Abstract: A resonator device includes: a resonator element; a first package that accommodates the resonator element; and a second package in which the first package is accommodated and fixed. The first package includes a base substrate that has a first surface on which the resonator element is disposed and a second surface which is in a front-back relationship with the first surface, and that contains single crystal silicon, an integrated circuit that is provided on the first surface or the second surface and that includes a temperature sensor circuit and a heater circuit, and a lid that is bonded to the base substrate such that the resonator element is accommodated between the lid and the base substrate.

Abstract: An acoustic resonator includes: a resonating unit including a piezoelectric layer, a first electrode disposed on a lower side of the piezoelectric layer, and a second electrode disposed on an upper side of the piezoelectric layer; a substrate disposed below the resonating unit; a support unit forming a cavity between the substrate and the resonating unit; and a pillar extending through the cavity and connecting the resonating unit to the substrate. The resonating unit further includes a first insertion layer disposed above the pillar.

Abstract: An integrated circuit is disclosed. The integrated circuit comprises a silicon substrate, a sensor comprising a bulk acoustic wave resonator and an acoustic mirror disposed between the bulk acoustic wave resonator and the substrate, and a CMOS circuit supported by substrate and operatively connected to the sensor.

Abstract: A vehicle-mounted power distribution board includes: a circuit structure including a control circuit board including a conductive path on at least one of a front surface and a back surface, and a plurality of bus bars that is placed on the control circuit board, and that is composed of a plurality of bus bars; and a plurality of electronic components that are mounted to the circuit structure. Some of the plurality of electronic components are semiconductor elements that generate heat when current flows through it, and the other components are low heat resistant electrolytic capacitors and integrated circuits that are influenced by heat transferred from the semiconductor elements. Bus bar non-arrangement regions in which no bus bar is disposed are formed in the circuit structure, and the low heat resistant electrolytic capacitors and the integrated circuits are disposed in the bus bar non-arrangement regions.

Abstract: A crystal oscillator includes a quartz crystal piece, a semiconductor chip, and a temperature sensor. The semiconductor chip includes an oscillator circuit to cause the quartz crystal piece to oscillate and a first bump. The first bump is connected to the oscillator circuit and disposed on a surface of the semiconductor chip facing the quartz crystal piece. The temperature sensor is bonded to the first bump.

Abstract: A resonator device includes a resonator element, a package that accommodates the resonator element, a temperature control element arranged on a first surface of the package, and a circuit part arranged on a second surface of the package that faces away from the first surface.

Abstract: A resonator device capable of preventing the characteristics of the resonator element from degrading while ensuring the fixation strength of the resonator element is provided. A vibrator as the resonator device includes a heat generation element as a base body, a first support arm and a second support arm as elastic members each constituting a plate spring having one end connected to the heat generation element and extending from the one end toward the other end disposed at a position distant from the heat generation element, and a resonator element connected to a first support section and a second support section respectively disposed on the other end side of the first support arm and the second support arm so as to be distant from the heat generation element.

Abstract: Provided herein is a method including bonding a first oxide layer on a handle substrate to a second oxide layer on a complementary metal oxide semiconductor (“CMOS”), wherein the fusion bonding forms a unified oxide layer including a diaphragm overlying a cavity on the CMOS. The handle substrate is removed leaving the unified oxide layer. A piezoelectric film stack is deposited over the unified oxide layer. Vias are formed in the piezoelectric film stack and the unified oxide layer. An electrical contact layer is deposited, wherein the electrical contact layer electrically connects the piezoelectric film stack to an electrode on the CMOS.

Abstract: A resonation device includes a heat generation element as a heat generation portion which is disposed on a bottom plate of a package as a base substrate, a resonator element having connection portions and fixed to the heat generation element, and a protruding portion which overlaps a region different from the connection portions and of the resonator element when seen in plan view and is provided on the bottom plate. The area of the connection portions is larger than the area of the protruding portion when seen in plan view.

Abstract: Methods and apparatus for temperature control of devices and mechanical resonating structures are described. A mechanical resonating structure may include a heating element and a temperature sensor. The temperature sensor may sense the temperature of the mechanical resonating structure, and the heating element may be adjusted to provide a desired level of heating. Optionally, additional heating elements and/or temperature sensors may be included.

