Acoustic Transducer Patents (Class 29/609.1)
  • Patent number: 10694296
    Abstract: A shallow speaker and a method of manufacture for the shallow speaker. The method of assembly uses two different alignment jigs at two different stages of the assembly to ensure alignment of the speaker components. During manufacture, a subassembly of components is created in the speaker frame, and then removed along with the first alignment jig. A second alignment jig is then placed in the speaker, and the bobbin and voice coil added. The subassembly is then connected to the frame, and the voice coil connected to the external connection terminal. Finally, the cone and dust cap are installed.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: June 23, 2020
    Assignee: Sound Sources Technology Inc.
    Inventors: Yoichiro Sumitani, Ching-Huang Cheng, Chih-Huang Hsiao
  • Patent number: 9038263
    Abstract: Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: May 26, 2015
    Assignee: Delaware Capital Formation, Inc.
    Inventors: Derek Wayne Puccio, Errol P. EerNisse
  • Patent number: 9040360
    Abstract: Methods for manufacturing multiple bottom port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from panels of substrates, sidewall spacers, and lids. Each MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port disposed in the substrate. The panels are joined together, and each individual substrate, sidewall spacer, and lid cooperate to form an acoustic chamber for its respective MEMS microphone die. The joined panels are then singulated to form individual MEMS microphones.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: May 26, 2015
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 9024432
    Abstract: A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a sidewall spacer and a lid, and the MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port in the substrate. The substrate, the sidewall spacer, and the lid are joined together to form the MEMS microphone, and the substrate, the sidewall spacer, and the lid cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: May 5, 2015
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 9023689
    Abstract: A top-port, surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a sidewall spacer and a lid with an acoustic port, and the MEMS microphone die is lid-mounted and acoustically coupled to the acoustic port. The substrate, the sidewall spacer, and the lid are joined together to form the MEMS microphone, and the substrate, the sidewall spacer, and the lid cooperate to form an acoustic chamber for the lid-mounted MEMS microphone die.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: May 5, 2015
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 9009947
    Abstract: A method of making a resonating beam accelerometer (RBA). In an example process, a proof mass device and resonators are created from a quartz material. A direct bond is formed between the proof mass and the resonators by applying a predefined amount of pressure at a predefined temperature for a predefined amount of time. One or more damping plates are created from a quartz material. A direct bond is formed between the damping plates and the proof mass device. The proof mass device is created by applying a predefined amount of pressure at pressure at temperature to two bases, two proof mass portions, and a flexure. The proof mass bases are on opposite sides of the flexure. The proof mass portions are on opposite sides of the flexure. A gap is present between the proof mass bases and the proof mass portions.
    Type: Grant
    Filed: April 19, 2012
    Date of Patent: April 21, 2015
    Assignee: Honeywell International Inc.
    Inventor: John S. Starzynski
  • Patent number: 9003637
    Abstract: A method of manufacturing a microphone assembly having an ear set function includes assembling a mike cell unit; obtaining a region for connection with the mike cell unit on a PCB, mounting only a conductive member in the region, and mounting other remaining components outside the region; adhering the mike cell unit to a corresponding region of the PCB; and sealing an adhering portion between the mike cell unit and the PCB. Assembling the mike cell unit includes inserting a mike cell case having a sound hole and a curing portion into a diaphragm assembly; stacking a spacer on the diaphragm assembly; inserting a back electrode plate into an insulating ring base; mounting the insulating ring base on the spacer; mounting a metal ring base on the insulating ring base; and curing or clamping a curing portion of the mike cell case.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: April 14, 2015
    Assignee: BSE Co., Ltd.
