Abstract: A high stability, high resistance metal film resistor having layered metallic films deposited and annealed such that one layer has a positive TCR and a negative TCR Slope, while a second layer has a negative TCR and a positive TCR Slope, thereby yielding a resistive film having TCR and a TCR Slope approaching zero.

Abstract: A method for forming a plurality of electrically conductive circuits of at least four laminations on a single base board having copper laminations attached on both sides thereof, for example, wherein the base board is processed to provide a through-hole therein, subjected to a catalyst treatment, etched to provide a plurality of circuits of a first lamination, effectively processed with a plating-resistant resist and an electrically conductive copper paste to provide a circuit of a second lamination on the circuits of the first lamination by making a pre-plating treatment and a subsequent chemical treatment applied to the copper paste.

Abstract: A voltage non-linear resistor excellent in varistor voltage characteristics, lightning discharge current withstanding capability and life performance against applied voltage comprises a disc-like voltage non-linear element and a thin insulating covering layer integrally provided on the side surface of said element. In the resistor according to the invention, said element comprises zinc oxides as main ingredient, 0.1-2.0% bismuth oxides, as Bi.sub.2 O.sub.3, 0.1-2.0% cobalt oxides, as CO.sub.2 O.sub.3, 0.1-2.0% manganese oxides, as MnO.sub.2, 0.1-2.0% antimony oxides, as Sb.sub.2 O.sub.3, 0.1-2.0% chromium oxides, as Cr.sub.2 O.sub.3, 0.1-2.0% nickel oxides, as NiO, 0.001-0.05% aluminum oxides, as Al.sub.2 O.sub.3, 0.005-0.1% boron oxides, as B.sub.2 O.sub.3, 0.001-0.05% silver oxides, as Ag.sub.2 O and 7-11% silicon oxides, as SiO.sub.2, and said layer comprises 45-60% silicon oxides, as SiO.sub.2, 30-50% zinc oxides, as ZnO, 1-5% bismuth oxides, as Bi.sub.2 O.sub.

Abstract: A method is described for producing multilayer circuits including a resistor circuit on one side of a copper laminated base board, wherein the base board is etched to provide a plurality of circuits of a first layer, effectively processed with a plating-resistant resist and an electrically conductive copper paste to form a plurality of circuits of a second layer, immersed in a metal plating solution to provide a metal plating layer on the copper paste to thereby form the circuits of the second layer on the circuits of the first layer, coated with an electrically conductive paste to provide a pair of electric terminals between two of the circuits of the second layer, and coated with an electrically resistant resist of a predetermined electric resistance value on a part extended between the two electric terminals.

Abstract: The invention relates to a method of manufacturing a device in which a homogeneous electrical resistance layer of a resistive material having 10 ohm.cm is formed on an insulating substrate. According to the invention a stable binder-free suspension containing ruthenium hydroxide and glass particles is provided on the insulating substrate from which a ruthenium oxide-containing electrical resistance layer is formed by heating. The method according to the invention may be used successfully, for example, in the manufacture of cathode ray tubes.

Abstract: The adjustment of the temperature coefficient of resistance (TCR) of a thick film resistor by laser annealing is disclosed. The thick film resistor is fired for a controlled time and temperature sufficient to burn off the organic material in the resistive paint, and to provide an initial adjustment of the (TCR), but prior to obtaining the desired (TCR) range. The resistor is then laser annealed to controllably adjust the (TCR) of the resistor within the desired (TCR) range. The fixture used to hold the substrate during laser annealing is preferably controllably heated to avoid thermal shock to the resistor during laser annealing. A microprocessor is preferably used to monitor the (TCR) during the laser annealing process. At least one of the laser scan speed, laser beam diameter, laser beam power, and number of annealing passes are used to controllably adjust the resistor (TCR) to within the desired (TCR) range.

Abstract: There is provided a soluble chemical layer affixed to a rigid backing, whereupon an electronic configuration is printed and covered with a lacquer. The pattern and lacquer coating are then separated from the backing by dissolving the soluble chemical. Once free, the pattern is transferred to and fused to the substrate.

