Abstract: In an automatic test system, a test computer of a kind of test equipment communicates with a loading-and-unloading computer of a kind of loading-and-unloading equipment. The loading-and-unloading equipment automatically loads a plurality of target devices on a plurality of test carriers according to the state of the test equipment, and the test equipment automatically tests the target devices loaded on the test carriers according to the state of the loading-and-unloading equipment. In addition, after the test is completed, the loading-and-unloading equipment automatically unloads the tested target devices from the test carriers, and automatically sorts the tested target devices according to the test results generated by the test equipment.

Abstract: The present invention relates to a picker device. The pickers are arranged in a line on a picker support, and each of the pickers comprises: a main nozzle in which vacuum pressure is applied or released at the lower end; and a lift actuator supported by the picker support to lift and lower the main nozzle. A sub-nozzle docking module is docked or undocked with the main nozzles, and comprises: at least one sub-nozzle which adsorbs or desorbs an object to be transferred as vacuum pressure is applied or released at the lower end thereof; a docking mount which receives vacuum pressure from the main nozzles in a docked state with the main nozzles by supporting the sub-nozzle at the lower end thereof and delivers the vacuum pressure to the sub-nozzle through a vacuum passage; and an attachment/detachment mechanism for attaching and detaching the docking mount to and from the picker support.

Abstract: An automatic robot control system and methods relating thereto are described. These systems include components such as a touch screen panel (“TSP”) robot controller for controlling a TSP robot, a camera robot controller for controlling a camera robot and an audio robot controller for controlling an audio robot. The TSP robot operates inside a TSP testing subsystem, the camera robot operates inside a camera testing subsystem, and the audio robot operates inside an audio testing subsystem. Inside the audio testing subsystem, an audio signals measurement system, using a bi-directional coupling, controls the operation of the audio robot controller. In this control scheme, a test application controller is designed to control the different types of subsystem robots. Methods relating to TSP, camera, and audio robots, and their controllers, taken individually or in combination, for automatic testing of device functionalities are also described.

Abstract: The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.

Abstract: An example test system includes test sites comprising test sockets for testing devices under test (DUTs) and pickers for picking DUTs from the test sockets or placing the DUTs into the test sockets. Each picker may include a picker head for holding a DUT. The test system also includes a gantry on which the pickers are mounted. The gantry may be configured to move the pickers relative to the test sites to position the pickers for picking the DUTs from the test sockets or placing the DUTs into the test sockets. The test sockets are arranged in at least one array that is accessible to the pickers on the gantry.

Abstract: Controlled appliance and method for controlling interactions between the controlled appliance and a remote control device. The controlled appliance comprises a BLE interface and an actuation module. The controlled appliance sets the BLE interface in a scanning mode where the BLE interface is capable of receiving BLE signals from other devices. The controlled appliance receives, via the BLE interface, a BLE advertising signal from the remote control device. The controlled appliance establishes a connection between the controlled appliance and the remote control device through the BLE interface. The controlled appliance exchanges data with the remote control device via the BLE interface. Upon reception from the remote control device via the BLE interface of a command for controlling operations of the actuation module, the controlled appliance applies the command to the actuation module.

Abstract: Test line structures are provided. A test line structure includes a semiconductor substrate, a plurality of diagnosis units and a plurality of first micro pad units. The diagnosis units are formed over the semiconductor substrate. Each of the diagnosis units includes a first interconnect structure having a first routing pattern. The first interconnect structures of the diagnosis units are connected in series to form a first test chain through the first micro pad units, and each of the first micro pad units is configured to connect the first interconnect structures of two adjacent diagnosis units in the first test chain. The first routing patterns of the first interconnect structures in the diagnosis units are different.

Abstract: A sod harvester's stacking position can be dynamically adjusted to form vertically aligned stacks. More particularly, a sod harvester's control system can be configured to automatically adjust the stacking position as a stack is being formed based on a sensed orientation of the pallet. In this way, the control system can ensure that a slab of sod that is dropped from the stacking head will fall into the intended location on the stack regardless of the orientation of the pallet relative to the stacking head.

Abstract: An automatic robot control system and methods relating thereto are described. These systems include components such as a touch screen panel (“TSP”) robot controller for controlling a TSP robot, a camera robot controller for controlling a camera robot and an audio robot controller for controlling an audio robot. The TSP robot operates inside a TSP testing subsystem, the camera robot operates inside a camera testing subsystem, and the audio robot operates inside an audio testing subsystem. Inside the audio testing subsystem, an audio signals measurement system, using a bi-directional coupling, controls the operation of the audio robot controller. In this control scheme, a test application controller is designed to control the different types of subsystem robots. Methods relating to TSP, camera, and audio robots, and their controllers, taken individually or in combination, for automatic testing of device functionalities are also described.

