Electrode Arrangement Patents (Class 310/365)
  • Patent number: 11569790
    Abstract: Methods for forming a film bulk acoustic resonator (FBAR) are provided. In the method, formation of several mutually overlapped and hence connected sacrificial material layers above and under a resonator sheet facilitates the removal of the sacrificial material layers. Cavities left after the removal overlap at a polygonal area with non-parallel sides. This reduces the likelihood of boundary reflections of transverse parasitic waves causing standing wave resonance in the FBAR, thereby enhancing its performance in parasitic wave crosstalk. Further, according to the disclosure, the FBAR is enabled to be integrated with CMOS circuitry and hence exhibits higher reliability.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: January 31, 2023
    Assignee: Ningbo Semiconductor International Corporation
    Inventor: Xiaochuan Wang
  • Patent number: 11566952
    Abstract: The present disclosure provides a tensile force detecting device including a piezoelectric element to generate an electrical signal by a load, the elastic thread connected to the piezoelectric element to support the load applied to the piezoelectric element, and a sewing thread connected to the piezoelectric element to transmit the load to the piezoelectric element.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: January 31, 2023
    Assignee: Korea Institute of Science and Technology
    Inventors: Youngsu Cha, Hojoon Kim
  • Patent number: 11569795
    Abstract: A resonator device includes a quartz crystal substrate, a resonator element including a first excitation electrode arranged on a first surface of the quartz crystal substrate, a second excitation electrode arranged on a second surface of the quartz crystal substrate in opposition to the first excitation electrode, and first and second pad electrodes that are arranged on the first surface and are coupled to the first and second excitation electrodes, a base including a substrate and first and second interconnects arranged on the substrate, a first bonding member bonding the first pad electrode to the first interconnect, and a second bonding member bonding the second pad electrode to the second interconnect. The first and second bonding members are arranged such that a first imaginary line that passes through a centroid of the resonator element and is parallel to an X axis is interposed between the first and second bonding members.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: January 31, 2023
    Assignee: Seiko Epson Corporation
    Inventors: Atsushi Matsuo, Shinya Aoki, Byonhaku Yu, Ryuta Nishizawa
  • Patent number: 11559389
    Abstract: An artificial tongue is provided. The artificial tongue includes tongue tissue formed by a bioprinting process, an antenna embedded within the tongue tissue and configured to wirelessly receive power from an external device, a processor embedded within the tongue tissue and operatively coupled to the antenna, and a piezoelectric element embedded within the tongue tissue and operatively coupled to the processor. The piezoelectric element is configured to deform in response to an applied electric bias, and the processor is configured to cause the electric bias to be applied to the piezoelectric element based on the power received by the antenna.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: January 24, 2023
    Assignee: International Business Machines Corporation
    Inventors: Abhidip Ray, Olivi Roy Chowdhury, Sarbajit K. Rakshit
  • Patent number: 11538982
    Abstract: A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: December 27, 2022
    Assignee: FUJIFILM Healthcare Corporation
    Inventors: Hidetsugu Katsura, Yoshihiro Tahara, Kazuhiro Kobayashi
  • Patent number: 11534796
    Abstract: An ultrasonic transducer includes a carrier with a first surface and a second surface which are opposite to each other, a piezoceramic element attached on the first surface of the carrier, a first acoustic matching layer with a third surface and a fourth surface which are opposite to each other, the third surface is attached on the second surface of the carrier, wherein the first acoustic matching layer includes a mesh with openings, and the thickness of first acoustic matching layer is smaller than ¼ wavelength of an ultrasonic wave emitted by the piezoceramic element in the first acoustic matching layer in an operating frequency, and a total area of the openings of mesh is larger than 30% area of the third surface of first acoustic matching layer, and a second acoustic matching layer disposed on the fourth surface of the first acoustic matching layer.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: December 27, 2022
    Assignee: Unictron Technologies Corporation
    Inventors: Lung Chen, Yi-Ting Su, San-Tang Chen, Tsung-Shou Yeh, Ming-Chu Chang
  • Patent number: 11522121
    Abstract: A tactile reproduction device, a method for driving the same, and a tactile reproduction apparatus. Tactile reproduction device may simulate textures to implement tactile reproduction. tactile reproduction device includes a plurality of piezoelectric units, includes: first electrode, piezoelectric section, and second electrode which are laminated, wherein the second electrode includes: first comb electrode and second comb electrode; the first comb electrode includes: a plurality of first comb-teeth electrodes and a first comb-shank electrode connecting the plurality of first comb-teeth electrodes; the second comb electrode includes: a plurality of second comb-teeth electrodes and a second comb-shank electrode connecting the plurality of second comb-teeth electrodes; the plurality of first comb-teeth electrodes and the plurality of second comb-teeth electrodes are mutually intersected; the first electrode includes a plurality of electrode units which are not connected to each other.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: December 6, 2022
    Assignee: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
