Abstract: The leakage resistance detection device includes a coupling capacitor having one terminal connected to an on-board high voltage device and another terminal connected to a repetitive signal output circuit, and measures a leakage resistance as a function of a transition time during which a monitoring voltage, which is a potential at the another terminal of the coupling capacitor to be charged/discharged in response to an operation of a charge/discharge switching element that operates in response to a repetitive pulse signal, changes from one predetermined voltage to reach another predetermined voltage. When the measured leakage resistance has become equal to or smaller than a predetermined limit leakage resistance, the leakage resistance detection device generates a resistance abnormality determination output.

Abstract: An exemplary implementation of the present disclosure is a power sourcing equipment (PSE) for determining a resistance of a powered cable. The PSE includes a first supply voltage to cause a first current to flow through first and second output terminals of the PSE. The PSE also includes a second supply voltage to cause a second current to flow through third and fourth output terminals of the PSE. The PSE further includes a current modulation circuit offsetting the second current from the first current to create an offset voltage between the second and the first supply voltages to determine the resistance of the powered cable. The current modulation circuit can offset the second current from the first current utilizing a variable resistance switch to adjust the second current.

Abstract: An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.

Abstract: A test circuit that senses a misaligned probe during a test includes a first power control section that senses voltage levels of a plurality of sensing lines and controls power supplied to a lower circuit section provided below a part of a pad group, and a second power control section that selectively provides an internal voltage in response to a sensing result of the first power control section.

Abstract: An accumulator control device includes a first electrical connection configured to connect the accumulator control device to a local accumulator. A second electrical connection is connected to the first electrical connection and configured to connect to a remote auxiliary electrical power supply device. A control unit is configured to measure at least one of a parameter of the accumulator and an environmental parameter and to transmit at least one of the at least one measured parameter and a value calculated using the at least one measured parameter to the remote auxiliary electrical power supply device via a communication interface.

Abstract: A method and apparatus for diagnosing an electrochemical sensor that detects the concentration of a gas are operative for diagnosing whether or not the sensor is in an error state due to a rise in a resistance in the electrolyte of the sensor. Such detection is made on the basis of a current flowing between a sensing electrode and an opposite electrode or a voltage corresponding to the current. A method for diagnosing an electrochemical sensor having a solid or liquid electrolyte between a sensing electrode and an opposite electrode detects the concentration of the gas to be detected on the basis of a current flowing between the sensing electrode and the opposite electrode, or a voltage corresponding to the current. Whether or not the electrochemical sensor is in an error state is diagnosed on the basis of a resistance of the electrolyte between the two electrodes of the electrolyte.

Abstract: A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool including at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact.

Abstract: The presently disclosed subject matter relates to powerline communications (PLC) in an advanced metering infrastructure (AMI) environment. A communications signal is applied to a power line by a PLC transmitting device. A receiver is provided that evaluates communications signals based on the power coupled to the power line by the transmitting device. In one present embodiment, PLC signal voltage and current levels are multiplied together to evaluate signal power to reproduce received PLC signals.

Abstract: A protection switching system in a power supply distribution system, comprises at least one protection switch (25) comprising a controllable semiconductor arranged to conduct current through the power supply line in a normal mode, a control unit (27) arranged to place the at least one protection switch in a test mode in which the current is reduced compared to the normal mode, registration means (28, 29) for registering a test mode value of at least one electrical characteristic in the power supply line that will be affected when the test mode is applied, a monitoring unit (30; 47) arranged to evaluate the at least one electrical characteristic and determine, based on the evaluation, whether or not an action should be taken. If a malfunction is detected an alarm is issued to indicate to service personnel that the protection switch should be replaced.

Abstract: A secure data entry device including a housing, tamper sensitive circuitry located within the housing and tampering alarm indication circuitry arranged to provide an alarm indication in response to attempted access to the tamper sensitive circuitry, the tampering alarm indication circuitry including at least one conductor, a signal generator operative to transmit a signal along the at least one conductor and a signal analyzer operative to receive the signal transmitted along the at least one conductor and to sense tampering with the at least one conductor, the signal analyzer being operative to sense the tampering by sensing changes in at least one of a rise time and a fall time of the signal.

