Electromagnet, Transformer Or Inductor Patents (Class 29/602.1)
  • Patent number: 11056268
    Abstract: A coil component includes a plurality of conductor layers constituted of a first conductor layer to a fourth conductor layer that includes a function layer and a coil layer wound around an axis center; and a covering portion that is formed of an insulative resin, integrally covers the plurality of conductor layers, and is interposed between conductor layers adjacent to each other. The coil layer and the function layer of the plurality of conductor layers have substantially the same shape in a plan view. The fourth conductor layer has a connection conductor layer connecting the coil layer and the function layer to each other. A conductor layer having no connection conductor layer among the plurality of conductor layers has a protrusion portion corresponding to the connection conductor layer at a position overlapping the connection conductor layer in a plan view.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: July 6, 2021
    Assignee: TDK CORPORATION
    Inventors: Masanori Suzuki, Kouji Kawamura, Naoaki Fujii, Manabu Yamatani, Tomonaga Nishikawa
  • Patent number: 11018086
    Abstract: A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the polymer, wherein the TAVs are coupled in series. A Redistribution Line (RDL) is underlying the polymer. The RDL electrically couples a first one of the TAVs to a second one of the TAVs.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: May 25, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hua Chen, Chen-Shien Chen
  • Patent number: 11004593
    Abstract: A coil conductive wire has a coil part wound around a pillar part, and flat-shaped connection end parts provided at respective ends of the coil part. Terminal electrodes are electrically connected to the connection end parts, each of which terminal electrodes has an electrode layer and a conductive layer covering the electrode layer. Each connection end part has a first principle face connected to a surface of the electrode layer, a second principle face projecting from a surface of the conductive layer, and a side face. The conductive layer has a flat area, and a skirt area provided between the flat area and the side face and sloping onto the side face. The thickness of the flat area is smaller than that of each connection end part, while the thickness of the skirt area decreases in the direction away from the side face.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: May 11, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Hirotaka Wakabayashi
  • Patent number: 10996297
    Abstract: A cage with a fastening system (1) in a magnetic resonance device (MRD) is disclosed, said cage in an MRD comprising (a) M pole pieces (45) (M?2); (b) N side magnets (20) (N?2), said side magnets substantially enclosing said pole pieces and thereby defining a magnetic envelope and enclosed volume therein; (c) N side walls (10), said side walls substantially enclosing said side magnets; (d) P face walls (30) (P?2); and (e) a plurality of fastening rods (100); wherein each of said fastening rods physically interconnects at least one pair of side walls, passing through at least one of said side magnets and at least one of said pole pieces.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: May 4, 2021
    Assignee: ASPECT IMAGING LTD.
    Inventor: Uri Rapoport
  • Patent number: 10986732
    Abstract: A laminated circuit board includes a base having a first surface, and a second surface on an opposite side from the first surface, a first metal layer provided in the base and including a first electrode exposed from the first surface, and a second metal layer provided in the base and including a second electrode exposed from the second surface. The first metal layer includes an inductor electrically connected to the first electrode, and the first electrode and the second electrode are bonded and electrically connected to each other.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: April 20, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takayuki Matsumoto, Tsukasa Nakanishi
  • Patent number: 10984141
    Abstract: A self-powering tamper detection system architecture includes a power source, a tamper detector configured to identify a tamper event, a tamper switch electrically connected to the power source and mechanically connected to the tamper detector, a tamper controller configured to produce a tamper response when the tamper event is identified, and program memory configured to store program data. The tamper detector is configured to mechanically actuate the tamper switch when a tamper event occurs, and the tamper response provides a disruption of the program data. The tamper detector and the tamper switch can include printed circuit board and embedded transformer, whereby the embedded transformer includes an axially-moveable ferromagnetic core.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: April 20, 2021
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Kirk A. Lillestolen, William E. Villano, David J. Manna
  • Patent number: 10930588
