On Back Of Piezoelectric Element Patents (Class 310/327)
  • Patent number: 11793494
    Abstract: An ultrasound probe of the present invention has a piezoelectric element and a backing material disposed on one direction side with respect to the piezoelectric element, the backing material containing heat conductive particles. The backing material has a heat conductivity of 2.0 W/mk or more, and the content of the heat conductive particles is less than 30 vol % based on the total volume of the backing material.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: October 24, 2023
    Assignee: KONICA MINOLTA, INC.
    Inventor: Kiyokazu Morita
  • Patent number: 11679414
    Abstract: Disclosed is an ultrasonic transducer including: at least one piezoelectric wafer having two parallel planar main faces: a front face and a posterior face; at least one posterior plate having two parallel planar main faces: an anterior face and a rear face, the anterior face of the posterior plate extending facing, and in contact with, the posterior face of the piezoelectric wafer. The posterior plate has a thickness between three and seven times the thickness of the piezoelectric wafer. The posterior plate has an acoustic impedance between 10 MPa·s·m?1 and 35 MPa·s·m?1. Also disclosed is a method for assembling such a transducer as well as a flowmeter including at least one such transducer.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: June 20, 2023
    Assignee: YZATEC
    Inventors: Marwan Zeidan, Alain Ramond, Merlin Minkus
  • Patent number: 11522513
    Abstract: Embodiments of this disclosure relate to bulk acoustic wave resonators on a substrate. The bulk acoustic wave resonators include a first bulk acoustic wave resonator, a second bulk acoustic wave resonator, a conductor electrically connecting the first bulk acoustic wave resonator to the second bulk acoustic wave resonator, and an air gap positioned between the conductor and a surface of the substrate.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: December 6, 2022
    Assignee: Skyworks Global Pte. Ltd.
    Inventors: Kwang Jae Shin, Renfeng Jin, Li Chen
  • Patent number: 11496819
    Abstract: An electronic device is provided The electronic device includes a first case member, a plurality of protruding members provided on the first case member or a supporting member disposed on the first case member, at least one speaker, an enclosure configured to receive at least a portion of the speaker and including a plurality of receiving recesses formed in a side surface of the enclosure, and engaging members engaged to the enclosure and at least partially positioned in the receiving recesses, respectively. The engaging members may be engaged to one of the plurality of protruding members, respectively, to fix the enclosure to the first case member or the support member disposed on the first case member. Other various embodiments are possible as well.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: November 8, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Brian Han, Kwanghyun Kim, Jiwoo Lee
  • Patent number: 11453031
    Abstract: An ultrasonic element includes an element substrate including a first surface, a second surface having a front-back relation with the first surface, an opening section piercing through the element substrate from the first surface to the second surface, and a partition wall section surrounding the opening section, a supporting film provided on the first surface of the element substrate to cover the opening section and including a third surface facing the opening section and a fourth surface having a front-back relation with the third surface, a piezoelectric element provided on the fourth surface of the supporting film and disposed in a region overlapping the opening section of the supporting film in a plan view from a film thickness direction extending from the third surface to the fourth surface, a sealing plate provided to be opposed to the fourth surface of the supporting film and joined to the supporting film by an adhesive member via a beam section projecting toward the supporting film, and a wall sectio
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: September 27, 2022
    Inventors: Hironori Suzuki, Chikara Kojima, Koji Ohashi, Yasuyuki Matsumoto, Katsuhiro Imai
  • Patent number: 11415560
    Abstract: A backing member includes a resin layer having a first surface, and a second surface opposite to the first surface, and a plurality of linear conductors, embedded in the resin layer, and penetrating the resin layer from the first surface to the second surface. Each of the plurality of linear conductors includes a metal material having an ultrasonic wave insulating property, and includes at least one bent portion or curved portion.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: August 16, 2022
    Inventor: Hisashi Kaneda
  • Patent number: 11326996
    Abstract: A system for monitoring processing of a fluid receives one or more characteristics of the fluid and uses those characteristics to determine specific gravity of the fluid and a level of processing activity of the fluid. The processor will cause a display device to output a dynamic representation of the specific gravity of the fluid as well as the determined level of processing activity. In some embodiments, the processing activity may include fermentation, as that of a beverage. If so, the dynamic representation of the determined level of processing activity may include a fermentation tank with a dynamically changing cavity. Displayed characteristics of the cavity will change as the determined level of the fermentation increases.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: May 10, 2022
