Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.

Abstract: A method may comprise measuring, by a conductivity or resistance measuring device, the conductivity or resistance of a surface of a substrate; comparing, by the conductivity or resistance measuring device, the measured conductivity or resistance to a reference value; and/or determining, by the conductivity or resistance measuring device, a presence or an absence of an antimicrobial system on the surface. The antimicrobial system may comprise a first coating, wherein the first coating may comprise an antimicrobial compound, wherein the antimicrobial compound may comprise a first end and a second end opposite the first end with a hydrocarbon chain therebetween, wherein the antimicrobial compound may comprise a cationic functional group on the first end and a silane group on the second end.

Abstract: A coating thickness measuring instrument comprising: a magnetic induction probe comprising at least one drive coil and at least one pick-up coil; a driver for driving an alternating current in the or each drive coil; and a detector for detecting the output of the or each pick-up coil; and a processor configured to: apply a transfer function to the detector output to produce an output which corresponds to a measured coating thickness; and, scale both the drive current and detector output simultaneously in response to the output. The scaling may be changed in a step-wise manner. The scaling applied to the drive current may be inversely proportional to the scaling applied to the detector output. The scaling may be defined by a first and second scaling factor, stored as a pair. The instrument may store two or more pairs of scaling factors and select a pair in response to the measured coating thickness.

Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.

Abstract: A method for managing authorization to access a shared vehicle, the vehicle having a memory dimensioned to simultaneously store a maximum number of reservations. The method includes obtaining a first reservation of a vehicle, searching, in a local representation of the memory of the vehicle, for an available location for storing the first reservation, and when there is no available location for storing the first reservation, selecting, from the reservations stored in the local representation of the vehicle's memory, a second reservation such that the start date of the second reservation is after the start date of the first reservation, storing the characteristics of the second reservation in a waiting list, replacing, in the local representation of the memory of the vehicle, the selected reservation with the first reservation, and transmitting, to the vehicle, a command to delete the second reservation, and a command to add the first reservation.

Abstract: An optical path shifting device includes: a holding frame holding a rectangular glass plate; a support part supporting the holding frame in a swingable state; an actuator causing the holding frame to swing; a magnetic sensor detecting a position of the holding frame; and a thermistor detecting a temperature of the magnetic sensor. A drive signal processing circuit includes: an amplifier amplifying a reference signal to generate a drive signal and supplying the drive signal to the actuator; and a signal processing unit inputting the reference signal and an amplifier gain to the amplifier. The signal processing unit performs gain adjustment processing to correct an amplitude value found from an output from the magnetic sensor, based on an output from the thermistor, and to adjust the amplifier gain, based on a corrected value.

Abstract: To specify a trajectory of an eddy current sensor provided on a polishing table of a substrate polishing apparatus, disclosed is a method of identifying a trajectory of an eddy current sensor as seen from a substrate in a substrate polishing apparatus having a polishing table and a polishing head. The method includes: obtaining a sensor output map as three-dimensional data; polishing the substrate; obtaining a profile of the real-time polishing signal as two-dimensional data; and extracting a trajectory having a profile most similar to the profile of the real-time polishing signal as two-dimensional data from the sensor output map as three-dimensional data and identifying the extracted trajectory as a trajectory of the eddy current sensor as seen from the substrate.

Abstract: Embodiments include devices and methods for detecting material deposition and material removal performed by a wafer processing tool. In an embodiment, one or more micro sensors mounted on a process chamber of the wafer processing tool are capable of operating under vacuum conditions and/or may measure material deposition and removal rates in real-time during a plasma-less wafer fabrication process. Other embodiments are also described and claimed.

Abstract: A first resistivity value and a correlation function relating thickness of a conductive layer having the first resistivity value to a signal from an in-situ monitoring system are stored. A second resistivity value for a conductive layer on a substrate is received. A sequence of signal values that depend on thickness of the conductive layer is received from an in-situ electromagnetic induction monitoring system that monitors the substrate during polishing. A sequence of thickness values is generated based on the sequence of signal values and the correlation function. For at least some thickness values of the sequence of thickness values adjusted thickness values are generated that compensate for variation between the first resistivity value and the second resistivity value to generate a sequence of adjusted thickness values. A polishing endpoint is detected or an adjustment for a polishing parameter is determined based on the sequence of adjusted thickness values.

