Abstract: A resistance element, a capacitor and an intermediate electrode are formed on a substrate. The capacitor and the resistance element are connected with the intermediate electrode interposed. Two terminal electrode portions are connected to each other through the intermediate electrode.

Abstract: The electronic component of the present invention includes: an element having an internal electrode therein; an external electrode formed on an end portion of the element where an end face of the internal electrode is exposed; and a protection layer formed on the entire surface of the element except for the end portion of the element, wherein the protection layer is made of a metal oxide.

Abstract: A process is provided for producing a sensor arrangement for measuring temperature with a temperature-sensitive measuring resistance element which has a thin, metallic resistance layer electrically-insulated toward the outside on a ceramic substrate and free-lying contact surfaces, which are connected electrically-conducting and directly mechanically fast with high-temperature-resistant conductor strips, electrically insulated from one another, on a ceramic board. The measuring resistance element is bonded and fastened on one end of the board by laying it on a still moist thick-film conducting paste printed on immediately before outfitting on the board and subsequently burning it in. On the end of the board away from the measuring resistance element, contact surfaces for connection of a plug or cable are arranged. The temperature sensor, a standard component in the form of a flat measuring resistance element, is applied wirelessly as an SMD component on the ceramic board.

Abstract: A resistor may be embedded into a substrate. A portion of the resistor may be exposed, by segmenting the substrate, for instance, so that the resistor may be trimmed to a desired resistance level. Alternatively, a portion of a resistor may be embedded into a substrate, with another portion of the resistor being disposed on the outer surface of the substrate. The portion of the resistor on the outer surface may be trimmed to adjust the resistance of the resistor to a desired level.

Abstract: A method for providing a resistive focusing lens structure for an electron beam device including forming a suspension of particles of a mixture of, by weight, of about 33-50% of an oxidic conductive material including about 40-60% of a lead ruthenate, about 25-38% of a lead titanate and about 2-15% of a ruthenium oxide, and of about 50-67% of a glass including about 30-40% of silicon dioxide (SiO.sub.2), about 3-7.5% alumina (Al.sub.2 O.sub.3), and about 53-67% of lead oxide (PbO) in a suspending medium consisting essentially of a non-acidic liquid having a boiling point of less than 150.degree. C., applying the suspension to an inside surface of a glass member to thereby provide a coating of the particles on the inside surface, firing the coating at a temperature of 700-900.degree. C. and before of after firing the coating, patterning the coating. The present method provides highly reproducible resistive focusing lens structures.

Abstract: A multi-chip module or other electronic semiconductor component (1) contains a multi-layer substrate (9) whose bottom surface, the bottom of the bottom layer (15) of that substrate, serves as the bonding surface for bonding the multi-chip module or component to a printed wiring board (8) using a thermally sensitive adhesive, such as a thermally sensitive adhesive or solder. The bottom layer (15) of that multi-layer substrate integrally includes a plurality of electrical heaters (16-28), arranged side by side. When energized with appropriate current, the heater generates sufficient heat to weaken the adhesive bond, allowing the MCM to be pulled away from the printed wiring board and removed, without weakening the bonding of the multiple layers of the laminate substrate or weakening the MCM component's bond to that substrate.

Abstract: The structure of the sensing element of a platinum resistance thermometer and method for manufacturing the same, in which the silicon wafer is used as a substrate. A silicon substrate is etched to form a desired wiring pattern, then a silicon dioxide layer is grown as a layer of thermal oxide on the silicon substrate by heating the etched substrate in an oxygen-containing atmosphere. After a platinum film is deposited onto the surface of the silicon dioxide layer, the platinum-coated substrate is subject to gentle polishing. The platinum membrane outside the etched groove is easily detached while the platinum layer inside the etched groove remains attached. Thus a platinum circuit with a desired circuit pattern is formed on the substrate. After heat treatment in a temperature range of 750.degree. C..about. 1500.degree. C. and further processing, the sensing element of a platinum resistance thermometer is obtained.

Abstract: A chip-like network resistor is disclosed which is reduced in variation in resistance of terminal electrodes. A substrate (1) is formed on both ends (3, 5) with a plurality of recesses (7), at each of which a terminal electrode (17) connected to a thick-film electrode (9) is arranged. The terminal electrodes (17) each are constituted of a thin metal film electrode layer (19) and two plated layers (21, 23). The thin metal film electrode layer (19) includes a front surface electrode section (19a) formed on a front surface (1a) of the substrate (1) so as to overlap with the thick-film electrode (9), a side surface electrode section (19b) connected to the front surface electrode section (19a) and arranged so as to entirely cover an inner surface of the recess (7) and a rear surface electrode section (19c) formed on a rear surface (1b) of the substrate (1) and connected to the side surface electrode section (19b).