Abstract: A plurality of diode/resistor devices are formed within an integrated circuit structure using manufacturing equipment operatively connected to a computerized machine. Each of the diode/resistor devices comprises a diode device and a resistor device integrated into a single structure. The resistance of each of the diode/resistor devices is measured during testing of the integrated circuit structure using testing equipment operatively connected to the computerized machine. The current through each of the diode/resistor devices is also measured during testing of the integrated circuit structure using the testing equipment. Then, response curves for the resistance and the current are computed as a function of variations of characteristics of transistor devices within the integrated circuit structure and/or variations of manufacturing processes of the transistor devices within the integrated circuit structure.

Abstract: An input device comprises a processing system coupled with a plurality of receiver paths. The processing system comprises a first capacitor and a bypass switch. The first capacitor is configured to be selectively coupled with the plurality of receiver paths. The bypass switch is configured for bypassing the first capacitor. The processing system is configured to selectively couple a first receiver path of the plurality of receiver paths with the first capacitor; acquire a measurement of a first resulting signal from at least one of the first receiver path or a second receiver path of the plurality of receiver paths while the first receiver path is coupled with the first capacitor and while the bypass switch is not bypassing the first capacitor; and determine whether the first receiver path is ohmically coupled with the second receiver path based on the measurement of the first resulting signal.

Abstract: An apparatus and method for burning-in an electronic ballast for a lamp. The apparatus comprises a first stage for emulating an input impedance characteristic of a lamp for the electronic ballast and a second stage connected to the first stage for providing energy feedback to a power supply. An input of the first stage connects in use to the electronic ballast to be burnt-in. An output of the second stage connects in use to the power supply to provide energy feedback to said power supply from the electronic ballast being burnt-in. The energy-recyclable burn-in apparatus can emulate the lamp characteristics from start up to the steady state, process high-frequency ballast output power and recycle the power back into the power grid. The burn-in method includes operating the apparatus for a predetermined period of time such that a voltage applied to the electronic ballast simulates a steady-state operation of a lamp for the electronic ballast.

Abstract: A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool including at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact.

Abstract: A high-voltage discharge circuit diagnostic system includes a high voltage DC link with a positive DC link and a negative DC link, a first resistor selectably connectable between the positive DC link and the negative DC link, and a second resistor connected between the positive DC link and the negative DC link. A control module connects the first resistor between the positive DC link and the negative DC link until the high voltage DC link discharges to a first voltage after which the control module disconnects the first resistor from between the positive DC link and the negative DC link to permit continued discharge of the high voltage DC link through the second resistor to a second voltage through an elapsed time period. The control module diagnoses a fault in the second resistor based upon the first voltage, the second voltage, and the elapsed time period.

Abstract: A monitoring apparatus includes a detection circuit, a filter circuit, an amplifying circuit, a regulation circuit, a delay and charging circuit, and a driving circuit. The detection circuit receives a video signal, and performs an operation to obtain an image signal from the video signal. The filter circuit obtains an average intensity of a luminance signal corresponding to the image signal. The delay and charging circuit charges an input capacitor when receiving a low level regulated signal from the amplifying circuit. The driving circuit activates an alarm when a charging voltage of the chargeable capacitor exceeds a predetermined value.

Abstract: A device for detecting the thinning down of the substrate of an integrated circuit chip, including, in the active area of the substrate, bar-shaped diffused resistors connected as a Wheatstone bridge, wherein: first opposite resistors of the bridge are oriented along a first direction; the second opposite resistors of the bridge are oriented along a second direction; and the first and second directions are such that a thinning down of the substrate causes a variation of the imbalance value of the bridge.

