Abstract: There is disclosed acoustic resonators and filter devices. An acoustic resonator includes a substrate and a piezoelectric diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) has interleaved fingers on the diaphragm. A thickness of the interleaved fingers is greater than or equal to 0.85 times a thickness of the diaphragm and less than or equal to 2.5 times the thickness of the diaphragm.

Abstract: An apparatus includes a first filter and a second filter. The first filter generally comprises a first plurality of resonators. The second filter generally comprises a second plurality of resonators. The first plurality of resonators generally comprise piezoelectric material. The second plurality of resonators generally comprise piezoelectric material. At least two of the first plurality of resonators are arranged in series between a signal input of the first filter and a signal output of the first filter. At least two of the second plurality of resonators are arranged in series between a signal input of the second filter and a signal output of the second filter. The second plurality of resonators are reverse connected relative to the first plurality of resonators.

Abstract: A package that includes a first filter device and a second filter device coupled to the first filter device. The first filter device includes a first substrate comprising a first piezoelectric material, and a first metal layer coupled to a first surface of the first substrate. The second filter device includes a second substrate comprising a second piezoelectric material, and a second metal layer coupled to a first surface of the first substrate. The package includes a first pillar interconnect configured to be electrically coupled to the first metal layer of the first filter device, where the first pillar interconnect extends through the second filter device. The package further includes a second pillar interconnect configured to be electrically coupled to the second metal layer of the second filter device.

Abstract: Provided is a micromechanical resonator including a support beam including a first portion supported on a support member and a second portion spaced apart from the first portion in a length direction of the support beam, and a piezoelectric sensing portion provided between the first portion and the second portion and connecting the first portion to the second portion.

Abstract: The present disclosure related to a micro-electromechanical system (MEMS) device and a method of forming the same. The MEMS device includes a substrate, a cavity, an interconnection structure and a proof mass. The substrate includes a first surface and a second surface opposite to the first surface. The cavity is disposed in the substrate to extend between the first surface and the second surface. The interconnection structure is disposed on the first surface of the substrate, over the cavity. The proof mass is disposed on the interconnection structure, wherein the proof mass is partially suspended over the interconnection structure.

Abstract: A bulk acoustic resonator having a heat dissipation structure, and a fabrication process are provided according to the present application. The bulk acoustic resonator includes a substrate, a metal heat dissipation layer formed on the base substrate and provided with an insulating layer on the surface thereof, and a resonance functional layer formed on the insulating layer, where the metal heat dissipation layer and the insulating layer together define a cavity on the substrate, a side wall of the cavity is formed by the insulating layer, and a bottom electrode layer in the resonance function layer covers the cavity.

Abstract: An adaptive filter includes, in part, a linear filter, and a non-linear resonator coupled to the linear filter and adapted to resonate at a frequency that is an integer multiple of the frequency of a received RF signal. The adaptive filter filters out the received RF signal. The resonant frequency may be twice the frequency of the received RF signal. The adaptive filter optionally includes a second non-linear resonator coupled to the linear filter and adapted to resonate at a frequency defined by a sum of the integer multiple of the frequency of the received signal and an offset frequency.

Abstract: A radio-frequency module is able to simultaneously communicate a signal of a first communication band and a signal of a second communication band and does not simultaneously communicate a signal of the first communication band and a signal of a third communication band. The radio-frequency module includes a mounting substrate, a filter, a filter, and a filter. The filter is provided on the mounting substrate and has the first communication band as the pass band thereof. The filter is provided on the mounting substrate and has the second communication band as the pass band thereof. The filter is provided on the mounting substrate and has the third communication band as the pass band thereof. The filter and the filter are indirectly stacked on top of each other and the filter and the filter are not stacked on top of each other.

Abstract: A filter device configured to directly connect to a differential power amplifier of a transmit chain circuit. The filter device may include a transformer and a filter configured as a half lattice equivalent topology and having a single-ended output. The filter may be a lattice filter configured as a full lattice topology or a lattice equivalent filter configured as a half lattice equivalent topology. The filter includes a first branch having a first impedance network of one or more first impedance elements and a second branch having a second impedance network of one or more second impedance elements. The single-ended output of the filter device may connect to an antenna switch that is in turn connected to an antenna.