Abstract: An electronic component includes a wiring substrate, a heating element, a first support, a second support, and a container. The heating element, the first support, and the second support are electrically connected to the wiring substrate. The wiring substrate is disposed within the container through the first support and the second support which penetrate the container. Each of the first support and the second support includes a protrusion portion protruding outside the container, and the protrusion portion of the second support is shorter than the protrusion portion of the first support.

Abstract: An electronic device includes a resonator provided with a heating element, and a circuit component opposed to the heating element, and provided with at least an oscillating amplifier element, and a distance between the heating element and the circuit component is in a range not smaller than 0 mm and no larger than 1.5 mm.

Abstract: An oscillation apparatus corrects a setting value for an output frequency based on a detection result of an environmental temperature. The oscillation apparatus includes a first crystal unit, a second crystal unit, an integrated circuit chip, and a container. The first crystal unit includes first excitation electrodes on respective surfaces of a crystal element. The second crystal unit includes second excitation electrodes on respective surfaces of a crystal element. The integrated circuit chip includes a first oscillation circuit, a second oscillation circuit, and a correction unit. The container houses the first crystal unit, the second crystal unit, and the integrated circuit chip. Assuming that distances from a gravity center position of the integrated circuit chip to respective gravity center positions of the first excitation electrodes and the second excitation electrodes in plan view are denoted by D1 and D2, D1/D2 is within a predetermined range close to 1.

Abstract: An electronic device includes: a substrate; a resonation device; a heating element; a first support which is mounted on the substrate and supports the resonation device; and a second support which supports the substrate, in which the relationship between thermal conductivity ?1 of the first support and thermal conductivity ?2 of the second support satisfies an expression, ?1>?2.

Abstract: An electronic device includes: a substrate; a resonation device; a heating element; a first support which is mounted on the substrate and supports the resonation device; and a second support which supports the substrate, in which the relationship between thermal conductivity ?1 of the first support and thermal conductivity ?2 of the second support satisfies an expression, ?1>?2.

Abstract: A resonation device includes a heat generation element as a heat generation portion which is disposed on a bottom plate of a package as a base substrate, a resonator element having connection portions and fixed to the heat generation element, and a protruding portion which overlaps a region different from the connection portions and of the resonator element when seen in plan view and is provided on the bottom plate. The area of the connection portions is larger than the area of the protruding portion when seen in plan view.

Abstract: A bulk acoustic wave (BAW) resonator device comprises a heating cod disposed over a first side of the piezoelectric layer and substantially around a perimeter adjacent to the active area of the acoustic resonator, the heating coil comprising a resistor configured to receive a heater current; and a heat sensor disposed over a second side of the piezoelectric layer and opposing the first side, the heat sensor configured to adjust the heater current in response to a temperature of the heating coil.

Abstract: Methods and apparatus for temperature control of devices and mechanical resonating structures are described. A mechanical resonating structure may include a heating element and a temperature sensor. The temperature sensor may sense the temperature of the mechanical resonating structure, and the heating element may be adjusted to provide a desired level of heating. Optionally, additional heating elements and/or temperature sensors may be included.

Abstract: A microelectromechanical resonator includes a resonator body, which is encapsulated within a sealed cavity extending between first and second substrates that are bonded together. The resonator body is anchored to the first substrate by at least a pair of tethers that suspend the resonator body opposite an underlying recess in the first substrate. A resistive heating element is provided, which is configured to indirectly heat the resonator body through convective heating of the cavity. This resistive heating element may be disposed on an inner surface of the second substrate that is exposed to the cavity. The resonator may also include first and second electrical interconnects, which extend through the second substrate and contact respective first and second portions of the resistive heating element.

Abstract: An acoustic resonator device includes an annular acoustic resonator, a heater coil and a heat sensor. The annular acoustic resonator is positioned over a trench formed in a substrate of the acoustic resonator device. The heater coil is disposed around a perimeter of the annular acoustic resonator, the heater coil including a resistor configured to receive a heater current. The heat sensor is configured to adjust the heater current in response to a temperature of the heater coil.

