Abstract: A fine electrical probe can provide fine-pitch applications in devices such as smart watches and smart phones. Fingers are positioned on a substrate. The substrate has a recess that allows the fingers to flex. The substrate and fingers are positioned in an assembly. The assembly has a recess that allows the substrate to flex.

Abstract: A connector includes a housing having a bore therein. A center conductor element is positioned in the bore and includes a center conductor pin. The center conductor pin is spring-biased to move longitudinally in the housing bore for being compressed. A ground sleeve element is coaxially arranged around the center conductor element and is also spring-biased to move longitudinally in the housing bore for being compressed. The center conductor element and ground sleeve element are coupled together for moving together in the housing bore when compressed. The compressed elements maintain their same coaxial position in the housing bore with respect to each other when the connector is compressed.

Abstract: In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.

Abstract: A novel modular probe may include an interchangeable (connectable/disconnectable) probe-tip adaptor having a tip connector for coupling to a device under test, and further having a probe-tip terminal for coupling to a first assembly connector of a cable assembly, which further has a second assembly connector for coupling to a first build-out terminal of a build-out adaptor, which also has a second build-out terminal for coupling to an assembly connector of an interchangeable instrument connector cable assembly, which also has an instrument-end connector for coupling to a measurement instrument. The built-out adaptor may include a compensation adjustment circuit for compensating the probe for varying system capacitances. The probe may include one or more corrective circuits in the interchangeable probe-tip adaptor and/or in the build-out adaptor for at least partially terminating each end of the cable assembly with a characteristic impedance of the cable in the cable assembly to attenuate reflections.

Abstract: A coaxial probe structure, comprising: a support member, comprising a first connecting member; a connector, comprising a second connecting member; a coaxial probe, connecting with a connecting end of the coaxial probe to a bottom of the connector, and extending downwards from the bottom of the connector to a probe tip, and an included angle formed at a junction of the probe tip and the connecting end; and an elastic body connecting the support member with the junction of the connecting end and the probe tip of the coaxial probe.

Abstract: A cable assembly includes a printed circuit board having a first surface and a second surface. A first post and a second post extend from one side of the printed circuit board. A first signal pad, a second signal pad, and a first ground pad are each coupled to the first surface. A first cable has a first signal wire at least partially covered by a first insulator and a second signal wire at least partially covered by a second insulator. The first cable further has a first ground shield at least partially covering the first and second insulators. A first end of a first cable is mounted between the first and second posts. A conductive attachment couples the first ground shield to the first ground pad.

Abstract: A probe card with a ground contact, a first contact element and a second contact element is provided. The first contact element is coupled to an interconnection node via a first interconnection line having a definite length and the second contact element is coupled to the interconnection node via a second interconnection line having the same definite length. The interconnection node is directly connected to the ground contact.

Abstract: An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.

Abstract: A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side.

Abstract: The invention relates to a cable interface (1) for operatively connecting a plurality of coaxial cables (11). A main body (2) has a first side face and an opposing second side face (3, 4) with a plurality of blind holes (5) arranged in a pattern in the first side face (3). An internal conductor opening (7) is formed at the bottom (6) of each blind hole (5) and arranged substantially coaxial with the blind hole (5), which is likewise coated with an electrically conductive material and is used for operatively connecting an internal conductor (17) of the coaxial cable (11). The blind holes (5) cooperate with at least one first bore (8), which extends from the second side face (4) into the main body (2) and is coated with an electrically conductive material.

Abstract: The invention relates to a contactless loop probe for the contactless decoupling of an HF signal for a contactless measuring system, comprising at least one coupling structure (10) and at least one first signal conductor (12) electrically connected to the coupling structure (10) by a first transition (20), said signal conductor being electrically connected by a second transition (22) to an output (14) for electrically connecting to the measuring system, wherein the coupling structure (10) is designed as an HF waveguide comprising at least one signal conductor (24; 30) and at least one reference conductor (26; 32).

Abstract: An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.