Abstract: An integrated passive die includes a substrate, an input node, an output node, and RF filtering circuitry. The RF filtering circuitry includes a number of LC tank circuits coupled between the input node and the output node. Each one of the LC tank circuits include an inductor and a capacitor. The inductor is formed by a metal trace over the substrate. The capacitor is coupled in parallel with the inductor over the substrate. The inductor and the capacitor are provided such that a resonance frequency of the combination of the inductor and the capacitor is less than a self-resonance frequency of the inductor.

Abstract: The present disclosure relates to a wafer-level packaged (WLP) bulk acoustic wave (BAW) device, which includes a BAW resonator and a WLP enclosure. The BAW resonator includes a piezoelectric layer with an interface opening, a bottom electrode lead underneath the interface opening, an interface structure extending over the interface opening and connected with the bottom electrode lead, a passivation layer with a passivation opening over the interface structure, and an oxide adhesion layer with an adhesion opening over the passivation layer. The WLP enclosure includes an outer wall directly residing over the oxide adhesion layer, and a through-WLP via encompassed by the outer wall and vertically aligned with the adhesion opening and the passivation opening. A portion of the interface structure is exposed to the through-WLP via through the adhesion opening and the passivation opening.

Abstract: An implantable device for sensing intravascular pressure, the device comprising a bulk acoustic wave (BAW) resonator arranged to be deflected by changes in intravascular fluid pressure to provide a pressure dependent sensing signal and an acoustic reflector arranged to separate the BAW resonator from the intravascular fluid and to mediate pressure from the intravascular fluid to the BAW resonator wherein the acoustic reflector comprises a layer structure arranged to provide a series of transitions in acoustic impedance between the intravascular fluid and the BAW resonator.

Abstract: A bulk-acoustic wave resonator includes a substrate, a first electrode disposed on the substrate, a piezoelectric layer covering at least a portion of the first electrode, and a second electrode covering at least a portion of the piezoelectric layer. When an active region, in which the first electrode and the second electrode are disposed to overlap each other, is viewed from above, among four sides of a rectangle with which at least three vertices of a polygon formed by the active region are in contact, a longest side is defined as a side B and a side connected to side B is defined as a side A, and an aspect ratio (side B/side A) is 1.3 to 3.

Abstract: Embodiments may relate to a die such as an acoustic wave resonator (AWR) die. The die may include a first filter and a second filter in the die body. The die may further include an electromagnetic interference (EMI) structure that surrounds at least one of the filters. Other embodiments may be described or claimed.

Abstract: Hybrid filters and more particularly filters having acoustic wave resonators (AWRs) and lumped component (LC) resonators and packages therefor are described. In an example, a packaged filter includes a package substrate, the package substrate having a first side and a second side, the second side opposite the first side. A first acoustic wave resonator (AWR) device is coupled to the package substrate, the first AWR device comprising a resonator. A plurality of inductors is in the package substrate.

Abstract: A bulk acoustic resonator includes: a substrate including an upper surface on which a substrate protection layer is disposed; and a membrane layer forming a cavity together with the substrate, wherein a thickness deviation of either one or both of the substrate protection layer and the membrane layer is 170 ? or less.

Abstract: A bulk acoustic resonator operable in a bulk acoustic mode includes a resonator body mounted to a separate carrier that is not part of the resonator body. The resonator body includes a piezoelectric layer, a device layer, and a top conductive layer on the piezoelectric layer opposite the device layer. A surface of the device layer opposite the piezoelectric layer is for mounting the resonator body to the carrier.

Abstract: A package for an electronic component wherein the package comprises a front end, a back end, and an active membrane layer sandwiched between front and back electrodes of conducting material; the active membrane being mechanically supported by the front end and covered by a back end comprising at least one back cavity having organic walls and lid, with filled through vias traversing the organic lid and walls for coupling to the electrodes by an internal routing layer; the vias being coupleable by external solderable bumps to a circuit board for coupling the package in a ‘flip chip’ configuration.

