Using Stripline Patents (Class 333/116)
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Patent number: 6853268Abstract: A noise filter includes four magnetic layers including upper and lower magnetic layers and intermediate magnetic layers which are laminated to define a laminated unit. Two signal lines are disposed side by side between the intermediate magnetic layers, and two ground electrodes sandwich the intermediate magnetic layers therebetween so as to form a transmission line. A dielectric member is disposed between the two signal lines. With this configuration, a common-mode signal is attenuated by utilizing magnetic loss in the magnetic layers. In contrast, by providing the dielectric member, a normal-mode signal is allowed to propagate by reducing the effective relative magnetic permeability while preventing the occurrence of blunt waves.Type: GrantFiled: August 21, 2003Date of Patent: February 8, 2005Assignee: Murata Manufacturing Co., Ltd.Inventor: Toru Harada
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Patent number: 6847813Abstract: A radio frequency connector that protrudes through a printed circuit board is comprised of threaded leads. A center conductor is shielded when a shielding connector cap, having a threaded inner portion, screws onto the threaded leads.Type: GrantFiled: December 27, 2001Date of Patent: January 25, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Timothy Harold Ashley, Mitchell Johnson
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Patent number: 6838958Abstract: The present invention relates to a rotary signal coupler, that is to say a device for providing signal coupling between two components which are rotatable relative to each other. A coupler is provided comprising a first substantially circular track secured to a first support and a second substantially circular track secured to a second support which is rotatable relative to the first support. The first and second tracks are coaxial with the axis of rotation of the rotatable second support and are adjacent each other so as to provide signal coupling therebetween. The second track has at least two gaps therein which form electrical discontinuities between separated track portions. The separated track portions are electrically connected to one another. Signal coupling with a rotatable support having a relatively large diameter may be thereby improved.Type: GrantFiled: May 10, 2001Date of Patent: January 4, 2005Assignee: Transense Technologies plcInventors: Anthony Lonsdale, Bryan Lonsdale
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Publication number: 20040263281Abstract: A symmetrical or asymmetrical coupler includes first and second conductive lines formed as at least first and second coupled sections and a delay section between the first and second coupled sections. The coupler may include plural alternating delay sections and coupled sections. Delay sections may include delay loops formed in both lines. One line may be a mirror image of the other line.Type: ApplicationFiled: June 25, 2003Publication date: December 30, 2004Inventor: Allen F. Podell
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Publication number: 20040257168Abstract: Conventional stripline implementations of couplers in Multilayer Ceramic Integrated Circuit (MCIC) technology incur a cost disadvantage when compared to an equivalent microstrip implementation. This is primarily due to the increased substrate thickness needed to achieve the required performance. Conventional stripline couplers significantly limit our ability to optimise for smaller substrate thickness and therefore overall cost. However, stripline couplers are needed for stacked integration c scenarios and as building blocks for complex active and passive RF circuits in MCICs. A method of implementation. that overcomes this practical disadvantages is therefore highly desirable. To this end, the present invention presents a novel coupling device structure that enable RF designers to use the stripline coupler configuration, by achieving required levels of performance with much reduced substrate thickness.Type: ApplicationFiled: September 23, 2003Publication date: December 23, 2004Inventors: Sarmad Al-Taei, George Passiopoulos
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Patent number: 6825738Abstract: A microwave directional coupler includes a first transmission line having an input port and an output port, and a second transmission line having a coupled port and a terminated port. The second transmission line is electromagnetically coupled to the first transmission line. A first capacitor is coupled between the input port and a reference potential, such as ground, a second capacitor is coupled between the output port and the reference potential, a third capacitor is coupled between the coupled port and the reference potential, a fourth capacitor is coupled between the terminated port and the reference potential, and a fifth capacitor is coupled between the output port and the terminated port. The microwave directional coupler has a small size in comparison with prior art directional couplers.Type: GrantFiled: December 18, 2002Date of Patent: November 30, 2004Assignee: Analog Devices, Inc.Inventor: Raymond J. Shumovich
