With Temperature Compensating Structure Patents (Class 310/346)
  • Patent number: 11159141
    Abstract: An acoustic wave device includes a high-acoustic-velocity film, a piezoelectric layer provided directly or indirectly on the high-acoustic-velocity film, an IDT electrode provided on the piezoelectric layer, and a dielectric film provided on the piezoelectric layer to cover the IDT electrode. An acoustic velocity of bulk waves propagating through the high-acoustic-velocity film is higher than an acoustic velocity of acoustic waves propagating through the piezoelectric layer. The dielectric film includes a material including hydrogen atoms.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: October 26, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Koji Yamamoto, Tsutomu Takai, Hideaki Takahashi
  • Patent number: 10965271
    Abstract: An acoustic resonator includes a membrane layer disposed on an insulating layer; a cavity formed by the insulating layer and the membrane layer; a resonating portion disposed on the cavity and having a first electrode, a piezoelectric layer, and a second electrode stacked thereon; a protective layer disposed on the resonating portion; and a hydrophobic layer formed on the protective layer.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: March 30, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Jun Lim, Jong Woon Kim, Ran Hee Shin, Sung Sun Kim
  • Patent number: 10951193
    Abstract: An elastic wave device includes an interdigital transducer electrode including electrode fingers provided on a first principal surface of a piezoelectric thin film. A conductive layer is provided on a second principal surface of the piezoelectric thin film. An elastic wave propagates in the piezoelectric thin film in an S0 mode of a plate wave, and a piezoelectric thin film portion in a region below spaces between the electrode fingers of the interdigital transducer electrode is displaced by a greater amount than each electrode finger and a piezoelectric thin film portion in a region below each electrode finger.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: March 16, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yutaka Kishimoto, Masashi Omura, Tetsuya Kimura
  • Patent number: 10917068
    Abstract: Acoustic filtering circuitry includes an input node, an output node, a signal transmission path, a series acoustic resonator, and a shunt acoustic resonator. The signal transmission path is between the input node and the output node. The series acoustic resonator is coupled between the input node and the output node in the signal transmission path. Further, a temperature coefficient of frequency (TCF) of a parallel resonance frequency of the series acoustic resonator is positive. The shunt acoustic resonator is coupled between the signal transmission path and ground. Further, a TCF of a series resonance frequency of the shunt acoustic resonator is negative. By providing the TCF of the series acoustic resonator and the shunt acoustic resonator in this manner, self-heating of the acoustic filtering circuitry may be significantly reduced, thereby improving the performance of the acoustic filtering circuitry.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: February 9, 2021
    Assignee: Qorvo US, Inc.
    Inventors: Andreas Tag, Fabien Dumont
  • Patent number: 10903817
    Abstract: A method of manufacturing a bulk acoustic wave resonator includes: forming a sacrificial layer on a substrate protection layer; forming a membrane layer on the substrate protection layer to cover the sacrificial layer; and forming a cavity by removing the sacrificial layer using a gas mixture comprising a halide-based gas and an oxygen-containing gas, wherein a mixture ratio of the halide-based gas to the oxygen-containing gas in the gas mixture is in a range from 1.5 to 2.4.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: January 26, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Kee Yoon, Nam Soo Park, Hyung Jae Park, Tae Kyung Lee, Moon Chul Lee
  • Patent number: 10186654
    Abstract: A MEMS piezoelectric device includes a monolithic semiconductor body having first and second main surfaces extending parallel to a horizontal plane formed by first and second horizontal axes. A housing cavity is arranged within the monolithic semiconductor body. A membrane is suspended above the housing cavity at the first main surface. A piezoelectric material layer is arranged above a first surface of the membrane with a proof mass coupled to a second surface, opposite to the first surface, along the vertical axis. An electrode arrangement is provided in contact with the piezoelectric material layer. The proof mass causes deformation of the piezoelectric material layer in response to environmental mechanical vibrations. The proof mass is coupled to the membrane by a connection element arranged, in a central position, between the membrane and the proof mass in the direction of the vertical axis.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: January 22, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventors: Maria Fortuna Bevilacqua, Flavio Francesco Villa, Rossana Scaldaferri, Valeria Casuscelli, Andrea Di Matteo, Dino Faralli
  • Patent number: 10069500
