With Deforming Patents (Class 29/882)
  • Patent number: 7083481
    Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.
    Type: Grant
    Filed: June 27, 2005
    Date of Patent: August 1, 2006
    Assignee: Antaya Technologies Corporation
    Inventors: John Pereira, Manuel Machado, Stephen Antaya
  • Patent number: 7073256
    Abstract: In a method of manufacturing a center electrode for a spark plug, a core member is press-fitted into a metal cup and, thereafter, a cold-forging process is performed to form a small-diameter portion at a closed end of the metal cup. The small-diameter portion is completely free from deformation which may occur during press-fitting operation. Thus, the small-diameter portion has excellent accuracy in shape. Furthermore, since the press-fitting is performed before the cold-forging of the small-diameter portion, it is possible to increase the press-fitting load or pressure to the extent that the core member and the metal cup are joined together with a sufficient degree of adhesion which will insure the a center electrode to have good thermal conductivity.
    Type: Grant
    Filed: October 21, 2003
    Date of Patent: July 11, 2006
    Assignee: Denso Corporation
    Inventors: Hirofumi Muranaka, Kazuhiko Tanaka, Akihiro Endou
  • Patent number: 7067774
    Abstract: A heating element for placing on a pipe or nozzle comprises a current-carrying conductor connectable by means of connecting leads to a power supply. Each of the connecting leads has a terminal contact piece which can be engaged with a contact surface of the heating element. The contact piece can be clamped against the heating element by means of a clamping device. The contact piece rests loosely on the contact surface and the clamping force of the clamping device acts in a substantially normal manner to the contact surface and clamps the contact piece against said contact surface.
    Type: Grant
    Filed: May 12, 2005
    Date of Patent: June 27, 2006
    Assignee: Watlow GmbH
    Inventor: Michael Hoffmann
  • Patent number: 7065871
    Abstract: A printed circuit board electrical power contact for connecting a daughter printed circuit board to a mating contact on another electrical component. The power contact includes a main section; at least one daughter board electrical contact section extending from the main section; and at least one mating connector contact section extending from the main section. The mating connector contact section includes at least three forward projecting beams. A first one of the beams extends outward in a first direction as the first beam extends forward from the main section and has a contact surface facing the first direction. Two second ones of the beams are located on opposite sides of the first beam and extend outward in a second opposite direction as the second beams extend forward from the main section. The second beams have contact surfaces facing the second direction.
    Type: Grant
    Filed: October 17, 2004
    Date of Patent: June 27, 2006
    Assignee: FCI Americas Technology, Inc.
    Inventors: Steven E. Minich, Christopher J. Kolivoski
  • Patent number: 7047636
    Abstract: A method in which a claw portion of a connecting member penetrates a first piercing portion of a flat circuit member in a thickness direction thereof. In the case of connection to the flat circuit member having a thick conductor portion, the claw portion is bent such that a distal end portion of the claw portion pierces the flat circuit member so as to obtain electric contact with the conductor portion of the flat circuit member. In the case of connection to the flat circuit member having a thin conductor portion, the claw portion is bent such that a portion of the flat circuit member is clamped between an outer surface of the claw portion and inner edge portion of a side wall portion of the connecting member, so as to obtain electric contact with the conductor portion of the circuit member.
    Type: Grant
    Filed: June 17, 2003
    Date of Patent: May 23, 2006
    Assignee: Yazaki Corporation
    Inventor: Masanori Onuma
  • Patent number: 7000316
    Abstract: The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: February 21, 2006
    Assignee: Curamik Electronics GmbH
    Inventors: Jurgen Schulz-Harder, Andreas Meyer
  • Patent number: 7000315
    Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: February 21, 2006
    Assignee: Xerox Corporation
    Inventors: Christopher L. Chua, Francesco Lemmi, Koenraad F. Van Schuylenbergh, Jeng Ping Lu, David K. Fork, Eric Peeters, Decai Sun, Donald L. Smith, Linda T. Romano
  • Patent number: 6973722
    Abstract: Spring structures are subjected to pre-release and post-release annealing to tune their tip height to match a specified target. Post-release annealing increases tip height, and pre-release annealing decreases tip height. The amount of tuning is related to the annealing temperature and/or time. Annealing schedules are determined for a pre-fabricated cache of unreleased spring structures such that finished spring structures having a variety of target heights can be economically produced by releasing/annealing the cache according to associated annealing schedules. Selective annealing is performed using lasers and heat absorbing/reflecting materials. Localized annealing is used to generate various spring structure shapes. Both stress-engineered and strain-engineered spring structures are tuned by annealing.