    Assignee: TZero Research & Development LLC
    Inventors: Stephen M. Wells, Nicholas A. Wells, Eli M. Hughes
  • Patent number: 11317897
    Abstract: The invention has, at a distal end part thereof, an ultrasonic oscillator array in which a plurality of ultrasonic oscillators are arranged; a shielded cable including a plurality of signal lines, and a plurality of metallic shield members disposed outside the signal lines; a wiring part including a plurality of connecting parts that electrically connect the plurality of signal lines to the plurality of ultrasonic oscillators, respectively; a ground part that is electrically connected to the plurality of shield members and has heat conductivity; a sheet-like first heat-conduction member disposed on a side surface of the ultrasonic oscillator array; and a second heat-conduction member that thermally connects the first heat-conduction member to the ground part. Accordingly, an ultrasonic endoscope capable of improving diagnostic accuracy in ultrasonic diagnosis, and a method for manufacturing the ultrasonic endoscope are provided.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: May 3, 2022
    Assignee: FUJIFILM Corporation
    Inventors: Satoru Okada, Katsuya Yamamoto, Yasuhiko Morimoto
  • Patent number: 11316093
    Abstract: A magneto-electric converter capable of converting a variation in magnetic field into a potential difference between two electrical terminals includes a support layer comprising two electrical terminals; a stack disposed on the support layer of a first layer made from a magnetostrictive material defining the reference plane and of a second layer made from a piezoelectric material having a polarization axis in the plane defined by the second layer, parallel to the reference plane; the second layer comprising electrodes; and a means for electrical connection of the electrodes to the electrical terminals.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: April 26, 2022
    Assignee: Enerbee
    Inventors: Jérôme Delamare, Thibault Ricart, Jérémie Guillen
  • Patent number: 11241217
    Abstract: An ultrasound probe includes: a casing; a plurality of piezoelectric devices that are arranged inside the casing; an acoustic matching layer that is attached to ultrasound radiation surfaces of the piezoelectric devices; a shared ground that is arranged on a surface of the acoustic matching layer to allow at least a part of the shared ground to come in contact with the piezoelectric devices; a deformation preventing member that is arranged in contact with the surface of the acoustic matching layer to surround an outer periphery of the piezoelectric devices and to be separated from the piezoelectric devices; a coaxial line configured to transmit a signal to each of the piezoelectric devices; and a circuit board that is arranged on an opposite side to the ultrasound radiation surfaces of the piezoelectric devices, the circuit board being configured to electrically connect the piezoelectric devices and the coaxial line.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: February 8, 2022
    Inventor: Sunao Sato
  • Patent number: 11197655
    Abstract: Provided are an ultrasound probe including high-sensitive piezoelectric elements and a method of manufacturing an ultrasound probe. The ultrasound probe includes a plurality of piezoelectric elements on a backing material arranged in an array along an arrangement direction. Each of the plurality of piezoelectric elements includes a laminate in which a first conductive part, a piezoelectric body part, and a second conductive part are laminated on a surface of the backing material in order. A plurality of acoustic matching part respectively arranged on the second conductive parts of the plurality of piezoelectric elements is provided. A plurality of third conductive parts acquired by respectively joining a part of the plurality of acoustic matching parts in an elevation direction to the second conductive parts of the plurality of piezoelectric elements is provided. A fourth conductive part that electrically connects the plurality of third conductive parts to each other is provided.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: December 14, 2021
    Assignee: FUJIFILM Corporation
    Inventor: Atsushi Osawa
  • Patent number: 11179749
    Abstract: An interposer includes: a circuit board stack in which circuit boards are stacked; and an outer board arranged on at least one of outer side surfaces of the circuit board stack. The circuit boards are arranged include first conductive lines having first ends exposed through a first side portion of the circuit boards and second ends exposed through a second side portion opposite the first side portion of the circuit boards. The outer board includes second conductive lines having first ends exposed through a different side from the first side portion of the circuit boards and second ends exposed through a side portion located on a same side as the second side portion of the circuit boards.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: November 23, 2021
    Inventors: Kyung-moo Choi, Dong Won Shin
  • Patent number: 11094875
    Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: August 17, 2021
    Assignee: FUJIFILM SonoSite, Inc.
