Abstract: A cooling system is described. The cooling system includes a cooling element having a central region and a perimeter. The cooling element is anchored at the central region. At least a portion of the perimeter is unpinned. The cooling element is in communication with a fluid. The cooling element is actuated to induce vibrational motion to drive the fluid toward a heat-generating structure.

Abstract: An apparatus for cleaning industrial components which has a liquid container defining a liquid enclosure for containing a cleaning liquid and ultrasonic transducers having an operating frequency and a wavelength in the cleaning liquid and secured to at least a portion of the liquid container at a spacing of between 2 and 10 wavelengths. During operation, the transducers generate a larger power density in the component-receiving area of the liquid container than an average power density of the liquid container.

Abstract: Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods are disclosed. The SAW filter package also includes a cavity frame comprising a perimeter structure and a cavity inside the perimeter structure coupled to a substrate of a piezoelectric material that contains interdigital transducers (IDTs). A cap substrate is disposed on the perimeter structure of the cavity frame to enclose an air cavity inside the perimeter structure between a substrate and the cap substrate. In exemplary aspects, to effectively dissipate heat generated in the SAW filter package to maintain the desired performance of the SAW filter, the cavity frame is comprised of a material that has an enhanced thermal conductivity. The heat generated in the SAW filter package can more effectively be dissipated, particularly at edges and corners of the cavity frame where hot spots can particularly occur.

Abstract: A strain compensated heterostructure comprising a substrate comprising silicon carbide material; a first epitaxial layer comprising single-crystal aluminum nitride material formed on a top surface of the substrate; a second epitaxial layer formed on the first epitaxial layer opposite the top surface of the substrate, the second epitaxial layer comprising single-crystal scandium aluminum nitride material; and a third epitaxial layer formed on the second epitaxial layer opposite the first epitaxial layer, the third layer comprising single-crystal aluminum nitride material.

Abstract: Techniques for improving Bulk Acoustic Wave (BAW) mass loading of resonator structures are disclosed, including filters, oscillators and systems that may include such devices. First and second layers of piezoelectric material may be acoustically coupled with one another to have a piezoelectrically excitable resonance mode. The first layer of piezoelectric material may have a first piezoelectric axis orientation, and the second layer of piezoelectric material may have a second piezoelectric axis orientation that substantially opposes the first piezoelectric axis orientation of the first layer of piezoelectric material. An acoustic reflector electrode may include a first pair of top metal electrode layers electrically and acoustically coupled with the first and second layer of piezoelectric material to excite the piezoelectrically excitable resonance mode at a resonant frequency of the BAW resonator.

Abstract: Provided is a thermostatic type crystal oscillator with short operation stabilization time and low power consumption. A thermostatic type crystal oscillator according to the present invention includes a crystal resonator including an IT-cut crystal blank, a vibration control circuit configured to control a vibration frequency of the crystal resonator, a temperature regulator configured to regulate a temperature of the crystal resonator within a set temperature range by repeating heating and cooling to the crystal resonator, a heat conducting plate configured to function as a heat absorbing plate and a heat dissipating plate for the temperature regulator, a temperature control circuit configured to control a temperature of the temperature regulator, and a housing that accommodates the crystal resonator. The housing defines a resonator accommodating space in which the crystal resonator is accommodated inside the housing.

Abstract: There is configured an oscillator characterized by including an outer package having a housing space, an inner package housed in the housing space, a resonator element housed in the inner package, a heater element housed in the housing space, and fixed to the inner package, an oscillation circuit configured to oscillate the resonator element, a conducting member configured to electrically couple the inner package and the heater element to each other, and a first bonding wire configured to couple the heater element and the outer package to each other, and configured to electrically couple the conducting member and the outer package to each other.