Abstract: The invention relates to a method for measuring the thickness of non-magnetisable layers (51) on a magnetisable base material (52), the permeability of which is not known, having a measuring probe (11), which has a probe head (17), which comprises a pot core (31) having a first and second coil (36, 37), which lie on a common geometric axis (16), and in which the first and second coils (36, 37) form a first coil pair (38), and which has a bearing calotte (21) in a common axis (16), in which the probe head (17) is placed on the layer (51) to measure the thickness of the layer (51) on the base material (52), wherein a first interaction volume is detected by the first coil pair (38) with a field focusing caused by the pot core (31), a second interaction volume is detected by a second coil par (44) with a first and second coil (42, 43), which is arranged outside the pot core (31) and jointly with the geometric axis (16) without field focusing by the pot core (21), and the detected first and second base material vo

Abstract: An apparatus for determining the thickness of media is provided and includes a ferrous plate, a solenoid mounted perpendicular to the ferrous plate, and a magnet at the end of the solenoid piston. The solenoid piston ranges from a retract position to a down position where the magnet presses on media fed in the gap between the solenoid piston and the ferrous plate. A current source connected to the solenoid moves the piston to the retract position when the current source is energized. A detector is provided to determine when the solenoid piston is in the retract position. A programmable device controls the current source and a time measurement device. The programmable device simultaneously starts the time measurement device and increases current to the solenoid, thereby retracting the piston and timing the retraction.

Abstract: A polishing apparatus of the present disclosure polishes a polishing target by pressing the polishing target against a polishing pad. An eddy current sensor measures an impedance that is changeable according to a change of a film thickness of the polishing target, at a plurality of positions of the polishing target, and outputs measurement signals. A difference calculator generates data corresponding to a film thickness based on a measurement signal. The difference calculator calculates a difference between data at different times based on measurement signals output by the eddy current sensor at different times at a center of the polishing target. An end point detector detects a polishing end point indicating the end of polishing based on the difference calculated by the difference calculator.

Abstract: Provided is a method for inspecting an electroconductive composite material including disposing a detection magnetic field measurement unit, disposing a correction magnetic field measurement unit, applying a current, acquiring a detection magnetic field strength, acquiring a correction magnetic field strength, and detecting a portion in which arrangement of carbon fibers is disordered. The operation includes calculating a correction coefficient using the correction magnetic field strength and correcting the detection magnetic field strength using the correction coefficient.

Abstract: Multiple pin probes and methods for controlling such multiple pin probes to support parallel measurements are disclosed. The method may include: establishing electrical contact between a multiple pin probe and a subject of measurement; selecting two pins out of a plurality of pins included in the multiple pin probe as current-carrying pins; selecting more than two additional pins out of the plurality of pins included in the multiple pin probe as voltage-metering pins; injecting a current through the current-carrying pins; simultaneously measuring voltage signals through the voltage-metering pins; calculating a simulated voltage distribution curve at least partially based on the voltage signals simultaneously measured through the voltage-metering pins; and determining one or more processor monitor parameters of the subject of measurement at least partially based on the simulated voltage distribution curve.

Abstract: Polishing systems and methods for polishing a substrate are provided. The method includes polishing a substrate using a polishing pad and monitoring a thickness of the polishing pad. The monitoring of the thickness of the polishing pad is performed by detecting an eddy current generated from a conductor element below a bottom surface of the polishing pad. The method also includes replacing the polishing pad with a second polishing pad if the thickness of the polishing pad is smaller than a predetermined value.

Abstract: An electroplating reactor includes an electro-plating solution in a bath, a ring cathode in the bath and located to contact a workpiece such that only the front side of the workpiece is immersed in the solution, plural anodes immersed in the bath below the ring cathode, and plural anode voltage sources coupled to the plural anodes; plural thickness sensors at spatially separate locations on the back side of the workpiece with feedback control to the anode voltage sources.