    Inventors: Dong Sun Lee, Hyoung Joo Kim
  • Patent number: 9006880
    Abstract: The present invention relates to a surface mount package for a micro-electro-mechanical system (MEMS) microphone die and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components that simplifies manufacturing and lowers costs. The surface mount package features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the MEMS microphone die is mechanically attached, providing an interior surface for making electrical connections between the MEMS microphone die and the package, and providing an exterior surface for surface mounting the microphone package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The microphone package has a substrate with metal pads on its top and bottom surfaces, a sidewall spacer, and a lid.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: April 14, 2015
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 8991022
    Abstract: A method for manufacturing piezoelectric resonator devices according to the present invention includes the following steps: a wafer forming step of preparing a thick-walled wafer 30 integrally formed with multiple lower lid members 3; a bonding step of bonding crystal resonator plates 2 to one main surface 31 of the wafer 30 via a bonding material 5 and bonding upper lid members 4 on the crystal resonator plates via a bonding material 5; a thinning step of thinning the wafer 30 from the other main surface 37 of the wafer; an external terminal forming step of forming external terminals on the other main surface of the thinned wafer; and a dividing step of cutting the wafer between each adjacent pair of crystal resonators so that multiple crystal resonators are obtained.
    Type: Grant
    Filed: January 7, 2010
    Date of Patent: March 31, 2015
    Assignee: Daishinku Corporation
    Inventors: Syunsuke Satoh, Naoki Kohda
  • Patent number: 8978237
    Abstract: A method to align an optical device optically with an interference device is disclosed. The method includes steps of: selecting one of arm waveguides, biasing rest of arm waveguides to cause optical absorption thereat, and aligning the optical device optically with the selected arm waveguide.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: March 17, 2015
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Tohru Watanabe
  • Patent number: 8973250
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming a wiring layer on a substrate comprising actuator electrodes and a contact electrode. The method further includes forming a MEMS beam above the wiring layer. The method further includes forming at least one spring attached to at least one end of the MEMS beam. The method further includes forming an array of mini-bumps between the wiring layer and the MEMS beam.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: March 10, 2015
    Assignee: International Business Machines Corporation
    Inventors: Christopher V. Jahnes, Anthony K. Stamper
  • Patent number: 8955212
    Abstract: A micro-electro-mechanical microphone and manufacturing method thereof are provided. The micro-electro-mechanical microphone includes a diaphragm, which is formed on a surface of one side of a semiconductor substrate, exposed to the outside surroundings, and can vibrate freely under the pressure generated by sound waves; an electrode plate with air holes, which is under the diaphragm; an isolation structure for fixing the diaphragm and the electrode plate; an air gap cavity between the diaphragm and the electrode plate, and a back cavity under the electrode plate and in the semiconductor substrate; and a second cavity formed on the surface of the same side of the semiconductor substrate and in an open manner The air gap cavity is connected with the back cavity through the air holes of the electrode plate The back cavity is connected with the second cavity through an air groove formed in the semiconductor substrate.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: February 17, 2015
    Assignee: Lexvu Opto Microelectronics Technology (Shanghai) Ltd
    Inventors: Jianhong Mao, Deming Tang
  • Patent number: 8914955
    Abstract: A method for manufacturing a piezoelectric element includes a process for forming a first conductive layer, a process for forming a piezoelectric layer having a region serving as an active region, a process for forming a second conductive layer, which overlaps with the region, a process for forming a third conductive layer, which overlaps with the region, on the second conductive layer, a process for forming an opening portion that divides the third conductive layer into a first portion and a second portion, a process for forming a resist layer that covers the opening portion and a peripheral portion at the side of the opening portion of the first portion and the second portion; a process for etching the third conductive layer to form a first conductive portion and a second conductive portion, and a process for etching the second conductive layer to form a third conductive portion.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: December 23, 2014
    Assignee: Seiko Epson Corporation
    Inventors: Eiju Hirai, Hiroshi Ito, Toshihiro Shimizu, Jiro Kato
  • Patent number: 8910370
    Abstract: A universal air bubble detector allows for use with a variety of sizes and types of tubing. The detector maintains proper alignment of a sensor emitter and receiver with different sizes of tubing. The detector may be mounted on existing equipment or may be used to monitor a tubing at any position along the tubing, and may operate in a stand alone mode or in combination with existing equipment.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: December 16, 2014
    Assignee: Zevex, Inc.
    Inventors: Timothy A. Riley, Mark D. Stringham, David H. Blaine, Frank A. Crandall, Philip N. Eggers
  • Patent number: 8898885
    Abstract: A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: December 2, 2014
    Assignee: NuCurrent, Inc.
