Abstract: A joint structure includes a first and a second metal member overlapping with each other as viewed in a first direction. The first metal member and the second metal member are joined together. The joint structure includes a welded portion at which the first metal member and the second metal member, overlapping with each other, are partly fused to each other. The welded portion has an outer circumferential edge and a plurality of linear marks. The outer circumferential edge is annular as viewed in the first direction. The plurality of linear marks each extend from an inside of the welded portion toward the outer circumferential edge as viewed in the first direction. Each of the plurality of linear marks is curved to bulge to one sense of an annular direction along the outer circumferential edge.

Abstract: A method of coating metal parts, comprising providing a metal part of a first metal material, applying a foil of a second metal material to the metal material onto the metal part in a bearing area, and irradiating the foil applied on the metal part in at least part of the bearing area with a laser.

Abstract: An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.

Abstract: A resistor element is provided, comprising a substrate including an upper surface and lower surface opposite to each other; a pair of electrodes separately disposed on the upper surface; at least one first groove extended from the upper surface to lower surface and defined by first side walls and a first bottom surface, wherein the depth from the upper surface of the substrate to the first bottom surface is a first depth; and a resistant layer disposed on the upper surface and electrical connected to the pair electrodes. The resistant layer covers the first side wall, the first bottom surface and part of the upper surface. The substrate with grooves increases the current path of the resistant layer, so that the resistor element having higher resistance can be obtained.

Abstract: Disclosures of the present invention mainly describe a copper film with buried film resistor. In the present invention, Ni, Cr, W, Ni-based compound, W-based compound, Ni-based alloy, or W-based alloy are adopted for the manufacture of a resistor layer, and a copper layer is processed to the copper film 1 with buried film resistor by being integrated with the resistor layer. Particularly, the resistor layer, formed on the copper layer through sputter-coating process, is able to show the lowest resistance less than or equal to 5 ?/sq. Moreover, the use of sputter-coating technology is helpful in reduction of industrial waste water. In addition, at least one electronic circuit having at least one film resistor can be formed on a printed circuit board comprising the above-mentioned copper film by just needing to complete two times of photolithography processes on the printed circuit board.

Abstract: Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.

Abstract: The invention relates to a composite material strip for producing an electric component, in particular a resistor, in particular a low-resistance current-measuring resistor, comprising a first material strip (4) made of a copper-containing material, in particular a copper-containing conductor material, for later forming a first connection part of the electric component and comprising a second material strip (3) for later forming a second connection part of the electric component. The first material strip (4) and the second material strip (3) are electrically and mechanically connected together along a longitudinal seam, wherein the second material strip (3) consists of an aluminum-containing material, in particular an aluminum-containing conductor material. The invention further relates to a corresponding production method and to a corresponding component.

Abstract: An electromechanical switching device includes a first electrode, comprising layers of a first 2D layered material, which layers exhibit a first surface; a second electrode, comprising layers of a second 2D layered material, which layers exhibit a second surface opposite the first surface; and an actuation mechanism; wherein each of the first and second 2D layered materials has an anisotropic electrical conductivity, which is lower transversely to its layers than in-plane with the layers; the first electrode includes two distinct areas alongside the first surface, which areas differ in at least one structural, electrical and/or magnetic property; and at least one of the first and second electrodes is actuatable by the actuation mechanism, such that actuation thereof for modification of an electrical conductance transverse to each of the first surface and the second surface to enable current modulation between the first electrode and the second electrode.

Abstract: An electromechanical switching device includes a first electrode, comprising layers of a first 2D layered material, which layers exhibit a first surface; a second electrode, comprising layers of a second 2D layered material, which layers exhibit a second surface opposite the first surface; and an actuation mechanism; wherein each of the first and second 2D layered materials has an anisotropic electrical conductivity, which is lower transversely to its layers than in-plane with the layers; the first electrode includes two distinct areas alongside the first surface, which areas differ in at least one structural, electrical and/or magnetic property; and at least one of the first and second electrodes is actuatable by the actuation mechanism, such that actuation thereof for modification of an electrical conductance transverse to each of the first surface and the second surface to enable current modulation between the first electrode and the second electrode.

Abstract: The present invention provides a rigid raft formed of rigid composite material. The raft has an electrical system and/or a fluid system embedded therein. The raft further has a tank for containing liquid integrally formed therewith. The tank can be formed of the rigid composite material. The tank can be for a gas turbine engine.

