Including Distributed Parameter-type Coupling Patents (Class 330/286)
  • Patent number: 10243250
    Abstract: A two-way microwave power divider (the “power divider”) may include an input port and two output ports. The power divider may also include a junction that is configured to split a feedline from the input port into a first transmission line and a second transmission line. One or more resistors may be placed along the first transmission line and the second transmission line to provide isolation between the two output ports.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: March 26, 2019
    Assignee: The United States of America, as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Kongpop U-Yen, Nathan Kovarik
  • Patent number: 10224878
    Abstract: A power amplification device, including a first amplification branch, a second amplification branch, a harmonic injection circuit, and a first output matching circuit. A first amplifier in the first amplification branch supports a first frequency. A second amplifier in the second amplification branch supports the first frequency and a second frequency, and the second amplifier is turned off for a signal of the first frequency that has a power value lower than an enabling threshold. The harmonic injection circuit injects a signal of the second frequency that is input from a second input terminal (I2) to a signal of the first frequency that is input from a first input terminal (I1) to obtain a signal of the first frequency that has undergone harmonic injection.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: March 5, 2019
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yanhui Wang, Xikun Zhang, Qianhua Wei
  • Patent number: 10205427
    Abstract: A multi-way power amplifier circuit includes two baluns and a number (2×N) of differential power amplifiers, where N?2. Each balun generates a number (N) of corresponding differential intermediate signal pairs based on a respective to-be-amplified signal. Each differential power amplifier generates a respective differential amplified signal pair based on a respective differential intermediate signal pair. One of the baluns includes: a first transmission line and a second transmission line connected to each other; a number (N) of third transmission lines electromagnetically coupled to the first transmission line; and a number (N) of fourth transmission lines electromagnetically coupled to the second transmission line.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: February 12, 2019
    Assignee: NATIONAL CHI NAN UNIVERSITY
    Inventors: Yo-Sheng Lin, Jin-You Liao
  • Patent number: 10200077
    Abstract: Described herein are radio-frequency (RF) modules that include shielding for improved RF performance. The RF modules including a packaging substrate with a receiving system implemented thereon. The RF module includes a shield implemented to provide RF shielding for at least a portion of the receiving system. The receiving system can include any combination of pre-amplifier or post-amplifier bandpass filters, amplifiers, switching networks, impedance matching components, phase-shifting components, input multiplexers, and output multiplexers. The shielding can include a conductive layer within a conformal shielding on an upper side and side walls of the RF module. The shielding can be an overmold formed over the packaging substrate. The conductive layer can be connected to one or more ground planes. The packaging substrate can include contact features on an underside of the substrate for mounting an underside component.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: February 5, 2019
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Yi Liu, Anthony James Lobianco, Matthew Sean Read, Hoang Mong Nguyen, Howard E. Chen, Stephane Richard Marie Wloczysiak, William J. Domino, Bipul Agarwal
  • Patent number: 10164579
    Abstract: A distributed amplifier includes an input transmission circuit, an output transmission circuit, at least one cascode amplifier coupled between said input and output transmission circuits. Each cascode amplifier includes a first common-gate configured transistor coupled to the output transmission circuit, a common-source configured transistor coupled between the input transmission circuit and the common-gate configured transistor, and a second common-gate configured transistor coupled between the first common-gate configured transistor and common-source configured transistor.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: December 25, 2018
    Assignee: HITTITE MICROWAVE LLC
    Inventor: Keith Benson
  • Patent number: 10164667
    Abstract: Spatial power-combining devices having amplifier connectors are disclosed. A spatial power-combining device structure includes a plate including a first face, a second face that opposes the first face, an exterior surface between the first face and the second face, and a plurality of amplifier connectors accessible at the exterior surface. A waveguide assembly is coupled to the plate at the first face, the waveguide assembly including an inner housing including a plurality of antenna signal conductors and an outer housing including a plurality of antenna ground conductors. A coaxial waveguide section is coupled to the waveguide assembly. The plurality of amplifier connectors may be radially arranged in the plate. A plurality of amplifier modules are on the exterior surface and coupled to corresponding ones of the plurality of amplifier connectors.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: December 25, 2018
    Assignee: Qorvo US, Inc.
