Abstract: A electronic apparatus manufacturing cell defining an electronic apparatus manufacturing cell envelope having a first side and having a second side opposite the first side. According to one aspect, the electronic apparatus manufacturing cell comprises an infeed conveyor, a pass conveyor and a reject conveyor. The infeed conveyor extends from a point outside of the electronic apparatus manufacturing cell envelope on the first side to a point inside of the envelope. The pass conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the second side. The reject conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the first side.

Abstract: A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises: Forward feeding the substrate along a transport direction designated as x direction, Equipping a predetermined number of columns with semiconductor chips in accordance with the steps: Moving the pick and place device to an x position corresponding to the column to be equipped, Moving the die ejector to this x position, and Equipping the substrate places of the column.

Abstract: A structured cabling tool includes a lower frame base that supports cable axles, the tool being extended in a ready for use condition and compacted in a ready for transport condition; frame arms supported by the lower frame base, the frame arms fixable upright orthogonal to the lower frame base in the ready for use condition and coextensive with the lower frame in the ready for transport condition; a cable sorting threader supported between the frame arms; and a revolvable tape segmenting spindle supported by the frame arms below the cable sorting threader.

Abstract: In manufacturing a semiconductor device, a first chamber is provided. An opening couples the first chamber to a first environment through which at least one substrate can pass. A first seal environmentally isolates the first chamber from the first environment. A process chamber is coupled to the first chamber. Another seal environmental isolates the first and the process chambers. The substrate is placed within the first chamber, and the first chamber and the outside environment are isolated. The second opening is opened, and the substrate moves into the semiconductor process chamber. The first chamber is again environmentally isolated from the second volume. A semiconductor processing step is performed on the substrate within the processing chamber. While the substrate is processed, the substrate is rotated and translated through the processing chamber.

Abstract: A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: A back-up table for a chip mounter. The back-up table for a chip mounter includes a base plate, a back-up plate spaced a predetermined distance from the base plate to support a back-up pin that supports a printed circuit board, and at least one set of link units installed between the base plate and the back-up plate and facing opposite to each other. The back-up table further comprises a first driving part installed between the opposite facing link units and operating the link units to raise and lower the back-up plate, and a second driving part serially connected to the first driving part.

Abstract: Reference marks arranged at specified intervals on a glass board are recognized, and from its recognition results, offset values for individual areas matching the board size are determined as numerical values for correction use, and further corresponding offset values for individual movement positions of a component placing head are reflected as numerical values for correction use in operation of placing position correction, mark recognition correction, or measurement of placing position offset values, respectively. Thus, high-accuracy placing is achieved. Moreover, correction of positional displacement of a component holding member due to an inclination of the component placing head is performed.

Abstract: An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

Abstract: A system for fabricating semiconductor components includes a semiconductor substrate, a thinning system for thinning the semiconductor substrate, an etching system for forming the substrate opening, and a bonding system for bonding the conductive interconnect to the substrate contact. The semiconductor component can be used to form module components, underfilled components, stacked components, and image sensor semiconductor components.

Abstract: The present invention relates to an apparatus for producing a comb-like capacitor element member including a guide member and a plurality of rectangular metal foil pieces bonded to the guide member, comprising an automatic feed mechanism for feeding tape-like metal foil by a constant length toward the guide member, a bonding mechanism for bonding the metal foil to the guide member, and a cutting mechanism for cutting the bonded metal foil. According to the apparatus of the present invention, a comb-like capacitor element member having a plurality of rectangular metal foil pieces bonded can be produced efficiently, by bonding the elongated tape-like metal foil without damaging it.

Abstract: A surface mounting device and method for fabricating a printed circuit board (PCB) are provided. The device includes at least one pair of surface mounters, a feed conveyor for transporting a PCB to be fed to the surface mounters, a discharge conveyor for transporting a PCB to be discharged from the surface mounters and an elevator provided between the surface mounters, the elevator transporting a PCB discharged from one of the surface mounters to the discharge conveyor, and feeding a PCB transported by the feed conveyor to another one of the surface mounters. In a surface mounting device for a PCB configured as described above, each of the multiple surface mounters completes an assembly operation of integrated circuit chips on one PCB. Even when a failure or a malfunction occurs in one of the surface mounters, other surface mounters can normally continue an assembly operation because a feed and a discharge path of a PCB are set to bypass other surface mounters.