Abstract: An inspection apparatus includes a load port area in which a carrier accommodation chamber for accommodating a carrier that receives an inspection object is disposed; an inspection area in which a plurality of probe cards are respectively disposed under a plurality of inspection devices, and in which the probe card is pressed against an electronic device of the inspection object on a chuck top to inspect the electronic device; a transfer area in which a transfer mechanism transfers the inspection object onto the chuck top; and a plurality of probe card accommodation devices disposed in at least one of the load port area or the inspection area, each probe card accommodation device being capable of accommodating the probe card, and a number of the probe card accommodation devices being equal to or greater than a number of the probe cards.

Abstract: An automatic robot control system and methods relating thereto are described. These systems include components such as a touch screen panel (“TSP”) robot controller for controlling a TSP robot, a camera robot controller for controlling a camera robot and an audio robot controller for controlling an audio robot. The TSP robot operates inside a TSP testing subsystem, the camera robot operates inside a camera testing subsystem, and the audio robot operates inside an audio testing subsystem. Inside the audio testing subsystem, an audio signals measurement system, using a bi-directional coupling, controls the operation of the audio robot controller. In this control scheme, a test application controller is designed to control the different types of subsystem robots. Methods relating to TSP, camera, and audio robots, and their controllers, taken individually or in combination, for automatic testing of device functionalities are also described.

Abstract: The present disclosure provides an integrated-circuit-level (IC-level) test method and system. The IC-level test method includes the operations of: providing, by a stage wagon, a plurality of burn-in boards to an IC loading chamber; determining, by the IC loading chamber, at least one disposing configuration for a plurality of ICs according to at least one docking mechanism of the stage wagon; disposing, by the IC loading chamber, the plurality of ICs on each of the plurality of burn-in boards according to the at least one disposing configuration; providing, by the stage wagon, the plurality of burn-in boards with the plurality of ICs to a test chamber; and performing, by the test chamber, a test function on the plurality of ICs to determine a status of each of the plurality of ICs.

Abstract: A testing apparatus including a testing platform, a loading device, a testing-signal generating device, a sound sensing device, a control unit, and an unloading device is disclosed. The loading device is configured to load a plurality of under-test devices to the testing platform. The testing-signal generating device is configured to generate at least one testing signal. The plurality of under-test devices receives the at least one testing signal and produces at least one testing sound-according to the at least one testing signal. The sound sensing device is configured to receive the at least one testing sound. The control unit controls the unloading device to unload the plurality of under-test devices from the testing platform and controls the unloading device to categorize the plurality of under-test devices into a plurality of groups according to the at least one testing sound received by the sound sensing device.

Abstract: A method of an embodiment separates a bonded substrate including first and second substrates. The bonded substrate includes a carbon film on a first surface of the first substrate, a memory cell on the carbon film, a first connection terminal on the memory cell, a transistor on a first surface of the second substrate, and a second connection terminal on the transistor. In opposing direction of the first surfaces of the first and second substrates, a side of the first substrate on which the memory cell is located and a side of the second substrate on which the transistor is located are joined together, and the first and second connection terminals are mutually connected. The method includes removing the carbon film, and separating the bonded substrate into the first substrate with the first surface exposed and the second substrate on which the memory cell and the transistor are located.

Abstract: Embodiments describe an electronic device fastener including a base link bar, and a pair of corner retaining features coupled to the base link bar. Each corner retaining feature includes a base being formed of a planar structure and having a base top surface, a support rail extending from a portion of the base top surface and having a support rail top surface, a fastening feature defined by surfaces of the base and support rail and comprising vacant space extending through the base and at least a portion of the support rail, a guide wall extending from a portion of the support rail top surface, a retaining protrusion extending from the guide wall toward a center line of the electronic device fastener, and a stopper positioned beside the base link bar and at back ends of the base, the support rail, the guide wall, and the base link bar.