Abstract: A piezoelectric thin film resonator includes: a substrate; a piezoelectric film located on the substrate; a lower electrode and an upper electrode facing each other across at least a part of the piezoelectric film; and an insertion film that is inserted between the lower electrode and the upper electrode, is located in an outer peripheral region within a resonance region where the lower electrode and the upper electrode face each other across the piezoelectric film, is located in a region that is located outside the resonance region and surrounds the resonance region, is not located in a center region of the resonance region, and includes a first part, which is located in the resonance region and has a first film thickness, and a second part, which is located outside the resonance region and has a second film thickness, the first film thickness being less than the second film thickness.

Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination; one or more pins attached to each of the plurality of actuators, one end of each of the plurality of pins affixed to the actuators extrudes beyond surface of the wearable device case and is exposed outside of the wearable device case; electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. Other related embodiments are disclosed.

Abstract: A piezoelectric thin film resonator includes: a substrate; lower and upper electrodes located on the substrate; a piezoelectric film that has a lower piezoelectric film mainly composed of aluminum nitride and an upper piezoelectric film mainly composed of aluminum nitride, the lower piezoelectric film and the upper piezoelectric film being in contact with each other in at least a part of a resonance region where the lower electrode and the upper electrode face each other across at least a part of the piezoelectric film, and a fluorine concentration at a boundary face with which the lower piezoelectric film and the upper piezoelectric film are in contact being 0.03 atomic % or less; and an insulating film that is located between the lower piezoelectric film and the upper piezoelectric film in a region other than the at least a part of the resonance region and contains silicon oxide.

Abstract: A display device includes a first substrate having an active area, a circuit area extending outwardly from the active area, and a cell seal area extending outwardly from the circuit area, a second substrate covering the first substrate, a sealing part between the first substrate and the second substrate, the sealing part covering at least a portion of the circuit area, a wiring part in the circuit area of the first substrate and electrically connected to elements in the active area of the first substrate, the wiring part including at least one level-difference compensation part, and a stepped part between the sealing part and at least a portion of the wiring part, the at least one level-difference compensation part of the wiring part being adjacent to the stepped part.

Abstract: A probe that is inserted into a body cavity, wherein an inner unit (inner assembly) comprises an oscillator unit, an intermediate substrate, an electronic circuit substrate, and a backing member. An exhaust heat sheet is joined to an area at the perimeter of the rear surface of the electronic circuit substrate. The exhaust heat sheet comprises a main body part and a plurality of wings that extend to the outside from the main body part. The plurality of wings include a right wing and a left wing. The wings are inserted into two slits formed in a probe head case (heat radiating shell), and the end parts of the wings are accommodated in and adhered to two recessed sections formed in the outer surface of the probe head case. Thus, heat generated inside the probe head case can be directly transferred to the outer surface of the probe head case.

Abstract: Methods of forming semiconductor devices comprising integrated circuits and microelectromechanical system (MEMS) devices operatively coupled with the integrated circuits involve the formation of an electrically conductive via extending at least partially through a substrate from a first major surface of the substrate toward an opposing second major surface of the substrate, and the fabrication of at least a portion of an integrated circuit on the first major surface of the substrate. A MEMS device is provided on the second major surface of the substrate, and the MEMS device is operatively coupled with the integrated circuit using the at least one electrically conductive via. Structures and devices are fabricated using such methods.

Abstract: Methods, systems, and devices for providing cooling for a mobile device using piezoelectric active cooling devices. Some embodiments utilize piezoelectric actuators that oscillate a planar element within an air channel to fan air within or at an outlet of the air channel. The air channel may be defined by at least one heat dissipation surface in thermal contact with components of the mobile device that generate excess waste heat. For example, the air channel may include a surface that is in thermal contact with a processor of the mobile computing device. In embodiments, the piezoelectric active cooling device may be used in an air gap between stacked packages in a package on package (PoP) processor package. The described embodiments provide active cooling using low power, can be controlled to provide variable cooling, use highly reliable elements, and can be implemented at low cost.

