrough. The antenna modules are connected by high frequency RF connectors, thereby forming a single antenna. Accordingly, the illustrative embodiments described herein will reduce the assembly complexity, increase repeatability of the design implementation, and enhance the productivity of the manufacturing process.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: January 15, 2019
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Lay Wei Ang, Agustin Omictin Gubuan
  • Patent number: 10170232
    Abstract: A toroid inductor includes a plurality of first turns configured in a first ring shape and a plurality of second turns configured in a second ring shape. The plurality of first turns includes a plurality of first upper interconnects, a plurality of first lower interconnects, and a plurality of first vias coupled to the plurality of first upper interconnects and to the plurality of first lower interconnects. The plurality of second turns is at least partially intertwined with the plurality of first turns. The plurality of second turns includes a plurality of second upper interconnects, a plurality of second lower interconnects, and a plurality of second vias coupled to the plurality of second upper interconnects and to the plurality of second lower interconnects.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: January 1, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Yue Li, Charles David Paynter, Ryan David Lane
  • Patent number: 10170229
    Abstract: There is provided a chip electronic component including: an insulating substrate; a first coil part disposed on one surface of the insulating substrate; a second coil part disposed on the other surface of the insulating substrate opposing one surface of the insulating substrate; a via connecting the first and second internal coil parts to each other while penetrating through the insulating substrate; first and second via pads disposed on one surface and the other surface of the insulating substrate, respectively, so as to cover the via; and a first dummy pattern disposed in a region of one surface of the insulating substrate adjacent to the first via pad and a second dummy pattern disposed in a region of the other surface of the insulating substrate adjacent to the second via pad.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: January 1, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 10163596
    Abstract: The present invention discloses a horizontal-deflection prevention mechanism for an HVDC relay, comprising a moving contact assembly which comprises a moving reed and moving contacts arranged at left and right ends of the moving reed; an upper section of a pushrod is located above a yoke plate and fixed with the moving reed; a positioning plate is provided on the yoke plate; and a left return spring is connected between a left end of the moving reed and the positioning plate, and a right return spring is connected between a right end of the moving reed and the positioning plate.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: December 25, 2018
    Assignee: ZHEJIANG INNUOVO NEW ENERGY TECHNOLOGY CO., LTD.
    Inventors: Wenrong Song, Rongai Yu, Xiaobin Guo, Haiyan Huang, Peng Su, Dejin Du
  • Patent number: 10164128
    Abstract: A composition for solar cell electrodes includes silver powder; a silver alloy (AgX) that includes silver (Ag) and a metal (X), the silver alloy having a eutectic point of about 150° C. to about 900° C.; a glass frit; and an organic vehicle.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: December 25, 2018
    Assignee: Cheil Industries, Inc.
    Inventors: Sang Hee Park, Tae Joon Kim, Hun Hyu Song
  • Patent number: 10158293
    Abstract: A power supply module includes a substrate, a switching control IC and a coil. The coil includes a plurality of metal posts, first ends of which are mounted on a first surface of the substrate, wiring conductors that are in conductive contact with the first ends of the metal posts, and post connection conductors that are in conductive contact with second ends of the metal posts. The power supply module further includes a magnetic core that strengthens magnetic flux generated by the coil, and a sealing resin that seals the metal posts and the magnetic core.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: December 18, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takashi Noma, Keiichi Ichikawa
  • Patent number: 10148233
    Abstract: Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures. A compensation circuit can act to protect the receive path during an RF transmit mode.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: December 4, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yalin Jin, Setu Mohta
  • Patent number: 10148172
    Abstract: A power supply module is disclosed. The power supply module includes: a coil including a coil body and connecting ends; electronic components including at least an integrated circuit chip; a magnetic core which encloses the coil body, wherein at least one side of the magnetic core has a cavity provided therein, and the at least one electronic component is positioned in the cavity; a connector, which abuts against the side of the magnetic core having the cavity therein, covers the surface of the side, and is electronically connected to the coil and the electronic components. The power supply module is able to reduce the damage to the integrated circuit chip, decrease electromagnetic interferences and achieve an excellent cooling effect.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: December 4, 2018