Abstract: A thick film resistor composition, comprising a silicide powder composed of a molybdenum disilicide, a tantalum disilicide and a magnesium silicide, and an alkaline earth borosilicate glass powder dispersed in a vehicle containing a heat-depolymerizing organic polymer. The thick film resistor composition, employing this heat-depolymerizing organic polymer, can be fired in a nonoxidizing atmosphere and coexist with base metal materials such as copper electrodes. Owing to the Nb.sub.2 O.sub.5 and Ta.sub.2 O.sub.5 contained in the alkaline earth borosilicate glass powder, the thick film resistor composition is free from sheet resistivity fluctuation, according to resistor length, which would result from diffusion of the electrode material into the resistor.

Abstract: The rate of production of chip resistors is greatly increased by forming rows of chip resistors on a substrate, laser trimming the rows of resistors while still on the substrate, breaking up the substrate into separate rows of chip resistors, applying edge-around terminations to each of the separated rows of the chip resistors and separating the chip resistors from each other.

Abstract: A process for delineating a vertical resistor on a semiconductor device is disclosed. Resistive and diffusion barrier layers are deposited and then etched, first by dry plasma and then by wet bath. The two step etching allows complete removal of the deposited layers with minimal damage to exposed dielectric, silicide, polysilicon or doped regions on the semiconductor.

Abstract: A hybrid integrated circuit substrate comprising an insulating substrate. On predetermined positions of the upper surface of the substrate, there are formed cermet resistors and activation layers to be in contact with ends of the resistors. On predetermined positions of the upper surface of the activation layers, there are formed conductor layers electrically connected with the ends of the resistors through the activation layers. The activation layers are formed from an activation paste containing a catalytic metal for enabling deposition in electroless plating in glass ingredients for attaining adhesion with the insulating substrate upon firing. Electrical connection between the conductor layers and the cermet resistors occurs through the activation layers by ohmic contact effected between the cermet resistors and the conductor layers through diffusion layers formed upon firing the activation paste.

Abstract: Disclosed is a thermal head and a method of manufacturing the same, in which a heating portion provided with at least a heating resistor film, a conductor film and a protection film and formed on a substrate having a center-raised stripe and made of an electrically insulating material having anisotropy or selectivity with respect to etching is integrated with a lead wire portion separate from the heating portion and having lead wires formed on an electrically insulating substrate by connecting conductors of the heating portion with respective and corresponding ones of the lead wires of the lead wire portion.

Abstract: In a thin film resistor substrate for a thermal ink jet printhead, there is provided an elongated ink feed slot for supplying ink to a plurality of heater resistors on the substrate. Ink flows from this slot vertically through the substrate and then laterally along predetermined ink flow paths in an orifice plate and barrier layer members to ink reservoirs above the heater resistors. In this manner ink flow pressure drops to all of the reservoirs are equal and thereby enhance ink pressure control for all of the reservoirs.

Abstract: In the manufacture of an electrical strain gauge the strain-responsive circuit element is formed from a thin film deposit on a surface of a metal substrate on which an insulating film has already been deposited. Connections are made directly to the circuit element by the ends of conductor leads that are bonded into insulating plugs in apertures in the substrate. The plugs and the insulating film are glasses to which the substrate and the circuit element are bonded. A further glass layer encapsulates the circuit element. As a result a very robust form of gauge is provided that can be used in high temperatures and in chemically active environments.

Abstract: A high density miniature sensor circuit useful for measuring pressure changes in a fluid in a closed chamber, comprising a high density of resistor segments gapped about 0.002 inches and conductors as contact pads which conductors are permanently affixed to a ceramic substrate is disclosed.

Abstract: A method of adjusting the values of resistors is described wherein regions of a resistive layer provided on a substrate are removed by means of a laser in dependence on the resistance that is required and/or by cutting marks of a specific shape into the resistive layer. In order to obtain resistors with values which are defined as accurately as possible, and which are free of disturbing inductivity, a point raster is formed in the resistive layer by means of single shots of the laser, with the extent and position of the raster, and/or the spacing between its individual points, and/or the size of the individual points being chosen in relation to the total area of the resistive layer in dependence on the required resistance and further physical values.

