With Temperature Modifier And/or Gas Or Vapor Atmosphere Control Patents (Class 310/341)
  • Patent number: 11228299
    Abstract: A piezoelectric thin film resonator includes: a substrate; a piezoelectric film located on the substrate; a lower electrode and an upper electrode facing each other across at least a part of the piezoelectric film; and an insertion film that is inserted between the lower electrode and the upper electrode, is located in an outer peripheral region within a resonance region where the lower electrode and the upper electrode face each other across the piezoelectric film, is located in a region that is located outside the resonance region and surrounds the resonance region, is not located in a center region of the resonance region, and includes a first part, which is located in the resonance region and has a first film thickness, and a second part, which is located outside the resonance region and has a second film thickness, the first film thickness being less than the second film thickness.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: January 18, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Jiansong Liu, Tokihiro Nishihara, Tsuyoshi Yokoyama, Shinji Taniguchi, Taisei Irieda
  • Patent number: 10964178
    Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination; one or more pins attached to each of the plurality of actuators, one end of each of the plurality of pins affixed to the actuators extrudes beyond surface of the wearable device case and is exposed outside of the wearable device case; electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. Other related embodiments are disclosed.
    Type: Grant
    Filed: October 1, 2016
    Date of Patent: March 30, 2021
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Georgios C. Dogiamis, Johanna M. Swan
  • Patent number: 10523177
    Abstract: A piezoelectric thin film resonator includes: a substrate; lower and upper electrodes located on the substrate; a piezoelectric film that has a lower piezoelectric film mainly composed of aluminum nitride and an upper piezoelectric film mainly composed of aluminum nitride, the lower piezoelectric film and the upper piezoelectric film being in contact with each other in at least a part of a resonance region where the lower electrode and the upper electrode face each other across at least a part of the piezoelectric film, and a fluorine concentration at a boundary face with which the lower piezoelectric film and the upper piezoelectric film are in contact being 0.03 atomic % or less; and an insulating film that is located between the lower piezoelectric film and the upper piezoelectric film in a region other than the at least a part of the resonance region and contains silicon oxide.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: December 31, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Shinji Taniguchi, Hiroomi Kaneko, Hiroshi Kawakami, Tokihiro Nishihara
  • Patent number: 9679919
    Abstract: A display device includes a first substrate having an active area, a circuit area extending outwardly from the active area, and a cell seal area extending outwardly from the circuit area, a second substrate covering the first substrate, a sealing part between the first substrate and the second substrate, the sealing part covering at least a portion of the circuit area, a wiring part in the circuit area of the first substrate and electrically connected to elements in the active area of the first substrate, the wiring part including at least one level-difference compensation part, and a stepped part between the sealing part and at least a portion of the wiring part, the at least one level-difference compensation part of the wiring part being adjacent to the stepped part.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: June 13, 2017
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jaekyung Go, Eunjae Na, Minjun Jo, Hyunjun Choi
  • Patent number: 9612227
    Abstract: A probe that is inserted into a body cavity, wherein an inner unit (inner assembly) comprises an oscillator unit, an intermediate substrate, an electronic circuit substrate, and a backing member. An exhaust heat sheet is joined to an area at the perimeter of the rear surface of the electronic circuit substrate. The exhaust heat sheet comprises a main body part and a plurality of wings that extend to the outside from the main body part. The plurality of wings include a right wing and a left wing. The wings are inserted into two slits formed in a probe head case (heat radiating shell), and the end parts of the wings are accommodated in and adhered to two recessed sections formed in the outer surface of the probe head case. Thus, heat generated inside the probe head case can be directly transferred to the outer surface of the probe head case.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: April 4, 2017
    Assignee: Hitachi, Ltd.
    Inventors: Takeo Yasuhara, Hidetsugu Katsura, Toru Watanabe
  • Patent number: 9481566
    Abstract: Methods of forming semiconductor devices comprising integrated circuits and microelectromechanical system (MEMS) devices operatively coupled with the integrated circuits involve the formation of an electrically conductive via extending at least partially through a substrate from a first major surface of the substrate toward an opposing second major surface of the substrate, and the fabrication of at least a portion of an integrated circuit on the first major surface of the substrate. A MEMS device is provided on the second major surface of the substrate, and the MEMS device is operatively coupled with the integrated circuit using the at least one electrically conductive via. Structures and devices are fabricated using such methods.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: November 1, 2016
    Assignee: SOITEC
    Inventors: Mariam Sadaka, Bernard Aspar, Chrystelle Lagahe Blanchard
  • Patent number: 9006956
    Abstract: Methods, systems, and devices for providing cooling for a mobile device using piezoelectric active cooling devices. Some embodiments utilize piezoelectric actuators that oscillate a planar element within an air channel to fan air within or at an outlet of the air channel. The air channel may be defined by at least one heat dissipation surface in thermal contact with components of the mobile device that generate excess waste heat. For example, the air channel may include a surface that is in thermal contact with a processor of the mobile computing device. In embodiments, the piezoelectric active cooling device may be used in an air gap between stacked packages in a package on package (PoP) processor package. The described embodiments provide active cooling using low power, can be controlled to provide variable cooling, use highly reliable elements, and can be implemented at low cost.