    Inventors: Hui Hua, Yuju Chen, Xiaofeng Yin
  • Patent number: 11522515
    Abstract: An acoustic wave device includes a piezoelectric substrate, a pair of interleaved interdigital transducer electrodes disposed on the piezoelectric substrate, and a dielectric film including silicon oxynitride covering the pair of interleaved interdigital transducer electrodes. The dielectric film exhibits a temperature coefficient of velocity of substantially zero throughout an operating temperature range of the acoustic wave device of between ?55° C. and 125° C.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: December 6, 2022
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Satoru Matsuda, Atsushi Nishimura, Yoshiro Kabe
  • Patent number: 11515464
    Abstract: There is provided a piezoelectric actuator, including: a vibration plate; a first piezoelectric body; a second piezoelectric body; a first electrode disposed on a first surface of the first piezoelectric body; a second electrode disposed on a second surface of the second piezoelectric body; an intermediate electrode disposed on an intermediate surface of the first piezoelectric body and overlapping with the first and second electrodes; an intermediate trace connected to the intermediate electrode on the intermediate surface and drawn out to one side in a first direction beyond the first piezoelectric body and the second piezoelectric body; a first trace overlapping with the intermediate trace in the thickness direction and being conducted with the intermediate trace; and a second trace overlapping with the intermediate trace in the thickness direction and being conducted with the intermediate trace.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: November 29, 2022
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Toru Kakiuchi
  • Patent number: 11508902
    Abstract: A method of manufacturing a semiconductor device includes: forming a first substrate includes a membrane stack over a first dielectric layer, the membrane stack having a first electrode, a second electrode over the first electrode and a piezoelectric layer between the first electrode and the second electrode, a third electrode over the first dielectric layer, and a second dielectric layer over the membrane stack and the third electrode; forming a second substrate, including: a redistribution layer (RDL) over a third substrate, the RDL having a fourth electrode; and a first cavity on a surface of the RDL adjacent to the fourth electrode; forming a second cavity in one of the first substrate and the second substrate; and bonding the first substrate to the second substrate.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: November 22, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yi Heng Tsai, Fu-Chun Huang, Ching-Hui Lin, Chun-Ren Cheng
  • Patent number: 11495731
    Abstract: A piezoelectric actuator assembly is described. The assembly including a first layer including a top and a bottom surfaces. The assembly including a second layer having a top and a bottom surfaces, the bottom surface of the second layer is disposed over the top surface of the first layer. The assembly including a third layer having a top and a bottom surfaces, the bottom surface of the third layer is disposed over the top surface of the second layer. The assembly includes a first electrode, a second electrode, a third electrode, and a fourth electrode. The third electrode is configured to be shorter than the second electrode such that the active PZT length of the second layer and the third layer is shorter than the active PZT length of the first layer.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: November 8, 2022
    Assignee: Magnecomp Corporation
    Inventors: Long Zhang, Kuen Chee Ee, David Glaess, Peter Hahn, Johnathan Phu
  • Patent number: 11487389
    Abstract: The present disclosure provides a fingerprint recognition module, a driving method thereof, a manufacturing method thereof, and a display device. The fingerprint recognition module includes a receiving electrode layer, a piezoelectric material layer, and a driving electrode layer. The receiving electrode layer includes a plurality of receiving electrodes arranged in an array along a first direction and a second direction. The piezoelectric material layer is disposed on a side of the receiving electrode layer. The driving electrode layer is disposed on a side of the piezoelectric material layer remote from the receiving electrode layer and includes a plurality of driving electrodes arranged along the second direction. Each driving electrode is a strip electrode extending along the first direction, and overlaps with multiple receiving electrodes arranged along the first direction.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: November 1, 2022
    Assignee: Beijing BOE Technology Development Co., Ltd.
    Inventors: Yuzhen Guo, Yingming Liu, Haisheng Wang, Peixiao Li, Chenyang Zhang, Xiufeng Li, Lijun Zhao, Yanling Han
  • Patent number: 11426143
    Abstract: Vertical packaging configurations for ultrasound chips are described. Vertical packaging may involve use of integrated interconnects other than wires for wire bonding. Examples of such integrated interconnects include edge-contact vias, through silicon vias and conductive pillars. Edge-contact vias are vias defined in a trench formed in the ultrasound chip. Multiple vias may be provided for each trench, thus increasing the density of vias. Such vias enable electric access to the ultrasound transducers. Through silicon vias are formed through the silicon handle and provide access from the bottom surface of the ultrasound chip. Conductive pillars, including copper pillars, are disposed around the perimeter of an ultrasound chip and provide access to the ultrasound transducers from the top surface of the chip. Use of these types of packaging techniques can enable a substantial reduction in the dimensions of an ultrasound device.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: August 30, 2022
    Assignee: BFLY OPERATIONS, INC.
