Abstract: The invention relates to a method for inspecting quality and/or condition of an elongated composite member, which is a load bearing member of a rope of a hoisting apparatus, such as an elevator, or a precursor of such a load bearing member, the method comprising providing an elongated composite member; and changing the temperature of said elongated composite member by heating or cooling said elongated composite member via a flank thereof; and scanning said elongated composite member from a lateral side thereof with a thermal imaging device after said changing of the temperature; and creating thermographic images of said elongated composite member.

Abstract: A circuit arrangement for voltage testing and partial discharge capture in a single-phase or multi-phase medium-voltage or high-voltage installation includes one or more conductor signal inputs that are couplable to respective capacitive coupling electrodes that are coupled to respective conductors of the installation, a voltage testing unit coupled to the relevant conductor signal input and configured for threshold-based voltage state capture, a partial discharge detector unit, and an energy supply for the partial discharge detector unit with a first energy supply circuit for supplying energy from the relevant conductor signal input and/or with a second energy supply circuit for supplying energy from the relevant conductor signal input. An input side of the partial discharge detector circuit is couplable via a partial discharge connection path to an earth side of an installation system capacitance that is electrically parallel to the capacitive coupling electrode.

Abstract: The present disclosure provides a chip detection method and a chip detection apparatus. The chip detection method includes: providing a chip to be tested, the chip including a power pump region, and the power pump region including a plurality of power pump structures; detecting a dim light signal emitted from the power pump region when the chip is in a preset working mode; and determining whether the dim light signal matches a corresponding power pump working mode in the preset working mode, and if not, confirming that the power pump region has a defect, the power pump working mode including a working state of the power pump structures in the power pump region.

Abstract: The present application discloses a method for locating an open circuit failure point of a test structure, which includes the following steps: step 1: providing a sample formed with a test structure, a first metal layer pattern and a second metal layer pattern of the test structure forming a series resistor structure through each via; step 2: performing a first active voltage contrast test to the sample to show an open circuit point and making a first scratch mark at an adjacent position of the open circuit point; step 3: forming a coating mark at the first scratch mark on the sample; step 4: performing a second active voltage contrast test to the sample to show the open circuit point and locating a relative position of the open circuit point by using a position of the coating mark as a reference position.

Abstract: A segmented detector device with backside illumination. The detector is able to collect and differentiate between secondary electrons and backscatter electrons. The detector includes a through-hole for passage of a primary electron beam. After hitting a sample, the reflected secondary and backscatter electrons are collected via a vertical structure having a P+/P?/N+ or an N+/N?/P+ composition for full depletion through the thickness of the device. The active area of the device is segmented using field isolation insulators located on the front side of the device.

Abstract: A method of detecting a defect in a device using a charged particle beam includes inputting a charged particle beam condition, a light condition, and electronic device circuit information, controlling a charged particle beam applied to a sample based on the electron beam condition, controlling light applied to the sample based on the light condition, detecting second electrons emitted from the sample by the application of the charged particle beam and the light, and generating a calculation netlist based on the electronic device circuit information, generating a light irradiation netlist based on the calculation netlist and the light condition, estimating a first irradiation result when the charged particle beam and the light are applied to the sample based on the light irradiation netlist and the charged particle beam condition, and comparing the first irradiation result with a second irradiation result when the charged particle beam and the light are actually applied to the sample based on the electron beam

Abstract: Systems and methods for automatic detection of defects in a coating of a component are provided. In one aspect, a coating inspection system is provided. The coating inspection system includes a heating element operable to impart heat to the component as it traverses relative thereto. An imaging device of the system captures images of the component as the heating element traverses relative to the component and applies heat thereto. The images indicate the transient thermal response of the component. The system can generate a single observation image using the captured images. The system can detect and analyze defects using the generated single observation image.

Abstract: A system for distribution transformer monitoring may comprise a distribution transformer that includes a transformer fluid tank, a monitoring unit that includes a plurality of sensors, wherein the monitoring unit is coupled to the distribution transformer, and wherein the plurality of sensors comprises a fluid sensor that includes a sensor probe that extends out of the monitoring unit into the transformer fluid tank of the distribution transformer, and a communication unit coupled to the distribution transformer and communicatively coupled to the monitoring unit. The monitoring unit may further comprises a sensor module to receive sensor data from the plurality of sensors, a storage module to store the sensor data in an internal data storage device of the monitoring unit, an analysis module to analyze the sensor data to determine generated data, and a communication module to communicate the sensor data or the generated data to a remote computing device.