    Type: Grant
    Filed: November 17, 2003
    Date of Patent: December 13, 2005
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Thomas Hantschel, David K. Fork, Dirk De Bruyker, Chinnwen Shih, Jeng Ping Lu, Christopher L. Chua, Raj B. Apte, Brent S. Krusor
  • Patent number: 6964095
    Abstract: A method of manufacturing an electrical contact with a crimp ear from a flat ribbon of conductive material including applying a force to the ribbon to form an adjacent pair of approximately semicylindrical depressions on opposite sides of the centerline of the ear, shearing the ribbon at the depression bisectors to form a pair of legs on opposites of the centerline, and forming the legs into a predetermined shape about the centerline. Forming the legs includes straightening the legs and bending the legs to the appropriate predetermine relative angle. Optionally, the ear is coined. Optionally, serrations are inscribed across the ear.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: November 15, 2005
    Assignee: Etco, Inc.
    Inventor: Ralph Jacques
  • Patent number: 6945831
    Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.
    Type: Grant
    Filed: June 16, 2004
    Date of Patent: September 20, 2005
    Assignee: Antaya Technologies Corporation
    Inventors: John Pereira, Manuel Machado, Stephen Antaya
  • Patent number: 6931727
    Abstract: This invention is an electrical connection method for connecting multiple conductor cable, ideally flat flexible cable. The method involves using an actuator for pressing the cable against multiple contacts in a base, each of which contacts has a sharp edge for removing insulation from the cable.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: August 23, 2005
    Assignee: Miraco, Inc.
    Inventors: Douglas R. Bulmer, Joseph A. Roberts, II
  • Patent number: 6928850
    Abstract: A method and apparatus for enabling z-axis offset of narrow metal ties straps in lead frames used for packaging integrated circuits to prevent bowing or distortion. Simultaneous offsetting of the tie strap and stress relief mechanisms are provided on both the front and back sides of the lead frame. Those mechanisms include indentations along the long or primary axis of each tie strap, coupled with depressions across the top surface both at the center of the lead frame and between the base of the off set and the chip attach locations to prevent bowing in small pad and no pad lead frames, in particular.
    Type: Grant
    Filed: April 19, 2004
    Date of Patent: August 16, 2005
    Assignee: Texas Instruments Incorporated
    Inventors: William J. Pelletier, Wayne E. Mann
  • Patent number: 6880245
    Abstract: Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: April 19, 2005
    Assignee: International Business Machines Corporation
    Inventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da-Yuan Shih
  • Patent number: 6874222
    Abstract: Methods of manufacturing an antenna are presented. The antenna is capable of being mounted on a printed circuit board. In accordance with the method, the design dimension of a unitary piece of material are selected according to an operating wavelength. The unitary piece of material is stamped out from a larger section of material according to the design dimensions to form an antenna. The unitary piece of material includes a circular area and a stem area. The circular area has a center and an outer region. The stem area has a first end and a second end. The first end is joined with the center. The unitary piece is bendable at the first end and the center.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: April 5, 2005
    Assignee: Atheros, Inc.
    Inventors: Jovan E. Lebaric, Andy Dao
  • Patent number: 6860009
    Abstract: A method of constructing a probe which includes providing a substrate and creating a first substantially asymmetrical recess within the substrate. A conductive material is located within the recess and a conductive trace is electrically connected with the conductive material. A membrane supports the conductive trace, wherein the conductive material is located between the membrane and the substrate. The substrate is removed from the conductive material.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: March 1, 2005
    Assignee: Cascade Microtech, Inc.
    Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
  • Patent number: 6857184
    Abstract: A connecting method for pins and tin balls of an electric connector. Pins of the electric connector elastically resist against tin balls so as to position the pins. The lower ends of the pins store elastic energy due to the elastically resisting contact. During welding by blowing heated air, the elastic energy is released to push the melting tin balls so that the lower ends of the pins of the electric connector is tightly combined with the PC board.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: February 22, 2005
    Inventor: Ted Ju
  • Patent number: 6848175
    Abstract: Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the springs used to form out-of-plane structures are constrained via a tether to avoid bunching and entanglement. The high yield structure may be used in numerous electronic applications such as filter circuits.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: February 1, 2005
    Assignee: Xerox Corporation
    Inventors: David K. Fork, Ping Mei, Koenraad F. Van Schuylenbergh
  • Patent number: 6842976
    Abstract: A method of connecting a flat cable and a terminal, comprising a sticking step in which cramp pieces (13b-13d) are stuck through a flat cable (10) to be received in corresponding cavities (15b, 15c) that are provided to allow the cramp pieces to maintain their shapes, and a cramping step in which the cramp pieces that have been stuck through the flat cable are bent and thereby cramped to the flat cable.