    Inventor: John Kitt
  • Patent number: 10116272
    Abstract: An amplifier with switchable and tunable harmonic terminations and a variable impedance matching network is presented. The amplifier can adapt to different modes and different frequency bands of operation by appropriate switching and/or tuning of the harmonic terminations and/or the variable impedance matching network.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: October 30, 2018
    Assignee: pSemi Corporation
    Inventors: Gary Frederick Kaatz, Chris Olson
  • Patent number: 10110307
    Abstract: Optical network units (ONUs) for high bandwidth connectivity, and related components and methods are disclosed. A fiber optical network ends at an ONU, which may communicate with a subscriber unit wirelessly at an extremely high frequency avoiding the need to bury cable on the property of the subscriber. In one embodiment, an optical network unit (ONU) is provided. The ONU comprises a fiber interface configured to communicate with a fiber network. The ONU further comprises an optical/electrical converter configured to receive optical downlink signals at a first frequency from the fiber network through the fiber interface and convert the optical downlink signals to electrical downlink signals. The ONU further comprises electrical circuitry configured to frequency convert electrical downlink signals to extremely high frequency (EHF) downlink signals at an EHF, and a wireless transceiver configured to transmit the EHF downlink signals to a proximate subscriber unit through an antenna.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: October 23, 2018
    Assignee: Corning Optical Communications LLC
    Inventors: Bruce Cinkai Chow, Anthony Ng'Oma, Michael S Pambianchi, Michael Sauer
  • Patent number: 10090816
    Abstract: A two-stage amplifier of a type of the current re-use configuration is disclosed. The amplifier includes first to third transistors, where the first transistor constitute the first stage, while, the latter two transistors constitute the second stance. The first to third transistors are connected in series between a power supply and ground such that a bias current supplied to the third transistor flows in the second and first transistors. The first transistor in the source thereof is grounded in the DC mode. The second transistor is grounded in the AC mode but floated in the DC mode. The third transistor that outputs an amplified signal is connected in parallel in the AC mode but in series in the DC mode with respect to the second transistor.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: October 2, 2018
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Seiji Fujita, Tsuneo Tokumitsu
  • Patent number: 10069466
    Abstract: Solder bumps are placed in direct contact with the silicon substrate of an amplifier integrated circuit having a flip chip configuration. A plurality of amplifier transistor arrays generate waste heat that promotes thermal run away of the amplifier if not directed out of the integrated circuit. The waste heat flows through the thermally conductive silicon substrate and out the solder bump to a heat-sinking plane of an interposer connected to the amplifier integrated circuit via the solder bumps.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: September 4, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Michael Joseph McPartlin, Bharatjeet Singh Gill, Stephen Joseph Kovacic
  • Patent number: 10063211
    Abstract: The disclosure generally relates to a compact bypass and decoupling structure that can be used in a millimeter-wave radio frequency integrated circuit (RFIC). For example, according to various aspects, an RFIC incorporating the compact bypass and decoupling structure may comprise a grounded substrate, a mid-metal ground plane, a bypass capacitor disposed between the grounded substrate and the mid-metal ground plane, and a decoupling inductor disposed over the mid-metal ground plane. The bypass capacitor may close a current loop in the RFIC and the decoupling inductor may provide damping in a supply network associated with the RFIC. Furthermore, the decoupling conductor may have a self-resonance substantially close to an operating band associated with the RFIC to increase series isolation, introduce substrate losses that facilitate the damping in the supply network, and prevent high-Q resonances.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: August 28, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Alon Yehezkely, Sagi Kupferman
  • Patent number: 10009103
    Abstract: A microwave-frequency source at frequency fM comprises: a dual optical-frequency reference source, an electro-optic sideband generator, an optical bandpass filter, an optical detector, a reference oscillator, an electrical circuit, and a voltage-controlled oscillator (VCO). The sideband generator modulates dual optical reference signals at v2 and v1 to generate sideband signals at v1±n1fM and v2±n2fM. The bandpass filter transmits sideband signals at v1+N1fM and v2?N2fM. The optical detector generates a beat note at (v2?N2fM)?(v1+N1fM). The beat note and a reference oscillator signal are processed by the circuit to generate a loop-filtered error signal to input to the VCO. Output of the VCO at fM drives the sideband generator and forms the microwave-frequency output signal. The resultant frequency division results in reduced phase noise on the microwave-frequency signal.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: June 26, 2018
    Assignees: CALIFORNIA INSTITUTE OF TECHNOLOGY, THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE
    Inventors: Kerry Vahala, Scott Diddams, Jiang Li, Xu Yi, Hansuek Lee
  • Patent number: 10003118
    Abstract: A spatium amplifier includes a plurality of amplifiers connected between a pair of spatial couplers, each having a core member and a shell member forming an antenna. The core member includes a cylindrical core portion and a plurality of tapering core fins extending radially outwardly from the cylindrical core portion. The shell member includes a cylindrical shell portion and a plurality of tapering shell fins extending radially inwardly from the cylindrical shell portion to form a plurality of fin pairs. Each fin pair forms a tapering channel having a first channel height at a first end of the antenna and a second channel height larger than the first channel height at a second end of the antenna. Each of the plurality of amplifiers is electromagnetically coupled to a respective fin pair at the first end of each of the antennas.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: June 19, 2018
    Assignee: Qorvo US, Inc.