Abstract: A resistor and an integrated heat spreader are provided. A resistive element having a first surface is in contact with electrically conducting terminals. A heat spreader is provided having at least a portion in thermally conductive contact with at least a portion of the first surface of the resistive element. The heat spreader comprising a thermally conducting and electrically insulating material, and has terminations, each termination adjacent to one of the electrically conducting terminals. Each termination is in thermally conducting contact with the adjacent electrically conducting terminal. A method of fabricating a resistor and an integrated heat spreader is also provided.

Abstract: A current sense resistor and a method of manufacturing a current sensing resistor with temperature coefficient of resistance (TCR) compensation are disclosed. The resistor has a resistive strip disposed between two conductive strips. A pair of main terminals and a pair of voltage sense terminals are formed in the conductive strips. A pair of rough TCR calibration slots is located between the main terminals and the voltage sense terminals, each of the rough TCR calibration slots have a depth selected to obtain a negative starting TCR value observed at the voltage sense terminals. A fine TCR calibration slot is formed between the pair of voltage sense terminals.

Abstract: A fabrication method of an alloy resistor includes: providing an alloy sheet having a plurality of openings spacing apart from each other and going through the alloy sheet and a plurality of alloy resistor units located between any two adjacent openings, wherein each of the alloy resistor units has an insulating cover area and a plurality of electrode ends on both sides of the insulating cover area; forming an insulating layer on a surface of the insulating cover area of the alloy resistor units by an electrodeposition coating process; cutting the alloy along a connecting portion, so as to obtain separated alloy resistor units; and forming a conductive adhesion material on the electrode ends of the alloy resistor units. An alloy resistor having an insulating layer with a smooth surface can be obtained by performing an electrodeposition coating process.

Abstract: Method for manufacturing a flexible heater comprising a resistive track enclosed in two sheets of electrically insulating plastic material, said track comprising electrical connections to which electrical wires are connected, the method comprising the steps of: —enclosing the resistive track in the two sheets of electrically insulating plastic material—connecting the electrical wires to the electrical connections of the resistive track—putting an open mould around the connection area—injecting a liquid casting formulation into said mould—curing said composition—removing the mould.

Abstract: The present invention provides a heating element, including a transparent substrate, an adhesive agent layer provided on at least one side of the transparent substrate, a conductive heat emitting line provided on the adhesive agent layer, a coating film capsulating the conductive heat emitting line and an upper side of the adhesive agent layer not covered by the heat emitting line, a bus bar electrically connected to the conductive heat emitting line, and a power part connected to the bus bar, and a manufacturing method thereof.

Abstract: A method for making a positive temperature coefficient device includes: (a) forming a crosslinkable preform of a positive temperature coefficient polymer composition containing a polymer system and a conductive filler; (b) attaching a pair of electrodes to the preform; (c) soldering a pair of conductive leads to the electrodes using a lead-free solder paste having a melting point greater than 210° C.; and (d) crosslinking the crosslinkable preform after step (c).

Abstract: A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.

Abstract: A metal strip resistor is provided with a resistive element disposed between a first termination and a second termination. The resistive element, first termination, and second termination form a substantially flat plate. A thermally conductive and electrically non-conductive thermal interface material such as a thermally conductive adhesive is disposed between the resistive element and first and second heat pads that are placed on top of the resistive element and adjacent to the first and second terminations, respectively.

Abstract: A method for manufacturing a thermal head, including: forming a resistance heating element and an electrode on an insulating substrate, the resistance heating element emitting heat by a current flowing the resistance heating element, the electrode being connected to the resistance heating element; forming a corrosion prevention layer on the resistance heating element and the electrode; annealing the resistance heating element; adjusting an electrical resistance of the resistance heating element; and forming a protective layer on the corrosion prevention layer, the protective layer having glass as a main component. The annealing is implemented prior to the adjusting. The forming the corrosion prevention layer is implemented prior to the annealing.

