Abstract: SAW element has a substrate; an IDT having a first comb-shaped electrode and a second comb-shaped electrode located on an upper surface of the substrate; and a capacitance element located on the upper surface of the substrate. The capacitance element has a first counter electrode connected to the first comb-shaped electrode and a second counter electrode connected to the second comb-shaped electrode and facing the first counter electrode across a third gaps. The direction from the first counter electrode through the third gaps toward the second counter electrode is a reverse direction from the direction from the first comb-shaped electrode through the gaps toward the second comb-shaped electrode.

Abstract: An elastic wave filter device includes a one-port elastic wave resonator and an elastic wave filter unit connected in series to the one-port elastic wave resonator. The one-port elastic wave resonator is connected in parallel to an inductance. In the elastic wave filter device, fr1>f0 is satisfied, where f0 is the center frequency of a passband of the elastic wave filter unit, and fr1 is a resonant frequency of the one-port elastic wave resonator.

Abstract: An RF telemetry receiver circuit for active implantable medical devices. The baseband binary signal (Db) is doubly modulated by a low frequency carrier (Fm) and by a high frequency carrier (Fc). The receiver circuit is a semi-passive non heterodyne circuit, devoid of a local oscillator and mixer. It comprises an antenna (104), a passive bandpass filter (108) centered on the high-frequency carrier (Fc), a passive envelope detector (120-126) and a, digital demodulator (116). The envelope detector comprises a first diode circuit (120) of non-coherent detection, an active bandpass filter (122) centered on a frequency (2.Fm) twice the low frequency carrier and having a bandwidth (2.Db) twice the baseband bandwidth, and a second diode circuit (124) of non-coherent detection, outputting a baseband signal applied to the digital demodulation stage (116).

Abstract: In a duplexer, a common terminal is arranged in a central region of a back surface of a main body of the duplexer, a transmission terminal and a reception terminal are arranged on a virtual line that is parallel or substantially parallel with one side of the back surface of the main body and that passes through the common terminal such that the common terminal is sandwiched between the transmission terminal and the common terminal. By arranging a plurality of the duplexers such that the transmission terminals are aligned and the reception terminals are aligned, the common terminals, the transmission terminals, and the reception terminals provided on the respective duplexers are not spaced apart from one another.

Abstract: An electrical component, e.g., a diplexer or a duplexer, can have one of a number of diverse arrangements for terminal surfaces on the substrate bottom. For example, the terminal surfaces for first and second filters are not disposed at the maximum distance from one another. First and second filters can be disposed as one or two discrete components on the substrate, wherein one filter can be implemented as being integrated in a multilayer substrate.

Abstract: A transceiver module and duplexer within a communication device supports a minimized antenna volume and enhances a transfer gain for transmit and receive channels. The duplexer is communicatively coupled to one of multiple antenna and filter matching configurations which include a first configuration that couples receive and transmit filter matching circuits to a single antenna matching circuit. When the duplexer is coupled to the first configuration, receive and transmit filters of the duplexer are respectively coupled to the receive filter matching circuit and the transmit filter matching circuit. As a result, the antenna matching circuit and the filter matching circuits collectively provide the enhanced transfer gain.

Abstract: An elastic wave filter device includes a transmission elastic wave filter chip and a reception elastic wave filter chip. The transmission elastic wave filter chip includes an insulating support substrate, a piezoelectric layer directly or indirectly supported by the support substrate, and an IDT electrode in contact with the piezoelectric layer. The reception elastic wave filter chip includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate. The thermal conductivity of the support substrate is higher than the thermal conductivity of either of the piezoelectric layer and the piezoelectric substrate.

Abstract: The present disclosure relates to a hybrid transformer duplexer apparatus. The hybrid transformer duplexer apparatus includes an autotransformer having a first port, a second port and a tap coupled to a first antenna port. A step-down transformer has a primary winding with a first terminal coupled to the first port of the autotransformer and a second terminal coupled to the second port of the autotransformer, and a secondary winding having a third terminal coupled to a second antenna port and a fourth terminal coupled to a common node.

Abstract: A duplexer includes: a transmit filter connected between a transmit terminal and an antenna terminal and including series resonators and parallel resonators connected in a ladder form; and a receive filter connected between a receive terminal and the antenna terminal, wherein at least one of resonators, which are resonators other than a first series resonator and a first parallel resonator located at a first stage as viewed from a side of the transmit terminal and a second series resonator and a second parallel resonator located at a first stage as viewed from a side of the antenna terminal and have electrostatic capacitances less than an electrostatic capacitance of at least one of the first series resonator, the first parallel resonator, the second series resonator, and the second parallel resonator in the series resonators and the parallel resonators, is divided in series.