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Publication number: 20040233024Abstract: A microwave frequency device includes: a first substrate having a dielectric layer and a conductive film disposed on opposing first and second sides of the dielectric layer, the conductive film on the first side of the dielectric layer of the first substrate including at least one signal line; and a second substrate having a dielectric layer, conductive film disposed on at least one of first and second opposing sides of the dielectric layer, and at least one cut-out where the dielectric layer and conductive film have been removed, wherein the first and second substrates are bonded together to form a bonded assembly such that (i) a portion of the signal line of the first substrate is sandwiched between the dielectric layers of the first and second substrates, and (ii) the at least one cut-out exposes a portion of the signal line, thereby forming a microstrip portion. A method of forming same is also disclosed.Type: ApplicationFiled: May 22, 2003Publication date: November 25, 2004Inventors: Antonio Almeida, Shankar Joshi, Meta Rohde, Mahadevan Sridharan
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Patent number: 6822532Abstract: A suspended stripline device and method for manufacturing thereof. The device includes first and second conductive traces disposed on a dielectric substrate, each of the first and second conductive traces having a first edge and a second edge, and a housing at least partially surrounding the dielectric substrate, wherein the second edge of each of the first and second conductive traces includes at least one outwardly extending protrusion, the size and orientation of which may be selected so as to compensate for unequal even and odd mode propagation velocities through the suspended-stripline device. The device may be packaged by folding solder-coated tabs, provided on the housing, around the dielectric substrate and heating the device such that the solder melts causing the housing to be secured to the substrate.Type: GrantFiled: July 29, 2002Date of Patent: November 23, 2004Assignee: Sage Laboratories, Inc.Inventors: John R. Kane, Richard J. Garabedian
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Patent number: 6822531Abstract: Switchable path length coupler/dividers. Coupler/divider operation over multiple frequency bands is provided by using switchable path lengths. In one implementation, a Wilkinson-style device with switches to select different path lengths and therefore operating frequencies. In a rat-race style device, switches select races of different lengths, and therefore operating frequencies.Type: GrantFiled: July 31, 2002Date of Patent: November 23, 2004Assignee: Agilent Technologies, Inc.Inventor: Brian W. Carlson
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Patent number: 6809610Abstract: A balancing network has three planar lines which are coupled together. One end of the first line which runs between the second and the third line acts as an unbalanced gate. The opposite end of the first line is connected to earth, and one end of each of the other two lines forms a balanced gate. The balancing network is decoupled from the direct current source. The ends of the second and third lines, which do not act as gates, are capacitively coupled with one another.Type: GrantFiled: August 7, 2002Date of Patent: October 26, 2004Assignee: Marconi Communications GmbHInventors: Stefan Kern, Gregor Gerhard
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Publication number: 20040207482Abstract: A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.Type: ApplicationFiled: May 6, 2004Publication date: October 21, 2004Applicant: Merrimac Industries, Inc.Inventors: Joseph McAndrew, Rocco A. De Lillo
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Patent number: 6794954Abstract: A microstrip coupler is provided which includes an controlled capacitance bridge for improved directivity as compared to prior art controlled capacitance bridges. The novel controlled capacitance bridge provides the functionality of prior art wire or ribbon controlled capacitance bridges and also provides the necessary capacitance to compensate for the different phase velocities of odd and even modes in the transmission lines. Both the dimensions of the controlled capacitance bridge and the dimensions of an input microstrip conductor may be adjusted to provide the appropriate level of capacitance. In some embodiments, the controlled capacitance bridge connects segments of an input microstrip conductor. In other embodiments, the controlled capacitance bridge connects microstrip conductors which are configured to couple an input signal from an input microstrip conductor.Type: GrantFiled: January 11, 2002Date of Patent: September 21, 2004Assignee: Power Wave Technologies, Inc.Inventors: Mark Gurvich, Alex Rabinovich, Jianquing He
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Patent number: 6794953Abstract: A hybrid coupler (66, 67; 72, 73) has four ports and is capable of coupling radio frequency signals having a certain frequency from at least one port to at least one other port. The hybrid coupler (66, 67; 72, 73) is implemented as a differential coupler arranged to couple differential radio frequency signals. With such a hybrid coupler a power amplifying circuit can be produced which has sufficiently low ripple on the supply voltage to be integrated together with more sensitive radio circuits, and which is also insensitive to load mismatch such that an isolator can be avoided. A differential hybrid coupler allows the output current to be shared between four transistors or amplifiers, thus reducing the amplitude of the ripple. Further, the frequency of the ripple is four times the operating frequency of the circuit, which makes it much easier to filter out the ripple.Type: GrantFiled: November 28, 2001Date of Patent: September 21, 2004Assignee: Telefonaktiebolaget LM Ericsson (publ)Inventor: Per-Olof Brandt