    Abstract: An inductor or transformer with the inductor can include one or more windings split into strands along a radial path of the winding and provide for a more uniform current distribution across a width of the winding. The winding(s) can comprise twisting components as twistings or strand crossings located at various locations along the winding. The twisting components span the winding along a winding width with a connector or crossing strand and change a position of one strand to another at points that different strands of the winding are cut or spliced.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: February 23, 2021
    Assignee: Intel Corporation
    Inventor: Alfred Erik Raidl
  • Patent number: 10916374
    Abstract: A manufacturing method of a coil component for forming a coil-assembly body in which a coil is mounted on a magnetic-body core, comprising the steps of: inputting the coil-assembly body and an admixture containing a magnetic powder and a resin into a container; applying pressure onto the admixture which is inputted into the container; depressurizing an air pressure of an environment, in which the admixture is placed, to become a negative-pressure lower than the atmospheric pressure at least during the pressurizing process in the step of applying pressure; applying vibration onto the admixture and filling the admixture in the container at least during the depressurizing process in the step of depressurizing; and curing the resin contained in the admixture for the integrated object of the admixture and the coil-assembly body which passed through the step of depressurizing and the step of applying vibration.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: February 9, 2021
    Inventor: Teruaki Tanaka
  • Patent number: 10912223
    Abstract: The method for producing the electric module comprises: securing at least one first electrical component (108, 110) to a first plate (102); then assembling each first electrical component (108, 110) to an electrical connection bar (104) to which at least one second component (120) is already secured.
    Type: Grant
    Filed: October 9, 2014
    Date of Patent: February 2, 2021
    Assignee: Valeo Siemens eAutomotive France SAS
    Inventors: Valery Govindassamy, Christian Schwartz, Roger Deniot
  • Patent number: 10902988
    Abstract: A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 ?m or more.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: January 26, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Jung Hyuk Jung, Woo Jin Lee, Han Wool Ryu
  • Patent number: 10867746
    Abstract: An inductor structure includes a first curve metal component, a second curve metal component, and a connection component. The first curve metal component is disposed on a layer. The layer is located at a first plane, the first curve metal component is located at a second plane, and the first plane is perpendicular to the second plane. The second curve metal component is disposed on the layer. The second curve metal component is located at the second plane. The connection component is coupled to the first curve metal component and the second curve metal component.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: December 15, 2020
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Chih-Yu Tsai, Kai-Yi Huang
  • Patent number: 10868243
    Abstract: Co-fired integrated circuit devices and methods for fabricating and integrating such on a workpiece are disclosed herein. An exemplary method includes forming a first passive device and a second passive device over a carrier substrate. The first passive device and the second passive device each include at least one material layer that includes a co-fired ceramic material. The carrier substrate is removed after performing a co-firing process to cause chemical changes in the co-fired ceramic material. The first passive device may include a conductive loop disposed between a first magnetic layer and a second magnetic layer. The first magnetic layer, the second magnetic layer, or both includes a co-fired ceramic magnetic material. The second passive device may include a first conductive layer and a second conductive layer separated by a dielectric layer. The first conductive layer, the second conductive layer, or both includes a co-fired ceramic conductive material.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: December 15, 2020
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., APPLE
    Inventors: Alexander Kalnitsky, Shawn Searles, David Cappabianca
  • Patent number: 10861635
    Abstract: An electronic component having a multilayer body that includes a plurality of insulating layers that are stacked on top of one another; a plurality of first coils that are arranged inside the multilayer body in a stacking direction of the multilayer body and are electrically connected to each other; a plurality of second coils that are arranged inside the multilayer body in the stacking direction of the multilayer body and are electrically connected to each other; an inner ground electrode that is provided inside the multilayer body and is arranged between two of the first coils, which face each other in the stacking direction; and a ground terminal that is connected to the inner ground electrode.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: December 8, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Minoru Matsunaga
  • Patent number: 10832857