Abstract: A test system includes: an input signal generation unit that generates an input signal that drives a semiconductor device as a test target; a reference signal generation unit that supplies a reference signal, which is for use in generating the input signal, to the input signal generation unit; and a detection unit that, while implementing a test of the semiconductor device, generates a standard signal in which the same signal output as an output of the reference signal output from the reference signal generation unit is expected, and outputs a detection unit output signal based on the reference signal and the standard signal.

Abstract: Double-sided probe systems with thermal control systems and related methods. Thermally-controlled, double-sided probe systems include a probe assembly configured to test one or more devices under test (DUTs) of a substrate and a chuck configured to support the substrate. The probe assembly includes a thermal control system configured to at least partially control a substrate temperature of the substrate while the probe assembly tests the DUT(s). The chuck is configured to support the substrate such that the probe assembly has access to each of a first substrate side of the substrate and a second substrate side of the substrate while the substrate is operatively supported by the chuck. In some examples, methods of operating double-sided probe systems include regulating the substrate temperature with the thermal control system.

Abstract: A charged particle beam device includes an input and output device that receives, as inputs, a charged particle beam condition, a light condition, and electronic device circuit information, a charged particle beam control system that controls a charged particle beam applied to a sample based on the electron beam condition, a light control system that controls light applied to the sample based on the light condition, a detector that detects second electrons emitted from the sample by the application of the charged particle beam and the light and outputs a detection signal, and a calculator that generates a calculation netlist based on the electronic device circuit information, generates a light irradiation netlist based on the calculation netlist and the light condition, estimates a first irradiation result when the charged particle beam and the light are applied to the sample based on the light irradiation netlist and the charged particle beam condition, and compares the first irradiation result with a second

Abstract: An optical test equipment includes a chuck, a light receiving device corresponding in position to an opening of the chuck, a transparent heating plate disposed on the chuck or light receiving device in a way that the bottom surface of the transparent heating plate faces toward the light receiving device for a wafer to be disposed on the top surface of the transparent heating plate, allowing light to pass through the top and bottom surfaces and being powered to generate heat to heat the wafer, and a probing device including a seat and a probe protruding from the seat toward the top surface of the transparent heating plate for probing a light emitting chip of the wafer. The equipment can perform light emitting efficiency test to the light emitting chip on the wafer before dicing and heat the light emitting chip at the same time.

Abstract: A charged particle system may include a first charged particle beam source provided on a first axis, and a second charged particle beam source provided on a second axis. There may also be provided a deflector arranged on the first axis. The deflector may be configured to deflect a beam generated from the second charged particle beam source toward a sample. A method of operating a charged particle beam system may include switching between a first state and a second state of operating a deflector. In the first state, a first charged particle beam generated from a first charged particle beam source may be blanked and a second charged particle beam generated from a second charged particle beam source may be directed toward a sample. In the second state, the second charged particle beam may be blanked and the first charged particle beam may be directed toward the sample.

Abstract: A protective member forming apparatus for forming a protective member on the top surface of a substrate by laminating a liquid resin and a cover sheet on a resin film includes: a liquid resin supply unit configured to supply the liquid resin onto the resin film; a pressing unit including a pressing surface, the pressing unit being configured to spread the liquid resin over the resin film by pressing the liquid resin by the pressing surface via the cover sheet; and a determining unit configured to determine the state of the spread liquid resin. The determining unit includes a determining section configured to determine whether or not the liquid resin is spread over a predetermined range with respect to the substrate.

Abstract: Methods of controlling the operation of probe stations and probe stations that perform the methods. The methods including generating a test routine by constructing a substrate map, receiving a test subset input from a user, and updating the substrate map to incorporate information regarding which devices under test (DUTS) of a plurality of DUTs are in a test subset of a plurality of DUTs. The methods also include receiving a pre-test subset input from the user, wherein the pre-test subset is a subset of the test subset, and updating the substrate map to incorporate information which DUTs of the test subset are in the pre-test subset. The methods further include executing the test routine by moving a probe assembly to each DUT in the test subset, selectively performing a pre-test routine on each DUT that is in the pre-test subset, and electrically testing each DUT in the test subset.