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Patent number: 6791431Abstract: A balancing/unbalancing (balun) structure for operating at frequency f1 includes a microstrip printed circuit board (PCB). A balun on the PCB includes two input ports are coupled to a differential signal. An isolated port is connected to ground through a matched resistance. An output port is coupled to a single-ended signal corresponding to the differential signal. A plurality of traces on the PCB connect the two input ports, the load connection port and a tap point to the output port. A f2 rejection filter on the PCB is wrapped around the balun and includes a first folded element with a transmission length of &lgr;2/4 and connected to the output port. A second folded element has a transmission length of &lgr;2/4 and connected to the tap point. A third folded element connects the tap point to the output port and has a transmission length of &lgr;2/4.Type: GrantFiled: September 3, 2002Date of Patent: September 14, 2004Assignee: Broadcom CorporationInventor: Franco De Flaviis
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Patent number: 6788163Abstract: The method of networking comprises connecting a first coupler to a first and second transmission line to couple the first and second transmission lines, connecting a second coupler to the second and a third transmission line to couple the second and third transmission lines, connecting a third coupler to the first and third transmission line to couple the first and third transmission lines, connecting a first end of the first transmission line to a first digital device, connecting a first end of the second transmission line to a second digital device, and connecting a first end of the third transmission line to a third digital device. A signal is transmitted through the first, second, or third transmission line, by one of the digital devices, and is received by at least one digital device different from the transmitting digital device.Type: GrantFiled: January 7, 2002Date of Patent: September 7, 2004Assignee: Intel CorporationInventors: John R. Benham, Rajeevan Amirtharajah
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Publication number: 20040160291Abstract: A high power, TEM mode directional microwave coupler having low loss and expanded bandwidth uses novel thick suspended substrate conductors to provide multi-octave bandwidth performance in a practical package. Each of two center conductors is formed using metal layer deposited onto three surfaces of a thick dielectric substrate. The conductors, which can be edge-coupled or offset-coupled, form a novel structure in which the non-metallized side of the substrate is oriented toward the facing outside vertical walls. This effectively reduces the effect of the package wall on the coupling structure, permitting a smaller, constant-width dimension, which in turn raises the waveguide cut-off frequency. The result is a directional coupler with an extended high frequency performance, with reduced physical size and low loss.Type: ApplicationFiled: February 14, 2003Publication date: August 19, 2004Applicant: MICROLAB/FXRInventors: Marek E. Antkowiak, Andrzej Sawicki
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Patent number: 6778037Abstract: The invention relates to structures, by which part of the incoming high-frequency energy can be separated to its own path (out1) or energies coming from different paths can be combined to a common path. The basic idea of the invention is that all components of the dividing or combining means are integrated into a monolithic structure in an insulating material, preferably multilayer ceramics. The transmission line strips (311) and other conductors are formed by printing conductive material on the outer surface of the ceramic piece (301) and in its interlayers, when required. The conductors between the surfaces are formed by filling the hole made through the layer or layers with conductive material. The resistive components (321) parallel with and between the surfaces are formed in a similar manner. The structure according to the invention is relatively small and reliable, and its manufacturing costs are low.Type: GrantFiled: April 2, 2002Date of Patent: August 17, 2004Assignee: Nokia CorporationInventors: Olli Salmela, Esa Kemppinen, Markku Koivisto, Hans Somerma, Pertti Ikäläinen, Petri Savolainen
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Publication number: 20040155726Abstract: A transmission line of striptype includes a dielectric having a local dielectric constant alternating between at least two different values. It can be manufactured by applying a first layer (3) of a material having a first dielectric constant &egr;1 to a base (1), thereupon patterning the first layer to produce recesses, then applying a second layer (5) of a material having a second dielectric constant &egr;2 over the first layer to at least completely fill the recesses to obtain a flat surface, and finally applying a conductor on top of the produces structure. The transmission line can be used for example for various types of filters and delay lines, is simple and has a low cost for its manufacture and can give a space-saving design of different components.Type: ApplicationFiled: January 23, 2004Publication date: August 12, 2004Inventor: Hjalmar Hesselbom
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Patent number: 6774743Abstract: A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.Type: GrantFiled: April 1, 2002Date of Patent: August 10, 2004Assignee: Merrimac Industries, Inc.Inventors: Rocco A. De Lillo, Joseph McAndrew