    Type: Grant
    Filed: May 9, 2012
    Date of Patent: April 14, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Qing Li, Jon J. Anderson
  • Publication number: 20140375171
    Abstract: An ultrasound transducer includes an acoustic layer having a front side and an opposite back side. The acoustic layer is configured to convert electrical signals into ultrasound waves to be transmitted from the front side toward a target. The acoustic layer is configured to convert received ultrasound waves into electrical signals. A lens is connected to the front side of the acoustic layer. A heat sink is connected to the back side of the acoustic layer. A flex circuit is disposed between the acoustic layer and the heat sink. The flex circuit includes a backside matching layer incorporated into a body of the flex circuit. The backside matching layer is connected in thermal communication with the acoustic layer and the heat sink such that the backside matching layer is configured to conduct heat from the acoustic layer to the heat sink.
    Type: Application
    Filed: June 21, 2013
    Publication date: December 25, 2014
    Inventor: Alan Chi-Chung Tai
  • Patent number: 8912706
    Abstract: An oscillatory wave motor includes an oscillator having an oscillation body and an electro-mechanical energy-converting element, and a flexible heat-conducting member configured to dissipate heat generated by the oscillatory wave motor. The oscillatory wave motor drives a moving body in contact with a contact portion formed in the oscillation body by an elliptical movement of the oscillator, and the heat-conducting member is provided in addition to a heat-conducting path that conducts heat generated by the oscillatory wave motor through an oscillator supporting member that supports the oscillator or a heat-conducting path that conducts heat through the moving body.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: December 16, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventor: Hajime Kanazawa
  • Patent number: 8729775
    Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized. A first package plate has a main recess in which the piezoelectric vibrating piece is placed, and a peripheral surface surrounding the recess. A second package plate is bonded to the peripheral surface of the first package plate in airtight manner. A band of adhesive bonds the first package plate to the second package plate. The adhesive band surrounds the peripheral surface. Between the adhesive and the main recess is a band of metal film. The band of metal film prevents gas, generated from the adhesive, from flowing into the recess. The band of metal film surrounds the peripheral surface and is disposed inboard of the band of adhesive.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: May 20, 2014
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventors: Mitoshi Umeki, Ryoichi Ichikawa, Yoshiaki Amano, Kenji Kamezawa, Kenichi Kikuchi, Noritsugu Matsukura
  • Patent number: 8664835
    Abstract: An acoustic wave device includes: an electrode that excites an acoustic wave and is located on a substrate; and a silicon oxide film that is located so as to cover the electrode and is doped with an element or molecule displacing O in a Si—O bond, wherein the element or molecule is F, H, CH3, CH2, Cl, C, N, P, or S.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: March 4, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Satoru Matsuda, Takashi Matsuda, Michio Miura
  • Publication number: 20130334931
    Abstract: A backing member is provided in an ultrasonic probe on a side of the ultrasonic probe opposite from a transmission direction of an ultrasonic wave to a subject with respect to an ultrasonic vibrator that transmits the ultrasonic wave to the subject. The backing member includes a plate-like backing material, a thermal conductor, and a thermal conductive plate, wherein the thermal conductor and the thermal conductive plate are made of a material having a thermal conductivity higher than a thermal conductivity of the backing material, wherein the thermal conductor is buried in the backing material, and formed to have a columnar shape so as to reach both of two plate surfaces of the backing material, and wherein the thermal conductive plate is provided on at least the plate surface of the backing material that is near the ultrasonic vibrator.
    Type: Application
    Filed: November 28, 2012
    Publication date: December 19, 2013
    Applicant: GE MEDICAL SYSTEMS GLOBAL TECHNOLOGY COMPANY, LLC
    Inventors: Yasuo Yoshikawa, Hiroshi Isono
  • Patent number: 8574159
    Abstract: The present invention relates to an ultrasonic probe provided with a piezoelectric element for ultrasonic generation that has drive electrodes formed on two main surfaces thereof; an acoustic matching layer formed on the first main surface side of the piezoelectric element; a backing member attached to the second main surface side of the piezoelectric element; a base for heat dissipation provided on a lower surface of the backing member; and a thin metal plate for heat transfer that is thermally bonded between at least one of the main surfaces of the piezoelectric element and the base for heat dissipation; wherein the thin metal plate for heat transfer is surface-bonded to extend from one end of the piezoelectric element over the center thereof toward the other end. This configuration ensures that heat generated by the electrical-mechanical conversion of the piezoelectric element is transferred away in a satisfactory manner, enabling suppression of any temperature rise in the piezoelectric element.