    Inventors: Marc Lukacs, Nicholas Christopher Chaggares, Desmond Hirson, Guofeng Pang
  • Patent number: 11087582
    Abstract: An electronic gaming machine that provides enhanced physical player interaction by employing a player tactile feedback provider including co-acting ultrasonic transducer array assemblies.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: August 10, 2021
    Assignee: IGT
    Inventors: Matthew Franich, Jerrod Laputz, Stewart Thoeni
  • Patent number: 11056091
    Abstract: The invention relates to a damping device (5) for an exterior part (3) of a motor vehicle (1) for damping oscillations of the exterior part (3) which are caused by way of an ultrasonic sensor (4) during the emitting and/or receiving of ultrasonic signals, the damping device (5) having at least two damping elements (7, 8), a first one of the damping elements (7) being configured for increasing a degree of damping of the exterior part (3) in a first temperature range (T1) of the exterior part (3) and/or in a first frequency range of the oscillations, and a second one of the damping elements (8) being configured for increasing a degree of damping of the exterior part (3) in a second temperature range (T2) of the exterior part (3), which second temperature range (T2) is different from the first temperature range (T1), and/or in a second frequency range of the oscillations, which second frequency range is different from the first frequency range.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: July 6, 2021
    Assignee: Valeo Schalter und Sensoren GmbH
    Inventors: Uwe Kupfernagel, Michael Hallek
  • Patent number: 11051114
    Abstract: An electroacoustic transducer, comprising a piezoelectric part comprising a piezoelectric material having a first acoustical impedance and an acoustical thickness, a substrate part comprising a material having a second acoustical impedance, and an intermediate part comprising a material having a third acoustical impedance and at least partially sandwiched between the piezoelectric part and the substrate part for acoustical communication therewith. The first acoustical impedance and the second acoustical impedance each has a respective value within a range of values for which the value of third acoustical impedance: is an upper limit if said acoustical thickness is less than 0.4?, or is a lower limit if said acoustical thickness is greater than 0.4? where ? is an acoustical wavelength in the material of the piezoelectric part.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: June 29, 2021
    Assignee: BAE SYSTEMS plc
    Inventor: Lionel William Kent
  • Patent number: 10897005
    Abstract: A vibrating device includes a piezoelectric element, a resin member having electric insulation, a vibrating member made of metal, a first adhesive layer, and a second adhesive layer. The resin member includes a first principal surface and a second principal surface opposing each other. The vibrating member includes a third principal surface and a fourth principal surface opposing each other. The first adhesive layer joins the piezoelectric element and the first principal surface. The second adhesive layer joins the second principal surface and the third principal surface. An area of the resin member is greater than an area of the piezoelectric element, and an area of the vibrating member is greater than the area of the piezoelectric element. An area where the second adhesive layer adheres to the vibrating member is greater than an area where the first adhesive layer adheres to the resin member.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: January 19, 2021
    Inventors: Kaoru Kijima, Tatsuya Taki, Shunsuke Ueno, Atsushi Ezawa, Haruna Sumi, Tomohiro Takeda
  • Patent number: 10828012
    Abstract: An ultrasonic array oscillator according to the present technology includes ultrasonic oscillators and semiconductor chips. The ultrasonic oscillators form an array. The semiconductor chips are bonded to the respective ultrasonic oscillators to form impedance matching circuits.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: November 10, 2020
    Inventor: Rui Morimoto
  • Patent number: 10814352
    Abstract: Disclosed is an ultrasonic transducer assembly comprising an ultrasonic transducer chip (100) having a main surface comprising a plurality of ultrasound transducer elements (112) and a plurality of first contacts (120) for connecting to said ultrasound transducer elements; a contact chip (400) having a further main surface comprising a plurality of second contacts (420); an backing member (300) comprising ultrasound absorbing and/or scattering bodies (310), said backing member comprising a first surface (302) on which the transducer chip is mounted and a second surface (306) on which the contact chip is mounted; and a flexible interconnect (200) extending over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks (210), each conductive track connecting one of said first contacts to a second contact.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: October 27, 2020
