Probe Structure Patents (Class 324/755.01)
  • Patent number: 10627427
    Abstract: Embodiments relate to the formation of test probes. One method includes providing a bulk sheet of an electrically conductive material. A laser is used to cut through the bulk sheet in a predetermined pattern to form a test probe. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: April 21, 2020
    Assignee: INTEL CORPORATION
    Inventors: Roy E. Swart, Paul B. Fischer, Charlotte C. Kwong
  • Patent number: 10598696
    Abstract: A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: March 24, 2020
    Assignee: Intel Corporation
    Inventors: Joseph D. Stanford, David Craig, Todd P. Albertson, Mohit Mamodia, Dingying Xu
  • Patent number: 10571494
    Abstract: An electric power measuring device, consisting of a casing, which is provided with a first end, a second end, and a first through hole; a detection circuit board, which is mounted within the casing, and a switch and an indicator light set are mounted on the detection circuit board; an input pin set, which is mounted on the circuit board, moreover, a contact end of the input pin set passes through the area at the first end and is exposed external of the casing; an output pin set, which is contained within the casing and positioned at the second end; and a coil, which is mounted within the casing and encircles the first through hole. In addition, two ends of the coil are respectively connected to any one of the pins of the input pin set and any one of the pins of the output pin set.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: February 25, 2020
    Assignee: PEACEFUL THRIVING ENTERPRISE CO., LTD.
    Inventor: Shih Hsiang Chien
  • Patent number: 10509057
    Abstract: The instant disclosure provides a probe assembly and a probe structure thereof. The probe structure includes a metal main portion, a covering layer and an insulating layer. The metal main portion has a first end portion, a second end portion corresponding to the first end portion, a connecting portion connected between the first and the second end portions and a surrounding surface surrounding the first end portion, the second end portion and the connecting portion. The covering layer includes a first covering layer disposed on a surrounding surface located on the first end portion, a second covering layer disposed on a surrounding surface located on the second end portion and a third covering layer disposed on a surrounding surface located on the connecting portion. The insulating layer is disposed on the third covering layer for exposing the first and second covering layer.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: December 17, 2019
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Wei-Jhih Su, Chih-Peng Hsieh
  • Patent number: 10468056
    Abstract: Described are probe assemblies that include multiple layers, including at least one layer of probe bodies; suspension assemblies and components thereof, e.g., head gimbal assemblies, that include a probe assembly as described; and methods of using the probe assemblies and suspension assemblies.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: November 5, 2019
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Stefan A. Weissner, Wayne A. Bonin, James R. Krolnik
  • Patent number: 10217677
    Abstract: Methods of fabricating semiconductor devices and Radio Frequency (RF) components are provided. The method includes providing a circuit layout on a semiconductor layer and providing one or more sacrificial connections to connect bump pads in the circuit layout. The method also includes testing the circuit layout using the one or more sacrificial connections and removing at least a portion of the one or more sacrificial connections. In this way, the performance of the semiconductor device is improved by reducing or avoiding capacitive or inductive leakage paths that can be caused by leftover materials.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: February 26, 2019
    Assignee: Qorvo US, Inc.
    Inventors: Alexandre Christian Volatier, Guillermo Moreno Granado
  • Patent number: 10206294
    Abstract: An electronic apparatus comprising: 1) a first circuit board; 2) a second circuit board substantially parallel to the first circuit board; and 3) an electrical assembly coupled between the first and second boards. The electrical assembly comprises: i) a housing; ii) a plurality of pogo pin connectors disposed within and projecting from the housing and configured to make electrical contact with the first and second circuit boards; and iii) a plurality of capacitors disposed within the housing and configured to form electrical connections with selected ones of the plurality of pogo pin connectors.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: February 12, 2019
    Assignee: L3 Technologies Inc.
