Coating Resistive Material On A Base Patents (Class 29/620)
  • Patent number: 10619270
    Abstract: A system and corresponding method are provided for controlling production in a blow room, the blow room including a controller, a supplying machine having a supplying part, and a machine to be supplied that has a filling level measurement. The supplying machine and the machine to be supplied are connected to the controller. A production area is defined for the supplying machine and includes a minimum production and a maximum production. Production of the supplying part of the supplying machine is determined based on a filling level of the filling level measurement. When production of the production area drops below the minimum production, the supplying part of the supplying machine is shut down, the shutdown taking place independently of the filling level of the machine to be supplied.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: April 14, 2020
    Assignee: Maschinenfabrik Rieter AG
    Inventors: Reto Lüthard, Gerhard Gschliesser
  • Patent number: 10505403
    Abstract: A wireless power transmitting device transmits wireless power signals to a wireless power receiving device. To detect foreign objects, the wireless power transmitting device has an array of temperature sensors. The array of temperature sensors may include temperature sensor components such as temperature sensitive thin-film resistors or other temperature sensitive components. A temperature sensor may have thin-film resistors formed on opposing sides of a substrate. The thin-film resistors may be formed from meandered metal traces to reduce eddy current formation during operation of the wireless power transmitting device. Signal paths coupling control circuitry on the wireless power transmitting device to the array of temperature sensors may be configured to extend along columns of the temperature sensors without running along each row of the temperature sensors, thereby reducing eddy currents from loops of signal routing lines.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: December 10, 2019
    Assignee: Apple Inc.
    Inventors: J. Stephen Smith, Siddharth Seth, Douglas J. Adams, Michael A. Cretella
  • Patent number: 10466072
    Abstract: A system includes analysis circuitry. The analysis circuitry is configured to determine a first electrical resistance between a first terminal of a potentiometer and a second terminal of the potentiometer. The analysis circuitry is additionally configured to determine a second electrical resistance between the first terminal and a wiper terminal of the potentiometer. The analysis circuitry is additionally configured to determine a third electrical resistance between the second terminal and the wiper terminal. The analysis circuitry is additionally configured to determine a wiper resistance of the potentiometer based on the first electrical resistance, the second electrical resistance, and the third electrical resistance. The system additionally includes an output interface coupled to the analysis circuitry and configured to generate an output indicative of the wiper resistance.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: November 5, 2019
    Assignee: THE BOEING COMPANY
    Inventors: Suhat Limvorapun, Thomas A. Webb, Randy L. Brandt
  • Patent number: 10451506
    Abstract: Provided herein is a diaphragm that is highly durable, and that does not involve the risk of gas leakage, and a pressure sensor using such a diaphragm. The diaphragm is a metallic diaphragm that includes a plate-shaped pressure receiver, and a frame-like support member. The pressure receiver has a metal structure grown parallel to a flat plate surface of the plate-shaped pressure receiver.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: October 22, 2019
    Assignee: SEIKO INSTRUMENTS INC.
    Inventors: Tomoo Kobayashi, Ryo Sugawara
  • Patent number: 10446304
    Abstract: The invention is to provide a resistor trimming method capable of adjusting a resistance value with ultrahigh precision and having excellent production efficiency. To achieve the object, a start point (S1) at a distance from a resistor (4) is irradiated with laser light while probes are brought into contact with a pair of surface electrodes (3) to measure a resistance value of the resistor (4). The place irradiated with the laser light is scanned so that a first trimming groove (5) extending in a direction perpendicular to a current direction can be formed in the resistor (4). Then, the place irradiated with the laser light is returned by a predetermined amount from an end point (first turning point (T1)) of the first trimming groove (5) to be set as a second turning point (T2). With the second turning point (T2) as a start point, scanning and cutting is performed to forma second trimming groove (6). Thus, the resistance value of the resistor (4) is adjusted to a target resistance value with high precision.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: October 15, 2019
    Assignee: KOA Corporation
    Inventors: Naoto Oka, Homare Sasaki
  • Patent number: 10386762
    Abstract: A heating unit includes a circuit board, heating parts, and electrode parts. The heating parts are arranged in a first direction on a surface of the circuit board. The electrode parts are disposed on the surface of the circuit board, and electrically connected to both sides of the heating parts in a second direction that is orthogonal to the first direction. Each of the heating parts includes a plurality of heating resistors that is arranged in the first direction. Each of the heating resistors has a size ratio of a first length in the second direction to a second length in the first direction is 1 or more and 100 or less.
