Abstract: A radio frequency identification system includes: supplying a radio frequency identification tag including providing a radio frequency identification transponder and writing transponder content to the radio frequency identification transponder; and feeding the radio frequency identification tag for an assembly line.

Abstract: An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element being alignable with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligning with the substrate alignment element to position one or more components at a specified location on the substrate.

Abstract: A method and system for packaging and mounting a sensor to a flex plate for use in sensing, for example, torque. In some instances, a SAW sense die can be adhesively bonded to a metal disc that includes at least one locating feature formed in the metal disc. An insulator having lead pins can be adhesively bonded to the metal disc, and may surrounds at least part of a periphery of the sense die in a particular orientation. In some instances, a cap may be bonded over the insulator. The metal disc, along with the SAW sense die, can be aligned to the flex plate by, for example, matching the at least one locating feature formed in the metal disc with at least one corresponding locating feature of a cutout in the flex plate. The aligned metal disc and the flex plate can be bonded together by, for example, laser welding.

Abstract: A electronic apparatus manufacturing cell defining an electronic apparatus manufacturing cell envelope having a first side and having a second side opposite the first side. According to one aspect, the electronic apparatus manufacturing cell comprises an infeed conveyor, a pass conveyor and a reject conveyor. The infeed conveyor extends from a point outside of the electronic apparatus manufacturing cell envelope on the first side to a point inside of the envelope. The pass conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the second side. The reject conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the first side.

Abstract: Provided herein are methods, apparatuses and systems for fabricating photovoltaic cells and modules. In certain embodiments, the methods, apparatuses and systems involve coating ferromagnetic substrates with thin film solar cell materials and using magnetic force to constrain, move or otherwise manipulate partially fabricated cells or modules. According to various embodiments, the methods, apparatuses and systems provide magnetically actuated handling throughout a photovoltaic cell or module fabrication process, from forming photovoltaic cell layers on a substrate to packaging the module for transport and installation. The magnetically manipulated processing provides advantages over conventional photovoltaic module processing operations, including fewer mechanical components, greater control over placement and tolerances, and ease of handling. As a result, the methods, apparatuses and systems provide highly efficient, low maintenance photovoltaic module fabrication processes.

Abstract: The present invention generally relates to an automated solar cell electrical connection device that is positioned within an automated solar cell fabrication system. The automated solar cell electrical connection device includes a module and process for automatically attaching a junction box to a composite solar cell structure during the fabrication of a completed solar cell device.

Abstract: The present invention generally relates to an automated solar cell electrical connection device that is positioned within an automated solar cell fabrication system. The automated solar cell electrical connection device includes a module and process for automatically attaching a junction box to a composite solar cell structure during the fabrication of a completed solar cell device.

Abstract: A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: A robotic tool for assembling a portion of a disk drive includes a movable end effector that includes a first portion and a second portion that is movable relative to the first portion. The first portion may be configured to engage the actuator assembly and the second portion may be configured to engage the flex circuit connector. A controller may be provided to control the movable end effector, causing the end effector to pick up the head stack assembly in a first configuration, move the second portion of the end effector relative to the first portion thereof so as to articulate the head stack assembly into a second configuration that is different than the first configuration, and place the head stack assembly into the base.

Abstract: An apparatus and a method for automatically joining components of photovoltaic elements are disclosed. The apparatus includes: a) at least two manufacturing lines and at least two assembly bridges for joining the substrates, films and glass panes, b) a stacking device for film feeding and a conveyor belt for feeding the glass panes, c) devices for centering and suctioning the films and the glass plates, d) devices for transporting and fixing the film transport frame and the glass transport frame e) devices for lowering the films and the glass plates from the respective transport frames, and f) devices for further transport.

Abstract: A component placement device suitable for placing a component on a substrate comprises at least one component feeder, at least one substrate conveyor as well as at least one component pickup and placement device for picking up a component from the component feeder and placing said component on a substrate supported by the substrate conveyor.