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Patent number: 6771141Abstract: A directional coupling device includes a main line and a sub line, and line coupling (distributed constant coupling) is effected between the main line and the sub line, each of which has a portion that is arranged substantially parallel to each other and alongside each other. The sub line is longer than the main line. The main line is a substantially straight line or a substantially straight line bending at a predetermined position, i.e., a non-spiraling line, and the sub line is arranged to circle in a spiral manner by bending a substantially straight line at predetermined positions. Thus, a small high-capability directional coupler has excellent isolation properties and directivity, and little insertion loss or deterioration in reflection properties.Type: GrantFiled: October 16, 2002Date of Patent: August 3, 2004Assignee: Murata Manufacturing Co., Ltd.Inventors: Naoki Iida, Masahiko Kawaguchi
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Publication number: 20040145427Abstract: A coupling device defined by an RF circuit board having a cavity formed therein and a plurality of conductive traces and a ground plane, a coupler board having opposites sides and conductive traces, and first and, second metal shields. When assembled, the coupler board is supported by the RF circuit board, and cavities are formed on opposite sides of the coupler board by the first and second metal shields.Type: ApplicationFiled: January 27, 2003Publication date: July 29, 2004Applicant: Andrew CorporationInventors: Robert F. Snyder, Mark A. Hilbert
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Patent number: 6765455Abstract: A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.Type: GrantFiled: November 9, 2000Date of Patent: July 20, 2004Assignee: Merrimac Industries, Inc.Inventors: Rocco A. De Lillo, Joseph McAndrew
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Patent number: 6759922Abstract: The present invention discloses a miniature high directivity multi-band coupled-line coupler for RF power amplifier module application. The coupler utilizes a three-coupled-line structure, with a first RF line designated coupled line for the GSM 900 MHZ band, a second RF line designated coupled line for the DCS/PCS 1800/1900 MHZ band, and a common coupled line. A first capacitor is connected between the center of the first line and the center of the common line and a second capacitor is connected between the center of the second line and the center of the common line. The coupler has a length considerably less than the length of a quarter wave length coupler while achieving directivity requirements for both GSM band and DCS/PCS band.Type: GrantFiled: May 20, 2002Date of Patent: July 6, 2004Assignee: Anadigics, Inc.Inventors: Aharon Adar, Sheldon Xu
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Patent number: 6759923Abstract: A hybrid coupler (10, 90, 110, 130, 160, 210) includes a substrate (12) having a coupling structure formed thereon using thick film processing techniques. The coupling structure includes two parallel conductive strips (21, 31). One strip (21) is coupled at one end to an incident port (22) and at the other end to a direct port (23). The other strip (31) is coupled at one end to a coupled port (32) and at the other end to an isolated port (33). An electrically conductive shield (71, 91, 111, 164) is aligned with and enhances coupling between the conductive strips. A dielectric layer (61, 162) is provided between the shield and the conductive strips.Type: GrantFiled: February 19, 2002Date of Patent: July 6, 2004Assignee: Raytheon CompanyInventors: Gordon R. Scott, Teresa R. Robinson
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Publication number: 20040124946Abstract: The invention relates to a high frequency component of layered structure, and a method for manufacturing the component. The component comprises at least one dielectric layer parallel to the layers of the layered structure, at least two transmission lines for transmitting electrical signals, at least one capacitor, each of which is formed by overlapping parts of two transmission lines, the overlapping parts being for forming capacitive interaction between the parts, and the overlapping parts being arranged to overlap each other in a transversal direction to a dielectric layer parallel to the layers of the layered structure, the dielectric layer being in between the overlapping parts.Type: ApplicationFiled: December 27, 2002Publication date: July 1, 2004Inventor: Ryszard Vogel
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Patent number: 6756860Abstract: Disclosed is a dual band coupler, in which a dielectric layer having a coupling signal line is positioned between dielectric layers having a first main signal line and a second main signal line. Coupling coefficients of first and second signal lines can be independently controlled by laminating different numbers of dielectric layers between the coupling signal line and main signal lines, respectively. A shielding pattern for excluding mutual electromagnetic interference between the first and second main signal lines is formed on the dielectric layer having the coupling signal line to improve an isolation, and a small sized-dual band coupler can be provided because the dielectric layer having a ground pattern can be omitted.Type: GrantFiled: August 6, 2002Date of Patent: June 29, 2004Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Ji Hwan Shin
