Abstract: A device and method for detecting connections of a 4- or 5-terminal resistive touch panel are disclosed. The device includes five terminals and a detecting unit. When the five terminals are connected to the touch panel, the detecting unit provides a high potential and a low potential to first and last of the five terminals, respectively, thereby determining whether the touch panel is a 4- or 5-terminal resistive touch panel by determining if there is a closed circuit between the two terminals.

Abstract: A device and method for detecting connections of a 4- or 5-terminal resistive touch panel are disclosed. The device includes five terminals and a detecting unit. When the five terminals are connected to the touch panel, the detecting unit provides a high potential and a low potential to first and last of the five terminals, respectively, thereby determining whether the touch panel is a 4- or 5-terminal resistive touch panel by determining if there is a closed circuit between the two terminals.

Abstract: A device and method for detecting connections of a 4- or 5-terminal resistive touch panel are disclosed. The device includes five terminals and a detecting unit. When the five terminals are connected to the touch panel, the detecting unit provides a high potential and a low potential to first and last of the five terminals, respectively, thereby determining whether the touch panel is a 4- or 5-terminal resistive touch panel by determining if there is a closed circuit between the two terminals.

Abstract: A method for evaluating the integrity of a cable shield utilizing wideband noise-to-ground measurements is provided. Upon determining that trouble with the cable shield exists, a method s is provided to isolate the location of the trouble with the cable shield. The method utilizes access locations along the cable and therefore does not require opening of the cable shield to isolate the trouble in the shield.

Abstract: A probe resistance measuring method includes measuring first resistances at three or more nodes by making contact at least a part of a plurality of probes of a probe unit with three or more pads for resistance measurement based on a first correspondence relation. The measured resistances are stored as a first measurement result and contact resistances of the plurality of probes of the probe unit are calculated based on the first measurement result.

Abstract: Provided is a test apparatus that tests a device under test, comprising: a plurality of modules that each include an output circuit that outputs a prescribed output signal to the device under test and a measurement circuit that measures a prescribed characteristic of the device under test; and a control section that, for each module, causes the measurement circuit to measure output of the output circuit and diagnoses the module based on a measurement result of the measurement circuit. Each measurement circuit measures the output of the corresponding output circuit in parallel, and the control section is provided in common to the plurality of modules and sequentially reads the measurement result of the measurement circuit of each module.

Abstract: The present invention relates to a test structure that comprises at least two devices under test DUT, which respectively have a first electrical device resistance in a non-defect state and a second electrical device resistance in defect state, the first being higher than the second electrical device resistance. In the test structure the DUTs are connected in parallel to a first test contact pad via a first conducting line and connected in parallel to a second test contact pad via a second conducting line, and respectively connected to the first conducting line via respective first test resistors, which have known respective electrical test resistances, such that a total electrical resistance between the first an second test contact pads is indicative of the number of DUTs, which have the second electrical device resistance. The test structure allows testing a larger number of DUTs in parallel in a single measurement.

Abstract: In various embodiments, a dosimeter is employed to passively record a peak pressure (e.g., a peak blast pressure) and/or a maximum acceleration experienced by the dosimeter.

Abstract: A method of improving the clean, rinse and dry processes during the manufacture of ICs, MEMS and other micro-devices to conserve solution and energy while completing the process within a specified time. An electro-chemical residue sensor (ECRS) provides in-situ and real-time measurement of residual contamination on a surface or inside void micro features within the sensor representative of conditions on production wafers. The in-situ measurements are used to design and optimize a production process. The wafers are manufactured in accordance with the production process without the ECRS.

Abstract: A detection circuit and one or more wires or circuit traces are included in a die. The combination is used to detect mechanical failure of the substrate, e.g. silicon after singulation of the dice from the wafer. Failures may be detected at different regions or planes within the die, and the tests may be performed during operation of the packaged die and integrated circuit, even after installation and during operation of a larger electronic device in which it is incorporated. This is especially useful for chip scale packages, but may be utilized in any type of IC package.