    Abstract: An oven controlled MEMS timing device that includes a very small oscillator that can be heated very rapidly with very low power. The MEMS device includes a rectangular frame, a heated platform positing in the frame, and a pair of support beams that extend from the rectangular frame and hold the platform within a cavity of the frame to thermally isolate the platform. Moreover, the device includes a resonator attached to the platform by a pair of anchor beams, a heater that heats the platform to maintain a target temperature for the resonator and a thermistor that measures a temperature of the platform to provide a control loop for the heater.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: September 4, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Ville Kaajakari
  • Patent number: 9899987
    Abstract: An active type temperature compensation resonator structure is provided, including a resonant body and a temperature compensation element embedded in the resonant body for a compensation current to pass therethrough. The temperature compensation element has a specified temperature coefficient of resistance that reflects the temperature of the resonant body. The magnitude of the compensated current corresponds to the reflected temperature of the resonant body. With the active type temperature compensation resonator structure, the temperature of the resonant body can be accurately reacted by the specified temperature coefficient of resistance, such that the temperature compensation element, through which the compensated current passes, can dynamically correspond to the temperature of the resonant body and accurately provide the resonant body with temperature compensation.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: February 20, 2018
    Assignee: National Tsing Hua University
    Inventors: Sheng-Shian Li, Ming-Huang Li
  • Patent number: 9712137
    Abstract: A method of manufacturing resonation device (a quartz crystal oscillator) includes the steps of applying a thermosetting thermal insulating connection material and an electrically-conductive connection material, which is higher in curing temperature than the thermosetting thermal insulating connection material, on a principal surface of a substrate, mounting fixation terminals of a resonator (a quartz crystal resonator), which has a heating element, and to which the fixation terminals and connection terminals are connected, in application positions of the insulating connection material on the substrate, and connection terminals in application positions of the electrically-conductive connection material, and heating the insulating connection material and the electrically-conductive connection material based on a reflow profile to make the insulating connection material and the electrically-conductive connection material cure in this order.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: July 18, 2017
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Manabu Kondo
  • Patent number: 9667222
    Abstract: A method of manufacturing resonation device (a quartz crystal oscillator) includes the steps of applying a thermosetting thermal insulating connection material and an electrically-conductive connection material, which is higher in curing temperature than the thermosetting thermal insulating connection material, on a principal surface of a substrate, mounting fixation terminals of a resonator (a quartz crystal resonator), which has a heating element, and to which the fixation terminals and connection terminals are connected, in application positions of the insulating connection material on the substrate, and connection terminals in application positions of the electrically-conductive connection material, and heating the insulating connection material and the electrically-conductive connection material based on a reflow profile to make the insulating connection material and the electrically-conductive connection material cure in this order.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: May 30, 2017
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Manabu Kondo
  • Patent number: 9608192
    Abstract: An acoustic resonator device comprises: a substrate comprising a cavity or an acoustic mirror; a first electrode disposed over the substrate; a piezoelectric layer disposed over the first electrode; and a second electrode disposed over the piezoelectric layer. The first electrode or the second electrode, or both, are made of an electrically conductive material having a positive temperature coefficient.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: March 28, 2017
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Qiang Zou, Richard C. Ruby, Donald Lee, Zhiqiang Bi, Martha K. Small, Kristina Lamers
  • Patent number: 9331666
    Abstract: This disclosure provides systems, methods and apparatus related to acoustic resonators that include composite transduction layers for enabling selective tuning of one or more acoustic or electromechanical properties. In one aspect, a resonator structure includes one or more first electrodes, one or more second electrodes, and a transduction layer arranged between the first and second electrodes. The transduction layer includes a plurality of constituent layers. In some implementations, the constituent layers include one or more first piezoelectric layers and one or more second piezoelectric layers. The transduction layer is configured to, responsive to signals provided to the first and second electrodes, provide at least a first mode of vibration of the transduction layer with a displacement component along the z axis and at least a second mode of vibration of the transduction layer with a displacement component along the plane of the x axis and they axis.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: May 3, 2016
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun, Sang-June Park, Philip Jason Stephanou, Chi Shun Lo, Robert Paul Mikulka, Mario Francisco Velez, Ravindra V. Shenoy, Matthew Michael Nowak
