Abstract: An electronic apparatus which achieves ease of incorporating flexible boards into the electronic apparatus and ease of impedance control at the same time. A first flexible board and a second flexible board are placed along a structure having a bent portion and a flat portion. Differential signal wires are wired on one surface of the first flexible board placed between the structure and the second flexible board, and first ground wires for impedance control of the differential signal wires are wired on the other surface and on a rear side of the differential signal wires. Second ground wires for impedance control of the differential signal wires are wired on one surface of the second flexible board the one surface of the first flexible board faces. A wiring density of the first and second ground wires differs between an area along the bent portion and an area along the flat portion.

Abstract: A socket includes: a contact probe; and an insulating support body supporting the contact probe. The contact probe includes: a first plunger to be connected with an object to be inspected; a second plunger to be connected with an inspecting board; and a spring configured to urge the first plunger and the second plunger in a direction apart from each other. In a state where a tip end of the first plunger is released, a projecting amount of the second plunger from the insulating support body is zero with a natural length of the spring.

Abstract: A contact terminal defined by a probe may include a tubular body made of an electrically conductive material and central conductors, each of which is made of an electrically conductive material and has a stick shape. The central conductors and may include stick-shaped bodies inserted into the tubular body. The tubular body may include spring portions, which are defined by helical bodies formed by helical grooves along a circumference thereof and clasping portions, which are fitted onto proximal end portions of the stick-shaped bodies to fit the proximal end portions. The clasping portions may be defined by a circumferential wall of the tubular body and a slit extending from end portions of the helical grooves, which define the spring portions, in an axial direction of the tubular body, at which, portions are separated in a circumferential direction of the tubular body.

Abstract: A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.

Abstract: An inspection apparatus and an inspection method capable of reducing the effect of noises are provided. An inspection apparatus according to the present invention includes a work table 26 on which an inspection panel 12 is placed, a probe unit 31 including a probe 38 that comes into contact with an electrode 12a of the inspection panel 12 placed on the work table 26, and a stage 11 that moves the work table 26 in order to bring the probe 38 into contact with the electrode 12a of the inspection panel 12 placed on the work table 26, in which the stage 11 is connected to the ground and supports the work table 26 through a resistive element.

Abstract: A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.

Abstract: There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display.

Abstract: A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.

Abstract: A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.

Abstract: One embodiment includes a method for protecting from the accidental application of an electrical potential to an incorrect pin of a multipin electrical connector during testing. A sleeve is fitted around a pin that is not to have potential applied to it such that the pin is protected from accidental application of potential during testing.

Abstract: A semiconductor device includes: a first circuit; a first power switch provided either between a power supply potential terminal and a power supply potential node of the first circuit or between a reference potential terminal and a reference potential node of the first circuit; a power switch control circuit configured to control a voltage of a control terminal of the first power switch; a test terminal; and a first test control circuit configured to control connection of the test terminal and the control terminal of the first power switch.

Abstract: An exemplary printed circuit board testing method includes determining whether there is an open shielding box every a time interval. The method then transmits a first control signal including a first predetermined path to a robot when there is an open shielding box. Next, the method obtains an image captured by a camera and recognizes a unique identifier of a to-be-tested PCB in the obtained image. The method then determines a second predetermined path corresponding to the determined open shielding box, and transmits a second control signal comprising the determined second predetermined path to the robot. Next, the method closes the determined shielding box when a duration after transmitting the second control signal reaches a predetermined time, and controls a testing software to test the to-be-tested PCB, to generate a testing result corresponding to the unique identifier of the to-be-tested PCB.

Abstract: An example system for testing electronic assemblies (EAs) may include carriers for holding EAs and slots for testing at least some of the EAs in parallel. Each slot may be configured to receive a corresponding carrier containing an EA and to test the EA. An example carrier in the system may include a first part and a second part. At least one of the first part and the second part include a first structure, and the first structure is movable to enable electrical connection between an EA and an electrical connector.

Abstract: An EMI shielding composite film for use in printed circuit boards has at least two layers, a top layer electrically conductive in all directions (isotropic), and a bottom layer electrically conductive only in the Z (thickness) direction (anisotropic) after thermo-compression. The bottom layer is in contact with the grounding pads of the circuitry of the electronic device to be shielded. The conductive top layer functions similarly to metallic boxes to prevent the electromagnetic radiation from both entering the boxes and escaping into the environment. The bottom layer interconnects the top conductive layer to the grounding pads on the PCB after thermo-compression so that electromagnetic waves collected by the top layer are directed and released to PCB grounding pads through the bottom layer.

Abstract: A system for testing a computer includes a single chip microcontroller (SCM), an environmental test chamber, and a control device connected to the SCM and the environmental test chamber. The SCM repeatedly switches the computer on and off and monitors the computer's response. The environmental test chamber accommodates the computer. The control device receives monitored data from the SCM and controls temperature and humidity in the environmental test chamber.