    Abstract: A coil component includes: a body; and external electrodes disposed on an external surface of the body. The coil part may include a first coil layer and a second coil layer connected to the first coil layer, each of the first and second coil layers may include a plurality of coil patterns, the plurality of coil patterns of the first coil layer may include a first connection coil pattern physically connected to the second coil layer, the plurality of coil patterns of the second coil layer may include a second connection coil pattern physically connected to the first connection coil pattern, and an upper surface of the first connection coil pattern may come into direct contact with a lower surface of the second connection coil pattern.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: November 10, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Seob Lee, Sang Seob Kim, Young Sun Kim
  • Patent number: 10818429
    Abstract: An inductor device includes at least two wires and at least two switches. Each of the at least two wires includes an opening, and the openings are disposed correspondingly to each other. One of the at least two switches is coupled to two terminals of the opening of one of the at least two wires. Another one of the at least two switches is coupled to one terminal of the opening of the one of the at least two wires and one terminal of the opening of another one of the at least two wires in an interlaced manner. If the one of the at least two switches is turned on, one of the at least two wires forms an inductor; if another one of the at least two switches is turned on, both of the at least two wires form the inductor.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: October 27, 2020
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Chih-Hua Liu
  • Patent number: 10811598
    Abstract: A sensor package includes a semiconductor die including at least one current sensor. The semiconductor die includes a first pass through hole extending from one side of the semiconductor die to an opposite side of the semiconductor die. The semiconductor package further includes a second pass through hole extending from one side of the sensor package to an opposite side of the sensor package. The second pass through hole is aligned with the first pass through hole and is configured to receive a current-carrying conductor. The at least one current sensor senses current flow in the current-carrying conductor received in the second pass through hole. An end of the current-carrying conductor is coupled to a terminal on a circuit board in the sensor package.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: October 20, 2020
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Jefferson W. Hall, Michael J. Seddon, Yenting Wen
  • Patent number: 10804034
    Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a plating layer disposed on the electrode layer, and a secondary phase material disposed at a boundary between the plating layer and the electrode layer. The secondary phase material contains sulfur (S).
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: October 13, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Joon Hwan Kwag, Jong Ho Lee, Myung Jun Park
  • Patent number: 10801121
    Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: October 13, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Yeon Cha, Dong Hwan Lee, Jung Hyuk Jung, Chan Yoon, Hye Min Bang, Tae Young Kim
  • Patent number: 10777352
    Abstract: A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying a pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened, wherein a viscosity of the mixture is 1,000 to 1,000,000 mPa·s at room temperature.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: September 15, 2020
    Assignee: SUMIDA CORPORATION
    Inventors: Shinichi Sakamoto, Douglas James Malcolm
  • Patent number: 10770225
    Abstract: A method of producing electrical coils includes preparing a plurality of coil layers. Each coil layer is prepared by printing an electrically conductive coil pattern on a layer substrate. Each coil pattern includes an inner end at a first via through the substrate at a point radially inside the coil pattern, and an outer end at a second via through the substrate at a point radially outside the coil pattern. The method also includes joining the coil layers into a stack and electrically connecting successive coil patterns of the plurality of coil layers to one another through the vias to form a conductive coil extending through the stack.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: September 8, 2020
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Sameh Dardona, Paul Sheedy
  • Patent number: 10768257
    Abstract: In a method, control computer and magnetic resonance (MR) apparatus for generating MR recordings of an examination object, first magnetic MR data are acquired in a first recording region inside a homogeneity volume of the scanner of the MR apparatus, and second MR raw data are acquired in a second recording region outside the homogeneity volume. First image data are reconstructed on the basis of the first MR raw data and second image data are reconstructed on the basis of the second MR raw data. The first image data and the second image data are combined to form combination image data, which cover a region that extends in the first recording region and in the second recording region.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: September 8, 2020
