Abstract: A microphone assembly comprises a microphone, a connector secured to the underside of the microphone. A gasket has a sound collecting hole and is secured on the upper surface of the microphone.

Abstract: The invention provides a method of manufacturing piezoelectric wafers of surface acoustic wave (SAW) identification tags. In one embodiment, the method includes: (1) using a master reticle to form, on each of the piezoelectric wafers, wafer-independent patterns that encode digits of a first significance for SAW identification tags; and (2) using different ones of a library of coding reticles to form, on each of the piezoelectric wafers, wafer-dependent patterns that encode digits of a second significance for SAW identification tags.

Abstract: A method is provided for making a backing layer for an ultrasonic matrix array transducer useful in medical imaging and the like. A conductive grid is provided which includes a plurality of micro-contacts each joined together by a common base so that spaces are provided between the free ends of the contacts. A mold for the grid is filled with an acoustically absorbent material such that the absorbent material fills the spaces between the contacts, so as to produce a block when cured. The common base is removed so as to separate the contacts from one another within the block. Further machining exposes the opposite ends of micro-contacts so that a like number of contact faces or pads are provided at opposed surfaces of the backing layer. Improved transducer constructions are also disclosed.

Abstract: An acoustic transducer design having a slotted oval-shaped shell and active transducer elements located on the inner surface of the shell is disclosed. The design provides a high power, ultra-low frequency oval projector having a number of applications, including underwater seismic prospecting and fish mitigation.

Abstract: The invention relates to a noise suppressor unit for installing a common mode choke for a noise suppressor in a power source module onto a circuit board of the power source module, the module being arranged onto a circuit board of a plug-in unit. The noise suppressor unit includes a holder onto which the common mode choke for the noise suppressor of the power source module is arranged, at least one lifting element for an assembly head or the like of an automatic assembly machine for placing the noise suppressor unit onto the circuit board of the power source module with the automatic assembly machine or the like, and at least one surface mounting element for surface mounting the common mode choke for the noise suppressor onto the circuit board of the power source module.

Abstract: The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).

Abstract: Inner individual electrodes are formed at intervals on a piezoelectric ceramic layer so as to correspond in a one-to-one relationship with ink channels, and an inner common electrode are formed on another piezoelectric ceramic layer. The required number of piezoelectric ceramic layers with inner individual electrodes and with an inner common electrode are laminated alternately. An outer common electrode is connected to the inner common electrodes, and outer individual electrodes are connected to the respective inner individual electrodes. The capacitance between the outer common electrode and each of the outer individual electrodes is measured. A polarization electric field adjusted based on the measured value is applied between the common electrode and each of the outer individual electrodes to perform polarization.

Abstract: A piezoelectric element contains a piezoelectric ceramic body having a layered perovskite structure, and has the C axis selected and oriented in the thickness direction. In the piezoelectric ceramic body, line shaped electrodes are formed perpendicular to the C axis selected and oriented. The electrodes exposed at both of the end faces of the piezoelectric ceramic body are covered with conductive materials and insulation materials. The piezoelectric ceramic body is polarized in the opposite directions on both of the sides of electrodes arranged in the width direction. Moreover, external electrodes are formed on the faces where the conductive materials and the insulation materials are formed, whereby two groups of the electrodes are arranged in an interdigital electrode form.

Abstract: A piezoelectric/electrostrictive device is provided including a functional element. The functional element includes a base portion, a deformable portion assuming the form of a thin plate and extending from the base portion to thereby form a plane, a piezoelectric/electrostrictive element formed on the deformable portion, and a reflective portion extending from the deformable portion so as to form an active plane intersecting with the plane of the deformable portion and having a light-reflecting member disposed on the active plane. Operation of the piezoelectric/electrostrictive element causes the deformable portion to be deformed in a direction substantially perpendicular to the plane of the deformable portion to thereby change a reflection angle of light reflected from the reflective portion.

Abstract: A surface acoustic wave device includes a piezoelectric substrate and at least one interdigital electrode disposed on the piezoelectric substrate. The interdigital electrode is made of ?-tantalum.

Abstract: An assembly and method for array processing of hermetically sealed Surface Acoustic Wave (SAW) Devices employs a non-conductive material having an array of spaced cavities extending into the material for receiving a SAW die face down, in a flip-chip arrangement. Each cavity has a peripheral recess dimensioned to receive a lid for hermetically sealing the die within the cavity. Conductive paths are provided from the interior of the cavity to the surface of the array for providing an electrical contact with the SAW die. Individual SAW devices are then provided by cutting along separation lines between adjacent cavities after a plurality of die have been hermetically sealed within its cavity.