Abstract: An oven controlled crystal oscillator includes a thermostatic bath, an inner circuit board, an outer circuit board, a heating element, and a temperature sensor. The inner circuit board comprising a crystal oscillation circuit is positioned inside the thermostatic bath and electrically connected with the outer circuit board via a pin. The outer circuit board has a temperature control circuit and a power supply circuit. The heating element and the temperature sensor electrically connect with the outer circuit board. A through slot is formed through the outer circuit board, and the thermostatic bath is inserted into the through slot. By inserting the thermostatic bath into the through slot of the outer circuit board, the height and the weight of the oven controlled crystal oscillator are reduced, the electric connection performance is enhanced, and thus the stability of the output frequency of the oven controlled crystal oscillator is improved.

Abstract: A driving unit that may improve characteristics in a low temperature environment while implementing downsizing, and a lens module as well as an image pickup device with such a driving unit are provided. The driving unit includes one or a plurality of polymer actuator elements, and a voltage supply section supplying a driving voltage and a heating voltage to the polymer actuator element.

Abstract: The crystal oscillator device includes an air-tight case (1) forming a vacuum chamber (23), a piezoelectric resonator element (11), oscillation circuitry, a temperature sensor, and a heating unit implemented in an integrated-circuit (IC) chip (13) with an active surface (13a). The piezoelectric resonator element (11) and the oscillation circuitry are connected together to form an oscillation circuit. Furthermore, the temperature sensor and the heating unit are enclosed in the vacuum chamber (23) with the piezoelectric resonator element (11). The piezoelectric resonator element is attached in a heat conductive manner to the active surface (13a) of the integrated-circuit chip (13) in such a way that the IC chip provides mechanical support for the piezoelectric resonator element.

Abstract: Provided is a control circuit for a thermostatic oven in an oven controlled crystal oscillator, which is capable of further improving stability of an oscillation frequency. A control circuit in which a thermistor whose resistance value changes according to a temperature outputs a signal according to the ambient temperature of the thermostatic oven inside the oscillator, an operational amplifier outputs a signal according to a difference between the output of the thermistor and a reference signal, a power transistor amplifies the output of the operational amplifier, and a heater generates heat based on a collector voltage of the power transistor, is provided with a temperature sensor circuit having a transistor with a base to which the output of the operational amplifier is input. The control circuit outputs a collector voltage of the transistor as an internal temperature signal which changes according to a temperature inside the oscillator.

Abstract: A hermetic package for electronic components which is made of metallic silicon is disclosed. The package includes a plurality of silicon elements which are bonded together. In the first embodiment, a cavity is hollowed out in the cover to house the Application Specific Integrated Circuit oscillator and the resonator. In a second embodiment, the cavity is formed in the base member with a plurality of pedestal shelves to hold the resonator above and out of contact with the electrical circuitry for the oscillator and thermal controls.

Abstract: The present disclosure provides a device including a MEMS resonating element, provided for resonating at a predetermined resonance frequency, the MEMS resonating element having at least one temperature dependent characteristic, a heating circuit arranged for heating the MEMS resonating element to an offset temperature (Toffset), a sensing circuit associated with the MEMS resonating element and provided for sensing its temperature dependent characteristic, and a control circuit connected to the sensing circuit for receiving measurement signals indicative of the sensed temperature dependent characteristic and connected to the heating circuit for supplying a control signal thereto to maintain the temperature of the MEMS resonating element at the offset temperature. The heating circuit includes a tunable thermal radiation source and the MEMS resonating element is provided so as to absorb at least a portion of the thermal radiation generated by the tunable thermal radiation source.

Abstract: A retaining device for use when sintering electrical components made of ceramic and metal electrodes inside the ceramic. The retaining device includes a structure to hold the electrical components. The structure has a surface that contains a sintering aid. The sintering aid includes a material that is able to bind to a gas contained in the structure and to release the gas.

Abstract: A bistable electroactive polymer transducer is provided for electrically actuated deformation of rigid electroactive polymer members. The polymers have glass transition temperatures (Tg) above ambient conditions and turn into rubbery elastomers above Tg and have high dielectric breakdown strength in the rubbery state. They can be electrically deformed to various rigid shapes with maximum strain greater than 100% and as high as 400%. The actuation is made bistable by cooling below Tg to preserve the deformation. The dielectric actuation mechanism includes a pair of compliant electrodes in contact with a dielectric elastomer which deforms when a voltage bias is applied between the pair of electrodes. In some of the transducers of the present invention, the dielectric elastomer is also a shape memory polymer. The deformations of such bistable electroactive polymers can be repeated rapidly for numerous cycles.