Abstract: A method of making a circuitized substrate which involves forming a plurality of individual film resistors having approximate resistance values as part of at least one circuit of the substrate, measuring the resistance of a representative (sample) resistor to define its resistance, utilizing these measurements to determine the corresponding precise width of other, remaining film resistors located in a defined proximity relative to the representative resistor such that these remaining film resistors will include a defined resistance value, and then selectively isolating defined portions of the resistive material of these remaining film resistors while simultaneously defining the precise width of the resistive material in order that these film resistors will possess the defined resistance.

Abstract: A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

Abstract: The present invention is to provide an electronic component where positional accuracy for arranging members constituting a circuit element such as a resistor element and the like is mitigated and corrosion of a terminal electrode caused by sulfur in the atmosphere is reduced.

Abstract: A method for fabricating a negative temperature coefficient thermistor is provided, including the steps of: (A) combining ceramic powders having a negative temperature coefficient of resistance, a polymer binder and a solvent to form a mixture; (B) removing the solvent and granulating the mixture to form granulous powders; (C) compressing the granulous powders to obtain a thermistor material with a specific shape; (D) curing the thermistor material at 80° C. to 350° C.; and (E) mounting an electrode to the thermistor material to form the negative temperature coefficient thermistor. The method can be performed in a low temperature without the problem of interface diffusion. Further, the desired resistance value and thermistor constant (B) can be easily adjusted and obtained by mixing ceramic powders with different characteristics of temperature coefficient of resistance and/or the addition of conductive metal powder.

Abstract: The chip resistor (1) of the present invention includes an insulating substrate (2) in the form of a chip, a pair of terminal electrodes (3, 4) formed on both ends of the insulating substrate (2), a plurality of resistor films (5) formed on an obverse surface of the insulating substrate (2) in parallel with each other between the paired terminal electrodes (3, 4), and a cover coat formed on the obverse surface of the insulating substrate (2) to cover the resistor films (5). In the chip resistor (1), one of the terminal electrodes (3) includes individual upper electrodes (8) each formed on the obverse surface of the insulating substrate (3, 4) to be independently connected to a respective one of the resistor films (5) and a side electrode (9) formed on a side surface of the insulating substrate (2) to be connected to all the individual upper electrodes (8).

Abstract: A method for making chip resistor components includes: (a) forming a plurality of first and second notches in a substrate so as to form resistor-forming strips; (b) forming pairs of upper and lower electrodes on each of the resistor-forming strips; (c) forming a resistor film on each of the resistor-forming strips; (d) forming an insulator layer on the resistor film; (e) forming a hole pattern in the insulator layer and the resistor film; (f) forming an insulating shield layer on the insulator layer; (g) cleaving the substrate along the first notches so as to form a plurality of strip-like semi-finished products; (h) forming a pair of side electrodes on two opposite sides of each of the semi-finished products; and (i) cleaving each of the semi-finished products.

Abstract: A variable resistance device comprises a resistive member having a resistive resilient material. A first conductor is configured to be electrically coupled with the resistive member at a first contact location over a first contact area. A second conductor is configured to be electrically coupled with the resistance member at a second contact location over a second contact area. The first contact location and second contact location are spaced from one another by a distance. The resistance between the first conductor at the first contact location and the second conductor at the second contact location is equal to the sum of a straight resistance component and a parallel path resistance component. At least one of the first location, the second location, the first contact area, and the second contact area is changed to produce a change in resistance between the first conductor and the second conductor.

Abstract: In the case where a variable resistive element, which is made of a variable resistor provided between a first and second electrodes, and of which the electrical resistance varies by applying a voltage pulse between the two electrodes, is applied to a resistance nonvolatile memory, there is a range of the resistance value of the variable resistive element in a low resistance state where the nonvolatile memory can operate normally. In the conventional manufacturing method the resistance value of the variable resistive element is too low, therefore, it can not be controlled within a desired range of the resistance value. A step of carrying out of a reduction process is provided at any point after the step of forming a variable resistor material as a film, it has thereby become possible to increase the resistance value of the variable resistive element, which is too low in the conventional method.

Abstract: A method of securing a terminal to a ceramic heater is provided by the present disclosure. The ceramic heater includes a ceramic substrate and a resistive heating element, and the method includes exposing a portion of the resistive heating element, forming an intermediate layer on at least one of the portion of the resistive heating element and the ceramic substrate proximate the portion of the resistive heating element, the intermediate layer being selected from a group consisting of Mo/AlN and W/AlN, and bonding the terminal to the intermediate layer.