Abstract: To improve the reliability in an electric inspection of a semiconductor device. When a movable pedestal 15 is being positioned relative to an arrangement direction of a plurality of second contact pins 13a by a positioning pin 13b which a socket 12 includes, a substrate conduction test is performed by bringing a first contact pin 14a into contact with a pre-stack land 5c of a wiring substrate 5 and of the a lower package 2 and moreover bringing the second contact pin 13a into contact with a solder ball 7, and thus the electric inspection can be performed by precisely positioning the first contact pin 14a side and the second contact pin 13a side. Then, the reliability of the electric inspection can be improved.

Abstract: A testing device which may be used to conduct ground resistance and soil resistivity measurements. The testing device comprises both a main unit and a remote unit adapted to communicate with one another via a communication link. After setting the testing device up according to the desired measurement technique, the procedure may be carried out, and the resulting measurement values are subsequently displayed on the remote unit. This allows a single operator to perform measurements while standing directly adjacent to an electrode, which is, for example, placed at a large distance from the main unit and/or other electrodes. This relieves the operator from constantly having to walk back and forth placing electrodes in different positions, and also obviates the need to return to the main unit of the testing device to consult a display and/or change parameters or settings.

Abstract: A nanopore device includes a membrane having a nanopore extending there through forming a channel from a first side of the membrane to a second side of the membrane. The surface of the channel and first side of the membrane are modified with a hydrophobic coating. A first lipid monolayer is deposited on the first side of the membrane, and a second lipid monolayer is deposited on the second side of the membrane, wherein the hydrophobic coating causes spontaneous generation of a lipid bilayer across the nanopore orifice. Sensing entities, such as a protein ion channel, can be inserted and removed from the bilayer by adjusting transmembrane pressure, and adapter molecules can be electrostatically trapped in the ion channel by applying high transmembrane voltages, while resistance or current flow through the sensing entity can be measured electrically.

Abstract: A heat spreader includes a plurality of sensors that indicate that the heat spreader is flat against and in thermal contact with a plurality of chips when the heat spreader is loaded upon a chip stack. One or more nodes within the sensors are connected by electric conductors. The resistances of the conductors may be compared to determine if the nodes within the sensors are relatively flat. Sensor flatness may be indicated to a higher level electronic device such as a visual display. The display may ultimately be viewed by a user to determine whether the heat spreader is flat and in thermal contact with the plurality of chips when the heat spreader is loaded upon the chip stack.

Abstract: Provided is a power storage apparatus having an impedance measuring function and is capable of, when the apparatus has a large number of power storage elements connected in series, judging a deteriorated power storage element in a short period of time. The power storage apparatus having the impedance measuring function measures and compares impedances of power storage units in a high-voltage side half and a low-voltage side half using a first judgment circuit, measures impedances of high-voltage side and low-voltage side power storage elements by selectively using a second judgment circuit installed adjacent to a power storage unit judged to have a large impedance. With this, the power storage apparatus identifies a power storage element that has high impedance among the whole and its impedance, and detects and displays deterioration or malfunction through a threshold-value judgment.

Abstract: Systems and methods can be provided for measuring the resistance of high power apparatuses. A device can include a current source connectable to a test object, and the ability for measuring current and/or voltage, wherein the current source is a capacitor. By providing the current source as a capacitor, a light weight device is obtained which can be used essentially continuously without periods of non-use during recharging.

Abstract: A seating sensing device embedded in a seat includes: a variable resistance unit generating resistance values corresponding to the circumference of the seat through a plurality of conductive threads installed in the seat; and a signal analysis unit analyzing variable quantities of the resistance values to acquire activity information on one or more of whether a user is seated or not, a seating posture, and a seating posture change.

Abstract: Methods for measuring the electrical resistance of a tire including establishing contact between a tread face portion of the omega section and a grounded conductive surface and establishing contact between a mounting portion of the omega section and a mounting rim. An embodiment further includes measuring electrical resistance between each of two or more internal nodes of the omega section and the grounded conductive surface, wherein the two or more internal nodes are each a metal component cured in the tire and measuring electrical resistance between each of the two or more internal nodes of the omega section and the mounting rim and measuring electrical resistance between each of the two or more internal nodes of the omega section. A method may further include identifying a least conductive portion of the omega section as being the portion having the highest measured electrical resistance.

