Electromagnet, Transformer Or Inductor Patents (Class 29/602.1)
  • Patent number: 11404944
    Abstract: Disclosed is a method for manufacturing an MSO coil, comprising: a pressing step of forming a bent surface on a part of a unit coil layer, which has a ring shape such that both ends thereof face each other, thereby endowing both ends of the unit coil layer with a height difference; a fixing step of connecting and fixing a plurality of unit coil layers to each other, each unit coil layer having the bent surface formed thereon, such that the first end of both ends of a unit coil layer having the bent surface formed thereon contacts the second end of both ends of another unit coil layer having the bent surface formed thereon; and a bonding step of bonding connection parts defined by contact of the first and second ends of each of the plurality of unit coil layers that are connected and fixed to each other.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: August 2, 2022
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Eui Chun Lee, Soon O Kwon, Ho Young Lee, Su Woong Lee, Kang Won Lee
  • Patent number: 11398343
    Abstract: A coil component is disclosed. The coil component includes a body having one surface and the other surface opposing each other, and a plurality of wall surfaces connecting one surface and the other surface to each other; a coil part embedded in the body and having both ends exposed to both end surfaces of the plurality of wall surfaces of the body, opposing each other; an insulating layer covering one surface of the body; and first and second external electrodes disposed on both end surfaces of the body, respectively, to extend onto the insulating layer, and including a bonded conductive layer disposed on the insulating layer, and an external conductive layer disposed on the bonded conductive layer, respectively.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: July 26, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Byeong Cheol Moon, Joung Gul Ryu
  • Patent number: 11315731
    Abstract: A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer chip, the first end face being opposite to the second end face, external electrodes respectively provided on the first end face and the second end face, and a water repellent agent that is provided on at least one face of four faces of a rectangular parallelepiped shape of the multilayer chip other than the first and second end faces, is spaced from the first and second external electrodes, and extends in a direction intersecting with a direction in which the external electrodes face with each other.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: April 26, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Kiyoshiro Yatagawa, Satoshi Kobayashi
  • Patent number: 11251113
    Abstract: Methods/structures of forming embedded inductor structures are described. Embodiments include forming a first interconnect structure on a dielectric material of a substrate, selectively forming a magnetic material on a surface of the first interconnect structure, forming an opening in the magnetic material, and forming a second interconnect structure in the opening. Build up layers are then formed on the magnetic material.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: February 15, 2022
    Assignee: Intel Corporation
    Inventors: Sai Vadlamani, Prithwish Chatterjee, Robert A. May, Rahul S. Jain, Lauren A. Link, Andrew J. Brown, Kyu Oh Lee, Sheng C. Li
  • Patent number: 11244786
    Abstract: This disclosure relates generally to substrates having three dimensional (3D) inductors and methods of manufacturing the same. In one embodiment, the 3D inductor is a solenoid inductor where the exterior edge contour of the winding ends is substantially the same and substantially aligned with the exterior edge contour of the exterior edge contour of conductive vias that connect the windings. In this manner, there is no overhang between the windings and the conductive vias. In another embodiment of the 3D inductor, via columns connect connector plates. The via column attachment surfaces of each of the conductive vias in each of the columns is the same and substantially aligned. In this manner, carrier pads are not needed and there is no overhand between the conductive vias.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: February 8, 2022
    Assignee: Qorvo US, Inc.
    Inventors: Dirk Robert Walter Leipold, George Maxim, John August Orlowski, Baker Scott
  • Patent number: 11237234
    Abstract: A magnet (7) for use in an apparatus (1) for performing magnetic resonance imaging (MRI) of a patient's head is an asymmetric magnet (7) comprising a plurality of coils (45, 46, 47) that are aligned along a cylindrical axis (29) to provide a magnetic field on the cylindrical axis (29). The magnet (7) has a patient end (23) arranged to be positioned adjacent or against a patient's shoulders with the patient's shoulders outside the magnet (7). The magnet has a recess (27) for receipt of the patient's head and extending into the magnet (7) from the patient end (23). The magnet (7) is configured to provide an imaging volume (35) that is positioned along the cylindrical axis (29) of the magnet (7) in the recess (27), and at least a major part of the imaging volume (35) has a substantially linear non-zero magnetic field gradient along the cylindrical axis (29).