Abstract: An ultrasound transducer includes an acoustic layer having a front side and an opposite back side. The acoustic layer is configured to convert electrical signals into ultrasound waves to be transmitted from the front side toward a target. The acoustic layer is configured to convert received ultrasound waves into electrical signals. A lens is connected to the front side of the acoustic layer. A heat sink is connected to the back side of the acoustic layer. A flex circuit is disposed between the acoustic layer and the heat sink. The flex circuit includes a backside matching layer incorporated into a body of the flex circuit. The backside matching layer is connected in thermal communication with the acoustic layer and the heat sink such that the backside matching layer is configured to conduct heat from the acoustic layer to the heat sink.

Abstract: An oscillatory wave motor includes an oscillator having an oscillation body and an electro-mechanical energy-converting element, and a flexible heat-conducting member configured to dissipate heat generated by the oscillatory wave motor. The oscillatory wave motor drives a moving body in contact with a contact portion formed in the oscillation body by an elliptical movement of the oscillator, and the heat-conducting member is provided in addition to a heat-conducting path that conducts heat generated by the oscillatory wave motor through an oscillator supporting member that supports the oscillator or a heat-conducting path that conducts heat through the moving body.

Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized. A first package plate has a main recess in which the piezoelectric vibrating piece is placed, and a peripheral surface surrounding the recess. A second package plate is bonded to the peripheral surface of the first package plate in airtight manner. A band of adhesive bonds the first package plate to the second package plate. The adhesive band surrounds the peripheral surface. Between the adhesive and the main recess is a band of metal film. The band of metal film prevents gas, generated from the adhesive, from flowing into the recess. The band of metal film surrounds the peripheral surface and is disposed inboard of the band of adhesive.

Abstract: An acoustic wave device includes: an electrode that excites an acoustic wave and is located on a substrate; and a silicon oxide film that is located so as to cover the electrode and is doped with an element or molecule displacing O in a Si—O bond, wherein the element or molecule is F, H, CH3, CH2, Cl, C, N, P, or S.

Abstract: A backing member is provided in an ultrasonic probe on a side of the ultrasonic probe opposite from a transmission direction of an ultrasonic wave to a subject with respect to an ultrasonic vibrator that transmits the ultrasonic wave to the subject. The backing member includes a plate-like backing material, a thermal conductor, and a thermal conductive plate, wherein the thermal conductor and the thermal conductive plate are made of a material having a thermal conductivity higher than a thermal conductivity of the backing material, wherein the thermal conductor is buried in the backing material, and formed to have a columnar shape so as to reach both of two plate surfaces of the backing material, and wherein the thermal conductive plate is provided on at least the plate surface of the backing material that is near the ultrasonic vibrator.

Abstract: The present invention relates to an ultrasonic probe provided with a piezoelectric element for ultrasonic generation that has drive electrodes formed on two main surfaces thereof; an acoustic matching layer formed on the first main surface side of the piezoelectric element; a backing member attached to the second main surface side of the piezoelectric element; a base for heat dissipation provided on a lower surface of the backing member; and a thin metal plate for heat transfer that is thermally bonded between at least one of the main surfaces of the piezoelectric element and the base for heat dissipation; wherein the thin metal plate for heat transfer is surface-bonded to extend from one end of the piezoelectric element over the center thereof toward the other end. This configuration ensures that heat generated by the electrical-mechanical conversion of the piezoelectric element is transferred away in a satisfactory manner, enabling suppression of any temperature rise in the piezoelectric element.

Abstract: The present invention is directed to monolithic integrated circuits incorporating an oscillator element that is particularly suited for use in timing applications. The oscillator element includes a resonator element having a piezoelectric material disposed between a pair of electrodes. The oscillator element also includes an acoustic confinement structure that may be disposed on either side of the resonator element. The acoustic confinement element includes alternating sets of low and high acoustic impedance materials. A temperature compensation layer may be disposed between the piezoelectric material and at least one of the electrodes. The oscillator element is monolithically integrated with an integrated circuit element through an interconnection. The oscillator element and the integrated circuit element may be fabricated sequentially or concurrently.

