Applying Terminal Patents (Class 29/621)
  • Patent number: 10468163
    Abstract: Disclosures of the present invention mainly describe a copper film with buried film resistor. In the present invention, Ni, Cr, W, Ni-based compound, W-based compound, Ni-based alloy, or W-based alloy are adopted for the manufacture of a resistor layer, and a copper layer is processed to the copper film 1 with buried film resistor by being integrated with the resistor layer. Particularly, the resistor layer, formed on the copper layer through sputter-coating process, is able to show the lowest resistance less than or equal to 5 ?/sq. Moreover, the use of sputter-coating technology is helpful in reduction of industrial waste water. In addition, at least one electronic circuit having at least one film resistor can be formed on a printed circuit board comprising the above-mentioned copper film by just needing to complete two times of photolithography processes on the printed circuit board.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: November 5, 2019
    Assignee: FLEX TEK CO., LTD.
    Inventor: Tsung-Her Yeh
  • Patent number: 10438729
    Abstract: Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: October 8, 2019
    Assignee: Vishay Dale Electronics, LLC
    Inventors: Todd L. Wyatt, Darin W. Glenn
  • Patent number: 9972424
    Abstract: The invention relates to a composite material strip for producing an electric component, in particular a resistor, in particular a low-resistance current-measuring resistor, comprising a first material strip (4) made of a copper-containing material, in particular a copper-containing conductor material, for later forming a first connection part of the electric component and comprising a second material strip (3) for later forming a second connection part of the electric component. The first material strip (4) and the second material strip (3) are electrically and mechanically connected together along a longitudinal seam, wherein the second material strip (3) consists of an aluminum-containing material, in particular an aluminum-containing conductor material. The invention further relates to a corresponding production method and to a corresponding component.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: May 15, 2018
    Assignee: Isabellenhuette Heusler GmbH & Co. KG
    Inventor: Ullrich Hetzler
  • Patent number: 9896328
    Abstract: An electromechanical switching device includes a first electrode, comprising layers of a first 2D layered material, which layers exhibit a first surface; a second electrode, comprising layers of a second 2D layered material, which layers exhibit a second surface opposite the first surface; and an actuation mechanism; wherein each of the first and second 2D layered materials has an anisotropic electrical conductivity, which is lower transversely to its layers than in-plane with the layers; the first electrode includes two distinct areas alongside the first surface, which areas differ in at least one structural, electrical and/or magnetic property; and at least one of the first and second electrodes is actuatable by the actuation mechanism, such that actuation thereof for modification of an electrical conductance transverse to each of the first surface and the second surface to enable current modulation between the first electrode and the second electrode.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: February 20, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Urs T. Duerig, Armin W. Knoll, Elad Koren, Emanuel Loertscher
  • Patent number: 9881760
    Abstract: An electromechanical switching device includes a first electrode, comprising layers of a first 2D layered material, which layers exhibit a first surface; a second electrode, comprising layers of a second 2D layered material, which layers exhibit a second surface opposite the first surface; and an actuation mechanism; wherein each of the first and second 2D layered materials has an anisotropic electrical conductivity, which is lower transversely to its layers than in-plane with the layers; the first electrode includes two distinct areas alongside the first surface, which areas differ in at least one structural, electrical and/or magnetic property; and at least one of the first and second electrodes is actuatable by the actuation mechanism, such that actuation thereof for modification of an electrical conductance transverse to each of the first surface and the second surface to enable current modulation between the first electrode and the second electrode.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: January 30, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Urs T. Duerig, Armin W. Knoll, Elad Koren, Emanuel Loertscher
  • Patent number: 9456472
    Abstract: The present invention provides a rigid raft formed of rigid composite material. The raft has an electrical system and/or a fluid system embedded therein. The raft further has a tank for containing liquid integrally formed therewith. The tank can be formed of the rigid composite material. The tank can be for a gas turbine engine.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: September 27, 2016
    Assignee: ROLLS-ROYCE plc
    Inventors: Justin Dalton, Paul Broughton, Richard Peace, Gary Alan Skinner, Robin Charles Kennea
  • Publication number: 20150042444
    Abstract: A resistor and an integrated heat spreader are provided. A resistive element having a first surface is in contact with electrically conducting terminals. A heat spreader is provided having at least a portion in thermally conductive contact with at least a portion of the first surface of the resistive element. The heat spreader comprising a thermally conducting and electrically insulating material, and has terminations, each termination adjacent to one of the electrically conducting terminals. Each termination is in thermally conducting contact with the adjacent electrically conducting terminal. A method of fabricating a resistor and an integrated heat spreader is also provided.