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Publication number: 20040119559Abstract: A microwave directional coupler includes a first transmission line having an input port and an output port, and a second transmission line having a coupled port and a terminated port. The second transmission line is electromagnetically coupled to the first transmission line. A first capacitor is coupled between the input port and a reference potential, such as ground, a second capacitor is coupled between the output port and the reference potential, a third capacitor is coupled between the coupled port and the reference potential, a fourth capacitor is coupled between the terminated port and the reference potential, and a fifth capacitor is coupled between the output port and the terminated port. The microwave directional coupler has a small size in comparison with prior art directional couplers.Type: ApplicationFiled: December 18, 2002Publication date: June 24, 2004Applicant: Analog Devices, Inc.Inventor: Raymond J. Shumovich
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Patent number: 6753746Abstract: The present invention relates a printed circuit board having jumper lines, and a method for making the printed circuit board. An isolation layer made of a dielectric material is coated on the line layer of the printed circuit board, and multiple pads are formed in the isolation layer, thereby exposing part of the line layer without covered by the isolation layer. A high conductive material is coated on the isolation layer to connect the multiple pads, thereby forming a planar jumper layer that is connected to the line layer through the circular pads. Thus, the planar jumper layer may be made simultaneously during fabrication of the printed circuit board, without having to perform the wire-bonding work.Type: GrantFiled: November 7, 2001Date of Patent: June 22, 2004Assignee: Compeq Manufacturing Co., Ltd.Inventors: Wen-Yen Lin, Wen-Bo Ho
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Publication number: 20040113717Abstract: The present invention proposes a coupling device, comprising a substrate (1), a conductive layer (2) covering a first surface of said substrate (1), at least two electromagnetically coupled lines (3a, 3b) being provided opposite to said first surface and at least one thereof being covered by at least one cover layer (4, 5) wherein at least one capacitor (C1, C2, C3, C4) is connected between a first end of at least one of said at least two lines (3a, 3b) and said conductive layer (2). The at least one capacitor is a buried capacitor grounded in order to equalize unequal phase velocities otherwise degrading the performance of e.g. broadside coupled structures in an inhomogeneous substrate structure such as for example microstrips in a multilayer LTCC. Therefore the present invention enables coupling devices having a high performance and offering in that way the best of all possible design scenarios in terms of wideband performance, size and cost.Type: ApplicationFiled: February 10, 2004Publication date: June 17, 2004Inventors: George Passiopoulos, Sarmad Al-Taei, Mahmoud Zadeh, Kevin Lamacraft, Phil Lane
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Patent number: 6747525Abstract: A small directional coupler includes a main line and a subline having a sufficient self-inductance value and achieving a very small insertion loss. A main-line conductor pattern and a subline conductor pattern are formed on the top surface of an insulating substrate by a method using photolithographic technologies. The main-line conductor pattern and the subline conductor pattern are formed in a spiral shape and so as to extend substantially parallel to each other. In order for the self-inductance value of the main line to be lower than the self-inductance value of the subline, the line width of the subline conductor pattern is narrower than the line width of the main-line conductor pattern. More specifically, it is preferable that the line width of the conductor pattern for a subline be about 50% to about 90% of the line width of the main-line conductor pattern.Type: GrantFiled: February 6, 2002Date of Patent: June 8, 2004Assignee: Murata Manufacturing Co., Ltd.Inventors: Naoki Iida, Masahiko Kawaguchi
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Patent number: 6738611Abstract: It is described an image rejection, sub-harmonic frequency converter, realized in microstrip, particularly adapted to be used in mobile communication equipment, The converter avails of two identical sub-harmonic mixers employing each one or two pairs of diodes in antiparallel, obtained on a same silica substrate, and of a structure of hybrids performing appropriate phase combination adapted to suppress the image band in the converted signal. The mixers include filtering structures preferably consisting, but no limited to the same, of stubs &lgr;/4 long, at the local oscillator frequency, having a free end, in short or open circuit, respectively. According to an alternative embodiment, said stubs are replaced by appropriate filters implemented with concentrated structures (L and C) performing the same transfer function of the stubs in microstrip.Type: GrantFiled: April 25, 2000Date of Patent: May 18, 2004Assignee: Siemens Mobile Communications S.p.AInventor: Marco Politi
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Patent number: 6731244Abstract: A circuit for processing radio frequency signals. The circuit includes a substrate where the circuit can be placed. The substrate can be a meta material and can incorporate at least one dielectric layer (100). A directional coupler (106) and at least one ground (112) can be coupled to the substrate. The dielectric layer can include a first region (102) with a first set of substrate properties and a second region (104) with a second set of substrate properties. The substrate properties can include a permittivity and a permeability. A substantial portion of the directional coupler (106) can be coupled to the second region (104). The permittivity and/or permeability of the second region (104) can be higher than the permittivity and/or permeability of the first region (102). The increased permittivities and/or permeabilities can reduce a size of the directional coupler (106) and effect a change in a variety of electrical characteristics associated with the directional coupler (106).Type: GrantFiled: June 27, 2002Date of Patent: May 4, 2004Assignee: Harris CorporationInventors: William D. Killen, Randy T. Pike