    Assignee: Siemens Healthcare GmbH
    Inventor: Stefan Popescu
  • Patent number: 10741315
    Abstract: A magnetic body constituted by magnetic grains bonded together via oxide film, which magnetic grains contain a Fe—Si-M soft magnetic alloy (where M is a metal element more easily oxidized than Fe) that contains sulfur atoms (S). The magnetic body preferably contains 0.004 to 0.012 percent by weight of S, 1.5 to 7.5 percent by weight of Si, and 2 to 8 percent by weight of metal M.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: August 11, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Atsushi Tanada, Kiyoshi Tanaka
  • Patent number: 10694622
    Abstract: A printed wiring board comprises a sheet-shaped core base material containing a magnetic material, a coil disposed inside the core base material, and an external circuit layer disposed on at least one of first and second surfaces of the core base material opposite to each other.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: June 23, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akinori Hamada, Yoshimasa Yoshioka, Yoshinori Taguchi, Ryuichiro Tominaga
  • Patent number: 10665379
    Abstract: An embedded magnetic component device includes a magnetic core located in a cavity extending into an insulating substrate. The cavity and magnetic core are coved with a cover layer. Through holes extend through the cover layer and the insulating substrate, and are plated to define conductive vias. Metallic traces are provided at exterior surfaces of the cover layer and the insulating substrate to define upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a first isolation barrier is provided on the cover layer, and at least a third insulating layer is provided on the substrate. The second and third insulating layers provide additional insulation for the device, and define and function as a circuit board for surface mounted power electronics.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: May 26, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Scott Andrew Parish, Lee Francis
  • Patent number: 10658103
    Abstract: A coil component has a magnetic body of rectangular solid shape, a coil with N turns (N is a positive number of 2 or greater) provided inside the magnetic body, an insulating intermediate part, and external electrodes. The coil has a first conductor layer, a second conductor layer, and an inter-layer connection part. The first conductor layer has a first multiple winding part which is wound around one axis with a first spacing. The second conductor layer has a second multiple winding part which is wound around the one axis with the first spacing and faces the first conductor layer. The insulating intermediate part is provided inside the magnetic body and forms, between the first conductor layer and second conductor layer, a second spacing corresponding to a thickness equal to or less than the product of the first spacing and (N?1).
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: May 19, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Hirotaro Seino, Shinsuke Takeoka, Hitoshi Matsuura, Kenji Otake
  • Patent number: 10658102
    Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is greater than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: May 19, 2020
    Assignee: CYNTEC CO., LTD.
    Inventors: Wen-Hsiung Liao, Roger Hsieh, Hideo Ikuta, Yueh-Lang Chen
  • Patent number: 10643959
    Abstract: An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: May 5, 2020
    Assignee: Intersil Americas LLC
    Inventors: Zaki Moussaoui, Nikhil Vishwanath Kelkar
  • Patent number: 10636556
    Abstract: Disclosed are a bus bar unit capable of being easily manufactured while preventing a bus bar from being separated from a magnetic core and also capable of being reduced in size, and a manufacturing method thereof. The bus bar unit includes a magnetic core having a through-hole and covered with an insulating material, U-phase, V-phase and W-phase bus bars of which main body portions are arranged in parallel with each other in a predetermined direction within the through-hole and one side connecting portions provided on one side in an axial direction of the through-hole from the main body portions are bent in a direction crossing the axial direction, and a base member formed of an insulating material and to which the magnetic core is fixed, wherein the one side connecting portions of the bus bars are held while being disposed between the base member and the magnetic core.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: April 28, 2020
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yuya Ishihara, Tomohiro Fukazu
  • Patent number: 10622144
    Abstract: A method for producing a pair of electrically conductive members assembled into an electrical component assembly provided with a coil. The method includes: forming connection terminal sections provided in the pair of electrically conductive members by arranging them alternately opposite to each other and then performing press punching; and after the press punching, bending the connection terminal sections in the pair of electrically conductive members toward a side departing from the coil into a protruding form.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: April 14, 2020
    Assignee: NISSIN KOGYO CO., LTD.