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: February 1, 2022
    Assignee: VICTORIA LINK LIMITED
    Inventor: Benjamin John Parkinson
  • Patent number: 11205538
    Abstract: An inductor includes: a body including a support member including a through-hole and a via hole, an insulator disposed on the support member and including a first opening exposing portions of the support member, and a coil pattern disposed in the first opening, and including a plurality of layers including a seed layer in contact with the support member; and an external electrode disposed on an external surface of the body and electrically connected to the coil pattern. The support member may have a multilayer structure of at least first and second insulating layers, and the via hole may penetrate through both of the first and second insulating layers.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: December 21, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Min Moon, Cheol Soon Kim, Yu Jong Kim, Dong Min Kim, Young Do Choi, Tae Ryung Hu
  • Patent number: 11187735
    Abstract: An assembly with a secondary coil arranged on a coil carrier for a field device is described, wherein the field device comprises an electronics and an inductive interface connected to the electronics, and wherein the assembly can be used in the field device such that the field device can be connected via its interface to an inductive interface of a superordinate unit such that the secondary coil of the assembly, with a primary coil of the inductive interface of the superordinate unit, form a transformer for transmitting data and/or energy, which makes it possible to reduce the dimensions of field devices equipped with it and also contributes to increased operational safety, in that an assembly circuit formed by the secondary coil and at least one electronic component connected to the secondary coil via lines connected to it and arranged on the coil carrier is arranged on the coil carrier.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: November 30, 2021
    Assignee: Endress+Hauser Conducta GmbH+Co. KG
    Inventors: Torsten Pechstein, Stefan Paul, Jörg Uhle, Sven-Matthias Scheibe, Thomas Nagel, Christian Fanselow, Alexander Serfling
  • Patent number: 11189409
    Abstract: An inductor may be fabricated comprising a magnetic material layer and an electrically conductive via or trace extending through the magnetic material layer, wherein the magnetic material layer comprises dielectric magnetic filler particles within a carrier material. Further embodiments may include incorporating the inductor of the present description into an electronic substrate and may further include an integrated circuit device attached to the electronic substrate and the electronic substrate may further be attached to a board, such as a motherboard.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: November 30, 2021
    Assignee: Intel Corporation
    Inventors: Andrew J. Brown, Prithwish Chatterjee, Lauren A. Link, Sai Vadlamani
  • Patent number: 11189413
    Abstract: First internal conductors are separated from each other in a first direction. Each of the first internal conductors includes a coil portion and a pad portion having a width larger than a width of the coil portion. The pad portions adjacent to each other in the first direction are connected to each other via a through-hole conductor and overlap each other when viewed from the first direction. When viewed from the first direction, each of the coil portions includes a first portion not overlapping the pad portion adjacent in the first direction and a second portion overlapping a part of the pad portion adjacent in the first direction. A second internal conductor is disposed on the same layer as the second portion and is positioned to overlap a portion of the pad portion adjacent in the first direction not overlapping the second portion when viewed from the first direction.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: November 30, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuya Oshima, Shinichi Kondo, Junichi Otsuka, Yohei Tadaki, Kazuo Iwai, Masayuki Suzuki, Shigeshi Osawa, Kazuhiro Ebina, Makoto Yoshino, Mamoru Kawauchi
  • Patent number: 11164693
    Abstract: In an exemplary embodiment, a coil component includes: a drum core 10 having a winding shaft 12 and a pair of flange parts 14a, 14b; and a coil 30 constituted by a conductive wire 34 with insulating sheath 38 being wound around the winding shaft 12, forming one or more layers 32 in a direction which crosses an axial direction of the winding shaft 12; wherein the conductive wire 34 is exposed to and faces, at each of the one or more layers 32, a void 64 formed between the flange part 14a and the flange part 14b, wherein the void 64 is present at each of the one or more layers 32 in succession from one end to the other end of the conductive wire 34 as viewed in the axial direction of the winding shaft 12.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: November 2, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Satoshi Ito, Shintaro Takahashi
  • Patent number: 11158448
    Abstract: An inductor is formed in an IC device packaging structure. The structure includes an encapsulating material, with a ferromagnetic core in the encapsulation material. A plurality of metal layers are provided in the encapsulation material forming an inductor coil extending around the ferromagnetic core so as to form an inductor.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: October 26, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Alan Roth, Eric Soenen, Ying-Chih Hsu, Nick Samra, Stefan Rusu
  • Patent number: 11114235