    Inventors: David Nail, Matthew J. Spitzner, Joel B. Gorman
  • Patent number: 10168356
    Abstract: A probe for making electrical contact with a device-under-test test point includes a body, a rigid member capable of travelling linearly with respect to the body, a flexible arm having a test point contact at one end and fastened to the rigid member at the other end, and a flexible linkage fixed to the body and to the flexible arm. The flexible linkage is structured to cause the flexible arm to bend in response to travel of the rigid member in one direction, and to cause the flexible arm to unbend in response to travel of the rigid member in the other direction. A second flexible arm may be included, the two arms opening and closing to change the distance between test point contacts. A light source may be disposed on a portion of the flexible linkage that simultaneously articulates to automatically track the orientation of the test point contact.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: January 1, 2019
    Assignee: Tektronix, Inc.
    Inventors: Julie A. Campbell, William A. Hagerup, Ira G. Pollock
  • Patent number: 10024883
    Abstract: A block has a planar portion abutting a back side of a contact region of a flexible substrate, and a recess that is concave with respect to the planar portion. An electronic component mounted on the flexible substrate is located within the recess. When viewed from a direction perpendicular to the planar portion, the recess is located at a position near a power supply bump, except at a position overlapping the power supply bump, or the recess is filled with a filler. The planar portion of the block abuts only the back side of the power supply bump.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: July 17, 2018
    Assignees: Yokowo Co., Ltd., Murata Manufacturing Co., Ltd.
    Inventors: Takahiro Nagata, Takeshi Todoroki, Takahiro Nakamura, Yoshinori Ishikawa, Takayuki Kawano, Kazuhisa Honma
  • Patent number: 9983256
    Abstract: To provide a probing device and a probing method for an electronic device capable of confirming whether or not an electrical inspection has been executed appropriately, with an electrode pad being made in contact with a probe with a predetermined pressure, by utilizing a change in external shapes to be formed on the electrode pad when the probe and the electrode pad are pressed onto each other.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: May 29, 2018
    Assignee: Tokyo Seimitsu Co. LTD
    Inventors: Yuichi Ozawa, Yasuhito Iguchi, Tetsuo Yoshida, Junzo Koshio
  • Patent number: 9949364
    Abstract: Assembly methods and apparatus for electrically stable connectors are described herein where a conductive wire assembly generally comprises an insulative substrate having a length, one or more conductive elements formed along a first direction upon the substrate, an insulative coverlay formed upon the one or more conductive elements, and at least one opening or window defined through the insulative coverlay exposing a portion of the one or more conductive elements. A conductive coating is formed upon the insulative coverlay such that the conductive coating is in contact with the portion of the one or more conductive elements through the at least one opening or window and the conductive coating may have at least one region removed along a second direction in proximity to the at least one opening or window such that one or more conductive pads are formed and are electrically isolated from a remainder of the conductive coating.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: April 17, 2018
    Assignee: Angiometrix Corporation
    Inventor: Nitin Patil
  • Patent number: 9935024
    Abstract: A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a substrate and a conductive pad formed over the substrate. The semiconductor device structure includes a protection layer formed over the conductive pad, and the protection layer has a trench. The semiconductor device structure includes a conductive structure formed in the trench and on the protection layer. The conductive structure is electrically connected to the conductive pad, and the conductive structure has a concave top surface, and the lowest point of the concave top surface is higher than the top surface of the protection layer.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: April 3, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Pei-Chun Tsai, Wei-Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai
  • Patent number: 9921262
    Abstract: An integrated apparatus and method to provide test, diagnostics and characterization access to backplane electrical signals during electronic product development is presented. The apparatus removes need for manual and ad hoc connections made in an engineering laboratory or assembly line which make the process prone to damage of the components, inaccurate measurements and arbitrary fluctuations in function. The method and apparatus is a mechanized way to connect backplane signals to corresponding drivers, receivers and test equipment through probes placed on equidistant electrical traces, reducing inter signal variations.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: March 20, 2018
    Assignee: Elma Electronic Inc.