    Inventors: Vinit Singh, Christine A. Frysz, Matthew Geary, Eitan Babcock, Justin Derbas
  • Patent number: 8887375
    Abstract: An earphone includes an earphone housing, a speaker positioned in the earphone, and an earphone cable connected to the speaker. The earphone housing has a first housing and a second housing. The first housing forms a first connecting surface, and the second housing forms a second connecting surface. The first connecting surface and the second connecting surface abut against each other and are ultrasonically fused together, in which excess plastic is formed and arranged along a fusing line. A method of manufacturing above-described earphone is also provided. The method also includes the forming of an excess plastic arranged along a fusing line formed between the first housing and the second housing made during ultrasonic fusion, the removing of excess plastic of the earphone phone by a cutter, and the grinding of the earphone housing by a grinding device.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: November 18, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yi Xiong, Zhi-Hua Lin, Hai-Bing Jiang
  • Patent number: 8881370
    Abstract: Inertial sensor having a body with first and second cavities on opposite sides thereof, a sensing element in the first cavity, electronic circuitry in the second cavity, electrical conductors interconnecting the sensing element and the circuitry, and leads connected electrically to the circuitry and extending from the body for mounting the sensor and making connections with the circuitry.
    Type: Grant
    Filed: September 23, 2010
    Date of Patent: November 11, 2014
    Assignee: Custom Sensors & Technologies, Inc.
    Inventors: William Paul Berger, Mark Andrew Collins, Michael Thomas Frazee, Thad W. (Marc) Smith, Robert Albert Anderson, Stuart John Knowles, Victor Dragotti
  • Patent number: 8857041
    Abstract: An electromechanical transducer includes a first electromagnetic element and a second electromagnetic element, such as electrodes, disposed opposite to each other with a sealed cavity therebetween. The sealed cavity is formed by removing a sacrifice layer and then performing sealing. A sealing portion is formed by superposing a film of a hardened second sealing material that has fluidity at normal temperature on a film of a first sealing material that does not have fluidity at normal temperature.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: October 14, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yuichi Masaki, Yoshihiro Hasegawa
  • Patent number: 8839502
    Abstract: A production method of an electronic component includes: forming a sheet having a resin layer and a metal layer formed under the resin layer; bonding the sheet to a substrate so that the metal layer is arranged on a functional portion of an acoustic wave element formed on the substrate, a frame portion surrounding the functional portion is formed between the metal layer and the substrate, a cavity is formed on the functional portion by the metal layer and the frame portion, and the resin layer covers the metal layer and the frame portion.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: September 23, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Tsuyoshi Yokoyama, Kazunori Inoue, Kazuhiro Matsumoto
  • Patent number: 8806727
    Abstract: A method of forming a piezoelectric actuator on a vibration plate to provide a driving force to each of a plurality of pressure chambers includes forming a lower electrode on the vibration plate, forming a piezoelectric layer on the lower electrode at a position corresponding to each of the pressure chambers, forming a supporting pad on the lower electrode, the supporting pad contacting one end of the piezoelectric layer and extending away from the one end of the piezoelectric layer, forming an upper electrode extending from a top surface of the piezoelectric layer to a top surface of the supporting pad, and bonding the upper electrode to a driving circuit above the supporting pad to receive a voltage from the driving circuit.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: August 19, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae-kyung Lee, Jae-woo Chung, Kyo-yeol Lee, Hwa-sun Lee, Seung-mo Lim, Jae-chang Lee
  • Patent number: 8806738
    Abstract: A method for manufacturing a quartz crystal unit, comprising the steps of forming a quartz crystal tuning fork shape having a quartz crystal tuning fork base, and first and second quartz crystal tuning fork tines, a quartz crystal tuning fork resonator having the quartz crystal tuning fork shape, forming at least one groove in at least one of opposite main surfaces of each of the first and second quartz crystal tuning fork tines, determining each of a length of the at least one groove and an overall length of the quartz crystal tuning fork resonator so that a series resistance R1 of a fundamental mode of vibration of the quartz crystal tuning fork resonator is less than a series resistance R2 of a second overtone mode of vibration thereof, housing the quartz crystal tuning fork resonator in a case, connecting a lid to the case, and disposing a metal or a glass in a through-hole of the case.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: August 19, 2014