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Patent number: 6727782Abstract: A multilayered LC composite component includes a main body having a pair of side surfaces, a pair of end surfaces, and an upper surface and a lower surface. Ground-side terminal electrodes are disposed at the center of the side surfaces and hot-side terminal electrodes are disposed along edges of the side surfaces. Each of the hot-side terminal electrodes includes an end surface extended portion extending to each of the end surfaces. The end-surface extended portion is arranged so that at least the approximate center of each of the end surfaces is exposed.Type: GrantFiled: July 11, 2002Date of Patent: April 27, 2004Assignee: Murata Manufacturing Co., Ltd.Inventors: Tomohiro Sasaki, Takahiro Azuma, Shigekatsu Yamamoto
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Publication number: 20040046620Abstract: A directional coupler for microwave cavities is used to guide microwave signal power in both directions. The directional coupler contains a first carrier and a second carrier overlapped with each other, a metal line (such as a micro strip line) between the first and second carriers, a signal connector between both ends of the micro strip line, and a metal shell. The first and second carriers and the micro strip line are made using the print board technology. A copper foil is formed on the circuit board surface of the first carrier to form metal lines (such as micro strip lines). The circuit board surfaces of the first and second carriers are coated with a metal shell by electroplating means. A microwave cavity directional coupler with a simple structure and manufacturing process is thus achieved.Type: ApplicationFiled: September 6, 2002Publication date: March 11, 2004Inventors: Wen-Liang Huang, Chih-Chen Chang, Jen-Hui Tsai
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Publication number: 20040041657Abstract: A directional coupler for radio frequency application, comprising: an input (110) for receiving a radio frequency input signal; a port (120) for delivering a radio frequency output signal; a first elongated conductor (150; 150:1), suspended in air between two ground planes, for connecting the input (110) with the port (120); the first conductor (150) comprising a sandwich structure with a first upper conductive strip (150A), a first intermediate layer comprising a dielectric material and a first lower conductive strip (150B); a second elongated conductor (200; 200:1), suspended in air between two ground planes, the second elongated conductor (200:1) comprising a sandwich structure with a second upper conductive strip (200:1A), a second intermediate layer comprising a dielectric material and a second lower conductive strip (200:1B); said first elongated conductor (150; 150:1) and said second elongated conductor (200; 200:1) being substantially parallel; said first upper and lower conductive strips and said secType: ApplicationFiled: September 29, 2003Publication date: March 4, 2004Inventors: Peter Paakkonen, andrzej Plotka, Jurek Dabrowski
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Patent number: 6686812Abstract: A layered directional coupler including conductive traces placed along predetermined axes for making contact with main and auxiliary signal lines. The axes are positioned at predetermined angles relative to each other to maximize the area for making contact thereto, which minimizes the size of the directional coupler. Ground planes are used to minimize parasitic coupling between the traces. The main and auxiliary signal lines are provided by inductively coupled juxtapositioned spiral coils which coupling maximize the characteristics of the coupler.Type: GrantFiled: May 22, 2002Date of Patent: February 3, 2004Assignee: Honeywell International Inc.Inventors: William C. Gilbert, Bogdan M. Izdebski, William H. Brettner, III
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Publication number: 20040017267Abstract: A suspended stripline device and method for manufacturing thereof. The device includes first and second conductive traces disposed on a dielectric substrate, each of the first and second conductive traces having a first edge and a second edge, and a housing at least partially surrounding the dielectric substrate, wherein the second edge of each of the first and second conductive traces includes at least one outwardly extending protrusion, the size and orientation of which may be selected so as to compensate for unequal even and odd mode propagation velocities through the suspended-stripline device. The device may be packaged by folding solder-coated tabs, provided on the housing, around the dielectric substrate and heating the device such that the solder melts causing the housing to be secured to the substrate.Type: ApplicationFiled: July 29, 2002Publication date: January 29, 2004Applicant: Sage Laboratories, Inc.Inventors: John R. Kane, Richard J. Garabedian
