Abstract: The antenna sharing device has a first elastic-wave filter for passing signals of a first frequency passband and a second elastic-wave filter for passing signals of a second frequency passband higher than the first frequency passband. The first elastic-wave filter is a ladder-type filter including a first series resonator and a second series resonator having an antiresonant frequency point higher than that of the first series resonator. The first series resonator has a first IDT electrode and a first dielectric film covering the electrode. The second series resonator has a second IDT electrode and a second dielectric film covering the electrode. The first and the second dielectric films have a first projection and a second projection, respectively, so as to be formed above the electrode fingers of each IDT electrode.

Abstract: An acoustic wave resonator includes a piezoelectric body, an IDT electrode for exciting an acoustic wave with wavelength ?, and a dielectric thin film provided so as to cover the IDT electrode. The IDT electrode includes a bus bar electrode region, a dummy electrode region, and an IDT cross region in order from outside. The film thickness of the dielectric thin film above at least one of the bus bar electrode region and the dummy electrode region is smaller than that above the IDT cross region by 0.1? to 0.25?. This configuration provides an acoustic wave resonator that reduces transverse-mode spurious emission.

Abstract: A high-frequency switch module includes a first switching element and a second switching element. A common terminal of the first switching element is connected to an antenna. A common input terminal of the second switching element is connected to a multi-band power amplifier. A second individual output terminal of the second switching element is connected to a fourth individual terminal of the first switching element via a first low-pass filter, and is connected to a third individual terminal of the first switching element via a series circuit including a second low-pass filter and a high-pass filter. A first individual output terminal of the second switching element is connected to a first individual terminal of the first switching element via a phase-shift circuit and a first SAW duplexer, and is connected to a second individual terminal of the first switching element via the phase-shift circuit and a second SAW duplexer.

Abstract: A method of designing an acoustic microwave filter comprises selecting a filter section based on frequency response requirements. The filter section includes an input, an output, and a plurality of circuit elements. The circuit elements have at least in-line acoustic resonators or in-shunt acoustic resonators. The method further comprises selecting a value for each circuit element, selecting a number of filter sections, and cascading the selected number of filter sections to create a cascaded filter circuit design, such that at least one pair of immediately adjacent filter sections are connected to each other via their inputs or their outputs. The method further comprises adding parasitic effects to the cascaded filter circuit design to create a pre-optimized filter circuit design, optimizing the pre-optimized filter circuit design to create a final filter circuit design, and constructing the acoustic microwave filter based on the final filter circuit design.

Abstract: A guided acoustic wave resonant device is provided. The device comprises at least two filters (F1, . . . , Fi, . . . , FN), each filter comprising at least two acoustic wave resonators (R11-R12, . . . , Ri1-Ri2, . . . , RN1-RN2), each filter having a useful frequency band (BF1, . . . , BFi, . . . , BFN) centered on a central frequency (f1, . . . , fi, . . . , fN), each resonator comprising at least one suite of inter-digitated upper electrodes exhibiting a periodic structure of period (?ij) and a layer of piezoelectric material, each resonator having a coupling coefficient (k21, k22, . . . , k2n) and a resonant frequency (fr1, . . . , fr2, . . .

Abstract: A high-frequency module includes a multilayer body including stacked dielectric and a pair of ground electrodes spaced apart from each other; a common terminal arranged in the multilayer body to receive and transmit communication signals; and a duplexer that is mounted on a surface of the multilayer body and that separates communication signals input and output via the common terminal. The duplexer includes a first SAW filter mounted on the surface of the multilayer body and grounded by the ground electrode and a second SAW filter mounted on the surface of the multilayer body so as to be spaced apart from the first SAW filter and is grounded by the ground electrode. Thus, degradation of isolation characteristics of the transmission and reception terminals of a splitter is prevented.