Abstract: An apparatus for semiconductor processing that includes a pedestal that includes a wafer support surface that includes a plurality of mesas and a pattern of grooves is provided. Each mesa may be bracketed between two or more grooves, each mesa may include a plurality of mesa side walls that intersect, at least in part, with one of the grooves and with a mesa top surface that is a substantially planar surface, the mesa top surfaces may be substantially coplanar with each other, and the mesa top surfaces may be configured to support a wafer during semiconductor operations.

Abstract: A tactile probe for endovascular intervention with feedbacks informative of the range and direction of a contact force includes: a central column (7); a plurality of lateral electrodes (2) around the central column (7); a conductive contact sleeve (1) that is axially and radially movable relative to the central column (7); a top electrode (3) in movable connection with the central column (7); and an alert electrode (4) configured to generate: a lateral contact signal, upon the contact sleeve (1) radially moving relative to the central column (7) and being electrically connected to at least one lateral electrode (2); a top contact signal, upon the contact sleeve (1) axially moving relative to the central column (7) a first distance (d1) and being electrically connected to the top electrode (3); and a warning signal, upon the contact sleeve (1) axially moving relative to the central column (7) a second distance (d2) and being electrically connected to the alert electrode (4).

Abstract: A measuring probe for the measurement of the thickness of thin layers, includes a housing, at least one sensor element which is mounted with at least one spring element to be flexible with respect to the housing, the sensor element having a spherical positioning cap pointing towards the measuring surface of an object of measurement against a touchdown direction and along a longitudinal axis thereof, and an attenuating device on the housing which acts in the touchdown direction of the at least one sensor element before the sensor element is fitted onto the measuring surface of the object of measurement and attenuates the touchdown movement of the at least one sensor element in the direction of the measuring surface of the object of measurement.

Abstract: The present invention relates to a parallel image measurement method oriented to the insulating layer thickness of a radial symmetrical cable section. The method conducts the non-contact high-accuracy measurement based on the machine vision and the image analysis, adopts a GPU multi-core parallel platform for the high-speed measurement, extracts the useful information from the section image of the radial symmetrical cable, and then measures the insulating layer thickness. Compared with the prior art, the present patent can lower the time consumed for the accurate measurement, fill in the blank of the high-accuracy parallel image measurement of the insulating layer thickness of the radial symmetrical cable section in the domestic cable industry, break down the monopoly and technology blockade by related foreign manufacturers and improve the technology level of on-line testing of product quality in China, expedite the production automation progress of domestic manufacturer.

Abstract: A sensor system for a motor vehicle is provided. The sensor system comprises a flat shielding element which is electrically conductive and to which an electric potential can be applied, and at least one capacitive sensor element which includes an electrically conducting structure which is arranged on one side of the shielding element. As electrically conducting structure the sensor element includes at least one sensor conductor which forms a sewing thread and is sewn onto the one side of the shielding element.

Abstract: An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor is disposed near the metal film or the conductive film formed on the substrate to detect an eddy current generated in the metal film or the conductive film. The eddy current sensor includes a plurality of coils having different sizes formed by winding a wire or a conductive material. The plurality of coils includes an inner coil and an outer coil spaced from each other, and the outer coil is configured to surround the inner coil. The plurality of coils are configured to detect respective eddy currents generated in the metal film or the conductive film.

Abstract: The invention relates to a measuring probe for measuring the thickness of thin layers with a housing, having at least one sensor element, which is received in the housing at least slightly moveably along a longitudinal axis and which comprises at least one winding device, which is allocated to the longitudinal axis, having a spherical positioning cap facing the outer front face of the housing, said cap being arranged in the longitudinal axis, wherein the spherical positioning cap has a basic body that has a cylindrical core section and a pole cap arranged on a front face of the core section, wherein the winding device is allocated to the spherical positioning cap, said winding device being formed from a discoidal or annular carrier with at least one Archimedean coil arranged thereon and with the basic body consisting of a ferritic material and the pole cap consisting of a hard metal.