    Type: Grant
    Filed: August 11, 2018
    Date of Patent: August 20, 2019
    Assignees: KYOCERA Document Solutions Inc., KYOCERA Corporation
    Inventors: Takashi Eiki, Hiroki Kawasaki, Ryohei Tokunaga, Atsushi Kohama, Yuhiro Sakai, Kotatsu Kawaguchi, Hidenobu Nakagawa
  • Patent number: 10349522
    Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: July 9, 2019
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wei-Ming Shieh, Yi-Feng Pu, Pei-Hsuan Huang
  • Patent number: 10276482
    Abstract: A method for manufacturing a circuit carrier for electronic components includes making available a carrier material layer made of an electrically insulating material and having at least one connecting layer which is applied at least to a first and/or second surface of the carrier material layer and has in each case a predefined layer thickness. Each connecting layer has a number of electrically conductive connections with a predefined conductor track width. At least some of the connections are strengthened by plasma spraying, at least in certain sections, with additional electrically conductive material. As a result, a greater layer thickness than the predefined layer thickness and/or a larger conductor track width than the predefined conductor track width is obtained. Furthermore, a circuit carrier for electronic components is specified.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: April 30, 2019
    Assignee: Continental Automotive GmbH
    Inventors: Detlev Bagung, Thomas Riepl
  • Patent number: 10224132
    Abstract: A chip resistor including an insulating film covering a resistor making contact with a pair of electrodes formed on an upper surface of an insulating substrate and a method for manufacturing same are provided. Both electrodes include a main electrode layer that contains silver as a main metal component an 10 weight % or more of palladium as another metal component, and an auxiliary electrode layer lower in specific resistance than the main electrode layer, a laminate part where the auxiliary electrode layer and the main electrode layer are laminated in order on a single surface of the insulating substrate; and an exposed part of the auxiliary electrode layer where a part of the auxiliary electrode layer is not covered with the main electrode layer on a far side from the resistor, and part that extend from a near side to the far side with respect to the resistor.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: March 5, 2019
    Assignee: KOA Corporation
    Inventor: Kentaro Matsumoto
  • Patent number: 10194532
    Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: January 29, 2019
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wei-Ming Shieh, Yi-Feng Pu, Pei-Hsuan Huang
  • Patent number: 10136672
    Abstract: A personal vapor inhaling unit is disclosed. An electronic flameless vapor inhaler unit t may simulate a cigarette. A flow of electrical power may be coupled through solderless pressure contacts to activate a heating element. When the unit is activated, and the user provides suction, the liquid to be vaporized may be vaporized by an atomizer assembly. Vapors may then be aspirated by the user through an oral aspiration tube, where they may be inhaled.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: November 27, 2018
    Assignee: RAI Strategic Holdings, Inc.
    Inventors: Noah Mark Minskoff, Nathan Andrew Terry
  • Patent number: 9763333
    Abstract: The electrical circuit can include a line circuit portion having a number of shared resistor pads, where each shared resistor pad is electrically coupled to an electrically conductive line lead, where the electrically conductive line lead carries a voltage capable of operating an electrical load. The electrical circuit can also include a load circuit portion comprising a number of unshared resistor pads. The electrical circuit can further include at least one zero ohm resistor electrically coupled to at least one shared resistor pad. The at least one zero ohm resistor can be configurable after manufacturing the printed circuit board. The load circuit portion can be electrically isolated from the line circuit portion in the absence of the at least one zero ohm resistor being further electrically coupled to at least one unshared resistor pad.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: September 12, 2017
    Assignee: Cooper Technologies Company
    Inventor: James Michael Parascandola
  • Patent number: 9707642
    Abstract: Disclosed herein is a solder composition comprising a metal or a metal alloy; and an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy. Disclosed herein too is a method comprising mixing an electrically conductive high temperature polymeric composition with a metal or a metal alloy to form the solder composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: July 18, 2017
    Assignee: BAKER HUGHES INCORPORATED
    Inventors: David Peter Gerrard, Sayantan Roy
  • Patent number: 9646748
    Abstract: A resistive voltage divider includes first and second resistors, which are electrically connected in series and are made of a resistive film material which is applied in the form of a trace onto an insulating substrate. The divider's voltage ratio has a value between ten and one million. To improve the accuracy of the voltage divider, the first and second resistors are made of the same resistive film material, have a trace length above a corresponding specific trace length, and have approximately the same trace width.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: May 9, 2017
    Assignee: ABB AG