Abstract: A method and a band reject filter (BRF) using as acoustic resonators at least one of bulk acoustic wave (BAW) resonators and film bulk acoustic resonators (FBAR) are provided. The BRF includes at least one substrate having at least one of a plurality of capacitors formed thereon, the plurality of capacitors having capacitances selected to achieve a particular band reject response. The BRF also includes at least one die. At least one of a plurality of acoustic wave resonators are formed thereon. The plurality of acoustic wave resonators are one of BAW resonators and FBARs and are designed to have the same resonant frequency. A plurality of conductors between the substrate and the die are positioned to electrically connect the acoustic wave resonators and the capacitors.

Abstract: A filter system includes a first resonator having a first resonant frequency, and a second resonator having a second resonant frequency different from the first resonant frequency, and electrically connected to the first resonator. A first response characteristic of the first resonator and a second response characteristic of the second resonator with respect to a frequency include a first section in which a first phase of the first resonator is equal to a second phase of the second resonator, and a second section in which the first phase is different from the second phase by 180 degrees. A first electrode of the first resonator is reversely connected to a second electrode of the second resonator.

Abstract: A receiver device includes an antenna that receives a high frequency signal having a bandwidth, a mixer connected to the antenna and a frequency multiplier. A filter that removes a noise signal whose frequency is different from that of the local signal is provided between the local oscillator and the frequency multiplier. The filter removes the noise signal that satisfies the condition that the absolute value of the frequency difference between the center frequency of the local signal and the center frequency of the noise signal is less than the bandwidth of the high frequency signal.

Abstract: A filter circuit includes a first input node and a second input node for receiving an input signal, and a first output node and a second output node for providing an output signal. A first series acoustic resonator is coupled in series between the first input node and the first output node. At least one coupled resonator filter (CRF) includes first and second transducers, which may be acoustically coupled to one another. The first transducer has a first electrode coupled to the first input node, a second electrode coupled to the second input node, and a first piezoelectric layer between the first electrode and the second electrode. A second transducer has a third electrode coupled to the first output node, a fourth electrode coupled to the second output node, and a second piezoelectric layer between the third electrode and the fourth electrode.

Abstract: An acoustic wave device includes: a first resonator that includes a first piezoelectric substance, and first lower and upper electrodes sandwiching the first piezoelectric substance in a direction of a c-axis orientation or a polarization axis of the first piezoelectric substance; and a second resonator that is located closer to a signal input terminal than the first resonator is, is connected in series to the first resonator, includes a second piezoelectric substance, and second lower and upper electrodes sandwiching the second piezoelectric substance so that an electrode in a direction of the c-axis orientation or a polarization axis of the second piezoelectric substance has an electric potential identical to an electric potential of an electrode of the first resonator in the direction of the c-axis orientation or the polarization axis of the first piezoelectric substance, and has an antiresonant frequency less than an antiresonant frequency of the first resonator.

Abstract: Compensation of on-die inductive parasitics in ladder filters through negative mutual inductance between ground inductors is disclosed herein. An exemplary ladder filter includes a primary arm of series resonators and two or more shunt resonator arms connecting nodes between the series resonators to ground. The resonators of the ladder filter are disposed over a semiconductor substrate, to form a circuit die. Constructed ladder filter dice may fail to achieve design filter rejection due to inductive parasitics (e.g., undesired magnetic induction between components). A first shunt arm and a second shunt arm are provided with mutual negatively coupled inductors in order to compensate for these parasitics and improve filter performance.

Abstract: A filter circuit includes a first input node and a second input node for receiving an input signal, and a first output node and a second output node for providing an output signal. A first series acoustic resonator is coupled in series between the first input node and the first output node. At least one coupled resonator filter (CRF) includes first and second transducers, which may be acoustically coupled to one another. The first transducer has a first electrode coupled to the first input node, a second electrode coupled to the second input node, and a first piezoelectric layer between the first electrode and the second electrode. A second transducer has a third electrode coupled to the first output node, a fourth electrode coupled to the second output node, and a second piezoelectric layer between the third electrode and the fourth electrode.

