To Determine Dimension (e.g., Distance Or Thickness) Patents (Class 324/716)
  • Patent number: 9752874
    Abstract: A system for measuring dimensions and/or other internal properties of a shoe, garment or other object of interest is described. The system includes a fixture having a measurement tip. When the tip is placed inside of the object of interest, a processor collects positional data from the fixture to develop a three-dimensional model of the interior of the object. If the measurement tip includes one or more pressure sensors, the processor may collect pressure data and use the pressure data to include stretch properties in the three-dimensional model.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: September 5, 2017
    Assignee: Amazon Technologies, Inc.
    Inventors: Matthew Tyler Wilkinson, Grant B. Fresen, Nicholas B. End, Michael Lin
  • Patent number: 9279753
    Abstract: A microelectromechanical device for electromechanical testing a specimen having a nano-scale dimension is formed on a multi-layered semiconductor substrate (chip) and includes an electrothermal or electrostatic actuator for applying a displacement load (force) to the specimen, a load sensor for sensing the load (force) experienced by the specimen. The specimen is disposed between first and second movable shuttles of the actuator and load sensor, which shuttles comprise electrically insulating layers so as to electrically isolate the shuttles and specimen from the actuator and the load sensor on the substrate. A four-terminal Kelvin array is provided to provide specimen electrical characterization measurements and includes first and second outer terminals connected to a current source and to opposite end locations of the specimen and first and second inner terminals connected to a high input impedance voltage meter and to the specimen at other locations between the first and second outer terminals.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: March 8, 2016
    Assignee: Northwestern University
    Inventors: Horacio Dante Espinosa, Rodrigo A. Bernal Montoya
  • Patent number: 9267969
    Abstract: One embodiment includes a method for protecting from the accidental application of an electrical potential to an incorrect pin of a multipin electrical connector during testing. A sleeve is fitted around a pin that is not to have potential applied to it such that the pin is protected from accidental application of potential during testing.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: February 23, 2016
    Assignee: Hamilton Sundstrand Corporation
    Inventor: John A. Kleindienst
  • Patent number: 9250642
    Abstract: A constant current generating circuit and constant current generating method applied to a chip are provided, where the chip includes a first current generating circuit and a second current generating circuit, the second current generating circuit includes a transistor and an adjustable resistor. The constant current generating method includes: connecting an external resistor to the first current generating circuit to make the first current generating circuit use the external resistor to generate a first current; utilizing the second current generating circuit to generate a second current; adjusting the adjustable resistor in accordance with the first current and the second current to make the second current substantially equal to the first current, where the second current serves as a constant current of the chip.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: February 2, 2016
    Assignee: Realtek Semiconductor Corp.
    Inventor: Chien-Ming Wu
  • Patent number: 9252202
    Abstract: Provided is a test pattern structure for determining overlay accuracy in a semiconductor device. The test pattern structure includes one or more resistor structures formed by patterning a lower silicon layer. Each includes a zigzag portion with leads at different spatial locations. An upper pattern is formed and includes at least one pattern feature formed over the resistor or resistors. The portions of the resistor or resistors not covered by the upper pattern feature will become silicided during a subsequent silicidation process. Resistance is measured to determine overlay accuracy as the resistor structures are configured such that the resistance of the resistor structure is determined by the degree of silicidation of the resistor structure which is determined by the overlay accuracy between the upper and lower patterns.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: February 2, 2016
    Assignee: WAFERTECH, LLC
    Inventor: Daniel Piper
  • Patent number: 9159646
    Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: October 13, 2015
    Assignee: Intel Corporation
    Inventors: Mayue Xie, Zhiyong Wang, Yuan-Chuan Steven Chen
  • Patent number: 9095071
    Abstract: Provided is a method for manufacturing a multi-layer wiring board and the multi-layer wiring board that are capable of suppressing variation in resistance values. The method according to the present invention is the method for manufacturing a multi-layer wiring board. The method includes forming a resistor thin film, measuring resistance distribution of the resistor thin film, calculating resistor width adjustment rates of the plurality of resistors according to the resistance distribution, forming a pattern of a protective film on the resistor thin film, in which the pattern of the protective pattern has pattern width according to the resistor width adjustment rate, forming a pattern of a plating film on the resistor thin film at a position exposed from the protective film, and etching the resistor thin film at a position exposed from the plating film and the protective film so as to pattern the resistor thin film.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: July 28, 2015
    Assignee: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Yoshiyuki Fukami, Toshinori Omori, Katsushi Mikuni, Noriko Kon
  • Patent number: 8990030
    Abstract: A submersion detection circuit includes a power source unit, a reference resistor connected between the power source unit and a voltage measurement node, a submersion unit configured to include a plurality of submersion measurement resistors connected in parallel to the voltage measurement node. Submersion contact terminals are formed at respective ends of the submersion measurement resistors, and a voltage measurement unit connected to the voltage measurement node and configured to measure voltage divided by the reference resistor and the submersion unit when the submersion contact terminals submerge.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: March 24, 2015
    Assignee: LG Chem, Ltd.