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: November 5, 2013
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventor: Takashi Kondoh
  • Patent number: 8564174
    Abstract: The present invention is directed to monolithic integrated circuits incorporating an oscillator element that is particularly suited for use in timing applications. The oscillator element includes a resonator element having a piezoelectric material disposed between a pair of electrodes. The oscillator element also includes an acoustic confinement structure that may be disposed on either side of the resonator element. The acoustic confinement element includes alternating sets of low and high acoustic impedance materials. A temperature compensation layer may be disposed between the piezoelectric material and at least one of the electrodes. The oscillator element is monolithically integrated with an integrated circuit element through an interconnection. The oscillator element and the integrated circuit element may be fabricated sequentially or concurrently.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: October 22, 2013
    Assignee: Cymatics Laboratories Corp.
    Inventors: Rajarishi Sinha, Peter Ledel Gammel, Marco Mastrapasqua, Hugo Safar
  • Patent number: 8469005
    Abstract: The present invention provides a fuel injector, comprising a housing having a sealable injector seat; a fuel injector pin disposed within the housing proximate to the injector seat such that the injector seat may be sealed and unsealed by displacing the fuel injector pin; a resilient element biasing the fuel injector pin in an unsealed direction; a piezoelectric actuator disposed within the housing proximal to the fuel injector pin configured to actuate to force the injector pin towards the injector seat to seal the injector seat; and a thermal compensating unit disposed within the housing proximal to the actuator and configured to compensate for thermal expansion or contraction of a component of the fuel injector.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: June 25, 2013
    Assignee: Transonic Combustion, Inc.
    Inventors: Michael J. Frick, Michael C. Cheiky
  • Publication number: 20130134834
    Abstract: A backing member is provided in an ultrasonic probe on a side of the ultrasonic probe opposite from a transmission direction of an ultrasonic wave to a subject with respect to an ultrasonic vibrator that transmits the ultrasonic wave to the subject. The backing member includes a plate-like backing material, a thermal conductor, and a thermal conductive plate, wherein the thermal conductor and the thermal conductive plate are made of a material having a thermal conductivity higher than a thermal conductivity of the backing material, wherein the thermal conductor is buried in the backing material, and formed to have a columnar shape so as to reach both of two plate surfaces of the backing material, and wherein the thermal conductive plate is provided on at least the plate surface of the backing material that is near the ultrasonic vibrator.
    Type: Application
    Filed: November 28, 2012
    Publication date: May 30, 2013
    Applicant: GE MEDICAL SYSTEMS GLOBAL TECHNOLOGY COMPANY, LLC
    Inventor: GE MEDICAL SYSTEMS GLOBAL TECHNOLOG
  • Publication number: 20130113340
    Abstract: Provided is a vibration wave motor including: a vibration member having an elastic body joined with a electric-mechanical energy converter; and a moving member contacting the vibration member, the vibration member and the moving member being annularly formed, the vibration wave motor frictionally driving the moving member by a motion generated at a contacting portion with the moving member of the vibration member upon application of an AC signal to the electric-mechanical energy converter. The vibration wave motor includes a centrifugal fan provided at an outer peripheral portion and/or an inner peripheral portion of a circular ring formed of the vibration member and the moving member, and the centrifugal fan rotates integrally with the moving member.
    Type: Application
    Filed: June 29, 2011
    Publication date: May 9, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Satoshi Tsuchiya
  • Publication number: 20130027153
    Abstract: A bulk acoustic wave resonator (BAWR) includes a bulk acoustic resonance unit and at least one compensation layer. The bulk acoustic resonance unit includes a first electrode, a second electrode, and a piezoelectric layer disposed between the first electrode and the second electrode. The first electrode, the second electrode, and the piezoelectric layer each include a material that modifies a resonance frequency based on a temperature, and the at least one compensation layer includes a material that adjusts the resonance frequency modified based on the temperature in a direction opposite to a direction of the modification.
