Abstract: A connector or adaptive connector includes a first subassembly and a second subassembly with each subassembly including a center conductor and terminating at one end in a termination portion forming a connector portion. The subassemblies interface with each other to slide with respect to each other. A spring acts on each of the subassemblies to bias the subassemblies to slide away from each other and a sleeve contains the subassemblies and spring, the sleeve securing at least one of the subassemblies while allowing movement of the other of the subassemblies in the sleeve for varying the length of the connector. Each subassembly center conductor includes a respective portion of an electrical contact that cooperate to form a center conductor for the connector. The portions of the electrical contact are configured to slide relative to each other when the connector varies in length for maintaining an electrical signal path through the connector.

Abstract: A healthcare device and a vehicle system are capable of charging a sensor device that measures a biosignal. The healthcare device includes the sensor device that includes a biosignal measuring sensor that measures the biosignal and uses the biosignal measuring sensor as a charging electrode during charging, a healthcare controller that collects and calculates the biosignal measured through the biosignal measuring sensor, a sensor device battery that receives power from an external pogo pin through an electrode of the biosignal measuring sensor during charging by the charging electrode to charge a power supply of the sensor device battery, and a selecting device that connects the biosignal measuring sensor to any one of the healthcare controller and the sensor device battery.

Abstract: An apparatus for testing electromagnetic components includes electromagnetically-isolating external walls that define a chamber. An internal wall is attached to one or more of the electromagnetically-isolating external walls to form an internal test instrument chamber and an internal device testing chamber. An internal RF feed-through port passes through the internal wall to electrically couple a test instrument disposed in the internal test instrument chamber to a wireless device-under-test (DUT) disposed in the internal device testing chamber. One or more external RF feed-through ports can pass through one of the electromagnetically-isolating external walls to electrically couple the DUT and/or the test instrument to a second wireless device.

Abstract: A wafer probe station includes a first shielding box, a chuck, a stage, a second shielding box, an electronic testing instrument, a manipulator and a cable. The first shielding box has a first chamber. The chuck is located in the first chamber to hold a device under test. The stage connects to the chuck to move the chuck. The second shielding box is outside the first shielding box and forms a second chamber with the first shielding box. The first and the second shielding boxes shield against an electromagnetic field. The electronic testing instrument is inside the second chamber. The manipulator is outside the first shielding box and has a probe arm penetrating into the first chamber. The probe arm is movable by the manipulator to hold a probe to contact the device under test. The cable connects between the electronic testing instrument and the probe.

Abstract: An example system includes a circuit board having electrical elements; a wafer having contacts; and an interconnect to route signals between the electrical elements and the contacts. The interconnect includes multiple layers, each of which includes a flexible circuit. The flexible circuit includes a conductive trace disposed thereon. The interconnect also includes shielding between adjacent layers of the multiple layers. The shielding is electrically connected to ground.

Abstract: The invention relates to a probe card structure, which comprises printed circuit board structure with a first through hole, a center stiffener with a second through hole, a first probe head module with a first through hole set and a plurality of first probe pins, and a second probe head module provided with a plurality of second probe pins. The first probe head module and the second probe head module are respectively arranged on a lower surface and an upper surface of the printed circuit board structure, wherein those first probe pins are set on a periphery of an opening of the first through hole set; and a portion of the second probe head module penetrating the first through hole, the second through hole, and the first through hole set. The first and second probe head module integrated together can be utilized for 3D IC testing.

Abstract: A probe card includes a mechanical support fixture having an inner aperture with a plurality of probes secured to the fixture that includes probe tips that extend into the inner aperture for contacting probe pads on die of a wafer to be probed. At least one magnetic shield includes a magnetic material that at least substantially surrounds a projected volume over an area that encloses the probe tips. The magnetic material has a relative magnetic permeability of at least 800.

Abstract: A probe sensor has a printed circuit comprising a coplanar transmission line, a ground plane, a plated-through contact via, and a part-circular ring of ground vias surrounding the contact via. The coplanar transmission line and ground plane are formed on a first layer of the printed circuit, and the contact via and part-circular ring of ground vias are plated with a conductive biocompatible material on a second layer of the printed circuit. A system uses a network analyzer with the probe to measure electrical properties of biological tissue. Also described is a method of using the system to determine qualities of stored blood.