Abstract: A polishing method includes: rotating a polishing table that supports a polishing pad; polishing a conductive film by pressing a substrate having the conductive film against the polishing pad; obtaining a film thickness signal with use of an eddy current film-thickness sensor disposed in the polishing table; determining a thickness of the polishing pad based on the film thickness signal; determining a polishing rate of the conductive film corresponding to the determined thickness of the polishing pad; calculating an expected amount of polishing of the conductive film to be polished at the determined polishing rate for a predetermined polishing time; calculating a temporary end-point film thickness by adding the expected amount of polishing to a target thickness; and terminating polishing of the conductive film when the predetermined polishing time has elapsed from a point of time when the thickness of the conductive film has reached the temporary end-point film thickness.

Abstract: The invention relates to a measuring probe for measuring the thickness of thin layers, having a housing (14) with at least one sensor element (17), which is received at least slightly moveably along a longitudinal axis (16) and which comprises at least one first winding device (44), which has a magnetic pot core (41) arranged in the longitudinal axis (16) of the housing (14), and to whose central pin (42) a first and second coil (70, 71) are allocated, and having a spherical positioning cap (21) on the central pin (42) pointing towards the measuring surface of an object to be measured, which cap comprises a bearing surface (57) for fitting on a measuring surface, wherein a second winding device (48) is provided allocated to the spherical positioning cap (21), which device is formed from a discoidal or annular carrier (49) having at least one Archimedean coil (51), and a shield (83, 85) is provided at least partially between the first and second winding device (44, 48).

Abstract: An apparatus and method tests the strength of a bond between a substrate, especially a vehicle window, and an item bonded thereto. The apparatus includes a force transfer shaft having a first end extending from a housing and a second end positioned within the housing, a ferromagnetic member connected to the end of the force transfer shaft positioned within the housing, and a permanent magnet having a predetermined pull force secured to the housing proximate the ferromagnetic member.

Abstract: A method and apparatus for inspecting sealant on an object. First data is generated for a first geometry of a first surface of the object prior to sealing the object. Second data is generated for a second geometry of a second surface of the object after the sealant has been applied to the object. A difference is identified between the first data and the second data. The difference indicates a thickness of the sealant on the object.

Abstract: Methods for testing magnetoresistance of test devices with layer stacks, such as MTJs, fabricated on a wafer are described. The test devices can be fabricated along with arrays of similarly structured memory cells on a production wafer to allow in-process testing. The test devices with contact pads at opposite ends of the bottom electrode allow resistance across the bottom electrode to be measured as a surrogate for measuring resistance between the top and bottom electrodes. An MTJ test device according to the invention has a measurable magnetoresistance (MR) between the two contact pads that is a function of the magnetic orientation of the free layer and varies with the length and width of the MTJ strip in each test device. The set of test MTJs can include a selected range of lengths to allow the tunnel magnetoresistance (TMR) and resistance area product (RA) to be estimated or predicted.

Abstract: A nondestructive system and method for measuring non-conductive coating thickness is disclosed. The method includes providing a composite substrate, placing a conductive layer over a surface of the composite substrate, and depositing a plurality of non-conductive coating layers over the conductive layer. An eddy-current measuring coil formed on a printed circuit board is provided atop the coating layers. The coil has a driving trace with first and second driving electrodes, and a receiving trace having first and second receiving electrodes. The receiving and driving traces can be either coaxial or interwoven, are spaced apart, and share a common center. A load administered to the first and second driving electrodes using an eddyscope is measured across the first and second receiving electrodes to determine impedance; the measured impedance is used to determine a total thickness of the plurality of coating layers and whether an overall coating thickness is uniform.