Abstract: A substrate includes a first plate member; a plurality of first electrodes provided on the major surface of the first plate member, the first electrodes including at least one electrode for circuit connection and at least one monitor electrode separate from the electrode for circuit connection; a second plate member; a plurality of second electrodes provided on the major surface of the second plate member; a plurality of solder members provided between the first electrodes and the second electrodes for electrical connection therebetween, repeatedly; and a detector for detecting an electrical disconnection between at least one of the monitor electrode and the second electrode.

Abstract: A dynamic quantity sensor includes a first substrate, a fixed part arranged in the first substrate, a spiral shaped movable electrode arranged separated from the first substrate, one end of the spiral shaped movable electrode being supported by the fixed part, a fixed electrode positioned on the periphery of the movable electrode and arranged in a detection direction of a dynamic quantity, and a first terminal electrically connected to the fixed part and a second terminal electrically connected to the fixed electrode.

Abstract: A circuit for detecting changes in resistance at a solder joint connecting a constant voltage source supplying a first voltage and a pin of an array package during operation of the array package includes: a test circuit for applying a second voltage different from the first voltage at a side of the solder joint opposite the constant voltage source; and a monitoring circuit for monitoring an output of the test circuit, wherein the test circuit is configured to output the first voltage when the resistance at the solder joint is below a threshold value, and to output a voltage other than the first voltage when the resistance at the solder joint is above the threshold value, and wherein the monitoring circuit is configured to indicate a failure of the solder joint connection when the voltage other than the first voltage is output by the test circuit.

Abstract: A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool that includes at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact.

Abstract: A fault position analysis method and a fault position analysis device for a semiconductor device, through which a fault position of a SiC semiconductor device can be analyzed and specified by an OBI RCH method, are disclosed. The fault position analysis method for the semiconductor device scans and irradiates a device and a circuit on a front surface of a substrate with a laser beam from a rear surface side of the substrate of the semiconductor device to heat the device and the circuit. It causes a current to flow to the device and the circuit while being heated, detects a change in a resistance value caused by a change in a current, and analyzes the fault position. The semiconductor device is a semiconductor device which uses an N-doped SiC substrate. Laser beams having wavelengths of 650 to 810 nm are used.

Abstract: A circuit, system and method for detecting the presence of a leakage path in a multi-cell voltage source is described. The system includes a detection circuit, the detection circuit having a first amplifier and a second amplifier, a first input of the first amplifier connected to a first terminal of the voltage source and the first input of the second amplifier connected to a second terminal of the voltage source, a second input of each of the first and second amplifiers connected to a reference voltage point, and an output of each of the first and second amplifiers connected to a respective first and second output of the detection circuit; and a processor having inputs connected to the first and second outputs of the detection circuit.

Abstract: An electronic device is provided, which includes a current supplying stage which is adapted to supply a first compensation current and a second compensation current to a first wire or a second wire, wherein the first compensation current is determined during a first clock period, when the first wire and the second wire are connected. The second compensation current is determined during a second clock period while the first wire and the second wire are not connected and the magnitude of the second current represents a ratio of a resistance value of the first wire and a resistance value of the second wire.

Abstract: An electrical test device including at least one transducer to detect a status of a circuit under test, and at least one indicator located remotely from the at least one transducer to display the status of the circuit under test.

Abstract: Systems, methods, and devices for detecting display panel or other patterned device fractures or microfractures using outer resistive trace(s) on the display panel or the other patterned device. To provide just one example, a system may include a display and data processing circuitry. The display may include a display panel with an outer resistive trace disposed near edges of the display panel. The display may include discontinuity detection circuitry that can detect the occurrence of a discontinuity of the outer resistive trace. The data processing circuitry may determine whether the display panel is likely to suffer a catastrophic failure based at least in part on the occurrence of the discontinuity. The data processing circuitry may also cause the display to display a user warning when the display panel is likely to suffer the catastrophic failure.