    Inventors: Johannes Wilhelmus Weekamp, Vincent Adrianus Henneken, Alfons Wouter Groenland, Marcus Cornelis Louwerse
  • Patent number: 10788352
    Abstract: A Wi-Fi tank monitor ultrasonically monitors liquid fuel oil in fuel oil tanks, as well as other liquids in respective liquid tanks. A transducer is magnetically attached to the bottom of a steel oil tank which will transmit ultrasonic pulses through the bottom of the tank and into the oil or other liquid. This wave is reflected by the top of the oil in the tank and be detected by the transducer on the bottom of the tank yielding the height of the oil or other liquid.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: September 29, 2020
    Assignee: BearClaw Technologies, LLC
    Inventor: John Beiswinger
  • Patent number: 10653390
    Abstract: An ultrasonic device includes: a substrate on which ultrasonic elements configured to transmit and receive ultrasound and a cable electrically connected to the ultrasonic elements are installed; an acoustic lens having a plurality of projecting portions connected to one of the substrate and the cable; and an acoustic matching unit located between the substrate and the acoustic lens, wherein the projecting portions extend along an outer perimeter of the substrate, and the projecting portions are provided at a lower ratio per unit length in a direction in which the projecting portions extend in a place where the cable is installed than in a place where the cable is not installed.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: May 19, 2020
    Assignee: Seiko Epson Corporation
    Inventor: Kanechika Kiyose
  • Patent number: 10644223
    Abstract: A piezoelectric hydrophone with perforations and an array comprising a plurality of hydrophones comprises a stack of layers that are bonded to one another, the layers comprising at least one piezoelectric layer and a plurality of layers referred to as rigid layers, at least two of which are electrode layers, the rigid layers exhibiting a stiffness perpendicularly to the direction of stacking, which stiffness is higher than the stiffness of the piezoelectric layer perpendicularly to the direction of stacking. At least one piezoelectric layer comprises a central zone comprising a set of perforations that pass through the piezoelectric layer solely along the direction of stacking, each perforation being closed tight by closure elements comprising portions of two of the rigid layers, the two rigid layers extending over the entirety of the surface of the central zone.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: May 5, 2020
    Assignee: THALES
    Inventors: Julien Bernard, Maryline Nakache, Robert Decarlis, Roger Thannberger, Antoine Caplain, Guy Bertrand
  • Patent number: 10610895
    Abstract: In one aspect, ultrasound transducers are described herein comprising monolithic caps having low acoustic impedance. Such transducers can be safer to use and/or simpler to manufacture. A transducer described herein, in some embodiments, a casing, a transducer element assembly disposed in the casing, an impedance matching layer assembly positioned over the transducer element assembly, and a monolithic thermoplastic cup enclosing the inner impedance matching layer assembly, the monolithic thermoplastic cup comprising side walls extending over side walls of the casing and an impedance matching bottom wall having an acoustic impedance of 1.5 MRayls to 4.0 MRayls.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: April 7, 2020
    Inventor: Matthew Todd Spigelmyer
  • Patent number: 10602289
    Abstract: In one aspect, the disclosure provides an apparatus that includes an acoustic transducer, and a backing coupled to the transducer, wherein the backing includes solid grains with fluid between the grains.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: March 24, 2020
    Inventors: Rocco DiFoggio, Roger R. Steinsiek
  • Patent number: 10483453
    Abstract: A method of forming an ultrasonic transducer comprises coupling a front polymer layer of uniform thickness to a piezoelectric element. A front metal layer is coupled to the polymer layer on a side of the front polymer layer opposite the piezoelectric element for transmitting acoustic energy between the front polymer layer and a propagation medium. The front polymer layer and the front metal layer define a front acoustic impedance converter, wherein the front polymer layer completely isolates the piezoelectric element from the front metal layer.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: November 19, 2019
    Assignee: Measurement Specialties, Inc.