    Inventor: John Kitt
  • Patent number: 9991854
    Abstract: Embodiments of an RF amplifier include a transistor with a control terminal and first and second current carrying terminals, and a shunt circuit coupled between the first current carrying terminal and a ground reference node. The shunt circuit includes a first shunt inductive element, a second shunt inductance, and a shunt capacitor coupled in series. Instead of a separate inductive element, the second shunt inductance may be achieved via magnetic coupling of the first shunt inductive element and an envelope inductive element of a video bandwidth circuit that is coupled between an RF cold point node (between the first and second shunt inductances) and the ground. Alternatively, an envelope inductance in the video bandwidth circuit may be achieved via magnetic coupling of first and second shunt inductive elements. A better RF cold point may be achieved without physically incorporating separate inductive elements, allowing for reduction in cost and size.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: June 5, 2018
    Assignee: NXP USA, INC.
    Inventors: Ning Zhu, Damon G. Holmes, Ricardo Uscola, Jeffrey Kevin Jones
  • Patent number: 9941851
    Abstract: An amplifier arrangement comprises N amplifier stages 101 to 10N, wherein N is an integer equal or greater than five. The amplifier arrangement comprises a cascade of quarter wavelength transmission line segments 111 to 11M coupled between an output of an amplifier of a first amplifier stage and an output node 15 of the amplifier arrangement. At least one intermediate junction 12 in the cascade of quarter wavelength transmission line segments comprises: a first amplifier coupled directly to the intermediate junction 12; and a second amplifier coupled to the same intermediate junction 12 via a connecting quarter wavelength trans mission line 131.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: April 10, 2018
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventor: Richard Hellberg
  • Patent number: 9929701
    Abstract: A receiver front end capable of receiving and processing intraband non-contiguous carrier aggregate (CA) signals using multiple low noise amplifiers (LNAs) is disclosed herein. A cascode having a “common source” input stage and a “common gate” output stage can be turned on or off using the gate of the output stage. A first switch is provided that allows a connection to be either established or broken between the source terminal of the input stage of each cascode. Further switches used for switching degeneration inductors, gate/sources caps and gate to ground caps for each legs can be used to further improve the matching performance of the invention.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: March 27, 2018
    Assignee: pSemi Corporation
    Inventors: Hossein Noori, Chih-Chieh Cheng
  • Patent number: 9923259
    Abstract: A device and a method for utilizing the device for radio-frequency (RF) power coupling, particularly a power combiner and/or divider, includes a box shaped casing forming the outside conductor, and connectors for inputting and outputting RF-power, which are electrically connected to at least one center conductor, where the electrical connection between the connectors and the at least one center conductor is a direct electrical and mechanical connection.