    Abstract: A magnetic coupling coil component includes: a main body including a first region, a second region disposed on a top side of the first region, and a third region disposed on a bottom side of the first region; a top-side coil conductor provided in the second region of the main body and wound around a coil axis extending in a top-bottom direction; and a bottom-side coil conductor provided in the third region of the main body and wound around the coil axis. The top-side coil conductor includes a plurality of top-side conductive patterns, and the plurality of top-side conductive patterns include a first top-side conductive pattern which is positioned closest to the first region among the plurality of top-side conductive patterns, and a number of turns of the first top-side conductive pattern is larger than an average of numbers of turns of the plurality of top-side conductive patterns.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: September 7, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Arai, Masanori Nagano, Akihisa Matsuda, Daisuke Yamaguchi, Naoya Terauchi
  • Patent number: 11092259
    Abstract: The invention relates to a method for producing an electromagnetic valve assembly (10), a planar metal sheet (12), which has through-slots (16) extending parallel to a longitudinal axis (14) of the sheet, and a disc (18), which has disc projections (22) that are complementary in shape to the through-slots (16), being provided, the disc projections (22) being engaged with the through-slots (16), and a coil housing (38) then being formed by the planar metal sheet (12) being shaped by non-overlapping roller-deforming along the longitudinal axis (14) of the sheet, around a circumference (20) of the disc (18). The invention further relates to an electromagnetic valve assembly (10) which has been produced in particular by means of such a method.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: August 17, 2021
    Assignee: Vitesco Technologies GmbH
    Inventors: Henry Meissgeier, Andreas Muehlbauer
  • Patent number: 11094535
    Abstract: Methods for selective deposition, and structures thereof, are provided. Material is selectively deposited on a first surface of a substrate relative to a second surface of a different material composition. A passivation layer is selectively formed from vapor phase reactants on the first surface while leaving the second surface without the passivation layer. A layer of interest is selectively deposited from vapor phase reactants on the second surface relative to the passivation layer. The first surface can be metallic while the second surface is dielectric, or the second surface is dielectric while the second surface is metallic. Accordingly, material, such as a dielectric, can be selectively deposited on either metallic or dielectric surfaces relative to the other type of surface using techniques described herein. Techniques and resultant structures are also disclosed for control of positioning and shape of layer edges relative to boundaries between underlying disparate materials.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: August 17, 2021
    Assignee: ASM IP HOLDING B.V.
    Inventors: Eva E. Tois, Suvi P. Haukka, Raija H. Matero, Elina Färm, Delphine Longrie, Hidemi Suemori, Jan Willem Maes, Marko Tuominen, Shaoren Deng, Ivo Johannes Raaijmakers, Andrea Illiberi
  • Patent number: 11056268
    Abstract: A coil component includes a plurality of conductor layers constituted of a first conductor layer to a fourth conductor layer that includes a function layer and a coil layer wound around an axis center; and a covering portion that is formed of an insulative resin, integrally covers the plurality of conductor layers, and is interposed between conductor layers adjacent to each other. The coil layer and the function layer of the plurality of conductor layers have substantially the same shape in a plan view. The fourth conductor layer has a connection conductor layer connecting the coil layer and the function layer to each other. A conductor layer having no connection conductor layer among the plurality of conductor layers has a protrusion portion corresponding to the connection conductor layer at a position overlapping the connection conductor layer in a plan view.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: July 6, 2021
    Assignee: TDK CORPORATION
    Inventors: Masanori Suzuki, Kouji Kawamura, Naoaki Fujii, Manabu Yamatani, Tomonaga Nishikawa
  • Patent number: 11018086
    Abstract: A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the polymer, wherein the TAVs are coupled in series. A Redistribution Line (RDL) is underlying the polymer. The RDL electrically couples a first one of the TAVs to a second one of the TAVs.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: May 25, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hua Chen, Chen-Shien Chen
  • Patent number: 11004593
    Abstract: A coil conductive wire has a coil part wound around a pillar part, and flat-shaped connection end parts provided at respective ends of the coil part. Terminal electrodes are electrically connected to the connection end parts, each of which terminal electrodes has an electrode layer and a conductive layer covering the electrode layer. Each connection end part has a first principle face connected to a surface of the electrode layer, a second principle face projecting from a surface of the conductive layer, and a side face. The conductive layer has a flat area, and a skirt area provided between the flat area and the side face and sloping onto the side face. The thickness of the flat area is smaller than that of each connection end part, while the thickness of the skirt area decreases in the direction away from the side face.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: May 11, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Hirotaka Wakabayashi
  • Patent number: 10996297
    Abstract: A cage with a fastening system (1) in a magnetic resonance device (MRD) is disclosed, said cage in an MRD comprising (a) M pole pieces (45) (M?2); (b) N side magnets (20) (N?2), said side magnets substantially enclosing said pole pieces and thereby defining a magnetic envelope and enclosed volume therein; (c) N side walls (10), said side walls substantially enclosing said side magnets; (d) P face walls (30) (P?2); and (e) a plurality of fastening rods (100); wherein each of said fastening rods physically interconnects at least one pair of side walls, passing through at least one of said side magnets and at least one of said pole pieces.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: May 4, 2021
    Assignee: ASPECT IMAGING LTD.