  • Patent number: 9287486
    Abstract: There are provided a multi-layer piezoelectric element which is capable of suppression of occurrence of an imperfect area, suffers from no development of leakage current even with moisture intrusion, has long-term freedom from variations in displacement and can achieve stable driving, as well as to provide a piezoelectric actuator, an injection device, and a fuel injection system provided with the multi-layer piezoelectric element. A multi-layer piezoelectric element includes a stacked body in which piezoelectric layers and internal electrodes acting as positive and negative internal electrodes are laminated; an inorganic coating attached to a side surface of the stacked body where ends of both the positive internal electrodes and the negative internal electrodes are exposed; and metal particles composed predominantly of a metal element contained in the internal electrodes, the metal particles dispersed in the inorganic coating.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: March 15, 2016
    Assignee: Kyocera Corporation
    Inventors: Takeshi Okamura, Shigenobu Nakamura
  • Patent number: 9160298
    Abstract: An acoustic wave device includes: a substrate; a lower electrode that is located on the substrate; a piezoelectric film that is located on the lower electrode and made of aluminum nitride of which a ratio of a lattice constant in a c-axis direction to a lattice constant in an a-axis direction is smaller than 1.6; and an upper electrode that is located on the piezoelectric film and faces the lower electrode across the piezoelectric film.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: October 13, 2015
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Tsuyoshi Yokoyama
  • Patent number: 9041271
    Abstract: A crystal device is provided, in which a peeling of a bonding material is prevented by using the bonding material having a thermal expansion coefficient which is between the coefficients in a first direction and a second direction of a bonding surface of a crystal element. A crystal device includes a rectangular crystal element formed with a crystal material that includes an excitation part and a frame surrounding the excitation part. The device further includes a rectangular base bonded to a principal surface of the frame, and a lid bonded to another principal surface of the frame; and the frame, the base and the lid have edges respectively along a first direction and a second direction intersecting with the first direction. The bonding material is applied having a thermal expansion coefficient that is between the coefficients in the first direction and second direction of the crystal element.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: May 26, 2015
    Assignee: NIHON DEMPA KOGYO CO., LTD
    Inventors: Masakazu Harada, Takumi Ariji, Takehiro Takahashi
  • Publication number: 20150137908
    Abstract: An acoustic wave filter includes series resonators and parallel resonators that have a piezoelectric film on an identical substrate and have a lower electrode and an upper electrode, wherein: one of the series resonators and the parallel resonators have a temperature compensation film on a face of the lower electrode or the upper electrode that is opposite to the piezoelectric film in a resonance region, the compensation film having an elastic constant of a temperature coefficient of which sign is opposite to a sign of a temperature coefficient of an elastic constant of the piezoelectric film; and the other have an added film on the same side as the temperature compensation film on the lower electrode side or the upper electrode side compared to the piezoelectric film in the resonance region in the one of the series resonators and the parallel resonators.
    Type: Application
    Filed: October 30, 2014
    Publication date: May 21, 2015
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Tokihiro NISHIHARA, Shinji TANIGUCHI
  • Patent number: 9030080
    Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: May 12, 2015
    Assignee: Sand 9, Inc.
    Inventors: David M. Chen, Jan H. Kuypers, Pritiraj Mohanty, Klaus Juergen Schoepf, Guiti Zolfagharkhani, Jason Goodelle, Reimund Rebel
  • Patent number: 9024512
    Abstract: A resonant transducer comprising: a vibration plate; and a piezoelectric element including a piezoelectric film and an upper electrode that are laminated on the vibration plate, wherein a compressive stress is applied to the piezoelectric film.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: May 5, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Yasutoshi Hirabayashi, Takamichi Fujii
  • Publication number: 20150116050
    Abstract: A vibrating element has a drive mode, and first and second detection modes in which the vibrating element vibrates in a direction orthogonal to a vibration direction in the drive mode. In frequency-temperature characteristic curves representing a change in frequency due to a change in temperature in the respective modes with a horizontal axis representing an ambient temperature and a vertical axis representing a change in frequency, when a turnover temperature of the frequency-temperature characteristic curve in the drive mode is Ta [° C.], a turnover temperature of the frequency-temperature characteristic curve in the first detection mode is Tb [° C.], and a turnover temperature of the frequency-temperature characteristic curve in the second detection mode is Tc [° C.], Ta is lower than Tb and Tc, or Ta is higher than Tb and Tc.