Abstract: A method of manufacturing a loudspeaker comprises: continuously forming diaphragm portions and alignment portions on a band resin film; positioning one of a frame and a protector at an upper die or lower die; aligning other alignment portions formed on the frame, the protector, or the upper or lower die having the film disposed thereon, with the alignment portion formed on the film; bonding the frame and the resin film that is to form the diaphragm; and cutting a diaphragm out of the resin film. A position of bonding the diaphragm to the frame or the protector can be easily determined by aligning the alignment portion formed on the band resin film with another alignment portion provided on the frame, the protector, or the lower or upper die on which the frame or protector is disposed. Further, a conventionally-indispensable ring can be eliminated to reduce a number of components.

Abstract: A speaker's surround to be attached to an edge of a diaphragm in a speaker system is provided, which is capable of keeping its predetermined shape while repeating elastic deformation for accommodating large amplitude vibration of the diaphragm. Further, the surround is highly durable to withstand the repeated large amplitude vibration, and which can achieve high sound pressure levels. The surround for a speaker system includes a surround piece made of a rubber mold and a base member embedded in the surround piece. The base member is obtained by soaking a cloth material made of cotton or aramid fiber with a thermosetting resin such as phenol resin, and press-formed with heat into a predetermined shape. The surround thus has enhanced its shape maintaining capability.

Abstract: The present invention provides a method of manufacture capable of manufacturing a repulsion magnetic circuit for a speaker with good production efficiency and in a stabilized manner and an apparatus for use in the manufacture. A position of abutment between first magnetic block circuit attached to lower jig (102) and second magnetic circuit block attached to upper jig (105) is detected by detection of a load current of servomotor (103). A pressing time for achieving adhesion is established by the number of pulses from encoder directly coupled with servomotor (103).

Abstract: A method of manufacturing an edge reflection type surface acoustic wave device using a Shear Horizontal type surface acoustic wave includes the steps of making a first half cut defining a first end surface portions having a smooth surface, that is, opposing two end surfaces which function as reflection end surfaces, from the upper surface of a piezoelectric substrate after at least one of a plurality of IDTs has been formed on the upper surface of the piezoelectric substrate, making a second half cut for forming second end surface portions having a rough surface after making the first cut, and making a full cut for cutting the piezoelectric substrate so as to reach the lower surface of the piezoelectric substrate outside of the second end surface portions in the surface acoustic wave propagation direction.

Abstract: One embodiment disclosed relates to a method for sealing an active area of a non-silicon-based device on a wafer. The method includes providing a sacrificial material over at least the active area of the non-silicon-based device, depositing a seal coating over the wafer so that the seal coating covers the sacrificial material, and replacing the sacrificial material with a target atmosphere. Another embodiment disclosed relates to a non-silicon-based device sealed at the wafer level (i.e. prior to separation of the die from the wafer). The device includes an active area to be protected, a contact area, and a lithographically-formed structure sealing at least the active area and leaving at least a portion of the contact area exposed.

Abstract: An electrostatic speaker is constructed using a thin flexible membrane as the active member. This membrane is uniformly positioned against at least one printed circuit board containing at least one stator fixed in the PCB. Variations in structure are provided, all including at least one PCB and a membrane. In a preferred embodiment, intermeshing opposing ridges on the PCBs are adjacent to a central vibrating area of the membrane, and serve to position and tension the membrane. Attachment means connect the PCBs together, and electrical connections permit the passage of current to bias the membrane and to drive the stators to vibrate the membrane, producing acoustical output in the sonic or ultrasonic ranges. The invention also relates to the electrostatic speakers produced by this method of manufacture.

Abstract: A surface acoustic wave device includes a piezoelectric plate and at least one interdigital electrode provided on the piezoelectric plate. The interdigital electrode includes a first metallic thin film and a second metallic thin film laminated on the first metallic thin film and containing tantalum as a principal component, and at least a portion of the tantalum of the second metallic thin film is &agr;-tantalum.

Abstract: A method of manufacturing an ultrasound transducer (60), which includes forming a plate into a hollow spherical cap by deformation, wherein the plate is initially in the form of a disc of a composite piezoelectric material. The step of forming is preceded by at least one slit (70) into the plate, wherein the at least one slit has a radial orientation and extends from the peripheral edge (72) of the disc (20) towards its center (C). After the step of forming, two facing, oppositely situated free edges (74, 76) which bound the slit (70) are substantially in contact with one another so as to minimize internal stresses in the cap caused by the deformation. A transducer obtained by such a method is also disclosed.