    Inventor: Uri Rapoport
  • Patent number: 10984141
    Abstract: A self-powering tamper detection system architecture includes a power source, a tamper detector configured to identify a tamper event, a tamper switch electrically connected to the power source and mechanically connected to the tamper detector, a tamper controller configured to produce a tamper response when the tamper event is identified, and program memory configured to store program data. The tamper detector is configured to mechanically actuate the tamper switch when a tamper event occurs, and the tamper response provides a disruption of the program data. The tamper detector and the tamper switch can include printed circuit board and embedded transformer, whereby the embedded transformer includes an axially-moveable ferromagnetic core.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: April 20, 2021
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Kirk A. Lillestolen, William E. Villano, David J. Manna
  • Patent number: 10986732
    Abstract: A laminated circuit board includes a base having a first surface, and a second surface on an opposite side from the first surface, a first metal layer provided in the base and including a first electrode exposed from the first surface, and a second metal layer provided in the base and including a second electrode exposed from the second surface. The first metal layer includes an inductor electrically connected to the first electrode, and the first electrode and the second electrode are bonded and electrically connected to each other.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: April 20, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takayuki Matsumoto, Tsukasa Nakanishi
  • Patent number: 10930588
    Abstract: An inductor or transformer with the inductor can include one or more windings split into strands along a radial path of the winding and provide for a more uniform current distribution across a width of the winding. The winding(s) can comprise twisting components as twistings or strand crossings located at various locations along the winding. The twisting components span the winding along a winding width with a connector or crossing strand and change a position of one strand to another at points that different strands of the winding are cut or spliced.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: February 23, 2021
    Assignee: Intel Corporation
    Inventor: Alfred Erik Raidl
  • Patent number: 10916374
    Abstract: A manufacturing method of a coil component for forming a coil-assembly body in which a coil is mounted on a magnetic-body core, comprising the steps of: inputting the coil-assembly body and an admixture containing a magnetic powder and a resin into a container; applying pressure onto the admixture which is inputted into the container; depressurizing an air pressure of an environment, in which the admixture is placed, to become a negative-pressure lower than the atmospheric pressure at least during the pressurizing process in the step of applying pressure; applying vibration onto the admixture and filling the admixture in the container at least during the depressurizing process in the step of depressurizing; and curing the resin contained in the admixture for the integrated object of the admixture and the coil-assembly body which passed through the step of depressurizing and the step of applying vibration.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: February 9, 2021
    Inventor: Teruaki Tanaka
  • Patent number: 10912223
    Abstract: The method for producing the electric module comprises: securing at least one first electrical component (108, 110) to a first plate (102); then assembling each first electrical component (108, 110) to an electrical connection bar (104) to which at least one second component (120) is already secured.