Abstract: An acoustic wave filter includes a piezoelectric substrate, an insulating pattern that has higher thermal conductivity than the piezoelectric substrate formed on the piezoelectric substrate, at least two pads formed on the piezoelectric substrate or the insulating pattern, at least one pad formed on the insulating pattern, at least one acoustic resonator formed on the insulating pattern, and at least one acoustic resonator directly formed on the piezoelectric substrate.

Abstract: A signal separation apparatus includes a piezoelectric substrate on which a transmission filter and a reception filter are provided. The reception filter includes first, second and third longitudinally coupled resonator-type elastic wave filter devices and the first, second and third longitudinally coupled resonator-type elastic wave filter devices each including a two-stage cascade connection structure. The signal separation apparatus further includes virtual ground wiring lines that are not connected to a ground potential and that connect ground terminals of adjacent longitudinally coupled resonator-type elastic wave filter units to each other on at least one of a first, second, and third group-A longitudinally coupled resonator-type elastic wave filter units side and a first, second, and third group-B longitudinally coupled resonator-type elastic wave filter units side.

Abstract: A dual-band surface acoustic wave filter is mounted on a circuit board together with a high-frequency switch, constitutes a composite high-frequency component together with the high-frequency switch, and significantly reduces and prevents deterioration of filter characteristics of the composite high-frequency component. A first input terminal is located on a first corner portion of a second principal surface of a wiring board. A second input terminal is located on the second principal surface of the wiring board and along a first long side or a first short side so as to be next to the first input terminal. First and second output terminals are arranged on an edge portion of the second principal surface of the wiring board on a second long side and along the second long side.

Abstract: A resonator includes: a first comb-shaped electrode including a first bus bar, first electrode fingers coupled to the first bus bar and extending in an extension direction, and first dummy electrode fingers coupled to the first bus bar; and a second comb-shaped electrode including a second bus bar, second electrode fingers coupled to the second bus bar, extending in the extension direction, and facing the first dummy electrode fingers through first gaps, and second dummy electrode fingers coupled to the second bus bar and facing the first electrode fingers through second gaps, wherein 0.5???D where ?D represents a distance in the extension direction between at least two gaps that are at least adjoining two of the first gaps or/and at least adjoining two of the second gaps, and ? represents pitches of the first electrode finger and the second electrode finger.

Abstract: A duplexer includes: an insulation substrate having an upper surface on which a transmission filter and a reception filter are mounted, and a lower surface on which a foot pad layer electrically connected to the transmission filter and the reception filter is formed; a transmission pad provided on the upper surface and electrically connected to the transmission filter; a reception pad provided on the upper surface and electrically connected to the reception filter, a ring-shaped electrode provided on the upper surface and configured to surround the transmission pad and the reception pad; a ground foot pad included in the foot pad layer, and a via interconnection configured to electrically interconnect the ring-shaped electrode and the ground foot pad and to be provided in the ring-shaped electrode in a section along a shorter one of routes that connect the transmission pad and the reception pad to each other along the ring-shaped electrode.

Abstract: A power device comprises an output port and at least one first acoustic pathway and one second acoustic pathway, each acoustic pathway comprising at least one first input acoustic wave transducer connected to an input port, and an output acoustic wave transducer connected to the output port. Each acoustic pathway further comprises a floating acoustic wave transducer connected to a floating port; the input transducer and the output transducer being separated by a distance equal to (2m+1)?/4 with m an integer and ? the propagation wavelength; the input transducer and the floating transducer being separated by a distance equal to (2n+1) ?/2 with n an integer; each output transducer being connected to the output port, said power device being a combiner.

Abstract: An acoustic wave device includes a first longitudinally-coupled acoustic wave filter having interdigital transducer (“IDT”) electrodes arranged in a propagation direction of acoustic wave, and a second longitudinally-coupled acoustic wave filter having IDT electrodes arranged in a propagation direction of acoustic wave. In the IDT electrodes of the first longitudinally-coupled acoustic wave filter, a comb-shaped electrode connected to an input port and another comb-shaped electrode connected to an output port are disposed in an in-phase relation. In the IDT electrodes of the second longitudinally-coupled acoustic wave filter, a comb-shaped electrode connected to an input port and another comb-shaped electrode connected to an output port are disposed in an anti-phase relation. This acoustic wave device has an excellent attenuation characteristic while maintaining a preferable insertion loss.

Abstract: An acoustic wave device includes: a first chip that includes a first substrate, and a first filter formed on a first surface of the first substrate; and a second chip that includes a second substrate, and a second filter formed on a second surface of the second substrate, the second surface being located in a plane different from the first surface.