    Inventors: Walter A Schindler, Jerry Choy
  • Patent number: 9810714
    Abstract: A probe pin (100, 100?) for electronic testing of semi-conductor elements is provided. The pin contains an electrically conductive core element (200) made up of a metallic alloy, and an electrically insulating jacket element (300) which surrounds the core element (200) over regions thereof. The core element (200) contains a distal contact section (210) for electrical contacting to a semi-conductor element. The metallic alloy of the core element contains at least 67% by weight rhodium, 0.1% by weight to 1% by weight zirconium, up to 1% by weight yttrium, and up to 1% by weight cerium. A method for producing a probe pin is also described.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: November 7, 2017
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Per Soerensen, Nicole Staudt, Reinhold Weiland, Ingo Prunzel, David Francis Lupton
  • Patent number: 9806714
    Abstract: In a testing device, a method for implementing automatic RF port testing. The method includes attaching a device under test having a plurality of RF pins to a load board, dynamically tuning a plurality of RF ports of the load board to the plurality of RF pins, and automatically matching the plurality of RF ports to the plurality of RF pins with respect to impedance. The method further includes implementing an RF port testing process on the device under test.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: October 31, 2017
    Assignee: ADVANTEST CORPORATION
    Inventors: Xin Ping Zeng, Hui Yu, Keith Schaub, Liang Ge, Heng Huat Goh
  • Patent number: 9753082
    Abstract: A manufacturing method of a semiconductor device is provided with an inspecting of a semiconductor substrate by an inspection method, the method including heating the semiconductor substrate, measuring first and second characteristics. The measuring of a first characteristic is performed by bringing a plurality of probes into contact with the heated semiconductor substrate and making a first electric current flow in the semiconductor substrate. The measuring of a second characteristic is performed, after the measuring of the first characteristic, by bringing a plurality of probes into contact with the heated semiconductor substrate and making a second electric current flow in the semiconductor substrate. A number of the plurality of probes used in the measuring of the second characteristic is larger than a number of the plurality of probes used in the measuring of the first characteristic. The second electric current is larger than the first electric current.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: September 5, 2017
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yohei Iwahashi, Hidemi Senda
  • Patent number: 9632109
    Abstract: A semiconductor device includes a first wafer having i) a plurality of semiconductor dies, ii) a plurality of scribe lines adjacent one or more of the semiconductor dies, iii) a test access interface positioned in one or more of the scribe lines, wherein the test access interface has a first plurality of through-substrate conductors with a standardized physical layout, and iv) electrical couplings between at least some of the through-substrate conductors and at least one of the semiconductor dies. Methods, apparatus and systems for testing this and other types of semiconductor devices are also disclosed.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: April 25, 2017
    Assignee: ADVANTEST CORPORATION
    Inventors: Larry John Dibattista, Duncan Packard Gurley
  • Patent number: 9435854
    Abstract: An electrical contactor has a contact portion that is pressed onto a terminal of an electronic device and is electrically connected. When the dimension of the contact portion is S1, the contact dimension of the contact portion and the terminal of the electronic device is V, the amount of sliding of the contact portion is W, and the additional element including at least positional accuracy of the contact portion is X, the dimension of the contact portion S1 satisfies S1>V+W+X. In a contact method for the electrical contactor, when the sum of a clearance on the front end side in the sliding direction in starting contact and a clearance on the back end side in the sliding direction in ending contact is X3, the crushed area S2 of the terminal is set to satisfy a relationship of S2<S1?X3.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: September 6, 2016
    Assignee: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Mika Nasu, Akihiro Karouji, Takayuki Hayashizaki
  • Patent number: 9379465
    Abstract: A connection terminal for a power module, includes a conductive wire that is wound to form the connection terminal. The conductive wire includes an insertion part, at least a part of which is closely wound and to be inserted into a hollow part of a holding member of the power module, and includes a press-fitting part having a diameter larger than a diameter of the hollow part, a rough winding part in which the wire is wound at a predetermined interval, and a contact part for coming into contact with an external circuit, the contact pert being provided at an end part of the rough winding part on a side different from the end part on a side of the insertion part.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: June 28, 2016
    Assignee: NHK Spring Co., Ltd.