Abstract: The present invention relates to an apparatus for producing a comb-like capacitor element member including a guide member and a plurality of rectangular metal foil pieces bonded to the guide member, comprising an automatic feed mechanism for feeding tape-like foil by a constant lenght toward the guide member, a bonding mechanism for bonding the metal foil to the guide member, and a cutting mechanism for cutting the bonded metal foil. According to the apparatus of the present invention, a comb-like capacitor element member having a plurality of rectangular metal foil pieces bonded can be produced efficiently, by bonding the elongated tape-like metal foil without damaging it.

Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Abstract: Tooling fixtures and methods are described for securing a solid-matrix panel for cutting. In one embodiment, a tooling fixture includes a first clamping system and a second clamping system. The first clamping system receives a solid-matrix panel of PCBs and secures the solid-matrix panel for cutting of the solid-matrix panel along a first axis. Once secured, a cutting apparatus cuts the solid-matrix panel along the first axis between the PCBs to cut the solid-matrix panel into a plurality of strips. The second clamping system then moves into a position relative to the strips of the solid-matrix panel and secures the strips for cutting of the strips along a second axis. When secured by the second clamping system, the cutting apparatus cuts the individual PCBs from the strips.

Abstract: A component mounting apparatus has a stage 41 with a fixed height position for holding a substrate 5, and a mounting head 48 that releasably holds a component 2, is moved downward toward the stage 41 from a first reference height position HB1 fixedly positioned above the stage 41, and mounts the held component 2 on the substrate 5 or an already mounted component 2. A controller 14 has a mounting reference height calculation unit 103 for calculating a mounting reference height Hn corresponding to a distance from the first reference height position HB1, and a first target movement height calculation unit 104 for calculating a first target movement height ZTAGn based on at least the mounting reference height Hn and a thickness PTn of the component 2 held by the mounting head 48.

Abstract: A test device for a heat dissipating fan, which is suitable for testing if the fan wheel is secured to the housing firmly, includes a support post, a transverse slide unit, which is disposed at the top of the support post and provides a transverse slide seat, a vertical slide unit, which is disposed at the transverse slide seat and provides a vertical slide seat. Further, the test device provides a clamping unit, a suction unit and a sensing element, which are moved with the vertical slide seat. The clamping unit clamps the housing and the suction unit absorbs the fan wheel. The heat dissipating fan is admitted in case of the sensing unit sensing the fan wheel being incapable of moving upward under the suction force and is carried away by the transverse slide unit in case of the sensing unit sensing the fan wheel being capable of moving upward under the suction force.

Abstract: A component mounting apparatus having a work conveyor-positioner unit is arranged on a supporting base to convey and position a substrate in an X direction. Supporting frames extend vertically from ends of the supporting base and face each other in a Y direction. The component mounting apparatus further includes a plurality of Y-axis tables extending between upper ends of the supporting frames, X-axis tables attached to movable portions of the Y-axis tables, and operating heads attached to movable portions of the X-axis tables to perform operations with respect to the substrate on the work conveyor-positioner unit. Each of the plurality of the Y-axis tables includes a movable portion at a lower part. Each of the X-axis tables includes a movable portion at a lower part and the operating heads are attached to a lower part of the movable portion of the X-axis tables.

Abstract: A working system for a circuit substrate enabling a control of stopping the substrate without inconvenience. A PWB detector 308 held by a Y-axis slide 252 of an XY robot 266 moving a component mounting head, has reflection type photoelectric sensors 310, 312 spaced from each other in a direction of conveyance of a PWB 12 by a conveyor 14. When the PWB 12 carried in the system, the sensors 310, 312 are moved to a position corresponding to a downstream-side edge of the PWB 12 stopped at a predetermined stop position. The PWB 12 is decelerated when detected by one of the sensors on the upstream side, and stopped at a desired position regardless of its shape, dimensions and conveying direction, when detected by the other or downstream sensor. Electronic circuit components 16 can be supplied to plural kinds of PWBs 12 with one component supply device.

Abstract: An apparatus is provided for supporting a PCB substrate during printing. The apparatus includes first and second fixing units that cooperate to edge-clamp the substrate. The first fixing unit includes a first movable plate, a first actuator, and a first stopper that limits outward movement of the first movable plate. The second fixing unit includes a second movable plate, a second actuator, and a second stopper that limits outward movement of the second movable plate. When printing the substrate from the first edge to the second edge, the first and second fixing units operate so that the second actuator moves the second movable plate outwardly to contact the second stopper, and the first actuator moves the first movable plate inwardly to press the substrate toward the second movable plate. When printing the substrate from the second edge to the first edge the first and second fixing units operate oppositely.

Abstract: A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.

Abstract: In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.