    Inventor: Seongmun Baek
  • Patent number: 8884636
    Abstract: Disclosed is a sensor that can accurately detect displacement and prevents the phenomenon of a contact section between a shaft member and a sliding element receiver being shifted. The sensor comprising: a case having a through hole; a resistance substrate fixed at an inside of said case; a shaft member having a first end portion which is one end of the shaft member placed within said case and a second end portion which is other end of the shaft member exposed to an outside of said case from said through hole, said shaft member being placed at said through hole in a movable manner in an axial direction; and a sliding element receiver having a bearing end contacting with said second end portion of said shaft member, and attached with a brush sliding together with said resistance substrate, said sliding element receiver being capable of moving relatively against said resistance substrate with said shaft member. A hemispherical end face is formed at said first end portion.
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: November 11, 2014
    Assignee: Eagle Industry Co., Ltd.
    Inventor: Mikio Nitta
  • Patent number: 8629688
    Abstract: A method for performing corrosion testing is provided. The method includes applying a thin film of silicone to an electrical device to be tested, positioning the device in a chamber, connecting the device to electrical testing equipment for determining any change in electrical resistance of the device, and disposing a gaseous compound of sulfur in the chamber. The method also comprises monitoring the device for any change in electrical resistance for indicating failure of the device.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: January 14, 2014
    Assignee: International Business Machines Corporation
    Inventors: King M. A. Chu, Steven R. Nickel, Timothy J. Tofil
  • Patent number: 8521471
    Abstract: A system and method by which thickness of a dielectric film on substrates can be noninvasively determined is invented. The system and method are especially applicable to areas and applications where traditional techniques have proven unsuccessful or limited. According to embodiments of the present invention the present system and method can be used to measure film thickness in confined and inaccessible locations, and on substrates of complex geometry. The method can be used with an arbitrary and time varying orientation of the substrate-film interface. The measurements of the film thickness on the inside of open or enclosed channels of an arbitrary geometry, and on flexible substrates are possible. With multiple embedded sensors, the film thickness in different lateral locations can be simultaneously measured. The dielectric permittivity of the FUT as a function of the distance from the substrate of the film can also be measured.
    Type: Grant
    Filed: March 24, 2007
    Date of Patent: August 27, 2013
    Assignee: University of Utah Research Foundation
    Inventor: Mikhail Skliar
  • Patent number: 8502548
    Abstract: A distance measuring device and method for determining distance, and a suitable reflective member are provided. The distance measuring device includes analysis electronics and a sensor device, which has at least one coupling probe for feeding a transmission signal into a line structure. A reflective member is disposed in the line structure which has a base plate with an attached collar forming a cup-shaped element, and a feed block with a recess into which the collar plunges. The recess has a sealing ring which produces airtightness with the collar, wherein the attached collar is provided on the front face with a plastic plate.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: August 6, 2013
    Assignee: Astyx GmbH
    Inventor: Guenther Trummer
  • Patent number: 8482306
    Abstract: A system to measure thickness of a shroud is provided. The system includes at least one resistive element embedded within the shroud. A reduction in a cross-sectional area of the at least one resistive due to wearing out of the shroud results in a change in a resistance of the at least one resistive. The system also includes an impedance measurement device that measures a total resistance associated with the at least one resistive element.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: July 9, 2013
    Assignee: General Electric Company
    Inventors: Emad Andarawis Andarawis, Chukwueloka Obiora Umeh
  • Patent number: 8456182
    Abstract: A method includes positioning body-electrodes in galvanic contact with a body of a patient and positioning a mapping-tool, having a mapping-electrode, in a plurality of regions in the body. The method further includes tracking the mapping-tool at different positions in each of the regions using a location-measuring system, and for each region, generating a respective set of calibration-currents between the body-electrodes and the mapping-electrode at the different positions in the region. A respective relation is derived for each region between the respective set of the calibration-currents and the different positions, and is used in determining the location of an investigation-tool in response to the different respective relations and investigation-tool-currents.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: June 4, 2013
    Assignee: Biosense Webster, Inc.