Abstract: A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

Abstract: According to one embodiment of the present invention, a method for manufacturing thin film heaters includes an automated process for applying at least one layer of ink to a conductive substrate, and forming at least one electrically conductive electrode in electrical communication with the substrate by curing the ink. When an electrical current is applied to the thin film heater, current flowing through the substrate generates heat in the substrate. In alternate embodiments, a flexographic printing process is used to overlay two similar layers of ink on a carbon impregnated substrate and cure the ink to form at least one electrode conductor.

Abstract: A multi-layer type over-current and over-temperature protection structure and a method of manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrate more than two over-current and over-temperature protection elements on a component structure that can be adhered to a substrate. Hence, the over-current and over-temperature protection structure has more than two over-current and over-temperature protection functions at the same time. Therefore, the advantages of the present invention is that the over-current and over-temperature protection structure effectively integrates two or more over-current and over-temperature protection elements together in order to increase the usage range of the over-current and over-temperature protection structure. Moreover, the present invention effectively reduces size of the over-current and over-temperature protection elements on a PCB and reduces the number of solder joints.

Abstract: A method of making capacitive/resistive devices provides both resistive and capacitive functions. The capacitive/resistive devices may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive devices conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability.

Abstract: A chip resistor includes a metal resistor element made in the form of a chip that includes an upper surface, a lower surface, two end surfaces, and two side surfaces. Two electrodes are formed on the resistor element to be spaced from each other in a longitudinal direction of the resistor element. Each of the electrodes is formed directly on the resistor element and extends continuously from the lower surface onto the upper surface via a corresponding one of the two end surfaces.

Abstract: Disclosed herein is a manufacturing method of a planar resistance heating element and a planar resistance heating element made using the method. In the manufacturing method of a planar resistance heating element by etching an aluminum foil deposited on an insulating substrate in a desired pattern, printing carbon paste and connecting current input terminals in parallel, the aluminum foil is adapted to undergo a multiple step tempering process to thereby prevent heat deformation. The carbon paste acting as a resistor element is made of electrically conductive carbon, graphite, a resin, a solvent and a hardener which are mixed so as to optimize physical properties of the carbon paste. As a result, prevention of heat deformation of the insulating substrate, uniform heat conductivity, excellent heat-generation effect and easy manufacture may be achieved.

Abstract: A semiconductor device and a method for manufacturing the same that includes terminal patterns and resistor patterns disposed between and electrically connected to the terminal patterns.

Abstract: A resistor includes first and second opposite terminations, a resistive element formed from a plurality of resistive element segments between the first and second opposite terminations, at least one segmenting conductive strip separating two of the resistive element segments, and at least one open area between the first and second opposite terminations and separating at least two resistive element segments. Separation of the plurality of resistive element segments assists in spreading heat throughout the resistor. The resistor or other electronic component may be packaged by bonding to a heat sink tab with a thermally conductive and electrically insulative material. The resistive element may be a metal strip, a foil, or film material.

Abstract: According to one aspect, an integrated circuit may comprise a first electrode, a second electrode, and a resistive switching rod extending from the first electrode to the second electrode and being at least partly embedded in a thermal barrier matrix.

Abstract: A resistive-type humidity sensing structure with microbridge includes a substrate, a sensing portion, and two measuring electrodes. An isolated layer and a bridge are respectively formed on the substrate. The sensing portion includes a resistive and humidity sensing layer. Two measuring electrodes are formed on the resistive sensing layer corresponding to the bridge, so as to fix the sensing portion on the first isolated layer for measuring resistance values of the resistive sensing layer. The material of the humidity sensing layer changes its volume according to humidity, the length of the resistive sensing layer covered by the humidity sensing layer is warped, and the changes of the length of the material for the resistive sensing layer causes variations of the resistance value. Finally, two measuring electrodes are used to measure the humidity value.

Abstract: Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

Abstract: A method of manufacturing an inexpensive fine resistor which do not require dimensional classifications of discrete substrates is disclosed. The method eliminates a process of replacing a mask according to a dimensional ranking of each discrete substrate. The method includes: dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; forming a top electrode layer on a top face of the discrete substrate; forming a resistor layer such that a part of the resistor layer overlaps the top electrode layer; forming protective layers so as to cover the resistor layer; and forming side electrode layer on a side face of the discrete substrate such that the side electrode layer is electrically coupled to the top electrode layer.