Abstract: A probe card includes a number probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. The probes include at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. The probe card further includes at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal.

Abstract: A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a first spring latch at the distal first plunger end. At least a portion of the first plunger has an arc with a first plunger outer contact point opposite the first spring latch relative to the longitudinal axis. The first plunger is disposed in a spring. The first plunger outer contact point in contact with the inner diameter of the spring, and the first spring latch engages at least a portion of the spring.

Abstract: A contacting assembly, in particular an HF measuring tip, having a carrier, on which a conductor structure is arranged, wherein the conductor structure has, at a contact end, at least one contact element protruding from the carrier for electrically contacting at least one contact point of a test specimen, and wherein the conductor structure has at least one impedance converter, wherein the impedance converter has a conductor segment having a gradually tapered or expanding cross-section.

Abstract: Embodiments of the present invention provide an RF probe for coupling out a probe signal from a transmission line of a circuit. The RF probe includes at least two probe pins having first ends for contacting the circuit and second ends. Furthermore, the RF probe includes a provider for providing a variable impedance at the second ends of the probe pins. The RF probe is configured to provide the probe signal based on a signal propagating along at least one of the probe pins.

Abstract: A method of calibrating and debugging a testing system is provided. First, values of different electrical path segments are calibrated, and parameters of the electrical path segments while being calibrated are saved. After calibration, electrical tests can be processed on a DUT. If the testing system malfunctions, the values of the electrical path segments are calibrated again to compare the current parameters to the previously saved parameters. The component which goes wrong can be found out quickly in this way.

Abstract: A probe module including a housing, a PCB, three probes, a resonating member, and a signal connector. The housing has a room therein, a first opening, and a second opening at opposite ends thereof. The PCB is received in the room of the housing, and has a substrate, on which a circuit and two groundings are provided. The probes are electrical connected to the circuit and the groundings of the PCB respectively, and then extend out of the housing via the first opening. The resonating member has a chamber, and is attached to the PCB. The signal connector is connected to the PCB, and extends out of the housing via the second opening. The signal connector has a signal transmission portion electrically connected to the circuit of the PCB, and a grounding portion electrically connected to the at least one grounding of the PCB.

Abstract: A fully-automatic verification system for intelligent electric energy meters comprises a plurality of verification units for automatic verification of the electric energy meters, main transport lines for connecting the verification units, and a verification management system for coordinating the work of the verification units. The main transport lines comprise upper transport lines for transporting boxes carrying electric energy meters to be verified to the verification units and lower transport lines for transporting the boxes carrying the electric energy meters back to the warehouse. The verification system for electric energy meters can implement fully-automatic verification, thus enhancing the efficiency and the verification accuracy.

Abstract: An integrated circuit test socket includes a highly conductive compliant material that is cut and installed into the test socket. The conductive material draws electrical charge away from the test socket, leading to more accurate testing. The test socket base is grounded, and a ground current runs through the base and into conductive strips. The configuration forms an electromagnetic impulse shield, protecting the chip from electromagnetic interference. The compliance of the shield material allows the shield to be sealed when activated, ensuring that the electromagnetic impulse shield is complete around the semi-conductor chip.

Abstract: A probe card includes a number probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. The probes include at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. The probe card further includes at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal.

Abstract: A test socket for connecting a device under test (DUT) electrically to a high-frequency power source comprises a plurality of pogo pins each having an electrode, an electron-to-heat conversion plate supporting bottoms of the pogo pins, the electron-to-heat conversion plate configured to convert kinetic energy of free electrons emitted from the pogo pins to thermal energy, and a heat sink wall formed on the electron-to-heat conversion plate, the heat sink wall having a predetermined height and isolating the plurality of pogo pins from one another.