    Assignee: Sumida Electric (H.K.) Company Limited
    Inventors: Douglas James Malcolm, Yanfei Liu, Guoping Zhang, Zhuo Wu, Hongnian Zhang, Xinliang Luo
  • Patent number: 10147533
    Abstract: An inductor includes a body including an organic material and a coil part disposed in the body. External electrodes are disposed on outer surfaces of the body and connected to the coil part. The coil part includes a conductive pattern and a conductive via. An adhesive layer is disposed between the conductive pattern and the conductive via, and the adhesive layer is formed of a material different from materials of the conductive pattern and the conductive via.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: December 4, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soo Hyun Lyoo, Se Woong Paeng, Jung Min Kim, Jeong Gu Yeo, Tae Hoon Kim, Sang Jun Lee, Ji Hyung Jung, Ji Man Ryu, Do Young Jung
  • Patent number: 10135405
    Abstract: Embodiments of radio frequency (RF) systems include a power amplifier having a primary winding and a secondary winding. The primary winding can be biased in different states in transmit and receive modes such that a difference between center frequencies of the primary winding and the secondary winding are significantly different in the different modes.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: November 20, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yalin Jin, Setu Mohta
  • Patent number: 10121593
    Abstract: A composite electronic component includes a first and second electronic elements, and a joint material. The first electronic element includes a base member, and an upper surface conductor on an upper surface of the base member. The second electronic element includes an element body with a lower surface facing the upper surface of the base member, and a terminal conductor disposed on the lower surface of the element body. The joint material joins the upper surface conductor and the terminal conductor. The upper surface conductor includes a conductive layer in which a metal that is maximum in weight ratio is Ag. The lateral surface of the conductive layer is covered with conductive layers defining a protective metal film, and the metal that is maximum in weight ratio contained in the conductive layers defining a protective metal film is a metal other than Ag and Cu.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: November 6, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuo Hattori, Isamu Fujimoto, Shinichiro Kuroiwa
  • Patent number: 10117328
    Abstract: The present disclosure relates to a flexible circuit board. The flexible circuit board includes a first conductive trace substrate and a third conductive layer, a second conductive post and a third conductive post. The first conductive trace substrate includes a first insulating layer, a first conductive layer and a second conductive layer formed two opposite surfaces of the first insulating layer. The first conductive layer includes a first signal line, the second conductive layer includes a second signal line, and the first signal line is parallel connected with the second signal line.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: October 30, 2018
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Fu-Wei Zhong, Ming-Jaan Ho, Yi-Qiang Zhuang, Xin Zhang
  • Patent number: 10100794
    Abstract: A fuel injector for an internal combustion engine includes an injector body in which there are positioned an actuator, a control valve, and a needle guide. The actuator actuates the control valve, the control valve controlling an injection needle sliding the needle guide between an open position in which injection is permitted and a closed position in which the injection of fuel is prevented. The injector additionally includes a first electrical connection extending from the needle guide to a metal that are internal to the injector, and a metal extension extending from the metal ring to a connector pin accessible from the outside of the injector, so that an electrical signal indicative of the position of the needle can be transmitted from the needle guide for the needle to the connector pin.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: October 16, 2018
    Assignee: DELPHI TECHNOLOGIES IP LIMITED
    Inventors: Philippe Barbier, Thierry Cochet
  • Patent number: 10103695
    Abstract: Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures, and a power amplifier and switch can be integrated onto a single complementary metal oxide semiconductor die.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: October 16, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yalin Jin, Setu Mohta
  • Patent number: 10094896
    Abstract: Methods of fastening a cage with a fastening system in an MRD. One method includes: assembling: a plurality of pole pieces; a plurality of side magnets, the side magnets substantially enclosing the pole pieces and thereby defining a magnetic envelope and enclosed volume therein; a plurality of side walls, the side walls substantially enclosing the side magnets; a plurality of face walls and a plurality of fastening rods; and passing a plurality of fastening rods through at least one of the side magnets and at least one of the pole pieces and fastening them in an effective measure, such that the rods physically interconnects at least one pair of side walls.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: October 9, 2018
    Assignee: Aspect Imaging Ltd.