Abstract: An impedance measurement method for circuits that has multiple power supply ports and a common ground shared by the multiple power supply ports, that includes finding multiple mutual impedances; finding approximate values for the ground impedance from the multiple mutual impedances; calculating multiple power supply port impedances from the approximate ground impedance values; and generating an equivalent circuit for the applicable circuit based on the ground impedances.

Abstract: A method for measuring transconductance of an oscillating circuit is provided. The oscillating circuit includes an inverter. When an input terminal and an output terminal of the inverter are floated, the bias voltage of the inverter is obtained by measuring the output terminal thereof. Based on floating the input terminal and respectively providing a first voltage and a second voltage to the output terminal, a first current corresponding to the first voltage and a second current corresponding to the second voltage are measured from the output terminal. The first voltage and the bias voltage have the same voltage levels. An output resistor value of the inverter is obtained according to the first and second voltages and the first and second currents. The transconductance of the oscillating circuit is obtained according to the output resistor value.

Abstract: The inventive concept provides a wafer test method and a wafer test apparatus. The wafer test method can recognize the amount of residuals generated in a sidewall of the metal-containing layer pattern and the extent of corrosion of a sidewall of the metal-containing layer pattern using the measured electric resistance by supplying an electrolyte so that the electrolyte is in contact with a portion of the metal-containing layer pattern in a predetermined chip region and measuring an electric resistance between a first electrode which is electrically in contact with the other portion of the metal-containing layer pattern and a second electrode which is in contact with the electrolyte in the predetermined region. Thus, a wafer test method and a wafer test apparatus can be embodied by an in-line method without dividing a wafer into each chip.

Abstract: A circuit is provided that includes a power source and a sensor circuit electrically coupled by a switch to the power source. The circuit further includes an A/D converter electrically coupled to the sensor circuit and adapted to read a voltage difference across a resistive element to determine an impedance of the sensor circuit. A method is provided that includes closing a switch electrically coupling a power source to a sensor circuit and measuring a voltage difference across a resistive element at an A/D converter electrically coupled to the sensor circuit. The method further includes determining an impedance of the sensor circuit based on the voltage difference.

Abstract: A circuit, system, machine-readable storage medium and method for detecting the presence of a leakage path in a multi-cell voltage source is described. The system includes a detection circuit, the detection circuit having a first, second and third amplifiers, a first input of the first amplifier connected to a first terminal of the voltage source and the first input of the second amplifier connected to a second terminal of the voltage source, a second input of each of the first and second amplifiers connected to a reference capacitor, and an output of each of the first, second and third amplifiers connected to a respective first, second and third outputs of the detection circuit; and a processor having inputs connected to the first and second outputs of the detection circuit.

Abstract: A method is provided for fault location in uncompensated power lines with two-end unsynchronized measurement, finding an application in the power industry and for overhead and overhead-cable transmission or distribution lines. The method according to the invention includes measuring the voltage and currents at both ends (A) and (B) of the section, obtaining the phasor of the positive sequence voltages (VA1, VB1) measured at the ends (A) and (B), respectively, obtaining the phasor of the positive sequence currents (IA1, IB1) measured at the ends (A) and (B), respectively, determining whether there is a three-phase balanced fault, and using either a first subroutine or a second subroutine (depending on whether or not there is a fault), determining a distance (d) to the fault.

Abstract: Input channel diagnostics for an industrial process control system that provides improved apparatus and methods relating to fault containment, overload protection and input channel diagnostics. The input circuit includes one or more series resistors that have a total resistance that is at least two orders of magnitude greater than the magnitude of the resistance of a conditioned sensor signal source.

Abstract: A method for detecting cell failure within a battery pack based on variations in the measured electrical isolation resistance of the battery pack is provided. The method includes the steps of monitoring the isolation resistance; determining when the isolation resistance falls below a first preset value; determining how long it takes for the electrical isolation resistance to recover to greater than a second preset value; determining when the isolation resistance falls below a third preset value; and performing a predetermined response after the electrical isolation resistance falls below the first preset resistance value and recovers to greater than the second resistance value and then falls below the third preset resistance value and if the time period is within a preset time range.