    Inventors: Minoru Toda, Mitchell L. Thompson
  • Patent number: 10481288
    Abstract: In accordance with embodiments of the present disclosure, systems and methods for improving performance of ultrasonic transducers, particularly those used in borehole environments, are provided. The disclosed ultrasonic transducers all feature a backing element that is a ceramic backing material. The ceramic backing material may include a solid piece of ceramic material that is disposed on a back end of a piezoelectric element used in the ultrasonic transducer. The disclosed ceramic backing material may be used to mechanically match the backing element to the piezoelectric source element, while minimizing the amplitude of reflections of the ultrasonic pulse generated by the piezoelectric element and reflected at the far end of the backing element. This ceramic backing material may provide consistent performance regardless of the surrounding pressure and temperature, making it particularly useful in borehole applications.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: November 19, 2019
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Chung Chang, Jing Jin, Yao Ge
  • Patent number: 10458824
    Abstract: An ultrasonic transducer arrangement has a housing for mounting the ultrasonic transducer arrangement in a through-hole in a housing of an ultrasonic water meter in a mounting plane. The housing of the meter contains an ultrasonic measuring section along which a transit time measurement can be carried out by the ultrasonic transducer arrangement. The ultrasonic transducer arrangement has a transducer body located in the housing for generating and/or receiving an acoustic signal, a housing wall assigned to the transducer body through which the acoustic signal runs, and an electrical contact for connecting the transducer body to a voltage or current source. The transducer body is positioned in the housing at an oblique angle with respect to the mounting plane. A holding device, which is oriented at an oblique angle with respect to the mounting plane is provided inside the housing, which exerts a holding force oriented towards the housing wall.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: October 29, 2019
    Assignee: Diehl Metering GmbH
    Inventors: Harald Kroemer, Wilhelm Oefelein, Patrick Huenenberger
  • Patent number: 10433063
    Abstract: The invention relates to a MEMS printed circuit board module (1) for a sound transducer assembly (2) for generating and/or detecting surge waves in the audible wavelength spectrum with a printed circuit board (4) and a multi-layer piezoelectric structure (5), by means of which a membrane (6) provided for this purpose can be set into oscillation and/or oscillations of a membrane (6) can be detected. In accordance with the invention, the multi-layer piezoelectric structure (5) is directly connected to the printed circuit board (4). In addition, the invention relates to a sound transducer assembly (2) with such a MEMS printed circuit board module (1) along with a method for the manufacturing of the MEMS printed circuit board module (1) and the sound transducer assembly (2).
    Type: Grant
    Filed: September 5, 2016
    Date of Patent: October 1, 2019
    Assignee: USound GmbH
    Inventors: Andrea Rusconi Clerici Beltrami, Ferruccio Bottoni
  • Patent number: 10401204
    Abstract: An electromechanical transformation device for an ultrasonic flow meter comprises an alkaline niobate piezoelectric ceramic composition and a rigid body adhered onto the major surface of the ceramic composition. The ceramic composition is made of crystal structures such as orthorhombic crystals formed at the side where the temperature is lower than the orthorhombic-to-tetragonal phase transition temperature, tetragonal crystals formed at the side where temperature is higher that the orthorhombic-to-tetragonal phase transition temperature as well as at the side where the temperature is lower than the tetragonal-to-cubic phase transition temperature, and the cubic crystals formed at the side where the temperature is higher than the tetragonal-to-cubic phase temperature. Young's modulus of the rigid is 60 GPa or more. The volume percent of the ceramic composition existing within a range where the distance from the adhesion point of the piezoelectric ceramic composition and the rigid body is 40% or more.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: September 3, 2019
    Inventors: Kenji Nagareda, Yuki Murai, Atsuhiro Hayashi, Yuichi Maida
  • Patent number: 10327735
    Abstract: Provided is a portable ultrasonic probe including a main body comprising a transducer configured to generate an ultrasonic wave, and a folder part comprising a display and rotatably coupled to an end portion of the main body, wherein the main body further comprises an analog to digital (AD) converter and a beamformer, the AD converter and the beamformer being provided in a chip.