Abstract: The invention is directed to a thick film resistor composition for firing in a low oxygen-containing atmosphere comprising finely divided particles of (a) a semiconductive material consisting essentially of a refractory metal carbide, oxycarbide or mixtures thereof and (b) a nonreducing glass having a softening point below that of the semiconductive material dispersed in (c) organic medium and to resistor elements made therefrom.

Abstract: An electrical resistor of resistivity of less than about 600 ohms per square and with a temperature coefficient of resistance within the range of .+-.200 ppm/.degree.C. comprises an insulating substrate, electrically conductive terminations on a surface of the substrate, and a layer of resistor material on the surface of the substrate and in contact with the terminations. The resistor material comprises from about 25 to about 35% by weight glass and from about 50% to about 75% by weight conductive particles. Preferably the conductive particles consisting essential of tin oxide and at least about 0.2% by weight of ruthenium containing material, expressed as RuO.sub.2. The mass ratio of ruthenium containing material (as RuO.sub.2) to tin oxide is less than 7:93.

Abstract: A method of forming chip resistors in which a resistive coating is applied to an insulating substrate which is subsequently divided up into single chip components includes the step of providing end terminations for the individual chip resistors before the sheet is divided up. This is achieved by forming a hole 13 in the substrate 11 at the position of each end termination and then coating the holes with an electrically conductive material 14 which electrically connects with the adjacent region of the resistive coating 12. In order to improve the solderability and the reliability of the end terminations the holes 13 may be filled with solder 15. The electrical value of the resistive element coating may then be adjusted to a precise value by trimming away some of the resistive element material with a laser. Finally, the substrate is divided up into the single chip resistor components.

Abstract: This invention relates to thick film base metal resistive paints for firing on a substrate to form a resistor having a temperature coefficient of resistance within .+-.100 ppm/.degree.C., while providing a means to selectively blend the resistive paint to provide a wide range of decade resistivities from less than 10 ohms/square to more than 1K ohms/square. The sheet resistance and TCR are controlled by mixing a glass frit from at least one of a first and second glass material; with TiSi.sub.2 ; and at least one of Ti.sub.5 Si.sub.3 and AL.sub.2 O.sub.3 ; and a screening agent, for subsequent screening onto a substrate and firing in an inert atmosphere at a peak temperature of about 900.degree. C. The first glass material comprises, by weight, 5 to 10% SiO.sub.2 ; 30 to 50% BaO; 40 to 60% B.sub.2 O.sub.3 and 1 to 5% CuO. The second glass material comprises, by weight, 50 to 70% B.sub.2 O.sub.3 ; 25 to 45% SrO; and 2 to 10% SiO.sub.2.

Abstract: Miniature thermal fluid flow sensors of the airfoil type are made in batch form by forming the thermal fluid flow sensors on a thin sheet of material and bonding the sheet over an array of duct structures and dicing the individual sensors and duct structures apart. In another embodiment, thin carrier sheet portions of a wafer bearing the thermal fluid flow sensors of the airfoil or grid type are supported by surrounding frame portions of the wafer. The wafer is diced to separate the individual sensing chips. The respective chips are mounted across respective fluid flow ducts. For the airfoil type sensor, portions of the frame are broken away for undisturbed flow over the thin carrier and sensor. In one thermal flow sensor configuration, a flow heater is disposed in between first and second thermal flow sensors in heat exchanging relation therewith.

Abstract: A thick film resistance element is disclosed which is especially suited for use on hybrid circuit subassemblies, which resistance element includes both coarse and fine adjustment, such as by laser beam trimming operation. The resistance element includes a first segment having a given resistance value per unit area and a second segment abutting the first segment along one edge thereof. The second segment includes a resistance material with a differing resistance value per unit area than exhibited by such first segment. In the trimming operation, a laser beam cuts a longitudinal slot in the segment with the higher resistance point below the desired value. The laser beam then cuts a similar longitudinal slot in the other segment to a point where the desired resistance value is obtained.

Abstract: A mass gas flow sensor for measuring the mass flow rate of a gas through a passage, and a method of manufacture thereof. The sensor includes a substrate having a streamlined end surface which is to project upstream in the passage, upstream and downstream heating resistors formed on the substrate, protective films covering the resistors, and circuitry for applying current to the resistors so as to heat the resistors, the gas cooling the upstream resistor more than the downstream resistor. The circuitry also produces an electrical voltage responsive to differences in voltage across the upstream and downstream resistors, corresponding to the mass gas flow in the passage.