Abstract: An electronic element inspection equipment is provided, which is adapted to inspect an electronic element. The electronic element inspection equipment includes a first transmission track, a first rotational unit, a first image capturing device, a second image capturing device, a third image capturing device, a second rotational unit, a fourth image capturing device, and a second transmission track. The first rotational unit rotates around a first axis. When the first rotational unit moves the electronic element, the first image capturing device, the second image capturing device, and the third image capturing device capture images of the electronic element. The second rotational unit rotates around a second axis, wherein the second axis is perpendicular to the first axis. When the second rotational unit moves the electronic element, the fourth image capturing device captures one image of the electronic element.

Abstract: An unmanned conveyance vehicle includes a monitoring section which includes, as monitoring regions for detecting obstacles, a first monitoring region and a second monitoring region which is capable of detecting obstacles that are more distant than the first monitoring region, and a light emitting section which emits light in the first monitoring region, in which when an obstacle is detected within the first monitoring region, a vehicle is caused to perform an emergency stop. Ordinarily, when the unmanned conveyance vehicle stops the light emission of the light emitting section and detects an obstacle within the second monitoring region, the unmanned conveyance vehicle causes the light emitting section to emit light. Accordingly, when an operator enters the second monitoring region, the operator is capable of recognizing a distance at which, when reached by the unmanned conveyance vehicle, the unmanned conveyance vehicle will perform the emergency stop.

Abstract: A semiconductor test apparatus capable of securely having the contact pin and the external contact terminal held in contact with each other even in case where the vertical type handler is used. The semiconductor test apparatus comprises: a test socket having a socket surface formed thereon, the socket surface having a contact pin towering therefrom; and a semiconductor transport fixture having a concave portion formed thereon, the concave portion adapted to receive therein an IC under test, wherein the test socket has a position adjustment guide provided thereon, the semiconductor transport fixture has a guide through bore formed therein, the guide through bore adapted to receive the position adjustment guide therethrough when the IC under test comes under test, and either one of the position adjustment guide or the guide through bore is formed in a tapered shape.

Abstract: An RF shield for enclosing a robotic tester unit while testing mobile devices. In some embodiments, the RF shield includes at least two conductive RF shield layers separated by an insulator material. In some embodiments, an inner surface of the RF shield is further lined with a RF absorbing material to absorb EM radiation generated within the RF Shield enclosure. In some embodiments, the internal components required for testing, e.g. the robot, are powered via a power conditioner that removes from the power source frequencies above a threshold, e.g. 100 Hz, to eliminate RF signals absorbed into the power lines via radio towers and/or intentionally induced into the power lines to control power equipment.

Abstract: Embodiments of the present invention provide methods and systems to analyze wearable technology. A robot with snake assembly works in conjunction with a server in order to simulate the locomotive actions of appendages and to concomitantly determine the response of wearable technology devices, which are attached to the snake robot assembly, to the simulated locomotive actions.

Abstract: A configurable electronic test system that is adapted for varying test processes and thermal conditions, consisting of a device handler working with multiple testers and a thermal environment module for controlling the thermal condition during test. The test system can be easily expanded by stacking more testers vertically for more test capacity without requiring an increase in floor space.

Abstract: A system, method, and device may include software and hardware which simplify and quicken configuration of the system for testing a device, enhance testing procedures which may be performed, and provide data via which to easily discern a cause and nature of an error which may result during testing. A camera may capture still images of a display screen of a tested device and another camera may capture video images of the tested device and a partner device. A wizard may be used to generate a configuration file based on one previously generated for a similar device. A mount for a tested device may be structured so that: it is suitable for mounting thereon a plurality of differently structured devices; and adjustments in a vertical direction and a horizontal direction in a plane and adjustments of an angle of the device relative to the plane may be easily made.

Abstract: A method and system are provided for optimizing operational throughput for a semiconductor device handler having multiple stages. The method includes receiving semiconductor devices for testing at an input carrier buffer, and operating the handler in the testing of semiconductor devices. The method also includes recording operational throughput characteristics for each operational stage of the handler, and analyzing recorded operational throughput characteristics for each operational stage of the handler. Additionally, the method includes determining which operational stage of the handler has the most limiting constraint causing a lowest operational drumbeat, and adjusting operational parameters of the operational stage of the handler that has the lowest operational drumbeat to increase the operational drumbeat.

Abstract: Described are methods and apparatuses, including computer program products, for testing mobile devices using an intelligent mobile device test fixture. A server computing device generates programmatic instructions for testing an application on a mobile device coupled to the test fixture, where the programmatic instructions are based upon a test script, and include a first set of instructions and a second set of instructions. The server computing device transmits the first set of instructions to the application, and transmits the second set of instructions to a controller board coupled to the test fixture. The application executes the first set of instructions to activate functionality. The controller board executes the second set of instructions to activate one or more servo motors of the test fixture that control movement of the fixture. The server computing device determines an updated state of the application after execution of each instruction.