    Type: Grant
    Filed: August 15, 2013
    Date of Patent: March 20, 2018
    Assignee: OOO SIEMENS
    Inventors: Alexey Gudovich, Andrey Krasnov, Konstantin Nikolskiy, Alexander Smirnov
  • Patent number: 9912303
    Abstract: A power combining and outphasing system and related techniques for simultaneously providing both wide-bandwidth linear amplification and high average efficiency is described. Providing linear amplification encompasses the ability to dynamically control an RF output power level over a wide range while still operating over a wide frequency bandwidth. The system and techniques described herein also operate to maintain high efficiency across a wide range of output power levels, such that a high average efficiency can be achieved for highly modulated output waveforms.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: March 6, 2018
    Assignee: Massachusetts Institute of Technology
    Inventors: Taylor W. Barton, David J. Perreault
  • Patent number: 9866181
    Abstract: Embodiments for a power amplifier that can increase a low-frequency resonance frequency are provided. The power amplifier includes a power amplifying transistor die, a first metal oxide semiconductor capacitor, a direct current decoupling capacitor, and an output matching network, where: a drain of the power amplifying transistor die is connected to a first end of the first metal oxide semiconductor capacitor by using a bonding wire, and a second end of the first metal oxide semiconductor capacitor is grounded; the drain of the power amplifying transistor die is directly connected to the output matching network by using a bonding wire; a source of the power amplifying transistor die is grounded; the first end of the first metal oxide semiconductor capacitor is connected to one end of the direct current decoupling capacitor by using a bonding wire; and the other end of the direct current decoupling capacitor is grounded.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: January 9, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Xiaomin Zhang, An Huang, Liuyan Jiao
  • Patent number: 9843343
    Abstract: This invention is about the switched multiplexers used for adaptive filtering in systems operating in signal dense environments such as electronic warfare systems. The aim of this invention is to design a switched multiplexer with lower input/output return losses and having lower level of destructive interaction between channels compared to the known examples.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: December 12, 2017
    Assignee: ASELSAN ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETI
    Inventor: Bulent Alicioglu
  • Patent number: 9831837
    Abstract: The present disclosure includes dynamic power divider circuits and methods. In one embodiment, a dynamic power divider includes first and second quarter wave lines that receive an input signal and produce first and second signal on second terminals of the lines. Dynamic power division of the input signal uses a variable impedance circuit between the second terminal of the first quarter wave line and the second terminal of the second quarter wave line. The variable impedance may reduce impedance between two output paths as the input signal power increases or increase impedance between the output paths as the input signal power decreases.
    Type: Grant
    Filed: November 5, 2014
    Date of Patent: November 28, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Joonhoi Hur, Paul Joseph Draxler
  • Patent number: 9825603
    Abstract: A distributed amplifier is disclosed having a plurality of amplifier sections, each having an input gate and an output drain, and a first plurality of inductive elements coupled in series between a DA input terminal and a gate termination terminal to form a first plurality of connection nodes. Each of the connection nodes is coupled to a corresponding adjacent pair of the first plurality of inductive elements and to a corresponding input gate of the plurality of amplifier sections. A second plurality of inductive elements is coupled in series between a drain termination terminal and a DA output terminal to form a second plurality of connection nodes, each being coupled to a corresponding adjacent pair of the second plurality of inductive elements and to a corresponding output drain of the plurality of amplifier sections. An active impedance termination circuitry has a termination output coupled to the drain termination terminal.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: November 21, 2017
    Assignee: Qorvo US, Inc.
    Inventor: Kevin Wesley Kobayashi
  • Patent number: 9806673
    Abstract: An outphasing amplifier includes a first class-E power amplifier (16-1) having an output coupled to a first conductor (31-1) and an input receiving a first RF drive signal (S1(t)). A first reactive element (CA-1) is coupled between the first conductor and a second conductor (30-1). A second reactive element (LA-1) is coupled between the second conductor and a third conductor (32-1). A second class-E power amplifier (17-1) includes an output coupled to a fourth conductor (31-2) and an input coupled to a second RF drive signal (S2(t)), a third reactive element (CA-3) coupled between the second and fourth conductors. Outputs of the first and second power amplifiers are combined by the first, second and third reactive elements to produce an output current in a load (R). An efficiency enhancement circuit (LEEC-1) is coupled between the first and fourth conductors to improve power efficiency at back-off power levels. Power enhancement circuits (20-1,2) are coupled to the first and fourth conductors, respectively.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: October 31, 2017
    Assignee: TEXAS INSTRUMENT INCORPORATED
    Inventors: Aritra Banerjee, Joonhoi Hur, Baher Haroun, Nathan Richard Schemm, Rahmi Hezar, Lei Ding
  • Patent number: 9800208
    Abstract: An embodiment of a radio-frequency (RF) device includes at least one transistor, a package, and a surface-mountable capacitor. The package contains the at least one transistor and includes at least one termination. The surface-mountable capacitor is coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: October 24, 2017
    Assignee: NXP USA, INC.