    Inventors: Meir Bar-Tal, Daniel Osadchy
  • Patent number: 8415960
    Abstract: A capacitance sensing apparatus for use in a position sensing apparatus, comprising a first set of electrodes and a second set of electrodes and a capacitance sensing circuit arranged to determine, in use in a normal operating mode, the capacitance between each pairing of electrodes comprising one from the first set and one from the second set, in which the apparatus is further provided with at least one group switch arranged to selectively electrically connect together groups of the electrodes within the sets of electrodes, in which, in use in a low resolution mode of the apparatus the or each group switch connects together the groups of electrodes and the capacitance sensing circuit is arranged to determine the capacitance between the each pairing of groups of electrodes in one set and the electrodes or groups of electrodes of the other set. Typically, the apparatus is used in conjunction with a display to form a touch-sensitive display.
    Type: Grant
    Filed: November 26, 2007
    Date of Patent: April 9, 2013
    Assignee: TRW Limited
    Inventor: Roger John Hazelden
  • Patent number: 8373425
    Abstract: A method for determining a distance between a first piece and a second piece includes measuring, at the first or second piece, an AC signal, and determining the distance based on the measured AC signal. A system for determining a distance between a first piece and a second piece includes a measuring device adapted to measure, at one or both of the first and second piece, an AC signal, and a signal processing device adapted to determine the distance based on the measured AC signal. The AC signal includes a DC offset.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: February 12, 2013
    Assignee: Hypertherm, Inc.
    Inventors: Sanjay Garg, William J. Connally
  • Patent number: 8353210
    Abstract: The invention relates to a system for measuring a physical variable using a plurality of measuring sensors (20). Said system is characterized in that an inverting measuring signal amplifier (17; 17.1, 17.2) is connected downstream of every measuring sensor (20), one output of a sensor (20) each being connected to an inverting input of the measuring signal amplifier (17; 17.1, 17.2) connected downstream of the measuring sensor (20).
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: January 15, 2013
    Assignee: Tecan Trading AG
    Inventors: Lars Kamm, Werner Hinn, Roman Baumann
  • Patent number: 8305096
    Abstract: An apparatus and method for measuring and monitoring layer properties in web-based processes are described. The apparatus includes multiple electrode devices adjacently positioned on a surface of a web material, which advances with a predetermined speed. The electrode devices perform measurements of electrical parameters of a layer of the web material and provide an electrical signal to a layer deposition system for further adjustment of layer properties of the layer.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: November 6, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Warren Jackson, Carl Taussig
  • Patent number: 8151441
    Abstract: A method for providing an electronic lapping guide (ELG) for a structure in a magnetic transducer are described. The structure has a front edge and a back edge. The ELG includes a stripe having a top edge and a bottom edge. The method includes calibrating a sheet resistance of the stripe and calibrating an offset of the top edge of the stripe from the back edge of the structure. The method further includes terminating the lapping based at least on the sheet resistance and offset of the ELG.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: April 10, 2012
    Assignee: Western Digital (Fremont), LLC
    Inventors: Steven C. Rudy, Matthew R. Gibbons, Curtis V. Macchioni, Yun-Fei Li, Changhe Shang, Carlos Corona
  • Patent number: 7956624
    Abstract: A system monitors growth characteristics of a plant having a root buried in a prescribed volume of ground using a plurality of electrodes inserted into the ground at a known spacing relative to one another in proximity to the root or root-like structure. When electrical current is applied to some of the electrodes, electrical potential is measured at other ones of the electrodes to construct a representation of electrical impedance across the prescribed volume locating the root or root-like structure. Growth characteristics of the soil and the plant, for example root size, root shape, soil moisture content, and the like, can be identified by locating variations of the electrical impedance.