    Inventor: Uri Rapoport
  • Patent number: 10072944
    Abstract: The invention relates to a device (1) for measurement of an angle of an axis of rotation (10), comprising a magnet (12) with a magnet surface (14), which is pivotally assembled at the axis of rotation (10), and further comprising a sensor (16) for recognition of external magnetic flux lines of the magnet (12). According to the invention, the magnet (12) comprises at least a first magnet section (20) with a magnetic first orientation (22) and the magnet (12) further at least comprises a second magnet section (24) with a second magnetic orientation (26), wherein the first magnetic orientation (22) is displaced from the second magnetic orientation (26), whereby the magnet surface (14) comprises a different concentration of external magnetic flux lines.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: September 11, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Tobias Klocke, Yan Bondar
  • Patent number: 10062491
    Abstract: A choke coil module of a high power density DC-AC power inverter includes a bottom plate and a top plate. Two upright posts are secured between the bottom plate and the top plate. The upright posts are sleeved with choke coils, respectively. The choke coils and heat radiating holes of the bottom plate and the top plate are communicated with one another to form an air guide passage. When the power converter is actuated, the choke coils generate heat. Through a fan unit, the outside air is guided into a casing via air inlets of the casing, and the heat generated by the choke coils is expelled to the outside via the air guide passage and air outlets of the casing. The choke coil module mounted in the high power density casing is able to achieve an excellent heat radiation effect.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: August 28, 2018
    Assignee: CHYNG HONG ELECTRONIC CO., LTD.
    Inventor: Mu-Chun Lin
  • Patent number: 10049814
    Abstract: A multilayer electronic component includes a multilayer body having a structure in which a plurality of insulation layers are stacked, and having first and second end surfaces opposing each other and first and second side surfaces connecting the first and second end surfaces to each other. An internal coil disposed in the multilayer body includes a plurality of internal coil patterns exposed to the first and second side surfaces of the multilayer body and vias penetrating through the insulation layers connecting the plurality of internal coil patterns to each other. First and second side parts cover at least portions of the first and second side surfaces of the multilayer body, respectively.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: August 14, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Seung Kyu Lee
  • Patent number: 10012614
    Abstract: An ion filter and a method of manufacturing an ion filter. The method including providing a monolithic structure; selectively removing regions of the structure, to form a pair of electrodes defining at least one ion channel therebetween. The electrodes are preferably mechanically connected at one or more locations by a portion of the structure; wherein the connecting portion of the structure provides a higher electrical impedance than the filter would provide without such a mechanical connection, to thereby electrically separate the electrodes.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: July 3, 2018
    Assignee: Owlstone Medical Limited
    Inventors: Matthew Hart, Andrew H. Koehl
  • Patent number: 10008989
    Abstract: Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures. A compensation circuit can act to protect the receive path during an RF transmit mode.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: June 26, 2018
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Yalin Jin, Setu Mohta
  • Patent number: 10008324
    Abstract: A method for manufacturing a powder magnetic core using a soft magnetic material powder, wherein the method has: a first step of mixing the soft magnetic material powder with a binder, a second step of subjecting a mixture obtained through the first step to pressure forming, and a third step of subjecting a formed body obtained through the second step to heat treatment. The soft magnetic material powder is an Fe—Cr—Al based alloy powder comprising Fe, Cr and Al. An oxide layer is formed on a surface of the soft magnetic material powder by the heat treatment. The oxide layer has a higher ratio by mass of Al to the sum of Fe, Cr and Al than an alloy phase inside the powder.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: June 26, 2018
    Assignee: HITACHI METALS, LTD.