Abstract: Embodiments of the disclosure provide a probe structured for electrical and photonics testing of a photonic integrated circuit (PIC) die, the probe including: a membrane having a first surface and an opposing second surface and including conductive traces, the membrane being configured for electrical coupling to a probe interface board (PIB); a set of probe tips positioned on the membrane, the set of probe tips being configured to send electrical test signals to the PIC die or receive electrical test signals from the PIC die; and a photonic test assembly disposed on the membrane and electrically coupled to the conductive traces of the membrane, the photonic test assembly positioned for substantial alignment with a photonic I/O element of the PIC die, wherein the photonic test assembly is configured to transmit a photonic input signal to the photonic I/O element or detect a photonic output signal from the photonic I/O element.

Abstract: An integrated automobile diagnostic and troubleshooting device circuitry operable to present an electrical load to a system or component under test, circuitry operable to provide an audible indication of continuity in a system or component under test, circuitry operable to provide a visual indication of current and voltage under test; and circuitry operable to provide differential output voltage to a system or component under test. In a preferred embodiment, the circuitry is integrated into a single handheld integrated housing allowing simultaneous operation of the circuitry by a single technician. In alternative embodiments, the device includes a test cable allowing remote operation and testing of an automobile system or component.

Abstract: The disclosure provides an array substrate, a display device, a detecting apparatus and a detecting method for detecting a defect connection of a data line. A data signal input bus of the array substrate of the present disclosure applies a data signal to each pixel unit, and a detection line is added on one side of the array substrate opposite to the data signal input bus, when the product is detected, the data signal input bus inputs the normal data signal, the detection line on the other side inputs a signal having a polarity contrary to that of the data signal. At a position of the data line existing defect connection, heat is generated and the data line is burnt at the position existing defect connection.

Abstract: A novel spacer assembly includes a body defining a bottom surface and a top surface opposite the bottom surface, a guide coupled to the top surface and extending along an axis, and a plurality of spacer elements movably coupled to the guide along the axis and being configured to receive a plurality of electrical leads therebetween. Each of the spacer elements extends above the top surface of the body and defines a predetermined width along the axis. When the leads are placed between the spacer elements, a spacing between adjacent ones of the leads corresponds to the predetermined width of the interposing spacer element. The predetermined width corresponds to a predefined electromagnetic compatibility (EMC) testing criteria. The spacer assembly facilitates rapid placement and accurate spacing of leads during initial EMC test setup or reconfiguration.

Abstract: A method for probe card alignment is provided. The method includes providing a probe card with a plurality of probe needles having their distal ends on a reference plane. The method further includes providing a light from both the upper side and lower side of the reference plane. The method also includes using a camera to image the probe needles. In addition, the method includes performing a probe card alignment process according to the image generated by the camera.

Abstract: In an aspect, a moon appearance generating system (1) is configured for providing an enhanced depth perception to imitate a sky scene, for example, a natural sky scene at night.

Abstract: The present invention relates to “an Innovative Semiconductor Fab's Defect Operating System” thereof for design house and manufacturing Fab is provided. The Innovative Semiconductor Fab's Defect Operating System comprises: receiving pluralities of defect data, IC design layout data; analyzing the defect data, design layouts, by a Critical Area Analysis (CAA) method via a Defect Operating System located inside the Fab site; identify a killer or non-killer defect based on the open or short failure probability; sending the killer defect data to the design house via internet, FTP, etc. The design house receives the wafer testing yield data; pick the bad die information and the killer defect information for failure analysis; correlate the corresponding defect data with the wafer test data; sending the failure killer defect data to the Fab via internet, FTP, etc.

Abstract: In various embodiments, an RFID Antenna/Tag Location Configuration device (RLC) may facilitate placement of one or more RFID antennas in a physical space. The RLC may collect RFID data from tags determine which of the RFID antennas need to be relocated. The RLC may determine, based on collected RFID data, whether each antenna is a dominant antenna and/or has a substantial read rate. If an antenna is not dominant and/or does not exhibit a substantial read-rate, the RLC ma indicate that the antenna should be relocated. The RLC may also be configured to filter collected RFID data prior to using the data for determination of antennas. The RLC may also determine, using the RFID antennas, a physical location of RFID tags in the physical space using detected signal strength for RFID tags. Additional embodiments may be described and/or claimed.

Abstract: Quality control testing for a batch of electronic modules. A series of tests are performed on manufactured electronic modules, including tests sensitive to the failure rate of previously tested modules. Specifically, a first test comprised of two phases is performed on the module batch. Further screening is then performed responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase. The further screening is on modules that passed the first test phase and excludes modules that failed the first test phase.