Abstract: A single-chip duplexer, interfacing a receiver and a transmitter with a common antenna, includes transmit and receive filters, an annular sealing ring and a conductive stripe. The transmit filter is connected between the antenna and the transmitter, and has a transmit passband. The receive filter is connected between the antenna and the receiver, and has a receive passband different from the transmit passband. The annular sealing ring is connected between a surface of the chip and a surface of a cap to form a sealed cavity between the chip and the cap. The conductive stripe extends across at least a portion of the surface of the chip between the transmit filter and the receive filter, the conductive stripe being directly connected to the sealing ring and electrically connected to ground. The conductive stripe provides at least one of magnetic shielding and capacitive shielding between the transmit filter and the receive filter.

Abstract: The present disclosure relates to a passive multi-band duplexer having a first bandpass filter and a second bandpass filter. The first bandpass filter includes a first group of sub-band bandpass filters, a first switching circuit, and a first tunable LC bandpass filter. Similarly, the second bandpass filter includes a second group of sub-band bandpass filters, a second switching circuit, and a second tunable LC bandpass filter. A first band of the passive multi-band duplexer, such as a transmit band, is chosen by selecting one of the first group of sub-band bandpass filters and tuning the first tunable LC bandpass filter to the first band. Similarly, a second band of the passive multi-band duplexer, such as a receive band, is chosen by selecting one of the second group of sub-band bandpass filters and tuning the second tunable LC bandpass filter to the second band.

Abstract: A switching circuit is provided. The switching circuit includes at least one Surface Acoustic Wave (SAW) filter, a Single-Pole n Throw (SPnT) switch connected to an input port of each of the at least one SAW filter, and a Dual-Pole n Throw (DPnT) switch connected to an output port of each of the at least one SAW filter.

Abstract: A multi-mode bandpass filter is described. The bandpass filter includes a first multi-directional vibrating microelectromechanical systems resonator. The bandpass filter also includes a second multi-directional vibrating microelectromechanical systems resonator. The first multi-directional vibrating microelectromechanical systems resonator is in a parallel configuration. The second multi-directional vibrating microelectromechanical systems resonator is in a series configuration.

Abstract: An IDT electrode defining any one of a plurality of surface acoustic wave resonators defining series arm resonators and parallel arm resonators, except for the IDT electrode having a smallest amount of heat generation per unit time when a signal flows between first and second signal terminals, does not face wiring electrodes.

Abstract: An acoustic wave filter includes: at least a parallel resonator, wherein at least one of the parallel resonator includes a piezoelectric substance, an IDT located on the piezoelectric substance, and reflectors located on the piezoelectric substance so as to sandwich the IDT, and a distance between a first electrode finger that is an electrode finger closest to the reflector among electrode fingers of the IDT and a second electrode finger that is an electrode finger closest to the IDT among electrode fingers of the reflector is less than 0.25(?IDT+?ref) where a period of the electrode fingers of the IDT is ?IDT and a period of the electrode fingers of the reflector is ?ref.

Abstract: A duplexer comprising an improved matching circuit for matching between transmitting path and receiving path is specified. In this case, the matching circuit comprises a hybrid and matching elements.

Abstract: According to an aspect of the invention, each of a filter, a duplexer and a communication module includes a plurality of series resonators connected to a signal line in series and a plurality of parallel resonators connected to the signal line in parallel. At least two of the plurality of parallel resonators are connected to the signal line between two of the plurality of series resonators in parallel, inductors are respectively connected to the at least two parallel resonators, and the inductors have different inductances from each other.

Abstract: A Bulk Acoustic Wave Resonator (BAWR), a method of manufacturing of the BAWR, and duplexer including the BAWR are provided. The BAWR may include a first substrate including a via hole formed in a predetermined area of a bottom surface of the first substrate. A first air cavity may be formed above the first substrate, and a first lamination resonating portion may be laminated above the first air cavity in sequence of a lower electrode, a piezoelectric layer, and an upper electrode. A second air cavity may be formed above the first substrate, and a second lamination resonating portion may be laminated above the second air cavity in sequence of the lower electrode, the piezoelectric layer, and the upper electrode. The first lamination resonating portion and the second lamination resonating portion may be connected via either the lower electrode or the upper electrode.