    Type: Grant
    Filed: August 14, 2002
    Date of Patent: January 18, 2005
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Noritsugu Enomoto, Yoshiyuki Suzuki, Mitsuhiro Yamamura
  • Publication number: 20040237300
    Abstract: The invention relates to a method for producing flat metal ribbon cables by cold-rolling, which is characterized by rolling, in a first pass, a round wire (2) on a two-stand metal forming device (4) between immediately successive pairs of rolls (8,9;16,17) with identical rotational axes to a defined breadth and, in a second pass, to a defined thickness without further edge machining.
    Type: Application
    Filed: March 25, 2004
    Publication date: December 2, 2004
    Inventor: Volker Gerth
  • Patent number: 6807734
    Abstract: Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a “post” component, a “beam” component, and a “tip” component. The resulting contact structure, mounted to an electronic component, is useful for making an electrical connection with another electronic component. The post component can be fabricated on a sacrificial substrate, joined to the electronic component and its sacrificial substrate removed. Alternatively, the post component can be formed on the electronic component. The beam and tip components can each be fabricated on a sacrificial substrate. The beam component is joined to the post component and its sacrificial substrate is removed, and the tip component is joined to the beam component and its sacrificial substrate is removed.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: October 26, 2004
    Assignee: FormFactor, Inc.
    Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
  • Publication number: 20040181940
    Abstract: The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.
    Type: Application
    Filed: December 31, 2003
    Publication date: September 23, 2004
    Inventors: Jurgen Schulz-Harder, Andreas Meyer
  • Patent number: 6794585
    Abstract: A method includes the steps of forming a first metal foil (82) on a surface of an insulator substrate (1a), drilling, with a thermosetting resin film (84) temporarily fixed to an opposite surface of the substrate, a through hole (86) simultaneously in the first foil, the substrate, and the resin film, simultaneously heating and vacuum-pressing the first foil, the substrate, the resin film, and a second metal foil (87) brought into contact with the resin film to obtain an intermediate board in which a bottom of the through hole is covered with the second foil and has a corner with a corner rounded portion (93) formed by the resin film, and forming a metal plating layer (95) on the first and the second foils, on the bottom and an inner wall of the through hole, and on the corner rounded portion to obtain a final printed wiring board.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: September 21, 2004
    Assignee: Japan Radio Co., LTD
    Inventors: Shigetoshi Abe, Tomoko Kato, Yasuo Sato, Takashi Itagaki, Kenji Matsumoto
  • Patent number: 6789308
    Abstract: A method of manufacturing a flat antenna is composed of the steps of entirely applying Ni plating to the front and back surfaces of a long metal sheet, bonding masking tapes to the front surface of the metal sheet where the Ni plating has been applied except two stripe regions, applying Au plating to the two stripe regions by dipping the metal sheet into an Au plating solution, making a plurality of conductive flat sheets by punching the metal sheet to a plurality of regions along the lengthwise direction thereof after exfoliating the masking tapes, and bending the portions of each conductive flat sheet acting as a power feed terminal and a ground terminal. The metal sheet can be simply masked by bonding a plurality of the masking tapes thereto linearly except the regions where the plating is to be applied, thereby the productivity of the flat antenna can be increased.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: September 14, 2004
    Assignee: Hitachi Cable, Ltd.
    Inventors: Shinichi Takaba, Takahiro Sugiyama, Shinichiro Suzuki, Morihiko Ikegaya
  • Publication number: 20040163251
    Abstract: Bulges in a wire having helically coiled strands are formed by untwisting the strands in an anti-helical direction at a predetermined position, to form an electrical connector from a length of the stranded wire. The wire is gripped by moving two spaced apart clamp members to a closed position and thereafter rotating the clamp members relative to one another in at least one complete relative revolution in a direction which is anti-helical relative to the coiled strands to form the bulge. The wire is gripped and rotated in the anti-helical direction for a relative rotational interval of greater than one-half, and preferably three-fourths, of a complete relative revolution. Thereafter, during the remaining rotational interval of each relative revolution, the clamp members are opened to permit the wire to be advanced to the next position where a bulge is to be formed.
    Type: Application
    Filed: March 2, 2004
    Publication date: August 26, 2004
    Inventors: Steven E. Garcia, James A. Harden
  • Patent number: 6780071
    Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.
    Type: Grant
    Filed: May 27, 2003
    Date of Patent: August 24, 2004
    Assignee: Antaya Technologies Corporation
    Inventors: John Pereira, Manuel Machado, Stephen Antaya
  • Patent number: 6772516
    Abstract: A main body includes a plurality of holes formed therein a main clip and includes an exterior contact portion positioned exterior to the main body, a first carrier strip connected to the exterior contact portion and located within the main body and a plurality of clips extending from this carrier strip, each position within a corresponding hole formed in the main body. A slave clip includes a carrier strip located within the main body and a plurality of clips extending from the carrier strip, each positioned within a corresponding hole of the main body to make the corresponding one of the clips of the main clip. The pair of the clips formed within each hole form a terminal to allow terminal portions of a grounding wire to be connected therein. A cap having a plurality of holes corresponding in position and size to the holes formed in the main body may be frictionally engaged in a hollow portion of the main body to complete the assembly. The same potential block (e.g.
    Type: Grant
    Filed: August 15, 2001
    Date of Patent: August 10, 2004
    Assignee: Array Connector Corporation
    Inventors: Joseph A. Lomastro, Santiago Llano, Peter J. Dutton, Thomas D. Ratzlaff, Robert D. Gracey
  • Patent number: 6755069
    Abstract: A method and apparatus for enabling z-axis offset of narrow metal ties straps in lead frames used for packaging integrated circuits to prevent bowing or distortion. Simultaneous offsetting of the tie strap and stress relief mechanisms are provided on both the front and back sides of the lead frame. Those mechanisms include indentations along the long or primary axis of each tie strap, coupled with depressions across the top surface both at the center of the lead frame and between the base of the off set and the chip attach locations to prevent bowing in small pad and no pad lead frames, in particular.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: June 29, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: William J. Pelletier, Wayne E. Mann
  • Patent number: 6729916
    Abstract: An electrical connector (1) includes a housing (2) receiving contacts (3). The housing includes a central island portion (20) surrounded by connected sidewalls. The island portion is separated from the sidewalls by a moat-like mating groove. Receiving slots (200) each including a first channel (2000) and a second channel (2002) are defined in each of opposite sides of the island portion, the first channel being wider than the second channel. Each contact is received in a corresponding receiving slot, and includes a contact portion (32), a terminal portion (34) and a medial portion (30). In manufacturing, each of two series of contacts is connected with a common operation carrier (6). The terminal portion of each contact has an L-shaped pull portion (56). Pushing force is applied on the operation carriers. Then pulling force is applied at the pull portions until the terminal portions are completely exposed outside of the housing.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: May 4, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Weihua Pan
  • Patent number: 6729026
    Abstract: Bulges in a wire having helically coiled strands are formed by untwisting the strands in an anti-helical direction at a predetermined position, to form an electrical connector from a length of the stranded wire. The wire is gripped by moving two spaced apart clamp members to a closed position and thereafter rotating the clamp members relative to one another in at least one complete relative revolution in a direction which is anti-helical relative to the coiled strands to form the bulge. The wire is gripped and rotated in the anti-helical direction for a relative rotational interval of greater than one-half, and preferably three-fourths, of a complete relative revolution. Thereafter, during the remaining rotational interval of each relative revolution, the clamp members are opened to permit the wire to be advanced to the next position where a bulge is to be formed.
    Type: Grant
    Filed: February 13, 2001
    Date of Patent: May 4, 2004
    Assignee: Medallion Technology, LLC
    Inventors: Steven E. Garcia, James A. Harden, Jr.
  • Patent number: 6725538
    Abstract: A method of connecting a terminal to a conductor comprises the steps of mating the terminal with the conductor through a thin stud of the terminal projecting from a base of the termina, giving ultrasonic vibration to the base of the terminal and the conductor to join the terminal and the conductor laminate at mating portion. The method further comprises the step of crushing a portion of the stud projecting above the conductor by giving a pressure without the ultrasonic vibration to the portion of the stud, thus to caulk the terminal to the conductor.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: April 27, 2004
    Assignee: Ultex Corporation
    Inventor: Shigeru Sato
  • Patent number: 6718815
    Abstract: Tool, device and machine for crimping contacts 10 possibly arranged in a housing of connector 20 onto a flexible circuit 40. The tool principally has a solid block 1 provided with a plurality of stamps 3 for crimping. The device has a tool support mounted in a press 9 and an anvil 50, the tool and the anvil coming to crimp the contacts mounted in the connector onto the flexible circuit.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: April 13, 2004
    Assignee: FCI
    Inventor: Flavio Fantini
  • Patent number: 6718628
    Abstract: A method of making a stimulator electrode with a conductive polymer coating is disclosed. A polymeric coating, such as polyethylene oxide containing NaCl or a similar ionic medium, coats and fills the pores of a high surface area electrode to provide a continuous ionic network from the can to the adjacent body tissue. In certain embodiments, the underlying high surface area, porous electrode is made by chemically etching a smooth electrode surface, such as that of a conventional titanium housing, followed by applying a thin coating of a noble metal such as platinum. In other embodiments, a noble metal or an oxide thereof, such as platinum black or iridium oxide, is applied to a titanium housing to form a porous, high surface area electrode. The conductive polymeric coating is then applied over the porous noble metal or metal oxide.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: April 13, 2004
    Assignee: Intermedics Inc.
    Inventor: M. Zafar Amin Munshi
  • Publication number: 20040063341
    Abstract: A connecting method of pins and tin balls of an electric connector, wherein a plurality of pins of the electric connector resist against tin balls so as to position the pins; the lower ends of the pins store elastic energy due to the resisting contact. In welding by blowing, the elastic energy is released to push the melt tin balls to that the lower ends of the pins of the electric connector is tightly combined with the PC board.
    Type: Application
    Filed: September 27, 2002
    Publication date: April 1, 2004
    Inventor: Ted Ju
  • Patent number: 6711816
    Abstract: A method for manufacturing an electrical connector for a flat cable, wherein the connector has at least one terminal (2) inserted into a receiving slot (3) of a box-shaped housing (1) from a side of the housing and having upper and lower arms (4 and 5), comprises the step of inserting the terminal into the receiving slot in a manner that the upper arm and lower arms are guided by inner surfaces of upper and lower walls of the housing, respectively, while the lower arm is deflected toward the upper arm and then deflected back to its original shape at a time of insertion to a predetermined position.
    Type: Grant
    Filed: May 27, 2003
    Date of Patent: March 30, 2004
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Kazuhisa Tsunematsu
  • Patent number: 6709237
    Abstract: The present invention relates to a turbine blade or vane (13; 14), in particular for a gas turbine (10), which has at least one chamber (18; 29; 20; 21) which can be acted on by a cooling medium and, at a rear edge (26), has a gap (25), which is delimited by two walls (28, 29), for the cooling medium to be discharged. According to the invention, at least one of the walls (28; 29) can be remachined in order to change the cross section (A) of the gap (25). In this way, the cross section (A) can be adapted to the particular boundary conditions, and therefore the consumption of cooling medium can be minimized. The invention also relates to a process for producing a turbine blade or vane (13; 14) of this type.
    Type: Grant
    Filed: March 21, 2002
    Date of Patent: March 23, 2004
    Assignee: Siemens Aktiengesellschaft
    Inventor: Peter Tiemann
  • Patent number: 6705009
    Abstract: Process for producing a middle electrode with precious metal reinforcement, a middle electrode being used with an ignition tipwhich is tapered relative to the middle electrode body, such that a precious metal wire with a cross section which corresponds to the tapered ignition tip is welded flat onto the tapered ignition tipand such that this precious metal wire is cut off at the desired height, with a sharp edge.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: March 16, 2004
    Assignee: Beru AG
    Inventor: Werner Niessner
  • Patent number: 6665932
    Abstract: An SMT connector suitable for surface mounting on a printed circuit board enabling the necessary coplanarity to be secured even if not providing a coplanarity correction step after assembly, wherein contact members made of a metal having a high hardness have lead members made of a metal having a low hardness and shaped straight connected to them, the connection parts are covered by an insulating material, next, the lead members are bent in a crank shape, whereby the coplanarity of the lead members is maintained at within a predetermined accuracy, and a method of production of the same.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: December 23, 2003
    Assignee: Nagano Fujitsu Component
    Inventor: Nobuo Saito
  • Publication number: 20030217464
    Abstract: A method for manufacturing an electrical connector for a flat cable, wherein the connector has at least one terminal (2) inserted into a receiving slot (3) of a box-shaped housing (1) from a side of the housing and having upper and lower arms (4 and 5), comprises the step of inserting the terminal into the receiving slot in a manner that the upper arm and lower arms are guided by inner surfaces of upper and lower walls of the housing, respectively, while the lower arm is deflected toward the upper arm and then deflected back to its original shape at a time of insertion to a predetermined position.
    Type: Application
    Filed: May 27, 2003
    Publication date: November 27, 2003
    Inventor: Kazuhisa Tsunematsu
  • Patent number: 6651326
    Abstract: A collar is provided that has a sleeve having a tapered axial bore that defines a tapered surface interiorly of the sleeve. The tapered axial bore is adapted to receive a receptacle such that the tapered surface bears against the receptacle. Moreover, the collar has a resilient device that engages the sleeve. The resilient device, the tapered axial bore of the sleeve, and the receptacle receive a connector. Axial displacement of the connector relative to the sleeve and the receptacle compresses the resilient device such that the resilient device exerts an increasing axial force on the sleeve. The increasing axial force displaces the sleeve axially relative to the receptacle causing the tapered surface to exert a radial force on the receptacle.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: November 25, 2003
    Assignee: ADC Telecommunications, Inc.
    Inventor: Michael J. Wayman
  • Patent number: 6637106
    Abstract: A method for manufacturing a linkage terminal mounted in a housing of a joint connector is disclosed. The method comprises a step of providing first and second terminal elements. Each terminal element includes a strip-shaped carrier and terminals integral with the carrier. The terminals are arranged at equal intervals along a longitudinal direction of the carrier and extend generally perpendicularly from the carrier. The carrier is wound in a reel. The method further comprises a step of unwinding the reel and shifting the first and second terminal elements relative to each other in the longitudinal directions of the carriers to stack the first and second terminal elements. The method further comprises a steps of welding the carriers of the first and second terminal elements intermittently along the longitudinal directions of the carriers.
    Type: Grant
    Filed: November 10, 1999
    Date of Patent: October 28, 2003
    Assignee: Yazaki Corporation
    Inventors: Kei Sato, Sanae Kato
  • Patent number: 6634100
    Abstract: Methods for fabricating an interposer, wherein the fence include the use of stereolithographic and molding processes. When stereolithography is used to fabricate the fence, a machine vision system that includes at least one camera operably associated with a computer may be used to control a stereolithography apparatus and facilitates recognition of the position and orientation of interposer substrates on and around which material is to be applied in one or more layers to form the fence. As a result, the interposer substrates need not be precisely mechanically aligned.
    Type: Grant
    Filed: April 26, 2001
    Date of Patent: October 21, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Salman Akram, Alan G. Wood, Warren M. Farnworth
  • Publication number: 20030172529
    Abstract: A crimp press has a positioning unit for lowering a grip arm supplying a cable end to a crimp device. The positioning unit is arranged on a handle firmly connected with a tool holder. Vertical movement of the handle with the positioning unit corresponds to the vertical movement of the tool holder during the crimping operation. Adjustment to different crimp devices and/or different crimping contact types is provided by a bar of the positioning unit being adjustable in vertical direction and automatically lockable and releasable.
    Type: Application
    Filed: March 13, 2003
    Publication date: September 18, 2003
    Inventor: Alois Conte
  • Patent number: 6604283
    Abstract: A method of manufacturing an electrode array has an elongate flexible carrier that is much more flexible in a first direction than in a second direction orthogonal thereto. The elongate flexible carrier is formed with a bias force that causes the array to flex in the first direction so as to assume the general spiral or circular shape of the scala tympani duct within the cochlea. The less-flexible direction is the direction that makes it difficult for the array to twist as it is inserted within the scala tympani duct. The bias force is sufficiently strong to cause the array to assume its preformed spiral shape even after being straightened during initial insertion into the cochlea. Electrode contacts, embedded into the carrier so as to be exposed along an inner or concave surface of the spiral, thus wrap snugly around the modiolus, thereby positioning the electrode contacts against the modiolar wall in an optimum position for stimulation.
    Type: Grant
    Filed: March 3, 2000
    Date of Patent: August 12, 2003
    Assignee: Advanced Bionics Corporation
    Inventor: Janusz A. Kuzma
  • Patent number: 6599157
    Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: July 29, 2003
    Assignee: Antaya Technologies Corporation
    Inventors: John Pereira, Manuel Machado, Stephen Antaya
  • Patent number: 6588100
    Abstract: A method for forming a contact insert subassembly (34) for a modular jack connector (200), includes the following steps: stamping a contact strip (10) to form a group of contacts (20) which are interconnected by an end carrier (11) and a middle carrier (13), the middle carrier dividing the contacts into first and second portions (21, 22); bending the first portion into a soldering tail portion for the contacts; subjecting the contact strip to an insert molding to form an insulative block (30) around the middle carrier (13); cutting the end carrier and the middle carrier from the contacts; and bending the second portion to form a contacting portion for the contacts.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: July 8, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Xue Dong Ma, Guang Xing Shi
  • Patent number: 6578264
    Abstract: A method for constructing a membrane probe that includes providing a substrate, and creating a depression within the substrate. Conductive material is located within the depression and a conductive trace is connected to the conductive material. A membrane is applied to support the conductive material and the substrate is removed from the conductive material.
    Type: Grant
    Filed: April 11, 2000
    Date of Patent: June 17, 2003
    Assignee: Cascade Microtech, Inc.
    Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith
  • Patent number: 6574855
    Abstract: A method of making a switch-equipped coaxial connector comprises the steps of stamping a pair of switching members from a metal sheet, bending the stamped switching members to complete the switching members, press-fitting the switching members into separate housing sections, assembling the housing sections so as to connect the switching members, and providing an outer conductor over said housing sections.
    Type: Grant
    Filed: September 29, 2000
    Date of Patent: June 10, 2003
    Inventor: Kohei Hida
  • Patent number: 6563065
    Abstract: A method of adjusting an electrical switch arrangement comprising a pair of electrical contact members to a predetermined contact spacing is suggested. A first one of the contact members is associated with a first contact carrier and a second one of the contact members is associated with a second contact carrier. The first and second contact members are normally spaced from each other by the predetermined contact distance and are movable relative to each other across the contact distance. At least one of the contact members is displaceably held on the associated contact carrier. The contact carriers are moved towards each other across the predetermined contact distance. The one of the contact members is displaced relative to the associated contact carrier into physical contact with the other of the contact members. The one contact member is fixed in position on the associated contact member while physically contacting the other of the contact members.
    Type: Grant
    Filed: April 27, 1999
    Date of Patent: May 13, 2003
    Assignee: TRW Automotive Safety Systems GmbH & Co. KG
    Inventors: Manfred Schrammek, Michael Christ, Guido Hirzmann
  • Patent number: 6557253
    Abstract: A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer by a small polymeric connecting element which can be broken or peeled away from the lead. Leads in a connecting element may be covered by an insulating jacket applied by a coating process, and the insulating jacket may in turn be covered by a conductive layer so that each lead becomes a miniature coaxial cable. This arrangement provides immunity to interference and facilitates operation at high speeds.
    Type: Grant
    Filed: April 14, 2000
    Date of Patent: May 6, 2003
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Konstantine Karavakis
  • Patent number: 6553650
    Abstract: A circular wire with a circular cross section is wound on a coil reel. When a winding-form motor rotates a winding form, the circular wire is pulled and drawn from the coil reel. Rectangular forming rollers press the circular wire, so that a rectangular wire with a rectangular cross section is formed. The rectangular wire is directly wound on the winding form to be formed into a rectangular-wire coil. Because forming rectangular wire and winding on the winding form are carried out in a sequence of contiguous processes, a separate process for removing torsion set of the rectangular wire is unnecessary. The rectangular-wire coil can be formed from inexpensive circular material wire by a simple and low-cost apparatus. It is also possible and preferable to make dimensions and a shape of the rectangular wire variable by controlling clearance widths between the forming rollers and tension acting on the rectangular wire that has passed through the rollers.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: April 29, 2003
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Masayuki Nakamura, Yasutomo Kawabata, Masahiro Nishioka, Yasuhiko Ishimaru, Tetsuya Miura, Katsuhisa Endo