    Type: Grant
    Filed: May 7, 2007
    Date of Patent: June 7, 2011
    Inventor: Kelly Beaulieu
  • Publication number: 20100219851
    Abstract: A distance measuring device and method for determining distance, and a suitable reflective member are provided. The distance measuring device includes analysis electronics and a sensor device, which has at least one coupling probe for feeding a transmission signal into a line structure. A reflective member is disposed in the line structure which has a base plate with an attached collar forming a cup-shaped element, and a feed block with a recess into which the collar plunges. The recess has a sealing ring which produces airtightness with the collar, wherein the attached collar is provided on the front face with a plastic plate.
    Type: Application
    Filed: April 28, 2008
    Publication date: September 2, 2010
    Inventor: Guenther Trummer
  • Patent number: 7714596
    Abstract: Sheet resistance, junction leakage and contact conductivity of a semiconductor layer, associated with an ultra-shallow junction layer or metal film are measured by contacting the surface with a plurality of probes. The probes can be used, in conjunction with a four-point probe system, to determine sheet resistivity. Junction leakage through an ultra-shallow junction is determined by establishing a reverse bias across the junction set at a predetermined voltage value, measuring through a first probe a total junction current conduction value, measuring through second, third, and fourth probes a plurality of voltage values. The junction leakage value is then directly computed based on the sheet resistivity value, reverse bias potential, wafer radius, and the measured voltage values. Contact conductivity between a metal film and semiconductor layer can be similarly directly computed.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: May 11, 2010
    Assignee: Four Dimensions Inc.
    Inventors: James T. C. Chen, Dimitar B. Dimitrov
  • Patent number: 7652230
    Abstract: An operating device for a cooktop has a cover with a control panel with a plurality of operating areas. Below the panel, several FSR sensors are positioned. When a control panel is pushed down by a process of operation, the FSR sensor changes its electrical resistance resulting in change of a signals that can be detected and interpreted as operation of the appliance by a user.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: January 26, 2010
    Assignee: E.G.O. Elektro-Geraetebau GmbH
    Inventor: Martin Baier
  • Patent number: 7605595
    Abstract: A clearance sensing system is disclosed. The system includes a probe separated from a test object by a variable distance d. The system also includes an alternating current (AC) source for supplying a current through the probe, wherein the AC source and the probe are configured to generate a controlled plasma channel between a tip of the probe and the test object. The system further includes a processing unit configured to determine the variable distance d based on a voltage difference between the tip of the probe and the test object.
    Type: Grant
    Filed: September 29, 2006
    Date of Patent: October 20, 2009
    Assignee: General Electric Company
    Inventor: Andrzej May
  • Publication number: 20090206855
    Abstract: The present invention is a conductivity measuring device comprising that two terminals tweezer having two probes of a observing probe and a grasping probe arranged contiguously along the face which is parallel to a sample support face. Two terminals of a tweezer are pressed while adjusts pressing force to a sample surface, it is galvanized between two terminal tweezer, and conductivity is determined making a current between the two terminals tweezers.