Abstract: A robot includes, a holding unit configured to hold an object, an image pickup unit, and a predetermined first portion of the robot. The image pickup unit picks up images of the holding unit and the object using the first portion as a background.

Abstract: A method for inspecting an electronic device, in which inspection of electrical characteristics is carried out, uses conduction to pass a current to an electronic device while the electronic device is being continuously conveyed.

Abstract: Described herein is a robot for testing touch-sensitive displays. The test robot may have a test surface holding a touch-sensitive display. The test robot may also have a first robotic unit that can translate in only two dimensions relative to the touch-sensitive display, where the first robotic unit secures a first plurality of finger units. The test robot may also have a second robotic unit that can translate in only the two dimensions relative to the touch-sensitive display, where the second robotic unit secures a second plurality of finger units. The test robot may also have a control unit controlling the first robotic unit, the second robotic unit, the first plurality of finger units, and the second plurality of finger units.

Abstract: The invention relates to a prober for checking and testing electronic semiconductor components and methods of using the same. The prober comprises at least two checking units, each of which is equipped with a chuck, probes, and a positioning unit, and each of which is assigned to a machine control system and a process control system. The prober further comprises a loading unit for automatically loading both testing units and an additional loader for manually loading at least one of the testing units, a user interface, and a module control system for controlling the process control systems and/or the machine control systems and the loading unit. The user interface can optionally be connected to at least one of the process control systems or the module control system by means of a switching device of the prober.

Abstract: A system, method, and device may include software and hardware which simplify and quicken configuration of the system for testing a device, enhance testing procedures which may be performed, and provide data via which to easily discern a cause and nature of an error which may result during testing. A camera may capture still images of a display screen of a tested device and another camera may capture video images of the tested device and a partner device. A wizard may be used to generate a configuration file based on one previously generated for a similar device. A mount for a tested device may be structured so that: it is suitable for mounting thereon a plurality of differently structured devices; and adjustments in a vertical direction and a horizontal direction in a plane and adjustments of an angle of the device relative to the plane may be easily made.

Abstract: There is provided a pitch changing apparatus which can change a pitch of DUTs when the DUTs are transferred between trays by a shuttle revolving system. The pitch changing apparatus, which changes the pitch of DUTs, includes a plurality of shuttles which hold DUTs, a first guide rail which guides the plurality of shuttles, a second feeder which feeds the shuttles along the first guide rail at a first pitch, a third feeder which includes a plurality of pins receiving the shuttles from the second feeder and moves the pins along the first guide rail at a second pitch, and a controller which controls a feed rate of the second feeder and a receiving rate of the third feeder.

Abstract: The semiconductor transporting and testing fixture according to the present invention comprises: a frame portion (21) adapted to receive therein an IC (5) having an external connection terminal, the frame portion having an inner peripheral wall; a bottom surface sheet (25) pasted on a bottom surface of the frame portion, the bottom surface sheet having an IC side pad (26) formed on a front surface thereof and a socket side pad (27) formed on a rear surface thereof, the IC side pad being adapted to contact the external connection terminal, the socket side pad electrically connected with the corresponding IC side pad and being adapted to contact a testing socket, wherein the frame portion (21) is provided with a retaining latch (23) protruding therefrom toward above the IC (5) when the IC (5) is received in the inner peripheral wall (22) of the frame portion (21).

Abstract: A handler for conveying DUTs to a socket for a test that can reduce a test time includes: a test section including the socket; a heat applying section into which a tray having plural DUTs placed on its surface is conveyed and that controls the temperature of the DUTs to a predetermined test temperature and conveys the tray into the test section; and a device image capturing section that includes imaging elements arranged along a first direction the number of which is equal to DUTs arranged along the first direction and that in the heat applying section, captures images of the DUTs by moving the imaging elements relative to the surface of the tray in a second direction non-parallel with the first direction; and a position adjusting section that adjusts the positions of the DUTs relative to the socket based on their images captured by the device image capturing section.

Abstract: A carrier disassembling apparatus which disassembles a test carrier including a base member and a cover member coming into close contact with each other, includes: a first reversing arm which sucks and holds the cover member; and a disassembly table which sucks and holds the base member. The first reversing arm can approach and separate from the disassembly table. The first reversing arm includes a first contract surface which comes into contact with the cover member. The first contract surface includes a protrusion which protrudes toward the cover member.