Abstract: The invention relates to a device and a method for applying semiconductor chips (5) to a plurality of carriers (4), especially smart card modules or flexboards. According to the invention, an adhesive application device (1) is used to apply an adhesive to pre-defined positions on the carrier (4), a fitting device (2) is used to apply the semiconductor chips (5) to the positions on the carrier (4), and a hardening device (3) is used to harden the adhesive. The hardening device (3) and/or another device can be connected to a conveyor belt (6) for transporting the carrier (4) along the devices, by means of a clamping device (13, 14), and can be displaced in the transport direction at the speed of the conveyor belt (6), by means of a lifting device (15).

Abstract: A method and apparatus for compressing the endplate of an electric generator to relieve the restraining force on a plurality of key blocks that restrain the endplate in compression. The method includes simultaneously applying independent compressive loads at each of the key block locations to the endplate to relieve pressures on the key blocks and removing the key blocks so the endplate can be removed.

Abstract: Disclosed herein is a development apparatus having a plurality of coating units and a development process unit stacked on each other in a layered direction in a process block which is connected at the rear side of the carrier block. A first transportation unit, which ascends and descends in the layered direction, is provided in the carrier block. Also, in the carrier block, the bottom of a substrate inspection unit is located above a highest position to which the first transportation unit is able to ascend in the layered direction.

Abstract: A production program creating system creates a production program having a module in which a processing for producing a board is described. The board is produced by mounting an electronic component supplied from a component feeding device onto the board by means of a component mounting device. The component mounting device is described in model form, and a configuration information of the component mounting device is stored in a database. The module is created such that the module works with respect to the component mounting device that is described in model form, and such that the module performs a generalized processing by acquiring the configuration information of the component mounting device from the database.

Abstract: A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.

Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Abstract: A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.

Abstract: A component placement device includes: (a) an elongated transport device by means of which substrates to be provided with components can be moved in a transport direction parallel to the transport device; (b) at least one component feeder that is located along a longitudinal side of the transport device; (c) at least one component pick-and-place unit by means of which in operation a component can be picked-up from the component feeder and placed on a substrate; and (d) a substrate support, which is located along a longitudinal side of the transport opposite to the component feeder.

Abstract: An electronic component mounting apparatus includes a mounting device adapted such that the applying unit applies adhesive to a substrate located in a predetermined site, a mounting unit mounts an LSI onto the application of the adhesive, subsequently the applying unit applies another adhesive onto the LSI, and the mounting unit mounts a reinforcing plate onto the application of the adhesive, a conveying device which conveys the substrate with the LSI and reinforcing plate mounted in the predetermined site by the mounting device to a heating site, and a heating unit which bonds, by the application of heat, the LSI and reinforcing plate on the substrate conveyed to the heating site.

Abstract: A base plate for magnetic disk drives is provided that includes a hooked protrusion integrated therein between adjacent spindle motor coils. The cross-over wires that span between adjacent coils are secured by the hooked protrusions, thereby optimizing coil height and reducing manufacturing steps. The hook-like protrusions of one embodiment of the present invention are preferably stamped into the base plate.

Abstract: Carriers (10) holding parts (50) for assembling complex MEMS devices are transported to a central assembly location. The parts are stacked in a pre-assigned order and later released from their carriers. Alternatively, they are positioned over the appropriate location and released so as to fall into position as needed. The assembly area (100) includes a cavity below the plane of the carriers such that the parts held within the carrier drop into the cavity. Heating elements are integrated into the cavity to assist in the release of the parts. The cavity is supplied with parts by one or more carriers which are move around by any number of MEMS drive systems (200, 250). The cavity and some of the MEMS assembled therein deliver with precision amounts of materials as required suitable for biomedical applications, or may be processed in-situ, as in an on-chip laboratory.

Abstract: A component-mounting apparatus and a component-positioning unit for positioning a component, having a simple structure with reduced manufacturing cost and a significantly higher component-mounting speed. The component-mounting apparatus includes a holding device that holds a component and moves horizontally and a positioning device having a sloped portion for positioning the component held by the holding device when the component comes into contact with the sloped portion. The positioning device comprises a first rotatable roller member having a sloped side surface with which the component comes into contact; and the horizontal movement speed of the holding device substantially agrees with the horizontal component of the peripheral velocity of the first roller member, with which the component comes into contact.

Abstract: Disclosed herein is a modular system for manufacturing printed circuit boards. The system comprises a plurality of pieces of processing equipment including at least one assembly material applicator, and at least one electronic component placement machine, and a transport system configured to transport circuit boards from the at least one stencil printer to the at least one electronic component placement machine, the system including an upper track and a lower track disposed below the upper track.