Abstract: A filter device is provided for filtering signals. The filter device includes multiple series resonators, multiple shunt resonators and multiple cross-coupling circuits. The series resonators are connected in series between an antenna and one of a transmitter or a receiver. The shunt resonators are respectively connected between at least one of the series resonators and a ground voltage. The cross-coupling circuits are configured to bypass at least two series resonators of the multiple series resonators and at least one shunt resonator of the multiple shunt resonators.

Abstract: A Radio Frequency (RF) duplexer including Bulk Acoustic Wave Resonators (BAWRs) and an RF filter including BAWRs are provided. The RF duplexer may convert the received signal into a balance signal and output the balance signal via a dual-output port. The RF duplexer may also include a BAWR receiving filter unit including an input end to receive the balance signal from the dual-output port, and an output end used for dual output. The RF duplexer may also include a BAWR transmitting filter unit to transmit a transmitted signal to the antenna via a single-output port.

Abstract: An elastic wave device includes a resonator and an inductor. One end of the inductor is connected to the resonator, and the other end of the inductor is connected to a ground electrode or a signal electrode. The elastic wave device includes a chip and a mounting substrate. The chip includes a piezoelectric substrate and an interdigital transducer electrode provided on the piezoelectric substrate so define the resonator. The chip is mounted on the mounting substrate. The inductor is provided to the mounting substrate. A dummy electrode to which the one end side of the inductor is connected and the ground electrode or the signal electrode are provided on a surface of the mounting substrate that is opposite to the chip.

Abstract: A filter device includes a piezoelectric substrate, an IDT arranged on a major surface of the piezoelectric substrate to define a surface acoustic wave resonator, a wiring electrode that is electrically connected to the IDT, and an acoustic member located on a major surface of the piezoelectric substrate near or adjacent to the IDT and that has an acoustic impedance different from that of the piezoelectric substrate. The wiring electrode that is to be disposed in the vicinity of the IDT is located on the acoustic member.

Abstract: A surface acoustic wave device includes a piezoelectric substrate including an interdigital transducer located on one principal surface thereof, an insulating layer arranged around the interdigital transducer, a cover layer arranged over the insulating layer and the interdigital transducer, and a columnar electrode penetrating through the insulating layer and the cover layer, and connected to the interdigital transducer through a connection wiring, wherein a buffer layer is arranged on the other principal surface of the piezoelectric substrate.

Abstract: The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC.

Abstract: A circuit module includes a duplexer and a circuit substrate. A first signal path connects a first external electrode to a second external electrode. A second signal path connects a third external electrode to a fourth external electrode. A third signal path connects a fifth external electrode to a sixth external electrode. A first ground path connects a seventh external electrode to an eighth external electrode. A second ground path is connected to a ninth external electrode and is capacitively coupled to the second signal path.

Abstract: In a filter module having excellent phase balance characteristics, a length of a signal path between a first balanced mount electrode and a first balanced terminal electrode is different from a length of a signal path between a second balanced mount electrode and a second balanced terminal electrode. When viewing a mount board from a side on which a filter component is mounted, an area along which the first balanced mount electrode and a first internal ground electrode oppose each other is different from an area along which the second balanced mount electrode and the first internal ground electrode oppose each other.

Abstract: The filter includes one or more series resonators and one or more parallel resonators. An inductance is connected in series to at least a parallel resonator of the parallel resonators, and a antiresonance frequency of the parallel resonator to which the inductance is connected in series is equal to or higher than that of the series resonators. The duplexer, the communication module and the communication device are provided with the filter.

Abstract: A production method of an electronic component includes: forming a sheet having a resin layer and a metal layer formed under the resin layer; bonding the sheet to a substrate so that the metal layer is arranged on a functional portion of an acoustic wave element formed on the substrate, a frame portion surrounding the functional portion is formed between the metal layer and the substrate, a cavity is formed on the functional portion by the metal layer and the frame portion, and the resin layer covers the metal layer and the frame portion.

Abstract: The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC.

Abstract: Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via-hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.

Abstract: A duplexer includes a transmit filter and an integrated receive filter configured to filter a receive signal from an antenna. The integrated receive filter includes a receive filter portion having multiple acoustic resonator filter elements and a matched balun configured to convert a single-ended input signal, received at a single-ended input of the matched balun from a single-ended output of the receive filter portion, to a differential output signal. The matched balun being is located in place of a phase matching inductor of the receive filter portion, eliminating need for the phase matching inductor of the receive filter portion and a phase matching inductor of the matched balun. Impedance at the single-ended input of the matched balun includes a complex conjugate of impedance at the single-ended output of the receive filter portion.