Abstract: A thin-film strain gauge and a method for producing it are proposed; the strain gauge is advantageously capable of integration into a thin-film circuit. The strain gauge comprises an elastically deformable spring element in combination with at least one elongation-sensitive resistor. The resistor disposition (R1-R4), the low-impedance connections (L11-L42) between the various resistance regions and the associated connection tracks (L5-L8) are applied in a vacuum process, preferably by cathode sputtering. The low-impedance connections (L11-L42) and the connection tracks (L5-L8) are of material which, although different from the material making up the actual resistance region, still has approximately the same temperature coefficient of resistance, so as to preclude errors caused by temperature.

Abstract: The invention is directed primarily to a method of doping tin oxide with Ta.sub.2 O.sub.5 and/or Nb.sub.2 O.sub.5 using pyrochlore-related compounds derived from the system SnO--SnO.sub.2 --Ta.sub.2 O.sub.5 --Nb.sub.2 O.sub.5 for use in thick film resistor compositions. The invention is also directed to thick film resistors containing the above-described pyrochlore-related compounds and to various compositions and methods for making such thick film resistors.

Abstract: A potentiometric linear position sensor including a housing (10) made of extruded aluminum which may be cut to preferred lengths (15). The sensor includes a Kapton film substrate (32) having first a uniform coating of resistive material (34) disposed thereon, and then distinct islands formed by laser sculpting. Conductive material (50, 53, 55, 56, 57, 58), screen printed upon the resistive material before or after the laser sculpting, is connected to terminals (62, 68, 70) for the respective electrical elements (48, 51, 55). The flexible Kapton film substrate (32) is inserted endwise into the housing (10) with the side edges of the substrate curled upwardly and captured within longitudinal housing slots (28, 29) disposed along opposite housing walls (14, 16).

Abstract: An array of electrically interconnected spaced electrical components on an apertured substrate wafer, each component being connected to terminal conductor pads on one surface of the substrate and to terminal conductor pads on the opposite surface of the substrate by thick film conductor strips which extend along the walls of the apertures is disclosed.

Abstract: Thick film resistor composition which is a dispersion of (a) a conductive phase of a nonprecious metal pyrochlore and SnO.sub.2, (b) inorganic binder and (c) CoCrO.sub.4 and/or NiCrO.sub.4 in (d) organic medium. The metal chromate functions as a TCR driver.

Abstract: The invention is directed primarily to a method of doping tin oxide with Ta.sub.2 O.sub.5 and/or Nb.sub.2 O.sub.5 using pyrochlore-related compounds derived from the system SnO-SnO.sub.2 -Ta.sub.2 O.sub.5 -Nb.sub.2 O.sub.5 for use in thick film resistor compositions. The invention is also directed to thick film resistors containing the above-described pyrochlore-related compounds and to various compositions and methods for making such thick film resistors.

Abstract: A resistor sheet input tablet comprising two rectangular resistor sheets each provided at two opposite edges thereof with electrodes, the rectangular resistor sheets being superposed such that the electrodes on one of the resistor sheets lie perpendicularly to those on the other resistor sheets, wherein the resistor sheets have a two resistor layer construction comprising (a) a main resistor layer consisting of a thin metal film deposited thereon which in turn is bonded to (b) an electrically insulating layer and (c) a protective resistor layer formed on the surface of the main resistor layer.

Abstract: A copper-containing thick film conductor composition comprising a mixture of finely divided particles of (a) a conductive material containing copper metal, (b) inorganic binder and (c) 0.2-5% wt. of a noncuprous metal selected from the group consisting of tungsten, molybdenum, rhenium and alloys and mixtures thereof all dispersed in organic medium. The metal particles must be within certain narrow ranges of particle size.

Abstract: Resistor composition comprising an admixture of finely divided particles of (a) ruthenium-based conductive material, (b) inorganic binder and (c) cobalt ruthenate.