    Type: Application
    Filed: October 24, 2014
    Publication date: April 30, 2015
    Inventors: Keiji NAKAGAWA, Ryuta NISHIZAWA
  • Publication number: 20150116428
    Abstract: A piezoelectric element used between a lowest use temperature T1 and a highest use temperature T2, includes a first electrode, a piezoelectric layer provided on the first electrode and made of a piezoelectric material including a composite oxide having a perovskite structure, the piezoelectric material having a morphotropic phase boundary which is inclined with respect to a temperature axis, and the piezoelectric material satisfying at least one of formulas T3?T1?T4 and T3?T2?T4, where T3 is a temperature corresponding to the morphotropic phase boundary at a lowest point and T4 is a temperature corresponding to the morphotropic phase boundary at a highest point and a second electrode provided on the piezoelectric layer.
    Type: Application
    Filed: October 23, 2014
    Publication date: April 30, 2015
    Inventor: Yasuaki HAMADA
  • Patent number: 9013088
    Abstract: Apparatus and methods for control of charge in a semiconductor material of a mechanical resonating structure are described. Controlling the charge of the material may control the material properties of the semiconductor, such as the stiffness. Such control may result in changes in the behavior of the mechanical resonating structure, allowing for control and tuning of the behavior of the mechanical resonating structure.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: April 21, 2015
    Assignee: Sand 9, Inc.
    Inventors: Andrew Sparks, Jan H. Kuypers, Florian Thalmayr
  • Patent number: 9006956
    Abstract: Methods, systems, and devices for providing cooling for a mobile device using piezoelectric active cooling devices. Some embodiments utilize piezoelectric actuators that oscillate a planar element within an air channel to fan air within or at an outlet of the air channel. The air channel may be defined by at least one heat dissipation surface in thermal contact with components of the mobile device that generate excess waste heat. For example, the air channel may include a surface that is in thermal contact with a processor of the mobile computing device. In embodiments, the piezoelectric active cooling device may be used in an air gap between stacked packages in a package on package (PoP) processor package. The described embodiments provide active cooling using low power, can be controlled to provide variable cooling, use highly reliable elements, and can be implemented at low cost.
    Type: Grant
    Filed: May 9, 2012
    Date of Patent: April 14, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Qing Li, Jon J. Anderson
  • Patent number: 8981624
    Abstract: A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: March 17, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: David Martin, Donald Lee, John Choy, Joel Philliber, Osvaldo Buccafusca
  • Publication number: 20150070443
    Abstract: A head has a base and a piezoelectric element which is superimposed on and fastened to the base in a thickness direction. The piezoelectric element has a plate-shaped piezoelectric body, and a common electrode and a individual electrode arranged so as to sandwich the piezoelectric body in the thickness direction. The base has a higher thermal expansion coefficient than the piezoelectric body (the piezoelectric element 23). The piezoelectric body has a tetragonal principal crystal phase, in which the degree of orientation of the c-axis toward one side in the thickness direction (positive side in z direction) in the region sandwiched by the common electrode and the individual electrode is 44% or more and 56% or less in terms of the Lotgering factor and in which the residual stress in the surface direction is 0 MPa or more and 35 MPa or less in the direction of compression.
    Type: Application
    Filed: March 29, 2013
    Publication date: March 12, 2015
    Applicant: KYOCERA CORPORATION
    Inventor: Shuzo Iwashita
  • Patent number: 8975802
    Abstract: An acoustic wave device includes: a comb-like electrode provided on a piezoelectric substrate; and a first medium that covers the comb-like electrode and has at least a silicon oxide film in which an element is doped, wherein sonic speed in the silicon oxide film in which the element is doped is lower than sonic speed in an undoped silicon oxide film.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: March 10, 2015
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Satoru Matsuda, Takashi Matsuda, Michio Miura
  • Patent number: 8941286
    Abstract: An acoustic wave device includes: a piezoelectric thin film resonator including: a substrate; a lower electrode formed on the substrate; at least two piezoelectric films formed on the lower electrode; an insulating film sandwiched by the at least two piezoelectric films; and an upper electrode formed on the at least two piezoelectric films, wherein an area of the insulating film within a resonance region, in which the lower electrode and the upper electrode face each other across the at least two piezoelectric films, is different from an area of the resonance region.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: January 27, 2015
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Shinji Taniguchi, Tokihiro Nishihara
  • Patent number: 8937425
    Abstract: Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations. The compensating structure may have multiple layers, one of which may have a stiffness that increases with increasing temperature and one of which may have a stiffness that decreases with increases in temperature.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: January 20, 2015
    Assignee: Sand 9, Inc.