Abstract: A contact member is supported on the support shaft. A force sensor is coupled to the support shaft. A movable member is coupled to the force sensor. The pressure apparatus allows the movable member to cause the axial movement of the support shaft. A first guide serves to guide the axial movement of the support shaft. The first guide is supported on the support member. The support member stands still during the movement of the movable member. Accordingly, the movement of the movable member is restrained in the axial direction. The contact member is thus prevented from suffering from a swinging movement around the force sensor. Servo control of a higher frequency bandwidth can be applied to the movement of the contact member. The contact member moves at a higher velocity. Occurrence of resonance is still avoided in the contact member. The tact time can be shortened.

Abstract: A system for populating a three dimensional array of semiconductor chips is disclosed. The system facilitates the surface mounting of semiconductor chips with chip carriers to achieve the three dimensional array of chips. The system includes a chip carrier pallet that holds and moves the chip carriers for the automatic assembly of a circuit board. The system also may include a print fixture pedestal that works in combination with the chip carrier pallet to position chip carriers for automatic deposition of solder on a multitude of carriers at once, and then position them for addition to a circuit board.

Abstract: An intermediate product manufacturing apparatus for carrying intermediate products and processing the intermediate products with a plurality of processing apparatuses is provided, the apparatus comprising: a plurality of carrying means for carrying the intermediate products to the processing apparatuses; a common processing apparatus provided between the plurality of carrying means, for carrying out a common process on the intermediate products carried by the carrying means; and intermediate product transfer sections provided between the plurality of carrying means, for transferring the intermediate products between the common processing apparatus and the carrying means.

Abstract: An apparatus for forming a wire mat includes a wire guide for simultaneously guiding multiple moving wires onto a moving plastic sheet. A pressure roll arrangement downstream from the wire guide has a first pressure roller and a second pressure roller that is engageable with the first pressure roller. The pressure rollers can apply pressure along a line of contact for combining the multiple wires with the plastic sheet between the rollers. The wire guide and one of the pressure rollers are configured to allow a voltage potential to be formed between the wire guide and the pressure roller for causing current to flow and heating of a portion of the wires between the wire guide and the pressure roller. The portion of the wires that is heated is capable of heating portions of the plastic sheet to allow the wires to be embedded into the plastic sheet by the pressure rollers along the line of contact to form a wire mat.

Abstract: Provided is a component mounter having a plurality of revolving nozzle spindles, which can simultaneously pick up and mount two or more electronic components. A head assembly for the component mounter includes: a base frame; a rotary housing rotatably mounted on the base frame and having spindle receiving holes vertically formed at regular intervals at the same radius from a center thereof; a plurality of nozzle spindles having lower ends to which nozzles for picking up electronic components are coupled, and received in the spindle receiving holes such that the plurality of nozzle spindles rotate on the same axis when the rotary housing rotates; a housing rotating mechanism rotating the rotary housing; and a nozzle lifting mechanism including a nozzle lift driving unit, and a clutch part that moves according to the operation of the nozzle lift driving unit and can simultaneously press down and lower the plurality of nozzle spindles.

Abstract: The present invention provides a measurement apparatus for obtaining a suitable position on a suspension where a more miniature magnetic head slider is to be mounted to the suspension, the apparatus including a front camera having a photographing optical axis within a plane parallel to a plane of extension of a suspension and directed to the suspension, and a side camera having a photographing optical axis within the parallel plane and which is different from that of the front camera. Coordinates of a top portion of a convex surface of a dimple formed in the suspension are obtained with these cameras. The resultant coordinates and coordinates of the deepest portion of a recess surface of the dimple are correlated with each other, whereby in actual mounting of the magnetic head slider, the deepest portion of the recess surface of the dimple which is readily recognized is measured.

Abstract: The invention relates to tooling for preparing a large-section harness comprising at least one cable. The tooling includes an output module (19) for receiving the terminal end of the cable. The output module (19) comprises three tools mounted on an output body (20) that is movable on a tray (1) so that each of the tools can be presented in alternation in register with the terminal end of the cable, the tools comprising a first tool (22) for marking cutting and stripping lengths for the cable, a second tool (28) for marking the position and the orientation of the terminal connection member (29), and a third tool (30) for checking that the terminal connection member (29) is in the proper position and orientation after it has been crimped to the terminal end of the cable.

Abstract: An apparatus and method for soldering an LED driving element to an LCD panel includes a panel holding unit, a rotating unit and a soldering unit. The panel holding unit holds the display panel. The rotating unit supports the panel holding unit at initial radial and angular positions relative to a center of rotation of the rotating unit and rotates the holding unit in a horizontal plane about the center of rotation to selected angular positions relative thereto. The soldering unit is disposed above the rotating unit at the initial radial position and at a first angular position relative to initial angular position of the holding unit, and is operable to solder the driving element of the display panel held by the panel holding unit when the rotating unit rotates the panel holding unit to the first angular position. The apparatus and method provide improved display panel productivity.