    Inventors: Yoshimasa Nishio, Shin Noguchi, Kazunori Nishimura, Tetsuroh Katoh, Toshio Mihara
  • Patent number: 10002700
    Abstract: In a particular embodiment, a device includes a low-loss substrate, a first inductor structure, and an air-gap. The first inductor structure is between the low-loss substrate and a second inductor structure. The first inductor structure is aligned with the second inductor structure to form a transformer. The air-gap is between the first inductor structure and the second inductor structure.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: June 19, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Je-Hsiung Lan, Chi Shun Lo, Jonghae Kim, John H. Hong
  • Patent number: 9986630
    Abstract: A superconducting air core cyclotron that replaces the iron core flutter field structure with an active superconducting wire structure with a superconducting main coil generating an isochronous field, and superconducting compensation coils generating the magnetic shield for the magnetic structure.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: May 29, 2018
    Inventor: Krunoslav Subotic
  • Patent number: 9984808
    Abstract: An electronic component includes a substantially helix-shaped inductor including inductive conductor layers on insulator layers including a first inductive conductor layer and a second inductive conductor layer adjacent to the first inductive conductor layer on the upper layer side. Each of the first and second inductive conductor layers has a contact portion and a linear portion. The contact portion is, when viewed in the laminating direction, overlapped by an inductive conductor layer adjacent thereto on the lower or upper layer side. The linear portion is not overlapped by inductive conductor layers adjacent thereto on the lower and upper layer sides. The lower surface of the linear portion of the second inductive conductor layer is positioned higher than that of the first inductive conductor layer, and is positioned lower than the upper surface of the linear portion of the first inductive conductor layer.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: May 29, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Hiromi Miyoshi
  • Patent number: 9966183
    Abstract: A coil is provided at a multilayer body including insulating layers stacked on one another. The coil includes linear conductors connected by via conductors to make a looped track when viewed from a layer stacking direction. The linear conductors include a first linear conductor contacting with an external electrode provided on the surface of the multilayer body, and a second linear conductor forming a half of the looped track. The first linear conductor includes a coil portion forming a part of the looped track. The second linear conductor is adjacent to the first linear conductor with one of the insulating layers in-between, and a first end of the second linear conductor is connected to a first end of the first linear conductor by a first via conductor. A second end of the second linear conductor does not overlap the first linear conductor when viewed from the layer stacking direction.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: May 8, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kouji Yamauchi, Mitsuru Odahara
  • Patent number: 9953759
    Abstract: A coil component includes a component main body, a coil conductor, first and second external terminal electrodes and first and second extended conductor layers The first and second extended conductor layers are extended in directions toward the first main surface from one end portions of the first and second external terminal electrodes in a state of forming uniform and edges, and connect the one end and the other end of the coil conductor and the first and second external terminal electrodes, respectively, with distances larger than distances extending in normal line directions of outer peripheral edges of the circulating conductor layers and equal to or smaller than distances extending in tangent line directions of the outer peripheral edges of the circulating conductor layers.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: April 24, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takeru Ozawa
  • Patent number: 9911679
    Abstract: A semiconductor package includes a semiconductor die comprising a control transistor and a sync transistor, an integrated output inductor comprising a winding around a core, and coupled to the semiconductor die. The winding comprises a plurality of conductive clips situated above a printed circuit board (PCB) and connected to a plurality of conductive segments in the PCB. The control transistor and the sync transistor are configured as a half-bridge. The integrated output inductor is coupled to a switched node of the half-bridge. At least one of the plurality of conductive clips includes a partially etched portion and a non-etched portion. The semiconductor die is attached to the integrated output inductor by a die attach material. The semiconductor die and the integrated output inductor are encapsulated in a molding compound.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: March 6, 2018
    Assignee: Infineon Technologies Americas Corp.
    Inventor: Eung San Cho
  • Patent number: 9885388
    Abstract: A linear motion assembly including a component having a longitudinal axis and adapted to translate along the longitudinal axis, and a bearing comprising a spiral body including a substrate and a low friction material, wherein the bearing extends around the component and provides a low friction interface for translation of the component, and wherein the bearing is adapted to prevent longitudinal translation of the component in a locked condition and permit longitudinal translation of the component in an unlocked condition. In an embodiment, the bearing is adapted to transition between the locked and unlocked conditions upon circumferential translation of an axial end of the spiral body, longitudinal translation of an axial end of the spiral body, or a combination thereof.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: February 6, 2018
    Assignee: SAINT-GOBAIN PERFORMANCE PLASTICS RENCOL LIMITED
    Inventor: James K. Burgess
  • Patent number: 9881726
    Abstract: A common mode filter is manufactured to include a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part. The magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon.
    Type: Grant
    Filed: February 5, 2014
    Date of Patent: January 30, 2018
    Assignee: SAMSUNG ELECTRO-MECHANIS CO., LTD.