    Inventors: David M. Chen, Jan H. Kuypers, Alexei Gaidarzhy, Guiti Zolfagharkhani
  • Publication number: 20140361664
    Abstract: An acoustic wave device includes: a piezoelectric film located on a substrate; a lower electrode and an upper electrode facing each other across the piezoelectric film; a temperature compensation film located on a surface, which is opposite to the piezoelectric film, of at least one of the lower electrode and the upper electrode and having a temperature coefficient of elastic constant opposite in sign to a temperature coefficient of elastic constant of the piezoelectric film; and an additional film located on a surface of the temperature compensation film opposite to the piezoelectric film and having an acoustic impedance greater than an acoustic impedance of the temperature compensation film.
    Type: Application
    Filed: May 12, 2014
    Publication date: December 11, 2014
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Shinji TANIGUCHI, Tokihiro NISHIHARA
  • Patent number: 8884499
    Abstract: A piezoelectric element includes a substrate, a lower electrode layer, a piezoelectric layer, and an upper electrode layer. The lower electrode layer is fixed to the substrate and the piezoelectric layer is formed on the lower electrode layer. The upper electrode layer is formed on piezoelectric layer. The lower electrode layer contains pores therein and has a larger thermal expansion coefficient than the piezoelectric layer.
    Type: Grant
    Filed: August 6, 2012
    Date of Patent: November 11, 2014
    Assignee: Panasonic Corporation
    Inventors: Toshinari Noda, Takashi Kubo, Hisao Suzuki, Naoki Wakiya, Naonori Sakamoto
  • Publication number: 20140320988
    Abstract: A polymer device includes: a pair of electrode layers; a polymer layer inserted between the pair of electrode layers; and an expansion-contraction suppression layer arranged between the pair of electrode layers, the expansion-contraction suppression layer being arranged away from the respective electrode layers, and the expansion-contraction suppression layer being configured to suppress expansion and contraction of the polymer layer.
    Type: Application
    Filed: April 15, 2014
    Publication date: October 30, 2014
    Applicant: Sony Corporation
    Inventors: Nobuyuki NAGAI, Takehisa ISHIDA, Yusaku KATO, Hideo KAWABE, Masayoshi MORITA
  • Publication number: 20140313866
    Abstract: A temperature-compensated resonator including a body used in deformation, a core of the body being formed by ceramic. At least one part of the body includes a coating whose Young's modulus variation with temperature is of an opposite sign to that of the ceramic used for the core, so that at least the first order frequency variation with temperature of the resonator is substantially zero frequency.
    Type: Application
    Filed: October 11, 2012
    Publication date: October 23, 2014
    Applicant: The Swatch Group Research and Development Ltd.
    Inventors: Thierry Hessler, Philippe Dubois, Thierry Conus
  • Publication number: 20140306580
    Abstract: Aspects of the subject disclosure include, for example, constructing a mechanical resonating structure by applying an active layer on a surface of a compensating structure, wherein the compensating structure comprises one or more materials having an adaptive resistance to deform that reduces a variance in a resonating frequency of the mechanical resonating structure, wherein at least the active layer and the compensating structure form a mechanical resonating structure having a plurality of layers of materials, and wherein a thickness of each of the plurality of layers of materials results in a plurality of thickness ratios therebetween. Other embodiments are disclosed.
    Type: Application
    Filed: February 11, 2014
    Publication date: October 16, 2014
    Applicant: Sand 9, Inc.