Abstract: Assigning multiple functions to a PA and simplifying wiring and circuits are achieved without using switches in a transmission-and-reception system using a high-frequency filter that supports multiple bands. Provided is a high-frequency filter including: first and second transmission filters; first and second reception filters; and a matching circuit connected to input sides of the first and second transmission filters. Transmission signals are inputted to the first and second transmission filters via the matching circuit. A resonator forming the matching circuit is serially connected to an input side of, among the first and second transmission filters, a filter whose passband is a higher frequency band.

Abstract: In a ladder-type elastic wave filter, a resonance frequency of a second parallel resonator is higher than that of a series resonator and lower than an antiresonance frequency of a series resonator. With this configuration, an attenuation pole is formed by the second parallel resonator at a frequency region lower than an attenuation pole formed by the series resonator in a frequency region higher than the passband of the ladder-type elastic wave filter.

Abstract: An elastic wave splitter includes an antenna terminal, a transmission terminal and reception terminals. A transmission filter is connected between the antenna terminal and the transmission terminal. A reception filter is connected between the antenna terminal and the reception terminals. The transmission filter and the reception filter are each defined by an elastic wave filter. A resonant circuit is connected between the antenna terminal and a ground potential. The resonant circuit includes a surface acoustic wave resonator and a capacitor connected in series with the surface acoustic wave resonator. A resonant frequency of the resonant circuit is positioned in a frequency band of an interference wave that causes intermodulation distortion to be generated.

Abstract: A high-frequency module includes a multilayer substrate, a switch IC, a SAW duplexer and a matching circuit. The matching circuit includes a wiring line and first and second inner layer ground electrodes. The matching circuit performs impedance matching between the switch IC and the SAW duplexer in a pass band of the SAW duplexer. The wiring line is an inner layer electrode of the multilayer substrate that is connected between the switch IC and the SAW duplexer. The first and second inner layer ground electrodes face the wiring line in a stacking direction with only dielectric layers of the multilayer substrate therebetween.

Abstract: A module substrate includes: a multilayered wiring substrate that includes wiring layers; and embedded duplexers that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers, wherein the embedded duplexers include duplexers supporting at least two bands of Band1, Band2, Band5, and Band8.

Abstract: A piezoelectric thin film resonator includes: a substrate; a piezoelectric film located on the substrate; a lower electrode and an upper electrode facing each other across at least a part of the piezoelectric film; and an insertion film that is inserted into the piezoelectric film, is located in at least a part of an outer periphery region in a resonance region in which the lower electrode and the upper electrode face each other across the piezoelectric film, and is not located in a center region of the resonance region.

Abstract: A branching filter includes a ladder-type elastic wave filter unit connected between an antenna terminal and a transmission signal terminal and a longitudinally coupled resonator-type elastic wave filter unit connected between an antenna terminal and first and second balanced reception signal terminals while maintaining the isolation characteristics between the transmission signal terminal and the first and second reception signal terminals. In a duplexer, a transmission signal propagation direction is perpendicular or substantially perpendicular to each of a first reception signal propagation direction and a second reception signal propagation direction.

Abstract: A surface acoustic wave filter and a duplexer are provided. In a surface acoustic wave filter, on a piezoelectric substrate, a first IDT electrode composed of an input/output electrode and a first floating electrode, and a second IDT electrode composed of a ground electrode and a second floating electrode are arranged, and are connected in series to each other via the first floating electrode and the second floating electrode to form IDTs. In two serial IDTs arranged next to each other, an electrode finger of the input/output electrode in the first IDT electrode of one serial IDT is arranged next to an electrode finger of the ground electrode in the second IDT electrode of the other serial IDT.

Abstract: The present application describes a radio frequency band reject filter including an input port, an output port, a plurality of acoustic resonators and an inductor for matching the impedance of the plurality of acoustic resonators. The inductor is positioned within the band reject filter in respect of the plurality of acoustic resonators such that a static capacitance between the input port and the inductor is substantially equivalent to a static capacitance between the output port and the inductor. The plurality of acoustic resonators may be a plurality of parallel resonators, a plurality of series resonators or a combination of series and parallel resonators. The radio frequency band reject filter is fabricated using any of surface acoustic wave (SAW) technology, thin film bulk acoustic resonator (FBAR) technology, and bulk acoustic wave (BAW) technology.