Abstract: A component placement device suitable for placing a component on a substrate comprises at least one component feeder, at least one substrate conveyor as well as at least one component pickup and placement device for picking up a component from the component feeder and placing said component on a substrate supported by the substrate conveyor.

Abstract: In an electronic component mounting method of mounting electronic components on a substrate by means of soldering by using an electronic component mounting system having a screen printing apparatus and an electronic component mounting apparatus connected to each other to manufacture a mounting substrate, prior to a screen printing process, the positions of pattern holes provided in a screen mask are measured to calculate mask aperture data, and the coordinates of a mounting position when a component mounting operation is performed by a mounting head are calculated, on the basis of the mask aperture data. In this way, it is possible to calculate the positional deviation of solder, without measuring the position of solder after printing whenever the solder is printed, and to prevent defects in mounting due to the positional deviation of solder, which results in high productivity.

Abstract: A substrate transferring method and a method for fabricating a flexible display by using the same are disclosed. The method for transferring a substrate includes providing a glass substrate with a recess formed thereon, aligning a flexible substrate on the glass substrate, inserting the flexible substrate in the recess of the glass substrate, and transferring the flexible substrate-inserted glass substrate for a process. The flexible substrate is insertedly fixed in the recess of the glass substrate and transferred, or a process is performed thereon, so that the transfer method is simplified and the process stability can be obtained.

Abstract: An insulator-combining apparatus which can correctly detects whether or not insulators are lined up in a predetermined sequence is provided. The plate-combining apparatus includes a plate-setting jig which includes a frame, holder, combining part and erroneous attaching-preventing part. The holders hold insulating plates and are provided being spaced from each other and supported by the frame capable of approaching and leaving each other. The combining part includes a pair of nipping members which positions the holder therebetween so as to cause the holders to approach each other. The erroneous attaching-preventing part prevents the holders from approaching each other until the insulators combine with each other when an incorrect insulating plate is attached on the holder.

Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.

Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

Abstract: An apparatus is provided for supporting a PCB substrate during printing. The apparatus includes first and second fixing units that cooperate to edge-clamp the substrate. The first fixing unit includes a first movable plate, a first actuator, and a first stopper that limits outward movement of the first movable plate. The second fixing unit includes a second movable plate, a second actuator, and a second stopper that limits outward movement of the second movable plate. When printing the substrate from the first edge to the second edge, the first and second fixing units operate so that the second actuator moves the second movable plate outwardly to contact the second stopper, and the first actuator moves the first movable plate inwardly to press the substrate toward the second movable plate. When printing the substrate from the second edge to the first edge the first and second fixing units operate oppositely.

Abstract: The present invention relates to an apparatus for producing a comb-like capacitor element member including a guide member and a plurality of rectangular metal foil pieces bonded to the guide member, comprising an automatic feed mechanism for feeding tape-like metal foil by a constant length toward the guide member, a bonding mechanism for bonding the metal foil to the guide member, and a cutting mechanism for cutting the bonded metal foil. According to the apparatus of the present invention, a comb-like capacitor element member having a plurality of rectangular metal foil pieces bonded can be produced efficiently, by bonding the elongated tape-like metal foil without damaging it.

Abstract: [Problems] To provide a surface mounting apparatus in which abutting members will not abut on a printed wiring board when the abutting members are lowered. [Means for Solving the Problems] A surface mounting apparatus includes a conveyer 34 or 53 that support a printed wiring board 2 movably in a transportation direction, and a board transfer device 14 that lowers a pair of tab members 71 and 71 to positions spaced apart upstream and downstream of the printed wiring board 2 in the transportation direction and moves the tab members 71 in the transportation direction. The board transfer device 14 includes an interval changing device that changes an interval between a pair of the tab members 71 and 71 and a sensor that detects the position of the printed wiring board 2 on the conveyer.