    Assignee: Piedek Technical Laboratory
    Inventor: Hirofumi Kawashima
  • Patent number: 8769803
    Abstract: Provided is a method of manufacturing a loudspeaker including assembling a magnetic circuit and a frame. In the step of assembling the magnetic circuit and the frame, parallelism between a plate and a damper attachment portion of the frame is ensured by bringing an upper portion of the plate and the damper attachment portion of the frame into contact with a jig. In addition, perpendicularity between a magnetic gap and the damper attachment portion of the frame is ensured by bringing an outer circumferential side portion of the plate of the magnetic gap and an inner circumferential side portion of the yoke into contact with the jig. The magnetic circuit and the frame are assembled in such a state. With such a manufacturing method, it is possible to achieve a superior loudspeaker capable of reducing a gap defect while being downsized and having increased maximum input power.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: July 8, 2014
    Assignee: Panasonic Corporation
    Inventors: Toshiyuki Koike, Shinsaku Sawa, Tadashi Akiyama
  • Patent number: 8769802
    Abstract: A method for manufacturing a resonator is presented in the present application. The method includes providing a handle substrate, providing a host substrate, providing a quartz substrate comprising a first surface opposite a second surface, applying interposer film to the first surface of the quartz substrate, bonding the quartz substrate to the handle substrate wherein the interposer film is disposed between the quartz substrate and the handle substrate, thinning the second surface of the quartz substrate, removing a portion of the bonded quartz substrate to expose a portion of the interposer film, bonding the quartz substrate to the host substrate, and removing the handle substrate and the interposer film, thereby releasing the quartz substrate.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: July 8, 2014
    Assignee: HRL Laboratories, LLC
    Inventors: David T. Chang, Randall L. Kubena, Pamela R. Patterson
  • Patent number: 8763234
    Abstract: A method for making a thermoacoustic module is disclosed. An insulating substrate and a sound wave generator are provided. A conductive paste is screen printed on the insulating substrate to form a first patterned conductive paste layer. The sound wave generator is placed on the first patterned conductive paste layer and at least partially suspended above the insulating substrate by the patterned conductive paste layer.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: July 1, 2014
    Assignee: Beijing FUNATE Innovation Technology Co., Ltd.
    Inventors: Liang Liu, Li Qian
  • Patent number: 8765530
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: July 1, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 8756796
    Abstract: A method for producing an electric component including a dielectric layer on a substrate, includes the method steps of applying a metallic layer to the substrate and oxidizing the metallic layer to form a dielectric layer, wherein at least one partial region of the metallic layer is fully oxidized through the entire thickness of the layer.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: June 24, 2014
    Assignee: Epcos AG
    Inventors: Werner Ruile, Markus Hauser, Christoph Eggs, Hans-Peter Kirschner
  • Patent number: 8746398
    Abstract: An acoustic material can be electromagnetically tuned to produce alterations in its acoustical properties without physical contact. The acoustic material should contain a periodic structure and a medium that has acousto-elastical properties that can be altered through the application of electromagnetic radiation. Changes in volumetric properties such as density result in changes to the velocity at which sound passes through the material. The acoustic material can be a phononic crystal that undergoes a change in its acoustic bandgap after being subjected to electromagnetic radiation. This electromagnetic tuning ability results in the ability to change the acoustic properties of various phononic devices without physical contact.
    Type: Grant
    Filed: May 2, 2012
    Date of Patent: June 10, 2014
    Assignee: University of North Texas
    Inventors: Arup Neogi, Ezekiel Walker
  • Patent number: 8732938
    Abstract: An improved method of packaging a sensor is provided. The method includes the step of affixing a tuning fork to a platform. The tuning fork includes tines comprising one or more surfaces, with each tine further comprising an electrode and a piezoelectric material. An application specific integrated circuit (ASIC) is affixed to the platform. Electrical communication between the ASIC and the electrode of each tine is established for providing stimulus to the tuning fork and for receiving a response signal from the tuning fork. A protective layer is applied to cover the platform and a portion of the tuning fork while maintaining a portion of a surface of each tine free from the protective layer such that the surface can displace the fluid in contact therewith.