    Inventors: Mahesh K. Shah, Jerry L. White, Li Li, Hussain H. Ladhani, Audel A. Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos
  • Patent number: 9787259
    Abstract: Embodiments relate to outphasing amplifiers and amplification. One example system includes a signal splitter configured to receive an input signal and output a plurality of signals, wherein the signal splitter shifts each of the plurality of signals by a distinct phase based at least in part on a power of the input signal; a plurality of power amplifiers (PAs), each configured to amplify a distinct signal of the plurality of signals to generate a distinct amplified signal; a plurality of input matching networks, each coupled to a distinct PA of the plurality of PAs and configured to transform an input impedance of the coupled PA to an outphasing load condition based on the distinct signal the coupled PA is configured to amplify; and a combiner configured to combine the plurality of distinct amplified signals to generate an amplified input signal.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: October 10, 2017
    Assignee: Infineon Technologies AG
    Inventors: Haedong Jang, Richard Wilson, Timothy Canning, David Seebacher, Christian Schuberth
  • Patent number: 9774301
    Abstract: An embodiment of a Doherty amplifier module includes a substrate, an RF signal splitter, a carrier amplifier die, and a peaking amplifier die. The RF signal splitter divides an input RF signal into first and second input RF signals, and conveys the first and second input RF signals to first and second splitter output terminals. The carrier amplifier die includes one or more first power transistors configured to amplify, along a carrier signal path, the first input RF signal to produce an amplified first RF signal. The peaking amplifier die includes one or more second power transistors configured to amplify, along a peaking signal path, the second input RF signal to produce an amplified second RF signal. The carrier and peaking amplifier die are coupled to the substrate so that the RF signal paths through the carrier and peaking amplifier die extend in substantially different (e.g., orthogonal) directions.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: September 26, 2017
    Assignee: NXP USA, INC.
    Inventors: Elie A. Maalouf, Margaret A. Szymanowski
  • Patent number: 9768741
    Abstract: A method for improving circuit stability is disclosed. In the method of the present invention, the circuit is analyzed to find the frequency band in which the input impedance at a target node behaves as a negative resistance, and then find the signal path of the frequency band in the matching circuit in front of the target node and add an attenuator in the signal path. This prevents the circuit from oscillation and improves the stability of the circuit. Furthermore, the signal on the main signal path will not be attenuated and the performance of the circuit will be maintained.
    Type: Grant
    Filed: January 7, 2016
    Date of Patent: September 19, 2017
    Assignee: Airoha Technology Corp.
    Inventor: Chun-Hsiung Chang
  • Patent number: 9722541
    Abstract: A distributed amplifier includes: an input-side transmission line; M amplification circuits; M output-side transmission lines; and a combination circuit configured to combine outputs of the M output-side transmission lines; wherein the input-side transmission line has an input-side serial line formed by connecting in series M×N unit transmission lines each including the same line length, and an input-side terminating resistor, the M amplification circuits each includes N amplifiers and the N amplifiers of the i-th amplification circuit take the input node of the ((k?1) M+i)-th input-side transmission line to be the input, and the output-side transmission line includes an output-side serial line including N transmission lines each being connected in series between the neighboring outputs of the N amplifiers and each having a line width in which the phase of the output of the amplifier in each stage agrees with one another.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: August 1, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Masaru Sato, Naoko Kurahashi
  • Patent number: 9716473
    Abstract: An amplifier circuit with at least one basic transistor, at least one load transistor, and at least one impedance element, the basic transistor being connected to the impedance element and the load transistor, an amplifier input and output, the amplifier input being connected to the gate contact of the basic transistor and the amplifier output being connected to a source contact of the load transistor. Here the amplifier circuit has at least two combined amplifying cells, with each combined amplifying cell respectively including a basic transistor, a load transistor, and an impedance element, with the basic transistor and the load transistor being non-complementary single-pin transistors, and arranged cooperating with the impedance element, and every combined amplifying cell has an input and an output, which cell input being connected to a gate contact of the basic transistor and which cell output being connected to a contact of the impedance element.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: July 25, 2017
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V.
    Inventor: Stephan Maroldt
  • Patent number: 9698023
    Abstract: A traveling-wave amplifier includes a plurality of amplifier cells, an insulating layer, an input line, and an output line. The plurality of amplifier cells is provided on a semiconductor substrate. Each of the amplifier cells receives an input signal and generates a part of an output signal from the input signal. The insulating layer is provided on the semiconductor substrate. The input line is used to externally receive an input signal and to transmit the input signal to the amplifier cells respectively. The output line is used to transmit the output signal generated by the amplifier cells and to externally output the output signal. The thickness of the input line is smaller than the thickness of the output line, and the input line and the output line are provided on the same insulating layer.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: July 4, 2017
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Naoki Itabashi, Taizo Tatsumi, Masataka Watanabe
  • Patent number: 9692373
    Abstract: The embodiments described herein provide inverse class F (class F?1) amplifiers. In general, the inverse class F amplifiers are implemented with a transistor, an output inductance and a transmission line configured to approximate inverse class F voltage and current output waveforms by compensating the effects of the transistor's intrinsic output capacitance for some even harmonic signals while providing a low impedance for some odd harmonic signals. Specifically, the transistor is configured with the output inductance and transmission line to form a parallel LC circuit that resonates at the second harmonic frequency. The parallel LC circuit effectively creates high impedance for the second harmonic signals, thus blocking the capacitive reactance path to ground for those harmonic signals that the intrinsic output capacitance would otherwise provide. This facilitates the operation of the amplifier as an effective, high efficiency, inverse class F amplifier.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: June 27, 2017
    Assignee: NXP USA, INC.