    Inventors: Keith G. Fife, Jianwei Liu
  • Patent number: 11402282
    Abstract: Provided is a piezoelectric substrate including: an elongate conductor; and an elongate first piezoelectric material helically wound in one direction around the conductor, in which the first piezoelectric material includes an optically active helical chiral polymer (A), the lengthwise direction of the first piezoelectric material and the principal orientation direction of the helical chiral polymer (A) included in the first piezoelectric material are substantially parallel to each other, and the first piezoelectric material has an orientation degree of F. in a range of from 0.5 to less than 1.0, determined from X-ray diffraction measurement by the following Formula (a): orientation degree F.=(180°??)/180°??(a) (in Formula (a), ? represents a half width of a peak derived from orientation).
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: August 2, 2022
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Mitsunobu Yoshida, Kazuhiro Tanimoto, Katsuki Onishi, Shigeo Nishikawa
  • Patent number: 11367827
    Abstract: A piezoelectric substrate, comprising: a conductor cord that has a core material and a conductor disposed around the core material; and an elongated piezoelectric body that is disposed around the conductor cord in a spiral manner, unidirectionally along an axial direction of the conductor cord, wherein: the piezoelectric body comprises an optically active helical chiral polymer, a lengthwise direction of the piezoelectric body and a main orientation direction of the helical chiral polymer in the piezoelectric body are substantially parallel to each other, the piezoelectric body has an orientation degree F. of from 0.5 to less than 1.0, and the conductor cord satisfies Formula (b): ?Dmax<tpmin, wherein ?Dmax is a maximum value of a difference in height between a division A that is selected from plural divisions and a division B that is adjacent to the division A, and tpmin is a minimum thickness of the piezoelectric body.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: June 21, 2022
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Mitsunobu Yoshida, Katsuki Onishi, Kazuhiro Tanimoto
  • Patent number: 11367828
    Abstract: An actuator device includes: an actuator including piezoelectric elements arranged in a first direction and first contacts arranged in the first direction; a protector including a first wall opposed to the piezoelectric elements and a second wall coupled to the first wall and joined to a region of the actuator at which the first contacts are disposed; first connection terminals disposed on the first; and first through electrodes formed in the second wall to bring the first contacts and the first connection terminals into conduction with each other. A distance between two of the first through electrodes which respectively correspond to two of the piezoelectric elements which are adjacent to each other in the first direction is greater than a distance in the first direction between the two of the piezoelectric elements which are adjacent to each other in the first direction.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: June 21, 2022
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Toru Kakiuchi, Yasuo Kato, Rui Wang, Yuichi Ito
  • Patent number: 11289641
    Abstract: A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: March 29, 2022
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Wei Xiong, Atsushi Iijima
  • Patent number: 11253996
    Abstract: A method of manufacturing an electrode assembly includes positioning a layer stack comprising an electrode positioned between an electrode insulator and a support polymer in a vacuum bag, removing air from the vacuum bag thereby vacuum coupling the electrode to the electrode insulator, and removing the layer stack from the vacuum bag, where upon removal of the layer stack from the vacuum bag, the electrode remains vacuum coupled to the electrode insulator and the electrode insulator is in direct contact with the electrode, thereby forming an electrode assembly.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: February 22, 2022
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Michael P. Rowe, Ryohei Tsuruta
  • Patent number: 11233190
    Abstract: A piezoelectric transformer that includes a vibration portion assembly having an output electrode, an output-side intermediate electrode, an input-side intermediate electrode, and an input electrode. The vibration portion assembly includes n vibration portions. The input electrode includes one to n input electrode pieces. The output electrode includes one to n output electrode pieces. Wiring lines are arranged such that voltages of opposite phases can be respectively applied to a first input electrode piece group of the input electrode pieces corresponding to odd-numbered vibration portions, and a second input electrode piece group of the input electrode pieces corresponding to even-numbered vibration portions. The second output electrode piece and the first output-side intermediate electrode piece are superposed with each other in the thickness direction.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: January 25, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinsuke Ikeuchi, Yoichi Mochida, Kansho Yamamoto, Takuo Hada, Hideya Horiuchi
  • Patent number: 11213133
    Abstract: A dielectric elastomer driving sensor system includes: a dielectric elastomer transducer portion including a dielectric elastomer layer and a pair of electrode layers that sandwich the dielectric elastomer layer, where the pair of electrode layers include a driving region and a sensor region that are partitioned from each other; a power supply unit that applies a voltage to the driving region; a detection unit that detects a change in capacitance in the sensor region; and a control unit that controls the power supply unit and the detection unit. With this configuration, both the driving function and the sensor function can be performed.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: January 4, 2022
    Assignees: ZEON CORPORATION
    Inventors: Seiki Chiba, Mikio Waki, Hironobu Kondo, Masahiro Ishikawa, Keiji Osugi
  • Patent number: 11192364
    Abstract: An electro-mechanical transducer includes a diaphragm plate on a substrate, a first electrode on the diaphragm plate, an electro-mechanical transducer film on the first electrode, and a second electrode on the electro-mechanical transducer film. One of the first electrode and the second electrode is a common electrode. Another of the first electrode and the second electrode is an individual electrode. At least a portion of the common electrode is laminated on and in contact with the diaphragm plate. The common electrode has a plurality of holes penetrating the common electrode in a lamination direction.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: December 7, 2021
    Assignee: RICOH COMPANY, LTD.