    Type: Grant
    Filed: May 19, 2010
    Date of Patent: May 27, 2014
    Assignees: MEAS France, Hella KGaA Hueck & Co.
    Inventors: Oleg Kolosov, Leonid Matsiev, John F. Varni, G. Cameron Dales, Olaf Ludtke, Dirk Wullner, Andreas Buhrdorf, Heiko Dobrinski
  • Patent number: 8726489
    Abstract: An adjustment method of a magnetic resonance imaging apparatus includes: a cooling and excitation step in which work of transporting a superconducting magnet to a facility different from a facility where the superconducting magnet is to be installed, cooling a superconducting coil of the superconducting magnet with a refrigerant, and supplying a current from an external power supply for excitation is repeated until a predetermined rated current flows; a demagnetization and transportation step of demagnetizing the superconducting coil and transporting the superconducting magnet to the facility where the superconducting magnet is to be installed in a state where the superconducting coil is cooled by the refrigerant; and an installation step of installing the superconducting magnet in the facility where the superconducting magnet is to be installed and supplying a predetermined rated current from an external power supply to the superconducting coil in order to excite the superconducting coil.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: May 20, 2014
    Assignee: Hitachi Medical Corporation
    Inventor: Munetaka Tsuda
  • Patent number: 8713789
    Abstract: A method of manufacturing a microphone comprising a substrate, a transducer element that is mounted on a top side of the substrate, a covering layer that covers the transducer element and forms a seal with the top side of the substrate, a shaped covering material that covers the substrate, the transducer element and the covering layer, and a sound opening that extends through the covering material and the covering layer. Methods for manufacturing a microphone and for manufacturing a plurality of microphones are also disclosed.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: May 6, 2014
    Assignee: Epcos AG
    Inventors: Anton Leidl, Wolfgang Pahl
  • Patent number: 8704360
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: April 22, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 8689415
    Abstract: In an exemplary method for manufacturing a piezoelectric device, a lid wafer, a piezoelectric wafer, and a base wafer are prepared. Each wafer defines multiple lids, multiple piezoelectric vibrating pieces, and multiple bases, respectively. The piezoelectric vibrating pieces comprise respective first and second electrodes, and the base wafer is made of glass. The bases comprise respective first and second metal wires extending therethrough, each wire having a respective end and a respective side surface at the end that protrudes at least partially from the first surface. A wafer sandwich is formed with the three wafers co-aligned with each other, with the protruding ends of the wires contacting respective first and second electrodes. The layers are anodic bonded together, which also bonds the protruding ends of the first and second wires to the respective first and second electrodes. The bonded wafer sandwich is cut into separate individual piezoelectric devices thus formed in the sandwich from each other.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: April 8, 2014
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventors: Kozo Ono, Takahiro Inoue
  • Patent number: 8689426
    Abstract: Aspects of the subject disclosure include, for example, obtaining a mechanical resonating structure comprising a compensating structure, where the compensating structure comprises one or more materials having an adaptive stiffness that reduces a variance in a resonating frequency of the mechanical resonating structure (f0), and adjusting at least one of a value of f0 of the obtained mechanical resonating structure or a value of a temperature for which temperature coefficient of frequency of the obtained mechanical resonating structure is approximately zero (T0) by altering a thickness of at least one targetable material of the mechanical resonating structure. Other embodiments are disclosed.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: April 8, 2014
    Assignee: Sand 9, Inc.