Abstract: The present invention employs identically sized mirror transistors arrange in groups that may be preferentially addressed and activated to determine the value of a resistor. Known current are directed through the resistor, and the voltage developed is measured by comparing against a reference voltage. The current is increased or decreased by the least significant value until the voltage across the resistor matches the reference voltage. A successive approximation or other known technique may be used instead. A reference current is developed that temperature stable and that is trimmed when manufactured to reduce process effects. The reference voltage may be constructed to be independent form a local power source so that the system is relatively independent of process, voltage and temperature, PVT.

Abstract: A unified test structure which is applicable for all levels of a semiconductor device including a current path chain having a first half chain and a second half chain, wherein each half chain comprises lower metallization segments, upper metallization segments, an insulating layer between the lower metallization segments and the upper metallization segments, and connection segments. Each of the connection segments is electrically connected to a contact region of one of the lower metallization segments and to a contact region of one of the upper metallization segments to thereby electrically connect the respective lower metallization segment and the respective upper metallization segment, and the first half chain and the second half chain are of different configuration.

Abstract: A storage battery inspecting system includes a power supply unit and an inspecting unit. The inspecting unit includes two inspecting terminals to be connected to a battery soldering spot so as to detect response of the soldering spot to application of a test power signal by the power supply unit, and a control module for determining if a detected response of the soldering spot falls within a predetermined range configured in the control module, generating an indication signal if the detected response falls outside the predetermined range, and generating an inspection result corresponding to the detected response. The inspecting unit further includes an indication interface for outputting the indication signal, a transmission interface permitting supply of the inspection result to a processing device, and a control interface permitting supply of a control signal generated by the control module to a peripheral device for controlling operation of the peripheral device based on the detected response.

Abstract: A method for detecting cell failure within a battery pack based on variations in the measured electrical isolation resistance of the battery pack is provided. The method includes the steps of monitoring the isolation resistance; determining when the isolation resistance falls below a preset value; and performing a predetermined response when the isolation resistance falls below the preset value. The method may include additional steps such as (i) determining how long the isolation resistance remains below the preset value; (ii) determining the rate of change in the isolation resistance; (iii) determining how long it takes for the electrical isolation resistance to recover; (iv) determining when the isolation resistance falls below a third preset value, wherein this step is performed after the isolation resistance recovers to greater than the second preset value; and (v) monitoring for a secondary effect associated with cell failure.

Abstract: A load compensation method for phase-to-ground loops in distance protection. A first reactive reach is estimated assuming zero fault resistance or with a positive sequence current. A second reactive reach is estimated with a zero sequence current. A third reactive reach is estimated with a negative sequence current. An import or export condition is estimated. A fourth reactive reach for import or export condition is estimated based on the first, second and third reactive reach. A fault impedance is estimated based on the estimated fourth reactive reach.

Abstract: An electrical waveform is received over an electrical power line. A plurality of nominal electrical parameters are determined for the electrical power network and the plurality of nominal electrical parameters are associated with a state of the electrical power network in the absence of at least one transitory electrical fault in the network. Subsequently, a plurality of electrical parameters of the electrical waveform are sampled when the at least one transitory electrical fault exists in the network. A plurality of inductances are determined based at least in part upon a comparison of the nominal electrical parameters and the plurality of sampled electrical parameters. The plurality of inductances are representative of inductances present in the network when the at least one transitory electrical fault exists in the network. The plurality of inductances are analyzed to determine a distance and/or direction to the at least one electrical fault.

Abstract: Electronic devices operate in an analog world and their circuitry is subject to non-linear environmental effects that can cause operational problems. Selecting components for a design for a capacitor-charging circuit that incorporates a current-limiting resistor and uses non-linear power supplies, either means having to test every possible combination of elements, and suffering a resultant ‘combinatorial explosion’ as complexity increases, or choosing to over-engineer against untested surprise failure points. Doing the latter in a cost-efficient manner through a min/max/log-set testing series also enables use of non-linear power supplies whose parameters are not known due to competitive or trade secret protective efforts by their manufacturers.