    Inventor: Keishi Miwa
  • Patent number: 11121647
    Abstract: An electrical connection structure for connecting a piezoelectric element and an electrical circuit to each other with a conductive adhesive is described. The electrical connection structure includes an epoxy, a conductive component surrounded by the epoxy, and a trace feature implemented on top of the electrical connection structure.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: September 14, 2021
    Assignee: Magnecomp Corporation
    Inventors: Kuen Chee Ee, Peter Hahn, David Glaess, Keith A. Vanderlee
  • Patent number: 10944041
    Abstract: A hybrid ultrasonic transducer and a method of manufacturing the same are provided. A method of manufacturing a semiconductor device includes the forming of a first substrate and a second substrate. The forming of the first substrate includes: depositing a membrane stack over a first dielectric layer; forming a third electrode over the first dielectric layer; and depositing a second dielectric layer over the membrane stack and the third electrode. The forming of the second substrate includes: forming a redistribution layer (RDL) having a fourth electrode; and etching a first cavity on a surface of the RDL adjacent to the fourth electrode. The method further includes: forming a second cavity in one of the first substrate and the second substrate; and bonding the first substrate to the second substrate.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: March 9, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yi Heng Tsai, Fu-Chun Huang, Ching-Hui Lin, Chun-Ren Cheng
  • Patent number: 10881418
    Abstract: The present disclosure relates to electrically controllable surgical tools. In general, surgical devices are provided having an electrically controllable, fingered operating end for use in angiography, endovascular and/or neurological surgery. The finger(s) at the operating end can be made from ionic polymer metal composite (IPMC) material to facilitate control of the finger(s).
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: January 5, 2021
    Assignee: Maine Medical Center
    Inventors: Robert D. Ecker, Mohsen Shahinpoor
  • Patent number: 10866155
    Abstract: A method for manufacturing a pressure-sensitive sensor includes providing an extruder that includes a cylindrical die, a mandrel arranged inside the die and having plural helical grooves on an outer circumferential surface, and an annular outlet sandwiched between the die and the mandrel, and by using the extruder, performing simultaneous extrusion-molding of an elastic insulating material and an elastic conductive material by supplying the elastic conductive material into not less than two of the grooves from the inside of the mandrel while extruding the elastic insulating material, so as to form a pressure-sensitive sensor. The sensor includes a tubular body including an elastic insulation and having a hollow portion along a longitudinal direction, and not less than two conductive ribs including an elastic conductor and helically provided along an inner circumferential surface of the hollow portion of the tubular body so as to protrude inward from the inner circumferential surface.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: December 15, 2020
    Assignee: Hitachi Metals, Ltd.