Abstract: A display substrate, a display panel including the display substrate and a display device including the display panel are provided. The display substrate comprises a flexible circuit board and test pads, wherein the flexible circuit board covers an area of the test pads. In the aforesaid display substrate, the flexible circuit board covers the area of the test pads, so that test points on the test pads can be prevented from contacting the outside, and corrosion of the test points and signal abnormity in signal lines resulting therefrom during testing are prevented; compared with the prior art, the process of coating the test pads with UV adhesive is omitted, thus the process flow is reduced, and the production efficiency and the productivity are improved; moreover, the thickness of the display substrate can be reduced, which is conducive for the display panel including the display substrate to be lighter and thinner.

Abstract: A method and apparatus related to developing electromagnetic emission and power models for a target device using photonic emissions thereof are provided. Data of photonic emissions of a target device during a first period of time with the target device in one or more modes is recorded. Data of electromagnetic emissions of the target device during the first period of time with the target device in the one or more modes is also recorded. The recorded data of the photonic emissions and the recorded data of the electromagnetic emissions are correlated to establish one or more electromagnetic emission models for the target device. The one or more electromagnetic emission models enable predictive analysis of emissions by the target device.

Abstract: A method for probe card alignment is provided. The method includes providing a probe card with a plurality of probe needles having their distal ends on a reference plane. The method further includes providing a light from both the upper side and lower side of the reference plane. The method also includes using a camera to image the probe needles. In addition, the method includes performing a probe card alignment process according to the image generated by the camera.

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

Abstract: The number, popularity, sophistication, etc. of mobile applications have grown dramatically with the rise of smartphones, tablets, and other such devices. Alternatives to native application development, including approaches such as hybrid application development which may employ among other things a container paradigm, inter alia address various of the drawbacks associated with native application development. A flexible, extensible, and dynamically configurable Feature Vector (FV) facility addresses one challenge with approaches such as hybrid application development—controlling an application's access to features (e.g., functions, methods, resources, etc.) and the efficient administration, management, etc. same.

Abstract: A system and method may include determining a presence or absence of cigarettes in a set of cigarettes being processed by a cigarette packer machine by using at least one of a first image or a second image inclusive of the cigarettes in the set of cigarettes. A stereographic image may be produced using the first and second images. Determine level of tobacco of each cigarette of the set of cigarettes by using the first and second images. Produce a report in response to determining that a cigarette is not present or that a level of tobacco of a cigarette is outside of a specified level of tobacco of a cigarette.

Abstract: Embodiments of the present invention provide efficient systems and methods for creating an optimal set of partitions across replica blocks using two checkpoints during the design process. The two checkpoints group a set of macros according to a timing constraint and a location proximity to the other macros. Clustering of the macros is iteratively performed until a distance parameter exceeds a pre-defined threshold.

Abstract: A conductive layer is formed on a first surface of a first carrier. The redistribution layer is formed on the conductive layer. Then an open-test is performed to the redistribution layer. Since the conductive layer and the redistribution layer constitute a closed loop, a load should be presented during the open-test if the redistribution layer is formed correctly. After the open-test is performed, the first carrier and the conductive layer are removed. Then a short-test is performed to the redistribution layer. No load is presented during the short-test if the redistribution layer is formed correctly since the redistribution layer constitutes an open loop. Therefore, whether the redistribution layer has flaws can be determined before the dies are boned on the redistribution layer. Thus, no waste of the good die occurs because of the flawed redistribution layer.

Abstract: A system for testing electromagnetic compatibility of electrical devices includes a plurality of mobile-ground-planes and a fixed-ground-plane. Each of the plurality of mobile-ground-planes is individually customizable to provide a test-fixture for testing a selected instance of an electrical device. The fixed-ground-plane is configured to receive an instance of the plurality of mobile-ground-planes to overlay the fixed-ground plane and form a direct electrical contact between a bottom-side of the instance of the plurality of mobile-ground-planes and a top-side of the fixed-ground-plane. Optionally, the system includes an air-nozzle used to generate an air-gap between the instance of the plurality of mobile-ground-planes and the fixed-ground-plane while the instance of the plurality of mobile-ground-planes is being placed onto the fixed-ground-plane when gas passes through the air-nozzle.

Abstract: A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.