    Type: Application
    Filed: February 11, 2009
    Publication date: August 20, 2009
    Inventor: Masatoshi Yasutake
  • Patent number: 7557591
    Abstract: The present invention describes a system and method for monitoring a material film within a plasma processing device. The system includes a plasma reactor formed by a reactor wall and an electrode, a RF generator to couple electrical energy to the electrode, an electrical measurement device for measuring an electrical property of the plasma processing device, and a controller coupled to the electrical measurement device and programmed to determine a state of a film on the reactor wall based on the measured electrical property.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: July 7, 2009
    Assignee: Tokyo Electron Limited
    Inventor: John Donohue
  • Patent number: 7525063
    Abstract: An elongate contact switch is disclosed having several partial contact areas and associated illumination means for indicating the actuation mode and also the actuation point to an operator, in order to increase operational effectiveness. The illumination means can be directly associated with individual partial contact areas or can indicate the progress of movements for operating the contact switch by applying a finger and pulling the same along a contact area. Moreover, malfunctions can be indicated to the operator.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: April 28, 2009
    Assignee: E.G.O. Elektro-Geraetebau GmbH
    Inventors: Ralf Dorwarth, Wilfried Schilling
  • Patent number: 7514940
    Abstract: A system and method are disclosed for determining the effective channel width (Weff) and the effective channel length (Leff) of metal oxide semiconductor devices. One advantageous embodiment of the method provides a plurality of metal oxide semiconductor field effect transistor capacitors in which each capacitor has a same value of drawn channel length but a different value of drawn channel width. A value of Fowler-Nordheim tunneling current is measured from each capacitor. Channel width offset is the difference between the drawn channel width and the effective channel width. A value of channel width offset is obtained from the measured values of the Fowler-Nordheim tunneling currents and used to determine the value of effective channel width. A similar method is used to determine the value of the effective channel length.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: April 7, 2009
    Assignee: National Semiconductor Corporation
    Inventor: Jiankang Bu
  • Patent number: 7511514
    Abstract: A method of operating a passenger screening kiosk system to perform at least one verify a passenger's identity, detect the presence of an explosive material, and detect the presence of a metallic material includes initiating a prompt to be issued by the passenger screening kiosk system to prompt the passenger to enter the passenger screening kiosk system, prompting the passenger to enter the passenger screening kiosk system, and determining whether the passenger is within the passenger screening kiosk system.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: March 31, 2009
    Assignee: GE Security, Inc.
    Inventors: Christopher W. Crowley, Richard Shelby, Oscar Mitchell, Richard Keith Ostrom
  • Patent number: 7487064
    Abstract: A method that uses a goodness of fit test/measurement (e.g., correction coefficient) for process control of a test parameter (e.g., resistance). At least the minimum number of test values required to calculate a goodness of fit test is obtained. A curve is fitted for the test parameters values and the independent variable(s). A goodness of fit measurement/test (e.g., correlation coefficient) is calculated for the curve and data. The goodness of fit measurement value is used for process control. Control limits can be established on the goodness of fit measurement values. The use of the goodness of fit test is a sensitive test that can used to control processes with low level defects or small fluctuations.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: February 3, 2009
    Assignee: Chartered Semiconductor Manufacturing, Ltd.
    Inventor: Sheldon C. P. Lim
  • Patent number: 7420163
    Abstract: According to one embodiment of the invention, photoelectron spectroscopy is used to determine the thickness of one or more layers in a single or multi-layer structure on a substrate. The thickness may be determined by measuring the intensities of two photoelectron species or other atom-specific characteristic electron species emitted by the structure when bombarded with photons. A predictive intensity function that is dependent on the thickness of a layer is determined for each photoelectron species. A ratio of two predictive intensity functions is formulated, and the ratio is iterated to determine the thickness of a layer of the structure. According to one embodiment, two photoelectron species may be measured from a single layer to determine a thickness of that layer. According to another embodiment, two photoelectron species from different layers or from a substrate may be measured to determine a thickness of a layer.
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: September 2, 2008
    Assignee: ReVera Incorporated
    Inventor: Bruno Schueler
  • Patent number: 7394280
    Abstract: A method of determining the time to failure of parallel electro migration test structures is described. The method generally includes the steps of: measuring the resistance of the complete structure; calculating the resistance of the n individual parallel structures from the measured resistance; calculating the resistance of the complete structure after the failure of m individual parallel structures, for m=1 to n; and recording the time of failure for each m as the time when the resistance is approximately the value predicted for m fails.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: July 1, 2008
    Assignee: Systems on Silicon Manufacturing Co. Pte. Ltd.