Abstract: A communication connector having a plurality of contact pairs for conductive connection to respective communication signal wire pairs is provided with a capacitor label that capacitively couples a first contact of one contact pair to a second contact of a second contact pair to reduce near end cross talk between adjacent contacts. A common conductive lamina disposed closely adjacent to and spaced from more than one of the contacts further improves near end cross talk performance of the communication connector.

Abstract: A method of manufacturing a plurality of electronic multilayer components is disclosed in which each multilayer component comprises alternately stacked electrically conductive layers and electrically insulating layers, the electrically conductive layers being electrically connected in a periodically alternate arrangement to different edges of the multilayer component. The method comprises the steps of providing a substrate which is endowed with a regular pattern of surface protrusions on one face; depositing individual multilayer components into intervening spaces delimited by the protrusions; depositing electrically conductive layers for connection to a given edge of a multilayer component, wherein each connection occurs at an angle (.theta.) of less than 90.degree.

Abstract: Resistor material such as polysilicon is deposited on the insulating surface of a substrate and patterned to form resistor layers disposed generally parallel. Another resistor material such as polysilicon is deposited filling each space between adjacent resistor layers, with an insulating film being interposed between the upper and lower resistor materials, and etched back to form other resistor layers at respective spaces. After an insulating film is formed covering the resistor layers, contact holes are formed in the insulating film. A conductive layer is deposited and patterned to serially connect the resistor layers.

Abstract: A method of manufacturing a plurality of electronic multilayer component search of which alternately stacked electrically conductive and insulating layers alternately connected to opposite edges of the component, which method comprises: providing a substrate having a face endowed with a regular pattern of substantially parallel elongated protrusions separated by valleys; providing a first and a second flux of electrically conductive material in a direction subtending an angle of less than 90 with the substrate face and extending substantially parallel to the surface protrusions, and covering the thus-formed electrically conductive layers with intervening electrically insulating layers, the first and second fluxes having substantially oppositely directed in-plane components; providing said first and second fluxes with intervening insulating layers in an alternate manner as often as desired; dividing the substrate into strips, each including a protrusion, by severing the substrate along a series of planes, each

Abstract: A three dimensional polysilicon resistor and a method by which the three dimensional polysilicon resistor is manufactured. A semiconductor substrate has formed upon its surface an insulating layer. The insulating layer has a minimum of one aperture formed at least partially through the insulating layer. A polysilicon layer is formed upon the insulating layer and formed conformally into the aperture(s) within the insulating layer. The polysilicon layer is then patterned to form a resistor which includes the portion of the polysilicon layer which resides within the aperture(s).

Abstract: The electronic component of the present invention includes: an element having an internal electrode therein; an external electrode formed on an end portion of the element where an end face of the internal electrode is exposed; and a protection layer formed on the entire surface of the element except for the end portion of the element, wherein the protection layer is made of a metal oxide.

Abstract: A plurality of flow sensors are fabricated on a single substrate. The substrate is laid out to provide the proper physical relationship of the individual sensors. The resulting multiple sensor structure may be effectively used as a respiration detector by positioning a different sensor element at each of the airflow orifices (i.e., two nostrils and mouth) of a patient. In the preferred embodiment, the sensors are thermoresistive elements, which are screened on the substrate using conductive ink. The change in temperature of the air flow in relation to the ambient at each orifice provides an indication of the flow and may be used to determine the extent of the flow. The substrate is packaged in a single piece adhesive strip which provides ease of proper attachment by the patient.

Abstract: A method of producing a microwave power divider or combiner having equally matched sections of a split terminating resistor. The method initially matches the resistance value of both sections of the split terminating resistor by identifying which section has a lower resistance value. The ratio of the resistance values of the two sections is determined. The section having the lower resistance value is then trimmed until it is equal to the other. The termination sections may then be equally trimmed to provide a desired final resistance value for the terminating resistor.

Abstract: A method for making electrical connections between a lead and a conductor on a substrate, the method including the steps of disposing a copper conductor on a ceramic substrate; positioning a lead in contact with the conductor; applying a copper film to the lead and the conductor to attach the lead to the conductor; and heating the substrate, lead and conductor assembly to secure bond the lead and conductor together. In a preferred embodiment, the conductor, lead and film are made of copper. The method can further include disposing a resistive film of the substrate using thin or thick film processes.