Abstract: Systems (100) and methods (600) for determining a location of an object within space. The methods comprise: generating Inertial Reference Measurement Data (“IRMD”); reading RFID inventory tags by an RFID reader; processing IRMD to determine an RFID reader orientation and position estimates at a time of each RFID inventory tag read; defining cones associated with each RFID inventory tag; mapping the cones to a model; analyzing the model to identify a set of cones which overlap each other and are associated with reads for a respective RFID inventory tag; and deriving a position estimate for the respective inventory tag based on intersecting portions of the cones in the set of cones. Each cone has: a vertex which is the RFID reader position estimate at a respective time; and an angle which is in inverse proportion to a signal strength of a signal received from a respective RFID inventory tag.

Abstract: A semiconductor device inspection system includes a laser light source for generating light to be irradiated a semiconductor device, an optical sensor for detecting the light reflected by the semiconductor device and outputting the detection signal, a tester unit for applying a operating signal to the semiconductor device, an electricity measurement unit to which the detection signal is input, an electricity measurement unit to which the detection signal and the operating signal are selectively input, and a switching unit having a detection signal terminal and a operating signal terminal. The switching unit inputs the detection signal to the electricity measurement unit by connecting a connection section to the detection signal terminal and inputs the operating signal by connecting the connection section to the operating signal terminal.

Abstract: Embodiments of the present invention provide systems and method for adaptively generating a pattern for fabricating semiconductor devices, the method comprising obtaining image data of a surface, and dynamically modifying a pattern to be applied to the surface based on the obtained image data.

Abstract: To analyze an element to be evaluated with high sensitivity and high accuracy in a short period of time, in an electron beam analyzer including a wavelength dispersive X-ray analyzer in an electron microscope. The electron beam analyzer has one diffraction grating in which a plurality of patterns having maximum X-ray reflectance with respect to the respective X-rays are formed. It simultaneously detects an X-ray as an energy reference and an X-ray spectrum to be evaluated. The positional displacement of X-ray energy due to the installation/replacement of the diffraction grating is corrected using the X-ray spectrum as the energy reference, thereby enabling to perform an analysis with high sensitivity and high accuracy in a short period of time.

Abstract: A method for analyzing performance of a solar photovoltaic installation data indicating measured value of power generated by the photovoltaic installation receives and stores that data in a database. An expected output of the installation for at least one period of a test day using a first method is determined. The first expected output of the installation is compared with the measured value of power generated. If the expected output of the installation determined by the first method differs from the measured value by more than an acceptable tolerance, an expected output using another method is determined. If the expected output of the installation determined by the other method differs from the measured value by more than an acceptable tolerance, an under performance warning for the solar photovoltaic installation is issued.

Abstract: A semiconductor device inspection system includes a laser beam source, a tester, an optical sensor, a first spectrum analyzer for measuring first phase information serving as phase information of the detection signal, a reference signal generating unit for generating a reference signal of a predetermined frequency, a second spectrum analyzer for measuring second phase information serving as phase information of a reference signal, and an analysis unit for deriving phase information of the detection signal at the predetermined frequency, wherein the first spectrum analyzer measures the first phase information with respect to the reference frequency, the second spectrum analyzer measures the second phase information with respect to the reference frequency, and the frequency of the base signal of the first spectrum analyzer and the phase thereof are synchronized with the frequency of the base signal of the second spectrum analyzer and the phase thereof.

Abstract: Through-silicon vias (TSVs) are tested using a modified integrated circuit test probe array, an electron beam generation device, a beam direction control device and an electron beam detection device. The TSV extends through a silicon substrate with end portions exposed or accessible by contacts disposed on opposing upper and lower surfaces of the substrate. The test probe array includes a test probe that accesses the lower TSV end portion and applies an AC test signal. An electron beam is directed by the beam direction control device onto the upper substrate surface such that a beam portion reflected from the upper TSV end portion is captured by the electron beam detection device. Reflected beam data is then analyzed to verify the TSV is properly formed. Various scan patterns, different test signal frequencies and an optional resistive coating are used to enhance the TSV testing process.

Abstract: Disclosed, in general, are devices that provide a substantially sound-tight chamber over a sound source while absorbing fields of sounds from the sound source. In general, the devices feature: an anechoic chamber that is configured to receive a sound source in a substantially sound-tight manner; an active noise canceling means in the anechoic chamber; and an anechoic channel that is in fluid communication with the ambient atmosphere.