    Inventors: Adrian Hozoi, Rolf Disselnkötter
  • Patent number: 9158049
    Abstract: An optical device includes a telecentric optical system, a variable wavelength interference filter, and a detection section, the variable wavelength interference filter includes a first reflecting film, a second reflecting film provided to a movable section, and an electrostatic actuator adapted to displace the movable section, an effective measurement area capable of transmitting a light with a wavelength, which is within a predetermined allowable range centered on a measurement center wavelength when an amount of the displacement of the movable section takes a maximum displacement value, is set in the first reflecting film and the second reflecting film, and the telecentric optical system guides the incident light to the variable wavelength interference filter so that a principal ray of the incident light is parallel thereto and perpendicular to the first reflecting film, and at the same time, collects the incident light in the effective measurement area.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: October 13, 2015
    Assignee: Seiko Epson Corporation
    Inventor: Tatsuaki Funamoto
  • Patent number: 9126271
    Abstract: An embedded sensor or other desired device is provided within a completed structure through a solid-state bonding process or through a dynamic bonding process. The embedded sensor or other desired device is provided on a substrate through any known or later-developed method. A cover is then bonded to the substrate using a solid-state bonding process or a dynamic bonding process. The solid-state bonding process may include providing heat and pressure to the substrate and the cover to bond the substrate and the cover together. The dynamic bonding process may include heating a bonding agent and distributing the heated bonding agent between the substrate and cover to bond the substrate and the cover together.
    Type: Grant
    Filed: October 7, 2008
    Date of Patent: September 8, 2015
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Xiaochun Li, Arindom Datta, Xudong Cheng
  • Patent number: 9113546
    Abstract: A method for manufacturing an electric film body is made by forming a film body to have a shape in accordance with a desired electric characteristic and includes a film forming process for forming an electric film body on a board layer, an electric characteristic measuring process for measuring an electric characteristic in a surface of the electric film body formed in the film forming process, an electric film body shape setting process for setting a shape of the electric film body based on the electric characteristic measured in the electric characteristic measuring process, and an electric film body forming process for forming the electric film body formed in the shape set in the electric film body shape setting process.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: August 18, 2015
    Assignee: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Takayasu Sugai, Noboru Otabe
  • Patent number: 9029742
    Abstract: An electrically conductive resistive layer is produced by thermally spraying an electrically conductive material onto the surface of a non-conductive substrate. Initially, the material layer arising therefrom has no desired shape. The material layer is then removed in certain areas so that an electrically conductive resistive layer having said desired shape is produced.
    Type: Grant
    Filed: May 28, 2013
    Date of Patent: May 12, 2015
    Assignee: Watlow Electric Manufacturing Company
    Inventor: Elias Russegger
  • Publication number: 20150000418
    Abstract: A variable resistance flexure sensor, and a system and method of controlling an appliance using a variable resistance flexure sensor are provided. The sensor can include a substrate having a flexible portion and a non-flexible portion. A plurality of electrically resistive elements, such as a first resistive element and a second resistive element, can be disposed on the substrate where at least one resistive element is exclusively within the non-flexible portion of the substrate and at least one resistive element is within the flexible portion of the substrate. The resistive element within the non-flexible portion of the substrate can act as a reference resistance for the flexure sensor and can be used as, or as part of, a biasing network for the electrically resistive element within the flexible portion of the substrate. The flexure sensor can be used within an appliance to detect various conditions such as temperature, moisture, etc.
    Type: Application
    Filed: September 16, 2014
    Publication date: January 1, 2015
    Inventor: James Carter Bach
  • Publication number: 20140368965
    Abstract: [Subject] To provide a highly-reliable and small-size chip component, e.g., a chip resistor having an accurate resistance value. [Solution] The chip resistor (10) includes: a substrate (11); a plurality of resistor elements each having a resistive film portion (20) provided on the substrate (11) and an aluminum-containing interconnection film portion (21) provided in contact with the resistive film portion (20); electrodes (12, 13) provided on the substrate (11); and a plurality of fuses (F) each having an aluminum-containing interconnection film portion integral with the aluminum-containing interconnection film portion of the resistor element and disconnectably connecting the resistor element to the electrodes (12, 13). [Effect] The resistance of the chip resistor can be adjusted at a desired resistance value by selectively disconnecting desired ones of the fuses.