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: June 25, 2019
    Inventors: Kyung Il Cho, Jong Keun Song, Bae Hyung Kim, Young Il Kim, Seung Heun Lee
  • Patent number: 10314562
    Abstract: Provided are an ultrasonic probe and a method of manufacturing the same. The ultrasonic probe includes: a matching layer; a piezoelectric layer that is disposed on a bottom surface of the matching layer and generates ultrasonic waves; and a backing layer that is disposed on a bottom surface of the piezoelectric layer and includes plate-shaped carbon allotropes and a backing material provided between the plate-shaped carbon allotropes.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: June 11, 2019
    Inventors: Kyung Hun Song, Jae Moon Jo
  • Patent number: 10277194
    Abstract: Methods of designing a BAW resonator having fractal geometry and the resulting devices are provided. Embodiments include providing a fractal generator function; providing three or more line segments; applying the fractal generator function to each of the three or more line segments to form three or more respective fractal line segments, each of the three or more fractal line segments having a respective start point and endpoint and at least four sub-segments; and connecting an endpoint of each one of the three or more fractal line segments to a successive start point of another of the three or more fractal line segments to form a closed-loop contour line representative of an area of an electrode of a BAW resonator, the closed-loop contour line having a fractal dimension that is greater than one and less than two.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: April 30, 2019
    Inventors: Humberto Campanella-Pineda, You Qian, Rakesh Kumar
  • Patent number: 10206659
    Abstract: A unimorph-type ultrasound probe includes a substrate in which a plurality of openings each having a predetermined shape is formed, a plurality of vibration plates formed on the substrate so as to close one end of each of the plurality of openings, a plurality of piezoelectric element portions which is formed on a surface of the plurality of vibration plates and each has a piezoelectric substance layer and a pair of electrode layers formed on both surfaces of the piezoelectric substance layer, and a covering layer which is disposed on a surface of the substrate such that the plurality of piezoelectric element portions is embedded in the covering layer, and is formed of an organic resin having an acoustic impedance of 1.5×106 kg/m2 s to 4×106 kg/m2 s and a Shore A hardness of equal to or less than 75.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: February 19, 2019
    Assignee: FUJIFILM Corporation
    Inventor: Takatsugu Wada
  • Patent number: 10134973
    Abstract: The present application relates to the technical field of transducer, it provides an ultrasonic transducer and the manufacture method therefore. The ultrasonic transducer comprises: a piezoelectric layer for radiating sound signal forward or backward, each side thereof being plated with an electrode; a matching layer arranged in the front of the piezoelectric layer and suitable for sending the forward sound signal; a tuning layer arranged on the back of the piezoelectric layer, wherein the piezoelectric layer is disposed between the tuning layer and the matching layer; a backing layer for absorbing the backward sound signal from the piezoelectric layer, wherein the backing layer is arranged against the piezoelectric layer on the tuning layer.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: November 20, 2018
    Inventors: Wenjuan Wang, Dan Zhou, Bo Ouyang, Jianhua Mo
  • Patent number: 10107786
    Abstract: A clamping apparatus for coupling an ultrasonic transducer to a conduit is disclosed. The clamping apparatus comprises a base portion fastened to the conduit and including a bracket for receiving an adapter. The adapter is attached to a housing and allows the housing to be rotated when the adapter is positioned in an upper portion of the bracket, and prevents the housing from being rotated when the adapter is positioned in a lower portion of the bracket. The housing is configured to enclose the ultrasonic transducer except for a housing opening along the bottom of the housing. The ultrasonic transducer extends through the housing opening and is spring biased against the conduit.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: October 23, 2018
    Assignee: General Electric Company
    Inventor: Kai Fan
  • Patent number: 10074795
    Abstract: An ultrasonic probe is provided that makes it possible to increase the shock resistance of a board of an ultrasonic device unit. An ultrasonic probe includes a housing. The housing defines an opening and an accommodation space that is continuous with the opening. An ultrasonic device unit is disposed in the accommodation space. A board has on its first surface an ultrasonic transducer that faces the opening. A rigid body is in contact with a second surface of the board and the housing. The rigid body has higher stiffness than the board.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: September 11, 2018
    Assignee: Seiko Epson Corporation
    Inventor: Kanechika Kiyose
  • Patent number: 10031155
    Abstract: The piezoelectric sensor is formed in a semiconductor material chip having a surface defining a plane and integrating a structure for sensing forces acting in the plane. The chip is formed by a substrate defining a cantilever having a first end, constrained to an anchorage portion of the substrate, and a second end, which is free to bend under the action of external forces. The cantilever has first and second longitudinal halves, each carrying a respective strip element of piezoelectric material, which extends parallel to the chip plane.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: July 24, 2018
    Assignee: STMicroelectronics S.r.l.
