Abstract: A vacuum adiabatic body includes a heat exchange pipeline and a sealing plug. The heat exchange pipeline includes at least two pipelines which pass through a first plate and a second plate to allow a refrigerant to move between inner and outer spaces. The sealing plug allows the heat exchange pipeline to pass through a first point of the first plate and a second point of the second plate without contacting a third space.

Abstract: There is provided a prober including inspection rooms. Each of the inspection rooms includes: a probe card having probes; a chuck top configured to mount a wafer; and a temperature adjuster configured to adjust a temperature of the chuck top. At least one of the probe card and the chuck top includes a gap adjustment member configured to maintain a constant gap between the probe card and the chuck top. The probe card is preheated by heat of the chuck top whose temperature is adjusted by the temperature adjuster, in a state in which the wafer is not mounted on the chuck top and in a state in which the probe card and the chuck top are connected with each other via the gap adjustment member.

Abstract: A system for testing a computer includes a single chip microcontroller (SCM), an environmental test chamber, and a control device connected to the SCM and the environmental test chamber. The SCM repeatedly switches the computer on and off and monitors the computer's response. The environmental test chamber accommodates the computer. The control device receives monitored data from the SCM and controls temperature and humidity in the environmental test chamber.

Abstract: A thermal chamber and system for influencing the temperature of an IC chip under test including a thermal block that receives a chip socket, the thermal block adapted to be disposed between a docking interface plate and a workpress. The thermal block receives a flow of heated or cooled gas, and causes an IC chip to become heated or cooled prior to and during a test of the chip. The thermal chamber and system allows an IC chip to be testing under specific temperature conditions without using an expensive handler costing hundreds of thousands of dollars.

Abstract: A plasma measurement device used for measuring plasma characteristics of radio frequency plasma a probe, a connector electronic wire, and a power supply device. The probe is used for entering the radio frequency plasma to measure the plasma characteristics. One end of the connector electronic wire is electrically connected to the probe. The power supply device is electrically connected to another end of the connector electronic wire, and the power supply device is used for providing a voltage to the probe. The connector electronic wire is a specific length, and the connector electronic wire and the radio frequency plasma would generate a standing wave effect. Thus, according to the standing wave effect, the plasma measurement device could eliminate high-frequency interference generated by the radio frequency plasma while measuring the plasma characteristics.

Abstract: A silicon carrier space transformer assembly includes one or more silicon structures, which provide space transformer scaling to permit interconnection for fine pitch input/output interconnections with a semiconductor die or wafer, and fine pitch test probe tips connected to the one or more silicon structures.

Abstract: A method includes generating a first, second and third voltage output from a temperature sensing element of an integrated circuit using a respective, corresponding first, second and third, switched current source, for sequentially switching a respective first, second and third excitation current through the temperature sensing element. The third switched current source generates the corresponding third voltage output as a reference voltage between the first voltage and the second voltage. An error corrected difference is calculated between the first voltage and the second voltage using the reference voltage. In the method, the second excitation current is proportional to the first excitation current by a value n, and the third excitation current is proportional to the first excitation current by the square root of n.

Abstract: A temperature regulation plate 106 is divided into at least two areas, a heater 408 for applying a temperature load in correspondence with such areas and its control system are divided and controlled independently to set temperatures, and a cooling source is controlled by comparing the measurements from temperature sensors 409 arranged in respective areas for controlling the heater 408 and switching the measurement for calculating the control output sequentially thus reducing variation in in-plane temperature of a wafer due to heating when an electric load is applied. Since consumption and burning of a probe are prevented, highly reliable wafer level burn-in method and apparatus can be provided.

Abstract: A system resistance simulating apparatus includes a case and a resistance adjusting element arranged in the case. The resistance adjusting element includes a number of blocking strips. The blocking strips can be selectively poisoned in the case for simulating system resistance of an electronic device at different power platforms.