Abstract: An automatic module apparatus for manufacturing a solid state drive (SSD) includes a labeling apparatus, one or more test handler apparatuses and a sorting apparatus. The labeling apparatus is for printing a label on a SSD mounted on a carrier tray. The one or more test handler apparatuses are for transporting the carrier tray on which the labeled SSD is mounted and for testing the labeled SSDs to determine whether the labeled SSDs have any defects. The SSD sorting apparatus is for transporting the carrier tray on which the tested SSDs are mounted and sorting non-defective defective SSDs tested by the test handler apparatuses. The SSD labeling apparatus, the test handler apparatuses, and the SSD sorting apparatus are in-line and automated.

Abstract: A system for positioning a load including a support column, a drive rail unit coupled to the support column, the drive rail unit moveable relative to the support column, a vertical carriage moveable along the support column, wherein the vertical carriage supports the load, an engagement member which engages the drive rail and which moves along the drive rail, and a motor which applies force to the engagement member, causing the engagement member to move along the drive rail. The motor is coupled to the vertical carriage so that, as the motor applies force to the engagement member, the vertical carriage moves relative to the drive rail unit, the vertical carriage is also moveable with the drive rail unit so that the vertical carriage and the drive rail unit move relative to the support column. A method of positioning a load is also provided.

Abstract: A wafer inspection interface IF comprises a probe card, an adsorption unit configured to adsorb a wafer to the probe card, a wafer adsorption sealing member to which the probe card is adsorbed, and a fixing ring configured to fix the wafer adsorption sealing member to a card holder. The adsorption unit includes an air exhaustion unit, a first air duct whose right end portion is opened in the hermetically closed space and the left end portion is opened at a side of the fixing ring, a second air duct whose right end portion is opened to face an opening of the left end portion of the first air duct and the left end portion is opened to be connected with the air exhaustion unit, and a hole by which the first air duct is in communication with the second air duct.

Abstract: One embodiment is a transport apparatus for moving carriers of microelectronic devices along a track, the transport apparatus including: (a) a track with two rails adapted to support the carriers; (b) a trolley adapted to be transported in a direction along the track by a linear actuator; and (c) a first and a second engagement feature attached to the trolley wherein the first engagement feature is adapted to engage temporarily with a first of the carriers, and the second engagement feature is adapted to engage temporarily with a second of the carriers; wherein a predetermined movement of the trolley slidably moves the first carrier onto a test position and slidably moves the second carrier off the test position simultaneously.

Abstract: The resistive probing tip system has one or more carriers and one or more electrical contact assemblies. Each carrier has opposing surfaces with a plurality of resistors engaging the carrier. Each of the plurality of resistors has opposing electrical contacts that are exposed at respective opposing surfaces of the carrier. Each electrical contact assembly has opposing surfaces with electrical contacts exposed at the opposing surfaces with each electrical contact exposed on one surface coupled to a corresponding electrical contact on the other opposing surface. The carrier(s) and the electrical contact assembly(s) selectively mate to and mate from one another with the electrical contacts exposed at the opposing surfaces the carrier(s) and the electrical contact assembly(s) contacting one another. The carrier(s) and/or the electrical contact assembly(s) may be selectively secured to either of a circuit board or a probe head.

Abstract: A test apparatus includes a foreign matter removal unit having a first slope provided with an abrasive coating or an adhesive sheet and a second slope provided with an abrasive coating or an adhesive sheet, the second slope facing the first slope in such a manner that an upper end of the second slope is spaced from an upper end of the first slope a greater distance than a lower end of the second slope is spaced from a lower end of the first slope, a test unit for testing electrical characteristics of a semiconductor chip, and a transfer unit for holding and releasing the semiconductor chip at a position above the first and second slopes and transferring the semiconductor chip to the test unit.

Abstract: An inspecting method for an object to be inspected is provided to bring probes of a probe card into electrical contact with a predetermined number of devices of target devices of the object at a time to inspect electrical characteristics of the target devices by moving a mounting table for mounting thereon the object under the control of a control unit. Upon completion of the inspection of the target devices, if inspection errors have occurred in specific devices of the target devices in a regular pattern, the target devices are re-examined, and when the re-examination is carried out, a contact position between the probe card and the object is displaced from a contact position in a previous inspection by a distance of at least one device to inspect electrical characteristics of the number of devices of the target devices at a time.