    Inventors: Francesco Procopio, Carlo Valzasina
  • Patent number: 10022750
    Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: July 17, 2018
    Assignee: FUJIFILM Dimatix, Inc.
    Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
  • Patent number: 9966524
    Abstract: According to one embodiment, an ultrasonic probe includes a single crystal piezoelectric body with first and second planes facing each other and having a crystal orientation of [100], first and second electrodes on the respective first and second plane of the piezoelectric body, an acoustic matching layer on the first electrode, and a backing member under the second electrode, wherein the piezoelectric body is polarized along a first direction passing through the piezoelectric body and first and second electrodes, a fracture surface of the piezoelectric body that includes the first direction has a multilayer shape along one of the first and second electrodes, and a thickness of each layer of the multilayer shape is not less than 0.5 ?m and not more than 5 ?m.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: May 8, 2018
    Assignee: Toshiba Medical Systems Corporation
    Inventors: Noriko Yamamoto, Yohachi Yamashita, Yasuharu Hosono, Kazuhiro Itsumi, Kazuhiko Higuchi
  • Patent number: 9949739
    Abstract: A grip assembly for an embolic delivery device is described, where said grip assembly includes an integral wiping system utilizing one or more wipers. The grip assembly is constructed and arranged to allow an embolic delivery device to be inserted into the grip quickly and easily, without shifting undue attention away from the patient to the device. The wiper or wipers prevent any fluids or debris that may be present on a proximal end of the embolic delivery device from entering the interior of the grip assembly, thereby preserving a clean environment for making solid electrical connections between contacts in the grip assembly and corresponding contacts on the embolic delivery device.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: April 24, 2018
    Assignee: MicroVention, Inc.
    Inventors: Ross Tsukashima, Thomas Charles Sternweiler, Matthew J. Fitz
  • Patent number: 9945817
    Abstract: A phased array transducer for inspecting a fastener hole and adjacent structure to identify defects and determine hole integrity without removing the fastener from the hole. The phased array transducer includes a plurality of transducer elements, where one of the transducer elements is used to align the transducer to the hole, one group of the remaining transducer elements inspects the entire thickness of the structure at one side of the fastener and another group of the remaining transducer elements inspects the entire thickness of the structure at an opposite side of the fastener.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: April 17, 2018
    Assignee: Northrop Grumman Systems Corporation
    Inventors: William H. Pember, Kevin L. Boyd, Kevin H. Cook, Chris Famighetti, Robert D. Fidnarick, John Munyak, John D. Weir
  • Patent number: 9903536
    Abstract: The present invention is directed to an improved fluid diode using topology optimization with Finite Element Method (FEM). Topology optimization as a flexible optimization method has been extended to the fluid field. For given boundary conditions and constraints, it distributes a specific amount of pores (or remove materials to get channel) in the design domain to minimize/maximize an objective function. In this design, inlet and outlet ports are aligned and inflow and outflow are in the same direction. The present invention features an intricate network of fluid channels having optimized fluid connectivity and shapes, which significantly improves the diodicity of fluidic passive valves.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: February 27, 2018
    Assignee: The Johns Hopkins University
    Inventors: Sen Lin, James Kevin Guest, Takeru Igusa
  • Patent number: 9840313
    Abstract: A cleaning or grooming system that uses acoustic pressure shock waves can remove barnacles, algae, biofilms and other undesired materials from the hulls of ships, propellers, rudders, inlet ports for cooling of nuclear submarines, outlet ports, sonar housings, protective grills and other structures that are submerged in salt or fresh water environments.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: December 12, 2017
    Assignee: SANUWAVE, INC.