Abstract: An oven controlled crystal oscillator capable of uniformly transmitting heat from the heat generator to improve the frequency-temperature characteristics. The oven controlled crystal oscillator includes a high thermal conductivity plate having high thermal conductivity and provided on one side of a substrate, where the crystal resonator is provided, in such a manner to contact the resistors, the transistor, the crystal resonator, and the temperature sensor. This structure can transmit heat from the resistors and the transistor as the heat generator to the crystal resonator and the temperature sensor rapidly with less heat loss to assure a uniform temperature inside the substrate, thereby improving the frequency-temperature characteristics.

Abstract: A MEMS switch includes a lower substrate having a signal line on an upper surface of the lower substrate; an upper substrate, having a cavity therein, disposed apart from the upper surface of the lower substrate by a distance, and having a membrane layer on a lower surface of the upper substrate; a bimetal layer formed in the cavity of the upper substrate on the membrane layer; a heating layer formed on a lower surface of the membrane layer; and a contact member formed on a lower surface of the heating layer. The contact member can come into contact with or separate from the signal line. A method for manufacturing the MEMS switch includes preparing the upper and lower substrates and combining them so that a surface having the signal line faces a surface having the contact member and the upper and lower substrates are disposed apart by a distance.

Abstract: A piezooscillator having a piezoelectric vibrator and an oscillation circuit in a space surrounded by a substrate and a cover, which has a smaller size and height, and further, which can be assembled easily and suppress power consumption, is provided.

Abstract: The present invention relates to a resonator structure, temperature compensation method and temperature control apparatus for controlling local temperature of a resonator structure. At least one heating element (55) is integrated on a substrate of the resonator structure, and a temperature control signal generated based on a stored temperature characteristic is applied to the at least one integrated heating element (55). Thereby, the at least one heating element (55) and an optional integrated sensing element can be provided very close to the resonator. It is thus possible to control or calibrate variations of sensing elements, heating elements and resonator out from every sample.

Abstract: A surface mount type crystal oscillator includes: a container body composed of a laminated ceramic including a plate-shaped center layer, and first and second frame layers stacked on opposite surfaces of the center layer respectively; a crystal blank hermetically sealed in a first recess formed by the first frame layer and the center layer; an IC chip accommodated in a second recess formed by the second frame layer and the center layer; and a test terminal provided on the outer side surface of the container body and used to test the crystal blank. The center layer has at least a first layer and a second layers, and the test terminal is electrically connected to a crystal retaining terminal provided on the bottom surface of the first recess in order to retain the crystal blank through a conductive path provided on an interface between the first and second layers.

Abstract: A method and apparatus for allocating subcarriers in an orthogonal frequency division multiple access (OFDMA) system is described. In one embodiment, the method comprises allocating at least one diversity cluster of subcarriers to a first subscriber and allocating at least one coherence cluster to a second subscriber.

Abstract: Various micro-transducers incorporating piezoelectric materials for converting energy in one form to useful energy in another form are disclosed. In one embodiment, a piezoelectric micro-transducer can be operated either as a micro-heat engine, converting thermal energy into electrical energy, or as a micro-heat pump, consuming electrical energy to transfer thermal energy from a low-temperature heat source to a high-temperature heat sink. In another embodiment, a piezoelectric micro-transducer is used to convert the kinetic energy of an oscillating or vibrating body on which the micro-transducer is placed into useful electrical energy. A piezoelectric micro-transducer also is used to extract work from a pressurized stream of fluid. Also disclosed are a micro-internal combustion engine and a micro-heat engine based on the Rankine cycle in which a single fluid serves as a working fluid and a fuel.