Abstract: A filter includes a plurality of series portions each including one or more series resonators, and a plurality of shunt portions each including one or more shunt resonators. At least one of the plurality of shunt portions includes two shunt resonators connected to each other in anti-series, and antiresonance frequencies of the two shunt resonators are arranged externally of a passband.

Abstract: A filter circuit includes a first input node and a second input node for receiving an input signal, and a first output node and a second output node for providing an output signal. A first series acoustic resonator is coupled in series between the first input node and the first output node. At least one coupled resonator filter (CRF) includes first and second transducers, which may be acoustically coupled to one another. The first transducer has a first electrode coupled to the first input node, a second electrode coupled to the second input node, and a first piezoelectric layer between the first electrode and the second electrode. A second transducer has a third electrode coupled to the first output node, a fourth electrode coupled to the second output node, and a second piezoelectric layer between the third electrode and the fourth electrode.

Abstract: A resonator element for use in a filter is provided. The resonator element includes a first resonator acoustically coupled to a second or third resonator or both. The first resonator has terminals for incorporation in a filter structure. A tuning circuit is coupled to the second or third resonator or both to enable tuning of the resonator element. The tuning circuit includes a variable capacitor and an inductor.

Abstract: A communication module includes: a first substrate having a first surface; a second substrate having a second surface, the second surface facing the first surface across an air gap; a first filter located on the first surface, a passband of the first filter being either one of a transmit band and a receive band of a first band, the first band being a frequency division duplex band; and a second filter located on the second surface, at least a part of the second filter overlapping with at least a part of the first filter in a stacking direction in which the first substrate and the second substrate are stacked, a passband of the second filter being at least one of a transmit band and a receive band of a second band, the second band differing from the first band.

Abstract: An acoustic resonator includes: a central portion; an extension portion extended outwardly of the central portion; a first electrode, a piezoelectric layer, and a second electrode sequentially stacked on a substrate, in the central portion; and an insertion layer disposed below the piezoelectric layer in the extension portion, wherein the piezoelectric layer includes a piezoelectric portion disposed in the central portion, and a bent portion disposed in the extension portion and extended from the piezoelectric portion at an incline depending on a shape of the insertion layer.

Abstract: A filter includes: a series part disposed between a signal input terminal and a signal output terminal, and including at least one first bulk-acoustic resonator; an inductor portion including a first inductor disposed between ends of the series part and a second inductor having a first end connected to a connection node of the series part and the first inductor; and a shunt part disposed between a second end of the second inductor and a ground, and including at least one second bulk-acoustic resonator, wherein a resonant frequency of the at least one second bulk-acoustic resonator is higher than a resonant frequency of the at least one first bulk-acoustic resonator.

Abstract: The invention relates to an acoustically coupled thin-film BAW filter, comprising a piezoelectric layer, an input-port on the piezoelectric layer changing electrical signal into an acoustic wave (SAW, BAW), and an output-port on the piezoelectric layer changing acoustic signal into electrical signal. In accordance with the invention the ports include electrodes positioned close to each other, and the filter is designed to operate in first order thickness-extensional TE1 mode.

Abstract: A piezoelectric micromechanical resonator includes a supporting beam including a fixed edge that is fixed to a supporting member and a free edge opposite the fixed edge, a piezoelectric sensor including an edge attached to the supporting member, the piezoelectric sensor further including a lower electrode, a piezoelectric unit, and an upper electrode sequentially stacked on a surface of the supporting beam, and a lumped mass provided on the surface of the supporting beam at a side of the supporting beam including the free edge, the upper electrode having a Young's modulus smaller than a Young's modulus of the lower electrode.

Abstract: Road signal systems and methods for controlling road signals include a piezoelectric layer integrated with a surface that undergoes stresses with traffic passing over the surface. A power collection circuit is configured to collect and store power from the piezoelectric layer. One or more devices receive electrical power from the power collection circuit responsive to traffic passing over the surface.

Abstract: A bulk acoustic wave resonator includes a substrate protective layer disposed on a top surface of a substrate, a cavity defined by a membrane layer and the substrate, and a resonating part disposed on the membrane layer. The membrane layer includes a first layer and a second layer, the second layer having the same material as the first layer and having a density greater than that of the first layer.