Abstract: A method for manufacturing a speaker apparatus that includes fixing a magnetic circuit to a frame so that the magnetic circuit is positioned around a central hole of the frame; positioning a coil with respect to a center pole of the magnetic circuit; connecting a damper to the coil and the frame; positioning a jig in the central hole of the frame; projecting the jig from a center hole of the center pole; engaging a positioning portion provided on a diaphragm with the jig to position the diaphragm at a predetermined position with respect to the center pole, the positioning portion being removably connected with the jig positioned in the central hole of the frame to secure the position of the diaphragm relative to the magnetic circuit during the installation; and connecting the positioned diaphragm to the coil and the frame.

Abstract: A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.

Abstract: An elastic wave generator includes an excitation coil, a magnetostriction oscillator around which the excitation coil is wound and an oscillator support. The excitation coil is wound around the oscillator, which is made of laminated magnetostriction sheets having a positive strain characteristic, in which length varies directionally upon magnetic excitation. The oscillator support has a first support surface bearing against a first end surface of the magnetostriction oscillator, intersecting the direction along which the length of the magnetostriction oscillator changes and a second support surface shrink-fit against a second end surface of the magnetostriction oscillator, intersecting the direction along which the length of the magnetostriction oscillator changes. Thus, the changes in the length of the magnetostriction oscillator due to the magnetic excitation of the excitation coil appearing at the first and second end surfaces is directly supported by the first and second support surfaces.

Abstract: In an electroacoustic transducer (21) with a stationary transducer part (23) and with a membrane configuration (17) comprising a membrane (15) and a handling ring (1) for the membrane (15) connected with the membrane (15), the membrane configuration (17) is connected with the stationary transducer part (23) via the handling ring (1), and the handling ring (1) and membrane (15) are connected together via an interlocking connection.

Abstract: A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.

Abstract: A method of forming a resonance transducer comprises providing a piezoelectric body having a first acoustic impedance and a propagation medium having a second acoustic impedance. A matching layer is coupled between the piezoelectric body and the propagation medium. The body vibrating at the resonance frequency has a resonance impedance less than the second acoustic impedance of the propagation medium. The matching layer has a third acoustic impedance less than the second acoustic impedance for providing a high output or high sensitivity signal when operated at the resonance frequency.

Abstract: In a folded armature assembly the vibratory end portion of the armature is prelocatable both translationally and rotationally relative to the facing pole surfaces of the permanent magnetic flux means before attachment of the supported portion of the armature to said means. The armature has wings extending laterally from the supported portion to form therewith a connecting bridge portion, and the wings are formed to provide pads extending normal to the bridge. A magnet strap with attached magnets fits slidably between the pads, with a clearance from the bridge of the armature, to permit said locations before the parts are permanently attached. After attachment and with the magnets magnetized, the armature may be adjusted substantially in translation to magnetic center between the pole faces by appropriate plastic deformation of the bridge. In a preferred embodiment, an improved structure is provided for viscoelastic damping of the undesirable second natural resonant mode of the folded armature.

Abstract: Described are various improved methods of forming stable metallization for electronic devices, electromechanical devices, force-sensing devices and accelerometers. Also described are various improved electronic devices, electromechanical devices, force-sensing devices, and accelerometers.

Abstract: A piezoelectric resonator is constructed to be vibrated in a square type vibration mode and to minimize the variations in the resonant frequency caused by the manufacturing process. The resonator includes a piezoelectric substrate having a pair of main surfaces, electrodes disposed on the pair of main surfaces and grooves provided on one of the main surfaces of the piezoelectric substrate. The grooves divide at least one of the electrodes into a plurality of divided electrodes. One of the plurality of divided electrodes defines an input/output electrode. A maximum distance between the outer edges of two of the grooves disposed opposite to each other across the input/output electrode is about 0.5 to about 0.55 times the length of one side edge of the piezoelectric substrate.

Abstract: A back plate having a stationary back electrode is secured to a substrate. A diaphragm electrode is mounted on the back plate interposing a spacer. A frame having a sound collecting hole is mounted on the diaphragm electrode.