Abstract: Systems and methods (the “utility”) presented herein provide for the assessment of acousto-electrical probes, such as their connections (e.g., transducer leads) and their response characteristics. For example, the utility may provide for readily evaluating transducer leads that have been broken and/or detached from transducers within an ultrasound probe. Due to the increasing complexity of ultrasound probes, identification of broken and/or detached transducer leads also becomes increasingly complex. Being able to identify such disconnected transducer leads may enable a person to repair, or “reterminate”, these transducer leads leading to a potentially substantial cost savings, the least of which being incurred by avoiding total replacement of an ultrasound probe.

Abstract: A device for detecting the presence of bodily fluid, the device including a detector (1) means having two spaced apart electrodes (2, 3), each electrode is connected to a signal generating means via a lead (6, 7). The electrodes are encased in a flexible non-conductive material with each including at least one protruding conductive element (4). The protruding elements are separated by the same distance as the spacing between the two electrodes. The device also includes a signal processing means that detects a change of state across the electrodes produced by the introduction of a fluid and an alarm actuated by the change of state.

Abstract: An eFuse with at least one fuse unit is provided. The fuse unit includes a common node, a sensing unit with a first input terminal and a second input terminal, at least one fuse coupled between the common node and the first input terminal of the sensing unit with a resistance, and a switching unit coupled between the common node and the second input terminal of the sensing unit. A resistance of the switching unit is equivalent to a first resistance in a normal mode and equivalent to a second resistance in a test mode, and the second resistance is higher than the first resistance. The sensing unit generates an output signal indicating whether the fuse is blown or not according to the resistances of the fuse and the switching unit.

Abstract: It is disclosed to measure the impedance of a read-out line. The read-out line includes at least two cascaded electrical circuit segments, each electrical circuit segment including two longitudinal arms, wherein one of the longitudinal arms includes an electrical component, and a lateral arm including a switch configured to close in the presence of an object in the vicinity of the switch. The measured impedance of the read-out line can be compared to a preset value corresponding to an allowable value of the impedance of the read-out line.

Abstract: An integrated circuit has an inhomogeneous protective layer or coating over a circuit to be protected, and a sensing circuit (80) arranged to sense a first impedance of a part of the protective coating compared to a reference impedance (CO) located on the integrated circuit. The sensing circuit is able to measure a change in the first impedance, e.g. caused by tampering. The sensing circuit has an amplifier (OTA) having a feedback loop, such that the impedance being sensed is in the feedback loop. The sensing circuit can be incorporated in an oscillator circuit (OTA, Comp) so that the frequency depends on the impedance. Where the impedance is a capacitance, sensing electrodes adjacent to the protective layer or coating, form the capacitance. The electrodes can be arranged as selectable interdigitated comb structures, so that the protective layer or coating extends in between the teeth of the comb structures.

Abstract: The present invention relates to a switching device for generating a switch signal, a reading device with the switching device and a method for the communication between a reading device and a transponder (T). The switching device includes an antenna (4), which with the help of an adapter circuit (AN) is adapted to a given resistance, and a measuring bridge (1), which includes two voltage dividers connected in parallel. The resistance acts in one of the voltage dividers and in the case of a change of the resistance the measuring bridge (1) generates the switch signal. This means when a transponder reaches the detection range of a reading device having the switching device, an additional impedance is coupled in, which acts on the measuring bridge (1). This change is recognized and leads to the generation of the switch signal.

Abstract: A method of improving the clean, rinse and dry processes during the manufacture of ICs, MEMS and other micro-devices to conserve solution and energy while completing the process within a specified time. An electro-chemical residue sensor (ECRS) provides in-situ and real-time measurement of residual contamination on a surface or inside void micro features within the sensor representative of conditions on production wafers. The measured impedance can be used to determine what process variables and specifically how process conditions affect the rate of change of the measured impedance. The in-situ measurements are used to design and optimize a production process and/or to monitor the production run in real-time to control the process conditions and transfer of a patterned wafer through the processes.