    Type: Application
    Filed: August 29, 2014
    Publication date: February 12, 2015
    Applicant: VISHAY DALE ELECTRONICS, INC.
    Inventors: Clark Smith, Todd Wyatt
  • Publication number: 20140002232
    Abstract: A current sense resistor and a method of manufacturing a current sensing resistor with temperature coefficient of resistance (TCR) compensation are disclosed. The resistor has a resistive strip disposed between two conductive strips. A pair of main terminals and a pair of voltage sense terminals are formed in the conductive strips. A pair of rough TCR calibration slots is located between the main terminals and the voltage sense terminals, each of the rough TCR calibration slots have a depth selected to obtain a negative starting TCR value observed at the voltage sense terminals. A fine TCR calibration slot is formed between the pair of voltage sense terminals.
    Type: Application
    Filed: August 30, 2013
    Publication date: January 2, 2014
    Applicant: VISHAY DALE ELECTRONICS, INC.
    Inventors: Clark L. SMITH, Thomas L. Bertsch, Todd L. Wyatt, Thomas L. Veik
  • Patent number: 8590140
    Abstract: A fabrication method of an alloy resistor includes: providing an alloy sheet having a plurality of openings spacing apart from each other and going through the alloy sheet and a plurality of alloy resistor units located between any two adjacent openings, wherein each of the alloy resistor units has an insulating cover area and a plurality of electrode ends on both sides of the insulating cover area; forming an insulating layer on a surface of the insulating cover area of the alloy resistor units by an electrodeposition coating process; cutting the alloy along a connecting portion, so as to obtain separated alloy resistor units; and forming a conductive adhesion material on the electrode ends of the alloy resistor units. An alloy resistor having an insulating layer with a smooth surface can be obtained by performing an electrodeposition coating process.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: November 26, 2013
    Assignee: Viking Tech Corporation
    Inventors: Shih-Long Wei, Shen-Li Hsiao, Chien-Min Shao, Chien-Hung Ho
  • Publication number: 20130298385
    Abstract: Method for manufacturing a flexible heater comprising a resistive track enclosed in two sheets of electrically insulating plastic material, said track comprising electrical connections to which electrical wires are connected, the method comprising the steps of: —enclosing the resistive track in the two sheets of electrically insulating plastic material—connecting the electrical wires to the electrical connections of the resistive track—putting an open mould around the connection area—injecting a liquid casting formulation into said mould—curing said composition—removing the mould.
    Type: Application
    Filed: October 28, 2011
    Publication date: November 14, 2013
    Applicant: INERGY AUTOMOTIVE SYSTEMS RESEARCH (SOCIETE ANONYME)
    Inventors: Jae Sik Choi, Jean-Michel Granes, Pierre-Francois Tardy
  • Publication number: 20130292373
    Abstract: The present invention provides a heating element, including a transparent substrate, an adhesive agent layer provided on at least one side of the transparent substrate, a conductive heat emitting line provided on the adhesive agent layer, a coating film capsulating the conductive heat emitting line and an upper side of the adhesive agent layer not covered by the heat emitting line, a bus bar electrically connected to the conductive heat emitting line, and a power part connected to the bus bar, and a manufacturing method thereof.
    Type: Application
    Filed: July 3, 2013
    Publication date: November 7, 2013
    Inventors: Hyeon CHOI, Su-Jin KIM, Ki-Hwan KIM, Young-Jun HONG
  • Patent number: 8458894
    Abstract: A method for making a positive temperature coefficient device includes: (a) forming a crosslinkable preform of a positive temperature coefficient polymer composition containing a polymer system and a conductive filler; (b) attaching a pair of electrodes to the preform; (c) soldering a pair of conductive leads to the electrodes using a lead-free solder paste having a melting point greater than 210° C.; and (d) crosslinking the crosslinkable preform after step (c).
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: June 11, 2013
    Assignee: Fuzetec Technology Co., Ltd.
    Inventors: Jack Jih-Sang Chen, Chi-Hao Gu
  • Publication number: 20130104389
    Abstract: A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.
    Type: Application
    Filed: December 18, 2012
    Publication date: May 2, 2013
    Applicant: ROHM CO., LTD.