Abstract: A duplexer includes: a transmission filter connected between a common terminal and a transmission terminal; and a reception filter connected between the common terminal and a reception terminal, wherein the reception filter includes resonators located on a piezoelectric substrate, at least one resonator of the resonators is grounded, and a resonator located at a side closest to the common terminal out of the grounded resonator is a divided resonator that is divided into two or more, and a resonance frequency fr of the divided resonator is in a range of fr=2×(fTL to fTH)?(fRL to fRH) when a pass frequency of the transmission filter is fTL to fTH and a pass frequency of the reception filter is fRL to fRH.

Abstract: An antenna duplexer includes a transmission filter and a reception filter both coupled with an antenna terminal. The transmission filter has a lower pass band than the reception filter. The transmission filter includes a first series resonator coupled with a first terminal, a second series resonator connected to the first series resonator at a first node, a first parallel resonator connected to a first port of the first series resonator, a second parallel resonator connected to a first node and the first parallel resonator at a second node, a third parallel resonator connected to the first node, a fourth parallel resonator connected to the third parallel resonator at a third node, a first inductance element coupled with the second node and a ground, and a second inductance element coupled with the third node and the ground. The second inductance element has a lower inductance than the first inductance element.

Abstract: The invention relates to a filter arrangement (10) comprising a substrate (16) having a first series resonator (11) and a first and a second parallel resonator (12, 13). The filter arrangement (10) further comprises a carrier (18), on which the substrate (16) is arranged and which comprises a first inductor (17), the first connection of which is coupled to a first connection of the first series resonator (11) by means of the first parallel resonator (12) and to a second connection of the first series resonator (11) by means of the second parallel resonator (13).

Abstract: A filter module includes: reception filters connected between an antenna terminal and a reception terminal; and a module substrate, wherein a first reception filter that is at least one reception filter of the reception filters is embedded in the module substrate, and a second reception filter that is at least another one reception filter is mounted on a surface of the module substrate so as to overlap the first reception filter.

Abstract: A filter includes: a filter circuit connected between a first terminal and a second terminal; and a matching circuit connected between the filter circuit and the second terminal, wherein an impedance viewed from the second terminal toward the matching circuit is less than an impedance viewed from a node between the filter circuit and the matching circuit toward the filter circuit.

Abstract: A filter includes: acoustic wave resonators connected between an input terminal and an output terminal; and a cancel circuit including an input connection portion and an output connection portion connected so that the cancel circuit is connected in parallel to at least a part of the acoustic wave resonators, wherein the cancel circuit includes a first acoustic wave resonator connected between a node between the input connection portion and the output connection portion and a ground.

Abstract: At least one duplexer includes first and second balanced terminals. A mount electrode layer includes a first balanced mount electrode, which is connected to the first balanced terminal, and a second balanced mount electrode, which is connected to the second balanced terminal. An internal electrode layer includes at least one internal ground electrode. When viewing a mount board from a side on which the duplexer is mounted, the first and second balanced mount electrodes do not oppose the same internal ground electrode.

Abstract: In a substrate that improves isolation characteristics of a high-frequency-side signal path and a low-frequency-side signal path, a duplexer, and a substrate module, a package substrate includes two SAW filters mounted thereon and defines a portion of the duplexer. A substrate body includes main surfaces that oppose each other. Land electrodes are provided on one of the main surfaces and are used to connect either of the two SAW filters. Land electrodes are provided on one of the main surfaces and are used to connect a mounting substrate on which the duplexer is mounted and are respectively superposed with the land electrodes when viewed in plan from a z-axis direction. The land electrodes and the land electrodes, which are superposed with each other when viewed in plan from the z-axis direction, are electrically connected to each other.

Abstract: In a filter module having excellent phase balance characteristics, a length of a signal path between a first balanced mount electrode and a first balanced terminal electrode is different from a length of a signal path between a second balanced mount electrode and a second balanced terminal electrode. When viewing a mount board from a side on which a filter component is mounted, an area along which the first balanced mount electrode and a first internal ground electrode oppose each other is different from an area along which the second balanced mount electrode and the first internal ground electrode oppose each other.

Abstract: A composite electronic component includes: a circuit board; a package that includes an acoustic wave filter and is located on a top surface of the circuit board; a dummy package that is located on the top surface of the circuit board; and a lid that is located above the package and the dummy package.