    Inventors: Takahiro Fujii, Koji Ishikawa, Jun Tominaga, Takayuki Katsuumi, Keiichi Ito
  • Patent number: 9274143
    Abstract: Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: March 1, 2016
    Assignee: FormFactor, Inc.
    Inventor: January Kister
  • Patent number: 9121868
    Abstract: A probe having a conductive body and a contacting tip that is terminated by one or more blunt skates for engaging a conductive pad of a device under test (DUT) for performing electrical testing. The contacting tip has a certain width and the blunt skate is narrower than the tip width. The skate is aligned along a scrub direction and also has a certain curvature along the scrub direction such that it may undergo both a scrub motion and a self-cleaning rotation upon application of a contact force between the skate and the conductive pad. While the scrub motion clears oxide from the pad to establish electrical contact, the rotation removes debris from the skate and thus preserves a low contact resistance between the skate and the pad. The use of probes with one or more blunt skates and methods of using such self-cleaning probes are especially advantageous when testing DUTs with low-K conductive pads or other mechanically fragile pads that tend to be damaged by large contact force concentration.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: September 1, 2015
    Assignee: FormFactor, Inc.
    Inventor: January Kister
  • Patent number: 9119333
    Abstract: A multilayer wiring board including a build-up layer, formed from one or more conductor and resin insulation layers that are layered one on top of the other, having conductive pads formed on a surface of at least one resin insulation layer so as to project from the surface are provided. The conductive pads may each include a columnar portion situated at a lower part thereof and a convex portion situated at a higher part thereof, wherein a surface of the convex portion may assume a continual curved shape. A solder layer may be formed over an upper surface of the conductive pads. Certain embodiments make it possible to minimize or eliminate the concentration of stress on the conductive pads, and may inhibit the occurrence of defective connections to a semiconductor element and infliction of damage to the conductive pads.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: August 25, 2015
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Takuya Hando, Masahiro Inoue, Hajime Saiki, Atsuhiko Sugimoto, Hidetoshi Wada
  • Publication number: 20150145546
    Abstract: A coated probe is provided. The probe includes a probe body and a cladding layer. The probe body has a terminal. The cladding layer covers the surface of the terminal of the probe body, wherein the cladding layer includes a carbon nano-material layer, and the carbon nano-material layer includes a carbon nano-material.
    Type: Application
    Filed: September 24, 2014
    Publication date: May 28, 2015
    Inventors: Shih-Chun Tseng, Ren-Jye Wu, Ping-Hsing Yang, Li-Duan Tsai, Jin-Bao Wu
  • Publication number: 20150130490
    Abstract: The present invention relates to a probe apparatus for testing the quality of semiconductor chips, wherein the probe apparatus for testing chips has superior reliability and durability. The probe apparatus of the present invention comprises: a printed circuit board having a center with a through-hole; a pin holder which is attached to the front surface of the printed circuit board and which has a plurality of pinholes; a plurality of probe pins, each of which has an L-shape with a horizontal end connected to one side end of a circuit pattern formed on the printed circuit board, and a vertical end exposed outwardly from the upper surface of the pinhole; and a back cover attached to the back surface of the printed circuit board.
    Type: Application
    Filed: June 8, 2012
    Publication date: May 14, 2015
    Inventor: Kenzo SUDO
  • Patent number: 9030219
    Abstract: A variable pressure probe pin device, including: a housing with a channel having a first longitudinal axis; a probe at least partially disposed in the channel and including a plurality of probe pins configured to measure a property of a conductive layer; and a fluid pressure system configured to supply pressurized fluid o the channel to control a position of the probe within the channel. The housing or the probe is displaceable such that the plurality of probe pins contact the conductive layer.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: May 12, 2015
    Assignee: KLA-Tencor Corporation
    Inventors: Walter H. Johnson, Nanchang Zhu
  • Patent number: 9030222
    Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: May 12, 2015
    Assignee: FormFactor, Inc.
    Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Alex Madsen, Gaetan L. Mathieu
  • Patent number: 9030220
    Abstract: A tester includes a main body and a removable probe. The main body includes a main body probe and a front panel including selectable options for selecting a tester function. The removable probe may be coupled to the main body via a cord. The removable probe is fixable to the main body via a latch assembly. The latch assembly including a socket disposed on one of the removable probe or the main body and a mating protrusion disposed at the other of the removable probe or the main body, the main body having a probe support ridge associated therewith and the removable probe having an alignment ridge associated therewith, the alignment ridge and the probe support ridge lying in a same plane when the mating protrusion is inserted into the socket.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: May 12, 2015
    Assignee: Fluke Corporation
    Inventors: Ferdinand Laurino, Duncan Nigel Kearsley, Wilbur R. Ames, IV
  • Patent number: 9030221
    Abstract: A circuit structure of a test-key and a test method thereof are provided. The circuit structure comprises a plurality of transistors, a first conductive contact, a plurality of second conductive contacts and a plurality of third conductive contacts. The transistors are arranged in a matrix. The first conductive contact is electrically connected to one source/drain of each transistor in each column of the matrix. Each second conductive contact is electrically connected to the other source/drain of each transistor in a corresponding column of the matrix. Each third conductive contact is electrically connected to the gate of each transistor in a corresponding row of the matrix. In the method, a plurality of driving pulses are provided to the third conductive contacts in sequence, and a plurality of output signals are read from the second conductive contacts to perform an element-character analyzing operation when a row of the transistors is turned on.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: May 12, 2015
    Assignee: United Microelectronics Corporation
    Inventor: Ching-Yu Tso
  • Patent number: 9018967
    Abstract: An electrical probe comprises a cylindrical body which has a first end including a plurality of claws and a second end opposite to the first end for cooperating with an electrical test machine, wherein a concave contact surface conforming with the curvature of a solder ball of an electronic device under test is formed between the claws, whereby the first end of the cylindrical body can be brought into line contact with the solder ball at a predetermined length to ensure a proper electrical connection, so that the accuracy of an electrical test can be increased.
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: April 28, 2015
    Inventor: Te-Hsing Hsiao
  • Patent number: 9007086
    Abstract: The present invention discloses a voltage applying device for an LCD substrate, and the voltage applying device includes a base, a probe bar, and probe pins. The base includes a first slide rail. The probe bar is movably disposed on the first slide rail of the base, and the probe bar includes a second slide rail. The probe pins are movably disposed on the second slide rail of the probe bar, and the probe pins are utilized to contact a plurality of contact pads of the LCD substrate, so as to apply voltage on the LCD substrate. The voltage applying device of the present invention can overcome a problem of increased costs for a conventional voltage applying device can not be shared.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: April 14, 2015
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventors: Shengpeng Mo, Wen-Pin Chiang
  • Patent number: 9007083
    Abstract: A planar body is configured such that its edges engage the sidewall of a via of a device under test to create point electrical contacts and the planar body resists removal of the planar body from the via after insertion. The edges of the planar body may include barbs that create point electrical contacts and resist removal of the planar body from the via after insertion. The end of the body that is inserted into the via may form a tapered tip to facilitate insertion. The end of the planar body that is inserted into the via may include barbs that resist removal of the planar body from the via after insertion. The edges of the planar body may include stops that prevent further insertion of the planar body into the via beyond the stops.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: April 14, 2015
    Assignee: Tektronix, Inc.