Abstract: A dual probing tip system uses a slot and rail system to provide variable spacing and lateral and axial compliance of the probing tips mounted on first and second support members. A movable base member is secured on a frame with the base member having a rack of linear teeth and a pair of rails angled toward the front. First and second intermediate carriers each have a slot that engages one of the angled rails. Each of the carriers has stanchions that receive a thumb wheel pinion gear mounted on a shaft. The pinion gear mates with the teeth on the base member for movement of the carriers. Each support member has an axial slot that mated with an axial slot on each one of the carriers. Each support member has a compression spring which allows axial compliance of the support members.

Abstract: A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side.

Abstract: In one embodiment, the present invention includes an apparatus for contacting a plurality of contact locations of a semiconductor device. The apparatus includes a housing, a support member, a plurality of probe members, and an adhesive substance. The housing has a plurality of apertures that provides a low leakage pathway for high frequency signals to reach the semiconductor device through the plurality of probe members. The plurality of probe members are aligned on the support member and the adhesive substance secures the plurality of probe members to the supporting member. The housing, supporting member, and adhesive substance match in thermal expansion to reduce the error in alignment between the plurality of contact locations and the plurality of probe members over a temperature variance.

Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.

Abstract: Provided is a micro contact element which is capable of coping with the miniaturization and greater complexity of substrates or boards, which is simplified due to a reduction in the number of components, and which creates sufficient contact pressure and stroke. Also provided is an inspection jig using this contact element. An inspection contact element having the contact pressure and amount of contraction required to carry out an inspection is formed by using notch parts respectively formed in two conductive cylindrical members having different outer and inner diameters so that the notch parts can function as elastic parts, and combining the two cylindrical members in such a way that the elastic parts are arranged in parallel or in series.

Abstract: Disclosed is a coaxial probe comprising, an internal conductor comprising an upper contact configured to contact a semiconductor device; a lower contact configured to contact a tester for testing the semiconductor device; and an internal elastic member configured to elastically bias at least one of the upper and lower contacts to make the upper and lower contacts distant from each other; an external conductor configured to surround the internal conductor; a plurality of gap members which is respectively inserted into opposite ends between the internal conductor and the external conductor to create a predetermined air gap between the internal conductor and the external conductor; and at least one external elastic member that is inserted into an external circumferential surface of the external conductor to elastically bias at least one of the semiconductor device and the tester to a direction that makes either the semiconductor device or the test distant from the external conductor.

Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: Systems and methods for EMC, EMI and ESD testing are described. A probe comprises a center conductor extending along an axis of the probe, a probe tip, and a shield coaxially aligned with the center conductor and configured to provide electromagnetic screening for the probe tip. One or more actuators may change the relative positions of the probe tip and shield with respect to a device under test, thereby enabling control of sensitivity and resolution of the probe.

Abstract: A probe defining a transmission line for use with a measurement instrument includes a pulse circuit connected to the probe for generating pulses on the transmission line and receiving reflected pulses on the transmission line. The probe comprises a conductive outer sleeve for mounting to a process vessel. A center conductor is coaxial with the outer sleeve for conducting the pulses. A primary seal element between the outer sleeve and the center conductor is spaced a select distance from a near end of the outer sleeve. A secondary seal element between the outer sleeve and the center conductor is spaced proximate the near end of the outer sleeve, to define a generally tubular space between the primary seal element and the secondary seal element. A dielectric insert fills a portion of the tubular space proximate the secondary seal element. A leak detection tube is in the tubular space between the dielectric insert and the primary seal element.

Abstract: A test probe for testing an object electrically includes a main body, a first probe pin mounted to and protruding out of the main body, and at least one second probe pin coupled to the main body. The at least one second probe pin is changeable from a first state of being folded into the main body to a second state of being unfolded to protrude out of the main body. When the at least one second probe pin is in the first state, the first probe pin is used to contact the object, and when the at least one second probe pin is in the second state, the at least one second probe pin takes the place of the first probe pin in making electrical connection with the object.

Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: A system for making high frequency measurements on a DUT includes a high frequency measurement instrument; a plurality of DUT probes; a first coaxial cable having a center conductor and a coaxial conductor for connection between the instrument and a first DUT probe; and a second coaxial cable having a center conductor and a coaxial conductor for connection between the instrument and a second DUT probe, at least one of the first and second cables being selectively shortable between the respective center conductor and coaxial conductor at a location near the respective DUT probe.