Abstract: A sensor for detecting moisture on a non-conductive support, in particular a windshield of a motor vehicle, has one or more metallic, electrically conductive layers which are arranged in a given pattern on the outer surface of the support. The metallic, electrically conductive layer is produced from a metallic resinate which is applied to the support and then burned-in by the action of heat. Also deseribed is a method for constructing such a moisture sensor whit applies a glass layer in the form of a glass frit paste to be sintered upon the metallic electrically conductive layer, where the burning-in of the metallic resinate and the sintering of the glass frit paste are effected in single step.

Abstract: A resistor structure which resistance value is electrically adjusted after fabrication by a tester during the test operation so that its equivalent resistance closely approximates a desired nominal value. The resistor structure includes a main resistor and a number of trimming resistors connected in parallel. Each trimming resistor can be connected in parallel to the main resistor independently of one another via a switch, typically a pass-gate NFET device, and serially connected therewith. The switch is enabled via a control line coupled to a binary storage cell. It includes a programmable fuse that can be electrically blown by the tester. Because the resistance value of the main resistor and trimming resistors changes as a result of fabrication process variations, the trimming resistors are designed so that no matter what the equivalent resistance value of the main resistor is, there exists an appropriate combination of trimming resistors to achieve the desired nominal value.

Abstract: Components of the printing device are attached by a process employing thermo-compressive welding. The process results in a unitary, graded interface between the attached components and eliminates the need for applying thermal-cure adhesives to secure the components.

Abstract: A method for producing a desired resistive taper under computer control for controlling the surface resistivity of an electrical element, which comprises the steps of creating a computer controlled optically graded pattern corresponding to the desired resistive taper, producing a phototool from the graded pattern and using the phototool to photochemically etch the graded pattern onto a substrate.

Abstract: A resistor of SMD (Surface Mounted Device) construction includes a film of a resistive alloy as a resistive track on two electrically separated carrier plate elements of copper, which are constructed as contact elements solderable to the terminals of a printed circuit board to thereby ensure good heat dissipation into a printed circuit board. In order to manufacture such resistors, a resistive film sufficient for a plurality of individual resistors is adhered to but electrically isolated from a large copper plate and the laminate formed thereby is split into the individual resistors after producing the individual resistive tracks and their electrical connections to the copper plate and after producing gaps between the plate elements for each track.

Abstract: An array of termination resistors has symmetrical geometry producing essentially no net magnetic field and a resultant low inductance is fabricated on a substrate as disk resistors. Conductive through vias are formed in the substrate in an array pattern defining what will be resistor first and second contacts. Each disk resistor has one first contact located at the resistor disk center, and preferably four second contacts located symmetrically about the resistor disk and shared by four adjacent disk resistors. For each resistor, a annular-shaped disk of resistive material is fabricated on a first surface of the substrate, such that a central opening in the disk overlies at least the upper surface of a first contact via. The disk geometry and material determines its resistance. Next, a layer of conductive material is formed over the first surface of the substrate to cover at least the periphery of each disk, and to fill the central opening in each disk.

Abstract: A high temperature electrical insulation system is provided by forming a winding in an electrical device from a conductor that is pre-coated with a first layer of at least partially cured inorganic material. A second layer of inorganic material is applied, either during or just prior to forming the winding, over the first layer in order to seal any cracks in the first layer. The resultant electrical insulative coating is cured following the forming process, essentially at room temperature. The insulation system provided is thus totally inorganic, and its manufacture does not require the use of organics, or heating to high temperatures to cure the coating or to cause pyrolysis and/or volatilization of organic elements, as did prior electrical insulation systems. Furthermore, because no organics are utilized in either the manufacture or operation of the insulation system, there is no residual carbon in the resultant coating.

Abstract: A thermal inkjet printhead includes unpassivated heater resistors whose resistive material is doped, preferably with oxygen, nitrogen or an equivalent dopant, for increasing the resistance of the material. By increasing the resistance of the resistive material through doping, the drive currents for generating heat within the resistors need not be changed from levels which inkjet printers are presently designed to work with. The printhead of the invention can thus be used in place of a standard printhead without modification to the printer.