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Patent number: 6677832Abstract: An electrical connecting element is disclosed comprised of a dielectric substrate having two conductor paths disposed on opposite sides and being substantially aligned with one another. The electrical connecting element employs differential-mode signaling such that the first conductor path carries a signal of opposite polarity to the second conductor path. A virtual ground exists between the differential + and − lines that permits an otherwise “groundless” differential transmission line. The substantial alignment of the first and second conductor paths improves the space constraints, relative to conventional electrical connecting elements. The characteristic impedance of the disclosed differential transmission line depends on the width of the trace lines the thickness of the dielectric substrate.Type: GrantFiled: October 27, 2000Date of Patent: January 13, 2004Assignee: Lucent Technologies Inc.Inventors: Keith V. Guinn, Louis Thomas Manzione, Ming-Ju Tsai, Hui Wu
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Publication number: 20040000965Abstract: A directional coupler includes a transmission line, and a coupling line, the transmission line being coupled with the coupling line. The transmission line is located at a height position different from that of the coupling line with respect to a reference plane. The transmission line and the coupling line have portions that do not overlap each other.Type: ApplicationFiled: June 18, 2003Publication date: January 1, 2004Applicant: FUJITSU QUANTUM DEVICES LIMITEDInventors: Kunihiro Usami, Toshiaki Moriuchi
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Publication number: 20040000964Abstract: A circuit for processing radio frequency signals. The circuit includes a substrate where the circuit can be placed. The substrate can be a meta material and can incorporate at least one dielectric layer (100). A directional coupler (106) and at least one ground (112) can be coupled to the substrate. The dielectric layer can include a first region (102) with a first set of substrate properties and a second region (104) with a second set of substrate properties. The substrate properties can include a permittivity and a permeability. A substantial portion of the directional coupler (106) can be coupled to the second region (104). The permittivity and/or permeability of the second region (104) can be higher than the permittivity and/or permeability of the first region (102). The increased permittivities and/or permeabilities can reduce a size of the directional coupler (106) and effect a change in a variety of electrical characteristics associated with the directional coupler (106).Type: ApplicationFiled: June 27, 2002Publication date: January 1, 2004Inventors: William D. Killen, Randy T. Pike
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Patent number: 6670856Abstract: In accordance with the invention, coupled transmission lines are fabricated in forms that are tolerant of manufacturing variation or can be readily tuned. In accordance with a first embodiment, the transmission line is formed with alternating overlapping edges for enhanced manufacturing tolerance. In a second embodiment, the line is provided one or more overlapping adjustment regions to permit tuning. A third embodiment has both alternating overlapping edges and one or more tuning regions.Type: GrantFiled: June 6, 2002Date of Patent: December 30, 2003Assignee: Lamina CeramicsInventor: Joseph Mazzochette
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Publication number: 20030227345Abstract: In accordance with the invention, coupled transmission lines are fabricated in forms that are tolerant of manufacturing variation or can be readily tuned. In accordance with a first embodiment, the transmission line is formed with alternating overlapping edges for enhanced manufacturing tolerance. In a second embodiment, the line is provided one or more overlapping adjustment regions to permit tuning. A third embodiment has both alternating overlapping edges and one or more tuning regions.Type: ApplicationFiled: June 6, 2002Publication date: December 11, 2003Inventor: Joseph Mazzochette
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Publication number: 20030218516Abstract: A layered directional coupler including conductive traces placed along predetermined axes for making contact with main and auxiliary signal lines. The axes are positioned at predetermined angles relative to each other to maximize the area for making contact thereto, which minimizes the size of the directional coupler. Ground planes are used to minimize parasitic coupling between the traces. The main and auxiliary signal lines are provided by inductively coupled juxtapositioned spiral coils which coupling maximize the characteristics of the coupler.Type: ApplicationFiled: May 22, 2002Publication date: November 27, 2003Inventors: William C. Gilbert, Bogdan M. Izdebski, William H. Brettner, III
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Patent number: 6642809Abstract: Disclosed herein is a multi-layer chip directional coupler. The multi-layer chip directional coupler has a first ground pattern, a coupling signal line, a main signal line, a second ground pattern, and a plurality of ports. The first ground pattern is formed on the upper surface of a first dielectric layer. The coupling signal line is formed of a conduction pattern on the upper surface of a second dielectric layer. The main signal line is formed of a conduction pattern on the upper surface of a third dielectric layer formed over the second dielectric layer. The second ground pattern formed on the upper surface of a fourth dielectric layer formed over the third dielectric layer. A plurality of ports is formed on the side surfaces of the first to fourth dielectric layers.Type: GrantFiled: December 11, 2001Date of Patent: November 4, 2003Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ji-Hwan Shin, Seung-Gyo Jeong