Abstract: A method for forming film bulk acoustic resonator devices includes depositing a first portion of a first electrode, and a piezoelectric layer onto the substrate. The method includes removing a portion of the substrate under the piezoelectric layer and under the portion of the first electrode, and depositing a second portion of the first electrode onto the piezoelectric film layer and onto the first portion of the first electrode.

Abstract: A method of manufacturing an edge reflection type surface acoustic wave device includes the step of preparing a surface acoustic wave mother substrate having a plurality of interdigital transducers formed on one main surface thereof. A cut groove is formed in the substrate by cutting the surface acoustic wave mother substrate beginning from the one main surface side thereof. This step of forming a cut groove is repeated so as to produce a plurality of cut grooves so that the first reflection edge of the respective surface acoustic wave devices are sequentially formed. Next, similarly, cut grooves are sequentially formed on the surface acoustic wave mother substrate from the one main-face side thereof so as not to reach the other main surface thereof, whereby the second reflection edges of the respective surface acoustic wave devices are sequentially formed.

Abstract: A method for making a piezoelectric composite transducer is disclosed. A block of piezoelectric material having a common base and a plurality of uniform-length rods is utilized. An electric conductor is positioned to extend through a side region of the block. Spaces between the rods are filled up to a first surface region with a viscoelastic material. The common base of the block is removed forming a second surface region. Electrodes are deposited at the first surface region to be in contact with the rods and in electrical contact with the electric conductors. A ground electrode is deposited at the second surface region to be in contact with the rods. The resulting piezoelectric composite transducer can be heated and shaped to conform to complex curves.

Abstract: A method for fabricating a piezoelectric macro-fiber composite actuator comprises providing a piezoelectric material that has two sides and attaching one side upon an adhesive backing sheet. The method further comprises slicing the piezoelectric material to provide a plurality of piezoelectric fibers in juxtaposition. A conductive film is then adhesively bonded to the other side of the piezoelectric material, and the adhesive backing sheet is removed. The conductive film has first and second conductive patterns formed thereon which are electrically isolated from one another and in electrical contact with the piezoelectric material. The first and second conductive patterns of the conductive film each have a plurality of electrodes to form a pattern of interdigitated electrodes. A second film is then bonded to the other side of the piezoelectric material. The second film may have a pair of conductive patterns similar to the conductive patterns of the first film.

Abstract: An acoustic backing element includes a glass fiber epoxy composite planar substrate to the outer major surfaces of which are applied electrically conductive material. The electrically conductive material may be a conductive layer that is etched to expose electrical contact material in the form of conductive traces. Each conductive trace provides electrical connection between a transducer element and electrical control circuitry typically located on an electrical circuit board. The acoustic backing element provides precisely located electrical contacts for connecting the transducer elements to their control circuitry, while simultaneously providing superior acoustic attenuation. In addition, the thermal coefficient of expansion (TCE) of the glass fiber epoxy composite material comprising the planar substrate can be closely matched to the TCE of the electrical contact material.

Abstract: This invention relates to a method of manufacturing an ultrasonic transducer. A plurality of leads end portions are inserted into a plurality of lead holes of an alignment jig. A backing layer is formed by resin molding. After that, the alignment jig is removed from the surface of the backing layer, and the surface of the backing layer is flattened. Since the end portions of the leads are exposed to this flattened surface of the backing layer, discrete electrodes formed on the back surfaces of transducer elements are electrically connected to these lead end portions. The accuracy of lead arrangement is thus improved by the use of the alignment jig. This reduces alignment errors of leads with respect to the discrete electrodes of the transducer elements.

Abstract: A degassed polyester varnish is applied to the transduction driver to increase surface dielectric strength (insulation resistance), driver voltage breakdown, physical protection, and heat and water resistance. A vacuum chamber application process is used to apply the polyester varnish. The disclosed coating technique is applicable to all transducer drive materials and all transducer types.

Abstract: A conductive damper for use in a speaker is provided, the endurance and the moldability of which are improved. A base is moved downward to allow an inner top mold to abut on a bottom mold, then the base is further moved downward to allow the inner top mold and the bottom mold to be applied pressure and the base moves down with being guided by guiding means. At this time, energizing means energizes the inner top mold to press the bottom mold, thereby corrugations for the inner part of a workpiece of the conductive damper are molded. At this time, the workpiece of the conductive damper is pulled toward the inner side thereof. Then, the base is further moved downward to press an outer top mold onto the bottom mold, thereby corrugations for the outer part of the workpiece of the conductive damper are molded.