Abstract: A deployable acoustic wave RFID/biosensor assembly has at least one protective layer, and an acoustic wave RFID/biosensor within the protective layer or layers. The acoustic wave RFID/biosensor includes an acoustic wave device, a biolayer mounted on the acoustic wave device, an electric circuit operable to actuate the acoustic wave device, and a fluidic chamber associated with the biolayer. In use, the fluidic chamber contains fluid which, if a predetermined substance to be sensed is present, operates to modify the biolayer which in turn affects the operation of the acoustic wave device. Protective fluid is provided within the protective layer or layers substantially surrounds the acoustic wave RFID/biosensor to protect the acoustic wave RFID/biosensor from damage when the RFID/biosensor assembly impacts a target and to protect the biolayer from deterioration during storage and use.

Abstract: A crystal oscillator of the present invention includes: a substrate provided in a package; a heating device arranged as surrounding an internal area of the substrate on at least one of the surfaces of the substrate; a crystal resonator or a crystal element and an oscillation circuit unit provided in an area enclosed by the heating device; a thermosensitive element which detects a temperature in an area enclosed by the heating device; and a control unit for controlling a heating value applied to the heating device based on a detection result of the thermosensitive element.

Abstract: A thin and highly stable piezoelectric oscillator is provided with a piezoelectric vibrator, a mother printed board which supports a piezoelectric vibrator main body on its one face and connects lead terminals to a wiring pattern, oscillating circuit parts which are mounted on one face of the mother printed board to be disposed in close contact with one face of the piezoelectric vibrator main body, adjusting circuit parts which are mounted on the other face of the mother printed board, an internal printed board which is provided in contact with the other face of the piezoelectric vibrator main body, and heater resistors which are mounted on the internal printed board to be disposed in close contact with the other face of the piezoelectric vibrator main body.

Abstract: A device comprising a resonator formed of a piezoelectric layer sandwiched between two metal electrodes, the resonator being laid on a suspended beam, the device comprising means for deforming said beam by the difference in thermal expansion coefficients.

Abstract: A micro-electro-mechanical generator is provided with a housing having a heat source and a heat sink opposite to the heat source in the housing. An upper diaphragm and a lower diaphragm separated from the upper diaphragm by a constant distance are further provided, which are deformable between a first position where the lower diaphragm is thermally connected to the heat source while the upper diaphragm being thermally shut off from the heat sink, and a second position where the upper diaphragm is thermally connected to the heat sink while the lower diaphragm being thermally shut off from the heat source. Further, the upper diaphragm and the lower diaphragm are adapted to generate electric energy whenever being deformed.

Abstract: A micro-electro-mechanical generator has a liquid chamber, a heating block, an elongated elastic piezoelectric plate and a pair of electrodes. The liquid chamber is defined by bottom blocks which include the heating block and side walls, and can maintain a liquid. The heating block generates bubbles within the liquid chamber. The elongated elastic piezoelectric plate has a piezoelectric material layer, and is positioned in the liquid chamber adjacent to an upper portion of the heating block. The elongated elastic piezoelectric plate is deformable by contact with the bubbles, wherein a first end of the elongated elastic piezoelectric plate is a free end and a second end of the elongated elastic piezoelectric plate is a fixed end. The pair of electrodes are electrically connected to the piezoelectric material layer.

Abstract: The present invention is for a thermally controlled package for oscillators, particularly evacuated miniature surface acoustical wave oscillators (EMSO) devices. In a preferred embodiment the surface acoustical wave device is bonded directly to a heated substrate. The package is evacuated to improve temperature characteristics. A temperature heater, sensor, and control controller are utilized to maintain the internal package temperature above ambient. In one embodiment there is an additional substrate layer that house components that are not sensitive to temperature with interconnects electrically connecting the heated substrate and the additional substrates.

Abstract: An apparatus and method for stabilizing the frequency of a piezoelectric crystal resonator, especially useful in common emergency positioning radio beacons. A temperature compensated crystal oscillator circuit (TCXO) is mounted on one surface of a thin substrate. The TCXO includes a piezoelectric device such as a quartz resonator and a capacitor thermistor compensation network to reduce the frequency fluctuations of the crystal through variations in temperature. A heating circuit is mounted to the opposing surface of the substrate, thereby providing a thermal connection between the two circuits. The heating circuit includes a temperature sensor for sensing changes in ambient temperatures and a heater control amplifier for adjusting the power of a heating element. The substrate with the two circuits disposed thereon is suspended within a hermetically sealed enclosure by a plurality of support pins.