Abstract: An elastic-wave filter device includes a reception filter section including a longitudinally coupled resonator-type elastic-wave filter section that has a balanced-to-unbalanced conversion function and has improved common-mode isolation characteristics. Among IDT electrodes of a filter section, each of the other comb-shaped electrode of a first IDT electrode including a pair of comb-shaped electrodes, one of which is connected to a first balanced-signal terminal, and the other comb-shaped electrode of a second IDT electrode including a pair of comb-shaped electrodes, one of which is connected to a second balanced-signal terminal, is connected to one of ground electrodes that are provided on a piezoelectric substrate. Inductors are provided on the piezoelectric substrate, and each inductor is connected between the other comb-shaped electrode of one of the first and second IDT electrodes and one of the ground electrodes.

Abstract: An elastic wave device includes elastic wave filters connected in parallel between an input and an output, and has reduced size and insertion loss, and improved electric power handling capability. An elastic wave filter chip is mounted on a die-attach surface of a wiring board and includes an input signal terminal and output signal terminals. At least one of the input and output signal terminals includes a plurality of signal terminals. A common connection wiring line to commonly connect the plurality of signal terminals of the elastic wave filter chip is provided in the wiring board.

Abstract: An acoustic wave device includes a piezoelectric substrate, a comb-shaped electrode formed on the piezoelectric substrate and configured to excite a Rayleigh wave as a main acoustic wave, a first dielectric film formed above the piezoelectric substrate to cover the comb-shaped electrode, and a second dielectric film having a portion provided between electrode fingers of the comb-shaped electrode and a portion provided above the comb-shaped electrode. The portion provided between the electrode fingers is provided between the piezoelectric substrate and the first dielectric film. The portion provided above the comb-shaped electrode is provided between the comb-shaped electrode and the first dielectric film. A speed of a transverse wave propagating through the first dielectric film is lower than a speed of the Rayleigh wave excited by the comb-shaped electrode.

Abstract: The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC.

Abstract: In an elastic wave device, a first piezoelectric substrate and a second piezoelectric substrate are joined to each other with a joining portion so as to face each other across a cavity. A first set of a plurality of filters located on a facing surface of the first piezoelectric substrate and a second set of a plurality of filters located on a facing surface of the second piezoelectric substrate define a plurality of pairs of filters and face each other across the cavity. An absolute value of a difference between center frequencies of a filter of the first set of filters and a filter of the second set of filters in each pair of filters is larger than a minimum value among absolute values of differences between center frequencies of pairs of filters selected from a group including the first set of filters and the second set of filters.

Abstract: A filter arrangement for filtering a radio transmit signal and radio receive signal, comprising a first duplex filter and a second duplex filter, a signal divider for splitting a transmit input signal into a first transmitter signal portion and a second transmitter signal portion, the first transmitter signal portion being passed to the a transmit port of the first duplex-filter, and a second signal portion being passed to the second transmitter port of the second duplex filter. The filter arrangement further comprising a signal combiner/divider for combining a first filtered transmit portion signal and a second filtered transmit portion signal into a single filtered transmit signal. The filter arrangement further comprising a signal combiner for combining a first filtered receive signal portion and a second filtered receive signal portion into a single filtered receive signal, which is provided at a third output of the signal combiner.

Abstract: An antenna sharer with both low loss and sharp attenuation characteristic in a wide band is achieved. Antennal sharer 1 of the present invention includes first filter 3 for passing a signal in the first frequency band, and second filter 4 for passing a signal in the second frequency band higher than the first frequency band. First filter 3 includes a ladder filter that includes first series resonator 6 and second series resonator 7 with an antiresonant frequency point higher than antiresonant frequency of first series resonator. Electromechanical coupling coefficient of first series resonator 6 is smaller than electromechanical coupling coefficient of second series resonator 7.

Abstract: A circuit module includes a duplexer mounted on a module board and a cover layer is stacked on an insulating layer that is disposed on one principal surface of a device board so as to enclose a predetermined area thereof. A transmission filter device and a reception filter device that have different transmission bands are provided on the one principal surface of the device board in the predetermined area thereof within the space enclosed by the insulating layer between the device board and the cover layer. Accordingly, the duplexer does not include a package board as in the existing technique, and in turn a circuit module including the duplexer mounted on the module board is significantly reduced in height and in size.

Abstract: According to an aspect of the invention, each of a filter, a duplexer and a communication module includes a plurality of series resonators connected to a signal line in series and a plurality of parallel resonators connected to the signal line in parallel. At least two of the plurality of parallel resonators are connected to the signal line between two of the plurality of series resonators in parallel, inductors are respectively connected to the at least two parallel resonators, and the inductors have different inductances from each other.

Abstract: Provided is a duplexer that can maintain isolation characteristics while being able to independently adjust the input/output ground inductances and the common ground inductance of the double-mode filter.

Abstract: A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.