Abstract: A method and system for maximizing process capability in a progressive forming operation. The method compensates for deviations introduced by unformed components, and uses closed loop feedback to compensate for deviations introduced by forming tools. Fiducial features are detected on an incoming component, and a first compensation value is calculated from displacement of the fiducial features from an ideal forming location on the component. Component position with respect to a theoretical forming position is adjusted according to the first compensation value. Placement of a feature formed on the component at the adjusted position is detected and compared to the ideal forming location to obtain a difference value. A second compensation value is derived from a plurality of difference values. Forming positions for subsequent incoming components are adjusted with respect to the theoretical forming position according to first and second compensation values.

Abstract: A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

Abstract: The present invention provides a tray for holding components having first and second sides, wherein the first side has at least one first component receptacle for engaging said component; and the second side has at least one component engaging member, and further wherein the first component receptacle and the component engaging member are aligned such that when multiples of the tray are stacked upon each other the first component receptacle and the component engaging member will cooperate to restrain the motion of the component relative to the tray. In such an embodiment the component will have first and second engagement surfaces and the first component receptacle will engage the first component engagement surface and the component engaging member will engage the second component engagement surface.

Abstract: A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.

Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Abstract: A modular rotary anvil for mounting on an ultrasonic welding machine. The modular rotary anvil includes a first end segment configured to attach to the ultrasonic welding machine, a second end segment configured to attach to the ultrasonic welding machine, and at least one insert having a first side and a second side. Each of the first side and the second side is configured to attach to at least one of other inserts, the first end segment, and the second end segment.

Abstract: A micro device using assembly system for feeding, programming, and placing micro devices on circuit boards includes a robotic handling system capable of picking up and placing the micro devices on the circuit boards on a conveyor system. A control system controls the conveyor system and the robotic handling system. An input feeder provides the micro devices and a programming system is capable of programming a plurality of micro devices in sockets which are in line parallel with the input feeder. The input feeder responds to communication with the control system to feed the unprogrammed micro devices while the programming system programs the micro devices and communicates to the control system. The robotic handling system responds to communication of the programming system with the control system to pickup and places the programmed micro devices on the circuit boards at high speed.

Abstract: Provided is an electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. Also provided is a method including a parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera which are performed concurrently.

Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.

Abstract: In an embodiment of the invention an apparatus is configured to stack a plurality of semiconductor chips having the same or similar size. The apparatus includes a tape providing unit for providing an insulating adhesive tape, a tape attaching device for attaching the insulating adhesive tape to an area between electrode pads of a first chip, and a chip attaching device for attaching a second chip to the insulating adhesive tape.

Abstract: A method of transferring component tape information to a component mounting machine, a tape guide for guiding a component tape in a component mounting machine, and a tape magazine for receiving the tape guide. The tape guide is arranged for quick and ready attachment and detachment into and from the component mounting machine. The loading and/or unloading of a component tape into and from the tape guide can be performed away from the component mounting machine. The ability to be releasably mounted is achieved by providing the tape guide with a lock that enables ready and quick attachment and detachment to an interacting lock in a component mounting machine, or in a tape magazine arranged for insertion into a component mounting machine, and a guide for guiding the component tape. The tape guide further includes an identifier for holding the identity of the tape guide, which can be associated with information relating to the component tape.

Abstract: A system for performing an operation to a printed wiring board (PWB) having an apparatus for automatically resetting a PWB supporting device including a supporting table, supporting members which are set on a surface of the supporting table to support the PWB, a supporting-member storing device for storing the supporting members, a holding head for holding each of the supporting members, a moving device which moves the holding head relative to each of the supporting table and the storing device, in a direction parallel to the supporting table surface, so that the holding head takes a prescribed one of the supporting members from the storing device and sets the supporting member at a prescribed setting position on the surface of the supporting table, and takes the supporting member from the setting position and stores the supporting member in the storing device, and a control device which controls the moving device.

Abstract: A machine for terminating wire assemblies comprising: a means for holding a wire assembly; a linear movement means for moving said means for holding between a first area and a second area; an insertion head; and, a means for dislodging; wherein, after a wire assembly is loaded into the means for holding a wire assembly, the means for holding a wire assembly is moved by the linear moving means from the first area to the second area for assembly termination by the insertion head; and, following termination, the assembly is at least partially unseated from the means for holding a wire assembly by the means for dislodging.