Abstract: There are disposed on a printed substrate a crystal resonator as a piezoelectric resonator, an oscillation circuit, a plurality of surface mount heaters and a temperature controlling circuit for controlling a heating temperature of the heaters. A case of the piezoelectric resonator and a lead terminal of the piezoelectric resonator are heated respectively at the same time by individually separate heaters for the purpose of heating the piezoelectric resonator, the oscillation circuit and the temperature controlling circuit at the same time. Accordingly, it is possible to provide a piezo-oscillator excellent in low power consumption and compactness.

Abstract: A low profile integrated oscillator operable to provide an oscillator signal includes a thermally conductive substrate having a cavity and a ledge. A crystal or other resonator is located in the cavity and mounted to the ledge. The resonator stabilizes the oscillator signal. An electrical circuit is mounted to the substrate and electrically connects to the resonator to condition the oscillator signal. A cover seals the resonator in the cavity. A via electrically connects the resonator to the electrical circuit. A heater is mounted to the substrate, outside the cavity, for elevating the temperature inside the cavity and a temperature sensor is mounted to the substrate to monitor the oscillator temperature. The substrate is surrounded by an insulation and mounted within a housing. The housing has a connector for connecting to an external electrical circuit.

Abstract: A heater apparatus (10) for a piezoelectric device (12) includes a resistive heating element (18) on an insulating substrate (14). The heating element (18) maintains a temperature of the piezoelectric device (12) within a predetermined temperature range. A plurality of electrical couplings (20) extend through the insulating substrate (14). The electrical couplings (20) electrically connect to the heating element (18) and mechanically and electrically connect to the piezoelectric device (12). The piezoelectric device (12) is suspended above the heating element (18) on at least two of the electrical couplings (20). As a result, the heater apparatus (10) and piezoelectric device (12) can be enclosed within a standard crystal package.

Abstract: A low profile integrated oscillator operable to provide an oscillator signal includes a substrate having a cavity and a via passing through the substrate. A crystal or other resonator is disposed in the cavity and stabilizes the oscillator signal. An electrical circuit means is mounted to the substrate and electrically connects to the via to condition the oscillator signal. A cover seals the resonator in the cavity. A connector electrically connects the resonator to the via. A heater is mounted to the substrate to elevate the oscillator temperature and a temperature sensor is mounted to the substrate to monitor and control the oscillator temperature. The substrate is surrounded by an insulation and mounted within a housing. The housing has a connection means for connecting to an external electrical circuit.

Abstract: A crystal resonator assembly is described wherein a piezo-electric resonator is mounted over a heat conducting substrate and one or more heat generating elements are located on the substrate. The heating elements provide heat both by conduction and radiation and by virtue of the use of a heat conducting substrate enable a uniform and efficient heating of the crystal resonator to a desired oven temperature.

Abstract: An oven assembly for a crystal resonator and oscillator utilizes a thermally symmetrical design to provide a high thermal gain. The oven assembly includes an encasement that forms a hermetically sealed oven chamber that is substantially cylindrical. Concentric with the oven chamber is an annular oven mass that functions as a heat reservoir for the crystal resonator that is contained within the oven mass. The cylindrical oven chamber and the concentric annular oven mass provide two levels of circular symmetry that help achieve a thermally isotropic oscillator environment. Wide-area uniform heat transfer promotes high thermal gain and minimizes thermal gradients. Another factor is the geometry and circuitry for temperature monitoring. Temperature sensors are equidistantly spaced from each other and are equidistant from the center of the oven chamber. Signals from the various thermistors are averaged to provide a more accurate temperature determination for regulating the heaters.

Abstract: A substantially sealed frequency source (10) including a crystal oscillator (14) and a programmable IC (22) thermally and electrically coupled on a substrate (12). The IC (22) is accessed through an interface (26) with programming signals (42) so as to provide an analog temperature control signal (34) and a crystal oscillator frequency adjustment signal (36). The substrate (12) maintains a substantially constant temperature at a turning point (82) on a frequency-temperature response curve (80) of the crystal (64). The IC (22) allows programming of the source (10) after sealing to compensate for shifts in the crystal frequency-temperature response (80) due to sealing. The IC (22) provides electrical correction of the substrate temperature setpoint and the crystal oscillator frequency without mechanically or thermally disturbing the internal components of the source (10).