    Inventors: Joseph Staudinger, Maruf Ahmed, Hussain H. Ladhani
  • Patent number: 9692126
    Abstract: A mm-wave antenna apparatus with beam steering function that includes: a Butler Matrix feeding network; a plurality of power combiners, each power combiner having one input and N outputs, configured to apply equal phase and power to a phase distributed output signal generated by the Butler Matrix feeding network and to generate N processed signals; and a plurality of millimeter wave switched beam planar antenna arrays having at least 1.5 GHz of bandwidth and located on a top low loss dielectric substrate, each antenna array of N elements, configured to obtain direct and narrow width beams from the N processed signals combined by each power combiner.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: June 27, 2017
    Assignee: King Fahd University of Petroleum and Minerals
    Inventor: Mohammad Said Sharawi
  • Patent number: 9647615
    Abstract: Parallel capacitors (5c and 5d) of impedance matching circuits (5) which are connected to two transistors (1), respectively, have their first ends connected to a ground through via holes (5e and 5f) that are used in common, respectively. Although a conventional circuit necessitates via holes by the number equal to the number of stages multiplied by the number of cells of the transistors (1) for an LPF type impedance matching circuit (3), the present circuit can halve the number of via holes of the LPF type impedance matching circuit (5), thereby being able to downsize the circuit.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: May 9, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Eigo Kuwata, Koji Yamanaka, Hiroshi Otsuka, Tasuku Kirikoshi, Yoshitaka Kamo
  • Patent number: 9647309
    Abstract: Systems and methods for using power dividers for improved ferrite circulator RF power handling are provided. In one embodiment, a method for switching RF power using a high power circulator switch comprises: operating a ferrite circulator switch to direct RF power to either a first output port or a second output port, the ferrite circulator switch comprising at least three ferrite circulators arranged as a triad switch, wherein a first circulator is coupled to the first output port, a second circulator is coupled to the second output port; and using a waveguide power divider coupled between the first circulator and the second circulator, distributing reflected RF power received at the first output port or the second output port between a plurality of waveguide loads.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: May 9, 2017
    Assignee: Honeywell International Inc.
    Inventor: Adam M. Kroening
  • Patent number: 9647656
    Abstract: An integrated circuit includes a transistor, and an impedance matching circuit coupled with the transistor. The impedance matching circuit includes a signal line to transmit a high-frequency signal and a power supply line that is a short stub branched from the signal line and supplies current to the transistor. The power supply line includes a bent line and a shortcut line to shortcut the bent line.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: May 9, 2017
    Assignee: FUJITSU LIMITED
    Inventor: Satoshi Masuda
  • Patent number: 9641144
    Abstract: A power combining arrangement includes an input divider waveguide and an output combiner waveguide, and a first and second amplifier. The power combining arrangement is configured to amplify RF energy having a characteristic wavelength ?. The first amplifier has a first input electrically coupled with a first output port of the divider waveguide. The second amplifier has a second input electrically coupled with a second output port of the divider waveguide. The first and second output ports are separated by a first distance corresponding to a phase delay Ø1, the first distance being selected substantially independently of the characteristic wavelength. The first amplifier has a first output electrically coupled with a first input port of the combiner waveguide and the second amplifier has a second output electrically coupled with a second input port of the combiner waveguide. The first and second input ports are separated by the first distance.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: May 2, 2017
    Assignee: Space Systems/Loral, LLC
    Inventors: James J. Sowers, Perry Peterson
  • Patent number: 9614485
    Abstract: An amplifier circuit includes: plural transistors; plural first transmission lines respectively connected between input terminals of the plural transistors; plural second transmission lines respectively connected between output terminals of the plural transistors; an input node connected to the input terminal of a first stage transistor among the plural transistors; an output node connected to the output terminal of a final stage transistor among the plural transistors; and a capacitance connected to the output terminal of the first stage transistor via a third transmission line.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: April 4, 2017
    Assignee: FUJITSU LIMITED
    Inventor: Masaru Sato
  • Patent number: 9564871
    Abstract: A Radio Frequency (RF) filter configured by combining a hybrid coupler with a general filter, for having different characteristics from original characteristics of a general filter is provided, in which a coupler receives an input signal through a first port, divides the input signal, outputs the divided signals through second and third ports, combines signals received through the second and third ports according to phases of the signals, and outputs the combined signal through the first port or as an output signal of the RF filter through a fourth port, and a first filter unit has a first port connected to the second port of the coupler and a second port connected to the third port of the coupler, for having a predetermined frequency filtering characteristic.