    Inventors: Yong Han Frankie Low, Kwang Ye Sim, Eu Gene Glen Foo
  • Publication number: 20080100311
    Abstract: A method for the electrical measurement of the thickness of a semiconductor layer ( 10, 11, 12) is disclosed. Active layers on SOI wafers, EPI layers with inverse conductivity tape and membrane thickness can be measured by use of a test structure which can routinely be measured during a production process. The embodiment of the test structure (A1 to F1) is preferably annular, such that a high degree of symmetry is achieved on propagation of the measuring current and such that no interactions occur with surrounding structures. The diameter of the arrangement can be matched to the corresponding thickness range of the semiconductor layer to be measured using conventional U-I parameter test systems, conventionally applied in semiconductor production. The determination of the layer thickness is achieved by means of two sequential quadrupole measurements at six contact points.
    Type: Application
    Filed: November 16, 2005
    Publication date: May 1, 2008
    Applicant: X-FAB Semiconductor Foundries AG
    Inventors: Karlheinz Freywald, Giesbert Hoelzer, Siegfried Hering, Uta Kuniss, Appo Van Der Wiel
  • Patent number: 7358748
    Abstract: A method for determining a property of an insulating film is provided. The method may include obtaining a charge density measurement of the film, a surface voltage potential of the film relative to a bulk voltage potential of the substrate, and a rate of voltage decay of the film. The method may also include determining the property of the film using the charge density, the surface voltage potential, and the rate of voltage decay. A method for determining a thickness of an insulating film is provided. The method may include depositing a charge on the film, measuring a surface voltage potential of the film relative to a bulk voltage potential of the substrate, and measuring a rate of voltage decay of the film. The method may also include determining a thickness of the film using the rate of voltage decay and a theoretical model relating to current leakage and film thickness.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: April 15, 2008
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: Thomas G. Miller, Gregory S. Horner, Amin Samsavar, Zhiwei Xu, Patrick Stevens
  • Publication number: 20080079445
    Abstract: A clearance sensing system is disclosed. The system includes a probe separated from a test object by a variable distance d. The system also includes an alternating current (AC) source for supplying a current through the probe, wherein the AC source and the probe are configured to generate a controlled plasma channel between a tip of the probe and the test object. The system further includes a processing unit configured to determine the variable distance d based on a voltage difference between the tip of the probe and the test object.
    Type: Application
    Filed: September 29, 2006
    Publication date: April 3, 2008
    Inventor: Andrzej May
  • Patent number: 7352194
    Abstract: The invention relates to a method for determining the thickness of a coating on a composite material by applying induced currents wherein the composite material together with its coating is placed on a conducting material, in which circulating electric currents induced by an alternating magnetic field are created, an indirect measurement being subsequently carried out based on the measurement of the lift-off effect that the coating, together with the composite material, offers in induced currents against the mentioned conducting material.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: April 1, 2008
    Assignee: Airbus Espana, S.L.
    Inventors: Antonio Fuente Souviron, Joaquin Pascual Fernandez
  • Patent number: 7285965
    Abstract: A paper-width detecting device includes a paper guide, a conductive element, a circuit board and a control-processing unit. The paper guide is movably disposed on a paper tray for accommodating different sizes of papers. The conductive element attaching to the paper guide and moving simultaneously with the paper guide has a plurality of first conductive portions. The circuit board has a plurality of conductive wires, which is formed by a plurality of separated second conductive portions on the surface of the circuit board. An insulating region is formed between any two adjacent second conductive portions of each conductive wire. The control-processing unit is for providing an electric voltage between the conductive wires and the conductive element. When the paper guide presses against the paper, the control-processing unit generate a paper-width value corresponding to the number of current passages formed between the first conductive portions and the corresponding conductive wire thereof.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: October 23, 2007
    Assignee: Avison Inc
    Inventors: Feng-Chi Shen, Hui-Kung Sun
  • Patent number: 7242206
    Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: July 10, 2007
    Assignees: Tokyo Electron Limited, Kabushiki Kaisha Toshiba, Ibiden Co., Ltd.