    Type: Grant
    Filed: October 9, 2014
    Date of Patent: February 2, 2021
    Assignee: Valeo Siemens eAutomotive France SAS
    Inventors: Valery Govindassamy, Christian Schwartz, Roger Deniot
  • Patent number: 10902988
    Abstract: A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 ?m or more.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: January 26, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Jung Hyuk Jung, Woo Jin Lee, Han Wool Ryu
  • Patent number: 10868243
    Abstract: Co-fired integrated circuit devices and methods for fabricating and integrating such on a workpiece are disclosed herein. An exemplary method includes forming a first passive device and a second passive device over a carrier substrate. The first passive device and the second passive device each include at least one material layer that includes a co-fired ceramic material. The carrier substrate is removed after performing a co-firing process to cause chemical changes in the co-fired ceramic material. The first passive device may include a conductive loop disposed between a first magnetic layer and a second magnetic layer. The first magnetic layer, the second magnetic layer, or both includes a co-fired ceramic magnetic material. The second passive device may include a first conductive layer and a second conductive layer separated by a dielectric layer. The first conductive layer, the second conductive layer, or both includes a co-fired ceramic conductive material.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: December 15, 2020
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., APPLE
    Inventors: Alexander Kalnitsky, Shawn Searles, David Cappabianca
  • Patent number: 10867746
    Abstract: An inductor structure includes a first curve metal component, a second curve metal component, and a connection component. The first curve metal component is disposed on a layer. The layer is located at a first plane, the first curve metal component is located at a second plane, and the first plane is perpendicular to the second plane. The second curve metal component is disposed on the layer. The second curve metal component is located at the second plane. The connection component is coupled to the first curve metal component and the second curve metal component.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: December 15, 2020
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Chih-Yu Tsai, Kai-Yi Huang
  • Patent number: 10861635
    Abstract: An electronic component having a multilayer body that includes a plurality of insulating layers that are stacked on top of one another; a plurality of first coils that are arranged inside the multilayer body in a stacking direction of the multilayer body and are electrically connected to each other; a plurality of second coils that are arranged inside the multilayer body in the stacking direction of the multilayer body and are electrically connected to each other; an inner ground electrode that is provided inside the multilayer body and is arranged between two of the first coils, which face each other in the stacking direction; and a ground terminal that is connected to the inner ground electrode.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: December 8, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Minoru Matsunaga
  • Patent number: 10832857
    Abstract: A coil component includes: a body; and external electrodes disposed on an external surface of the body. The coil part may include a first coil layer and a second coil layer connected to the first coil layer, each of the first and second coil layers may include a plurality of coil patterns, the plurality of coil patterns of the first coil layer may include a first connection coil pattern physically connected to the second coil layer, the plurality of coil patterns of the second coil layer may include a second connection coil pattern physically connected to the first connection coil pattern, and an upper surface of the first connection coil pattern may come into direct contact with a lower surface of the second connection coil pattern.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: November 10, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Seob Lee, Sang Seob Kim, Young Sun Kim
  • Patent number: 10818429
    Abstract: An inductor device includes at least two wires and at least two switches. Each of the at least two wires includes an opening, and the openings are disposed correspondingly to each other. One of the at least two switches is coupled to two terminals of the opening of one of the at least two wires. Another one of the at least two switches is coupled to one terminal of the opening of the one of the at least two wires and one terminal of the opening of another one of the at least two wires in an interlaced manner. If the one of the at least two switches is turned on, one of the at least two wires forms an inductor; if another one of the at least two switches is turned on, both of the at least two wires form the inductor.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: October 27, 2020
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Chih-Hua Liu
  • Patent number: 10811598
    Abstract: A sensor package includes a semiconductor die including at least one current sensor. The semiconductor die includes a first pass through hole extending from one side of the semiconductor die to an opposite side of the semiconductor die. The semiconductor package further includes a second pass through hole extending from one side of the sensor package to an opposite side of the sensor package. The second pass through hole is aligned with the first pass through hole and is configured to receive a current-carrying conductor. The at least one current sensor senses current flow in the current-carrying conductor received in the second pass through hole. An end of the current-carrying conductor is coupled to a terminal on a circuit board in the sensor package.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: October 20, 2020
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Jefferson W. Hall, Michael J. Seddon, Yenting Wen
  • Patent number: 10804034
    Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a plating layer disposed on the electrode layer, and a secondary phase material disposed at a boundary between the plating layer and the electrode layer. The secondary phase material contains sulfur (S).