    Inventors: Takuro Kodama, Keiichi Tatsuno
  • Patent number: 10598353
    Abstract: Described is an arrangement and system for precise angular and directional positioning of light-emitting diodes (LED). An LED component includes a base body with a light-emitting region, a first connector, and a second connector, where the connectors are electrically conductively connected to the light-emitting region. The base body includes at least two fixing regions and the connectors each include a bending portion and a contact area for surface mounting. Each of the bending portions is arranged between the base body and the contact area. A supporting frame includes a plinth region to align the supporting frame on a surface and includes an outwardly open recess, a support region to receive a component in the supporting frame and at least two fixing elements to fix the component above the support region. A base area of the plinth region and a base area of the support region enclose an acute angle.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: March 24, 2020
    Assignee: Jabil Optics Germany GmbH
    Inventors: Sepehr Baghschomali, Samir Catic
  • Patent number: 10586648
    Abstract: A coil component includes a body portion including a magnetic material, and a coil portion disposed in the body part. The coil portion includes a first coil pattern layer having a planar spiral pattern, an insulating layer formed of an insulating resin embedding at least a portion of the first coil pattern layer, and a second coil pattern layer disposed on the insulating layer and having a planar spiral pattern. The insulating layer includes a core material disposed between the first and second coil pattern layers, and a thickness of a lower region of the insulating layer disposed below the core material is greater than a thickness of an upper region of the insulating layer disposed above the core material.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: March 10, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jae Lee, Youn Soo Seo, Jae Ha Kim, Hye Yeon Cha
  • Patent number: 10581388
    Abstract: Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures, and a power amplifier and switch can be integrated onto a single complementary metal oxide semiconductor die.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: March 3, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yalin Jin, Setu Mohta
  • Patent number: 10573803
    Abstract: A semiconductor package includes a semiconductor die. A through hole in the semiconductor package and semiconductor die extends from one side of the semiconductor package and die to an opposite side of the semiconductor package and die. The through hole is configured to receive a current-carrying conductor there through. At least one current sensor is formed in, or on, the semiconductor die and configured to sense current flow in the current-carrying conductor received in the through hole.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: February 25, 2020
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Jefferson W. Hall, Michael J. Seddon, Yenting Wen
  • Patent number: 10571537
    Abstract: A system for multi-slice magnetic resonance imaging (MRI) comprises a gradient coil array comprising a plurality of independent coils distributed about an enclosure; and a controller configured to concurrently actuate said plurality of coils so as to generate a spatially-varying magnetic field within said enclosure such that for at least first and second volumetric slices, a magnetic field magnitude associated with at least one location in the first volumetric slice is substantially equal to a magnetic field magnitude associated with a respective location in the second volumetric slice.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: February 25, 2020
    Assignee: Bilkent University
    Inventors: Ergin Atalar, Niyazi Koray Ertan, Soheil Taraghinia
  • Patent number: 10566131
    Abstract: A transformer includes a transformer core, and a primary winding and a secondary winding each wound about the transformer core. The primary winding includes a wire wound in multiple primary winding layers, and each primary winding layer includes multiple primary turns arranged in a spiral. The secondary winding includes one or more substantially flat conductors defining multiple secondary winding layers. Each secondary winding layer includes one secondary turn, every two adjacent secondary turns have a single different one of the primary winding layers positioned between the two adjacent secondary turns to interleave the secondary winding and the primary winding, and each secondary turn has a different diameter than an adjacent one of the secondary turns.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: February 18, 2020
    Assignee: Astec International Limited
    Inventor: Kwong Kei Chin
  • Patent number: 10557898
    Abstract: A magnetoelastic tag includes a frame-suspended magnetoelastic resonator that combines a strong resonant response with a relatively small resonator, enabling magnetoelastic sensor use in a variety of inconspicuous applications and/or small packages. The resonator is suspended with respect to a substrate, which reduces, minimizes, or eliminates interaction between the substrate and resonator. Signal strength is thereby enhanced, thereby allowing miniaturization while maintaining a measurable response to the interrogation field. The resonator can have a hexagonal shape and/or be suspended at particular locations about its perimeter to promote signal generation in a direction different from that of the interrogation field. A sensor can include one or more frame-suspended resonators, which can be arranged in an array, stacked, or randomly where a plurality of resonators is employed.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: February 11, 2020
    Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
    Inventors: Yogesh Gianchandani, Jun Tang, Scott Green
  • Patent number: 10559413
    Abstract: A coil electronic component includes a first coil and a second coil disposed on and beneath a main board, respectively, wherein the first coil includes a first coil pattern and a second coil pattern connected to each other through a first via of a first insulating layer and disposed on and beneath the first insulating layer, respectively, and the second coil includes a third coil pattern and a fourth coil pattern connected to each other through a second via of a second insulating layer and disposed on and beneath the second insulating layer, respectively. In this case, the main board, the first insulating layer, and the second insulating layer include through-holes formed in central portions thereof, respectively.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: February 11, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Dong Hwan Lee, Young Ghyu Ahn
  • Patent number: 10553342
    Abstract: A deformable inductive device includes an elastomer material having at least one deformable electrode and a liquid magnetic core formed in the elastomer material and containing a magnetic liquid. Depending on the device's configuration, the deformable element may be embedded in, attached to, or in close proximity with the liquid magnetic core. In some embodiments, the deformable inductive device may be configured as an inductor, solenoid, or transformer and the deformable electrode is at least partially embedded in the liquid magnetic core, for instance. In another embodiment, the deformable inductive device may be configured as part of a wireless power transfer system which includes a coil and a magnetic backplane having the liquid magnetic core with the coil being attached to or in close proximity to the magnetic backplane.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: February 4, 2020
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Nathan S. Lazarus, Christopher D. Meyer
  • Patent number: 10529485
    Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: January 7, 2020
    Assignee: SUMIDA CORPORATION
    Inventors: Shinichi Sakamoto, Douglas James Malcolm
  • Patent number: 10490348
    Abstract: Disclosed is an apparatus including a plurality of vias each having a defined shape, wherein each of the plurality of vias includes a first two-dimensional conductive layer plated on a first side of a substrate, the first two-dimensional conductive layer having the defined shape, a second two-dimensional conductive layer plated on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and a via conductively coupling the first two-dimensional conductive layer to the second two-dimensional conductive layer. The apparatus further includes a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: November 26, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Mario Francisco Velez, Daeik Daniel Kim, Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim, Chengjie Zuo, Yunfei Ma, Robert Paul Mikulka
  • Patent number: 10490347
    Abstract: A method for producing a monolithic electromagnetic component includes preparing a precursor from a ferrite material during an initial step; preparing elements including at least one coil having coil turns; embedding the elements including at least one coil having the coil turns in the precursor embedded in a mold; co-sintering the elements including at least one coil having the coil turns and the precursor compressed by the mold under a predetermined pressure, the predetermined pressure being generated under a load, wherein a pulsed electric current is generated during the co-sintering; discharging the pulsed electric current through the mold such that a temperature in the mold rises; and obtaining the monolithic electromagnetic component in which the precursor is secured to the elements including at least one coil having the coil turns.
    Type: Grant
    Filed: August 21, 2014
    Date of Patent: November 26, 2019
    Assignee: Centre National de la Recherche Scientifique (C.N.R.S.)
    Inventors: Frédéric Mazaleyrat, Karim Zehani, Vincent Loyau, Eric Laboure
  • Patent number: 10460865
    Abstract: A vehicle is provided with a transmission having a chamber with fluid therein. The vehicle includes a core and a conductor that are mounted within the chamber. The core includes a pair of elements that are oriented toward each other along a longitudinal axis. Each element includes a base with a post and at least two projections extending longitudinally from the base. The conductor is disposed over the posts and is configured to receive the fluid through an opening formed between adjacent projections.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: October 29, 2019
    Assignee: Ford Global Technologies, LLC
    Inventors: Shahram Zarei, Behzad Vafakhah, Jeremy Richard Ikerd, Vincent Skalski
  • Patent number: 10454235
    Abstract: A metal terminal where a connecting portion has a receiving portion which receives a wire and a contact segment which extends from the receiving portion by way of a bending scheduled portion is prepared. By applying heat and pressure in a state where the wire is placed on the receiving portion for temporarily fixing the wire, the wire is adhered to the receiving portion using a molten or softened insulating resin coating as an adhesive agent. Next, the connecting portion is bent by way of the bending scheduled portion such that the contact segment faces the receiving portion by way of the wire and the contact segment is brought into contact with the wire. Next, by irradiating a laser beam to a portion of the metal terminal, the wire and the metal terminal are welded to each other.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: October 22, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takashi Murakami, Akio Igarashi, Koji Onishi