Abstract: A thermal chamber and system for influencing the temperature of an IC chip under test including a thermal block that receives a chip socket, the thermal block adapted to be disposed between a docking interface plate and a workpress. The thermal block receives a flow of heated or cooled gas, and causes an IC chip to become heated or cooled prior to and during a test of the chip. The thermal chamber and system allows an IC chip to be testing under specific temperature conditions without using an expensive handler costing hundreds of thousands of dollars.

Abstract: Among other things, one or more techniques and/or systems are provided for shielding a signal pin. A signal pin, such as a signal pin within a probe card used to test electronic devices, such as integrated circuits, is shielded from interference signals, which are emitted from other signal pins within the probe card. Shielding the signal pin mitigates cross-talk issues and/or impendence control issues associated with signals that are carried by the signal pin. In one example, one or more shield pins are arranged with respect to the signal pin according to a shield configuration. For example, the shield configuration comprises a plane of signal pins, a substantially regular layout of signal pins, or a polygonal layout of signal pins, etc. In this way, one or more shield pins inhibit unintended interactions or effects that otherwise occur among two or more signal pins.

Abstract: An electronic protection module adapted for an electronic device to protection information read and stored in a signal reading element. The electronic protection module includes a circuit board, a first loop, a cover, a first flexible circuit board with a second loop, a second flexible circuit board with a third loop, electrical conductor(s) and conductive element(s). When one of the first loop, second loop and the third loop is disconnected, the signal reading element will be disconnected and lose the information, thereby preventing information leak from the electronic device. The electronic device may be a card reader capable of reading a barcode type, magnetic strip type or chip type of a financial card, credit card or personal identity card.

Abstract: Shielded probe array. In accordance with a first embodiment, an article of manufacture includes a plurality of rows of electronic probes. Each row of probes is substantially in a plane. Each probe includes a metal signal layer and a ground layer, separated by an insulator. The article of manufacture also includes a space transformer for mechanically supporting the plurality of rows of electronic probes. The space transformer also provides an electrical path from each of the probe metal signal layers and the probe ground layers to a higher level electronic assembly. Each of the plurality of rows of electronic probes may include a handle including a substrate for handling the row of electronic probes.

Abstract: A radio frequency (RF) testing apparatus, for testing device under test (DUT) comprising a receiving antenna, includes a pair of transmitting antennas transmitting wireless communication signals to the receiving antenna, a shielding box, a first filter and a second filter. The shielding box includes a transmitting box, a receiving box for receiving the DUT, a connecting box connecting between the transmitting box and the receiving box and a pair of transmitting antennas fixed on the transmitting box and suspending towards the connecting box. The connecting box includes a microwave absorption medium on the connecting box and communicates with the receiving box. The first filter is mounted on the connecting box and the transmitting box to electrically connect with the transmitting antenna. The second filter is mounted on the receiving box to electrically connect with the DUT.

Abstract: A test device for wireless electronic devices includes a metal casing, a RF-absorbing material, a measurement antenna, and an impedance adjustment module. The impedance adjustment module includes a dielectric layer, a microstrip line, and a slot line, wherein the slot line is electrically connected to the measurement antenna. The microstrip line and the slot line are disposed on two opposite sides of the dielectric layer and respectively include a first body and a second body, which are parallel to each other.

Abstract: A wiring substrate that allows wiring at a fine pitch and has a coefficient of thermal expansion close to the coefficient of thermal expansion of silicone, and a probe card that includes the wiring substrate are provided. To this end, there are provided a wiring substrate that includes a ceramic substrate having a coefficient of thermal expansion of 3×10?6 to 5×10?6/° C. and one or more thin-film wiring sheets stacked on one surface of the ceramic substrate, and a probe head on which a plurality of conductive proves are arranged in accordance with wiring on the thin-film wiring sheet, which holds individual probes while preventing the probes from coming off and allowing both ends of each probe to be exposed, and which is stacked on the wiring substrate while one end of each probe is brought into contact with the thin-film wiring sheet.

Abstract: An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.

Abstract: The invention discloses a testing system and a testing method. The testing system includes a testing platform and a fetching device. The testing platform includes a metal base plate, a DUT board, a testing stand and a metal wall. The DUT board is disposed on the metal base plate. The testing stand is disposed on the DUT board. The metal wall is disposed on the metal base plate and surrounds the testing stand. The fetching device is movably disposed above the testing platform and used for placing a DUT on the testing stand. A metal covering plate of the fetching device corresponds to the metal wall of the testing platform. When the fetching device places the DUT on the testing stand, the metal covering plate cooperates with the metal wall and the metal base plate of the testing platform to form an isolated space, so as to isolate the DUT.

Abstract: A radio frequency (RF) testing apparatus, for testing device under test (DUT) comprising a receiving antenna, includes a pair of transmitting antennas transmitting wireless communication signals to the receiving antenna, a shielding box, a first filter and a second filter. The shielding box includes a transmitting box, a receiving box for receiving the DUT, a connecting box connecting between the transmitting box and the receiving box and a pair of transmitting antennas fixed on the transmitting box and suspending towards the connecting box. The connecting box includes a microwave absorption medium on the connecting box and communicates with the receiving box. The first filter is mounted on the connecting box and the transmitting box to electrically connect with the transmitting antenna. The second filter is mounted on the receiving box to electrically connect with the DUT.