    Inventors: David T. Engquist, Brian S. Mantel
  • Patent number: 9000791
    Abstract: A voltage clamp circuit for reflecting a voltage at an input node includes a circuit for providing at least two currents at its output terminal, and at least two diodes each being connected to an output terminal of the circuit for providing at least two currents. The diodes also are connected to a line of a ground voltage and to the input node respectively. The circuit includes an alternative current path connected to an output terminal of the circuit for providing at least two currents and to a current sinking node. The voltage at the input node thus is reflected as the voltage between two output nodes when the voltage at the input node is lower than a clamping voltage and so that the voltage is fixed between the two output nodes to the clamping voltage when the voltage at the input node is higher than the clamping voltage.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: April 7, 2015
    Assignees: Katholieke Universiteit Leuven, Triphase
    Inventors: Johan Driesen, Jordi Everts, Ratmir Gelagaev, Pieter Jacqmaer, Jeroen Van den Keybus
  • Patent number: 9000794
    Abstract: An elastic micro high frequency probe includes a conductor, which includes a stationary body and a movable body. The stationary body has a conductive terminal, a contacting end, and a guider. The movable body has a conductive terminal, a spring mechanism, and a guider. The spring mechanism is connected to the stationary body and to one conductive terminal. The second guider connects to the spring mechanism in such a manner that the compression direction of the spring mechanism is confined by a guiding rail. Since the width of the spring mechanism is not limited by the first and second guiders, the width of the spring mechanism can be enlarged to maximize within limited space. Therefore, the HF probe as a whole can have shortest length while acquiring the predetermined total length of the elastic stroke, such that the transmission performance of the high frequency signals can be effectively enhanced.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: April 7, 2015
    Assignee: MPI Corporation
    Inventors: Yi-Lung Lee, Chih-Chung Chen, Tsung-Yi Chen, Horng-Kuang Fan
  • Patent number: 8994393
    Abstract: A test device including cobra probes and a method of manufacturing is disclosed. The test device includes a conductive upper plate having an upper guide hole and a conductive lower plate having a lower guide hole. The test device also includes a conductive cobra probe disposed between the upper guide hole of the upper plate and the lower guide hole of the lower plate. A dielectric material insulates the cobra probe from the upper plate and the lower plate.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: March 31, 2015
    Assignee: International Business Machines Corporation
    Inventors: Hanyi Ding, John Ferrario, Barton E. Green, Richard J. St. Pierre
  • Publication number: 20150084659
    Abstract: A contact arrangement is provided, including a contact structure and a sense structure. The sense structure may be arranged in proximity of the contact structure. The sense structure may be configured such that a correct mechanical contacting of the contact structure will not impact the sense structure and an incorrect mechanical contacting of the contact structure will impact the sense structure.
    Type: Application
    Filed: September 20, 2013
    Publication date: March 26, 2015
    Applicant: Infineon Technologies AG
    Inventors: Wolfgang Horn, Mario Wiesner
  • Patent number: 8988094
    Abstract: The invention relates to a test contact arrangement (15) for testing semiconductor components, comprising at least one test contact (10) which is arranged in a test contact frame (13) and is designed in the type of a cantilever arm and which has a fastening base (12) and a contact arm (30) which is provided with a contact tip (11) and which is connected to the fastening base, wherein the fastening base is inserted with a fastening projection (16) thereof into a frame opening (14) of the test contact frame in such a manner that a lower edge (17) of the fastening projection is essentially aligned flush with a lower side (18) of the test contact frame.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: March 24, 2015
    Assignee: Pac Tech-Packaging Technologies GmbH
    Inventor: Ghassem Azdasht
  • Patent number: 8988065
    Abstract: According to an embodiment, a microprobe includes a base and a lever. The base includes a first electrode provided on a surface thereof. The lever is supported by the base and includes a second electrode and a third electrode. The second electrode is connected between the first electrode and the third electrode. The third electrode is formed to project from the second electrode in a first direction in a main surface of the lever. A width of the third electrode in a second direction perpendicular to the first direction in the main surface defines a width of an electrical contact area when a scanning operation is performed by use of the third electrode in a third direction perpendicular to the main surface.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: March 24, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yongfang Li, Yasushi Tomizawa
  • Patent number: 8988093
    Abstract: A probe assembly that acts as a temporary interconnect between terminals on an IC device and a test station. The probe assembly includes a plurality of stud bumps arranged on a first surface of a substrate in a configuration corresponding to the terminal on the IC device. The stud bumps include a shape adapted to temporarily couple with the terminals on the IC device. A plurality of conductive traces on the substrate electrically couple the stud bumps with the test station.
