Both Sides Patents (Class 324/763.02)
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Patent number: 8981808Abstract: A semiconductor device includes a plurality of memory chips arranged in a layered manner, each including a substrate and a memory cell array, and a plurality of current paths provided while penetrating through the memory chips. Each of the memory chips includes a test circuit that reads test data from a corresponding one of the memory cell array and outputs a layer test result signal responding to the test data to a different current path for each of the memory chips.Type: GrantFiled: October 6, 2010Date of Patent: March 17, 2015Assignee: PS4 Luxco S.A.R.L.Inventor: Naohisa Nishioka
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Patent number: 8810268Abstract: A built-in self-test (BIST) circuit for a liquid crystal display (LCD) source driver includes at least one digital-to-analog converter (DAC) and at least one buffer coupled to the respective DAC, wherein the buffer is reconfigurable as a comparator. A first input signal and a second input signal are coupled to the comparator. The first input signal is a predetermined reference voltage level. The second input signal is a test offset voltage in a test range.Type: GrantFiled: April 21, 2010Date of Patent: August 19, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jui-Cheng Huang, Yung-Chow Peng, Ruey-Bin Sheen
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Patent number: 8350575Abstract: An electrical connection defect detection system to detect whether an electrical connection between an under-test pin of an under-test device and a signal line of a circuit board is normal is provided. The electrical connection defect detection system comprises a signal provider providing a test signal to the under-test pin through the signal line, a detection module, an electrode board and a plurality of grounding paths. The electrode board comprises a detection surface to be adapted to a surface of the under-test device opposite to the under-test pin to make the detection module detect a capacitance value associated with the electrode board, the under-test pin and the signal line larger than a threshold value when their connection is normal. The grounding paths are connected to one of not-under-test pin groups respectively to further connect to the ground potential. An electrical connection defect detection method is disclosed herein as well.Type: GrantFiled: April 16, 2010Date of Patent: January 8, 2013Assignee: Test Research, Inc.Inventors: Su-Wei Tsai, Shang-Tsang Yeh
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Patent number: 8299813Abstract: A system includes a switching power supply, an electric load connected to the switching power supply, a voltage regulation circuit, and a detect device. The voltage regulation circuit is connected to the electric load and configured to output a Pulse Width Modulation (PWM) signal to regulate a voltage supplied to the electric load. The detect device is connected to the switching power supply for detecting whether the switching power supply is powered off when a current flowing to the electric load exceeds a preset tolerance value.Type: GrantFiled: April 2, 2010Date of Patent: October 30, 2012Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Ling-Yu Xie
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Patent number: 8269505Abstract: One embodiment provides a method of locating a short circuit in a printed circuit board. Test signals may be injected at different test points on the circuit board. The distance between each test point and the short circuit may be determined according to how long it takes for a signal reflection at the short circuit to propagate back to each test point. The distances between the various test points and the short circuit can be used to narrow the possible locations of the short circuit or even to pinpoint the location of the short circuit.Type: GrantFiled: December 15, 2009Date of Patent: September 18, 2012Assignee: International Business Machines CorporationInventors: Moises Cases, Bhyrav M. Mutnury, Terence Rodrigues
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Patent number: 8063656Abstract: A method of enabling a circuit board analysis is disclosed. The method comprising removing a portion of the circuit board on a first side of the circuit board opposite a second side of the circuit board having an integrated circuit package; removing the circuit board from the integrated circuit package; performing a dye mapping to analyze bonds between the integrated circuit package and the circuit board; and performing an analysis of the integrated circuit package.Type: GrantFiled: March 13, 2009Date of Patent: November 22, 2011Assignee: Xilinx, Inc.Inventors: Pedro R. Ubaldo, Leilei Zhang
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Patent number: 8008938Abstract: A testing system module for testing printed circuit board (PCB) includes at least one robot having a pogo pin for moving to a testing point of the PCB; a pressure detecting unit for detecting a current pressure value on the printed circuit board; and a control system for keeping the pogo pin to contact with the PCB with constant pressure.Type: GrantFiled: June 5, 2009Date of Patent: August 30, 2011Assignee: King Yuan Electronics Co., Ltd.Inventor: Cheng-Chin Ni
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Patent number: 8004301Abstract: A testing device for testing functions of a printed circuit board (PCB) includes a transfer board electrically coupled to the PCB, and a controller board electrically coupled to the transfer board and the PCB. The transfer board includes a signal bus and a controller bus. The PCB is capable of running a test program stored therein to transmit instructions to the controller board; and the controller board is capable of transmitting control signals to the transfer board according to the instructions. The transfer board is capable of switching the PCB corresponding ports on/off; and the PCB information is capable of being transmitted to the controller board via the signal bus. The controller board is capable of converting the PCB information to network information which is uploaded to the internet.Type: GrantFiled: April 20, 2010Date of Patent: August 23, 2011Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Jun-Hui Fan
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Publication number: 20110080187Abstract: In one embodiment, a device interface board is provided which includes a printed circuit board with a DUT interface structure, such as socket, associated with a DUT side of the printed circuit board. A high frequency connector and electronic component are mounted in a cavity formed in a back side of the printed circuit board. A signal via through the printed circuit board couples the high frequency connector and electronic component with the DUT interface structure. An encapsulating structure may be provided, which covers the cavity while allowing a cable to connect to the high frequency connector.Type: ApplicationFiled: October 2, 2009Publication date: April 7, 2011Inventors: Peter Hotz, Wolfgang Steger