    Inventors: Florian Thalmayr, Jan H. Kuypers, Klaus Juergen Schoepf
  • Patent number: 8857041
    Abstract: An electromechanical transducer includes a first electromagnetic element and a second electromagnetic element, such as electrodes, disposed opposite to each other with a sealed cavity therebetween. The sealed cavity is formed by removing a sacrifice layer and then performing sealing. A sealing portion is formed by superposing a film of a hardened second sealing material that has fluidity at normal temperature on a film of a first sealing material that does not have fluidity at normal temperature.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: October 14, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yuichi Masaki, Yoshihiro Hasegawa
  • Publication number: 20140292150
    Abstract: An acoustic resonator comprises: an acoustic resonator device comprises: a composite first electrode disposed over a substrate, the composite first electrode comprising: a first electrically conductive layer provided over the substrate; a first interlayer disposed on the first electrical conductive layer; a buried temperature compensation layer disposed over the first interlayer; a second interlayer disposed over the temperature compensation layer; a second electrically conductive layer disposed over the second interlayer, a piezoelectric layer disposed over the composite first electrode; and a second electrode disposed over the piezoelectric layer.
    Type: Application
    Filed: September 27, 2013
    Publication date: October 2, 2014
    Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Qiang Zou, Donald Lee, Martha K. Small, Frank Bi, Tina L. Lamers, Richard C. Ruby
  • Publication number: 20140292153
    Abstract: A resonator device comprising a piezoelectric material and at least one electrode, the device also provided with a material with a positive coefficient of stiffness, wherein the material is disposed in the device as an electrode or as a separate layer adjacent the piezoelectric material formed as one or more layers in the device. The material that performs the temperature compensating function is selected from the group consisting of ferromagnetic metal alloys, shape-memory metal alloys, and polymers, wherein the selected material has a temperature coefficient that varies with the relative amounts of the individual constituents of the compositions and wherein the composition is selected to provide the material with the positive coefficient of stiffness.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 2, 2014
    Applicant: CYMATICS LABORATORIES CORP.
    Inventors: Rajarishi Sinha, David Francois Guillou
  • Publication number: 20140292152
    Abstract: A resonator device in which a piezoelectric material is disposed between two electrodes. At least one of the electrodes is formed of a nickel-titanium alloy having equal portions nickel and titanium.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 2, 2014
    Applicant: Cymatics Laboratories Corp.
    Inventors: Peter Ledel Gammel, Marco Mastrapasqua, Hugo Safar, Rajarishi Sinha
  • Publication number: 20140292149
    Abstract: An acoustic resonator device comprises: a substrate comprising a cavity or an acoustic mirror; a first electrode disposed over the substrate; a piezoelectric layer disposed over the first electrode; and a second electrode disposed over the piezoelectric layer. The first electrode or the second electrode, or both, are made of an electrically conductive material having a positive temperature coefficient.
    Type: Application
    Filed: March 28, 2013
    Publication date: October 2, 2014
    Inventors: Qiang ZOU, Richard C. RUBY, Donald LEE, Zhiqiang BI, Martha K. SMALL, Kristina LAMERS
  • Patent number: 8810104
    Abstract: A surface acoustic wave device includes a piezoelectric substrate, at least one interdigital transducer (IDT) electrode provided on the piezoelectric substrate, and an insulator layer to improve a temperature characteristic arranged so as to cover the IDT electrode. When a surface of the insulator layer is classified into a first surface region under which the IDT electrode is positioned and a second surface region under which no IDT electrode is positioned, the surface of the insulator layer in at least one portion of the second surface region is higher than the surface of the insulator layer from the piezoelectric substrate in at least one portion of the first surface region by at least about 0.001?, where the wavelength of an acoustic wave is ?.
    Type: Grant
    Filed: May 17, 2010
    Date of Patent: August 19, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shunsuke Kido, Takeshi Nakao, Yasuharu Nakai, Kenji Nishiyama, Michio Kadota
  • Publication number: 20140219067
    Abstract: The invention relates to a thermocompensated resonator comprising a body used in deformation, the core of the body being formed by a first material. According to the invention, at least one part of the body comprises at least one coating made of shape-memory metal, the variations in the Young's modulus of which as a function of the temperature (CTE) are of opposite sign to those (CTE) of the first material used for the core so as to allow said resonator to have a frequency variation as a function of the temperature which is substantially zero at least to the first order (?, ?).