    Type: Grant
    Filed: March 6, 2012
    Date of Patent: March 24, 2015
    Assignee: Hsio Technologies, LLC
    Inventor: James Rathburn
  • Patent number: 8988092
    Abstract: A probing apparatus for semiconductor devices provides a primary circuit board and a signal-adapting board positioned on the primary circuit board. The primary circuit board includes an inner area having a plurality of first contacts and an outer area having a plurality of first terminals and second terminals, and the first contacts are electrically connected to the first terminals via first conductive members in the primary circuit board. The signal-adapting board includes a plurality of second contacts electrically connected to the first contacts via second conductive members in the signal-adapting board.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: March 24, 2015
    Assignee: Star Technologies Inc.
    Inventors: Chen Jung Hsu, Chao Cheng Tseng
  • Patent number: 8988091
    Abstract: The present invention is a probe array for testing an electrical device under test comprising one or more ground/power probes and one or more signal probes and optionally a gas flow apparatus.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: March 24, 2015
    Assignee: MicroProbe, Inc.
    Inventor: January Kister
  • Patent number: 8981805
    Abstract: An inspection apparatus includes an insulating substrate, a probe pin having a body portion secured to the insulating substrate, a tip portion connected to one end of the body portion and disposed on the back surface side of the insulating substrate, and a connection portion connected to the other end of the body portion and disposed on the front surface side of the insulating substrate, and a heat-radiating terminal in contact with the connection portion, wherein a current is applied through the heat-radiating terminal and the probe pin to an object to measured, and wherein the heat-radiating terminal discharges heat from the probe pin.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: March 17, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akira Okada, Hajime Akiyama, Kinya Yamashita
  • Publication number: 20150070037
    Abstract: Systems and methods to fixture and utilizing a probe which tests a capacitive array are described herein. A support bracket with freedom about a plurality of axes may aid in locating a probe and allowing the probe to contact multiple surfaces consistently. By utilizing the support bracket, the angle between a test probe and a contact surface may be minimized such that the surface of the test probe and the contact surface may rest flat against one another. The system may also limit the force translated through support bracket. This system and method may allow for a high degree of accuracy and a high degree of precision during contact of the test probe and the test surface.
    Type: Application
    Filed: August 4, 2014
    Publication date: March 12, 2015
    Inventors: Anuranjini Pragada, Terrence L. Van Ausdall, Steven P. Hotelling
  • Patent number: 8975906
    Abstract: A probe for inspecting electronic components, and more particularly, to a probe for inspecting electronic components, which connects a target electronic component to an inspection apparatus to inspect defects of the target electronic component. The probe for inspecting electronic components includes: a cylinder body having a cylindrical shape; a piston body reciprocating between an inside and an outside of the cylinder body; a spring surrounding an outer circumference of the cylinder body and the piston body, and forcing a part of the piston body to resiliently move out of the cylinder body when inserted into the cylinder body; a probing unit extending from the cylinder body to be brought into contact with a target electronic component to be inspected as to flow of electric current therethrough; and a contact unit extending from the piston body to be connected to an inspection apparatus for inspecting the target electronic component.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: March 10, 2015
    Assignee: NTS Co., Ltd.