Abstract: Disclosed is a Hall sensor probe that configured to be coupled with one of a plurality of magnetic targets for measuring the thickness of a non-ferromagnetic wall. The probe comprises a magnetic field source, a Hall sensor, a concentrator and a main housing. The novel aspects of the probe include a wear tip that is exchangeably affixed onto the main-housing, leaving a permanent gap from and disjoined from the concentrator in a manner that transfers stress from the tip directly onto the main-housing. To serve every aspects of the primary objective, being it mechanical, thermal and operational, the material of the tip preferably has a fracture toughness higher than 20 MPa·m1/2, wear coefficient higher than 100, and a magnetic susceptibility lower than 0.001.

Abstract: A method monitors a change in thickness of a conductive film brought into sliding contact with a polishing surface of a polishing pad using an eddy current sensor. The output signal of the eddy current sensor includes two signals corresponding to a resistance component and an inductive reactance component of an impedance of an electric circuit including a coil of the eddy current sensor.

Abstract: Methods and apparatuses for calibrating eddy current sensors. A calibration curve is formed relating thickness of a conductive layer in a magnetic field to a value measured by the eddy current sensors or a value derived from such measurement, such as argument of impedance. The calibration curve may be an analytic function having infinite number terms, such as trigonometric, hyperbolic, and logarithmic, or a continuous plurality of functions, such as lines. High accuracy allows the omission of optical sensors, and use of eddy current sensors for endpoint detection, transition call detection, and closed loop control in which a process parameter is changed based on the measured magnetic flux density change in one or more processing zones.

Abstract: A device for detecting metal elements in slab form such as metal plates or sheets, includes an emission coil powered by suitable control elements and generating a magnetic field, a reception coil placed so as to enable generation via induction of a voltage across the terminals of the coil under the action of the magnetic field, and elements for processing and evaluating the voltage signal delivered by the at least one reception coil, enabling delivery of an information signal indicating the absence or presence of one or more metal elements near the coils. The emission coil (3) and the reception coil (5) are both mounted in a housing or a sensor head having an active detection face having an associated detection region, and are positioned at a defined inclination one relative to the other and relative to the face.

Abstract: Present embodiments include eddy current array probes having differential coils capable of detecting both long and short flaws in a test specimen and, additionally or alternatively, multiplexed drive coils. For example, an eddy current array probe may include a first plurality of eddy current channels disposed in a first row and a second plurality of eddy current channels disposed in a second row. The first plurality and second plurality of eddy current channels overlap in a first direction but do not overlap in a second direction. The probe also includes a semi-circular drive coil disposed proximate to the first plurality and second plurality of eddy current channels and configured to generate a probing magnetic field for each sense coil of the eddy current channels.

Abstract: In an eddy current testing method which involves using a rotatable eddy current testing probe in which a detection coil is arranged within an exciting coil, a change in detection sensitivity (a deviation of detection sensitivity) which changes depending on the rotational position of the detection coil is reduced. The eddy current testing probe includes an exciting coil EC1, a detection coil DC1, an exciting coil EC2 and a detection coil DC2, which are mounted on a disk DS. The eddy current testing probe is placed so as to face a circumferential surface of an object to be inspected T, which is in the shape of a circular cylinder, and the disk DS is rotated. Then, the distance (liftoff) between the detection coils DC1 and DC2 and an inspection surface changes. Therefore, also the detection sensitivity to a flaw signal changes. To reduce the change in detection sensitivity, the detection sensitivity is adjusted by detecting the rotational position (rotational angle) of the detection coils DC1 and DC2.

Abstract: The invention relates to a measuring probe for measuring the thickness of thin layers with a housing (14), having at least one sensor element (17), which is received in the housing (14) at least slightly moveably along a longitudinal axis (16) and which comprises at least one winding device (44), which is allocated to the longitudinal axis (16), having a spherical positioning cap (21) facing the outer front face of the housing (14), said cap being arranged in the longitudinal axis (16), wherein the spherical positioning cap (21) has a basic body (55) that has a cylindrical core section (56) and a pol cap (58) arranged on a front face of the core section (56), wherein the winding device (44) is allocated to the spherical positioning cap (21), said winding device being formed from a discoidal or annular carrier (49) with at least one Archimedean coil (51) arranged thereon and with the basic body (55) consisting of a ferritic material and the pol cap consisting of a hard metal.