Abstract: A branching filter has a group of terminals including an antenna terminal, a transmission signal terminal, reception signal terminals and, and a ground terminal; a transmitting filter located between the antenna terminal and the transmission signal terminal; a second filter located between the antenna terminal and the reception signal terminals and; a first connection line connecting the parallel resonators and the ground terminal; a second connection line connecting the receiving filter and the ground terminal; and a third connection line which connects the first connection line and the second connection line and which is electromagnetically coupled with at least one of the resonators and lines configuring the transmitting filter.

Abstract: The branching filter has the piezoelectric substrate having the main surface on which there are formed a transmission filter, which includes an input electrode and an antenna electrode, and a reception filter, which includes an output electrodes and the antenna electrode. The branching filter also has the mounting substrate having, on a first main surface, a first electrode group that is connected to the transmission filter and reception filter and that is formed symmetrical with respect to a line when viewed from the above, and also having, on a second main surface locating on the opposite side to the first main surface, a second electrode group that is connected to the circuit interconnects of an external circuit board and that is formed symmetrical with respect to a line when viewed from the above.

Abstract: A surface acoustic wave filter device uses a Rayleigh wave as a main mode, and includes a ladder type surface acoustic wave filter unit. A thickness of a dielectric layer in a surface acoustic wave resonator configuring a series arm resonator is different from thickness of a dielectric layer in a surface acoustic wave resonator configuring a parallel arm resonator. A propagation orientation of a surface acoustic wave in the surface acoustic wave resonator configuring the series arm resonator is different from a propagation orientation of a surface acoustic wave in the surface acoustic wave resonator configuring the parallel arm resonator.

Abstract: A filter includes a first signal line connected to one input-side unbalanced signal terminal, a second signal line connected to another output-side unbalanced signal terminal, a shunt circuit for providing connection between the first and second signal lines in parallel with a surface acoustic wave device, a first capacitor disposed in the first signal line so as to be in series with respect to the surface acoustic wave device, a first inductor disposed in the shunt circuit at a side of the first signal line, and a series resonance circuit having a second capacitor and a second inductor disposed in the shunt circuit at a side of the second signal line.

Abstract: A device includes a plurality of electrode actuated acoustic resonators coupled to form complementary paths to operate as a filter. Each acoustic resonator has an electrical input and an electrical output that contributes to a static capacitance. A compensation impedance is coupled to at least one of the paths to reduce adverse effects from the static capacitances of the acoustic resonators.

Abstract: An acoustic wave device includes a piezoelectric substrate, an IDT electrode provided on the piezoelectric substrate, a dielectric layer provided so as to cover the IDT electrode, and a first stress relaxation layer provided on the dielectric layer. Furthermore, the acoustic wave device includes an extraction electrode connected to the IDT electrode and extracted onto the first stress relaxation layer, and a bump provided on the extraction electrode. An elastic modulus of the first stress relaxation layer is smaller than that of the dielectric layer.

Abstract: A transmitting/receiving filter (filter device) according to one embodiment of the present invention is provided with a transmitting filter, a receiving filter, and a support substrate. The transmitting filter includes a first resonator constituted of a BAW device (FBAR, SMR). The receiving filter includes a second resonator constituted of a Lamb wave device. The support substrate supports both the transmitting filter and the receiving filter. The transmitting filter and the receiving filter are constituted of elastic wave resonators that resonate at different oscillation modes from each other, which allows miniaturization of the support substrate to be realized while preventing oscillation interference between the two filters.

Abstract: In a high-frequency module, a duplexer element and a matching element are mounted on a surface of a multilayer substrate. On a layer close to the surface, an individual-terminal-side wiring electrode connected to an individual terminal of the duplexer element is provided. On two layers below the layer close to the surface, first and second ground electrodes are respectively provided. On a layer below the layers on which the first and second ground electrodes are provided, a common-terminal-side wiring electrode connected to the common terminal of the duplexer element and one end of the matching element is provided. On a layer close to a bottom surface of the multilayer substrate, a third ground electrode connected to the other end of the matching element is provided.