    Inventor: Woo-Yoel Jeong
  • Patent number: 8975908
    Abstract: An embodiment disperses a force acting on a border portion between an extending portion and a pedestal portion or a reinforcing member to prevent breakage of a probe tip portion of a probe. An electrical test probe includes a probe main body, a recess provided at an end of the main body and having an inner surface, and a probe tip having a part received in the recess. The inner surface has a central area and two lateral areas on both sides of the central area, and the part of the probe tip is located at the central area and at least at either one of the lateral areas.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: March 10, 2015
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Takayuki Hayashizaki, Akira Soma, Hideki Hirakawa
  • Patent number: 8970238
    Abstract: A probe module for testing an electronic device comprises at least two contacts, each contact including a first end portion extending in a first direction along a first line, a second end portion extending linearly in a second direction opposite from the first direction and along a second line, and a third curved portion extending between the first end portion and the second end portion. The first line is spaced apart from and in parallel with the second line, and the at least two contacts are spaced apart from each other in a direction perpendicular to the first line and the second line. Methods for making such a probe module are also taught.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: March 3, 2015
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Douglas J. Garcia
  • Patent number: 8970245
    Abstract: A probing device for a TFT-LCD substrate, which includes a device body, a device body, a circuit board mounted on the device body, a plurality of motors mounted on the device body, and a plurality of probe pins respectively mounted to the motors. The motors and the probe pins are arranged in a one-to-one corresponding manner. The circuit board includes a programmable logic controller and a man-machine interface terminal electrically connected to the programmable logic controller. The plurality of motors and the plurality of probe pins are electrically connected to the programmable logic controller. The plurality of probe pins is set at locations corresponding to locations of panel inspection signal input pads of TFT substrates of various sizes. The programmable logic controller uses the motors to control the elevation and lowering of the probe pins.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: March 3, 2015
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventor: Haijian Zhang
  • Patent number: 8970240
    Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: March 3, 2015
    Assignee: Cascade Microtech, Inc.
    Inventors: Kenneth R. Smith, Mike Jolley, Eric Strid, Peter Hanaway, K. Reed Gleason, Koby L. Duckworth
  • Patent number: 8970242
    Abstract: Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality of probes, which are to be brought into contact with external terminals of the semiconductor devices, on one side of a board which forms the base body of the probe card; a step of forming on the board, by photolithography and etching, a plurality of through-holes which reach the probes from the other side of the board; a step of forming, in the through-holes, through electrodes to be conductively connected with the probes, respectively; and a step of forming wiring, which is conductively connected with the through electrodes, on the other side of the board.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: March 3, 2015
    Assignee: Rohm Co, Ltd.
    Inventors: Goro Nakatani, Masahiro Sakuragi, Koichi Niino
  • Patent number: 8963567
    Abstract: A wafer probing system includes a probe card assembly having a plurality of individual probe structures configured make contact with a semiconductor wafer mounted on a motor driven wafer chuck, with each probe structure configured with a pressure sensing unit integrated therewith; and a controller configured to drive the probe card assembly with one or more piezoelectric driver units response to feedback from the pressure sensing units of the individual probe structures.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: February 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Robert D. Edwards, Oleg Gluschenkov, Louis V. Medina, Tso-Hui Ting, Ping-Chuan Wang, Yongchun Xin
  • Patent number: 8963568
    Abstract: The resistive probing tip system has one or more carriers and one or more electrical contact assemblies. Each carrier has opposing surfaces with a plurality of resistors engaging the carrier. Each of the plurality of resistors has opposing electrical contacts that are exposed at respective opposing surfaces of the carrier. Each electrical contact assembly has opposing surfaces with electrical contacts exposed at the opposing surfaces with each electrical contact exposed on one surface coupled to a corresponding electrical contact on the other opposing surface. The carrier(s) and the electrical contact assembly(s) selectively mate to and mate from one another with the electrical contacts exposed at the opposing surfaces the carrier(s) and the electrical contact assembly(s) contacting one another. The carrier(s) and/or the electrical contact assembly(s) may be selectively secured to either of a circuit board or a probe head.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: February 24, 2015
    Assignee: Tektronix, Inc.
    Inventors: Richard A. Booman, Neil C. Clayton, Bruce C. Tollbom