Abstract: A thermal conductive roller for use in copying machines, steam-heated and induction-heated applications includes a ceramic heating layer formed by plasma spraying a ceramic material to form an electrically conductive heating layer of preselected and and controlled resistance. Several methods of controlling the resistance of the ceramic heating layer are disclosed. The ceramic heating layer is sealed with a solid, low viscosity sealer such as Carnauba wax to protect the ceramic layer from moisture penetration. Electrical current is applied at or near the core and is conducted radially outward through the heating layer to an outer grounded metallic layer. An outer contact layer of metal, ceramic, or polymeric material can be added.

Abstract: A product and process of making such product in which a varistor is formed by diffusing lead borosilicate-type glass, into a surface of a fired or sintered zinc oxide substrate, i.e., "varistor element," during formation of an electrode on the surface of the substrate. Typically, an electrode paste or material, comprising a mixture or lead borosilicate-type glass frit and Ag powder, is applied to the substrate and provides the lead borosilicate-type glass for diffusing into the substrate. The improvement is that the lead borosilicate-type glass frit for the electrode paste or material comprises a mixture of PbO, B.sub.2 O.sub.3, SiO.sub.

Abstract: In a first embodiment of the invention a layer of ruthenium oxide is reactively deposited onto a substrate, then annealed for TCR adjustment and for stabilization. In a second, bi-layer embodiment of the invention, a layer of tantalum nitride is first reactively deposited onto a substrate, then annealed for stabilization. After a ruthenium oxide layer is reactively deposited onto the annealed tantalum nitride layer, the structure is annealed until a near-zero effective TCR for the bi-layer resistor is achieved. The ruthenium oxide capping layer serves as a barrier against chemical attack.

Abstract: An infrared detector device is described. It is based on an infrared analog of the Fabry Perot interferometer, using one curved, fully reflecting, plate and one planar, mainly reflecting, but partially transmitting, plate. The space between these plates behaves as a resonant cavity which can be built to respond to either a broad or a narrow band of wavelengths in the general range between 1 and 15 microns. It is also possible to combine several detectors of different narrow bands in a single device. Actual detection of the radiation is based on use of thin film resistors, having a high thermal coefficient of resistance, that are thermally isolated from the other parts of the structure. Details relating to the manufacture of the devices are given.

Abstract: Electrical resistors and resistor networks are provided on an insulative substrate with designated conductive terminations by direct and continuous writing of resistive lines in fine-line patterns between and over each two of neighboring terminations from heterogeneous resistive thick film compositions. The resistive lines of line width w and total length l between conductive terminations can be directly written by suitable writing apparatus to have a high aspect ratio n=l/w, thereby providing resistors and resistor networks of high resistance values on an overall substrate area significantly smaller than required for conventional thick film resistors of comparable resistance value and comparable operational characteristics.

Abstract: A collinear terminated transmission line structure and method for producing same is presented. The structure comprises a plurality of conductors electrically connected to a plurality of resistors. A predetermined spacing between each of the plurality of conductors ranges from 2 mils to 7 mils. Greater spacings are easily accomplished with the present method. The method comprises the steps of screen-printing a resistor swath onto a substrate, the swath being adjacent to one end of the plurality of conductors. After the substrate is dipped into a solution, the resistor swath is laser trimmed to form the plurality of resistors. The substrate is then rinsed with warm water to remove the solution. The solution can be a poly-vinyl alcohol and isopropyl alcohol mixture.

Abstract: A method for calibrating the response time of a mass air flow sensor in which the sensors bridge offset voltage is measured and the constant C.sub.I is calculated from the initial value of the bridge offset voltage. C.sub.I is a constant of the heated resistor's resistance in the equation RH=C+(1/I.sub.H) C.sub.I. The response time of the mass air flow sensor is a function of C.sub.I. A bridge offset voltage required to give C.sub.I a desired value is calculated. A pair of biasing resistors are trimmed while monitoring the value of the bridge offset voltage until the monitored value of the bridge offset voltage is equal to the desired value.

Abstract: A hybrid resistance card (R-Card) is manufactured using a two-step process wherein an electrically conductive ink layer and an electrically resistive ink layer are printed onto a surface, which may be either a substrate or the part on which the R-Card is to be used. The conductive ink layer is selectively applied in a pattern of shapes to electrically short out portions of the resistive ink layer, thereby permitting the R-Card to have a predetermined resistive taper across its width according to a desired resistivity curve. The resistive ink layer comprises grid-like lines bordering and separating the conductive shapes. The resistive taper is substantially continuous along the length of the R-Card, at least linearly, though if the card is designed to cover an entire part, it is substantially continuous along a plurality of directions on the card, with the tapers being designed to round into one another.