Abstract: An EMI shielding composite film for use in printed circuit boards has at least two layers, a top layer electrically conductive in all directions (isotropic), and a bottom layer electrically conductive only in the Z (thickness) direction (anisotropic) after thermo-compression. The bottom layer is in contact with the grounding pads of the circuitry of the electronic device to be shielded. The conductive top layer functions similarly to metallic boxes to prevent the electromagnetic radiation from both entering the boxes and escaping into the environment. The bottom layer interconnects the top conductive layer to the grounding pads on the PCB after thermo-compression so that electromagnetic waves collected by the top layer are directed and released to PCB grounding pads through the bottom layer.

Abstract: A deflection measurement probe includes a body portion having a cavity defined by the body portion, a first positional measurement sensor disposed in the cavity of the body portion, the first positional measurement sensor including a sensor tip extending from the body portion operative to contact a measurement surface, and a second positional measurement sensor disposed in the cavity of the body portion, the first positional measurement sensor including a sensor tip extending from the body portion operative to contact a measurement surface.

Abstract: The present disclosure is directed to systems and methods for operating, designing, testing and verifying the performance of wireless communication devices. Specifically, the present systems and methods can reliably emulate a mobile environment with channel impairment in an ad-hoc network and determine the operating behavior (routing, auto-healing, etc.) of wireless communication modules. Utilizing a relatively inexpensive, compact testing chamber arrays with useful electromagnetically isolating structure, the present invention allows for scalable, multi-application and production line operation and testing and verification of electromagnetic equipment therein.

Abstract: A method for reducing electromagnetic emissions in an electronic device having a multiple micro-controllers includes identifying the number of micro-controllers installed in the electronic device. An operating frequency range of the electronic device is determined based on the operating frequency range of each micro-controller. A frequency spacing for each micro-controller within the operating frequency range of the electronic device is then calculated, and an operating frequency is assigned to each micro-controller. The operating frequency of each micro-controller is separated from the operating frequency of each other micro-controller by at least the frequency spacing. Then, the operating frequency of each micro-controller is set at the assigned operating frequency.

Abstract: A contact probe comprises conductively coupled plungers and a coil spring. The plungers have coupling means which enable them to be slidably and non-rotatably engaged. The spring is attached to the plungers in a manner that prevents rotation of the spring's ends. A desired magnitude of torsional bias is generated by twisting the spring a predetermined angle prior to attachment of the spring to the plungers. An additional torsional bias is generated by the tendency of the spring to twist when the spring is axially displaced. The resultant torsional bias rotatably biases the coupling means of the plungers against each other, generating contact forces for a direct conductive coupling between the plungers. The plungers are self-latching or are retentively attached to the spring using the torsional bias of the spring. Plungers with hermaphroditic coupling means can be fabricated from a sheet metal or a profiled stock by stamping or machining.

Abstract: A radio frequency (RF) testing apparatus, for testing device under test (DUT) comprising a receiving antenna, includes a pair of transmitting antennas transmitting wireless communication signals to the receiving antenna, a shielding box, a first filter and a second filter. The shielding box includes a transmitting box, a receiving box for receiving the DUT, a connecting box connecting between the transmitting box and the receiving box and a pair of transmitting antennas fixed on the transmitting box and suspending towards the connecting box. The connecting box includes a microwave absorption medium on the connecting box and communicates with the receiving box. The first filter is mounted on the connecting box and the transmitting box to electrically connect with the transmitting antenna. The second filter is mounted on the receiving box to electrically connect with the DUT.

Abstract: The present disclosure is directed to systems and methods for operating, designing, testing and verifying the performance of wireless communication devices. Specifically, the present systems and methods can reliably determine the operating behavior of wireless communication modules within electronic products and devices in a relatively inexpensive and compact testing cabinet, with useful electromagnetically isolating structure, that allows for scalable, multi-application and production line operation and testing and verification of electromagnetic equipment therein.

Abstract: An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.