Abstract: The present invention provides a fuel injector, comprising a housing having a sealable injector seat; a fuel injector pin disposed within the housing proximate to the injector seat such that the injector seat may be sealed and unsealed by displacing the fuel injector pin; a resilient element biasing the fuel injector pin in an unsealed direction; a piezoelectric actuator disposed within the housing proximal to the fuel injector pin configured to actuate to force the injector pin towards the injector seat to seal the injector seat; and a thermal compensating unit disposed within the housing proximal to the actuator and configured to compensate for thermal expansion or contraction of a component of the fuel injector.

Abstract: A backing member is provided in an ultrasonic probe on a side of the ultrasonic probe opposite from a transmission direction of an ultrasonic wave to a subject with respect to an ultrasonic vibrator that transmits the ultrasonic wave to the subject. The backing member includes a plate-like backing material, a thermal conductor, and a thermal conductive plate, wherein the thermal conductor and the thermal conductive plate are made of a material having a thermal conductivity higher than a thermal conductivity of the backing material, wherein the thermal conductor is buried in the backing material, and formed to have a columnar shape so as to reach both of two plate surfaces of the backing material, and wherein the thermal conductive plate is provided on at least the plate surface of the backing material that is near the ultrasonic vibrator.

Abstract: Provided is a vibration wave motor including: a vibration member having an elastic body joined with a electric-mechanical energy converter; and a moving member contacting the vibration member, the vibration member and the moving member being annularly formed, the vibration wave motor frictionally driving the moving member by a motion generated at a contacting portion with the moving member of the vibration member upon application of an AC signal to the electric-mechanical energy converter. The vibration wave motor includes a centrifugal fan provided at an outer peripheral portion and/or an inner peripheral portion of a circular ring formed of the vibration member and the moving member, and the centrifugal fan rotates integrally with the moving member.

Abstract: A bulk acoustic wave resonator (BAWR) includes a bulk acoustic resonance unit and at least one compensation layer. The bulk acoustic resonance unit includes a first electrode, a second electrode, and a piezoelectric layer disposed between the first electrode and the second electrode. The first electrode, the second electrode, and the piezoelectric layer each include a material that modifies a resonance frequency based on a temperature, and the at least one compensation layer includes a material that adjusts the resonance frequency modified based on the temperature in a direction opposite to a direction of the modification.

Abstract: A piezoelectric vibrating device comprises a metallic containing member, a piezoelectric member and a heat dissipating and conducting member. The piezoelectric member is provided within the metallic containing member, and the heat dissipating and conducting member includes a plurality of the heat dissipating and conducting fins. Each the heat dissipating and conducting fin has a first heat conduction connecting end and a second heat conduction connecting end, wherein the first heat conduction connecting end is provided on an external surface of the piezoelectric member, and the second heat conduction connecting end is connected with an inner wall surface of the metallic containing member.

Abstract: The invention relates to an insonification device (100) comprising a plurality of elementary ultrasonic transducers (110) each comprising at least one electro-acoustic element (111) and distributed on a chassis (120, 140) so that the electro-acoustic elements (111) are distributed on a so-called front surface (120?) of the device (100) intended to be placed facing the medium to be insonified. According to the invention, as each transducer (110) comprises a longitudinal body (113) made in a heat conducting material at the so-called front end of which the electro-acoustic element (111) is placed, the chassis (120, 140) comprises a sealed cooling chamber (130) placed behind the front surface (120?), crossed by the bodies of the transducers (113) and intended to be gone through by a coolant fluid flow.

Abstract: An ultrasound transducer element includes a piezoelectric layer, a front end body, and a backing layer assembly. The piezoelectric layer extends between opposite front and back sides and is configured to transmit acoustic waves from the front side. The front end is body disposed proximate to the front side of the piezoelectric layer and is configured to emit the acoustic waves out of a housing. The backing layer assembly is disposed proximate to the back side of the piezoelectric layer. The backing layer assembly includes a first thermally conductive mesh disposed in a matrix enclosure. The first thermally conductive mesh is positioned to conduct thermal energy away from the piezoelectric layer. In one aspect, the first thermally conductive mesh is a grid of elongated strands of a metal or metal alloy material oriented in at least one of transverse or oblique directions.