Abstract: A method of manufacturing a stack of interlocked laminations in a progressive die assembly having a choke. A strip of sheet stock material is provided and a plurality of laminations are stamped therein. Each of the laminations include at least one interlock feature and include first and second regions and a connecting section extending between the first and second regions. The laminations are separated from the sheet stock material and stacked in the choke with the first and second regions in a first orientation. The laminations are also interlocked substantially concurrently with the separation and stacking of the laminations. The interlocked stack of laminations is removed from the choke with the first and second regions in their first orientation. The stack is then formed into a second shape wherein the first and second regions have a second orientation and the connecting section therebetween has been deformed.

Abstract: An electronic parts mount apparatus for taking out electronic parts from a parts supply section 3by a transfer head 9 and transporting and mounting the electronic parts to and on a board 2 has a board recognition camera 15 moving independently of the transfer head 9 and advancing to and retreating from the board 2 positioned on a transfer passage 1 for picking up an image of the board 2 to detect the position thereof. The image pickup step of the board 2 by the board recognition camera 15 and the parts taking out step in the parts supply section by the transfer head 9 are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

Abstract: A dicing tape attaching unit that can attach both a pre-cut dicing tape and a general dicing tape to a wafer in a semiconductor package assembling process, and an in-line system used in a semiconductor package process including the dicing tape attaching unit are provided. The dicing tape attaching unit supplies one of the pre-cut dicing tape and the general dicing tape and attaches it to a wafer according to the direction of rotation of a tape loader. Accordingly, without an additional pre-cut dicing tape attaching unit, either of the pre-cut dicing tape and the general dicing tape can be attached to the back side of the wafer by one and the same unit.

Abstract: An electric-component mounting system wherein a determining device is operated for presently required operations of working devices disposed on a common main body, to determine a cycle-time-determinant working device which determines a cycle time of the system such that the cycle time is determined by a required operating time of the cycle-time-determinant working device as calculated when the presently required operation is performed at predetermined maximum acceleration and deceleration values or a predetermined maximum operating speed, and a slowdown device determines actual acceleration and deceleration values or an actual operating speed of each of non-cycle-time-determinant working device, so as to be lower than the predetermined maximum acceleration and deceleration values or operating speed thereof, such that the presently required operation of each non-cycle-time-determinant working device can be completed within the cycle time determined by the cycle-time-determinant working device.

Abstract: An electric-component mounting system including a substrate-holding device for holding at least one circuit substrate, at least one first mounting unit and at least one second mounting unit, each of which has at least one mounting head each operable to receive a selected one of the electric components while each mounting unit is located in a component-supplying area, and to mount the electric component onto the at least one circuit substrate held by the substrate-holding device located in a component-mounting area, and a mounting-unit moving device operable to move the at least one first mounting unit and the at least one second mounting unit past each other, between the component-supplying and component-mounting areas in opposite directions, along respective two paths, without an interference between the first mounting unit and second mounting units.

Abstract: A process for producing bundles of laminated sheet metal for magnet cores, wherein laminations are punched free along two longitudinal edges of a sheet metal strip, at least two sheet metal laminations of a magnet core are of a different width extending from one longitudinal edge to the other, and several laminations, which rest against each other, are connected with each other to form the bundle. To simplify the tool control, the two longitudinal edges of a lamination are punched in edge cutting stations, which are separate from each other and are arranged offset in the feed direction of the sheet metal strip. The edge cutting stations for cutting the longitudinal edges have a cutting die and an associated bottom die. The cutting die, together with the bottom die, is displaced for creating different laminate widths.

Abstract: An apparatus and a method for equipping plug housings with fitted-out cables includes an equipping installation downstream of a fitting-out installation and introduces each fitted-out cable end into a first or second plug housing according to an installation sequence. A feeder unit takes a cable loop from a transfer unit moved from the fitting-out installation and transfers the leading cable end to a transfer station and the trailing cable end either to a rotatable store unit or, to the transfer station when it is free. An equipping unit takes over the cable ends in succession at the second transfer station and introduces the cable ends into designed cells of the corresponding plug housings.

Abstract: An electric-component mounting system for mounting a plurality of electric components onto a circuit board. The system includes a plurality of electric-component mounting units which are arranged in a predetermined direction with a spacing distance between each adjacent pair of the electric-component mounting units. Each of the electric-component mounting units includes (a) a board holding device which is capable of holding the circuit board in a predetermined position, (b) a component mounting device which is capable of mounting the electric components onto the circuit board held by the board holding device, and (c) a component supplying device which is capable of supplying the electric components to the component mounting device. The system further includes a spacing-distance changing device capable of changing the spacing distance.