Abstract: A composition for making electrical resistance elements including a conductive component which comprises(a) a precious metal oxide of the formula A'.sub.1-x A".sub.x B'.sub.1-y B".sub.y O.sub.3, wherein when A' is Sr; A" is one or more of Ba, La, Y, Ca and Na, and when A' is Ba, A" is one or more of Sr, La, Y, Ca and Na; B' is Ru; B" is one or more of Ti, Cd, Zr, V and Co, O<x<0.2; O<y<0.2;(b) a binder component which comprises(i) between 40 weight percent and 75 weight percent C', wherein C' is SrO when A' is Sr, C' is BaO when A' is Ba, and C' is SrO+BaO when A' is Sr and A" is Ba and when A' is Ba and A" is Sr,(ii) between 20 weight percent and 35 weight percent B.sub.2 O.sub.3,(iii) between 2 weight percent and 12 weight percent SiO.sub.2, and(iv) between 0.5 weight percent and 6.5 weight percent ZnO. The method of the present invention includes mixing the conductive component and binder as described above with an organic vehicle.

Abstract: The process is for manufacturing an electric circuit which comprises an electric element for firing a pyrotechnic device, in which a sheet (1) made from an electrically resistant material is fixed to an electrically insulating support (3), and in which two conducting zones (12a, 12b) separated by an electrically resistant element (13) are then etched on this sheet.This process comprises the following steps:a fine nickel layer and then a fine copper layer are applied to the sheet (1), after which;a hole (7) is pierced through the assembly,a fine copper layer is deposited on the assembly, a protecting mask is deposited in the openings etched in the resistive sheet, a copper layer (10) then a tin-lead layer are deposited in the hole (7) and on both faces of the assembly,the protecting mask is removed and the fine copper layer which was protected by the mask is stripped by chemical action and,the external tin-lead layer is removed by chemical action.

Abstract: A resistor having of an insulating substrate bearing a thin layer of the alloy CrSi.sub.x, where 1.ltoreq.x.ltoreq.5 and which layer is doped with nitrogen. The doping may be spread homogeneously throughout the thickness or be concentrated in one or two thickness zones on the outside and/or on the side adjoining the substrate. As a result of the nitrogen doping an improvement of the stability of the resistor is obtained.

Abstract: The disclosed oxygen sensor comprises a plate-like oxygen pump element with electrodes, a plate-like oxygen concentration cell element having electrodes disposed in parallel alignment with those of said pump element, and an intermediate board disposed between said two elements and having a hole defining a cavity between electrodes of said two elements, said intermediate board further having passages bored therethrough so as to communicate said cavity to outside of said oxygen sensor.

Abstract: The disclosed oxygen sensor includes three plate-like elements disposed in parallel and a heater, i.e., an oxygen pump element with electrodes and said heater disposed adjacent thereto, an oxygen concentration cell element with electrodes, and an insulating board disposed between the first two elements and having a hole bored therethrough at a position between the opposing electrodes of the first two elements so as to define a cavity therebetween, said insulating board further having at least one passage communicating said cavity to outside of said oxygen sensor.

Abstract: A novel construction for a thick film resistor is disclosed. A substrate has a first face deposited with a layer of resistive material. Between the substrate and this first layer is located a strip of conductive material. The strip of material is oriented at approximately right angles to the current path through the first layer, midway along the current path. A second layer of resistive material is located on a second face, parallel to the first face, and the first and second layers are connected electrically in series such that the current path through the second layer is orthogonal to the current path through the first layer.

Abstract: Electrical resistance heating element including a number of metal strips arranged in a meander-like pattern. In the resistance metal strips, which are made from a non-expensive base sheet material like lead, there is incorporated at least one fuse which will operate if the heat transfer from a randomly placed area of critical size (a critical area) is substantially blocked. The fuse or fuses are preferably constituted by a lead/tin alloy rolled into intimate contact with the lead base material.

Abstract: An electrical resistor and method of making the same is disclosed wherein a ceramic substrate is coated with a relatively rough dielectric film which is subsequently coated with a thin metal film such as nichrome.

Abstract: A method for forming a thermal printing head comprising a base of electrically insulating material, a glaze layer formed on said base so as to form an elongated projection thereon, said glaze layer comprising a main portion and a portion integral with and extending from said main portion, at least one thermal printing element formed on said main portion of said glaze layer, and an area formed in said extending portion of said glaze layer to relieve said glaze layer of surface tension when glaze is sintered and then cooled to form said glaze layer on said base.