    Inventors: Keisuke Sugita, Masahiro Abe
  • Patent number: 10862448
    Abstract: A piezoelectric thin film resonator includes: a substrate; a piezoelectric film located on the substrate; a lower electrode and an upper electrode facing each other across at least a part of the piezoelectric film; and a wiring layer located on the upper electrode, the wiring layer having a thickness equal to or greater than 0.8 ?m and equal to or less than 3.0 ?m, at least a part of the wiring layer overlapping in plan view with a resonance region in which the lower electrode and the upper electrode face each other across the piezoelectric film, a distance between an outline of the resonance region and an edge of a lower surface located within the resonance region and farthest from the outline being greater than 0 ?m and less than 2 ?m.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: December 8, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yoshiyuki Yagami, Ryuichi Okamura, Yoshiaki Takaoka
  • Patent number: 10814625
    Abstract: A liquid ejecting head includes a flow path forming substrate in which a pressure generating chamber which communicates with a nozzle which ejects a liquid is formed by a partitioning wall, and a piezoelectric actuator in which a first electrode, a piezoelectric layer, and a second electrode are laminated, in which the piezoelectric layer includes a region which is interposed between the first electrode and the second electrode in a lamination direction, and in which when viewed in plan view from the lamination direction, the region overlaps at least a portion of the edges of each side of an opening of the pressure generating chamber on the piezoelectric actuator side and does not overlap one of the first electrode and the second electrode in at least a portion of the opening.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: October 27, 2020
    Assignee: Seiko Epson Corporation
    Inventor: Shiro Yazaki
  • Patent number: 10756700
    Abstract: A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: August 25, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Han, Jae Chang Lee, Won Han, Tae Yoon Kim, Jong Woon Kim, Tae Kyung Lee, Moon Chul Lee, Tae Hun Lee, Sung Min Cho, In Young Kang
  • Patent number: 10622148
    Abstract: A multi-layer ceramic capacitor includes: a multi-layer unit including a capacitance forming unit including internal electrodes laminated in a first direction, a drawn portion extending from the capacitance forming unit in a second direction, and a cover that covers the capacitance forming unit and the drawn portion in the first direction, the multi-layer unit having a main surface facing in the first direction, an end surface facing in the second direction, and a side surface facing in a third direction; and a side margin provided to the side surface, the side surface including a first straight portion including an outer edge of the main surface and extending in the second direction, a second straight portion including an outer edge of the end surface and extending in the first direction, and a corner portion that connects the first and second straight portions with each other, the corner portion being curved.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: April 14, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Ryo Ono, Tetsuhiko Fukuoka, Shoji Kusumoto, Akihiko Kono
  • Patent number: 10608608
    Abstract: A method for fabricating bulk acoustic wave resonator with mass adjustment structure, comprising following steps of: forming a sacrificial structure mesa on a substrate; etching the sacrificial structure mesa such that any two adjacent parts have different heights, a top surface of a highest part of the sacrificial structure mesa is coincident with a mesa top extending plane; forming an insulating layer on the sacrificial structure mesa and the substrate; polishing the insulating layer to form a polished surface; forming a bulk acoustic wave resonance structure including a top electrode, a piezoelectric layer and a bottom electrode on the polished surface; etching the sacrificial structure mesa to form a cavity; the insulating layer between the polished surface and the mesa top extending plane forms a frequency tuning structure, the insulating layer between the mesa top extending plane and the cavity forms a mass adjustment structure.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: March 31, 2020
    Assignee: WIN SEMICONDUCTORS CORP.
    Inventors: Chia-Ta Chang, Chun-Ju Wei, Kuo-Lung Weng
  • Patent number: 10566914
    Abstract: A transducer that converts electrical energy to mechanical energy, the transducer includes a dielectric layer; a first electrode that is provided on one surface of the dielectric layer; and a second electrode that is provided on another surface of the dielectric layer. At least one of the first electrode and the second electrode becomes an insulator, before the dielectric layer suffers insulation breakdown by voltage that is applied between the first electrode and the second electrode.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: February 18, 2020
    Assignee: SONY CORPORATION
    Inventors: Shuji Fujita, Yukari Tsunoda, Satoshi Nakamaru
  • Patent number: 10498311
    Abstract: A crystal resonator includes a flat plate-shaped crystal element and excitation electrodes. The crystal element has principal surfaces parallel to an X?-axis and a Z?-axis. The X?-axis is an axis of rotating an X-axis in a range of 15 to 25 degrees around a Z-axis. The Z?-axis is an axis of rotating the Z-axis in a range of 33 to 35 degrees around the X?-axis. The excitation electrodes are formed on the respective principal. The excitation electrodes include a first region with a circular outer shape and a second region. The second region is formed at a peripheral area of the first region. The second region has a thickness thinner than the first region and has an elliptical outer shape. The elliptical shape has a long axis extending in a direction in a range of ?5 to +15 degrees with respect to a direction that the X?-axis extends.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: December 3, 2019
    Assignee: NIHON DEMPA KOGYO CO., LTD.
    Inventors: Shigeru Obara, Tetsuya Sato, Masaaki Nakahara, Tomonori Shibazaki, Yuki Oi, Yuya Nishimura
  • Patent number: 10484793
    Abstract: An electronic device such as a pair of headphones may be provided with left and right speakers for playing audio to a user. Control circuitry in the electronic device may play audio through the speakers in an unreversed configuration in which left channel audio is played through a first of the speakers that is adjacent to a left ear of the user and right channel audio is played through a second of the speakers that is adjacent to a right ear of the user or a reversed configuration in which these channel assignments are reversed. The headphones may have ear cups that house the speakers. Capacitive touch sensors, force sensors, and other sensors on the ear cups may measure ear shapes and finger grip positions on the ear cups to determine whether to operate in the unreversed or reversed configuration. Sensors may gather gestures and other user touch input.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: November 19, 2019
    Assignee: Apple Inc.