Abstract: There is disclosed a torque sensor comprising: a shaft whose torque is to be detected; a magnetostrictive film formed on the shaft; and a coil for detecting a change of a magnetic property of the magnetostrictive film, wherein an intermediate film having a melting point lower than a melting point of the shaft and a melting point of magnetostrictive film is formed between the shaft and the magnetostrictive film, so that the torque sensor is superior in productivity and durability and can detect a torque in a rotational direction.

Abstract: The present invention provides an transducer and a method of making the same. The transducer is comprised of a plurality of transducer cells, and conductive interconnects between the cells. Each transducer cell contains a bottom electrode formed on a layer of insulator material, a lower insulating film portion formed over the bottom electrode, a middle insulating film portion that includes an air/vacuum void region, and an upper insulating film portion that includes a top electrode formed within a portion of the upper insulating film portion. A first layer of interconnects electrically connect the bottom electrodes of each transducer cell and a second layer of interconnects electrically connect the top electrodes of each transducer cell. The top and bottom layers of interconnects are patterned to avoid overlap between them, thus reducing the parasitic capacitance.

Abstract: Method for manufacturing speaker bottom yoke, including steps of: 1. calculating product weight according to required dimension; 2. cutting off a blank material with the calculated weight from steel bar (material bar), which blank material can be further planed; 3. performing first time forging to forge one end of the blank material into a stem section with reduced diameter, which stem section can be formed with a sink in accordance with the required shape of the bottom yoke; 4. performing second time forging to forge the other end of the blank material into a bottom disc with larger diameter; and 5. performing third time forging to further forge the bottom disc of the blank material into a predetermined dimension. In the above forging procedure, the diameter of the blank material is forged from large dimension into small dimension and the bottom disc is forged at two times into a specific dimension.

Abstract: The present invention discloses an ultrasonic phased array transducer with an ultralow backfill and a method for making. The ultrasonic phased array includes a low density backfill material having an ultralow acoustic impedance. The backfill material is either an aerogel, a carbon aerogel, an xerogel, or a carbon xerogel. A piezoelectric ceramic material and two matching layers are bonded to the backfill material. In one embodiment, a plurality of interconnect vias are formed in the backfill material with conducting material deposited in the vias. A portion of the bonded matching layers, the piezoelectric ceramic material, and the backfill material have isolation cuts therethrough to form an array of electrically and acoustically isolated individual elements. In a second embodiment, the backfill material is bonded to an electronic layer at a face opposite to the piezoelectric ceramic material and the matching layers.

Abstract: Flat knitted tinsel wires (2h) are sewn on a base cloth (B) of a conductive suspension (1) with a sewing thread (3) and the ends (2ha, 2hb) of the flat knitted tinsel wires extend outward from the conductive suspension (1). In this suspension device, a work load of peeling off the flat knitted tinsel wire ends (2ha and 2hb) from the base cloth (B) is reduced and associated problems are solved. The flat knitted tinsel wires (2h) are sewn on the base cloth (B), with the flat knitted tinsel wire ends (2ha, 2hb) being positioned at base close holes (B1), and thermally pressed and trimmed together with the base cloth (B).

Abstract: This invention relates to a method of manufacturing an ultrasonic transducer. First, a plurality of printed boards in each of which a plurality of leads are formed in a line are stacked. The end portions of the leads protrude from each printed board. These lead end portions are inserted into a plurality of lead holes of an alignment jig. The plurality of printed boards are buried in the back surface of this alignment jig, and a backing layer is formed by resin molding. After that, the alignment jig is removed from the surface of the backing layer, and the surface of the backing layer is flattened. Since the end portions of the leads are exposed to this flattened surface of the backing layer, discrete electrodes formed on the back surfaces of transducer elements are electrically connected to these lead end portions. The accuracy of lead arrangement is thus improved by the use of the alignment jig. This reduces alignment errors of leads with respect to the discrete electrodes of the transducer elements.

Abstract: A method of manufacturing a diaphragm for an electroacoustic transducer which operates in accordance with the electrodynamic principle and has portions with different thicknesses made from a thermoplastically deformable material having a constant thickness, wherein, in a first work step, that portion of the diaphragm material which is to have the greater thickness in the finished diaphragm, is held by an inner positioning device, while the remaining area of the diaphragm is additionally held by an outer positioning device, and the remaining area of the diaphragm is pulled or stretched with the influence of tension and heat to reduce the thickness thereof. In a second workstep, the entire diaphragm is thermoplastically stamped in a mold.