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Patent number: 6624722Abstract: A microwave coupler has a planar form with a transmission line segment oriented at an angle relative to a main transmission line. The planar form of the transmission line, such as in a printed circuit board, helps reduce the size and manufacturing costs for the coupler. When placed a prescribed distance from the main transmission line and oriented at an appropriate angle, the directivity and coupling factor requirements can be met precisely with minimal tuning. Where fine tuning is required, a tuning screw and resistor disposed adjacent to the transmission line segment are provided.Type: GrantFiled: September 12, 2001Date of Patent: September 23, 2003Assignee: Radio Frequency Systems, Inc.Inventors: Chi Wang, William D. Wilber
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Patent number: 6614325Abstract: A Printed Circuit Board (PCB) (30, 70, 102) and method of manufacturing same. The PCB (30, 70, 102) includes an embedded shielded conductor structure comprising a dielectric layer (42) disposed over a first conductor (40, 80, 84), and a second conductor (38, 78, 82) proximate and coupled to said first conductor (40, 80, 84) being disposed over said dielectric layer (42). The first (40, 80, 84) and second (38, 78, 82) conductors are juxtaposed to form a broadside coupled stripline. A first low noise ground layer (54, 94) is disposed under said first conductor (40, 80, 84), and a second low noise ground layer (52, 92) is disposed over said second conductor (38, 78, 82), these low noise ground layers typically being coupled to chassis ground. RF (32, 72) and digital (34, 74) portions of the PCB (30, 70, 102) are separated and isolated by a vertical ground shield (36, 76). The use of heavy, bulky RF connectors and cables may be eliminated or reduced.Type: GrantFiled: August 31, 2000Date of Patent: September 2, 2003Assignee: Northrop Grumman CorporationInventor: Michael J. Kocin
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Patent number: 6611181Abstract: An electromagnetic (EM) coupler including a first transmission structure having a first geometry, and a second transmission structure having a second geometry and forming an EM coupler with the first transmission structure, the first and second geometries being selected to reduce sensitivity of EM coupling to relative positions of the first and second transmission structures is disclosed.Type: GrantFiled: March 1, 2001Date of Patent: August 26, 2003Assignee: Intel CorporationInventors: Nandu J. Marketkar, John R. Benham, Thomas F. Knight, Jr., Rajeevan Amirtharajah
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Publication number: 20030151477Abstract: The present invention provides a high-frequency module device having a distributed constant circuit formed therein, the device comprising: a base board (2) having a high-frequency element layer forming surface (3) formed by performing flattening processing on an uppermost layer of a multilayer printed wiring part in which a printed wiring layer having a ground part and a dielectric insulating layer made of a dielectric insulating material are formed in a multilayer form on one major surface of a core board (6); and a high-frequency element layer part (5) having a passive element and a circuit element for receiving power or a signal supplied from the base board (2) via a dielectric insulating part made of a dielectric insulating material, on the high-frequency element layer forming surface (3) of the base board (2). The base board (2) has a distributed constant circuit (4) formed by pattern wiring.Type: ApplicationFiled: December 23, 2002Publication date: August 14, 2003Inventors: Takayuki Hirabayashi, Takahiko Kosemura, Akihiko Okubora, Tatsuya Ogino, Kuniyuki Hayashi
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Patent number: 6600386Abstract: A thin-film coupler with a carrier substrate (1) and two strip lines disposed thereon, of which one represents the main coupler loop (2) and one the auxiliary coupler loop (3). The use of inexpensive carrier substrate materials and a compact construction are made possible through an integration of a strip line, a coil, or an LC combination into the auxiliary coupler loop (3). The integration of these components (4) achieves a phase shift in the frequency of the signal coupled out so that a broadband coupler is obtained which exhibits an identical coupling at at least two frequencies.Type: GrantFiled: March 31, 2000Date of Patent: July 29, 2003Assignee: Koninklijke Philips Electronics N.V.Inventors: Hans-Peter Löbl, Rainer Kiewitt, Mareike Klee
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Publication number: 20030132816Abstract: A microstrip coupler is provided which includes an controlled capacitance bridge for improved directivity as compared to prior art controlled capacitance bridges. The novel controlled capacitance bridge provides the functionality of prior art wire or ribbon controlled capacitance bridges and also provides the necessary capacitance to compensate for the different phase velocities of odd and even modes in the transmission lines. Both the dimensions of the controlled capacitance bridge and the dimensions of an input microstrip conductor may be adjusted to provide the appropriate level of capacitance. In some embodiments, the controlled capacitance bridge connects segments of an input microstrip conductor. In other embodiments, the controlled capacitance bridge connects microstrip conductors which are configured to couple an input signal from an input microstrip conductor.Type: ApplicationFiled: January 11, 2002Publication date: July 17, 2003Applicant: PowerwaveInventors: Mark Gurvich, Alex Rabinovich, Jianquing He