    Inventor: Masaki YONEDA
  • Publication number: 20130091696
    Abstract: A metal strip resistor is provided with a resistive element disposed between a first termination and a second termination. The resistive element, first termination, and second termination form a substantially flat plate. A thermally conductive and electrically non-conductive thermal interface material such as a thermally conductive adhesive is disposed between the resistive element and first and second heat pads that are placed on top of the resistive element and adjacent to the first and second terminations, respectively.
    Type: Application
    Filed: November 30, 2012
    Publication date: April 18, 2013
    Applicant: Vishay Dale Electronics, Inc.
    Inventor: Vishay Dale Electronics, Inc.
  • Patent number: 8261431
    Abstract: A method for manufacturing a thermal head, including: forming a resistance heating element and an electrode on an insulating substrate, the resistance heating element emitting heat by a current flowing the resistance heating element, the electrode being connected to the resistance heating element; forming a corrosion prevention layer on the resistance heating element and the electrode; annealing the resistance heating element; adjusting an electrical resistance of the resistance heating element; and forming a protective layer on the corrosion prevention layer, the protective layer having glass as a main component. The annealing is implemented prior to the adjusting. The forming the corrosion prevention layer is implemented prior to the annealing.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: September 11, 2012
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Hokuto Electronics Corporation
    Inventors: Daiki Iino, Masato Sawada, Atsunori Ando, Shigenori Kitamura, Taro Asakura
  • Patent number: 8240027
    Abstract: A method of making a circuitized substrate which involves forming a plurality of individual film resistors having approximate resistance values as part of at least one circuit of the substrate, measuring the resistance of a representative (sample) resistor to define its resistance, utilizing these measurements to determine the corresponding precise width of other, remaining film resistors located in a defined proximity relative to the representative resistor such that these remaining film resistors will include a defined resistance value, and then selectively isolating defined portions of the resistive material of these remaining film resistors while simultaneously defining the precise width of the resistive material in order that these film resistors will possess the defined resistance.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: August 14, 2012
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Frank D. Egitto, John S. Kresge, John M. Lauffer
  • Patent number: 8181340
    Abstract: A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: May 22, 2012
    Assignee: TDK Corporation
    Inventors: Ko Onodera, Satoshi Kurimoto, Yoji Tozawa, Shirou Ootsuki
  • Patent number: 8085551
    Abstract: The present invention is to provide an electronic component where positional accuracy for arranging members constituting a circuit element such as a resistor element and the like is mitigated and corrosion of a terminal electrode caused by sulfur in the atmosphere is reduced.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: December 27, 2011
    Assignee: KOA Corporation
    Inventors: Seiji Karasawa, Koji Fujimoto
  • Patent number: 7992285
    Abstract: A method for fabricating a negative temperature coefficient thermistor is provided, including the steps of: (A) combining ceramic powders having a negative temperature coefficient of resistance, a polymer binder and a solvent to form a mixture; (B) removing the solvent and granulating the mixture to form granulous powders; (C) compressing the granulous powders to obtain a thermistor material with a specific shape; (D) curing the thermistor material at 80° C. to 350° C.; and (E) mounting an electrode to the thermistor material to form the negative temperature coefficient thermistor. The method can be performed in a low temperature without the problem of interface diffusion. Further, the desired resistance value and thermistor constant (B) can be easily adjusted and obtained by mixing ceramic powders with different characteristics of temperature coefficient of resistance and/or the addition of conductive metal powder.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: August 9, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Wen-How Deng, Tsung-Wen Chen, Shin-Shing Lo
  • Patent number: 7907046
    Abstract: The chip resistor (1) of the present invention includes an insulating substrate (2) in the form of a chip, a pair of terminal electrodes (3, 4) formed on both ends of the insulating substrate (2), a plurality of resistor films (5) formed on an obverse surface of the insulating substrate (2) in parallel with each other between the paired terminal electrodes (3, 4), and a cover coat formed on the obverse surface of the insulating substrate (2) to cover the resistor films (5). In the chip resistor (1), one of the terminal electrodes (3) includes individual upper electrodes (8) each formed on the obverse surface of the insulating substrate (3, 4) to be independently connected to a respective one of the resistor films (5) and a side electrode (9) formed on a side surface of the insulating substrate (2) to be connected to all the individual upper electrodes (8).
    Type: Grant
    Filed: September 4, 2006
    Date of Patent: March 15, 2011
    Assignee: Rohm Co., Ltd.