Abstract: A dynamically self-adjusting magnetometer is disclosed. In one embodiment, a first sample module periodically generates an electronic signal related to at least one magnetic field characteristic of a monitored environment. A second sample module periodically generates an electronic signal related to at least one magnetic field characteristic of a monitored environment. A summing module sums the absolute value of the electronic signal from the first sample module and the electronic signal from the second sample module. A delta comparator module receives the electronic signals from each of the first sample module, the second sample module and the summing module and compares each of the electronic signals with a previously received set of electronic signals to establish a change, wherein an output is generated if the change is greater than or equal to a threshold.

Abstract: High-frequency resonance method is used to measure magnetic parameters of magnetic thin film stacks that show magnetoresistance including MTJs and giant magnetoresistance spin valves. The thin film sample can be unpatterned. Probe tips are electrically connected to the surface of the film (or alternatively one probe tip can be punched into the thin film stack) and voltage measurements are taken while injecting high frequency oscillating current between them to cause a change in electrical resistance when one of the layers in the magnetic film stack changes direction. A measured resonance curve can be determined from voltages at different current frequencies. The damping, related to the width of the resonance curve peak, is determined through curve fitting. In embodiments of the invention a variable magnetic field is also applied to vary the resonance frequency and extract the magnetic anisotropy and/or magnetic saturation of the magnetic layers.

Abstract: A method of evaluating the condition of a laminated core of an electric machine including positioning a magnetic flux injection excitation yoke extending between a pair of teeth of the laminated core, and the excitation yoke being wound with an excitation winding defining an electrical circuit for producing a magnetic flux excitation. Power is supplied to an excitation winding wound around the yoke to produce a magnetic flux in the yoke and to form a magnetic circuit through the yoke and the laminated core. A characteristic of the electrical circuit of the excitation winding is measured to identify a fault in the magnetic circuit corresponding to an eddy current between individual laminations in the laminated core.

Abstract: A method and system for evaluating the condition of a laminated core of an electric machine, and including a first yoke wound with a first winding and having a first pair of arms spanning between a first pair of teeth of the laminated core, and a second yoke wound with a second winding and having a second pair of arms spanning between a second pair of teeth. A power supply provides power to an electrical circuit defined by one of the first and second windings to produce a magnetic flux in the yoke corresponding to the one of the first and second windings and defining an excitation yoke. A monitoring module provides a measurement of a characteristic of an electrical circuit defined by the other one of the first and second windings to identify a fault corresponding to an eddy current between individual laminations in the laminated core.

Abstract: A method and device for measuring the thickness of a coating material layer of a running strip according to which, by means of an eddy current sensor for at least one area of the strip, a quantity is measured, representative of the thickness of the coating layer and the thickness of the coating layer is determined from the measured quantity and from at least one calibration value. The measurement made with an eddy current sensor comprises the measurement of the complex impedance of a coil facing the running strip for a low excitation frequency and a high excitation frequency and the elaboration of a quantity representative of the thickness of the coating layer from said complex impedance measurements. A device for applying the method and a coating installation equipped with the device.

Abstract: A method of testing for defects in the bottom of an above ground storage tank, the tank bottom having a lip extending outwardly from the tank wall around the circumference of the tank. A special magnetostrictive sensor is designed to be placed on this lip. The sensor is placed over a strip of magnetostrictive material, which generally conforms in length and width to the bottom of the probe, with a couplant being applied between the strip and the lip surface. The sensor is then operated in pulse echo mode to receive signals from defects in the bottom of the tank. It is incrementally moved around the circumference of the tank.

Abstract: Methods and apparatuses for calibrating eddy current sensors. A calibration curve is formed relating thickness of a conductive layer in a magnetic field to a value measured by the eddy current sensors or a value derived from such measurement, such as argument of impedance. The calibration curve may be an analytic function having infinite number terms, such as trigonometric, hyperbolic, and logarithmic, or a continuous plurality of functions, such as lines. High accuracy allows the omission of optical sensors, and use of eddy current sensors for endpoint detection, transition call detection, and closed loop control in which a process parameter is changed based on the measured magnetic flux density change in one or more processing zones.