Abstract: The present invention is intended to realize a hold posture inspection of a plurality of components sucked by a plurality of nozzle rows provided on a head with a single scanning operation, thereby reducing the time for the hold posture inspection and improving the accuracy thereof. In order to achieve such objections, the present invention includes: a head on which at least two nozzle rows are disposed, each of which includes at least one nozzle; a circuit board holding unit for holding a circuit board on which components conveyed by the head are mounted; and an inspection unit, provided on a moving path of the head from a supplying unit to the circuit board holding unit, for inspecting hold postures of the components held by the nozzles of the head and including sensors for posture inspection independent for the respective nozzle rows.

Abstract: A printed-board supporting apparatus includes a support pin that is attached to a pin-supporting table. An image of the support surface of the support pin is taken by a mark-image taking device, at a first position where a center of an image-take surface of the mark-image taking device is expected to coincide with a center of the support surface of the support pin. Another image of the support surface is taken at a second position where the center of the image-take surface is distant from the center of the support surface by a predetermined distance. At the second position, the image of the support surface is formed on the image-take surface at a position corresponding to the height of the support surface. Based on the position corresponding to the height of the support surface, the height of the support surface relative to the mark-image taking device is obtained.

Abstract: An interposer bonding device 3 is intended for bonding an interposer 10 having an interposer-side terminal to a base circuit sheet 20 provided with a base-side terminal. The interposer bonding device 3 has a press anvil 31 that holds the base circuit sheet 20 on which the interposer 10 is laminated and a bonding head 32 that moves relatively with respect to the press anvil 31. The bonding head 32 has a pressing surface 320 that presses the rear surface of the interposer by abutting against this surface. The pressing surface 320 scans the rear surface of the interposer 10 by the relative movement of the bonding head 32 with respect to the press anvil 31 and presses the whole surface of the interposer-side terminal 12 toward the base circuit sheet 20.

Abstract: A tool is provided for removing a circuit breaker from a mounting member or a housing. The tool includes a housing having a first end, a second end, a first side, a second side, a surface, and an axis. Disposed at the first end of the housing is a recess that is structured to receive the operating handle or actuator lever of the circuit breaker, while a number of apertures are disposed substantially adjacent to the second end of the housing. One or more mechanical fasteners extend through the apertures and secure the housing to the circuit breaker.

Abstract: An apparatus for producing an electronic inductor includes a coil winder, a locator of inductor, and a spot electric welder. The coil winder includes a brushless DC motor, a single chip for controlling the DC brushless motor and a digital display screen. Locator of inductor is connected to a rotational axis of the DC motor of the coil winder via a connecting pole. Because the apparatus has multi-function, it can accomplish winding the coil, locating, removing the painting, welding and testing the electrical characteristic at the same time and much of the manual operation is replaced by the apparatus, not only the productivity is improved greatly, but also the product quality is ensured.

Abstract: An induction forging coil apparatus which makes induction forge coils easier and faster to change on a forge-line. The coil insert is a separate independent unit by itself which slides into the frame to connect to the frame via bus connections and other components. The coil insert is attached to the frame (another separate independent unit by itself) to complete the overall induction heating coil. The induction coil (with both units attached and operatively interconnected) can run on the forge line until it blows/fails, and instead of pulling the whole induction coil (both units attached) off-line to be rebuilt; the frame can be left on-line (or pulled off-line for a brief period of time if there is not enough room to reach the components due to the particular forge-line setup) to switch the failed insert with a new or rebuilt insert, by disconnecting the failed coil insert from the frame and then reconnecting the frame with the new or rebuilt coil insert.

Abstract: This invention provides an electronic component mounting apparatus which can detects an electronic component held by a suction nozzle without fail after a mounting operation of electronic components on a printed board and perform various processes in a case where the electronic component is held by the suction nozzle.

Abstract: A pick-up tool for gripping a die comprises a sleeve and a gripping member. The sleeve has a longitudinal bore extending in the longitudinal direction in which the gripping member is inserted. The gripping member is held in the sleeve displaceably in the longitudinal direction. A portion of the gripping member protrudes from the sleeve. The gripping member assumes a predetermined position relative to the sleeve at the absence of any external action of force on the portion of the gripping member protruding from the sleeve, in which the portion of the gripping member protruding from the sleeve is held in a play-free manner radially to the longitudinal direction. In the case of action of force in the longitudinal direction on the portion of the gripping member protruding from the sleeve, the gripping member can be inserted further into the sleeve and is then radially movably held in the longitudinal bore of the sleeve. The mass of the gripping member is not more than 1 gram.