    Inventor: Torayuki Tsukada
  • Patent number: 7882621
    Abstract: A method for making chip resistor components includes: (a) forming a plurality of first and second notches in a substrate so as to form resistor-forming strips; (b) forming pairs of upper and lower electrodes on each of the resistor-forming strips; (c) forming a resistor film on each of the resistor-forming strips; (d) forming an insulator layer on the resistor film; (e) forming a hole pattern in the insulator layer and the resistor film; (f) forming an insulating shield layer on the insulator layer; (g) cleaving the substrate along the first notches so as to form a plurality of strip-like semi-finished products; (h) forming a pair of side electrodes on two opposite sides of each of the semi-finished products; and (i) cleaving each of the semi-finished products.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: February 8, 2011
    Assignee: Yageo Corporation
    Inventors: Mu-Yuan Chen, Wen-Feng Wu, Chi-Pin Chang, Kao-Po Chien
  • Patent number: 7788799
    Abstract: A variable resistance device comprises a resistive member having a resistive resilient material. A first conductor is configured to be electrically coupled with the resistive member at a first contact location over a first contact area. A second conductor is configured to be electrically coupled with the resistance member at a second contact location over a second contact area. The first contact location and second contact location are spaced from one another by a distance. The resistance between the first conductor at the first contact location and the second conductor at the second contact location is equal to the sum of a straight resistance component and a parallel path resistance component. At least one of the first location, the second location, the first contact area, and the second contact area is changed to produce a change in resistance between the first conductor and the second conductor.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: September 7, 2010
    Assignee: Authentec, Inc.
    Inventors: Allan E. Schrum, Michael D. Rogers
  • Patent number: 7743488
    Abstract: In the case where a variable resistive element, which is made of a variable resistor provided between a first and second electrodes, and of which the electrical resistance varies by applying a voltage pulse between the two electrodes, is applied to a resistance nonvolatile memory, there is a range of the resistance value of the variable resistive element in a low resistance state where the nonvolatile memory can operate normally. In the conventional manufacturing method the resistance value of the variable resistive element is too low, therefore, it can not be controlled within a desired range of the resistance value. A step of carrying out of a reduction process is provided at any point after the step of forming a variable resistor material as a film, it has thereby become possible to increase the resistance value of the variable resistive element, which is too low in the conventional method.
    Type: Grant
    Filed: June 6, 2006
    Date of Patent: June 29, 2010
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yukio Tamai, Takuya Otabe
  • Publication number: 20100154203
    Abstract: A method of securing a terminal to a ceramic heater is provided by the present disclosure. The ceramic heater includes a ceramic substrate and a resistive heating element, and the method includes exposing a portion of the resistive heating element, forming an intermediate layer on at least one of the portion of the resistive heating element and the ceramic substrate proximate the portion of the resistive heating element, the intermediate layer being selected from a group consisting of Mo/AlN and W/AlN, and bonding the terminal to the intermediate layer.
    Type: Application
    Filed: March 1, 2010
    Publication date: June 24, 2010
    Applicant: Watlow Electric Manufacturing Company
    Inventors: Hongy Lin, Thomas M. Laskowski, Jason E. Smith
  • Patent number: 7673382
    Abstract: A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: March 9, 2010
    Assignee: TDK Corporation
    Inventors: Ko Onodera, Satoshi Kurimoto, Yoji Tozawa, Shirou Ootsuki
  • Patent number: 7617592
    Abstract: According to one embodiment of the present invention, a method for manufacturing thin film heaters includes an automated process for applying at least one layer of ink to a conductive substrate, and forming at least one electrically conductive electrode in electrical communication with the substrate by curing the ink. When an electrical current is applied to the thin film heater, current flowing through the substrate generates heat in the substrate. In alternate embodiments, a flexographic printing process is used to overlay two similar layers of ink on a carbon impregnated substrate and cure the ink to form at least one electrode conductor.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: November 17, 2009
    Assignee: Total Electronics, LLC
    Inventors: Kraig Rayl, Alan Study
  • Patent number: 7609143
    Abstract: A multi-layer type over-current and over-temperature protection structure and a method of manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrate more than two over-current and over-temperature protection elements on a component structure that can be adhered to a substrate. Hence, the over-current and over-temperature protection structure has more than two over-current and over-temperature protection functions at the same time. Therefore, the advantages of the present invention is that the over-current and over-temperature protection structure effectively integrates two or more over-current and over-temperature protection elements together in order to increase the usage range of the over-current and over-temperature protection structure. Moreover, the present invention effectively reduces size of the over-current and over-temperature protection elements on a PCB and reduces the number of solder joints.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: October 27, 2009
    Assignee: Inpaq Technology Co., Ltd.