Abstract: A filter includes at least one series resonator and parallel resonators, the at least one series resonator and the parallel resonators including excitation electrodes and reflectors, the parallel resonators having different resonance frequencies, and at least one of the parallel resonators other than the parallel resonator having the highest resonance frequency being configured to have a pitch of reflectors that is smaller than that of excitation electrodes.

Abstract: Disclosed embodiments include a surface acoustic wave device having electrode period, electrode width, and/or ratio of electrode width to electrode period varied in a prescribed manner.

Abstract: An acoustic wave filter having reduced non-linearities as well as a production method are disclosed. A filter comprises a first electroacoustic transducer having a first metallization ratio and a second electroacoustic transducer having a second metallization ratio. The metallization ratios range from 0.2 to 0.8, and the metallization ratio of the first transducer is no more than 0.8 times the metallization ratio of the second transducer.

Abstract: A filter and a transceiver in a radio frequency (RF) band, using a bulk acoustic wave resonator (BAWR), are provided. The RF filter includes at least one low temperature coefficient of frequency (TCF) BAWR. The RF filter further includes at least one high quality factor (Q) BAWR including a high Q compared to the at least one low TCF BAWR, the at least one low TCF BAWR including a low TCF compared to the at least one high Q BAWR.

Abstract: Provided is a high-frequency circuit module that has high mounting density. In a high-frequency circuit module 100, an RFIC 160 that performs transmission and reception processes for high-frequency signals, a power amplifier IC 155 that amplifies a transmission signal from the RFIC, and a duplexer 110 that separates a transmission signal outputted from the power amplifier IC 155 to an antenna and a reception signal that is inputted from the antenna to the RFIC 160 are formed on the top surface thereof. The duplexer 110 is disposed between the RFIC 160 and the power amplifier IC 155.

Abstract: A transmission elastic wave filter element and a reception elastic wave filter element each flip-chip mounted to a principal surface of a substrate are sealed off by a sealing member. The sealing member includes a base portion in contact with the principal surface of the substrate and made of a first dielectric material, and a lower dielectric-constant portion made of a second dielectric material having a dielectric constant lower than that of the first dielectric material and arranged in at least one of a region of the sealing member that faces the transmission elastic wave filter element on a side opposite from the substrate with respect to the transmission elastic wave filter element, and a region of the sealing member that faces the reception elastic wave filter element on the side opposite from the substrate with respect to the reception elastic wave filter element.

Abstract: A resonator according to the present invention includes a supporting substrate, a piezoelectric layer, a pair of excitation electrodes, and a bonding layer. The piezoelectric layer is made of a piezoelectric material. The pair of excitation electrodes is formed on the upper surface of the piezoelectric layer so as to excite bulk acoustic waves. The bonding layer has a cavity formed therein so as to face the excitation electrode pair through the piezoelectric layer, and the bonding layer bonds the supporting substrate to the lower surface of the piezoelectric layer.

Abstract: A circuit arrangement includes an antenna port, a transmission port, and a reception port, each of which is connected to one respective 20° hybrid that splits an input signal into two output signals that are in quadrature. The circuit arrangement also includes two duplexers which are connected in such a way that the two output signals emitted by the 20° hybrid that is connected to the transmission port constructively interfere on the antenna port, while spurious signals caused by the two output signals destructively interfere on the reception port.

Abstract: A small antenna duplexer that includes antenna terminal, first filter electrically connected to this antenna terminal and passing a first frequency band, second filter electrically connected to antenna terminal and passing a second frequency band, and third filter electrically connected to antenna terminal and passing a third frequency band. First filter and third filter are used for one band, and second filter and third filter are used for another band.

Abstract: An elastic wave filter device includes a ladder filter unit, a first inductor, a second inductor, and a capacitor. The ladder filter unit includes at least three parallel arms including a first parallel arm. The first inductor is connected between the first parallel arm and a ground potential. The second inductor is connected between at least two of the parallel arms, other than the first parallel arm among the at least three parallel arms, and the ground potential. The capacitor is connected between a connection point of the first parallel arm and the first inductor and a connection point of the second inductor and the at least two parallel arms.