Abstract: A secure data entry device including a housing, tamper sensitive circuitry located within the housing and tampering alarm indication circuitry arranged to provide an alarm indication in response to attempted access to the tamper sensitive circuitry, the tampering alarm indication circuitry including at least one conductor, a signal generator operative to transmit a signal along the at least one conductor and a signal analyzer operative to receive the signal transmitted along the at least one conductor and to sense tampering with the at least one conductor, the signal analyzer being operative to sense the tampering by sensing changes in at least one of a rise time and a fall time of the signal.

Abstract: A device for detecting interruptions in a ring bus has a first interface configured so that it permits connection of a first free end of a line of the ring bus so that the device transmits data to bus elements of the ring bus via the first interface, a second interface configured so that it permits connection of the second free end of the line of the ring bus, and the device detects a creeping interruption of the line of the ring bus.

Abstract: A set of parameters of an evaluation structure are extracted by applying a radio frequency (RF) signal through a first capacitive contact and a second capacitive contact to the evaluation structure. Measurement data corresponding to an impedance of the evaluation structure is acquired while the RF signal is applied, and the set of parameters are extracted from the measurement data. In an embodiment, multiple pairs of capacitive contacts can be utilized to acquire measurement data. Each pair of capacitive contacts can be separated by a channel having a unique spacing.

Abstract: Methods to determine the location of an arc fault include a first method utilizing the inherent resistance per unit length of the wire. A second and a third method utilize an inherent inductance per unit length of the wire. The second method derives the inherent inductance from the output voltage and a rate of current rise. The third method derives the inherent inductance from a resonant frequency of an oscillating current. The information is useful to locate a fault emanating from a wire member of a wiring harness used to distribute power about an aircraft.

Abstract: A semiconductor device and a defect analysis method of a semiconductor device, in which a failure location can be easily identified. The semiconductor device is provided with at least 2N resistor patterns having a fixed form, and being divided into N groups; the resistor patterns of each group are disposed in parallel, in sequence, and at an equal pitch, so that (N?1) resistor patterns of another group interpose between a resistor pattern of each of the groups and another resistor pattern within the group in question; the resistor patterns of each of the groups is connected in series with other resistor patterns with the group; and the resistor patterns of each of the groups, which are connected in series, are additionally connected in series to resistor patterns of another group. Measuring pads are provided respectively between two ends of resistor patterns that are connected in series, and groups.

Abstract: Certain embodiments of the invention may include systems, methods, and apparatus for locating possible fault locations in an electrical power network. According to an example embodiment of the invention, a method is provided for locating possible fault locations in an electrical power network. The method can include receiving fault information including one or more of: an identifier associated with at least one tripping device or a fault impedance value associated with a faulted section of the electrical power network; determining a fault direction; and generating a list of possible fault locations based at least in part on the received fault information and the fault direction.

Abstract: A method for determining an adjustment value for an electrical protection device wherein, upon occurrence of a ground short circuit, first current indicator measured values and first voltage indicator measured values are captured by a first measurement device at a first end of a segment of an electrical power supply line, and second current indicator measured values and second voltage indicator measured values are captured by a second measurement device at a second end of the segment of an electrical power supply line. In order to design a method of this type such that an adjustment value for a ground impedance can be determined in a relatively simple fashion.

Abstract: A testing device which may be used to conduct ground resistance and soil resistivity measurements. The testing device comprises both a main unit and a remote unit adapted to communicate with one another via a communication link. After setting the testing device up according to the desired measurement technique, the procedure may be carried out, and the resulting measurement values are subsequently displayed on the remote unit. This allows a single operator to perform measurements while standing directly adjacent to an electrode, which is, for example, placed at a large distance from the main unit and/or other electrodes. This relieves the operator from constantly having to walk back and forth placing electrodes in different positions, and also obviates the need to return to the main unit of the testing device to consult a display and/or change parameters or settings.