    Inventor: Chien-Hao Huang
  • Patent number: 7571536
    Abstract: A method of making capacitive/resistive devices provides both resistive and capacitive functions. The capacitive/resistive devices may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive devices conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability.
    Type: Grant
    Filed: January 26, 2007
    Date of Patent: August 11, 2009
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: David Ross McGregor
  • Publication number: 20090153287
    Abstract: A chip resistor includes a metal resistor element made in the form of a chip that includes an upper surface, a lower surface, two end surfaces, and two side surfaces. Two electrodes are formed on the resistor element to be spaced from each other in a longitudinal direction of the resistor element. Each of the electrodes is formed directly on the resistor element and extends continuously from the lower surface onto the upper surface via a corresponding one of the two end surfaces.
    Type: Application
    Filed: December 4, 2008
    Publication date: June 18, 2009
    Applicant: ROHM CO., LTD.
    Inventor: Torayuki TSUKADA
  • Patent number: 7520049
    Abstract: Disclosed herein is a manufacturing method of a planar resistance heating element and a planar resistance heating element made using the method. In the manufacturing method of a planar resistance heating element by etching an aluminum foil deposited on an insulating substrate in a desired pattern, printing carbon paste and connecting current input terminals in parallel, the aluminum foil is adapted to undergo a multiple step tempering process to thereby prevent heat deformation. The carbon paste acting as a resistor element is made of electrically conductive carbon, graphite, a resin, a solvent and a hardener which are mixed so as to optimize physical properties of the carbon paste. As a result, prevention of heat deformation of the insulating substrate, uniform heat conductivity, excellent heat-generation effect and easy manufacture may be achieved.
    Type: Grant
    Filed: November 22, 2005
    Date of Patent: April 21, 2009
    Assignee: Suntech Co., Ltd.
    Inventor: Gyongtae Kim
  • Publication number: 20090085715
    Abstract: A resistor includes first and second opposite terminations, a resistive element formed from a plurality of resistive element segments between the first and second opposite terminations, at least one segmenting conductive strip separating two of the resistive element segments, and at least one open area between the first and second opposite terminations and separating at least two resistive element segments. Separation of the plurality of resistive element segments assists in spreading heat throughout the resistor. The resistor or other electronic component may be packaged by bonding to a heat sink tab with a thermally conductive and electrically insulative material. The resistive element may be a metal strip, a foil, or film material.
    Type: Application
    Filed: September 27, 2007
    Publication date: April 2, 2009
    Applicant: VISHAY DALE ELECTRONICS, INC.
    Inventors: Felix Zandman, Clark L. Smith, Todd L. Wyatt, Thomas L. Veik, Thomas L. Bertsch
  • Publication number: 20090085716
    Abstract: A semiconductor device and a method for manufacturing the same that includes terminal patterns and resistor patterns disposed between and electrically connected to the terminal patterns.
    Type: Application
    Filed: September 30, 2008
    Publication date: April 2, 2009
    Inventor: Jung-Ho Kim
  • Publication number: 20080278988
    Abstract: According to one aspect, an integrated circuit may comprise a first electrode, a second electrode, and a resistive switching rod extending from the first electrode to the second electrode and being at least partly embedded in a thermal barrier matrix.
    Type: Application
    Filed: May 9, 2007
    Publication date: November 13, 2008
    Inventor: Klaus Ufert
  • Publication number: 20080092649
    Abstract: A resistive-type humidity sensing structure with microbridge includes a substrate, a sensing portion, and two measuring electrodes. An isolated layer and a bridge are respectively formed on the substrate. The sensing portion includes a resistive and humidity sensing layer. Two measuring electrodes are formed on the resistive sensing layer corresponding to the bridge, so as to fix the sensing portion on the first isolated layer for measuring resistance values of the resistive sensing layer. The material of the humidity sensing layer changes its volume according to humidity, the length of the resistive sensing layer covered by the humidity sensing layer is warped, and the changes of the length of the material for the resistive sensing layer causes variations of the resistance value. Finally, two measuring electrodes are used to measure the humidity value.