    Type: Application
    Filed: January 8, 2013
    Publication date: December 18, 2014
    Applicant: ROHM CO., LTD.
    Inventors: Yasuhiro Kondo, Hiroshi Tamagawa, Hiroki Yamamoto
  • Publication number: 20140301908
    Abstract: An electrically heated catalyst device includes a catalyst support including a ceramics, on which a catalyst is supported, a pair of surface electrodes disposed on an outer surface of the catalyst support, the surface electrodes being disposed opposite to each other and extending in an axial direction of the catalyst support, and a wiring line that externally supplies electric power to the surface electrodes, in which the catalyst support is electrically heated through the surface electrodes. A wrought member made of metal is buried in the surface electrodes, the wrought member extending in the axial direction of the catalyst support. With the configuration like this, the spreading of electric currents in the catalyst-support axis direction can be maintained even when cracks occur in the catalyst-support circumference direction in the surface electrodes.
    Type: Application
    Filed: December 27, 2011
    Publication date: October 9, 2014
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tadashi Takagaki, Yasuo Kinoshita, Kenji Shimoda, Kazuaki Nishio
  • Publication number: 20140240083
    Abstract: A chip resistor includes an insulating substrate, a resistor element arranged on the obverse surface of the substrate, a bonding layer provided between the resistor element and the substrate, a first electrode connected to the resistor element, and a second electrode connected to the resistor element. The second electrode is deviated from the first electrode in a direction perpendicular to the thickness direction of the substrate. The substrate includes a side surface between the obverse surface and the reverse surface. The first electrode covers the resistor element, and also the side surface and the reverse surface of the substrate.
    Type: Application
    Filed: February 25, 2014
    Publication date: August 28, 2014
    Applicant: ROHM CO., LTD.
    Inventors: Kenichi HARADA, Masaki YONEDA
  • Publication number: 20140202881
    Abstract: According to one embodiment of the present invention, an electrochemical sensor (10) for detecting the concentration of analyte in a fluid test sample is disclosed. The sensor (10) includes a counter electrode having a high-resistance portion for use in detecting whether a predetermined amount of sample has been received by the test sensor.
    Type: Application
    Filed: March 25, 2014
    Publication date: July 24, 2014
    Applicant: Bayer HealthCare LLC
    Inventors: Dijia Huang, Steven C. Charlton, Suny J. George, Andrew J. Edelbrock
  • Patent number: 8752279
    Abstract: A method for protecting an aircraft component from ice formation uses a thermally conductive film. The film includes a polymer, an electrically conductive material, and a sufficient concentration of hexagonal boron nitride to provide adequate heat transfer properties, and have high thermal conductivity, peel strength, and shear strength. The films can include thermoset polymers, thermoplastic polymers, or blends thereof, and can also include reinforcing materials such as fiberglass, carbon fiber, metal mesh, and the like, and thermally conductive fillers, such as aluminum oxide, aluminum nitride, and the like. The films can be included in composite materials. The films can be used as part of a layered structure, and used in virtually any application, for example, various locations in aircraft, where heating is desirable, including nacelle skins, airplane wings, heated floor panels, and the like.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: June 17, 2014
    Assignee: Goodrich Corporation
    Inventors: David L. Brittingham, Stanley G. Prybyla, Daniel P. Christy
  • Publication number: 20140123474
    Abstract: A method of forming a heating element for use with a steering wheel includes (i) forming a first heating part of a heating element which is coated in a longitudinal direction of the rim along an inner diameter portion of the rim by continuously connecting loops having the same shape, (ii) forming a second heating part of the heating element which is coated in the longitudinal direction of the rim along an outer diameter portion of the rim by continuously connecting loops having the same shape, (iii) forming a third heating part of the heating element which is coated in the longitudinal direction of the rim by continuously connecting loops having the same shape between the first heating part and the second heating part; and (iv) adjusting an electrical resistance of the heating element according to a coating width or thickness of the conductive paste.
    Type: Application
    Filed: January 13, 2014
    Publication date: May 8, 2014
    Applicant: Hwajin Co., Ltd.