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: October 13, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Joon Hwan Kwag, Jong Ho Lee, Myung Jun Park
  • Patent number: 10801121
    Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: October 13, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Yeon Cha, Dong Hwan Lee, Jung Hyuk Jung, Chan Yoon, Hye Min Bang, Tae Young Kim
  • Patent number: 10777352
    Abstract: A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying a pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened, wherein a viscosity of the mixture is 1,000 to 1,000,000 mPa·s at room temperature.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: September 15, 2020
    Assignee: SUMIDA CORPORATION
    Inventors: Shinichi Sakamoto, Douglas James Malcolm
  • Patent number: 10770225
    Abstract: A method of producing electrical coils includes preparing a plurality of coil layers. Each coil layer is prepared by printing an electrically conductive coil pattern on a layer substrate. Each coil pattern includes an inner end at a first via through the substrate at a point radially inside the coil pattern, and an outer end at a second via through the substrate at a point radially outside the coil pattern. The method also includes joining the coil layers into a stack and electrically connecting successive coil patterns of the plurality of coil layers to one another through the vias to form a conductive coil extending through the stack.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: September 8, 2020
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Sameh Dardona, Paul Sheedy
  • Patent number: 10768257
    Abstract: In a method, control computer and magnetic resonance (MR) apparatus for generating MR recordings of an examination object, first magnetic MR data are acquired in a first recording region inside a homogeneity volume of the scanner of the MR apparatus, and second MR raw data are acquired in a second recording region outside the homogeneity volume. First image data are reconstructed on the basis of the first MR raw data and second image data are reconstructed on the basis of the second MR raw data. The first image data and the second image data are combined to form combination image data, which cover a region that extends in the first recording region and in the second recording region.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: September 8, 2020
    Assignee: Siemens Healthcare GmbH
    Inventor: Stefan Popescu
  • Patent number: 10741315
    Abstract: A magnetic body constituted by magnetic grains bonded together via oxide film, which magnetic grains contain a Fe—Si-M soft magnetic alloy (where M is a metal element more easily oxidized than Fe) that contains sulfur atoms (S). The magnetic body preferably contains 0.004 to 0.012 percent by weight of S, 1.5 to 7.5 percent by weight of Si, and 2 to 8 percent by weight of metal M.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: August 11, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Atsushi Tanada, Kiyoshi Tanaka
  • Patent number: 10694622
    Abstract: A printed wiring board comprises a sheet-shaped core base material containing a magnetic material, a coil disposed inside the core base material, and an external circuit layer disposed on at least one of first and second surfaces of the core base material opposite to each other.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: June 23, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akinori Hamada, Yoshimasa Yoshioka, Yoshinori Taguchi, Ryuichiro Tominaga
  • Patent number: 10665379
    Abstract: An embedded magnetic component device includes a magnetic core located in a cavity extending into an insulating substrate. The cavity and magnetic core are coved with a cover layer. Through holes extend through the cover layer and the insulating substrate, and are plated to define conductive vias. Metallic traces are provided at exterior surfaces of the cover layer and the insulating substrate to define upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a first isolation barrier is provided on the cover layer, and at least a third insulating layer is provided on the substrate. The second and third insulating layers provide additional insulation for the device, and define and function as a circuit board for surface mounted power electronics.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: May 26, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Scott Andrew Parish, Lee Francis
  • Patent number: 10658103
    Abstract: A coil component has a magnetic body of rectangular solid shape, a coil with N turns (N is a positive number of 2 or greater) provided inside the magnetic body, an insulating intermediate part, and external electrodes. The coil has a first conductor layer, a second conductor layer, and an inter-layer connection part. The first conductor layer has a first multiple winding part which is wound around one axis with a first spacing. The second conductor layer has a second multiple winding part which is wound around the one axis with the first spacing and faces the first conductor layer. The insulating intermediate part is provided inside the magnetic body and forms, between the first conductor layer and second conductor layer, a second spacing corresponding to a thickness equal to or less than the product of the first spacing and (N?1).
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: May 19, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Hirotaro Seino, Shinsuke Takeoka, Hitoshi Matsuura, Kenji Otake
  • Patent number: 10658102
    Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is greater than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: May 19, 2020
    Assignee: CYNTEC CO., LTD.