    Type: Application
    Filed: July 26, 2012
    Publication date: January 31, 2013
    Applicant: Samsung Electronics Co., Ltd.,
    Inventors: Jea Shik Shin, In Sang Song, Young Il Kim, Duck Hwan Kim, Chul Soo Kim, Sang Uk Son, Hyung Rak Kim, Jae Chun Lee
  • Publication number: 20120326567
    Abstract: A piezoelectric vibrating device comprises a metallic containing member, a piezoelectric member and a heat dissipating and conducting member. The piezoelectric member is provided within the metallic containing member, and the heat dissipating and conducting member includes a plurality of the heat dissipating and conducting fins. Each the heat dissipating and conducting fin has a first heat conduction connecting end and a second heat conduction connecting end, wherein the first heat conduction connecting end is provided on an external surface of the piezoelectric member, and the second heat conduction connecting end is connected with an inner wall surface of the metallic containing member.
    Type: Application
    Filed: September 15, 2011
    Publication date: December 27, 2012
    Applicant: DATRON PRODUCTS CO., LTD
    Inventor: WEN-TONG LEU
  • Patent number: 8310132
    Abstract: The invention relates to an insonification device (100) comprising a plurality of elementary ultrasonic transducers (110) each comprising at least one electro-acoustic element (111) and distributed on a chassis (120, 140) so that the electro-acoustic elements (111) are distributed on a so-called front surface (120?) of the device (100) intended to be placed facing the medium to be insonified. According to the invention, as each transducer (110) comprises a longitudinal body (113) made in a heat conducting material at the so-called front end of which the electro-acoustic element (111) is placed, the chassis (120, 140) comprises a sealed cooling chamber (130) placed behind the front surface (120?), crossed by the bodies of the transducers (113) and intended to be gone through by a coolant fluid flow.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: November 13, 2012
    Assignee: Super Sonic Imagine
    Inventors: Yves Martin, Mathieu Pernot
  • Publication number: 20120181902
    Abstract: An ultrasound transducer element includes a piezoelectric layer, a front end body, and a backing layer assembly. The piezoelectric layer extends between opposite front and back sides and is configured to transmit acoustic waves from the front side. The front end is body disposed proximate to the front side of the piezoelectric layer and is configured to emit the acoustic waves out of a housing. The backing layer assembly is disposed proximate to the back side of the piezoelectric layer. The backing layer assembly includes a first thermally conductive mesh disposed in a matrix enclosure. The first thermally conductive mesh is positioned to conduct thermal energy away from the piezoelectric layer. In one aspect, the first thermally conductive mesh is a grid of elongated strands of a metal or metal alloy material oriented in at least one of transverse or oblique directions.
    Type: Application
    Filed: January 14, 2011
    Publication date: July 19, 2012
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Jean-Francois Gelly, Anne Cecile Dagonneau, Jean Pierre Malacrida
  • Patent number: 8188638
    Abstract: A transducer with a closed heat pipe is provided with a hot surface and a cold surface. The hot surface is in contact with the transducer interior and the cold surface is in contact with a cooler contact area. A fluid is used in the pipe which boils at the temperature of the hot surface and condenses at the temperature of the cold surface. A wick inside the heat pipe facilities the return by capillary action of the condensed fluid to the hot end. The heat pipe can be evacuated to adjust the boiling temperature of the fluid. A variant involves drilling additional holes into ceramic rings and inserting heat pipes. Increasing the heat pipe length into the tail mass and the piston increases the cool region for the fluid to condense; thereby improving the performance of the transducer.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: May 29, 2012
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Anthony A. Ruffa
  • Patent number: 8026460
    Abstract: Provided is a control circuit for a thermostatic oven in an oven controlled crystal oscillator, which is capable of further improving stability of an oscillation frequency. A control circuit in which a thermistor whose resistance value changes according to a temperature outputs a signal according to the ambient temperature of the thermostatic oven inside the oscillator, an operational amplifier outputs a signal according to a difference between the output of the thermistor and a reference signal, a power transistor amplifies the output of the operational amplifier, and a heater generates heat based on a collector voltage of the power transistor, is provided with a temperature sensor circuit having a transistor with a base to which the output of the operational amplifier is input. The control circuit outputs a collector voltage of the transistor as an internal temperature signal which changes according to a temperature inside the oscillator.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: September 27, 2011
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventors: Manabu Ito, Takeshi Uchida
  • Patent number: 7990025
    Abstract: A hermetic package for electronic components which is made of metallic silicon is disclosed. The package includes a plurality of silicon elements which are bonded together. In the first embodiment, a cavity is hollowed out in the cover to house the Application Specific Integrated Circuit oscillator and the resonator. In a second embodiment, the cavity is formed in the base member with a plurality of pedestal shelves to hold the resonator above and out of contact with the electrical circuitry for the oscillator and thermal controls.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: August 2, 2011
    Inventors: Pablo Ferreiro, Kenneth Martin, John Cline
  • Patent number: 7956517
    Abstract: A MEMS structure having a temperature-compensated resonator member is described. The MEMS structure comprises an asymmetric stress inverter member coupled with a substrate. A resonator member is housed in the asymmetric stress inverter member and is suspended above the substrate. The asymmetric stress inverter member is used to alter the thermal coefficient of frequency of the resonator member by inducing a stress on the resonator member in response to a change in temperature.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: June 7, 2011
    Assignee: Silicon Laboratories
    Inventors: Mehrnaz Motiee, Roger T. Howe, Emmanuel P. Quevy, David H. Bernstein
  • Patent number: 7944118
    Abstract: A system for generating electrical power supply signals includes at least one heat engine that undergoes heating/cooling cycles and corresponding temperature variations. A thermoacoustic element is thermally coupled to the chamber. The temperature variations of the heat engine induce thermoacoustic oscillations of the thermoacoustic element which form a pressure wave. At least one piezoelectric transducer is deformed by the pressure wave. A power converter can be used to transform the electric signals generated in response to deformation of the at least one piezoelectric transducer to a desired electrical power supply signal. The heat engine preferably uses a geothermal source of cold and an ambient source of hot (typically used in the summer months), or vice-versa (typically used in the winter months).