Abstract: Safety glass, known to consist of glass panels having an interposed plastic ply to minimize shattering, is converted by the within method into an auto windshield having a wiper deicing function by the application of resistive conductive coatings forming a circuit along the glass panel bottom edges insulated by the plastic ply, which circuit is heat-generating when connected to the auto battery and thus effective to deice the wiper which in an at-rest position is near enough to the heat source to benefit therefrom for the purposes intended.

Abstract: Thick film resistor ink compositions and a method for formulating and processing such inks are provided for producing thick film resistors having highly repeatable and stable resistance characteristics. The inks are specifically formulated to produce resistors whose resistivities are determined in part by the sintering temperature employed in the processing of the resistors. The processing of the inks involves using infrared radiation techniques to rapidly sinter the inks at highly controllable temperatures, so as to enable the resistance of a resistor to be predictably altered by the sintering operation, such that in-process adjustments can be made to the processing method. Thick film resistors produced in accordance with this invention are characterized by high stability to environmental influences and low TCR values on the order of about .+-.50 ppm/.degree.C.

Abstract: a thin film printed circuit inductive element exhibiting low Q wherein a conductive spiral is deposited on an insulating substrate and resistive links are connected between adjacent turns of the spiral. Inherent resonance is thereby damped out.

Abstract: An electronic probe circuit having ac and dc amplifiers and an input compensation subcircuit is enclosed within a trim housing that replicates the electrical effect of the probe housing. The circuit is laser trimmed through ports in the trim housing. The difference between the voltage at 80 nsec and 1.4 .mu.sec points on a step voltage provides a first calibration factor while the difference between the 3 nsec voltage and the 80 nsec voltage provides a second calibration factor. A resistor in the DC amplifier is trimmed to an absolute voltage with a step scan laser cut. A resistor in the AC amplifier is trimmed with a laser L-cut until the difference between the 80 nsec and 1.4 .mu.sec points of the step voltage equals the first calibration factor. A capacitor in the input compensation subcircuit is trimmed until the voltage difference between the 3 nsec and 80 nsec points equals the second calibration factor.

Abstract: A multilayer hybrid circuit, which looks like a conventional printed circuit board, has a laminated body having at least one of a plurality of dielectric layers, magnetic layers, and conductive patterns, composing a capacitor, an inductor, and a resistor, and mounts a semiconductor chip. An external connection is effected by side terminals positioned on side walls of the laminated body. In one embodiment, said laminated body and said semiconductor chip are molded together by plastics so that the result looks as if a conventional semiconductor chip. In another embodiment, a resilient relay board is coupled with the laminated body when mounted on a mother board so that stress on the mother board is not applied directly to the laminated body.

Abstract: A trimmable resistor which is prepared with additional electrical contacts between the resistor and the substrate. These contacts are usually not connected electrically to the electronic circuit. Moreover, they do not extend across the entire width of the resistor. If the resistor is over trimmed, its resistance can be reduced by wire bonding a selected one of the additional electrical contacts to an end contact of the resistor. Multiple contacts may be placed along the substrate, both on the side of the resistor where trimming is to take place and on an opposite side.

Abstract: This invention relates to solid-state smoke detectors and smoke (fire) alarm systems, and more particularly to a novel and improved smoke-sensitive element comprising a bismuth oxide film deposited on one surface of an electrically insulating material. It also relates to a method of depositing this oxide on a substrate, of heat treatment which provides for a highly smoke-sensitive film, and to smoke detector signal processing circuits.

Abstract: A process and a device are proposed for manufacturing sensors, particularly those intended for the determination of pressure forces. In thick-film technology, initially at least one insulating layer (14) is produced on a pressure support (10), whereupon a pressure-sensitive resistance layer (12) and finally conductor paths (13) are applied. In a pressing tool (20-22), the layer arrangement (11-14) is then compressed together with a plastic pressure substance (15). Finally, the pressure support (10) is removed from the pressed article.

Abstract: A printed circuit board includes a wiring pattern formed on an insulating board according to a predetermined electric circuit, and a cover member covering a portion of the wiring pattern used as a contact, the cover member being formed of an electrically conductive and non-solderable material. Due to the presence of the covering member, the wiring pattern portion is not covered with solder when the printed circuit board is subjected to dip soldering to attach various electric components to the printed circuit board. Since the covering member is electrically conductive, the wiring pattern portion can readily be used as a contact when the dip soldering is completed.