    Type: Application
    Filed: February 3, 2014
    Publication date: August 7, 2014
    Applicant: The Swatch Group Research and Development Ltd
    Inventor: Thierry HESSLER
  • Patent number: 8791766
    Abstract: A piezoelectric resonating element includes a piezoelectric substrate having a rectangular vibrating portion and a thick-walled portion, excitation electrodes and, and lead electrodes. The thick-walled portion includes a fourth thick-walled portion, a third thick-walled portion, a first thick-walled portion, and a second thick-walled portion. The third thick-walled portion includes a third slope portion and a third thick-walled body, and at least one slit is formed in the third thick-walled portion.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: July 29, 2014
    Assignee: Seiko Epson Corporation
    Inventors: Osamu Ishii, Shiro Murakami
  • Publication number: 20140159548
    Abstract: An acoustic resonator structure includes an acoustic reflector over a cavity formed in a substrate, the acoustic reflector including a layer of low acoustic impedance material stacked on a layer of high acoustic impedance material. The acoustic resonator further includes a bottom electrode on the layer of low acoustic impedance material, a piezoelectric layer on the bottom electrode, a top electrode on the piezoelectric layer, and a collar formed outside a main membrane region defined by an overlap between the top electrode, the piezoelectric layer and the bottom electrode. The collar has an inner edge substantially aligned with a boundary of or overlapping the main membrane region. The layer of the low acoustic impedance material includes a temperature compensating material having a positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer, the bottom electrode and the top electrode.
    Type: Application
    Filed: November 27, 2013
    Publication date: June 12, 2014
    Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Dariusz Burak, John Choy, Kevin J. Grannen, Qiang Zou
  • Patent number: 8749123
    Abstract: A piezoelectric device has a plate-shaped substrate, a first frame defining a first concave portion at one surface of the substrate, a second frame defining a second concave portion at the other surface of the substrate, a first electrode member provided at one surface of the substrate, a second electrode member provided at the other surface of the substrate, a piezoelectric unit in which a first electrode section of the piezoelectric vibration plate is fixed to the first electrode member by a conductive binder, a cover sealing the first concave portion, and a temperature detection unit in which a second electrode section of the thermistor element is fixed to the second electrode member by a conductive joining material.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: June 10, 2014
    Assignee: Kyocera Kinseki Corporation
    Inventors: Yoichi Muraki, Tomohiro Ohya, Atsushi Muraoka, Hiroyuki Miura
  • Publication number: 20140152152
    Abstract: An acoustic resonator structure includes a bottom electrode disposed on a substrate, a piezoelectric layer disposed on the bottom electrode, a top electrode disposed on the piezoelectric layer, a cavity disposed beneath the bottom electrode, and a temperature compensating feature. The temperature compensating feature has a positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric and electrode layers. The acoustic resonator structure further includes an acoustic reflector disposed over the substrate around a perimeter of the cavity. The acoustic reflector includes a layer of low acoustic impedance material stacked on a layer of high acoustic impedance material.
    Type: Application
    Filed: November 27, 2013
    Publication date: June 5, 2014
    Applicant: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
    Inventors: Dariusz Burak, John Choy, Kevin J. Grannen, Phil Nikkel
  • Patent number: 8736145
    Abstract: A micro or nano electromechanical transducer device formed on a semiconductor substrate comprises a movable structure which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure having at least one mechanical layer having a first thermal response characteristic, at least one layer of the actuating structure having a second thermal response characteristic different to the first thermal response characteristic, and a thermal compensation structure having at least one thermal compensation layer. The thermal compensation layer is different to the at least one layer and is arranged to compensate a thermal effect produced by the mechanical layer and the at least one layer of the actuating structure such that the movement of the movable structure is substantially independent of variations in temperature.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: May 27, 2014
    Assignees: Freescale Semiconductor, Inc., Commissariar á l'Energie Atomique at aux Energies Alternatives (CEA)
    Inventors: Lianjun Liu, Sergio Pacheco, Francois Perruchot, Emmanuel Defay, Patrice Rey
  • Publication number: 20140132116
    Abstract: An acoustic wave device includes: a substrate; a piezoelectric film located on the substrate; a lower electrode and an upper electrode facing each other across the piezoelectric film, at least one of the lower electrode and the upper electrode including a first conductive film and a second conductive film formed on the first conductive film; an insulating film sandwiched between the first conductive film and the second conductive film and having a temperature coefficient of an elastic constant opposite in sign to a temperature coefficient of an elastic constant of the piezoelectric film; and a third conductive film formed on edge surfaces of the insulating film and the second conductive film and causing electrical short circuits between the first conductive film and the second conductive film.