    Type: Grant
    Filed: October 4, 2007
    Date of Patent: May 17, 2011
    Inventor: Kimberly Peacock
  • Patent number: 7924120
    Abstract: A piezoelectric resonator includes a substrate and a thin-film section. The thin-film section includes a first thin-film section supported by the substrate, and an acoustically-isolated second thin-film section which is separated from the substrate. In the second thin-film section, first and second electrodes are arranged on the respective main surfaces of a piezoelectric film, and a vibration section is provided at an area where the first and the second electrodes overlap each other on the second thin-film section when viewed through in the film-thickness direction. The thin-film section further includes a heat-radiating film which is in contact with peripheral edges of at least the first electrode among the first and second electrodes defining portions of a periphery of the vibration section, and which extends from the peripheral edges to the first thin-film section when viewed through in the film-thickness direction.
    Type: Grant
    Filed: July 1, 2009
    Date of Patent: April 12, 2011
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Keiichi Umeda
  • Publication number: 20110018395
    Abstract: A transducer with a closed heat pipe is provided with a hot surface and a cold surface. The hot surface is in contact with the transducer interior and the cold surface is in contact with a cooler contact area. A fluid is used in the pipe which boils at the temperature of the hot surface and condenses at the temperature of the cold surface. A wick inside the heat pipe facilities the return by capillary action of the condensed fluid to the hot end. The heat pipe can be evacuated to adjust the boiling temperature of the fluid. A variant involves drilling additional holes into ceramic rings and inserting heat pipes. Increasing the heat pipe length into the tail mass and the piston increases the cool region for the fluid to condense; thereby improving the performance of the transducer.
    Type: Application
    Filed: July 27, 2009
    Publication date: January 27, 2011
    Inventor: Anthony A. Ruffa
  • Patent number: 7795779
    Abstract: A contactless SAW based torque and temperature sensor includes three SAW resonators 2, 3, 4 mounted on a common substrate 1 made of Y+34° cut of quartz. The first SAW 2 has its principle axis inclined at +45° to the X-axis of the substrate, which, in use, is either aligned with the longitudinal axis of a device whose torque is to be measured or is perpendicular thereto, and the second SAW 3 has its principle axis inclined at 135 degrees to the X-axis of the substrate. The third SAW 4 is positioned with its principle axis inclined at an angle, preferably in the range of 0 to 30 degrees, to the principle axis of both the first 2 and second 3 resonators so that none of the SAWs are parallel, the third SAW 4 enabling temperature measurements to be taken.
    Type: Grant
    Filed: March 2, 2006
    Date of Patent: September 14, 2010
    Assignee: Transense Technologies plc
    Inventor: Victor Alexandrovich Kalinin
  • Patent number: 7781945
    Abstract: A retaining device for use when sintering electrical components made of ceramic and metal electrodes inside the ceramic. The retaining device includes a structure to hold the electrical components. The structure has a surface that contains a sintering aid. The sintering aid includes a material that is able to bind to a gas contained in the structure and to release the gas.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: August 24, 2010
    Assignee: Epcos AG
    Inventor: Peter Sedlmaier
  • Publication number: 20100188727
    Abstract: The invention relates to a piezochrome composite comprising a matrix of a piezoelectric material with particles of a spin transition compound. The invention also relates to a device that beside said composite also comprises a voltage supply connected to electrodes provided on said matrix. In one embodiment is this device provided with a temperature stabilising device.