    Inventor: Man Ho Cho
  • Publication number: 20140123766
    Abstract: A variable resistance flexure sensor, and a system and method of controlling an appliance using a variable resistance flexure sensor are provided. The sensor can include a substrate having a flexible portion and a non-flexible portion. A plurality of electrically resistive elements, such as a first resistive element and a second resistive element, can be disposed on the substrate where at least one resistive element is exclusively within the non-flexible portion of the substrate and at least one resistive element is within the flexible portion of the substrate. The resistive element within the non-flexible portion of the substrate can act as a reference resistance for the flexure sensor and can be used as, or as part of, a biasing network for the electrically resistive element within the flexible portion of the substrate. The flexure sensor can be used within an appliance to detect various conditions such as temperature, moisture, etc.
    Type: Application
    Filed: November 7, 2012
    Publication date: May 8, 2014
    Applicant: GENERAL ELECTRIC COMPANY
    Inventor: James Carter Bach
  • Publication number: 20140034633
    Abstract: Laminated resistive heaters comprising a carbon nanotube layer are described. The invention also includes methods of making laminated resistive heaters and applications using the resistive heaters.
    Type: Application
    Filed: November 17, 2011
    Publication date: February 6, 2014
    Applicant: BATTELLE MEMORIAL INSTITUTE
    Inventors: Amy M. Heintz, Katherine P. Mitchell, Brett R. Burton, Ioan I. Feier, Timothy J. Lastrapes, Beth Muszynski
  • Publication number: 20130292373
    Abstract: The present invention provides a heating element, including a transparent substrate, an adhesive agent layer provided on at least one side of the transparent substrate, a conductive heat emitting line provided on the adhesive agent layer, a coating film capsulating the conductive heat emitting line and an upper side of the adhesive agent layer not covered by the heat emitting line, a bus bar electrically connected to the conductive heat emitting line, and a power part connected to the bus bar, and a manufacturing method thereof.
    Type: Application
    Filed: July 3, 2013
    Publication date: November 7, 2013
    Inventors: Hyeon CHOI, Su-Jin KIM, Ki-Hwan KIM, Young-Jun HONG
  • Patent number: 8533938
    Abstract: In a resistance change memory (ReRAM) storing data by utilizing change in resistance of a resistance change element, a transistor T, interlayer insulating films, W plugs and the like are formed on a semiconductor substrate. Thereafter, a Pt film serving as a lower electrode of the resist change element is formed and a transition metal film (Ni film) is formed on the Pt film. After that, the surface of the transition metal film is oxidized to form a transition metal oxide film and a Pt film serving as an upper electrode is formed on the transition metal oxide film.
    Type: Grant
    Filed: June 18, 2009
    Date of Patent: September 17, 2013
    Assignee: Fujitsu Limited
    Inventors: Hideyuki Noshiro, Kentaro Kinoshita
  • Patent number: 8530802
    Abstract: A ceramic heater includes a heating resistor including a first conducting portion and a second conducting portion which face each other and a ceramic base in which the heating resistor is embedded. The first conducting portion includes a first burr which extends from the first conducting portion and is located between the first conducting portion and the second conducting portion. The second conducting portion includes a second burr which extends from the second conducting portion and is located between the second conducting portion and the first conducting portion. At least a part of the first and second burrs is spaced apart from the line linking a starting point of the first burr and a starting point of the second burr in a cross-section perpendicular to a conduction direction of the first and second conducting portions.
    Type: Grant
    Filed: March 26, 2008
    Date of Patent: September 10, 2013
    Assignee: Kyocera Corporation
    Inventor: Ken Yamamoto
  • Publication number: 20130220992
    Abstract: A transparent pane with a conductive coating is described. The transparent pane is electrically connected to an electrically heatable coating that extends at least over a part of the area of the pane and to at least two first electrodes provided for electrical connection to the two terminals of a voltage source. The heating field of the transparent pane includes at least one coating-free zone. The transparent pane also has at least one second electrode provided for electric connection to one terminal of the voltage source The supply section of the transparent pane consists of at least two supply parts separated from each other, and a coupling section, which is electrically connected to the heatable coating. A method for manufacturing the transparent pane is also described.