    Type: Application
    Filed: October 31, 2013
    Publication date: May 15, 2014
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Shinji TANIGUCHI, Tokihiro NISHIHARA
  • Patent number: 8724431
    Abstract: A temperature-compensated resonator includes a body used in deformation, wherein the core (58, 58?, 18) of the body (3, 5, 7, 15, 23, 25, 27, 33, 35, 37, 43, 45, 47) is formed from a plate formed at a cut angle (??) in a quartz crystal determining the first and second orders temperature coefficients (?, ?, ??, ??). According to the invention, the body (3, 5, 7, 15, 23, 25, 27, 33, 35, 37, 43, 45, 47) includes a coating (52, 54, 56, 52?, 54?, 56?, 16) deposited at least partially on the core (58, 58?, 18) and having first and second orders Young's modulus variations (CTE1, CTE2, CTE1?, CTE2?) according to temperature of opposite signs respectively to the first and second orders temperature coefficients (?, ?, ??, ??) of the resonator so as to render compensated first and second orders temperature coefficients substantially zero.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: May 13, 2014
    Assignee: The Swatch Group Research and Development Ltd
    Inventors: Thierry Hessler, Silvio Dalla Piazza
  • Patent number: 8723468
    Abstract: A motor having a first portion configured to turn in a forward direction, a second portion coaxially mirrors the first portion; and a central fan between the first and second portions, and forcing air through the portions. A thermoelectric cooler element, thermally coupled to the portion is configured to cool the motor. A motor controller is electrically coupled to the first and second portions, and operates a portion in response to a condition sensed by the motor controller. The condition sensed by the motor controller is a motor torque, a motor speed, a motor casing temperature, or a zoned motor casing temperature. A method includes detecting a motor operational command; selecting a motor operational state using motor portion responsive to the motor command; sensing a heating state of a motor portion; and providing a cooling state to the motor portion responsive to the heating state.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: May 13, 2014
    Assignee: Aurora Office Equipment Co., Ltd.
    Inventor: John O'Rourke
  • Publication number: 20140117815
    Abstract: A temperature compensated bulk acoustic wave (BAW) resonator device has low trim sensitivity for providing an accurate resonant frequency. The BAW resonator device includes a first electrode deposited on a substrate, a piezoelectric layer deposited on the first electrode, a second electrode deposited on the piezoelectric layer, and a mirror pair deposited on the second electrode. At least one of the first electrode and the second electrode includes an electrode layer, and a temperature compensating layer configured to compensate for a temperature coefficient of at least the piezoelectric layer.
    Type: Application
    Filed: October 26, 2012
    Publication date: May 1, 2014
    Applicant: Avago Technologies General IP (Singapore) Pte. Ltd
    Inventors: Zhiqiang BI, Richard C. Ruby
  • Patent number: 8710716
    Abstract: An actuator includes: a diaphragm having a thickness equal to or greater than 0.5 ?m and equal to or less than 20 ?m; a piezoelectric body layer which is provided on a first surface side of the diaphragm, and receives stress from the diaphragm; a pair of electrodes which is provided on the first surface side of the diaphragm together with the piezoelectric body layer, and is mutually opposing via the piezoelectric body layer; and a stress adjusting layer which is provided on a second surface side of the diaphragm on an opposite side to the first surface of the diaphragm, and receives stress from the diaphragm in a same direction as the stress that the piezoelectric body layer receives from the diaphragm.
    Type: Grant
    Filed: February 22, 2011
    Date of Patent: April 29, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Takamichi Fujii, Yasutoshi Hirabayashi
  • Patent number: 8698378
    Abstract: An ultrasonic transducer for use in a fluid medium includes at least one piezoelectric transducer element, at least one matching body for the promotion of a vibrational coupling between the piezoelectric transducer element and the fluid medium, and at least one compensating body situated between the piezoelectric transducer element and the matching body for the reduction of thermal stresses, the compensating body having a coefficient of thermal expansion that is between a coefficient of thermal expansion of the piezoelectric transducer element and a coefficient of thermal expansion of the matching body.
    Type: Grant
    Filed: November 26, 2009
    Date of Patent: April 15, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Roland Mueller, Gerhard Hueftle, Michael Horstbrink, Tobias Lang, Sami Radwan, Bernd Kuenzl, Roland Wanja