    Type: Application
    Filed: May 23, 2008
    Publication date: July 29, 2010
    Applicant: TOTALFORSVARETS FORSKNINGSINSTITUT
    Inventors: Jan Fagerström, Cesar Lopes, Sören Svensson, Stéphane Parola
  • Patent number: 7762236
    Abstract: The present invention provides a fuel injector, comprising a housing having a sealable injector seat; a fuel injector pin disposed within the housing proximate to the injector seat such that the injector seat may be sealed and unsealed by displacing the fuel injector pin; a resilient element biasing the fuel injector pin in an unsealed direction; a piezoelectric actuator disposed within the housing proximal to the fuel injector pin configured to actuate to force the injector pin towards the injector seat to seal the injector seat; and a thermal compensating unit disposed within the housing proximal to the actuator and configured to compensate for thermal expansion or contraction of a component of the fuel injector.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: July 27, 2010
    Assignee: Transonic Combustion, Inc.
    Inventors: Michael J. Frick, Michael C. Cheiky
  • Publication number: 20100033061
    Abstract: In the disclosed piezoelectric devices a piezoelectric frame includes a vibrating piece. An excitation electrode is formed on the vibrating piece. An outer frame portion surrounds the vibrating piece and includes an extraction electrode connected to the excitation electrode. A package base is bonded to one surface of the outer frame portion and includes a connection electrode connected to the extraction electrode. The package base includes an external terminal formed on a surface thereof opposite the surface on which the connection electrodes are formed. Through-hole conductors connected the connection electrodes with respective external terminals. A lid is bonded to an opposing surface of the piezoelectric frame. An exhaust channel is in communication with the extraction electrode adjacent the through-hole conductors.
    Type: Application
    Filed: July 27, 2009
    Publication date: February 11, 2010
    Inventors: Ryoichi Ichikawa, Mitoshi Umeki
  • Patent number: 7646138
    Abstract: A thickness shear mode (TSM) resonator is described, comprising a diamond layer. The diamond layer is preferably a high quality diamond layer with at least 90% sp3 bonding or diamond bonding. A method for manufacturing such a resonator is also described. The thickness shear mode resonator according to embodiments described herein may advantageously be used in biosensor application and in electrochemistry applications.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: January 12, 2010
    Assignees: Interuniversitair Microelektronica Centrum (IMEC), Universiteit Hasselt
    Inventor: Oliver Williams
  • Patent number: 7594614
    Abstract: An ultrasonic waterjet apparatus (10) has a mobile generator module (20) and a high-pressure water hose (40) for delivering high-pressure water from the mobile generator module (20) to a hand-held gun (50) with a trigger and an ultrasonic nozzle (60). An ultrasonic generator in the mobile generator module (20) transmits high-frequency electrical pulses to a piezoelectric or magnetostrictive transducer (62) which vibrates to modulate a high-pressure waterjet flowing through the nozzle (60). The waterjet exiting the ultrasonic nozzle (60) is pulsed into mini slugs of water, each of which imparts a waterhammer pressure on a target surface. The ultrasonic waterjet apparatus (10) may be used to cut and de-burr materials, to clean and de-coat surfaces, and to break rocks. The ultrasonic waterjet apparatus (10) performs these tasks with much greater efficiency than conventional continuous-flow waterjet systems because of the repetitive waterhammer effect.
    Type: Grant
    Filed: November 3, 2003
    Date of Patent: September 29, 2009
    Assignee: VLN Advanced Technologies, Inc.
    Inventors: Mohan M. Vijay, Wenzhuo Yan, Andrew Tieu, Baolin Ren
  • Publication number: 20090230819
    Abstract: A compact rake piezoelectric assembly comprises a body (110), a plurality of blades (120) extending away from the body, and a piezoelectric patch (130) attached to the body. The piezoelectric patch has a fixed portion (138) and a free portion (139), with the fixed portion being constrained to be in physical contact with the body.
    Type: Application
    Filed: March 13, 2008
    Publication date: September 17, 2009
    Inventor: Ioan Sauciuc
  • Publication number: 20080224570
    Abstract: A transformer arrangement is specified which includes a piezoelectric transformer with a main body (1), and a cooling body (7) on which the main body (1) is arranged, wherein the main body (1) is thermally coupled to the cooling body (7) by means of at least one heat-conducting coupling element (8).
    Type: Application
    Filed: July 27, 2006
    Publication date: September 18, 2008
    Applicant: EPCOS AG
    Inventors: Heinz Florian, Alexander Glazunov, Igor Kartashev
  • Publication number: 20080203854
    Abstract: The invention describes a sensor comprising an element package 2 including piezoelectric elements with an upper area 6 and a lower area 7. A preload sleeve 3 surrounds the said upper area 6 of the said element package 2, while an insulation sleeve 1 sits between the upper area 6 of the said element package 2 and the said preload sleeve 3. An outer housing 4 partially or fully surrounds the said preload sleeve 3 and the lower area 7 of the said element package 2. An insulation part 5 sits between the said lower area 7 of the element package 2 and the said outer housing 4, whereas the said upper area 6 of the said element package 2, the said insulation sleeve 1 and the said preload sleeve 3 have conical shapes and have conforming surfaces. Due to the conical size of the insulation sleeve 1, the load during a shock measurement is distributed on a larger surface area resulting in a reduced compression of the said insulation sleeve. Thereby, the maximum range of the sensor is increased.