Abstract: A method for manufacturing hygristors includes preparing a hygroscopic gel containing a substantially greater proportion of carbon than the prior art, and milling the gel for a period of at least 24 hours to produce a smooth mixture. Substrates are dipped into the milled gel at controlled rates to coat the substrates. The coated substrates are cured under controlled temperature and humidity. Adhesion of the coating is improved by the smoother mixture resulting from the longer milling time, and by the differences in components of the mixture compared to the prior art. Long term stability and dynamic range are both increased.

Abstract: A method for processing a wiring fraction of on a heat-generating resistance of a thermal recording device, having different thicknesses at different regions are using a masking process or a dual exposing process, so that a height difference between the heat-generating resistance and the wiring is dualized and the contact pressure between a thermal recording paper and the heat-generating resistance is maximized, thereby enabling a high quality printing operation with low power consumption.

Abstract: A method of manufacturing a platinum temperature sensor includes the step of obtaining a meandering resistive circuit by forming grooves in a platinum film which is provided on an insulating substrate. In order to provide a high resistance value by reducing the line width of the resistive circuit, as well as to miniaturize the platinum temperature sensor, this method comprises steps of forming a resist film on the platinum film provided on the insulating substrate, patterning the resist film by photolithography, and using the patterned resist film as a mask to finely work the platinum film by Ar.sup.+ ion etching for forming the grooves. Due to formation of such grooves, the platinum film defines a meandering pattern portion which provides the resistive circuit.

Abstract: A method of making a compact high-voltage, high-power, thick-film screen-printed cylindrical resistor. A V-serpentine pattern is formed and adapted to fit on a cylindrical substrate having a diameter range of about 1/10 inch to about 1/2 inch. Such pattern is caused to have adjacent sections at a small acute angle to each other. Furthermore, the pattern is caused to have gaps at the open ends of the loops that are substantially wider than the gaps at the closed ends of the loops. In addition, the pattern is caused to have a sufficient number of undulations, and sufficient gap size, to achieve a predetermined voltage rating. Thereafter, the height of the pattern is changed to achieve a voltage coefficient substantially corresponding to the desired voltage coefficient. Furthermore, the resistive film material is altered to cause it to have a different resistivity, said latter resistivity being such that the same resistance value is achieved.

Abstract: A laser assembly including a diamond film submount is formed by anisotropically etching a localized indentation (recess) region in an originally completely planar face of the film. The region has one or pair of intersecting sidewalls preferably making the same angle between them as an angle made between a pair of sides of a laser device. After metallizing the remaining top face of the film, the bottom of the indentation region, and one or both of the sidewalls of the indentation region, the laser device is pushed into position in the recess with its above-mentioned pair of sides lying against one of the sidewalls and the metallization of the other sidewall, or lying against the metallization of both sidewalls; and the bottom of the laser device is quickly bonded by means of solder to the metallization on the bottom of the recess.

Abstract: A thermal print head comprises: a thermally resistant insulating substrate; a glazed glass partially formed on the substrate at one end side thereof; a heating element formed on the glazed glass; a first common electrode formed on the heating element; and a protective film formed on the first electrode; a second common electrode a part of which is formed between the insulating substrate and the glazed glass, the first and second electrodes being connected to each other; wherein the insulating substrate has a chamfer on the one end side where the first and second common electrodes are arranged, the chamfer being formed closely from the glazed glass, a part of the first and second common electrode being arranged on the chamfer.

Abstract: In multi-layer thin film circuits, fabricated by alternate formation of conductor layers and insulating layers, there can be integrated thin film resistors which bear directly upon the substrate but nonetheless are not subjected, during manufacture, to the high temperatures of curing of the insulating layers and which then would be damaged. The manufacturing method also allows producing integrated electrical contacting between the thin film resistors and conductors of all of the conductor layers.

Abstract: A generic chip carrier is described which includes, as integral parts, a voltage bus and a plurality of terminating resistors connected between the voltage bus and signal traces on the carrier. The voltage bus wraps around the chip carrier, thus providing a large area of metal. Through the selective use of the terminating resistors, the generic carrier can be customized for a particular type of integrated circuit, i.e., source or destination termination of signals. A signal trace may be customized by "opening" the terminating resistor with a current spike applied by a standard electrical probe. Spare bonding pads and terminating resistors are placed at intervals about the periphery of the carrier as insurance against defective or mistakenly removed terminating resistors.