    Inventors: Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui, Hisashi Kaneko, Nobuo Hayasaka, Yoshiyuki Ido
  • Patent number: 7185545
    Abstract: Instrumentation for monitoring crack growth using a change in electric potential across a starter crack as the crack propagates is disclosed. The instrumentation includes a specimen of a material to be analyzed for crack growth propagation having a surface with a starter crack formed therein, a plurality of current leads to pass electric current through the specimen, a layer of insulating material disposed on each of opposite sides of the crack, a layer of conductive material disposed on each layer of insulating material, where a portion of each layer of conductive material is in electrical contact with the first specimen surface, and a pair of sensing leads, one sensing lead attached to each layer of conductive material. A method for using the instrumentation to monitor crack growth by measuring is also disclosed.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: March 6, 2007
    Assignee: General Electric Company
    Inventor: Philemon Kennard Wright, III
  • Patent number: 7180310
    Abstract: There is provided an amplitude varying driver circuit operable to output an output signal, which is an amplified input signal being supplied. The amplitude varying driver circuit includes: a plurality of differential amplifiers provided in parallel with one another, wherein a signal corresponding to the input signal is input into each base terminal thereof; a resistor section, which is provided in series with the plurality of differential amplifiers, operable to establish potential of the output signal according to total current flowing to the plurality of differential amplifiers; and an amplitude control transistor, which is provided in series with the plurality of differential amplifiers, operable to define total current flowing to the plurality of differential amplifiers.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: February 20, 2007
    Assignee: Advantest Corporation
    Inventor: Kei Sasajima
  • Patent number: 7104147
    Abstract: A system and method for measuring a voltage differential in a current-carrying pipe using a propulsion vehicle. The system may be adapted for use with a pipeline pig or other propulsion device, which is configured to determine the electric current in a pipeline with nominal noise while the apparatus is moving. One aspect of the present invention is a pig which is outfitted with electrical contacts. These electrical contacts may optionally consist of rotating steel brushes and/or rotating steel knives. The pig includes data logging capabilities which may record location and voltage data. A pig according to the present invention optionally may include electromechanical devices which reduce electrical noise.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: September 12, 2006
    Assignee: Shell Oil Company
    Inventors: Bert Pots, Kola Fagbayi, P. Kevin Scott, Mark W. Mateer
  • Patent number: 7098676
    Abstract: An on-chip redundant crack termination barrier structure, or crackstop, provides a barrier for preventing defects, cracks, delaminations, and moisture/oxidation contaminants from reaching active circuit regions. Conductive materials in the barrier structure design permits wiring the barriers out to contact pads and device pins for coupling a monitor device to the chip for monitoring barrier integrity.
    Type: Grant
    Filed: January 8, 2003
    Date of Patent: August 29, 2006
    Assignee: International Business Machines Corporation
    Inventors: William F. Landers, Thomas M. Shaw, Diana Llera-Hurlburt, Scott W. Crowder, Vincent J. McGahay, Sandra G. Malhotra, Charles R. Davis, Ronald D. Goldblatt, Brett H. Engel
  • Patent number: 7038472
    Abstract: The present invention provides novel devices for measuring internal dimensions of microscale structures. Methods in accordance with the invention use the voltage measured at a midpoint between a reference structure and a sample structure to determine the resistance of the sample structure, and to then calculate an internal dimension of the sample structure.
    Type: Grant
    Filed: May 12, 2003
    Date of Patent: May 2, 2006
    Assignee: Caliper Life Sciences, Inc.
    Inventor: Ring-Ling Chien
  • Patent number: 7038473
    Abstract: A fluid level (26) is measured through determining an inclination angle of a bracket (32) that rotatably connects a floating member (34) located near a surface of the fluid to a pivoting arrangement (28, 30) which carries a resistor (40) of which a first part is branched off through a slider (42) moving along with a change in the angle. In particular, the following steps are executed. First, connecting a stabilized power supply (U0) with its first terminal in series with a limiting resistor (RV) to one end of the resistor (40); second, measuring the voltages over both the first part (UF) and over a remainder part (UE) of the resistor. Finally, calculating the resistance value of the first part (RX) through eliminating a contact resistance value (RU, 46) associated with the slider from the measurement equations given by the values of the respective voltages (UF, UE).