    Inventors: Florian Thalmayr, Jan H. Kuypers, Klaus Juergen Schoepf
  • Patent number: 8677604
    Abstract: A method of manufacturing a boundary acoustic wave device includes the steps of forming an electrode on a first medium layer, forming a second medium layer so as to cover the electrode on the first medium layer, and forming a sound absorbing layer on an external surface of the second medium layer. The sound absorbing layer has an acoustic velocity of transverse waves that is lower than an acoustic velocity of transverse waves of the second medium layer.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: March 25, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Hajime Kando
  • Patent number: 8667665
    Abstract: One embodiment of the present inventions sets forth a method for decreasing a temperature coefficient of frequency (TCF) of a MEMS resonator. The method comprises lithographically defining slots in the MEMS resonator beams and filling the slots with a compensating material (for example, an oxide) wherein the temperature coefficient of Young's Modulus (TCE) of the compensating material has a sign opposite to a TCE of the material of the resonating element.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: March 11, 2014
    Assignee: SiTime Corporation
    Inventors: Paul Merritt Hagelin, Charles Grosjean
  • Publication number: 20140064525
    Abstract: The present invention includes a vibrating panel device for an electromagnetic vibrator, which includes at least one vibrating panel device. The vibrating panel module includes a base, a vibrating panel and an upper suspension, wherein an inner edge and an outer edge of the upper suspension are respectively connected with the base and the vibrating panel, and form an integrated whole body. Further, two vibrating panel modules are fixedly connected in opposite directions to form the vibrating panel device. By unique structures of the vibrating panel device, when the voice coil drives the vibrating panel to actuate, shaking of the vibrating panels is offset due to interactions between a pair of the suspensions and a pair of the vibrating panels, in such a manner that the voice coil drives the vibrating panel to process vertical up-and-down stroke, so as to replace a conventional damper.
    Type: Application
    Filed: April 12, 2012
    Publication date: March 6, 2014
    Inventor: Xinmin Huang
  • Patent number: 8661650
    Abstract: A method of making a handheld, electromechanical device useful in mammalian body-care includes the steps of: a) forming a one-piece housing having a single opening defined by a rim; b) assembling a unitary insert; c) inserting the unitary insert through the single opening of the housing; d) removably applying a cover having an exterior surface to close the opening of the one-piece housing; and e) attaching the unitary insert to at least one of the one-piece housing and the removable cover. The rim of the one-piece housing circumscribes a rim area, and the one-piece housing has a projected area that is substantially larger than the rim area. The unitary insert is dimensioned to be insertable through the opening defined by the rim, and it has a frame having disposed thereon electromechanical elements interconnected in an electrical circuit. The cover closes off the opening of the one-piece housing.
    Type: Grant
    Filed: September 27, 2011
    Date of Patent: March 4, 2014
    Assignee: Johnson & Johnson Consumer Companies, Inc.
    Inventors: Jorge M. Da Silva, Emanuel P. Morano, John Rytel
  • Patent number: 8656578
    Abstract: An ultrasound transducer includes an array of PZT elements mounted on a non-recessed distal surface of a backing block. Between each element and the backing block is a conductive region formed as a portion of a metallic layer sputtered onto the distal surface. Traces on a longitudinally extending circuit board—preferably, a substantially rigid printed circuit board, which may be embedded within the block—connect the conductive region, and thus the PZT element, with any conventional external ultrasound imaging system. A substantially “T” or “inverted-L” shaped electrode is thereby formed for each element, with no need for soldering. At least one longitudinally extending metallic member mounted on a respective lateral surface of the backing block forms a heat sink and a common electrical ground. A thermally and electrically conductive layer, such as of foil, transfers heat from at least one matching layer mounted on the elements to the metallic member.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: February 25, 2014
    Assignee: MR Holdings (HK) Limited
    Inventor: Xiacong Guo
  • Patent number: 8652883
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: February 18, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 8633064
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's sprinted circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 21, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 8629552
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: January 14, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 8627566
    Abstract: A ceramic header configured to form a portion of an electronic device package includes a mounting portion configured to provide a mounting surface for an electronic device. In addition, the ceramic header includes one or more conductive input-output connectors operable to provide electrical connections from a first surface of the ceramic header to a second surface of the ceramic header. The ceramic header also includes one or more thermally polished surfaces.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: January 14, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Moody K. Forgey, Mark A. Kressley
  • Patent number: 8629005
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 14, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 8623709
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 7, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 8624386
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: January 7, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 8624385
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: January 7, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 8623710
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 7, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 8624387
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: January 7, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 8624384
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: January 7, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 8617934
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 31, 2013
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini