Contact Or Terminal Manufacturing Patents (Class 29/874)
  • Patent number: 10293507
    Abstract: Provided are a method for manufacturing a Figure-T shaped metal part using a metal plate or a metal rod split by a method for splitting longitudinally an end part of the metal plate or the metal rod having a rectangular, polygonal, or elliptical shape, in which the length of incision in the split portion can be freely adjusted and smooth split face can be formed; a Figure-T shaped metal part manufactured by such method.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: May 21, 2019
    Assignee: Seki Press Co., Ltd.
    Inventor: Masakatsu Seki
  • Patent number: 10290990
    Abstract: A method for manufacturing a female terminal (1) with a tubular portion (11) formed by bending a metal plate into a tubular shape and resilient contact pieces (12) extending from the tubular portion (11) in an axial direction of the tubular portion (11), folded inwardly of the tubular portion (11) and configured to resiliently contact a mating terminal inside the tubular portion (11) includes a joining step of joining metal members thinner than the metal plate to the metal plate, and a forming step of bending the metal members joined to the metal plate and forming the metal members as the resilient contact pieces.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: May 14, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Kanji Horiuchi, Yoshitomo Tsujii, Atsushi Okuda, Noriyuki Uematu, Kensaku Takata
  • Patent number: 10256588
    Abstract: An electric contact having a contact resistance that is hardly increased even if the electric contact is repeatedly used for a long period of time. A base material of an electric contact is provided with a first contact part that is in contact with a first electrode of a first electric component, a second contact part that is in contact with a second electrode of a second electric component, and a spring part that presses the first contact part to the first electrode, and a wear-resistant contact point film is formed on a distal end portion of the first contact part. Furthermore, a highly conductive film is formed between a region of the wear-resistant contact point film and a distal end portion of the second contact part in the base material.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: April 9, 2019
    Assignee: ENPLAS CORPORATION
    Inventor: Takahiro Oda
  • Patent number: 10220662
    Abstract: A coupling structure includes a hollow rod section formed of a metal pipe and fastening sections formed by plastic deformation of the metal pipe so as to be connected with end sections of the hollow rod section. The fastening section includes a pair of base end sections which are each connected with a peripheral wall section forming a closed cross-section at the end section of the hollow rod section, and are separated from each other, and a bottom wall including a flat surface connected with the pair of the base end sections, and a pair of front end sections including a pair of side walls curving inwards from at least widthwise end sections of the bottom wall on a base end section side.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: March 5, 2019
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Satoshi Shirakami, Masaaki Mizumura, Tohru Yoshida
  • Patent number: 10177478
    Abstract: A board terminal 1 includes a base material 11 made of a metal material and a plating film 12 covering a surface of the base material 11. The plating film 12 includes an outermost layer 120 having a Sn mother phase 120a and Sn—Pd-based alloy phases 120b dispersed in the Sn mother phase 120a, the Sn mother phase 120a and the Sn—Pd-based alloy phases 120b being present on an outer surface. A Pd content in the outermost layer 120 is not more than 7 atomic %. A board connector 2 includes the board terminal 1 and a housing 20 for holding the board terminal 1.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: January 8, 2019
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hajime Watanabe, Yasushi Saitoh, Yoshifumi Saka
  • Patent number: 10114039
    Abstract: This disclosure relates to a method of fabrication contact pins 24 used in testing circuit components, typically integrated circuits and the contact pins themselves. It is desirable to selectively radius certain portions of each pin to achieve desired performance of the entire pin. The portion to be radiused is cut to the desire shaped from a blank material. The portion which is not to be radiused is not cut to its final shape from the blank but to a larger shape which includes the material for the final shape. The entire cut portion is then treated to shape or round all exposed edges. Then the remaining portion of the pin is cut out from the larger blank area which was previously retained, leaving those portions with non-radiused edged.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: October 30, 2018
    Assignee: Johnstech International Corporation
    Inventors: David Johnson, Michael Andres, Neil Graf, Kenna Pretts
  • Patent number: 9917389
    Abstract: A flat terminal for a socket of an electrical plug-and-socket connection comprising: a terminal body formed by a metal strip; a connecting end extending from one of the axial ends of the terminal body; a contacting lug extending from the other of the axial ends of the terminal body, said contacting lug being bent back such that a gap remains between the terminal body and the contacting lug to form a resilient contact surface; and a protection against over-bending protruding into said gap to stop a movement of the contacting lug towards the terminal body in a defined distance from the terminal body.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: March 13, 2018
    Assignee: Erich Jaeger GmbH & Co. KG
    Inventor: Klaus Markefka
  • Patent number: 9910069
    Abstract: A device for testing integrated circuits utilizing a compression spring that has one longitudinal centerline that is concentric to the housing of the test probe and terminates in a number of reduced diameter coil windings that are non-concentric to the housing so as to provide a side load to the probe.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: March 6, 2018
    Assignee: KITA USA
    Inventors: Larre H. Nelson, John M. Winter, Yoshihide Kimura
  • Patent number: 9837745
    Abstract: A connector terminal includes a top side contact portion which makes contact with a top surface of a counter connector terminal and three linear bottom side contact portions each of which extends along a fitting axis and makes contact with a bottom surface of the counter connector terminal, the three bottom side contact portions being arranged such that centers of themselves form an isosceles triangle, the top side contact portion being, when viewed in a direction perpendicular to the top surface of the counter connector terminal in a fitted state, positioned in a straight line that lies between a base and a vertex facing the base in the triangle and extends parallel to the base in a manner that a ratio of a distance from the base to a distance from the vertex is 1:2.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: December 5, 2017
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Takuo Sasaki, Osamu Hashiguchi
  • Patent number: 9795779
    Abstract: An electrical stimulation lead includes a lead body insertable into a patient. Electrodes are disposed along the lead body. The electrodes include at least two sets of segmented electrodes. Each set of segmented electrodes includes a first segmented electrode and a second segmented electrode radially spaced apart from one another around a circumference of the lead body. A tab is disposed on the first segmented electrode of each set of segmented electrodes. The tabs extend into the lead body. A guide feature is disposed on the tabs. The guide features are each radially aligned with one another along the length of the lead body. Conductors extend along the length of the lead body from a proximal end to the electrodes. Each of the conductors is electrically coupled to at least one of the electrodes. At least one of the conductors extends through the radially-aligned guide features of the tabs.
    Type: Grant
    Filed: February 5, 2014
    Date of Patent: October 24, 2017
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventors: Anne Margaret Pianca, Priya Sundaramurthy
  • Patent number: 9793633
    Abstract: A cable connector includes an insulative shell defining a receiving cavity extending along a front-to-back direction, a number of contact wafers retained in the receiving cavity, a number of cables, and a ground bar. The contact wafers include a number of signal contact wafers and a number of ground contact wafers arranged alternately. Each of the contact wafers includes an insulative housing and a number of terminals retained in the insulative housing. Each of the terminals includes a deflectable contacting section, a middle section, and a tail section. Each of the cables includes a conductive core connecting with a corresponding tail section and a shielding braid surrounding around the conductive core. The ground bar physically and electrically connects with the tail sections of the ground wafers and the shielding braids.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: October 17, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Fang-Jwu Liao
  • Patent number: 9736939
    Abstract: A printed circuit board may include: a first circuit layer; a first insulating layer disposed on the first circuit layer; a high-rigidity layer disposed on the first insulating layer; and a second circuit layer disposed on the high-rigidity layer and connected to the first circuit layer by a first via extending through the first insulating layer and the high-rigidity layer, wherein a rigidity of the high-rigidity layer is greater than a rigidity of the first insulating layer.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: August 15, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Hyeon Cho, Yong Ho Baek, Young Gwan Ko, Yoong Oh, Young Kuk Ko
  • Patent number: 9711875
    Abstract: A bolt-fastened terminal connects to a wire that includes an aluminum core wire of an aluminum-based metal. The terminal includes a wire connection configured by a copper-based metal material and continuous with an electric contact that includes a bolt hole, the wire connection being welded and electrically connected to the aluminum core wire. A surface of the wire connection is coated with a first metal such as nickel and a surface of the electric contact is coated with a second metal such as tin. The first metal and the second metal, which are configured by different metals, are selected from metals between hydrogen and aluminum, aluminum having a negative electric potential with reference to the electric potential of hydrogen and a high ionization tendency, and the second metal is a metal having a smaller negative electric potential and lower ionization tendency than the first metal.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: July 18, 2017
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Takuya Ooba
  • Patent number: 9685719
    Abstract: A press-fit terminal (10) made of a wire material (11) of a predetermined length, the press-fit terminal includes: a distal section (12) formed at one end thereof to be inserted into a substrate (29); a connecting section (13) formed at the other end thereof to be connected to a complementary terminal; and a press-fit section (14) formed at a distal section side thereof to be press-fitted into a through-hole (30) of the substrate; wherein the press-fit section is formed at the central part thereof a hole (15) vertically elongated along an axis direction of the wire material; the hole is formed with an extending section (14b) extendedly formed toward the inside of the hole along the inner circumferential surface (15a) of the hole; and the extending section is formed at the end thereof with an erected section (14c) in an intersecting direction about the axis direction of the wire material.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: June 20, 2017
    Assignee: J.S.T. MFG. CO., LTD.
    Inventors: Yoshihide Uchida, Makoto Shiraishi
  • Patent number: 9666382
    Abstract: The present invention is a rivet contact including a head portion and a foot portion having a smaller width than the head portion, wherein the head portion contains a contact material layer having at least a top containing an Ag-based contact material; the rest of the head portion and the foot portion contain a base material containing Cu or a Cu alloy; and a barrier layer including an Ag alloy is provided at a junction interface between the contact material and the base material. Here, an Ag alloy obtained in such a manner that one or more base metal elements of Sn, In, Cu, Ni, Fe, Co, W, Mo, Zn, Cd, Te, and Bi are added to Ag by 0.03 to 20 mass % is preferably used as the Ag alloy constituting the barrier layer.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: May 30, 2017
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Masao Kuroda, Hiroshi Shirahata
  • Patent number: 9634419
    Abstract: The invention discloses a cold forming method for forming power pins and a power pin formed thereof. The cold forming method for forming power pins comprises the following steps: step 1: cutting blank out; step 2: pre-forming the power pin body by necking; step 3: trimming the pre-formed power pin body, and pre-forming a pin fixing disk; step 4: forming the pin fixing disk and a staggered weld leg of pin. The invention also discloses a power pin formed by the cold forming method, composed of a power pin body, a pin fixing disk and a staggered weld leg of pin which are integrally formed into one piece by the cold forming method. The invention achieves high-speed automatic production and high production efficiency with a simple process, and improves material utilization and strength.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: April 25, 2017
    Inventors: Manzhi Zhou, Guangdong Song
  • Patent number: 9627320
    Abstract: Methods and devices including the formation of a layer of nanowires on wiring line traces are described. One device comprises a first dielectric layer and a plurality of traces on the first dielectric layer, the traces comprising Cu. The traces include a layer of ZnO nanowires positioned thereon. A second dielectric layer is positioned on the first dielectric layer and on the traces, wherein the second dielectric layer is in direct contact with the ZnO nanowires. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: April 18, 2017
    Assignee: INTEL CORPORATION
    Inventors: Rahul Panat, Bhanu Jaiswal
  • Patent number: 9601891
    Abstract: A cable assembling apparatus for allowing a terminal and a electric wire to be accurately crimped and to resolve increase of facility cost incurred by separation of a press and a crimping machine, includes a press having a downside press mold having a plurality of types of dies arranged in parallel, an electric wire support jig arranged in parallel, having a metal plate guide at an end thereof entering into between the plurality of types of dies, and a feeder adapted to lift the electric wire support jig together with the metal plate above the dies of the downside press mold, and advance and descend the electric wire support jig to an adjacent die of next process. Furthermore, an electric wire chuck disposed in a midstream die of the plurality of types of dies and supplying the electric wire support jig with the electric wire is disposed.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: March 21, 2017
    Assignee: Yazaki Corporation
    Inventors: Yasuto Yamauchi, Keisuke Matsuura, Tomoyuki Kojima, Yuusuke Yamamoto
  • Patent number: 9461416
    Abstract: A system for measuring an analyte of interest in a biological fluid includes a test strip for receiving a sample of the biological fluid having multiple contacts formed thereon. A test device includes a circuit board having multiple conducting strips. A connector assembly is fixed to the circuit board and receives the test strip as the test strip moves in an insertion direction to a test position. The connector assembly includes a connector assembly body and multiple conductors. Each of the conductors includes a conductor contact body fixedly connected to the connector assembly body, and a contact arm integrally connected to the conductor contact body and freely extending entirely in the insertion direction. The contact arm is deflected when directly contacted by one of the multiple contacts of the test strip.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: October 4, 2016
    Assignee: ROCHE DIABETES CARE, INC.
    Inventor: Matthew C. Sauers
  • Patent number: 9431737
    Abstract: In a fitting type connecting terminal having male and female terminals, each of which has a tin plating layer formed on an electrically conductive base material, a surface of a contact portion of one of the male and female terminals with the other thereof has a plurality of grooves or recessed portions which are spaced from each other in longitudinal directions, and the grooves or recessed portions are formed so as to satisfy d?b, d?a?L and a+c?L assuming that the width of each of the grooves or recessed portions is a (?m), the depth thereof being b (?m), the distance between two of the grooves or recessed portions adjacent to each other in the longitudinal directions being c (?m), the sliding distance producible between the male terminal and the female terminal in a state that the male terminal is fitted into and fixed to the female terminal being L (?m), and the maximum grain size of the oxide of abrasion powder producible due to sliding between the male terminal and the female terminal being d (?m).
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: August 30, 2016
    Assignees: DOWA METALTECH CO., LTD., YAZAKI CORPORATION
    Inventors: Akifumi Onodera, Masatoshi Nakamura, Akira Sigawara, Hiroto Narieda
  • Patent number: 9386953
    Abstract: A pulse oximeter sensor has both a reusable and a disposable portion. The reusable portion of the sensor preserves the relatively long-lived and costly emitter, detector and connector components. The disposable portion of the sensor is the relatively inexpensive adhesive tape component that is used to secure the sensor to a measurement site, typically a patient's finger or toe. The disposable portion of the sensor is removably attached to the reusable portion in a manner that allows the disposable portion to be readily replaced when the adhesive is expended or the tape becomes soiled or excessively worn. The disposable portion may also contain an information element useful for sensor identification or for security purposes to insure patient safety.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: July 12, 2016
    Assignee: Masimo Corporation
    Inventor: Ammar Al-Ali
  • Patent number: 9368895
    Abstract: The terminal has a base portion held by a terminal holding member, and a contact arm portion extending from the base portion and contacting the contact portion of another terminal. In this terminal, the contact arm portion includes a cantilevered first frame portion and second frame portion extending from the base portion, a connecting frame portion connecting a free end of the first frame portion and a free end of the second frame portion, a contact protruding portion formed in the first frame portion, and a contact face formed in the contact protruding portion; and the contact face moves in a parallel direction and maintains contact with a contact face of a contact portion of another terminal when the contact arm portion is elastically deformed by contact with the contact portion of the other terminal.
    Type: Grant
    Filed: January 21, 2013
    Date of Patent: June 14, 2016
    Assignee: Molex, LLC
    Inventors: Hiroshi Ueno, Toshihiro Niitsu, Hirokazu Suzuki
  • Patent number: 9230929
    Abstract: Wire-bonded semiconductor structures using organic insulating material and methods of manufacture are disclosed. The method includes forming a metal wiring layer in an organic insulator layer. The method further includes forming a protective layer over the organic insulator layer. The method further includes forming a via in the organic insulator layer over the metal wiring layer. The method further includes depositing a metal layer in the via and on the protective layer. The method further includes patterning the metal layer with an etch chemistry that is damaging to the organic insulator layer.
    Type: Grant
    Filed: October 10, 2014
    Date of Patent: January 5, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Zhong-Xiang He, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan
  • Patent number: 9172161
    Abstract: An interposer plate assembly having an insulating plate and metal contacts in the plate with contact points above and below the plate and a central portion in the plate. Two cantilever arms extend from the central portion to each contact point. The central portion may be formed to have a large area to form an impedance shield for reducing impedance between adjacent signal contacts. Plastic bodies may be overmolded on separate contacts or on contact pairs and may have sliding fits in passages of the interposer plate. Contacts may be arranged as differential pairs with ground contacts located between the differential pairs.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: October 27, 2015
    Assignee: Amphenol InterCon Systems, Inc.
    Inventors: John D. Walden, James S. Hileman
  • Patent number: 9159684
    Abstract: A wafer-level packaged semiconductor device is described. In an implementation, the device includes one or more self-assembled resilient leads disposed on an integrated circuit chip. Each of the resilient leads are configured to move from a first position wherein the resilient lead is held adjacent to the chip and a second position wherein the resilient lead is extended away from the chip to interconnect the chip to a printed circuit board. A guard is provided to protect the resilient leads when the resilient leads are in the first position. One or more attachment bumps may also be furnished to facilitate attachment of the device to the printed circuit board.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: October 13, 2015
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Chiung C. Lo, Arkadii V. Samoilov, Reynante Alvarado
  • Patent number: 9099831
    Abstract: An electrical power connector preparation method for making electrical power connectors by: employing a cold drawing technique with a series of dies to repeatedly draw a metal round rod into a thin thickness conducting contact bar, processing one end of the thin thickness conducting contact bar into a mating contact portion, stamping a part of the thin thickness conducting contact to form a mounting portion, repeating the aforesaid steps to obtain a large amount of metal contacts, using one or multiple contact material strips to hold multiple metal contacts in multiple sets, electroplating the metal contacts, using an insert molding technique to mold an electrically insulative terminal block on each set of metal contacts, and then assembling each set of metal contacts and the associating electrically insulative terminal block with one respective electrically insulative housing so that multiple electrical power connectors are obtained after removal of the contact material strips.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: August 4, 2015
    Assignee: RIIDEA INTERNATIONAL CORP.
    Inventor: Lung-Hsi Lee
  • Patent number: 9083132
    Abstract: A network communication connector fabrication method for making network communication connectors is performed by: employing a cold drawing technique to repeatedly draw a metal round rod into a thin thickness conducting contact bar, stamping one end of the thin thickness conducting contact bar into a mating contact portion, stamping the thin thickness conducting contact to form an interference portion and a bonding portion, cutting off the thin thickness conducting contact bar subject to a predetermined length, repeating the above steps to obtain multiple metal contacts, electroplating the metal contacts, setting the metal contacts in two contact material strips and inserting the metal contacts in a mold, and then using an injection molding technique to mold an electrically insulative terminal block on the interference portions of the metal contacts to form a semi-finished product for making a network communication connector.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: July 14, 2015
    Assignee: RIIDEA INTERNATIONAL CORP.
    Inventor: Lung-Hsi Lee
  • Patent number: 9032616
    Abstract: A method of manufacturing a terminal block for a telecommunication cable is disclosed, which includes providing a preformed substrate member comprising an elongated podium member having a plurality of wire receiving slots on an outer edge of the podium member and a plurality of electrical connector slots positioned within the podium member, wherein the plurality of wire receiving slots are arranged in pairs having a first and a second wire receiving slot, which are configured to receive one wire each of a pair of insulated electrical wires, an electrical connector in each of the plurality of electrical connector slots, each electrical connector having a pair of electrical contacts extending therefrom, and at least one insulated electrical wire attached to a first end of each of the electrical contacts; placing the substrate member in a mold; and injecting a dielectric material by a force of greater than 1 g into the mold.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: May 19, 2015
    Assignee: CHANNELL COMMERCIAL CORPORATION
    Inventor: Gerald L. Shimirak
  • Publication number: 20150132975
    Abstract: Provided is a keystone jack for use as a port in a wired computing network. The keystone jack includes a housing, a plug receptacle within the housing configured to receive a plug connector therein, a termination portion of the housing for connecting a network cable thereto, a first circuit disposed between the plug receptacle and the termination portion, a plurality of conductive terminals disposed within the plug receptacle and configured for defining together with the first circuit and the termination portion a communication channel for electrically communicating between the plug receptacle and the termination portion, and an interfacing unit being in electric communication with the first circuit and configured for interfacing with a detachably attachable supplementary electric unit to provide electrical communication thereof with said at least a portion of the communication channel.
    Type: Application
    Filed: May 8, 2013
    Publication date: May 14, 2015
    Applicant: HCS KABLOLAMA SISTEMLERI SAN. ve TIC.A.S.
    Inventor: Shay Yossef
  • Publication number: 20150123689
    Abstract: The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface.
    Type: Application
    Filed: January 12, 2015
    Publication date: May 7, 2015
    Inventors: John E. Nelson, Jeffrey C. Sherry, Patrick J. Alladio, Russell F. Oberg, Brian Warwick, Gary W. Michalko
  • Publication number: 20150122038
    Abstract: A pressure sensor comprises a first substrate containing a processing circuit integrated thereon and a cap attached to the first substrate. The cap includes a container, a holder, and one or more suspension elements for suspending the container from the holder. The container includes a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. The container is suspended from the holder such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit.
    Type: Application
    Filed: October 23, 2014
    Publication date: May 7, 2015
    Inventors: Felix MAYER, Marc VON WALDKIRCH, Johannes BUHLER, Rene HUMMEL, Stephan BRAUN, Marion HERMERSDORF, Chung-Hsien LIN
  • Patent number: 9017089
    Abstract: In one embodiment is provided a method of manufacturing a female electrical contact from a piece of material by removal of material from the piece of material by machining. The removal of material comprises forming at least one first hole in a first end of the material to form a contact portion, the at least one first hole formed along a longitudinal axis; making at least two slits in the contact portion to produce contact fingers, the slits extending from the first end along at least a portion of length of the contact portion. A corresponding single piece female contact is provided. Another embodiment provides a latching mechanism for an electrical connector housing, the latching mechanism comprising: a planar body portion; a neck portion extending in a first direction from one end of the body portion, the neck portion including a raised portion; and a locking member.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: April 28, 2015
    Assignee: Harwin PLC
    Inventors: Scott Flower, Andrew McQuilken, Mark Plested
  • Patent number: 9015938
    Abstract: A connector is disclosed. The connector includes a conductive housing. The conductive housing includes a wall region enclosing a space for receiving an adapter. The conductive housing also includes an annular end piece extending radially inward from a first end of the wall region and terminating the space. The annular end piece includes a flat annular surface, and a raised deformable annulus mounted on the flat annular surface. The raised deformable annulus is of a height such that an insertion of the adapter into the space deforms the raised deformable annulus to generate a physical contact connection between the flat annular surface and the adapter.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: April 28, 2015
    Assignee: National Instruments Corporation
    Inventors: Ron J. Barnett, Gregory S. Gonzales
  • Patent number: 9017101
    Abstract: A coaxial cable connector comprising a post, a coupling element configured to engage the post, and a connector body configured to engage the post and receive the coaxial cable, when the connector is in an assembled state, the connector body including: an integral body biasing element having a coupling element contact portion, and an annular groove configured to allow the integral body biasing element to deflect along the axial direction, wherein the integral body biasing element is configured to exert a biasing force against the coupling element sufficient to axially urge the inward lip of the coupling element away from the connector body and toward the flange of the post to improve electrical grounding reliability between the coupling element and the post, even when the post is not in contact with the interface port is provided. Furthermore, an associated method is also provided.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: April 28, 2015
    Assignee: PPC Broadband, Inc.
    Inventors: Trevor Ehret, Richard A. Haube, Noah Montena, Souheil Zraik
  • Patent number: 9009950
    Abstract: Disclosed herein is a method for manufacturing a high frequency inductor, the method including; forming a primary coil for manufacturing the high frequency inductor on a wafer; coating a primary PSV on the wafer on which the primary coil is formed; forming a secondary coil for manufacturing the high frequency inductor, after the coating of the primary PSV; coating a secondary PSV, after the forming of the secondary coil; forming a barrier layer on an electrode portion to be exposed of the high frequency inductor, after the coating of the secondary PSV; filling and curing an insulating resin on the wafer, after the forming of the barrier layer; and polishing the cured resin up to the barrier layer to expose the electrode.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: April 21, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Moon Lee, Young Seuck Yoo, Jong Yun Lee, Young Do Kweon, Sung Kwon Wi
  • Patent number: 9009962
    Abstract: In a stamping step, when a stamping terminal piece formed as a connector terminal is stamped, an electric wire crimping part is stamped and extended from a chain part in a direction perpendicular to a feeding direction, an electric contact part is stamped and extended from the electric wire crimping part in a direction parallel to the feeding direction and a range to which a gold plating is applied by a gold plating step is not overlapped on a range to which a tin plating is applied by a tin plating step in the feeding direction.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: April 21, 2015
    Assignees: Yazaki Corporation, Honda Motor Co., Ltd.
    Inventors: Naoto Sugie, Tomoyuki Miyakawa, Kazuto Ohtaka, Hideki Homma, Tetsuya Mitani, Masaru Shinmura
  • Patent number: 9009960
    Abstract: An inner contact of a coaxial connector has a body with a plurality of spring fingers, the spring fingers each provided with a contact surface. A plurality of transitions from the contact surfaces are provided as curved surfaces. The curved surfaces may be formed, for example, by chamfer, electrical discharge machining or the like, such that an edge to a slot between the spring fingers does not contact the contact surface.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: April 21, 2015
    Assignee: CommScope Technologies LLC
    Inventors: Ronald Alan Vaccaro, John Palac
  • Publication number: 20150102821
    Abstract: A sensor device for contacting first and second contact points of an electrochemical energy store which are situated inside a housing of the electrochemical energy store includes: a first terminal contact for the electrically conductive connection of the sensor device to the first contact point, a first terminal material on a surface of the first terminal contact corresponding to at least a first contact material on a surface of the first contact point; and a second terminal contact for the electrically conductive connection of the sensor device to the second contact point, a second terminal material on a surface of the second terminal contact corresponding to at least a second contact material on a surface of the second contact point.
    Type: Application
    Filed: March 7, 2013
    Publication date: April 16, 2015
    Inventors: Fabian Henrici, Mathias Bruendel, Jens Grimminger
  • Patent number: 8997336
    Abstract: A bonding device electrically bonds metallic surfaces through serrated metal teeth which embed into each metal surface as a fastener is tightened. A sealing material circumferentially outward and inward from the teeth create an air-tight and water-tight seal around the teeth, protecting the bonding location. The device can have an extended central collar extending axially from the through-hole in the center of the device, which will allow it to be installed in holes, or on a stud without the use of adhesives or other retaining methods.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: April 7, 2015
    Assignee: Renewable Energy Holdings, LLC
    Inventors: Michael Strizki, Jason Snyder, James Strizki
  • Publication number: 20150082630
    Abstract: A method of manufacturing a power contactor from an existing contactor having a magnetic amplifier that comprises a blowout coil and a ferromagnetic core, and an arc chute for extinguishing an arc generated by opening the existing contactor under a current load is disclosed. The method includes removing a bolt assembly from the existing contactor and at least one side plate from the existing contactor. The method also includes removing the ferromagnetic core from the existing contactor.
    Type: Application
    Filed: December 3, 2014
    Publication date: March 26, 2015
    Applicant: Progress Rail Services Corp.
    Inventors: John Franklin KRAL, Sidarta Fornari BELTRAMIN
  • Publication number: 20150083478
    Abstract: The electric part to be soldered to a metal pad mounted on a printed circuit board, includes a first surface facing the metal pad, a second surface extending from the first surface in a direction away from the metal pad, and a third surface outwardly extending from the second surface, the second surface and the third surface defining a space in which solder is stored.
    Type: Application
    Filed: September 12, 2014
    Publication date: March 26, 2015
    Inventors: Takayoshi ENDO, Kenya ANDO
  • Publication number: 20150086833
    Abstract: An example method of connecting an electric vehicle battery includes welding a landing of a terminal to a bus bar, and pressing a landing of the terminal and the bus bar against one another during the welding. The landing is along a first plane and a base of the terminal is along a second plane that is spaced from the first plane.
    Type: Application
    Filed: September 20, 2013
    Publication date: March 26, 2015
    Applicant: Ford Global Technologies, LLC
    Inventors: Vineeth Seshadri Kallur, Hari Addanki, Brian Utley, Steve F. Chorian, Debbi Callicoat
  • Patent number: 8984748
    Abstract: A socket assembly that forms a solderless electrical interconnection between terminals on a singulated integrated circuit device and another circuit member. The socket housing has an opening adapted to receive the singulated integrated circuit device. The compliant printed circuit is positioned relative to the socket housing to electrically couple with the terminals on a singulated integrated circuit device located in the opening. The compliant printed circuit includes a dielectric base layer printed onto a surface of a fixture, while leaving cavities in the surface of the fixture exposed. A plurality of contact members are formed in the plurality of cavities in the fixture and coupled to the dielectric base layer. The contact members are exposed wherein the compliant printed circuit is removed from the fixture. At least one dielectric layer with recesses corresponding to a target circuit geometry is printed on the dielectric base layer.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: March 24, 2015
    Assignee: Hsio Technologies, LLC
    Inventor: James Rathburn
  • Publication number: 20150079817
    Abstract: A board-to-board connector capable of preventing a short-circuit from occurring between contacts when connectors are fitted to each other. Pin-shaped male-side contact portions protrude from one surface of a male-side insulating film, and male-side terminal portions are provided on the other surface of said male-side insulating film. This makes it possible to prevent a short-circuit from occurring between adjacent female-side contacts by the male-side contacts.
    Type: Application
    Filed: August 25, 2014
    Publication date: March 19, 2015
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Osamu HASHIGUCHI
  • Publication number: 20150079851
    Abstract: The connector terminal includes a press-fit terminal and a shaft portion, the connector terminal being fabricated of a single metal sheet, the shaft portion having a lateral cross-section having a size entirely covering therewith a lateral cross-section of the press-fit terminal when viewed in an axial direction of the connector terminal, the shaft portion having surfaces extending in the axial direction at an entire circumference thereof, the lateral cross-section of the shaft portion being identical in shape with a lateral cross-section of a terminal space of a die used for fabricating a housing for the press-fit terminal, the press-fit terminal being fit into the terminal space when the housing is molded with resin.
    Type: Application
    Filed: September 8, 2014
    Publication date: March 19, 2015
    Inventors: Takayoshi ENDO, Takuya TAKEDA
  • Publication number: 20150077981
    Abstract: An electronic personal vaporizer is provided, including a shell having a flexible printed circuit board; and a printed battery printed on the flexible printed circuit board. The printed battery may be printed onto the flexible printed circuit board via application of inks to the flexible printed circuit board. The vaporizer may further include an electroluminescent light source printed on the flexible printed circuit board.
    Type: Application
    Filed: May 22, 2014
    Publication date: March 19, 2015
    Inventor: Cameron Lanning Cormack
  • Patent number: 8979564
    Abstract: A method of manufacture of a self-cleaning socket system includes: providing a base plate having a gas pocket with a dimple; and coupling a pin plate having a compressed gas port to the base plate with the compressed gas port aligned with the dimple.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: March 17, 2015
    Assignee: Data I/O Corporation
    Inventor: Jaswant Sandhu
  • Patent number: 8966745
    Abstract: A lead assembly includes a lead with a distal end and a proximal end. The lead includes a plurality of electrodes disposed at the distal end and a plurality of terminals disposed at the proximal end. The lead also defines at least one central lumen and a plurality of outer lumens. The central and outer lumens extend from the proximal end to the distal end such that the plurality of outer lumens extend laterally from the at least one central lumen. The lead further includes a plurality of conductive wires. Each conductive wire couples at least one of the plurality of electrodes electrically to at least one of the plurality of terminals. At least two conductive wires are disposed in each of the plurality of outer lumens.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: March 3, 2015
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventor: John Michael Barker
  • Publication number: 20150056872
    Abstract: A connector terminal comprised of a single bent metal sheet, including a contact portion including a first sheet portion and a second sheet portion, the first and second sheet portions being folded to overlap one on another, a terminal body, and a connector portion connecting the terminal body and the contact portion to each other, the connector portion including a reinforcement portion covering therewith an end surface of the first sheet portion, an end surface of the second sheet portion, and at least a part of a surface of the second sheet portion in a part of the contact portion.
    Type: Application
    Filed: August 13, 2014
    Publication date: February 26, 2015
    Inventors: Takayoshi ENDO, Sakai YAGI, Jun MUKUNOKI, Yuji KANO
  • Patent number: 8963056
    Abstract: Planar electrode system and method of manufacturing same, comprising at least one foil-type, electrically conductive planar electrode, a connection for connecting it to an external operating apparatus/control apparatus, and also at least one substrate layer, protective layer and/or insulation layer arranged on the surface of the planar electrode, which system comprises a foil-type planar electrode construction fitted into a continuous foil construction and comprising a least one foil-type electrode (101, 111), which planar electrode construction is fitted to operate both as a planar sensor, in which case it can be connected via a sensor connection (103) to a sensor control apparatus (SC101), and in electrical heating action, in which case it can be connected via an electrical heating connection (113) to an electrical heating control apparatus (HC111).
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: February 24, 2015
    Assignee: Elsi Technologies Oy.
    Inventor: Göran Sundholm