    Type: Application
    Filed: June 12, 2007
    Publication date: April 24, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jung-Tai Chen, Chia-Yen Lee, Yii-Tay Chiou, Chun-Hsun Chu
  • Patent number: 7350296
    Abstract: Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: April 1, 2008
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Sup Ryu, Myung Sam Kang
  • Patent number: 7334318
    Abstract: A method of manufacturing an inexpensive fine resistor which do not require dimensional classifications of discrete substrates is disclosed. The method eliminates a process of replacing a mask according to a dimensional ranking of each discrete substrate. The method includes: dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; forming a top electrode layer on a top face of the discrete substrate; forming a resistor layer such that a part of the resistor layer overlaps the top electrode layer; forming protective layers so as to cover the resistor layer; and forming side electrode layer on a side face of the discrete substrate such that the side electrode layer is electrically coupled to the top electrode layer.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: February 26, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masato Hashimoto, Yoshiro Morimoto, Akio Fukuoka, Hiroaki Kaito, Hiroyuki Saikawa, Toshiki Matsukawa, Junichi Hayase
  • Patent number: 7305754
    Abstract: In manufacturing a chip resistor by dividing a chip resistance substrate which includes an insulator, resistance film formed on a surface of the insulator, and a plurality of conductive strips disposed on the resistance film at fixed intervals, grooves are formed by removing a predetermined width of the resistance film including at least second prescribed severing lines. After forming the grooves, the chip resistance substrate is severed in longitudinal and lateral directions along first prescribed severing lines for dividing the conductive strips into two parts and the second prescribed severing lines perpendicular to the first prescribed severing lines so as to produce discrete chip resistors.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: December 11, 2007
    Assignee: Disco Corporation
    Inventors: Kazuma Sekiya, Toshiaki Takahashi
  • Patent number: 7284317
    Abstract: Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.
    Type: Grant
    Filed: February 3, 2004
    Date of Patent: October 23, 2007
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk-Hyun Cho, Jang-Kyu Kang, Byung-Kook Sun, Jong-Kuk Hong, Seok-Kyu Lee, Jin-Yong Ahn
  • Patent number: 7281318
    Abstract: A method of manufacturing a composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an intermediate layer of the structural reinforcement material disposed between the electrical devices. At least one electrical bus is disposed in the structural member, and each electrical device is connected to the bus by a conductive electrode. Thus, the electrodes can extend through the intermediate layer of the structural reinforcement material to connect each of the electrical devices to one or more of the buses.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: October 16, 2007
    Assignee: The Boeing Company
    Inventors: Joseph A. Marshall, Douglas B. Weems, Richard C. Bussom, David M. Anderson
  • Patent number: 7278201
    Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.
    Type: Grant
    Filed: October 18, 2004
    Date of Patent: October 9, 2007
    Assignee: Vishay Intertechnology, Inc
    Inventors: Joseph Szwarc, Reuven Goldstein
  • Patent number: 7278202
    Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: October 9, 2007
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Joel J. Smejkal, Steve E. Hendricks
  • Patent number: 7275308
    Abstract: A method for manufacturing the same, wherein the monolithic ink-jet printhead includes a manifold for supplying ink, an ink chamber having a hemispheric shape, and an ink channel formed monolithically on a substrate; a silicon oxide layer, in which a nozzle for ejecting ink is centrally formed in the ink chamber, is deposited on the substrate; a heater having a ring shape is formed on the silicon oxide layer to surround the nozzle; a MOS integrated circuit is mounted on the substrate to drive the heater and includes a MOSFET and electrodes connected to the heater. The silicon oxide layer, the heater, and the MOS integrated circuit are formed monolithically on the substrate. Additionally, a DLC coating layer having a high hydrophobic property and high durability is formed on an external surface of the printhead.
    Type: Grant
    Filed: December 22, 2003
    Date of Patent: October 2, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyeon-cheol Kim, Yong-soo Oh, Keon Kuk, Kwang-joon Yoon, Jae-sik Min, Sang-hyun Lee, Chang-seung Lee, Seog Soon Baek, Sang-wook Lee, Jong-cheol Shin
  • Patent number: 7241975
    Abstract: Resistive igniter systems are provided that comprise a metal substrate with an associated resistive igniter element in electrical connection through braze applied to the metal substrate. Igniter systems of the invention can enable significantly simplified manufacturing as well as notably higher yield production of more robust igniters. In preferred systems, the braze material is applied to the metal substrate prior to adjoining the igniter and metal substrate, which can enable application of a relatively precise amount of braze in a defined area of the metal substrate.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: July 10, 2007
    Assignee: Saint-Gobain Ceramics and Plastics, Inc.