Abstract: A method and an apparatus for measuring the thickness of a metal layer. The metal layer has a resistivity (?1) that differs from the resistivity (?2) of the metal object. The apparatus includes a first device arranged to generate a magnetic field in close vicinity of the metal layer, and to generate a variation of the magnetic field so that a current is induced in the surface of the metal layer, a second device arranged to measure the changes of the magnetic field outside the metal layer due to the induced current during a time period that is longer than the time it takes for the current to propagate through the metal layer, and a computing unit to determine the thickness of the layer based on a mathematical relation between the thickness of the layer and the measured values of the changes of the magnetic field.

Abstract: A sheet of a material is disposed in a melt of the material. The sheet is formed using a cooling plate in one instance. An exciting coil and sensing coil are positioned downstream of the cooling plate. The exciting coil and sensing coil use eddy currents to determine a thickness of the solid sheet on top of the melt.

Abstract: The invention relates to a device for measuring the mass of a magnetic material (6) present in an analysis medium, that comprises: a modulator (24) of the phase of a high-frequency and/or low-frequency component of a magnetic field for exciting the analysis medium with a modulation signal having a value that is modified by a frequency fmod; and a demodulator (36) capable of demodulating the amplitude of an amplitude signal, measured in response to the excitation field, from the modulation signal, wherein said demodulator is connected to the output of a filter (34) and to the input of an estimation unit (44).

Abstract: Methods and apparatuses for calibrating eddy current sensors. A calibration curve is formed relating thickness of a conductive layer in a magnetic field to a value measured by the eddy current sensors or a value derived from such measurement, such as argument of impedance. The calibration curve may be an analytic function having infinite number terms, such as trigonometric, hyperbolic, and logarithmic, or a continuous plurality of functions, such as lines. High accuracy allows the omission of optical sensors, and use of eddy current sensors for endpoint detection, transition call detection, and closed loop control in which a process parameter is changed based on the measured magnetic flux density change in one or more processing zones.

Abstract: Probes are electrically connected to a surface of a tunnel junction film stack comprising a free layer, a tunnel barrier, and a pinned layer. Resistances are determined for a variety of probe spacings and for a number of magnetizations of one of the layers of the stack. The probe spacings are a distance from a length scale, which is related to the Resistance-Area (RA) product of the tunnel junction film stack. Spacings from as small as possible to about 40 times the length scale are used. Beneficially, the smallest spacing between probes used during a resistance measurement is under 100 microns. A measured in-plane MagnetoResistance (MR) curve is determined from the “high” and “low” resistances that occur at the two magnetizations of this layer. The RA product, resistances per square of the free and pinned layers, and perpendicular MR are determined through curve fitting.

Abstract: A method monitors a change in film thickness during polishing using an eddy current sensor. This method includes acquiring an output signal of the eddy current sensor as a correction signal value during water-polishing of a substrate, during dressing of the polishing pad, or during replacement of the polishing pad, calculating a correcting amount from a difference between the correction signal value and a predetermined correction reference value, calculating an actual measurement signal value by subtracting the correction amount from the output signal of the eddy current sensor when polishing a substrate having a conductive film, and monitoring a change in thickness of the conductive film during polishing by monitoring a change in the actual measurement signal value.

Abstract: Probes are electrically connected to a surface of a tunnel junction film stack comprising a free layer, a tunnel barrier, and a pinned layer. Resistances are determined for a variety of probe spacings and for a number of magnetizations of one of the layers of the stack. The probe spacings are a distance from a length scale, which is related to the Resistance-Area (RA) product of the tunnel junction film stack. Spacings from as small as possible to about 40 times the length scale are used. Beneficially, the smallest spacing between probes used during a resistance measurement is under 100 microns. A measured in-plane MagnetoResistance (MR) curve is determined from the “high” and “low” resistances that occur at the two magnetizations of this layer. The RA product, resistances per square of the free and pinned layers, and perpendicular MR are determined through curve fitting.