Abstract: A logarithmic level detector (9) produces analog signals that represent logarithms of the voltage across, and current through, a target device (7). These signals are then passed to a processor (1) that performs a digital conversion. Because the digital conversion takes place after logarithmic conversion, it becomes possible to obtain an appropriate resolution for all signal levels, and a calculation of impedance of a target device, with reduced error, is enabled.

Abstract: The present invention provides a test strip for measuring a signal of interest in a biological fluid when the test strip is mated to an appropriate test meter, wherein the test strip and the test meter include structures to verify the integrity of the test strip traces, to measure the parasitic resistance of the test strip traces, and to provide compensation in the voltage applied to the test strip to account for parasitic resistive losses in the test strip traces.

Abstract: An impedance measuring method uses an impedance measuring device for measuring an impedance of a measured electronic component, a coaxial connector electrically connected to the impedance measuring device, and a measurement substrate which can be housed in the coaxial connector. The coaxial connector has a center conductor and an outer conductor located outside the center conductor. The measurement substrate has an insulating substrate and first and second conductors each formed on a first principal surface of the insulating substrate. The measurement substrate with the measured electronic component being mounted on the first and second conductors is housed in the coaxial connector connected to the impedance measuring device, so as to electrically connect the first conductor to the center conductor and electrically connect the second conductor to the outer conductor. Then the impedance of the measured electronic component is measured by the impedance measuring device.

Abstract: Apparatuses and methods are provided for determining electrode impedances of a bioelectric signal-monitoring/recording system that includes an amplifier, and electrodes connected between a subject and the amplifier. An example apparatus includes: a voltage source outputting a voltage signal; a switching arrangement including an input electrically connected with the voltage source for receiving the voltage signal, an output electrically connected with the amplifier and the electrodes, and switches between the input and the output; and a controller in communication with the switches for opening and closing the switches to establish signal paths between the voltage source and the output, the controller calculating the electrode impedances relative to voltage outputs of the amplifier for each signal path.

Abstract: A test and measurement instrument including a port including a plurality of connections; an impedance sense circuit configured to sense an impedance coupled to a connection of the plurality of connections; and a controller configured to setup the test and measurement instrument in response to a sensed impedance from the impedance sense circuit.

Abstract: Proposed is a magnetic valve with manual override, through the actuating element of which a magnetic core that serves as a valve element or that is connected to a valve element can be shifted from an off position into an operating position without excitation of a magnetic coil system assigned to it. To detect the position of the magnetic core that is held in the operating position by the manual override there is provided a coil current monitoring device that monitors the rise of the coil current after the magnetic coil system has been switched on, which device has a detection device for detection of the absence of a drop in current as formed by movement of the magnetic core after being switched on and a signaling device for electrical signaling of a position of the magnetic core that is held in the operating position by the manual override if said drop in current is absent.

Abstract: The present disclosure relates to an impedance-based arc detector for CT scanners and method of use and diagnosis therewith, and more specifically, to a two- or three-way conductive probe detector system and associated signal processing unit to distinguish the location of arc faults on a CT scanner at either the high-voltage cable of an x-ray tube, an anode connected to the x-ray tube, a cathode also connected to the x-ray tube, a high-voltage well, or a power distribution unit of the tube.

Abstract: A microelectronic device comprising one or several metallic levels provided with one or several superposed metallic interconnecting levels and at least one test structure: at least one metallic zone formed in at least one insulating zone, the metallic zone comprising: at least one first metallic portion through which a current will be injected and at least one second metallic portion through which said current will be extracted, at least one third metallic portion that will act as a first voltage measurement point, and at least one fourth metallic portion that will act as a second measurement point for said voltage, a plurality of insulating islands incorporated in said metallic zone, said structure also comprising: a plurality of metallic islands incorporated in the insulating zone and distributed around said metallic zone.

Abstract: A method of detecting faulty via holes of a printed circuit board. The printed circuit board including a number of electric trace segments.