Abstract: Provided is a micro contact element which is capable of coping with the miniaturization and greater complexity of substrates or boards, which is simplified due to a reduction in the number of components, and which creates sufficient contact pressure and stroke. Also provided is an inspection jig using this contact element. An inspection contact element having the contact pressure and amount of contraction required to carry out an inspection is formed by using notch parts respectively formed in two conductive cylindrical members having different outer and inner diameters so that the notch parts can function as elastic parts, and combining the two cylindrical members in such a way that the elastic parts are arranged in parallel or in series.

Abstract: In a cable assembly, when auxiliary ground conductor is provided so as to face the lower surface of supporting insulating member, elastically-deformed piece in an elastically deformed status comes in contact with the tip of ground terminal protruding from the lower surface of supporting insulating member.

Abstract: In one embodiment, the present invention includes an apparatus for contacting a plurality of contact locations of a semiconductor device. The apparatus includes a housing, a support member, a plurality of probe members, and an adhesive substance. The housing has a plurality of apertures that provides a low leakage pathway for high frequency signals to reach the semiconductor device through the plurality of probe members. The plurality of probe members are aligned on the support member and the adhesive substance secures the plurality of probe members to the supporting member. The housing, supporting member, and adhesive substance match in thermal expansion to reduce the error in alignment between the plurality of contact locations and the plurality of probe members over a temperature variance.

Abstract: An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.

Abstract: We introduce a new Periodic micro coaxial transmission line (PMTL) that is capable of sustaining a TEM propagation mode up to THz band. The PMTL can be manufactured using current photolithographic processes. This transmission line can be embedded in microscopic layers that allow many new applications. We further use the embedded PMTL to develop a modular, scaleable and fully automated Universal Test Fixture for testing chips in various stages of development mainly for digital IC chips that can be utilized in production lines with pick and place of chips on tape to test every chip before insertion into circuits. The PMTL can also provide Confined Field Interconnects between various elements on semiconductor wafers to reduce parasitic and radiation losses and practically eliminating cross talk, thus, increasing the speed of digital IC's. The PMTL is also used to develop a Universal Test Socket, and a Hand Probe.

Abstract: A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side.

Abstract: A test fixture (120) is disclosed for electrically testing a device under test (130) by forming a plurality of temporary mechanical and electrical connections between terminals (131) on the device under test (130) and contact pads (161) on the load board (160). The test fixture (120) has a replaceable membrane (150) that includes vias (151), with each via (151) being associated with a terminal (131) on the device under test (130) and a contact pad (161) on the load board (160). In some cases, each via (151) has an electrically conducting wall for conducting current between the terminal (131) and the contact pad (161). In some cases, each via (151) includes a spring (152) that provides a mechanical resisting force to the terminal (131) when the device under test (130) is engaged with the test fixture (120).

Abstract: A calibrated passive impedance probe has a wide bandwidth operating range for impedance and performance measurements of RF and microwave components, devices, and circuits in 50? and 75? environments. The probe is calibrated at the probe tip, thus allowing accurate impedance and performance measurements of in-circuit functions and on-board components. The calibrated probe can be used to eliminate RF connectors and provide input and output connections to a circuit board for prototype design and quick performance verification thus realizing cost savings on RF connectors.

Abstract: A calibrated passive impedance probe has a wide bandwidth operating range for impedance and performance measurements of RF and microwave components, devices, and circuits in 50? and 75? environments. The probe is calibrated at the probe tip, thus allowing accurate impedance and performance measurements of in-circuit functions and on-board components. The calibrated probe can be used to eliminate RF connectors and provide input and output connections to a circuit board for prototype design and quick performance verification thus realizing cost savings on RF connectors.

Abstract: Methods, devices, and systems for probing electrical circuits without loading the circuits are described herein. One embodiment of an electrical probe includes a coaxial cable having an inner conductor and an outer conductor, an extension portion of the inner conductor extending beyond the outer conductor at a probe end of the cable. The electrical probe includes a conductive whisker having a first portion separated from and extending a distance along the extension portion such that the first portion and the extension portion form a first capacitor and a second portion having a probe tip for receiving an input test signal from a circuit node under test.