    Inventors: Jonathan R. Peterson, Daniel D. Sunshine, Yohji Hamada, Daniel A. Podhajny, Kathryn P. Crews, Jahan C. Minoo
  • Patent number: 10469049
    Abstract: A piezoelectric thin film resonator includes: an acoustic reflection layer including an air gap or an acoustic mirror; lower and upper electrodes facing each other in a stacking direction, at least a part of each of the lower and upper electrodes being located on or above the acoustic reflection layer; a piezoelectric film sandwiched between the lower and upper electrodes and including lower and upper piezoelectric films, at least a part of an end face of the piezoelectric film in a film thickness direction being located between outer outlines of the resonance region and the acoustic reflection layer in at least a part of a region surrounding a resonance region; and an insertion film inserted between the lower and upper piezoelectric films, located in at least a part of an outer peripheral region within the resonance region, and not located in a center region of the resonance region.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: November 5, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Jiansong Liu, Tsuyoshi Yokoyama, Hiroomi Kaneko, Shinji Taniguchi, Tokihiro Nishihara
  • Patent number: 10432166
    Abstract: A piezoelectric thin film resonator includes: a substrate; a piezoelectric film located on the substrate; lower and upper electrodes facing each other across at least a part of the piezoelectric film; a first insertion layer located between the lower and upper electrodes and located in at least a part of an outer peripheral region within a resonance region in which the lower and upper electrodes face each other across the piezoelectric film, the first insertion layer being not located in a center region of the resonance region; and a second insertion layer located between the lower and upper electrodes and located in at least a part of the outer peripheral region, the second insertion layer being not located in the center region, a position of an edge of the second insertion layer being different from a position of an edge of the first insertion film in the resonance region.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: October 1, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Jiansong Liu, Tokihiro Nishihara, Shinji Taniguchi
  • Patent number: 10416768
    Abstract: A bi-functional apparatus for sensing touch and delivering a haptic signal. The bi-functional apparatus comprises first and second electrodes. The first electrode provides a haptic interface for delivering an electrostatic force and has a top surface and a bottom surface. A dielectric insulator covers the top surface of the first electrode. A sensor is positioned between the bottom surface of the first electrode and the second electrode. The sensor selectively provides electrical conductivity between the first and second electrodes in response to at least a threshold amount of pressure exerted against the dielectric insulator. A method of sensing touch and delivering a haptic signal with a single device.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: September 17, 2019
    Assignee: Immersion Corporation
    Inventors: Vahid Khoshkava, Abdelwahab Hamam, Juan Manuel Cruz Hernandez
  • Patent number: 10401139
    Abstract: A sensing device, a method for fabrication thereof, and a method for operating the same are disclosed. The sensing device includes an upper harvester having a piezoelectric (PE) thin film layer, a pressure sensor having a first metallization layer forming a source region and a drain region, a piezoresistive (PR) thin film layer that provides a channel region permitting passage of charge carriers between the source region and the drain region, a second metallization layer forming a gate electrode and regulating flow of the charge carriers through the piezoelectric thin film layer in response to a strain on the PE thin film layer, and an insulating layer disposed between the PR thin film layer and the second metallization layer. In other embodiments, the device includes a lower harvesting including a PE thin film layer for harvesting electrical energy from the stress of a mechanical load on the device.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: September 3, 2019
    Assignee: United Arab Emirates University
    Inventors: Mahmoud F. Y. Al Ahmad, Areen Abdellah Romi Allataifeh
  • Patent number: 10381546
    Abstract: An object of the present invention is to provide a bimorph piezoelectric film that enables the production of touch panels and the like that are less influenced by pyroelectric noise due to temperature change, and exhibit high transparency. The present invention provides a bimorph piezoelectric film comprising in sequence a first piezoelectric film, a tackifier layer or an adhesive agent layer, and a second piezoelectric film, the first piezoelectric film and the second piezoelectric film being disposed in such a manner that their surfaces on which electric charges of the same polarity are generated by a temperature increase are each outward-facing, the first piezoelectric film and the second piezoelectric film each having a total light transmittance of 90% or more, and a total haze value of 8.0% or less.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: August 13, 2019
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Meiten Kou, Tetsuhiro Kodani, Tomoyuki Gotou, Saori Inaba, Takashi Kanemura
  • Patent number: 10231708
    Abstract: An ultrasound transducer that achieves broadband characteristics without degrading the sensitivity of the ultrasound transducer. Piezoelectric element (202) includes piezoelectric thin film (203), first electrode (204) that is disposed on a first surface of piezoelectric thin film (203) in a thickness direction of piezoelectric thin film (203), and second electrode (205) that is disposed on a second surface of piezoelectric thin film (203) in the thickness direction of piezoelectric thin film (203), and at least two of parameters of a spring constant, a viscosity coefficient, and a mass in an equivalent single damped oscillation model representing a structure of a diaphragm composed of each piezoelectric cell (200) are each set to a value that is different among the piezoelectric cells (200) such that a relationship between a driving frequency ratio and a phase in the diaphragm is substantially identical among the piezoelectric cells (200).