    Inventors: Scott M. Hamel, Taehwan Yu, Louis Castriotta, III, Jack F. Eckalbar, Jr.
  • Patent number: 7237324
    Abstract: A multiple chip resistor is manufactured in the following method. First electrode layers are formed on a first surface of a substrate. Resistor elements electrically connected to the first electrode layers, respectively, are formed on the first surface of the substrate. Slits are formed in the substrate for separating the first electrode layers. Edge electrodes connected to the first electrode layers at the edges of the slits, respectively, are formed on respective edges at the slits of the substrate. The substrate is divided at the slits into strip substrates. Portions of the edge electrodes are removed for electrically isolating the resistor elements from each other. The method provides the edge electrodes on each strip substrate with an improved dimensional accuracy, hence allowing the edge electrodes to be isolated electrically from each other. Consequently, the multiple chip resistor is prevented from being mounted defectively when the resistor is surface-mounted.
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: July 3, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiki Matsukawa, Yasuharu Kinoshita, Shoji Hoshitoku, Masaharu Takahashi, Yoshinori Ando
  • Patent number: 7230214
    Abstract: A metal sheathed heater utilizes splice connections that connects ends of a heater cable with ends of a lead wire. Each splice connection has a connector that connects core wires of the lead wires and heater cable together. Heat shrinkable tubing surrounds the connector and ends of the heater cable and lead wires. An adhesive is interposed between the heat shrinkable tubing and heater cable and lead wire ends to bond with the heat shrinkable tubing and complete the splice connection. The metal sheath of the heater can be formed with an enlarged diameter portion to account for the heat shrinkable tubing surrounding the lead wire and heater cable ends.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: June 12, 2007
    Assignee: Tutco, Inc.
    Inventor: Robert Kirby
  • Patent number: 7200920
    Abstract: The substrate (2) containing the via-hole (3) is inserted into an electrophoretic cell (1) and an electrode (6) (the “first electrode”) is placed on top of a first orifice of the via-hole(s) (3), to be implemented with electrical component(s), so that the electrode (6) totally covers the first orifice. Electrically charged either conductive and/or non-conductive particles are provided by immersing the volume of the via-hole(s) (3) in a conductive medium (17) consisting of the electrically charged particles. An electric field is created between the first electrode (6) and a second electrode (4) through the via-hole(s) (3) and the conductive medium (17) and the electrically charged particles are precipitated on the inner surface of the first electrode (6) that is directed to the second orifice of the via-hole(s) (3), until a desired portion of the volume of the via-hole(s) (3) is filled with a first layer of the charged particles having a desired thickness.
    Type: Grant
    Filed: October 25, 2001
    Date of Patent: April 10, 2007
    Inventor: Israel Schuster
  • Patent number: 7188404
    Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: March 13, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masato Hashimoto, Yoshiro Morimoto, Akio Fukuoka, Hiroaki Kaito, Hiroyuki Saikawa, Toshiki Matsukawa, Junichi Hayase
  • Patent number: 7165316
    Abstract: An electrical resistor is made by providing a sacrificial layer and conductive pads disposed on a first surface of the sacrificial layer. An electrically resistive material is deposited over the pads and on the first surface of the sacrificial layer to form at least one unit including the resistive material and the pads. At least part of the sacrificial layer is then removed so as to expose one or more of the pads.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: January 23, 2007
    Assignee: Tessera, Inc.
    Inventor: Joseph Fjelstad
  • Patent number: 7165315
    Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: January 23, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masato Hashimoto, Yoshiro Morimoto, Akio Fukuoka, Hiroaki Kaito, Hiroyuki Saikawa, Toshiki Matsukawa, Junichi Hayase
  • Patent number: 7152291
    Abstract: Improved method steps for terminating multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. Electrode and dielectric layers are provided in an interleaved arrangement and selected portions of the electrode layers are exposed. Electrically isolated anchor tabs may optionally be provided and exposed in some embodiments. Termination material is then plated to the exposed portions of the electrode layers until exposed portions of selected such portions thereof are connected. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: December 26, 2006
    Assignee: AVX Corporation
    Inventors: Andrew P. Ritter, Robert Heistand, II, John L. Galvagni, Sriram Dattaguru