Abstract: A transducer with a closed heat pipe is provided with a hot surface and a cold surface. The hot surface is in contact with the transducer interior and the cold surface is in contact with a cooler contact area. A fluid is used in the pipe which boils at the temperature of the hot surface and condenses at the temperature of the cold surface. A wick inside the heat pipe facilities the return by capillary action of the condensed fluid to the hot end. The heat pipe can be evacuated to adjust the boiling temperature of the fluid. A variant involves drilling additional holes into ceramic rings and inserting heat pipes. Increasing the heat pipe length into the tail mass and the piston increases the cool region for the fluid to condense; thereby improving the performance of the transducer.

Abstract: Provided is a control circuit for a thermostatic oven in an oven controlled crystal oscillator, which is capable of further improving stability of an oscillation frequency. A control circuit in which a thermistor whose resistance value changes according to a temperature outputs a signal according to the ambient temperature of the thermostatic oven inside the oscillator, an operational amplifier outputs a signal according to a difference between the output of the thermistor and a reference signal, a power transistor amplifies the output of the operational amplifier, and a heater generates heat based on a collector voltage of the power transistor, is provided with a temperature sensor circuit having a transistor with a base to which the output of the operational amplifier is input. The control circuit outputs a collector voltage of the transistor as an internal temperature signal which changes according to a temperature inside the oscillator.

Abstract: A hermetic package for electronic components which is made of metallic silicon is disclosed. The package includes a plurality of silicon elements which are bonded together. In the first embodiment, a cavity is hollowed out in the cover to house the Application Specific Integrated Circuit oscillator and the resonator. In a second embodiment, the cavity is formed in the base member with a plurality of pedestal shelves to hold the resonator above and out of contact with the electrical circuitry for the oscillator and thermal controls.

Abstract: A MEMS structure having a temperature-compensated resonator member is described. The MEMS structure comprises an asymmetric stress inverter member coupled with a substrate. A resonator member is housed in the asymmetric stress inverter member and is suspended above the substrate. The asymmetric stress inverter member is used to alter the thermal coefficient of frequency of the resonator member by inducing a stress on the resonator member in response to a change in temperature.

Abstract: A system for generating electrical power supply signals includes at least one heat engine that undergoes heating/cooling cycles and corresponding temperature variations. A thermoacoustic element is thermally coupled to the chamber. The temperature variations of the heat engine induce thermoacoustic oscillations of the thermoacoustic element which form a pressure wave. At least one piezoelectric transducer is deformed by the pressure wave. A power converter can be used to transform the electric signals generated in response to deformation of the at least one piezoelectric transducer to a desired electrical power supply signal. The heat engine preferably uses a geothermal source of cold and an ambient source of hot (typically used in the summer months), or vice-versa (typically used in the winter months).

Abstract: A piezoelectric resonator includes a substrate and a thin-film section. The thin-film section includes a first thin-film section supported by the substrate, and an acoustically-isolated second thin-film section which is separated from the substrate. In the second thin-film section, first and second electrodes are arranged on the respective main surfaces of a piezoelectric film, and a vibration section is provided at an area where the first and the second electrodes overlap each other on the second thin-film section when viewed through in the film-thickness direction. The thin-film section further includes a heat-radiating film which is in contact with peripheral edges of at least the first electrode among the first and second electrodes defining portions of a periphery of the vibration section, and which extends from the peripheral edges to the first thin-film section when viewed through in the film-thickness direction.

Abstract: A transducer with a closed heat pipe is provided with a hot surface and a cold surface. The hot surface is in contact with the transducer interior and the cold surface is in contact with a cooler contact area. A fluid is used in the pipe which boils at the temperature of the hot surface and condenses at the temperature of the cold surface. A wick inside the heat pipe facilities the return by capillary action of the condensed fluid to the hot end. The heat pipe can be evacuated to adjust the boiling temperature of the fluid. A variant involves drilling additional holes into ceramic rings and inserting heat pipes. Increasing the heat pipe length into the tail mass and the piston increases the cool region for the fluid to condense; thereby improving the performance of the transducer.