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: March 19, 2019
    Assignee: KONICA MINOLTA, INC.
    Inventor: Kenji Suzuki
  • Patent number: 10177732
    Abstract: A piezoelectric thin film resonator includes: a substrate; a piezoelectric film located on the substrate and having a Poisson's ratio of 0.33 or less; a lower electrode and an upper electrode facing each other across the piezoelectric film; and an insertion film that is located in the piezoelectric film or on a lower surface or an upper surface of the piezoelectric film in an outer peripheral region within a resonance region, in which the lower electrode and the upper electrode face each other across the piezoelectric film, and is not located in a center region of the resonance region, wherein at least one of the lower electrode, the piezoelectric film, and the upper electrode in the outer peripheral region within the resonance region is thinner than the at least one of the lower electrode, the piezoelectric film, and the upper electrode in the center region of the resonance region.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: January 8, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Tsuyoshi Yokoyama
  • Patent number: 10153749
    Abstract: A resonator element includes a substrate that vibrates in a thickness shear vibration, a first excitation electrode that is provided on one main surface of the substrate and has a shape in which at least three corners of a virtual quadrangle are cut out, and a second excitation electrode that is provided on the other main surface of the substrate, and a ratio (S2/S1) of an area S1 of the virtual quadrangle and an area S2 of the first excitation electrode satisfies a relationship of 69.2%?(S2/S1)?80.1%.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: December 11, 2018
    Assignee: Seiko Epson Corporation
    Inventor: Yusuke Yamamoto
  • Patent number: 10128431
    Abstract: A multi-level piezoelectric actuator is manufactured using wafer level processing. Two PZT wafers are formed and separately metallized for electrodes. The metallization on the second wafer is patterned, and holes that will become electrical vias are formed in the second wafer. The wafers are then stacked and sintered, then the devices are poled as a group and then singulated to form nearly complete individual PZT actuators. Conductive epoxy is added into the holes at the product placement step in order to both adhere the actuator within its environment and to complete the electrical via thus completing the device. Alternatively: the first wafer is metallized; then the second wafer having holes therethrough but no metallization is stacked and sintered to the first wafer; and patterned metallization is applied to the second wafer to both form electrodes and to complete the vias. The devices are then poled as a group, and singulated.
    Type: Grant
    Filed: June 20, 2015
    Date of Patent: November 13, 2018
    Assignee: Magnecomp Corporation
    Inventors: Christopher Dunn, Peter Hahn
  • Patent number: 10120485
    Abstract: An electronic device that provides a number of function modes and operates by selecting one of the function modes. The device includes an audio output unit and a wireless communication unit that execute functions for the function modes. Moreover, a deformation detecting unit that detects deformation of an exterior housing by an external force and a storage unit that stores a correspondence between a deformation pattern and a response operation registered per function mode. The device also includes an operation determining unit that detects the deformation pattern based on the deformation and a control executing unit that reads a response operation of a current function mode associated with the deformation pattern and controls operation states of the audio output unit and the wireless communication unit.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: November 6, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hidekazu Kano, Hiroaki Kitada, Takafumi Inoue
  • Patent number: 10097156
    Abstract: A resonance structure of bulk acoustic wave resonator comprises a bottom electrode, a dielectric layer and a top electrode, wherein the dielectric layer is formed on the bottom electrode; the top electrode is formed on the dielectric layer. A resonance area is defined by the overlapping area of the projection of the bottom electrode, the dielectric layer and the top electrode. The resonance area has a contour. The contour includes at least three curved edges and is formed by connecting the at least three curved edges. Each curved edge is concave to a geometric center of the contour.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: October 9, 2018
    Assignee: WIN SEMICONDUCTORS CORP.