Abstract: Embodiments of the present invention provide systems, devices and methods for improving both the bandwidth of a BAW resonator bandpass filter and the suppression of out-of-band frequencies above the passband. In various embodiments of the invention, blocker inductors are located in series between the filter input and the filter output to realize both bandwidth enhancement and improved out-of-band frequency rejection. For example, a first blocker inductor may be located at the input and a second blocker inductor may be located at the output of a BAW resonator bandpass filter.

Abstract: In an elastic wave duplexer, a reception elastic wave filter element and a transmission elastic wave filter element are flip-chip mounted to a principal surface of a substrate. A sealing member is disposed on the principal surface of the substrate to cover and seal off at least one of the reception elastic wave filter element and the transmission elastic wave filter element. The sealing member has different thicknesses between a reception-element-covering region, which faces the reception elastic wave filter element on the side opposite from the substrate with respect to the reception elastic wave filter element, and a transmission-element-covering region, which faces the transmission elastic wave filter element on the side opposite from the substrate with respect to the transmission elastic wave filter element.

Abstract: An elastic wave filter device includes first and second signal terminals, an inductor, and a ladder elastic wave filter unit. The elastic wave filter device includes an elastic wave filter chip provided with the ladder elastic wave filter unit and a wiring board. The wiring board includes a plurality of dielectric layers and a plurality of electrode layers alternately laminated. An inductor electrode and a ground electrode are arranged so as to not face each other via the dielectric layer.

Abstract: In an elastic wave demultiplexer having excellent isolation characteristics, a first ground wiring electrode is connected to a second ground wiring electrode, via first ground via-hole electrodes. The first ground wiring electrode is connected to ground land electrodes via second ground via-hole electrodes. The second ground wiring electrode is connected to a ground terminal via third ground via-hole electrodes. The number of the first ground via-hole electrodes is greater than the number of the second ground via-hole electrodes and the number of the third ground via-hole electrodes.

Abstract: An elastic wave filter has first, second, and third IDT electrodes whose wiring electrodes are connected to unbalanced signal terminal; fourth IDT electrode disposed between the first and second IDT electrodes; fifth IDT electrode disposed between the second and third IDT electrodes; and first and second balanced signal terminals connected to the wiring electrodes of fourth and fifth IDT electrodes, respectively. The ground electrodes of the first through fifth IDT electrodes are connected to the ground. Signals in opposite phase and in phase with a signal input to unbalanced signal terminal are output from first and second balanced signal terminals, respectively. The wiring electrodes of second and third IDT electrodes are adjacent to the ground electrode of fifth IDT electrode. The wiring electrode of one of first and second IDT electrodes is adjacent to the wiring electrode of fourth IDT electrode. The ground electrode of the other is adjacent to the ground electrode of fourth IDT electrode.

Abstract: A duplexer is proposed with a substrate which has at least one patterned metallization plane and on which, at least to some extent, a transmission path (TX) and a reception path (RX) are arranged, both of which are connected to an antenna connection (ANT). The duplexer comprises a transmision filter (TXF) which is arranged in the transmission path (TX) and which has a first acoustic wase filter (BAW1) with one or more resonators. Furthermore, the duplexer (DPL) comprises a reception filter (RXF) which is arranged in the reception path (RX) on the antenna side and which has a second acoustic wave filter (BAW2) with one or more resonators and also a single-ended output.

Abstract: An antenna duplexer includes a transmission filter and a reception filter both coupled with an antenna terminal. A pass band of the transmission filter is lower than a pass band of the reception filter. The transmission filter includes a first series resonator coupled with a first terminal, a second series resonator connected to the first series resonator at a first node, a first parallel resonator connected to a first port of the first series resonator, a second parallel resonator connected to a first node and the first parallel resonator at a second node, a third parallel resonator connected to the first node, a fourth parallel resonator connected to the third parallel resonator at a third node, a first inductance element coupled with the second node and a ground, and a second inductance element coupled with the third node and the ground. The inductance of the second inductance element is lower than the inductance of the first inductance element.