    Type: Application
    Filed: January 25, 2006
    Publication date: August 28, 2008
    Applicant: KISTLER HOLDING AG
    Inventors: John M. Kubler, Andrew Paul Cook
  • Patent number: 7411337
    Abstract: An electrical energy-generating heat sink system provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: August 12, 2008
    Assignee: Intel Corporation
    Inventors: Pooya Tadayon, Koorosh Zaerpoor
  • Patent number: 7378780
    Abstract: A surface mount type crystal oscillator includes: a container body composed of a laminated ceramic including a plate-shaped center layer, and first and second frame layers stacked on opposite surfaces of the center layer respectively; a crystal blank hermetically sealed in a first recess formed by the first frame layer and the center layer; an IC chip accommodated in a second recess formed by the second frame layer and the center layer; and a test terminal provided on the outer side surface of the container body and used to test the crystal blank. The center layer has at least a first layer and a second layers, and the test terminal is electrically connected to a crystal retaining terminal provided on the bottom surface of the first recess in order to retain the crystal blank through a conductive path provided on an interface between the first and second layers.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: May 27, 2008
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventors: Hiroaki Mizumura, Kouichi Moriya
  • Patent number: 7378781
    Abstract: The present invention relates to a resonator structure, temperature compensation method and temperature control apparatus for controlling local temperature of a resonator structure. At least one heating element (55) is integrated on a substrate of the resonator structure, and a temperature control signal generated based on a stored temperature characteristic is applied to the at least one integrated heating element (55). Thereby, the at least one heating element (55) and an optional integrated sensing element can be provided very close to the resonator. It is thus possible to control or calibrate variations of sensing elements, heating elements and resonator out from every sample.
    Type: Grant
    Filed: September 7, 2005
    Date of Patent: May 27, 2008
    Assignee: Nokia Corporation
    Inventor: Ari Vilander
  • Publication number: 20080116766
    Abstract: The invention relates to a piezoelectric pressure sensor comprising an outer housing separated by an annular gap from an inner housing, which inner housing is attached to the outer housing on the pressure side. At least one piezoelectric measuring element being positioned between a diaphragm placed on the pressure side of the inner housing and a base part of said inner housing. The inner housing is provided with a massive cylindrical wall throughout, whose wall thickness essentially corresponds to the thickness of the adjacent outer housing, and in the annular gap between outer housing and inner housing or in the space between the base part of the inner housing and an interior shoulder of the pressure sensor there are provided means for transferring heat to the outer housing.
    Type: Application
    Filed: November 20, 2007
    Publication date: May 22, 2008
    Inventor: Alexander Friedl
  • Patent number: 7362037
    Abstract: An ultrasonic transducer device for a humidifier, the humidifier having a vaporizing chamber for producing water vapor or mist, the ultrasonic transducer device comprises: a transducer holder having a central opening formed in a longitudinal direction of the transducer holder and a flange portion disposed at a periphery of the transducer holder, the transducer formed of synthetic resin or plastic materials; an ultrasonic transducer disposed at the central opening of the transducer holder; a support member formed of metal and having an upper planar section and a side section extending vertically from the upper planar section, the upper planar section defining an opening therein for coupling with the flange portion of the transducer holder; and a heat discharge plate having heat discharging fins and coupled with the support member, the heat discharge plate coupled with a circuit board for discharging heat in the circuit board.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: April 22, 2008
    Assignee: Ohsung Co., Ltd.
    Inventor: Sang-Keun Kang
  • Patent number: 7321184
    Abstract: In some embodiments, a piezoelectric actuator is coupled to a blade having a rake shape. The blade may include a base with two or more prongs extending therefrom. At least a portion of one or more prongs may be positioned between the fins of a heat sink. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: August 9, 2005
    Date of Patent: January 22, 2008
    Assignee: Intel Corporation
    Inventors: Seri Lee, Ioan Sauciuc
  • Patent number: 7298067
    Abstract: A packaging system for piezoelectric devices is provided that substantially reduces and avoids the deleterious effects of environmental vibrations and shocks with gas or fluid-filled chambers that drastically improve the resonator's ability to withstand unwanted disturbances and decrease or eliminate the attendant frequency shifts. The damped piezoelectric resonator packaging system combines a resonator package, a membrane and gas/fluid-filled chambers that dampen dynamic amplification of the resonator and firmly restrain the resonator within the packaging system. The selection of gas or fluid for the chamber depends upon variables such as the type of waves being propagated and interaction with the piezoelectric substrate.