Abstract: A video circuit including a video amplifier adapted to generate an amplified output video signal from an input video signal; a short detection circuit adapted to generate a first signal indicative of whether there is a short present at an output of the video amplifier; and a load detection circuit adapted to generate a second signal indicative of whether there is a load coupled to the output of the video amplifier. The video circuit may further include an input signal detection circuit adapted to generate a third signal indicative of whether an input video signal is present. The third signal generated by the input signal detection circuit may be used to enable the outputting of the first and second signals in order to prevent the false indication of faults at the output of the video amplifier in the absence of an input video signal.

Abstract: A method and a system for determining a circular characteristic for distance protection of a three-phase electric line, the system comprising means for detecting a fault on the electric line, means for identifying a faulted phase or phases of the electric line, means for determining, at a measuring point, a first fault loop impedance by using voltage(s) of the faulted phase(s), a second fault loop impedance by using a polarization voltage and a third fault loop impedance by using predetermined line parameters, and means for determining a radius and midpoint of the circular characteristic.

Abstract: A method of monitoring voltage stability within an electrical power system comprises the steps of establishing a dynamic power system stability margin based on an operating characteristic of the power system; indicating that the power system has become unstable when the dynamic power system stability margin falls below a predetermined value; and initiating dynamic load shedding and/or restoration depending on stability margin.

Abstract: A method and program prevents a user from bypassing a limit placed on a specified operating life of a sensor by disconnecting and reconnecting the sensor. The present invention checks a characteristic of the sensor to see if the sensor is used prior to the connection of the sensor, and rejects the sensor if the sensor is determined to have been used before. The process of checking the characteristic of the sensor involves performing an Electrochemical Impedance Spectroscopy (EIS) procedure and calculating an impedance value. The impedance value can be compared to various threshold values for a variety of purposes including the determination of age, condition, hydration, and stabilization of the sensor.

Abstract: One exemplary embodiment is a method for detecting existence of an undesirable particle between a planar lithographic object, such as a semiconductor wafer or a lithographic mask, and a chuck during semiconductor fabrication. The exemplary method in this embodiment includes placing the planar lithographic object, such as the semiconductor wafer, over the chuck. The method further includes measuring a change in at least one electrical characteristic formed by and between the chuck and the planar lithographic object, such as measuring a change in capacitance between the chuck and semiconductor wafer, caused by the undesirable particle.

Abstract: A sensor device determines a value based on a sensed parameter by applying a voltage across two voltage terminals of a sensor. In response, the sensor provides an electrical signal representative of a sensed parameter to a controller via a pair of conductors. The controller samples the electrical signal to determine the value. In addition, the controller alternates the polarity of the voltage applied to the voltage terminals, thereby reducing the risk of damage to the conductors due to ion drift.

Abstract: A method is present for remotely controlling, monitoring, and analyzing loop resistance in a vehicle. A loop resistance test unit is positioned in the vehicle. A set of commands is sent from a monitoring unit to the loop resistance test unit over a wireless communications interface. Measurements are generated with the loop resistance test unit in response to the set of commands. The measurements are received from the loop resistance test unit at the monitoring unit in response to the set of commands send over the wireless communications interface.

Abstract: Methods, systems, and articles of manufacture consistent with the present invention determine the type of damage to a wire, the amount of damage, and the location of the damage based on the wire's broadband impedance measured from a single measurement point. The type of damage is determined by comparing the wire's calculated dielectric function, resistance and inductance to known values that correspond to types of wire damage. The amount of damage is determined by comparing the wire's low-frequency impedance phase to known low-frequency impedance phase information that corresponds to a known amount of wire damage. The location of damage is determined by comparing the wire's high-frequency impedance phase to known high-frequency impedance phase information that corresponds to a known location of wire damage.

Abstract: The condition of a lamp (1) for heating blank bodies made of thermoplastic material, intended for the manufacture of containers by blow moulding or stretch-blow moulding, is detected. The infrared electromagnetic radiation lamp has an envelope (2) made of glass or quartz enclosing a filament (3); the lamp is provided with an electrically conductive element (6) mechanically integral with the envelope; the conductive element is made electrically live and an electrical variable is continuously detected between the terminals of the conductive element when the lamp is in operation; and data representative of the condition of the conductive element, and of the envelope, is supplied.