Abstract: A contactless SAW based torque and temperature sensor includes three SAW resonators 2, 3, 4 mounted on a common substrate 1 made of Y+34° cut of quartz. The first SAW 2 has its principle axis inclined at +45° to the X-axis of the substrate, which, in use, is either aligned with the longitudinal axis of a device whose torque is to be measured or is perpendicular thereto, and the second SAW 3 has its principle axis inclined at 135 degrees to the X-axis of the substrate. The third SAW 4 is positioned with its principle axis inclined at an angle, preferably in the range of 0 to 30 degrees, to the principle axis of both the first 2 and second 3 resonators so that none of the SAWs are parallel, the third SAW 4 enabling temperature measurements to be taken.

Abstract: A retaining device for use when sintering electrical components made of ceramic and metal electrodes inside the ceramic. The retaining device includes a structure to hold the electrical components. The structure has a surface that contains a sintering aid. The sintering aid includes a material that is able to bind to a gas contained in the structure and to release the gas.

Abstract: The invention relates to a piezochrome composite comprising a matrix of a piezoelectric material with particles of a spin transition compound. The invention also relates to a device that beside said composite also comprises a voltage supply connected to electrodes provided on said matrix. In one embodiment is this device provided with a temperature stabilising device.

Abstract: The present invention provides a fuel injector, comprising a housing having a sealable injector seat; a fuel injector pin disposed within the housing proximate to the injector seat such that the injector seat may be sealed and unsealed by displacing the fuel injector pin; a resilient element biasing the fuel injector pin in an unsealed direction; a piezoelectric actuator disposed within the housing proximal to the fuel injector pin configured to actuate to force the injector pin towards the injector seat to seal the injector seat; and a thermal compensating unit disposed within the housing proximal to the actuator and configured to compensate for thermal expansion or contraction of a component of the fuel injector.

Abstract: In the disclosed piezoelectric devices a piezoelectric frame includes a vibrating piece. An excitation electrode is formed on the vibrating piece. An outer frame portion surrounds the vibrating piece and includes an extraction electrode connected to the excitation electrode. A package base is bonded to one surface of the outer frame portion and includes a connection electrode connected to the extraction electrode. The package base includes an external terminal formed on a surface thereof opposite the surface on which the connection electrodes are formed. Through-hole conductors connected the connection electrodes with respective external terminals. A lid is bonded to an opposing surface of the piezoelectric frame. An exhaust channel is in communication with the extraction electrode adjacent the through-hole conductors.

Abstract: A thickness shear mode (TSM) resonator is described, comprising a diamond layer. The diamond layer is preferably a high quality diamond layer with at least 90% sp3 bonding or diamond bonding. A method for manufacturing such a resonator is also described. The thickness shear mode resonator according to embodiments described herein may advantageously be used in biosensor application and in electrochemistry applications.

Abstract: An ultrasonic waterjet apparatus (10) has a mobile generator module (20) and a high-pressure water hose (40) for delivering high-pressure water from the mobile generator module (20) to a hand-held gun (50) with a trigger and an ultrasonic nozzle (60). An ultrasonic generator in the mobile generator module (20) transmits high-frequency electrical pulses to a piezoelectric or magnetostrictive transducer (62) which vibrates to modulate a high-pressure waterjet flowing through the nozzle (60). The waterjet exiting the ultrasonic nozzle (60) is pulsed into mini slugs of water, each of which imparts a waterhammer pressure on a target surface. The ultrasonic waterjet apparatus (10) may be used to cut and de-burr materials, to clean and de-coat surfaces, and to break rocks. The ultrasonic waterjet apparatus (10) performs these tasks with much greater efficiency than conventional continuous-flow waterjet systems because of the repetitive waterhammer effect.