    Inventors: Sung Kwon Wi, Jeong Bok Kwak, Sang Moon Lee, Young Seuck Yoo, Yong Suk Kim
  • Patent number: 9852841
    Abstract: A coil structure includes a conductor band and a first insulating plate. The conductor band turns around a coil axis in such a manner that the conductor band folds at a plurality of portions which form a plurality of folded portions. The first insulating plate includes a first edge portion which abuts along at least one of the plurality of folded portions. At least part of the conductor band is wound around the first insulating plate.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: December 26, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazuyuki Sakiyama, Akira Kato, Takehiko Yamakawa, Eiji Takahashi
  • Patent number: 9852836
    Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: a core substrate having a conductive pattern on the surface and a magnetic layer for covering the core substrate not to expose the conductive pattern, wherein the magnetic layer is made of a metal-polymer composite and has a multilayer structure.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: December 26, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Moon Soo Park, Seong Min Chin, Hwan Soo Lee, Hye Yeon Cha
  • Patent number: 9846834
    Abstract: An antenna device includes a first coil and a second coil whose winding axes are parallel or substantially parallel, are disposed so as to be insulated from each other, and that magnetically couple with each other; a first capacitance that is connected in parallel to the first coil and defines a first resonance circuit with the first coil; a second capacitance that is connected in parallel to the second coil and defines a second resonance circuit with the second coil; a third capacitance connected between at least one set of ends of the first coil and the second coil; and a power supply terminal connected to the first coil.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: December 19, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Nobuyuki Tenno
  • Patent number: 9824811
    Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: November 21, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Haiying Li, Benjamin Michael Sutton, Ming Li
  • Patent number: 9814167
    Abstract: A coil component capable of matching characteristic impedance (Zo) includes an insulating layer in which coil conductors are embedded; a first magnetic member disposed to be in contact with one surface of the insulating layer; and a second magnetic member having permeability lower than that of the first magnetic member and disposed to be in contact with the other surface of the insulating layer. An interval L1 between the second magnetic member and the coil conductors depends on an intended impedance value.
    Type: Grant
    Filed: November 10, 2015
    Date of Patent: November 7, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wook Park, Kwang Mo Kim, Won Chul Sim
  • Patent number: 9799721
    Abstract: A method of forming a semiconductor device includes forming a lower coil segment in a first dielectric layer over a substrate, forming a second dielectric layer over the lower coil segment and the first dielectric layer, anisotropically etching a top portion of the second dielectric layer to form an opening over the lower coil segment, depositing magnetic material in the opening to form a magnetic core, forming a third dielectric layer over the magnetic core and the second dielectric layer, forming vias extending through the second dielectric layer and the third dielectric layer, and after forming the vias, forming an upper coil segment over the third dielectric layer and the magnetic core, wherein the vias connect the upper coil segment with the lower coil segment.
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: October 24, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Tsung Kuo, Jiech-Fun Lu, Yen-Shuo Su
  • Patent number: 9779869
    Abstract: An integrated circuit transformer structure includes at least two conductor groups stacked in parallel in different layers. A first spiral track is formed in the at least two conductor groups, the first spiral track included first turns of a first radius within each of the at least two conductor groups, and second turns of a second radius within each of the at least two conductor groups, the first and second turns being electrically connected. A second spiral track is formed in the at least two conductor groups, the second spiral track including third turns of a third radius within each of the at least two conductor groups and disposed in a same plane between the first and second turns in each of the at least two conductor groups.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: October 3, 2017
    Assignee: International Business Machines Corporation
    Inventors: Robert L. Barry, Robert A. Groves, Venkata Nr. Vanukuru
  • Patent number: 9767953
    Abstract: A common mode filter, comprising a winding core, and said winding core further includes a U-type heave portion, said U-type heave portion divides said winding core into a first winding portion, a second winding portion and a cross winding portion; the first winding wires, are wound on said first winding portion, said cross winding portion and said second winding portion in sequence; and the second winding wires, are wound on said first winding portion, said cross winding portion and said second winding portion in sequence. As a result, the common mode filter not only can reduce the effects of the existence capacitors of in high-frequency layers and the inherent functionality of parasitic capacitors in common mode filters with higher frequency characteristics, but also the overall structure is simple, fast assembly and easy operation.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: September 19, 2017
    Assignee: ABC TAIWAN ELECTRONICS CORP.
    Inventors: Liang-Fang Fan, Ming-Chien Hsiao, Tang-Kang Chen