Abstract: A filter circuit includes a first input node and a second input node for receiving an input signal, and a first output node and a second output node for providing an output signal. A first series acoustic resonator is coupled in series between the first input node and the first output node. At least one coupled resonator filter (CRF) includes first and second transducers, which may be acoustically coupled to one another. The first transducer has a first electrode coupled to the first input node, a second electrode coupled to the second input node, and a first piezoelectric layer between the first electrode and the second electrode. A second transducer has a third electrode coupled to the first output node, a fourth electrode coupled to the second output node, and a second piezoelectric layer between the third electrode and the fourth electrode.

Abstract: A bulk acoustic wave (BAW) resonator includes: a substrate; a first BAW resonator including a first air cavity disposed in the substrate, and further including a first electrode, a first piezoelectric layer, and a second electrode stacked on the first air cavity; a second BAW resonator including a second air cavity disposed in the substrate, and further including a first electrode, a second piezoelectric layer, and a second electrode stacked on the second air cavity, wherein the second BAW resonator is connected in parallel to the first BAW resonator and has polarities that are opposite of polarities of the first BAW resonator; and a compensation capacitor circuit connected between the first BAW resonator and the second BAW resonator.

Abstract: A resonator element for use in a filter is provided. The resonator element includes a first resonator acoustically coupled to a second resonator. The first resonator has terminals for incorporation in a filter structure. A tuning circuit is coupled to the second resonator to enable tuning of the resonator element.

Abstract: A filter includes: a first substrate; first and second piezoelectric thin film resonators located on the first substrate, each of the resonators including first and second electrodes facing each other across a piezoelectric film, a crystal orientation from the first electrode to the second electrode of the piezoelectric film being the same between the resonators, the first electrodes of the resonators connecting to each other in a connection region between resonance regions where the first and second electrodes face each other across the piezoelectric film, the second electrodes of the resonators failing to connect to each other, and an area of the resonance region being approximately the same between the resonators, a second substrate mounting the first substrate across an air gap; and a ground pattern located on the second substrate and not overlapping with the first electrode located in the resonance regions and the connection region.

Abstract: Filter circuitry uses acoustic resonators to provide a frequency response having a stopband between two passbands. The filter circuitry includes at least one series acoustic resonator coupled between an input node and an output node. A compensation circuit is also coupled between the input node and the output node. The compensation circuit includes a first inductor and a second inductor coupled in series between the input node and the output node. The first inductor and the second inductor are negatively coupled with one another, wherein a common node is provided between the first inductor and the second inductor. A shunt circuit is coupled between the common node and a fixed voltage node. The shunt circuit includes a shunt inductor coupled in series with a plurality of parallel-coupled shunt acoustic resonators.

Abstract: Sensitivity of thin film bulk acoustic resonance (TFBAR) sensors is enhanced by mass amplification and operating a high frequency.

Abstract: A branching filter includes a low-pass filter provided between a common port and a first signal port, and a high-pass filter provided between the common port and a second signal port. The low-pass filter includes: a first LC resonant circuit; and a first acoustic wave resonator provided in a shunt circuit connecting a path leading from the first LC resonant circuit to the first signal port to a ground. The high-pass filter includes: a second LC resonant circuit; and a second acoustic wave resonator provided in a path leading from the second LC resonant circuit to the second signal port.

Abstract: An amplifier circuit includes an RF amplifier that is configured to amplify an RF signal between a first terminal and a second terminal across an RF frequency range. The amplifier circuit includes a multi-stage impedance matching network having a broadband impedance transformer, a phase shifter, and a high-pass impedance transformer connected in series with one another between a first port of the amplifier circuit and the first terminal. The broadband impedance transformer provides impedance transformation in the RF frequency range. The phase shifter shifts a phase output port reflection coefficient in a second order harmonic frequency range that overlaps with a second order harmonic of the fundamental RF frequency. The high-pass impedance transformer transmits an RF signal in the RF frequency range while providing impedance transformation in the RF frequency range and transmits RF signals in the second order harmonic frequency range with low impedance.