    Type: Application
    Filed: August 26, 2011
    Publication date: August 29, 2013
    Applicant: SAINT-GOBAIN GLASS FRANCE
    Inventors: Susanne Lisinski, Dang Cuong Phan, Günther Schall
  • Patent number: 8484832
    Abstract: There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: July 16, 2013
    Assignee: Nippon Mektron, Ltd.
    Inventor: Garo Miyamoto
  • Publication number: 20130146227
    Abstract: Devices and methods for fusing materials using a heating element, where the overall mass to be sealed varies along the length of the seal. According to the invention, the heating element has a different profile in different areas. According to some aspects, the thickness and/or cross section of the heating element is different in different areas so that when a current is passed through the heating element, each area heats to a different degree. In some aspects, the heating element is shaped to conform to the shape of the parts to be fused together. The transition between areas of different thickness or cross-sectional area, or between areas of different shape may be sharply defined. This abrupt transition may be created by machining the heating element to a finished shape rather than bending flat stock to shape.
    Type: Application
    Filed: December 7, 2012
    Publication date: June 13, 2013
    Inventor: Robert J. Mileti
  • Publication number: 20130020303
    Abstract: The present invention relates to a heating element and to a method for manufacturing same, and more particularly, to a heating element and to a method for manufacturing same wherein the heating element comprises a) a transparent substrate, and b) a conductive heating pattern formed on at least one surface of the transparent substrate, wherein the average distance between lines in a vertical direction of the conductive heating pattern is wider than the average distance between lines in a horizontal direction thereof. The heating element according to the present invention not only minimizes the side effects due to diffraction and interference phenomena of light but also exhibits superior heating performance at a low voltage while being invisible.
    Type: Application
    Filed: March 30, 2011
    Publication date: January 24, 2013
    Inventors: Sujin Kim, Ki-Hwan Kim, Young Jun Hong, Hyeon Choi
  • Patent number: 8336314
    Abstract: A nozzle arrangement for use in a gas thruster is presented. At least one heater micro structure (20) is arranged in a stagnation chamber (12) of the gas thruster. The heater microstructure (20) comprises a core of silicon or a silicon compound coated by a surface metal or metal compound coating. The heater microstructure (20) is manufactured in silicon or a silicon compound and covered by a surface metal coating. The heater microstructure (20) is mounted in the stagnation chamber (12) before or after the coverage of the surface metal or metal compound coating. The coverage is performed by heating the heater microstructure and flowing a gas comprising low quantities of a metal compound. The compound decomposes at the heated heater microstructure (20), forming the surface metal or metal compound coating. The same principles of coating can be used for repairing the heater microstructure (20) in situ.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: December 25, 2012
    Assignee: NanoSpace AB
    Inventors: Tor-Arne Gronland, Pelle Ransten, Hakan Johansson, Johan Bejhed
  • Publication number: 20120298804
    Abstract: An electrothermal heater mat (3) is provided for an ice protection system for an aircraft (1) or the like. The heater mat (3) is a laminated heater mat and comprises dielectric layers (50-58), a heater element (501) and a temperature sensor (507). Each dielectric layer (50-58) comprises thermoplastic material, and the temperature sensor (507) comprises a sprayed metal track (5010, 5012) deposited on a substrate (50, 5019) comprising thermoplastic material. The substrate may be one of the dielectric layers (50) or a separate carrier (5019) which is smaller than the dielectric layers (50-58).
    Type: Application
    Filed: January 31, 2011
    Publication date: November 29, 2012
    Inventors: Stuart Martin Lewis, Peter English, Nicholas John Winter
  • Patent number: 8304701
    Abstract: A resistive heating element 30 has a higher molybdenum carbide content in a central portion 35 than in a peripheral portion 34. Since molybdenum carbides have a low temperature coefficient of resistance compared to molybdenum, the amount of heat generated in the central portion 35 of the resistive heating element 30 does not increase as much as in the peripheral portion 34 even when the temperature is increased, and the increase in difference in temperature between the peripheral portion 34 and the central portion 35 can be suppressed. In other words, generation of hot spots near the center can be suppressed and a good uniform heating property in a wide range of operation temperatures can be obtained.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: November 6, 2012
    Assignee: NGK Insulators, Ltd.