Abstract: The invention discloses a testing system and a testing method. The testing system includes a testing platform and a fetching device. The testing platform includes a metal base plate, a DUT board, a testing stand and a metal wall. The DUT board is disposed on the metal base plate. The testing stand is disposed on the DUT board. The metal wall is disposed on the metal base plate and surrounds the testing stand. The fetching device is movably disposed above the testing platform and used for placing a DUT on the testing stand. A metal covering plate of the fetching device corresponds to the metal wall of the testing platform. When the fetching device places the DUT on the testing stand, the metal covering plate cooperates with the metal wall and the metal base plate of the testing platform to form an isolated space, so as to isolate the DUT.

Abstract: A probe station for testing semiconductor substrates, i.e., wafers and other electronic semiconductor elements, suitable for carrying out low-current and low-voltage measurement, comprises a shielding with which the electromagnetic influence (EMI) of the measurement of the semiconductor substrate can be minimized, and also comprises devices for the preparation of test signals. In addition, the housing of the probe station can offer a different possibility for the accessibility of individual components or component groups of the probe station.

Abstract: A probing apparatus can comprise a substrate, conductive signal traces, probes, and electromagnetic shielding. The substrate can have a first surface and a second surface opposite the first surface, and the electrically conductive first signal traces can be disposed on the first surface of the first substrate. The probes can be attached to the first signal traces, and the electromagnetic shielding structures can be disposed about the signal traces.

Abstract: A system and method for antenna analysis and electromagnetic compatibility testing in a wireless device utilizes a “parent” device that undergoes rigorous conventional testing. A “child” device having similar components may thereafter undergo abbreviated testing. Because the Total Isotropic Sensitivity of the parent device is known, testing may be performed on the child device to infer equivalence to the parent's TIS performance using the abbreviated test techniques.

Abstract: A method for adapting the signal transmission between two electronic devices (1, 2) that are connected to each other via a physical interface and that each have a transmitter (8a, 8b) and a receiver (7a, 7b), wherein analog signals are transmitted from the transmitter (8a, 8b) of one device (1, 2) along a transmission path (9a, 9b) to the receiver (7a, 7b) of the other device (1, 2). Known scattering parameters (10a, 10b, 10c, 11d) for describing the electromagnetic wave propagation in the transmission path (9a, 9b) between the receiver (7a, 7b) of the first device (1, 2) and the transmitter (8a, 8b) of the second device (1, 2) are retrieved by the first device (1, 2), transmitted to the second device (1, 2), and parameters of the transmitter (8a, 8b) in the second device (1, 2) are adapted with reference to a high-frequency description of the transmission path (9a, 9b) as a function of all of the scattering parameters (10a to 10d, 11a to 11d) known to the two devices.

Abstract: An electro magnetic (EM) wave shielding device includes at least one metal plate and an EM wave absorbing material configured on a lateral side of the metal plate. The lateral side of the metal plate configured with the EM wave absorbing material covers a test point region of a circuit board, thereby absorbing and shielding EM waves generated by the test point region.

Abstract: An EMI shielded isolation chamber is provided, having an integral manipulator for manipulating electronic devices such as cell phones within the chamber, whereby a probe can be precisely positioned to selectively and directly actuate controls, switches, and keypads upon the devices anywhere in the chamber upon rotation of a probe tip. Extensible collapsible shielding boots are coupled between wall portions of the shielded chamber, adjacent a wall mounted manipulator support gimbal, and forward or rearward portions of the mechanical manipulator for preventing EMI signals from entering or leaving the shielded chamber. Alternatively, the gimbal constitutes the shielding device whereby a metallic hollow ball, slidably and rotatably supporting and containing the elongated manipulator, is mechanically biased snugly against a concave metallic member to block radiation from entering or leaving the shielded chamber.

Abstract: A testing device includes a shielding case and a driving member opening and closing the shielding case. The shielding case includes a receiving space for receiving an electronic device therein, a cover, and a base. The driving member includes a first driving member mechanically connected to an outside of the cover of the shielding case and a second driving member mechanically connected to an outside of the base of the shielding case. The first driving member moves the cover vertically relative to the base. The second driving member moves the base horizontally relative to the cover. Movement of the shielding case in an open position allows the electronic device to be received in or removed from the shielding case. Movement of the shielding case in a closed position allows the electronic device to be tested.