Abstract: An acoustic wave filter includes: series resonators connected in series; and one or more parallel resonators connected in parallel, wherein at least two series resonators and a parallel resonator therebetween are divided into a first divided resonator, which includes a piezoelectric substance sandwiched between a pair of electrodes in a c-axis orientation direction, and a second divided resonator, which includes another piezoelectric substance sandwiched between another pair of electrodes so that the another pair of electrodes in the c-axis orientation direction has an electric potential opposite to that of the electrodes of the first divided resonator in the c-axis orientation direction, a first group including the first divided resonators and a second group including the second divided resonators are interconnected in parallel between two nodes, and the first divided resonators and the second divided resonators of the at least two series resonators are not electrically interconnected at the two nodes.

Abstract: Stealth-dicing-compatible devices and methods to prevent acoustic backside reflections on acoustic wave devices are disclosed. An acoustic wave device comprises a substrate having opposing top and bottom surfaces, where a first portion of the bottom surface has a higher roughness than a second portion of the bottom surface, and an acoustic resonator over the top surface of the substrate. The acoustic resonator comprises a piezoelectric layer having opposing top and bottom surfaces and a plurality of electrodes, at least some of which are disposed on the top surface of the piezoelectric layer. The first portion of the bottom surface of the substrate is below and opposite from the acoustic resonator, and the second portion of the bottom surface of the substrate is not located below and opposite from the acoustic resonator. Multiple first portions, each separated from the other by second portions, may exist.

Abstract: A filter circuit includes a serial arm connected between ports (P1-P2), a parallel arm having a resonator connected in series between ports (P1-P3), and another parallel arm having another resonator connected in series between ports (P2-P3). The serial arm includes a switching circuit, and the switching circuit connects an inductor or a capacitor to the serial arm in series using a switch.

Abstract: An apparatus for analyzing an active material of a secondary battery may include: a first electrode; a piezoelectric layer on the first electrode; a second electrode on the piezoelectric layer, configured to provide a voltage having a polarity opposite to a polarity of the first electrode; and/or an insulating layer on the second electrode and including a through hole exposing a portion of the second electrode. A method of analyzing an active material of a secondary battery may include: disposing an active material in a through hole of a bulk acoustic resonator, in which a first electrode, a piezoelectric layer, a second electrode, and an insulating layer are stacked; measuring a resonance frequency of the resonator by applying an electric signal to the first and second electrodes of the resonator; and/or measuring a weight of the active material in the through hole, based on the measured resonance frequency.

Abstract: A piezoelectric thin film comprising aluminum nitride containing magnesium and hafnium, wherein a content of the hafnium based on 100 atomic % of the magnesium is 8 atomic % or more and less than 100 atomic %, and a total content of the magnesium and hafnium based on a sum of a content of the magnesium, hafnium, and aluminum is in a range of 47 atomic % or less.

Abstract: A method for manufacturing a piezoelectric bulk acoustic wave element by forming a sacrificial layer on a part of a primary surface of a substrate. A piezoelectric film sandwiched between a pair of electrodes is formed on the primary surface of the substrate so as to cover the sacrificial layer, the piezoelectric film being formed from scandium-containing aluminum nitride having a scandium atomic concentration with respect to the total number of scandium atoms and aluminum atoms of more than 24 atomic percent. An etching step of removing the sacrificial layer by etching is performed. Prior to the etching step, a protective film formed from aluminum nitride or scandium-containing aluminum nitride having a lower scandium atomic concentration than that of the piezoelectric film is provided so as to cover at least a part of a portion of the piezoelectric film located in a region in which the sacrificial layer is provided.

Abstract: A surface-guided bulk wave transducer includes a stack of an acoustic substrate, an electric ground plane, and a network of synchronous acoustic excitation sources with two combs of elementary piezoelectric transducers alternately interlaced two-by-two according to a periodic network step corresponding to a propagation mode of a surface-guided bulk wave of the acoustic substrate. Each elementary piezoelectric transducer includes a single and different rod with a parallelepipedal shape for which the nature, the cut of the piezoelectric material, the height h, and the width are selected for increasing the electromechanical coupling coefficient of the transducer assembly to a high level.