    Type: Grant
    Filed: September 25, 2006
    Date of Patent: November 20, 2007
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventor: John A. Kosinski
  • Publication number: 20070176498
    Abstract: An ultrasonic wave generating device includes a substrate, a heat insulation layer on the substrate, a membrane heating portion on the heat insulation layer, and a membrane oscillator on the heating portion. The heating portion is electrically driven with a predetermined period, and produces heat for thermally displacing a surface of the oscillator. The oscillator receives a temperature variation with the predetermined period from the heating portion, and oscillates so as to generate ultrasonic waves.
    Type: Application
    Filed: November 21, 2006
    Publication date: August 2, 2007
    Applicant: DENSO CORPORATION
    Inventors: Makiko Sugiura, Takahiko Yoshida, Yasuyuki Okuda, Ryonosuke Tera, Hiroshi Tanaka, Yuta Hasebe
  • Patent number: 7229821
    Abstract: A deployable acoustic wave RFID/biosensor assembly has at least one protective layer, and an acoustic wave RFID/biosensor within the protective layer or layers. The acoustic wave RFID/biosensor includes an acoustic wave device, a biolayer mounted on the acoustic wave device, an electric circuit operable to actuate the acoustic wave device, and a fluidic chamber associated with the biolayer. In use, the fluidic chamber contains fluid which, if a predetermined substance to be sensed is present, operates to modify the biolayer which in turn affects the operation of the acoustic wave device. Protective fluid is provided within the protective layer or layers substantially surrounds the acoustic wave RFID/biosensor to protect the acoustic wave RFID/biosensor from damage when the RFID/biosensor assembly impacts a target and to protect the biolayer from deterioration during storage and use.
    Type: Grant
    Filed: February 16, 2006
    Date of Patent: June 12, 2007
    Assignee: P.J. Edmonson Ltd.
    Inventors: Peter J. Edmonson, William D. Hunt, Desmond D. Stubbs, Stephen T. Makk
  • Patent number: 7196456
    Abstract: A piezoelectric actuator 21 has: a piezoelectric actuator part 22 made up of a common electrode 27, a piezoelectric element 29, and an individual electrode 33; an electrical interconnection joint part 43 formed on the individual electrode 33; an electrical interconnection 45 formed on the electrical interconnection joint part 43; a head block 47 fixed to a nozzle plate 39 through the electrical interconnection 45; and a PI tape 49 disposed within the head block 47. A closed space 57 is defined between the head block 47 and the nozzle plate 39. The closed space 57 is divided by the PI tape 49 into two sections. Of these two sections of the closed space 57, the one on the side of the head block 47 constitutes a first closed space 57a. A moisture absorbent 52 is sealed within the first closed space 57a. Relative humidity within the closed space 57 of the ink jet head 1 is not less than 0% nor more than 20%.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: March 27, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takanori Nakano, Masakazu Tanahashi, Kazuo Nishimura, Masaichiro Tatekawa, Shogo Matsubara
  • Patent number: 7164222
    Abstract: The specification discloses embodiments of an apparatus comprising a film bulk acoustic resonator (FBAR) filter comprising a piezoelectric membrane having a portion thereof sandwiched between a first electrode and a second electrode, the piezoelectric membrane being suspended from at least two edges thereof, and a heat transfer layer placed on the piezoelectric membrane surrounding, but not in contact with, the first electrode. Also disclosed are embodiments of a process comprising sandwiching a portion of the piezoelectric membrane between a first electrode and a second electrode, suspending a piezoelectric membrane from at least two edges thereof, and placing a heat transfer layer on the piezoelectric membrane surrounding, but not in contact with, the first electrode. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: January 16, 2007
    Assignee: Intel Corporation
    Inventor: Li-Peng Wang
  • Patent number: 7129623
    Abstract: A piezoelectric blade protection structure for a plurality of juxtaposed piezoelectric blades mounting onto a circuit board to provide protection and anchoring effect for the piezoelectric blades. A protection member is mounted onto the vibration nodes of the piezoelectric blades to prevent the piezoelectric blades from broken by improper impact of external forces. The protection member, piezoelectric blades and circuit board are interposed respectively by a upper elastic element and a lower elastic element to provide a desired vibration space and anchoring for the piezoelectric blades.
    Type: Grant
    Filed: July 13, 2004
    Date of Patent: October 31, 2006
    Assignee: Zippy Technology Corp.
    Inventors: Chin-Wen Chou, Ying-Nan Cheng