Abstract: A method of testing a semiconductor device includes providing a first wafer that includes a first surface, a second surface that is allocated at an opposite side of the first surface, a first electrode penetrating the first wafer from the first surface to the second surface, and a pad formed on the first surface and coupled electrically with the first electrode, providing a second wafer that includes a second electrode penetrating the second wafer, stacking the first wafer onto the second wafer to connect the first electrode with the second electrode such that the second surface of the first wafer faces the second wafer, probing a needle to the pad, and supplying, in such a state that the first wafer is stacked on the second wafer, a test signal to the first electrode to input the test signal into the second wafer via the first electrode and the second electrode.

Abstract: A probe station for testing semiconductor substrates, i.e., wafers and other electronic semiconductor elements, suitable for carrying out low-current and low-voltage measurement, comprises a shielding with which the electromagnetic influence (EMI) of the measurement of the semiconductor substrate can be minimized, and also comprises devices for the preparation of test signals. In addition, the housing of the probe station can offer a different possibility for the accessibility of individual components or component groups of the probe station.

Abstract: The invention discloses a testing system and a testing method, suitable for testing a DUT with double-sided signal pins. The testing system includes a testing platform and a pick-and-place device. The testing platform includes an electromagnetic shielding chamber and a test-bench module. The electromagnetic shielding chamber has an opening. The test-bench module is disposed in-between the electromagnetic shielding chamber. The pick-and-place device is movably disposed above the testing platform. The pick-and-place device includes an electromagnetic shielding cap and a signal transmission structure. When the pick-and-place device places the DUT on the test-bench module, the electromagnetic shielding cap cooperates with the electromagnetic shielding chamber of the testing platform to form an isolated space for isolating the DUT, and furthermore, the signal pin disposed on an upper surface of the DUT can be electrically connected to the test-bench module through the signal transmission structure.

Abstract: A contact assembly for receiving a spring probe unit includes an elongate contact element adapted to electrically contact the spring probe unit. The contact element includes a stop for restraining movement of the spring probe unit towards the stop in the direction of an axis along the length of the contact element, and urging means, adapted to urge the spring probe unit against the contact element for removable engagement of the spring probe unit with the contact element.

Abstract: A chassis shielding effectiveness evaluation system includes a chassis having a chassis ground. A board is located in the chassis and includes a board ground layer. A signal generator includes at least one ground member coupled to the chassis ground and a signal member coupled to the board ground layer. The signal generator is operable to send a signal through the signal member to the board ground layer.

Abstract: A portable test chamber with an open top may serve as a field testing apparatus for wireless testing of electronic devices. A wireless device under test may be mounted within a cavity in the test chamber. The cavity may be surrounded by a dielectric lining of anechoic material. A layer of electromagnetic shielding such as metal foil may cover the outer surfaces of the dielectric lining. The chamber may have a box shape with a rectangular opening at its top. Satellite navigation system signals or other wireless signals may be received through the opening at the top of the test chamber during testing. The electromagnetic shielding may reduce the effects of multipath interference during field tests.

Abstract: A method for adapting the signal transmission between two electronic devices (1, 2) that are connected to each other via a physical interface and that each have a transmitter (8a, 8b) and a receiver (7a, 7b), wherein analog signals are transmitted from the transmitter (8a, 8b) of one device (1, 2) along a transmission path (9a, 9b) to the receiver (7a, 7b) of the other device (1, 2). Known scattering parameters (10a, 10b, 10c, 11d) for describing the electromagnetic wave propagation in the transmission path (9a, 9b) between the receiver (7a, 7b) of the first device (1, 2) and the transmitter (8a, 8b) of the second device (1, 2) are retrieved by the first device (1, 2), transmitted to the second device (1, 2), and parameters of the transmitter (8a, 8b) in the second device (1, 2) are adapted with reference to a high-frequency description of the transmission path (9a, 9b) as a function of all of the scattering parameters (10a to 10d, 11a to 11d) known to the two devices.

Abstract: A probing apparatus includes a housing, a device holder positioned in the housing and configured to receive a device under test, a temperature-controller positioned in the device holder, a platen positioned on the housing and configured to retain at least one probe, and a flow line positioned in the platen, wherein the flow line is configured to flow a fluid therein to adjust the temperature of the platen.

Abstract: A testing device includes a shielding case and a driving member opening and closing the shielding case. The shielding case includes a receiving space for receiving an electronic device therein, a cover, and a base. The driving member includes a first driving member mechanically connected to an outside of the cover of the shielding case and a second driving member mechanically connected to an outside of the base of the shielding case. The first driving member moves the cover vertically relative to the base. The second driving member moves the base horizontally relative to the cover. Movement of the shielding case in an open position allows the electronic device to be received in or removed from the shielding case. Movement of the shielding case in a closed position allows the electronic device to be tested.

Abstract: Electrical circuit apparatus and methods including hermeticity testing structures for testing the hermeticity of the electrical circuit apparatus.