Abstract: An improved polycrystalline silicon resistor having limited lateral diffusion, integrated circuits containing such resistors, and a method of their preparation is disclosed. The polysilicon resistor is formed by first doping the polysilicon layer with a p or n type impurity and thereafter neutralizing the treated layer with impurities of the other type so as to form a device wherein the concentration gradient between the resistor region of the aforesaid layer and its environment is low. The low concentration gradient reduces lateral diffusion during manufacture, thereby permitting manufacture of integrated circuits of higher circuit density and resistors with smaller dimensions, lower temperature coefficients and higher reliability.

Abstract: An array of electrically interconnected spaced electrical components on an apertured substrate wafer, each component being connected to terminal conductor pads on one surface of the substrate and to terminal conductor pads on the opposite surface of the substrate by thick film conductor strips which extend along the walls of the apertures is disclosed.

Abstract: Methods for producing thermistors having predetermined resistance values at predetermined temperatures are disclosed.

Abstract: A heat generating element particularly well suited for use in an electrical space heater and method of making same include an electrically nonconductive substrate on which is coated a layer of an electrically nonconductive ceramic material having finely divided, micron size metallic particles dispersed therein. A path of electrical conductivity is established in the otherwise nonconductive ceramic material by burnishing the surface of the ceramic material between two separated points. Thus, as electrical current flows along the burnished path, heat will be generated due to the electrical resistance thereof.

Abstract: Methods for adjusting the resistance of temperature measuring sensors are disclosed, including measuring the resistance for a first heat-sensitive portion of the sensor at a first predetermined temperature, measuring the resistance for a second heat-sensitive portion of the temperature measuring sensor at a second predetermined temperature, determining the overall resistance for the temperature measuring sensor from these measured values, and adjusting the resistance of the second heat-sensitive portion so that the overall resistance for the temperature measuring sensor substantially corresponds to the predetermined resistance value.

Abstract: A precision resistor using a resistance metal film etched into a long serpentine strip cemented to a substrate. This substrate is a composite of rigid materials and plastics. The composite thermal coefficient of expansion of the substrate is given a non-linearity which in turn induces a stress related non-linear resistance change in the cemented film when the temperature changes. This stress-induced non-linear change is of approximately the same shape as the inherent non-linearity of the resistance versus temperature of the metal film, but opposite in polarity, over a wide range of resistor operating temperatures. Over the range, a much closer approximation to complete temperature compensation is obtained than previously.

Abstract: A thick film cermet thermistor having a low to moderate electrical resistivity but high resistance to abrasion and humidity is disclosed. The thermistor composition has a sintering aid and a sealing glass that soften at significantly different temperatures. The thermistor film is sintered after application to a substrate predominantly between the two softening point temperatures. Sintering temperature is raised above the higher softening point temperature long enough to glaze the thick film and bond it to the substrate but not long enough to substantially increase film resistance. A composition is disclosed that can be sintered under the same firing conditions for resistor and conductor films, permitting one firing to be used to sinter all three types of films.

Abstract: A crossover construction of a thermal-head is which the thermal-head comprises: a substrate of insulating material; a plurality of heat elements disposed side by side in one row on said substrate; a plurality of lower thin film conductor patterns each of which connects to each of said heat elements and extends in direction X; an insulating layer disposed over said lower conductors; a plurality of upper conductor patterns disposed in parallel in another direction Y on said insulating layer so as to form a crossover on said substrate, said upper and lower conductors being selectively connected together through openings of said insulating layer, wherein said insulating layer and said upper conductors comprise printed and cured paste of insulating material and conductive material, respectively, each paste being of the low temperature curing type which can be cured at a temperature low enough not to affect the resistance of said thin film lower conductors, and a metallic layer of low resistance is coated on each o

Abstract: A method of regulating the valve of the resistance of a thick film resistive element. The resistive element comprises a resistive film (25) which bears on its edge two connection terminals (21, 22) and a connecting bar (24). The variation of the resistance is obtained by forming a slot (23) between the terminals, the slot being substantially perpendicular to the connection bar which connects the two parts of the resistive film separated by the said slot.