Abstract: In manufacturing a chip resistor by dividing a chip resistance substrate which includes an insulator, resistance film formed on a surface of the insulator, and a plurality of conductive strips disposed on the resistance film at fixed intervals, grooves are formed by removing a predetermined width of the resistance film including at least second prescribed severing lines. After forming the grooves, the chip resistance substrate is severed in longitudinal and lateral directions along first prescribed severing lines for dividing the conductive strips into two parts and the second prescribed severing lines perpendicular to the first prescribed severing lines so as to produce discrete chip resistors.

Abstract: Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.

Abstract: A method of manufacturing a composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an intermediate layer of the structural reinforcement material disposed between the electrical devices. At least one electrical bus is disposed in the structural member, and each electrical device is connected to the bus by a conductive electrode. Thus, the electrodes can extend through the intermediate layer of the structural reinforcement material to connect each of the electrical devices to one or more of the buses.

Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.

Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.

Abstract: A method for manufacturing the same, wherein the monolithic ink-jet printhead includes a manifold for supplying ink, an ink chamber having a hemispheric shape, and an ink channel formed monolithically on a substrate; a silicon oxide layer, in which a nozzle for ejecting ink is centrally formed in the ink chamber, is deposited on the substrate; a heater having a ring shape is formed on the silicon oxide layer to surround the nozzle; a MOS integrated circuit is mounted on the substrate to drive the heater and includes a MOSFET and electrodes connected to the heater. The silicon oxide layer, the heater, and the MOS integrated circuit are formed monolithically on the substrate. Additionally, a DLC coating layer having a high hydrophobic property and high durability is formed on an external surface of the printhead.

Abstract: Resistive igniter systems are provided that comprise a metal substrate with an associated resistive igniter element in electrical connection through braze applied to the metal substrate. Igniter systems of the invention can enable significantly simplified manufacturing as well as notably higher yield production of more robust igniters. In preferred systems, the braze material is applied to the metal substrate prior to adjoining the igniter and metal substrate, which can enable application of a relatively precise amount of braze in a defined area of the metal substrate.

Abstract: A multiple chip resistor is manufactured in the following method. First electrode layers are formed on a first surface of a substrate. Resistor elements electrically connected to the first electrode layers, respectively, are formed on the first surface of the substrate. Slits are formed in the substrate for separating the first electrode layers. Edge electrodes connected to the first electrode layers at the edges of the slits, respectively, are formed on respective edges at the slits of the substrate. The substrate is divided at the slits into strip substrates. Portions of the edge electrodes are removed for electrically isolating the resistor elements from each other. The method provides the edge electrodes on each strip substrate with an improved dimensional accuracy, hence allowing the edge electrodes to be isolated electrically from each other. Consequently, the multiple chip resistor is prevented from being mounted defectively when the resistor is surface-mounted.

Abstract: A metal sheathed heater utilizes splice connections that connects ends of a heater cable with ends of a lead wire. Each splice connection has a connector that connects core wires of the lead wires and heater cable together. Heat shrinkable tubing surrounds the connector and ends of the heater cable and lead wires. An adhesive is interposed between the heat shrinkable tubing and heater cable and lead wire ends to bond with the heat shrinkable tubing and complete the splice connection. The metal sheath of the heater can be formed with an enlarged diameter portion to account for the heat shrinkable tubing surrounding the lead wire and heater cable ends.

Abstract: The substrate (2) containing the via-hole (3) is inserted into an electrophoretic cell (1) and an electrode (6) (the “first electrode”) is placed on top of a first orifice of the via-hole(s) (3), to be implemented with electrical component(s), so that the electrode (6) totally covers the first orifice. Electrically charged either conductive and/or non-conductive particles are provided by immersing the volume of the via-hole(s) (3) in a conductive medium (17) consisting of the electrically charged particles. An electric field is created between the first electrode (6) and a second electrode (4) through the via-hole(s) (3) and the conductive medium (17) and the electrically charged particles are precipitated on the inner surface of the first electrode (6) that is directed to the second orifice of the via-hole(s) (3), until a desired portion of the volume of the via-hole(s) (3) is filled with a first layer of the charged particles having a desired thickness.