    Type: Grant
    Filed: May 14, 2014
    Date of Patent: February 7, 2017
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Nam-Shin Park
  • Patent number: 9565642
    Abstract: A gallium nitride (GaN) radio frequency integrated circuit (RFIC) is configured to receive and amplify a low-level WiFi signal to generate a WiFi transmit signal. By using a GaN RFIC, the performance of the RFIC is significantly improved when compared to conventional RFICs for WiFi signals. In one exemplary embodiment, the RFIC has an error vector magnitude less than 29 dBc, an average power output around 29 dBm, and an average power added efficiency of greater than 25%. In additional embodiments, the RFIC has a gain greater than about 32 dB and a peak output power around ?37 dB.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: February 7, 2017
    Assignee: Cree, Inc.
    Inventors: William Pribble, Simon Wood, James W. Milligan
  • Patent number: 9537605
    Abstract: An ultra-wideband high-power solid-state transmitter for electronic warfare applications which includes a plurality of wideband Gallium-Nitride (GaN) semiconductor monolithic-microwave integrated circuits (MMICs), a spatial power combiner to sum the aggregate contribution of the MMICs, a wide bandwidth small form factor driver amplifier module to supply the required gain in the transmitter, and a thermal management system.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: January 3, 2017
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Robert Actis, Robert J. Lender, Jr., Virginia W. Murray, Edwin C. Powers
  • Patent number: 9466867
    Abstract: A device for coupling RF power into a waveguide includes a push-pull output stage that includes an input and an output, a filter arrangement that is connected to the output of the push-pull output stage, and an induction loop that is connected to the filter arrangement is provided.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: October 11, 2016
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Oliver Heid, Timothy Hughes
  • Patent number: 9438173
    Abstract: A multiple-series amplifying device (100) of the present invention includes multiple series of amplifiers (110, 120) which are formed in parallel so as to input and output signals individually. Each of multiple-series of amplifiers (110, 120) includes a plurality of semiconductor amplifying elements (111, 112, 121, 122) which are driven in parallel so as to amplify signals. A pair of semiconductor amplifying elements (112, 121) adjoining together in a pair of amplifiers (110, 120) is formed in a single package (130).
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: September 6, 2016
    Assignee: NEC Corporation
    Inventor: Yoji Murao
  • Patent number: 9385669
    Abstract: An outphasing amplifier includes a first class-E power amplifier (16-1) having an output coupled to a first conductor (31-1) and an input receiving a first RF drive signal (S1(t)). A first reactive element (CA-1) is coupled between the first conductor and a second conductor (30-1). A second reactive element (LA-1) is coupled between the second conductor and a third conductor (32-1). A second class-E power amplifier (17-1) includes an output coupled to a fourth conductor (31-2) and an input coupled to a second RF drive signal (S2(t)), a third reactive element (CA-3) coupled between the second and fourth conductors. Outputs of the first and second power amplifiers are combined by the first, second and third reactive elements to produce an output current in a load (R). An efficiency enhancement circuit (LEEC-1) is coupled between the first and fourth conductors to improve power efficiency at back-off power levels. Power enhancement circuits (20-1,2) are coupled to the first and fourth conductors, respectively.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: July 5, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Aritra Banerjee, Joonhoi Hur, Baher Haroun, Nathan Richard Schemm, Rahmi Hezar, Lei Ding
  • Patent number: 9300254
    Abstract: An embodiment of a radio-frequency (RF) device includes at least one transistor, a package, and a surface-mountable capacitor. The package contains the at least one transistor and includes at least one termination. The surface-mountable capacitor is coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: March 29, 2016
    Assignee: FREESCALE SEMICONDUCTOR INC.