Abstract: A test apparatus includes a sector conveyance device provided with a plurality of soaking buffers, the soaking buffers being used to carry electronic components, the sector conveyance device being mounted pivotably by a pivot and moved between a test location and a transferring location; a transferring device arranged in correspondence to the transferring location, used to transfer a plurality of electronic components into or out of the sector conveyance device; and a test device arranged in correspondence to the test location for testing electronic components, the electronic components being transferred into the sector conveyance device after test.

Abstract: A technology related to a pick-and-place apparatus for electronic device inspection equipment is provided. The pick-and-place apparatus includes the guiding unit that can interact with a loading element and can guide the picker to load the electronic devices at a correct position on the loading element. Therefore, the pick-and-place apparatus can allow the electronic devices, for example, semiconductor devices having a ball type of electrical contact lead (BGA, FBGA, etc.), to electrically contact the tester in a stable manner when the tester inspects the electronic devices.

Abstract: A system for analyzing electronic devices includes an input station, a transport apparatus, an electric machine interface station, an electric machine interface, a support structure and first and second thermal components. The input station receives a plurality of electronic devices and the transport apparatus transports each of the electronic devices from the input station to the electric machine interface station. The electric machine interface engages the electronic device when the electronic device is at the electric machine interface station, and is disengageable from the electronic device for the electronic device to be transportable by the transport apparatus away from the electric machine interface station. The first and second thermal components are located on opposing sides of the electronic device when the electronic device is at the electric machine interface station to simultaneously transfer heat to or from the electronic device.

Abstract: Microelectronic contactors on a probe contactor substrate, or adhesive elements on a probe contactor or space transformer substrate, are protected by a sacrificial material as 1) the microelectronic contactors or adhesive elements are planarized, or 2) a surface of the substrate on which the microelectronic contactors or adhesive elements are formed is planarized. The adhesive elements are used to bond the probe contactor substrate to the space transformer substrate.

Abstract: [Problem] A test carrier able to secure a high air-tightness is provided. [Solution] A test carrier 10 comprises a cover member 50A and a base member 20A which are bonded together while sandwiching a die 90 between them. ultraviolet rays can pass through the cover member 50A.

Abstract: In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret of a turret handler, transporting the plurality of semiconductor components using the main turret to a test area, and splitting the plurality of semiconductor components into a first set and a second set. The method further includes testing a first semiconductor component in the first set at a first test pad using a tester while transporting a second semiconductor component in the second set to a second test pad and testing the second semiconductor component using the tester while transporting the first semiconductor component out of the first test pad. The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret.

Abstract: Test structures for performing electrical tests of devices under one or more microbumps are provided. Each test structure includes at least one microbump pad and a test pad. The microbump pad is a part of a metal pad connected to an interconnect for a device. A width of the microbump pad is equal to or less than about 50 ?m. The test pad is connected to the at least one microbump pad. The test pad has a size large enough to allow circuit probing of the device. The test pad is another part of the metal pad. A width of the test pad is greater than the at least one microbump pad.

Abstract: A calibration substrate having at least one calibration standard with at least two electrical connection points, each for one measurement gate of a vector network analyzer. At least one electrical connection point is formed of at least one calibration standard having a switch, wherein the switch has a first electrical contact electrically connected to an electrical connection point of the calibration standard, a second electrical contact designed for electrically connecting to a measurement gate of the vector network analyzer, and a third electrical contact, wherein the switch is designed such that an electrical contact is established either between the first and third electrical contact or between the first and second electrical contact.

Abstract: Disclosed is an apparatus for spinning a test tray and an in-line test handler including the above apparatus, wherein the apparatus may include a supporting unit for supporting a test tray transported between first and second chamber units facing in the different directions, wherein the first chamber unit is provided at a predetermined interval from the second chamber unit; a base unit to which the supporting unit is spinnably connected; and a spinning unit which spins the test tray so that semiconductor devices received in the test tray are tested at the same arrangement in each of the first chamber unit and the second chamber unit.

Abstract: An improved method and apparatus for automatically aligning probe pins to the test or bond pads of semiconductor devices under changing conditions. In at least one embodiment, a dynamic model is used to predict an impact of changing conditions to wafer probing process. This reduces the need for frequent measurements and calibrations during probing and testing, thereby increasing the number of dice that can be probed and tested in a given period of time and increasing the accuracy of probing at the same time. Embodiments of the present invention also make it possible to adjust positions of probe pins and pads in response to the changing conditions while they are in contact with each other.