    Inventors: Wen-Hsiung Liao, Roger Hsieh, Hideo Ikuta, Yueh-Lang Chen
  • Patent number: 10643959
    Abstract: An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: May 5, 2020
    Assignee: Intersil Americas LLC
    Inventors: Zaki Moussaoui, Nikhil Vishwanath Kelkar
  • Patent number: 10636556
    Abstract: Disclosed are a bus bar unit capable of being easily manufactured while preventing a bus bar from being separated from a magnetic core and also capable of being reduced in size, and a manufacturing method thereof. The bus bar unit includes a magnetic core having a through-hole and covered with an insulating material, U-phase, V-phase and W-phase bus bars of which main body portions are arranged in parallel with each other in a predetermined direction within the through-hole and one side connecting portions provided on one side in an axial direction of the through-hole from the main body portions are bent in a direction crossing the axial direction, and a base member formed of an insulating material and to which the magnetic core is fixed, wherein the one side connecting portions of the bus bars are held while being disposed between the base member and the magnetic core.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: April 28, 2020
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yuya Ishihara, Tomohiro Fukazu
  • Patent number: 10622144
    Abstract: A method for producing a pair of electrically conductive members assembled into an electrical component assembly provided with a coil. The method includes: forming connection terminal sections provided in the pair of electrically conductive members by arranging them alternately opposite to each other and then performing press punching; and after the press punching, bending the connection terminal sections in the pair of electrically conductive members toward a side departing from the coil into a protruding form.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: April 14, 2020
    Assignee: NISSIN KOGYO CO., LTD.
    Inventors: Takuro Kodama, Keiichi Tatsuno
  • Patent number: 10598353
    Abstract: Described is an arrangement and system for precise angular and directional positioning of light-emitting diodes (LED). An LED component includes a base body with a light-emitting region, a first connector, and a second connector, where the connectors are electrically conductively connected to the light-emitting region. The base body includes at least two fixing regions and the connectors each include a bending portion and a contact area for surface mounting. Each of the bending portions is arranged between the base body and the contact area. A supporting frame includes a plinth region to align the supporting frame on a surface and includes an outwardly open recess, a support region to receive a component in the supporting frame and at least two fixing elements to fix the component above the support region. A base area of the plinth region and a base area of the support region enclose an acute angle.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: March 24, 2020
    Assignee: Jabil Optics Germany GmbH
    Inventors: Sepehr Baghschomali, Samir Catic
  • Patent number: 10586648
    Abstract: A coil component includes a body portion including a magnetic material, and a coil portion disposed in the body part. The coil portion includes a first coil pattern layer having a planar spiral pattern, an insulating layer formed of an insulating resin embedding at least a portion of the first coil pattern layer, and a second coil pattern layer disposed on the insulating layer and having a planar spiral pattern. The insulating layer includes a core material disposed between the first and second coil pattern layers, and a thickness of a lower region of the insulating layer disposed below the core material is greater than a thickness of an upper region of the insulating layer disposed above the core material.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: March 10, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jae Lee, Youn Soo Seo, Jae Ha Kim, Hye Yeon Cha
  • Patent number: 10581388
    Abstract: Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures, and a power amplifier and switch can be integrated onto a single complementary metal oxide semiconductor die.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: March 3, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yalin Jin, Setu Mohta
  • Patent number: 10571537
    Abstract: A system for multi-slice magnetic resonance imaging (MRI) comprises a gradient coil array comprising a plurality of independent coils distributed about an enclosure; and a controller configured to concurrently actuate said plurality of coils so as to generate a spatially-varying magnetic field within said enclosure such that for at least first and second volumetric slices, a magnetic field magnitude associated with at least one location in the first volumetric slice is substantially equal to a magnetic field magnitude associated with a respective location in the second volumetric slice.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: February 25, 2020
    Assignee: Bilkent University
    Inventors: Ergin Atalar, Niyazi Koray Ertan, Soheil Taraghinia
  • Patent number: 10573803
    Abstract: A semiconductor package includes a semiconductor die. A through hole in the semiconductor package and semiconductor die extends from one side of the semiconductor package and die to an opposite side of the semiconductor package and die. The through hole is configured to receive a current-carrying conductor there through. At least one current sensor is formed in, or on, the semiconductor die and configured to sense current flow in the current-carrying conductor received in the through hole.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: February 25, 2020
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Jefferson W. Hall, Michael J. Seddon, Yenting Wen
  • Patent number: 10566131
    Abstract: A transformer includes a transformer core, and a primary winding and a secondary winding each wound about the transformer core. The primary winding includes a wire wound in multiple primary winding layers, and each primary winding layer includes multiple primary turns arranged in a spiral. The secondary winding includes one or more substantially flat conductors defining multiple secondary winding layers. Each secondary winding layer includes one secondary turn, every two adjacent secondary turns have a single different one of the primary winding layers positioned between the two adjacent secondary turns to interleave the secondary winding and the primary winding, and each secondary turn has a different diameter than an adjacent one of the secondary turns.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: February 18, 2020
    Assignee: Astec International Limited
    Inventor: Kwong Kei Chin