    Inventors: Yuji Akatsuka, Yoshinobu Goto
  • Publication number: 20120274413
    Abstract: A monolithic power splitter is used to split a pair of input differential signals into two pairs of output differential signals in the present invention. The monolithic power splitter has two input terminals to receive a pair of input differential signals, and it has two one-by-two power splitters integrated in one single chip to split a pair of input differential signals into two pairs of output differential signals with equal power. And, the monolithic power splitter has four output terminals to output two pairs of output differential signals. In one embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on the same surface of the substrate. In another embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on opposite surfaces of the substrate. The monolithic power splitter can be used as a power combiner based on the reciprocal property of the power splitter circuit.
    Type: Application
    Filed: April 29, 2011
    Publication date: November 1, 2012
    Applicant: CYNTEC CO., LTD.
    Inventor: Shih-Hsien Tseng
  • Patent number: 8299371
    Abstract: A circuitized substrate and method of making same in which quantities of thru-holes are formed within a dielectric interposer layer. The substrate includes two printed circuit board (PCB) layers bonded to opposing sides of the interposer with electrically conductive features of each PCB aligned with the interposer thru-holes. Resistive paste is positioned on the conductive features located adjacent the thru-holes to form controlled electrically resistive connections between conductive features of the two PCBs. A circuitized substrate assembly and method of making same are also disclosed.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: October 30, 2012
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, John M. Lauffer, Voya R. Markovich, James J. McNamara, Jr.
  • Publication number: 20120261404
    Abstract: The present invention provides a heating element, including a transparent substrate, an adhesive agent layer provided on at least one side of the transparent substrate, a conductive heat emitting line provided on the adhesive agent layer, a coating film capsulating the conductive heat emitting line and an upper side of the adhesive agent layer not covered by the heat emitting line, a bus bar electrically connected to the conductive heat emitting line, and a power part connected to the bus bar, and a manufacturing method thereof.
    Type: Application
    Filed: December 29, 2010
    Publication date: October 18, 2012
    Inventors: Hyeon Choi, Su-Jin Kim, Ki-Hwan Kim, Young-Jun Hong
  • Publication number: 20120244728
    Abstract: A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. A socket substrate is provided with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are attached to the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pads to electrically and mechanically couple the electrical interconnect to the PCB.
    Type: Application
    Filed: March 13, 2012
    Publication date: September 27, 2012
    Applicant: HSIO TECHNOLOGIES, LLC
    Inventor: JAMES RATHBURN
  • Patent number: 8261431
    Abstract: A method for manufacturing a thermal head, including: forming a resistance heating element and an electrode on an insulating substrate, the resistance heating element emitting heat by a current flowing the resistance heating element, the electrode being connected to the resistance heating element; forming a corrosion prevention layer on the resistance heating element and the electrode; annealing the resistance heating element; adjusting an electrical resistance of the resistance heating element; and forming a protective layer on the corrosion prevention layer, the protective layer having glass as a main component. The annealing is implemented prior to the adjusting. The forming the corrosion prevention layer is implemented prior to the annealing.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: September 11, 2012
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Hokuto Electronics Corporation
    Inventors: Daiki Iino, Masato Sawada, Atsunori Ando, Shigenori Kitamura, Taro Asakura
  • Patent number: 8256099
    Abstract: The manufacturing method for a thermal head includes: forming a hollow concave portion and a marking concave portion having a depth larger than a depth of the hollow concave portion on one surface of a thin plate glass; a bonding step of bonding a supporting plate onto the one surface of the thin plate glass, in which the hollow concave portion and the marking concave portion are formed in the concave portion forming step; a thinning step of thinning the thin plate glass onto which the supporting plate is bonded in the bonding step until the marking concave portion extends through the substrate from a side of a back surface opposite to the one surface; and a heating resistor forming step of forming a heating resistor on the back surface of the thin plate glass thinned in the thinning step so as to be opposed to the hollow concave portion.