    Type: Grant
    Filed: October 23, 2002
    Date of Patent: May 2, 2006
    Assignee: Siemens Aktiengesellschaft
    Inventor: Wolfgang Sinz
  • Patent number: 7012438
    Abstract: A method for determining a property of an insulating film is provided. The method may include obtaining a charge density measurement of the film, a surface voltage potential of the film relative to a bulk voltage potential of the substrate, and a rate of voltage decay of the film. The method may also include determining the property of the film using the charge density, the surface voltage potential, and the rate of voltage decay. A method for determining a thickness of an insulating film is provided. The method may include depositing a charge on the film, measuring a surface voltage potential of the film relative to a bulk voltage potential of the substrate, and measuring a rate of voltage decay of the film. The method may also include determining a thickness of the film using the rate of voltage decay and a theoretical model relating to leakage and film thickness.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: March 14, 2006
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: Thomas G. Miller, Gregory S. Horner, Amin Samsavar, Zhiwei Xu, Patrick Stevens
  • Patent number: 7005851
    Abstract: In some aspects, the present invention provides a method for estimating at least one measurement/object property of a metal object. The method includes generating a time-varying eddy current in a wall of the metal object utilizing a pulsed-signal transmitter. The method further includes measuring the time-varying eddy current, fitting the time-varying measured eddy current to a parameterized polynomial, and interpreting the parameterized polynomial to determine one or more measurement/object properties of the metal object.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: February 28, 2006
    Assignee: General Electric Company
    Inventors: Andrew May, Changting Wang, Yuri Alexeyevich Plotnikov
  • Patent number: 7002361
    Abstract: An apparatus for measuring the thickness of thin-film cause electron beams of first and second energies to strike thin-film to be measured that is formed on a silicon substrate, and measures the first substrate current value of current flowing in the substrate when it is struck by an electron beam of a first energy and the second substrate current value of current flowing in the substrate when it is struck by an electron beam of a second energy. The thin-film measuring apparatus obtains reference data indicating a relationship between the film thickness and a reference function having as variables the substrate current for the case of an electron beam of the first energy striking a standard sample and the substrate current for the case of an electron beam of the second energy striking the standard sample, and calculates the thickness of the thin-film under measurement based on the first and second substrate current values, giving consideration to the reference data.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: February 21, 2006
    Assignee: Fab Solutions, Inc.
    Inventors: Keizo Yamada, Yousuke Itagaki, Takeo Ushiki
  • Patent number: 6987388
    Abstract: A digital measuring head in a measuring apparatus measures a work by making a contact element abut to the work. The digital measuring head includes an arm supported rotatably around a support point arranged on a base; a finger having the contact element at a tip end and mounted to a tip end portion of the arm; and a scale and a read head, one of which is provided at a rear end portion of the arm and the other of which is arranged on the base. Displacement of the contact element which contacts with the work is measured with the scale and the read head. Thereby, the measuring head can perform measurement in a wide range and becomes excellent in the actuation property and the temperature property, and masters for calibration of an indicated dimension are only used at an initial adjustment time.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: January 17, 2006
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventor: Masaaki Oguri
  • Patent number: 6972576
    Abstract: A system for testing a reticle used in semiconductor wafer fabrication is provided. The system includes a reticle that has an opaque metal layer over a translucent substrate. The reticle includes one or more test features containing probe points operable for electrical contact. The system includes a reticle test system that is capable of applying a voltage to the probe points, measuring the resulting current, calculating the corresponding resistance of the test features, and determining the critical dimensions of the test features. The system is also capable of determining defects based on the resistance measurements. The critical dimension information and defect information can then be used to refine the processes used in the fabrication of subsequent reticles.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: December 6, 2005
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Christopher F. Lyons, Khoi A. Phan, Cyrus E. Tabery, Bhanwar Singh
  • Patent number: 6933735
    Abstract: Ramp arrangements and methods in accordance with the present invention can provide the position or velocity of an actuator assembly in a rotating media data storage device while loading or unloading a head connected with the actuator assembly from a disk. One such arrangement includes a conductive ramp electrically coupled to a conductive suspension lift tab such that a closed circuit is formed when the head is unloaded from the disk. As the suspension lift tab slides along the ramp, the resistance of the circuit changes. By measuring multiple positions at multiple times, a head velocity can be determined.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: August 23, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Fernando A. Zayas, Richard M. Ehrlich