Abstract: An apparatus for transplanting a multi-board is provided. This apparatus includes an orientation device, a calibration device, and an image-adjusting device. The orientation device has a first movable platform, and the multi-board is fixed on the first movable platform. The calibration device has a second movable platform and is used for moving a substitution circuit board to a recombination position of the multi-board. The image-adjusting device captures image data of the multi-board and the substitution circuit board and compares the image data to obtain an error signal. The calibration device receives the error signal and moves the second movable platform according to the error signal in order to calibrate the relative position between the substitution circuit board and the multi-board.

Abstract: An apparatus for workpiece assembly is disclosed. In the illustrated embodiment, the apparatus includes a carousel which rotates between a plurality of assembly stations for assembly. Workpieces are loaded onto or unloaded from the carousel at a load/unload station and the carousel rotates to position workpieces proximate to the plurality of assembly stations. As illustrated workpieces are loaded into a plurality of assembly nests on the carousel. The plurality of assembly nests include alignment fingers rotatable with the plurality of assembly nests or carousel to align components, for example to align discs of a hydrodynamic spindle assembly for merge operations.

Abstract: A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to slow down starting position where there is no risk that the electronic component makes contact with the substrate (S1), and from there the head is lowered at low speed until a predetermined target contact load is detected. The process of lowering the head at low speed includes the steps of moving down the head a predetermined distance (S3), measuring load after the step of moving down the head (S5), and determining whether the measured contact load has reached the target contact load (S9). The steps of moving down the head (S3) and measuring the load (S5) are repeated until the measured load reaches the target contact load. The actual load is precisely controlled to be close to a very small set level of target contact load. Accordingly, electronic components using low dielectric constant material are mounted without the risk of damage.

Abstract: The present invention generally relates to a system that can be used to form a photovoltaic device, or solar cell, using processing modules that are adapted to perform one or more steps in the solar cell formation process. The automated solar cell fab is generally an arrangement of automated processing modules and automation equipment that is used to form solar cell devices. The automated solar fab will thus generally comprise a substrate receiving module that is adapted to receive a substrate, one or more absorbing layer deposition cluster tools having at least one processing chamber that is adapted to deposit a silicon-containing layer on a surface of the substrate, one or more back contact deposition chambers, one or more material removal chambers, a solar cell encapsulation device, an autoclave module, an automated junction box attaching module, and one or more quality assurance modules that are adapted to test and qualify the completely formed solar cell device.

Abstract: The inventive electronic component mounting apparatus for mounting an electronic component on a substrate includes a substrate positioning unit for individually positioning a single large-sized substrate or two small-sized substrates carried into a mounting conveyor in respective mounting work positions and a substrate underside support part arranged below the mounting conveyor and including a first underside support part and a second underside support part. It is thus possible to position a single substrate in a mounting work position in case a large-sized substrate is handled and to individually position a plurality of substrates in a plurality of mounting work positions in case a small-sized substrate is handled. This ensures flexible component mounting work on plural types of substrates by a compact facility.

Abstract: An apparatus and a method for manufacturing a printed circuit board are disclosed. The apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which press the board and an insulator together; an elastic coating layer, formed on a surface of the upper roller; and a cleaning device, which removes impurities from a surface of the elastic coating layer. The apparatus does not require a separate device for performing a cushioning function and a detaching function between the bumps and the rollers, and the rollers can be kept clean using a cleaning device.

Abstract: In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus. This eliminates the waste of time attributable to transfer of substrates and enhances the production efficiency by a compact facility.

Abstract: A wire-processing device has a swivel-arm with gripper and open gripper-jaws and is able to thread a wire into a guide-tube arranged on a holder of the gripper and which serves as feeder to feed wire-ends to processing stations. The swivel-arm with the gripper is swiveled with reduced torque from a neutral position toward a wire-guide that functions as a threading aid, a pipe of the gripper actuating the wire-guide from a rest position to a working position. To allow threading of the wire into the guide-tube, the wire-guide bridges a distance between the pipe and the holder. After threading, the swivel-arm swivels back into the neutral position, the gripper-jaws being thereby closed, and the wire-guide is returned to the rest position by a tension spring.

Abstract: A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.