    Type: Grant
    Filed: October 19, 2009
    Date of Patent: September 4, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Noriyoshi Shoji, Norimitsu Sanbongi, Yoshinori Sato, Toshimitsu Morooka, Keitaro Koroishi
  • Patent number: 8240027
    Abstract: A method of making a circuitized substrate which involves forming a plurality of individual film resistors having approximate resistance values as part of at least one circuit of the substrate, measuring the resistance of a representative (sample) resistor to define its resistance, utilizing these measurements to determine the corresponding precise width of other, remaining film resistors located in a defined proximity relative to the representative resistor such that these remaining film resistors will include a defined resistance value, and then selectively isolating defined portions of the resistive material of these remaining film resistors while simultaneously defining the precise width of the resistive material in order that these film resistors will possess the defined resistance.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: August 14, 2012
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Frank D. Egitto, John S. Kresge, John M. Lauffer
  • Patent number: 8230586
    Abstract: A method of cooling a resistor is provided. The method includes forming a first electrical insulator having a high thermal conductivity in thermal contact with an electrically resistive pathway and forming a substrate adjacent the electrical insulator. The method further includes forming a first electrical conductor having a high thermal conductivity within the second substrate and in thermal contact with the electrical insulator.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: July 31, 2012
    Assignee: International Business Machines Corporation
    Inventors: Douglas D Coolbaugh, Ebenezer E Eshun, Terence B Hook, Robert M Rassel, Edmund J Sprogis, Anthony K Stamper, William J Murphy
  • Patent number: 8228160
    Abstract: A high-temperature sensor element includes at least one thermistor element having at least two contact areas and one contacting element including an isolating ceramic base body and at least two conductor lines. The contact areas of the thermistor element are connected to the conductor lines of the contacting element by an electro conductive bridge. A process for assembling a sensor element is also described in which an thermistor element is connected by a temperature resistant junction to a contacting element, and in which the thermistor element and part of the contacting element adjacent to the thermistor element are sealed by a encapsulation compound.
    Type: Grant
    Filed: November 5, 2009
    Date of Patent: July 24, 2012
    Assignee: EPCOS AG
    Inventors: Gerald Kloiber, Norbert Freiberger
  • Patent number: 8222968
    Abstract: A method for manufacturing a microstrip transmission line device includes forming a resistor layer on an insulating or dielectric substrate having a back face where a metal layer to be grounded is provided. The method also includes removing the formed resistor layer except for a part of the formed resistor layer which requires a resistor. Further, the method includes forming a metal conductive layer on the remaining part of the resistor layer. The metal conductive layer contacts the substrate. The method additionally includes removing the formed metal conductive layer at a part required as a resistor except for a part required for connection to the resistor, the parts being included at the remaining part of the resistor layer.
    Type: Grant
    Filed: February 1, 2007
    Date of Patent: July 17, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Kazutaka Takagi
  • Patent number: 8198978
    Abstract: The invention relates to a film resistor (1) comprising a carbon-containing material (3) into which clusters (4) of conductive cluster material are introduced, wherein the conductive cluster material has a positive temperature coefficient. The clusters (4) are surrounded by a graphite casing and embedded in the carbon-containing material (3). Furthermore, the cluster material is present in a thermodynamically stable phase.
    Type: Grant
    Filed: April 6, 2009
    Date of Patent: June 12, 2012
    Assignees: Hochschule fur Technik und Wirtschaft des Sarlandes, Siegert Thinfilm Technology GmbH
    Inventors: Günther Schultes, Dirk Göttel, Ralf Koppert, Olivia Freitag-Weber, Ulf Werner, Wolfgang Brode
  • Patent number: 8166814
    Abstract: A flow sensor may be formed by bonding a sensor chip formed with a flow rate detecting part and a flow path-forming member that is provided on the sensor chip and is formed with a flow path for a fluid flowing in the flow rate detecting part to each other on the upper surface of a substrate. The flow path-forming member may be formed by bonding a transparent first flow path forming member and a second flow path-forming member to each other. The first flow path forming member has a plate shape, and is provided with an inflow port and a outflow port for the fluid to be measured, and the second flow path forming member has a plate shape, and is provided with a through hole that forms the flow path along the flow of the fluid flowing along the flow rate detecting part.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: May 1, 2012
    Assignee: Yamatake Corporation
    Inventors: Shinichi Ike, Hiroshi Hatakeyama, Satoshi Tsuchiya
  • Publication number: 20120086541
    Abstract: A solid-core surge arrester includes a module assembly. The module assembly includes at least one metal oxide varistor (MOV) disk with an outer circumferential surface, and a material applied to the outer circumferential surface. The material includes multiple layers to allow the module assembly to withstand a bending moment under an approximately continuously applied load, and the material is configured to allow venting of gas that forms in the module assembly in a preferential direction.
    Type: Application
    Filed: October 6, 2011
    Publication date: April 12, 2012
    Applicant: COOPER TECHNOLOGIES COMPANY
    Inventor: Jeffrey J. Kester