    Inventors: Mahesh K. Shah, Jerry L. White, Li Li, Hussain H. Ladhani, Audel A. Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos
  • Patent number: 9257948
    Abstract: A high efficiency power amplifier of the present invention includes a transistor and an output power processing circuit section. The output power processing circuit section includes an output matching circuit section and an output harmonic processing circuit section. The output matching circuit section carries out impedance matching to the fundamental wave component of the output power. The output harmonic processing circuit section carries out a reactive power control to a reactive power of a plurality of harmonic power components respectively having a plurality of harmonic angular frequencies which are integral multiples of the base angular frequency of the output power. The output harmonic processing circuit section is formed to realize the reactive power control to at least one of the plurality of harmonic power components by orthogonalizing the phases of the current and voltage in the reactive power.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: February 9, 2016
    Assignee: The University of Electro-Communications
    Inventors: Masahiro Kamiyama, Ryo Ishikawa, Kazuhiko Honjo
  • Patent number: 9203348
    Abstract: An adjustable power splitter includes: a power divider with an input and a plurality, N, of divider outputs; a plurality, N, of adjustable phase shifters and a plurality, N, of adjustable attenuators series coupled to the divider outputs and providing a plurality, N, of power outputs; an interface; and a controller. The controller is configured to receive, via the interface, data indicating phase shifts to be applied by the adjustable phase shifters and attenuation levels to be applied by the adjustable attenuators, and to control, based on the data, the phase shifts and attenuation levels applied by the adjustable phase shifters and the adjustable attenuators.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: December 1, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Abdulrhman M. S. Ahmed, Joseph Staudinger, Paul R. Hart
  • Patent number: 9190702
    Abstract: A ganged circulator device for isolating a transmitter and increasing the power level, isolation performance, and input VSWR performance of an IBOC combiner module is provided. The ganged circulator device includes an input power divider, a ganged circulator module, and an output power combiner. The input power divider includes a first input port, a second input port, and a plurality of output ports. The ganged circulator module includes a plurality of circulators and a plurality of load resistors. The module also includes input ports corresponding to and electrically connected to the plurality of output ports on the input power divider. The output power combiner includes a first output port, a second output port, and plurality of input ports corresponding to and electrically connected to a plurality of output ports of the ganged circulator module.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: November 17, 2015
    Assignee: ELECTRONIC RESEARCH, INC.
    Inventors: Robert W. Rose, Nicholas A. Paulin
  • Patent number: 9165894
    Abstract: A cascode gain stage apparatus includes an input transistor having an RF input node and a transistor output node, an output transistor having a transistor input node and an RF output node, and a DC blocking capacitor connected between the transistor input and transistor output nodes.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: October 20, 2015
    Assignee: Teledyne Scientific & Imaging, LLC
    Inventors: Zachary M. Griffith, Thomas Benjamin Reed
  • Patent number: 9166532
    Abstract: An adjustable power splitter includes: a power divider with an input and a plurality, N, of divider outputs; a plurality, N, of adjustable phase shifters and a plurality, N, of adjustable attenuators series coupled to the divider outputs and providing a plurality, N, of power outputs; an interface; and a controller. The controller is configured to receive, via the interface, data indicating phase shifts to be applied by the adjustable phase shifters and attenuation levels to be applied by the adjustable attenuators, and to control, based on the data, the phase shifts and attenuation levels applied by the adjustable phase shifters and the adjustable attenuators.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: October 20, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Abdulrhman M. S. Ahmed, Joseph Staudinger, Paul R. Hart
  • Patent number: 9146412
    Abstract: The presence or absence of touch is detected according to a difference of a capacitance caused by the presence or absence of a material that blocks the electric field formed between the detection electrode and the common electrode. The common electrode includes a plurality of divided electrode portions that is extended in a lateral direction and aligned with each other in a longitudinal direction. Each of the plurality of common lines is electrically connected to at least one of the divided electrode portions. The plurality of common lines is arranged in an area next to the common electrode in the lateral direction of the common electrode, arranged next to each other in a width direction orthogonal to a length thereof, is different in width from each other, and the width of the common lines is wider as the length is longer.
    Type: Grant
    Filed: March 27, 2013
    Date of Patent: September 29, 2015
    Assignee: Japan Display Inc.
    Inventors: Hiroyuki Abe, Masahiro Maki, Takayuki Suzuki