Abstract: A complex inspection device provided with an optical image pickup unit, an X-ray camera, and an X-ray irradiation unit is provided. An arrival path is defined as a route of an X-ray that arrives at the X-ray camera from the X-ray irradiation unit. The arrival path is shortened for a close-up in a close-up position. In a non-close-up position, the arrival path is longer than that in the close-up position. When the X-ray irradiation unit and/or the X-ray camera needs to move toward the close-up position, the optical pickup unit is moved out in advance so that the X-ray irradiation unit and the X-ray camera relatively move toward the close-up position.

Abstract: Provided is an X-ray inspection device having a pair of conveyor frames that is disposed symmetrically with respect to a center line as an axis along a substrate conveying direction, and clamps a printed substrate in a substrate width direction. A substrate conveying mechanism conveys in an X axis direction the printed substrate supported by the conveyor frames. A distance adjustment mechanism drives the pair of conveyor frames so that the conveyor frames approach or depart from each other in the Y axis direction, thereby adjusting the width dimension of a printed substrate that can be conveyed by the substrate conveying mechanism disposed on each of the conveyor frames.

Abstract: The present invention relates to an electrical and/or opto-electrical characterisation method for testing large-area semiconductor devices in production, the method comprising the steps of providing a first electrode and placing it into electrical contact with a contact area of a conducting layer of a semiconductor device; providing a movable electrode assembly, comprising a container holding an electrolyte solution and at least a second electrode; immersing the second electrode into the electrolyte solution; positioning the electrode assembly such that the electrolyte solution places the second electrode into electrical contact with a top surface of the semiconductor device; and scanning the movable electrode assembly relative to the top surface of the semiconductor device while performing electrical measurements.

Abstract: Embodiments of the present disclosure are directed to an electron beam imaging/inspection apparatus having an electron source device to direct flood electrons on a sample immediately before image acquisition or inspection. The apparatus comprises a first device configured to charge a sample in a first mode, wherein the first device includes an electron source configured to provide a flood beam of charged particles to a first area of the sample. The apparatus also comprises a second device configured to generate a primary beam of electrons and characterize an interaction between the primary beam and a second area of the sample within the first area in a second mode. The apparatus is configured to switch from the first mode to the second mode less than 1 second.

Abstract: An inspection method includes photographing a measurement target to acquire image data for each pixel of the measurement target, acquiring height data for each pixel of the measurement target, acquiring visibility data for each pixel of the measurement target, multiplying the acquired image data by at least one of the height data and the visibility data for each pixel to produce a result value, and setting a terminal area by using the produced result value. Thus, the terminal area may be accurately determined.

Abstract: A method for inspecting a glass substrate for imprint including a glass substrate with a pattern surface and a transmissive conductive film coating at least part of the pattern surface, includes an electron beam irradiation step of irradiating the pattern surface of the glass substrate for imprint disposed on a stage with an electron beam having a predetermined irradiation area; an electron detection step of simultaneously detecting electrons from the pattern surface by the electron beam irradiation by means of a detection surface with a plurality of pixels; and a defect detection step of obtaining an image of the pattern surface based on the electrons detected by the detection surface and detecting a defect of the pattern surface.

Abstract: A semiconductor device testing apparatus 1A includes a tester unit 16 that generates an operational pulse signal, an optical sensor 10 that outputs a detection signal as a response to the operational pulse signal, a pulse generator 17 that generates a reference signal containing a plurality of harmonics for the operational pulse signal in synchronization with the operational pulse signal, a spectrum analyzer 13 that receives the detection signal and acquires a phase and amplitude of the detection signal at a detection frequency, a spectrum analyzer 14 that receives the reference signal and acquires a phase of the reference signal at a detection frequency, and an analysis control unit 18 that acquires a time waveform of the detection signal based on the phase and the amplitude of the detection signal acquired by the spectrum analyzer 13 and the phase of the reference signal. acquired by the spectrum analyzer 14.

Abstract: A pixel includes an organic light emitting diode, a first transistor that is connected to a first power source and that supplies a driving current according to a corresponding data voltage to the organic light emitting diode, a second transistor that is connected to a scan line and that transmits the corresponding data voltage from a data line to a driving transistor according to a scan signal transmitted from the scan line, and a first capacitor including one electrode connected to a gate electrode of the first transistor. The first capacitor stores the corresponding data voltage as a first voltage and a size of the first capacitor is in a range of about 2 times to about 4 times a size of a gate insulating layer of the first transistor.