    Inventors: Iulian Cioanta, Cary McGhin
  • Patent number: 9808830
    Abstract: An ultrasound transducer and an ultrasound imaging system including an acoustic layer with a plurality of transducer elements and a dematching layer coupled to the acoustic layer. The dematching layer has an acoustic impedance greater than the acoustic layer and the dematching layer has a thickness that varies in order to alter a bandwidth of the ultrasound probe.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: November 7, 2017
    Inventors: Alan Tai, Frederic Lanteri, Scott Easterbrook, Jian Zhong Zhao
  • Patent number: 9772314
    Abstract: An ultrasonic sensor which includes a substrate where an opening section is formed, a vibration plate that is provided on the substrate so as to close the opening section, and a piezoelectric element that is layered on a surface of the vibration plate on an opposite side to the opening section and includes a first electrode, a piezoelectric element, and a second electrode, includes a reflection layer that is provided in a space around the piezoelectric element on the surface of the vibration plate on an opposite side to the opening section, to reflect other ultrasonic waves which are transmitted in a different direction from a transmitted ultrasonic wave transmitted to a measuring target side on an interface between the piezoelectric element and the reflection layer, and has a thickness so as to superimpose other ultrasonic waves on the transmitted ultrasonic wave.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: September 26, 2017
    Assignee: Seiko Epson Corporation
    Inventors: Chikara Kojima, Koji Ohashi
  • Patent number: 9705065
    Abstract: There is provided a piezoelectric actuator including: a piezoelectric member having a multilayer structure; an external electrode formed on an outer surface of the piezoelectric member; and an intermediate electrode formed between layers of the piezoelectric members and having an area smaller than that of the external electrode.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: July 11, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Byung Hun Kim, Hwa Sun Lee, Jae Chang Lee, Seung Mo Lim
  • Patent number: 9673604
    Abstract: A coaxial cable terminator assembly includes an electrically insulative substrate carried by a non-conductive cap in a receiving area thereof. The substrate carries outer and inner termination connections and an electrically resistive connector that electrically connects the outer termination connection to the inner termination connection. Outer and inner contacts are electrically connected to the outer and inner termination connections, respectively. The outer and inner contacts are for electrically contacting coaxial outer and inner conductors, respectively, of the end of a coaxial cable for terminating the end of the coaxial cable, and the cap is for frictionally and non-conductively engaging the coaxial cable, when the end of the coaxial cable is inserted into the receiving area.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: June 6, 2017
    Inventor: Gregory L. Weipert
  • Patent number: 9645264
    Abstract: Embodiments related to sound sources for marine geophysical surveys. An embodiment provides a sound source, comprising: an outer shell containing a first gas at a first gas pressure; and a compliance chamber in indirect fluid communication with the first gas, the compliance chamber containing a second gas at a second gas pressure, wherein the second gas pressure is lower than the first gas pressure. An embodiment provides a sound source for marine geophysical surveys, comprising: an outer shell; a mass coupled to the outer shell; and an actuator coupled to the outer shell. Additional apparatus and methods are disclosed herein.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: May 9, 2017
    Assignee: PGS Geophysical AS
    Inventors: Julie Slaughter Zrostlik, Todd Allan Reinders
  • Patent number: 9585977
    Abstract: Methods and devices for treating skin include a skin-contacting portion, an actuator and a processor, wherein activation of the actuator causes surface acoustic waves of Rayleigh, “pseudo” Rayleigh types to be produced on the skin around the actuator. In a location which is under the actuator, the actuator produces tension and repulsion of skin particles. These surface acoustic waves can be used to provide treatment to the skin, including wound healing, non-adhesion of bandages, reduced infection, reduced pain and cosmetic enhancements. The skin-contacting portion may be a patch or bandage, a glove, a hand-held device, or any other suitable configuration. The actuator is incorporated into the skin-contacting portion.
    Type: Grant
    Filed: February 26, 2007
    Date of Patent: March 7, 2017
    Inventors: Jona Zumeris, Harold Jacob, Hanan Raskin, Gera Kratysh, Yanina Zumeris
  • Patent number: 9541431
    Abstract: An ultrasonic flow meter unit, mounted to a fluid passage through which a measurement target fluid flows, comprises a pair of ultrasonic transducers each including a piezoelectric substrate, and an acoustic matching member; a measuring circuit which measures a flow of a target fluid based on time for which an ultrasonic pulse propagates between the pair of ultrasonic transducers; and an insulating damping member unitarily formed to cover at least a portion of each of a portion of each of the pair of ultrasonic transducers, which portion contacts the fluid passage, the piezoelectric substrate, and the measuring circuit.
    Type: Grant
    Filed: June 4, 2013
    Date of Patent: January 10, 2017
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Makoto Nakano, Hajime Miyata, Yuji Fujii