Abstract: A compact rake piezoelectric assembly comprises a body (110), a plurality of blades (120) extending away from the body, and a piezoelectric patch (130) attached to the body. The piezoelectric patch has a fixed portion (138) and a free portion (139), with the fixed portion being constrained to be in physical contact with the body.

Abstract: A transformer arrangement is specified which includes a piezoelectric transformer with a main body (1), and a cooling body (7) on which the main body (1) is arranged, wherein the main body (1) is thermally coupled to the cooling body (7) by means of at least one heat-conducting coupling element (8).

Abstract: The invention describes a sensor comprising an element package 2 including piezoelectric elements with an upper area 6 and a lower area 7. A preload sleeve 3 surrounds the said upper area 6 of the said element package 2, while an insulation sleeve 1 sits between the upper area 6 of the said element package 2 and the said preload sleeve 3. An outer housing 4 partially or fully surrounds the said preload sleeve 3 and the lower area 7 of the said element package 2. An insulation part 5 sits between the said lower area 7 of the element package 2 and the said outer housing 4, whereas the said upper area 6 of the said element package 2, the said insulation sleeve 1 and the said preload sleeve 3 have conical shapes and have conforming surfaces. Due to the conical size of the insulation sleeve 1, the load during a shock measurement is distributed on a larger surface area resulting in a reduced compression of the said insulation sleeve. Thereby, the maximum range of the sensor is increased.

Abstract: An electrical energy-generating heat sink system provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.

Abstract: A surface mount type crystal oscillator includes: a container body composed of a laminated ceramic including a plate-shaped center layer, and first and second frame layers stacked on opposite surfaces of the center layer respectively; a crystal blank hermetically sealed in a first recess formed by the first frame layer and the center layer; an IC chip accommodated in a second recess formed by the second frame layer and the center layer; and a test terminal provided on the outer side surface of the container body and used to test the crystal blank. The center layer has at least a first layer and a second layers, and the test terminal is electrically connected to a crystal retaining terminal provided on the bottom surface of the first recess in order to retain the crystal blank through a conductive path provided on an interface between the first and second layers.

Abstract: The present invention relates to a resonator structure, temperature compensation method and temperature control apparatus for controlling local temperature of a resonator structure. At least one heating element (55) is integrated on a substrate of the resonator structure, and a temperature control signal generated based on a stored temperature characteristic is applied to the at least one integrated heating element (55). Thereby, the at least one heating element (55) and an optional integrated sensing element can be provided very close to the resonator. It is thus possible to control or calibrate variations of sensing elements, heating elements and resonator out from every sample.

Abstract: The invention relates to a piezoelectric pressure sensor comprising an outer housing separated by an annular gap from an inner housing, which inner housing is attached to the outer housing on the pressure side. At least one piezoelectric measuring element being positioned between a diaphragm placed on the pressure side of the inner housing and a base part of said inner housing. The inner housing is provided with a massive cylindrical wall throughout, whose wall thickness essentially corresponds to the thickness of the adjacent outer housing, and in the annular gap between outer housing and inner housing or in the space between the base part of the inner housing and an interior shoulder of the pressure sensor there are provided means for transferring heat to the outer housing.

Abstract: An ultrasonic transducer device for a humidifier, the humidifier having a vaporizing chamber for producing water vapor or mist, the ultrasonic transducer device comprises: a transducer holder having a central opening formed in a longitudinal direction of the transducer holder and a flange portion disposed at a periphery of the transducer holder, the transducer formed of synthetic resin or plastic materials; an ultrasonic transducer disposed at the central opening of the transducer holder; a support member formed of metal and having an upper planar section and a side section extending vertically from the upper planar section, the upper planar section defining an opening therein for coupling with the flange portion of the transducer holder; and a heat discharge plate having heat discharging fins and coupled with the support member, the heat discharge plate coupled with a circuit board for discharging heat in the circuit board.