  • Patent number: 10410782
    Abstract: A coil component is provided with only first and second columnar conductors that are a part of a coil electrode. This can simplify the manufacturing process and reduce the cost of the coil component. A wiring substrate is provided with substrate-side wiring electrode traces that form the remaining part of the coil electrode. In the process of forming the wiring substrate using a substrate forming technique commonly used, the substrate-side wiring electrode traces can be easily formed together with other wiring electrodes. Therefore, when the coil electrode is configured to be formed by placing the coil component on the wiring substrate, a coil module including the coil component can be inexpensively manufactured.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: September 10, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Norio Sakai, Mitsuyoshi Nishide, Shinichiro Banba
  • Patent number: 10404178
    Abstract: An insulation type step-up converter includes a core, first and second primary-side coils, a secondary-side coil, and a switching element. The core includes a middle leg, and first and second outer legs. The switching element is configured such that it can be controlled to be on/off so that electric currents flowing simultaneously in the first and second primary-side coils are opposite in direction to each other.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: September 3, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Nakajima, Takashi Kumagai, Yuji Shirakata, Yujiro Kido
  • Patent number: 10388454
    Abstract: A microfabricated laminated conductor, comprising at least two flat metallic conductors held together parallel by their edges by a first dielectric material anchor, such that there exists a gap of between several nanometers and several micrometers between most of the at least two flat metallic conductors.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: August 20, 2019
    Assignee: HRL Laboratories, LLC
    Inventors: Florian G. Herrault, Melanie S. Yajima
  • Patent number: 10381153
    Abstract: Disclosed herein is a spacer fixing structure including a core member constituting a core to be wound with a coil; and a plate spacer fixed to the core member. The spacer has a loop shape. A communication groove is formed in at least one surface of front and back surfaces of the spacer, and extends radially to communicate with inner and outer peripheries of the spacer. A region of the at least one surface of the spacer other than a grooved portion is left as a flat surface. At least the flat surface of the spacer is adhered to the core member via an adhesive layer made of an adhesive.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: August 13, 2019
    Assignee: TABUCHI ELECTRIC CO., LTD.
    Inventor: Keisuke Honda
  • Patent number: 10361591
    Abstract: Techniques for wireless power charging of chargeable devices such as electric vehicles are provided. An example of a wireless power transmitting apparatus according to the disclosure includes a first coil structure, at least one second coil structure disposed adjacent to the first coil structure, and a transmitter operably and electrically connected to the first coil structure, such that the transmitter is configured to provide an electrical signal to the first coil structure and such that the at least one second coil structure is a parasitic coil structure and such that at least one of the first and the at least one second coil structure is a double-D coil structure.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: July 23, 2019
    Assignee: WiTricity Corporation
    Inventors: Hans Peter Widmer, Markus Bittner
  • Patent number: 10319519
    Abstract: The invention proposes a method of producing induction components each containing a coil, wherein the coils are wound on a wire-winding plate, containing a multiplicity of wire-winding stubs arranged in rows and columns, using a wire which is continuous for a plurality of coils. The template provided with the coils is then pressed in a molding press with ferromagnetic substrate powder, which embeds the coils. Once the template has been removed, the interiors of the coils are provided with substrate powder, and pressed, once again in a molding press. Electrical contact is then made with the connections and the block is divided up into individual induction components each containing a coil.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: June 11, 2019
    Assignee: Würth Elektronik eiSos GmbH & Co. KG
    Inventors: Markus Stark, Klaus Richter, Dorian Degen
  • Patent number: 10312007
    Abstract: A method and device includes a first conductor formed on a first dielectric layer as a partial turn of a coil. A second conductor is formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil. A vertical interconnect couples the first and second conductors to form a first full turn of the coil. The interconnect coupling can be enhanced by embedding some selective magnetic materials into the substrate.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: June 4, 2019
    Assignee: Intel Corporation
    Inventors: Mihir K Roy, Mathew J Manusharow, Harold Ryan Chase