Abstract: A motor control circuit 1 for controlling driving of a plurality of motors is provided with a plurality of motor driver circuits 7 and 8 for controlling driving of the plurality of motors 3 and 4, a plurality of excess current detection circuits 39 and 40 each for detecting an excess current flowing through corresponding one of the plurality of motors 3 and 4 to determine which motor driver circuit among the plurality of motor driver circuits 7 and 7 caused the excess current. The motor control circuit further includes a nonvolatile memory 46 configured to receive detection results from the plurality of excess current detection circuits 39 and 40 and store information on which motor driver circuit among the plurality of motor driver circuits 7 and 8 caused the excess current.

Abstract: PDs that can be supplied through the LAN line are discriminated from PDs that cannot be so supplied as a function of the resistance of the supply line and of the voltage drop caused by nonlinear elements in series therewith. The values of these two parameters are estimated by applying two distinct voltages to the supply terminals of the LAN line and sensing the relative steady-state currents absorbed by the power supply line, and by processing voltage and current values for estimating the resistance of the line and the voltage drop caused by nonlinear elements connected in series therewith.

Abstract: An optical reproducing apparatus connectable to optical pickups and a method of controlling an optical pickup thereof are provided. The optical reproducing apparatus measures resistance of an optical pickup on a port of a connection unit to which the optical pickup is connected, and determines the type of the optical pickup according to the measured resistance. Accordingly, optical reproducing apparatuses may be controlled according to the type of optical pickups, and manufactured using various optical pickups without checking the type of optical pickups, which allows convenient manufacturing of optical reproducing apparatuses.

Abstract: A method for testing a characteristic impedance of a signal path routing of a printed circuit board (PCB) controls the test device to test a characteristic impedance of the signal path routing of the PCB to get test data of the signal path routing of the PCB. The method further analyzes the test data of the signal path routing of the PCB get analysis results, generate a test report for storing the test data of each signal path routing of the PCB and the analysis results if all signal path routings of the PCB have been tested.

Abstract: A detecting circuit measures at least one response characteristic of an output channel in an electro-acoustic transducer system. A memory stores a plurality of equalizations, each equalization corresponding to a known electro-acoustic transducer system associated with at least one response characteristic stored in the memory. A processor in communication with the detecting circuit and the memory selects one of the stored response characteristics matching the response characteristic measured by the detecting circuit. In some cases, an appropriate equalization is loaded based on the selected response characteristic.

Abstract: A system and associated methods for acquiring and analyzing LEIS data from a buried structure, such as a pipeline. A special probe having adjustable electrodes is placed in the soil above the structure. A voltage is applied to the structure, causing more current to emanate from a coating defect than from intact coating. The probe electrodes acquire a response signal, which is analyzed to detect the defect.

Abstract: A device and method for detecting connections of a 4- or 5-terminal resistive touch panel are disclosed. The device includes five terminals and a detecting unit. When the five terminals are connected to the touch panel, the detecting unit provides a high potential and a low potential to first and last of the five terminals, respectively, thereby determining whether the touch panel is a 4- or 5-terminal resistive touch panel by determining if there is a closed circuit between the two terminals.

Abstract: A power distribution unit (PDU) testing apparatus includes a main power plug, a number of branch power plugs, a main switch, a number of branch switches, and a number of loads. The main switch and the branch switches are single-pole double-throw switches. A first terminal of the main power plug is connected to the first throw of the main switch. The second throw of the main switch is idle. The pole of the main switch is connected to the second throws of the branch switches. The first throws of the branch switches are respectively connected to first terminals of the branch power plugs. Second terminals of the branch power plugs are connected a second terminal of the main power plug. The poles of the branch switches are respectively connected to first terminals of the loads. Second terminals of the loads are connected to the second terminal of the main power plug.