    Inventors: Chia-Ta Chang, Re Ching Lin, Yung-Chung Chin, Chih-Feng Chiang
  • Patent number: 10032977
    Abstract: An inkjet printing head 1 includes a piezoelectric element 6 having a lower electrode 7, a piezoelectric film 8 formed above the lower electrode 7, and an upper electrode 9 formed above the piezoelectric film 8, a hydrogen barrier film 13 covering an entirety of a side surface of the upper electrode 9 and the piezoelectric film 8, and an interlayer insulating film 14 that has an opening 17 at an upper surface center of the upper electrode 9, is laminated on the hydrogen barrier film 13, and faces the entirety of the side surface of the upper electrode 9 and the piezoelectric film 8 across the hydrogen barrier film 13.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: July 24, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Yoshikazu Fujimori, Tomohiro Date
  • Patent number: 9905364
    Abstract: A multilayer ceramic electronic component includes a multilayer body including ceramic layers and inner electrode layers, the inner electrode layers being disposed on interfaces between the ceramic layers, and an outer electrode on an external surface of the multilayer body and electrically connected to first end portions of the inner electrode layers exposed to the external surface of the multilayer body. Each of the ceramic layers includes a thin portion with a continuously reducing thickness near the first end portion. Each inner electrode layer includes a thick portion near a connection with the outer electrode, the thick portion having a thickness continuously increasing toward the connection on a first side in accordance with a shape of the thin portion in the ceramic layer.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: February 27, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takahiro Hirao
  • Patent number: 9886135
    Abstract: The invention provides a capacitive touch panel that hardly cause malfunction in a wide range of temperature environment from a low temperature to a high temperature. The capacitive touch panel according to the invention is a capacitive touch panel including a display device, a lower adhesive layer, a capacitive touch panel sensor, an upper adhesive layer, and a protective substrate in this order, in which a maximum value of tan ? of the upper adhesive layer and a maximum value of tan ? of the lower adhesive layer obtained from a temperature dependency evaluation test is 0.08 or less, and tan ? of the lower adhesive layer at each temperature of every 20° C. from ?40° C. to 80° C. is equal to or less than tan ? of the upper adhesive layer.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: February 6, 2018
    Assignee: FUJIFILM Corporation
    Inventors: Shinya Ogikubo, Michihiro Shibata, Yasuhiro Mitamura
  • Patent number: 9842959
    Abstract: A Method for producing a microsystem (1) with pixels includes: producing a thermal silicon oxide layer on the surface of a silicon wafer as a base layer (5) by oxidation of the silicon wafer; producing a silicon oxide thin layer on the base layer as a carrier layer (6)by thermal deposition; producing a platinum layer on the carrier layer by thermal deposition, whereby an intermediate product is produced; cooling the intermediate product to room temperature; pixel-like structuring of the platinum layer by removing surplus areas of the platinum layer, whereby bottom electrodes (8, 12) of the pixels (7, 8) are formed in pixel shape on the carrier layer in remaining areas; removing material on the side of the silicon wafer facing away from the base layer, so a frame (3) remains and a membrane (4) formed by the base layer and the carrier layer is spanned by the frame.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: December 12, 2017
    Assignee: Pyreos, Ltd.
    Inventors: Carsten Giebeler, Neil Conway
  • Patent number: 9752907
    Abstract: An ultrasonic flowmeter includes a conduit for receiving a flow of a fluid and a flexible printed circuit board (FPC) including: a pair of ultrasonic transducers, wherein each transducer comprises a piezoelectric element divided into a plurality of segment electrodes and the FPC is bonded around the conduit; and a control circuit configured to sequentially activate the segment electrodes using a pulse train to cause at least one of the piezoelectric elements to emit a sonic signal. A delay time between activation of each successive segment electrode controls a phase velocity and an angle of emission of the corresponding sonic signal.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: September 5, 2017
    Inventor: Joseph Baumoel
  • Patent number: 9595660
    Abstract: A method of manufacturing an electromechanical transducer includes forming a first electrode on a substrate or a base film, forming a piezoelectric film made of lead zirconate titanate on the first electrode, forming a second electrode on the piezoelectric film, and polarizing the piezoelectric film. The polarizing includes applying to the second electrode a positive polarity voltage having a positive polarity relative to a potential of the first electrode, and satisfying a first expression of ?EcP?(?Ec)<0 and a second expression of |?EcP?(?Ec)|>0.15×EcPav, where ?Ec represents an initial coercive field of a negative polarity side of the electromechanical transducer, ?EcP represents a coercive field of the negative polarity side after the applying, EcP represents a coercive field of a positive polarity side after the applying, and EcPav represents an average of absolute values of the coercive field ?EcP and the coercive field EcP.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: March 14, 2017
    Assignee: RICOH COMPANY, LTD.
    Inventors: Yoshikazu Akiyama, Naoya Kondo, Satoshi Mizukami