Electromechanical Filter Patents (Class 333/186)
  • Patent number: 10374118
    Abstract: Semiconductor devices, such as photonics devices, employ substantially curved-shaped Silicon-Germanium (SiGe) structures and are fabricated using zero-change CMOS fabrication process technologies. In one example, a closed-loop resonator waveguide-coupled photodetector includes a silicon resonator structure formed in a silicon substrate, interdigitated n-doped well-implant regions and p-doped well-implant regions forming multiple silicon p-n junctions around the silicon resonator structure, and a closed-loop SiGe photocarrier generation region formed in a pocket within the interdigitated n-doped and p-doped well implant regions. The closed-loop SiGe region is located so as to substantially overlap with an optical mode of radiation when present in the silicon resonator structure, and traverses the multiple silicon p-n junctions around the silicon resonator structure.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: August 6, 2019
    Assignee: Massachusetts Institute of Technology
    Inventors: Luca Alloatti, Rajeev Jagga Ram, Dinis Cheian
  • Patent number: 10367469
    Abstract: A MEMS resonator array is provided with improved electrical characteristics and reduced motional impedance at high frequency applications. The MEMS resonator array includes a pair of first piezoelectric resonators that are opposed to each other with a space defined therebetween. Moreover, the MEMS resonator array includes a pair of second piezoelectric resonators that are opposed to each other and that are each coupled to respective corners of each of the first piezoelectric resonators. As such, each of the second piezoelectric resonators is partially disposed in the space defined between the pair of first piezoelectric resonators.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: July 30, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Ville Kaajakari
  • Patent number: 10355195
    Abstract: An acoustic resonator includes: a substrate; a resonance part including a lower electrode, a piezoelectric layer, and an upper electrode sequentially stacked on the substrate, and a frame formed on the upper electrode along an edge of the upper electrode; and a trench part formed in at least one side of the resonance part and making a thickness of the resonance part asymmetrical.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: July 16, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Ho Kim, Dae Hun Jeong, Won Han, Sang Uk Son
  • Patent number: 10333052
    Abstract: A vibrating device includes a vibration plate that vibrates at a harmonic of a contour vibration and on which plural vibration members to are disposed. Moreover, support members are provided having first ends connected to the vibration plate and second ends connected to a frame base that surrounds the vibration plate. Cavities extending in a direction that intersects a direction in which the support members extend are formed in the base with flexure-vibration members formed therebetween. Both ends of the flexure-vibration members are joined to the base to serve as stationary ends. Moreover, a length between ends of the flexure-vibration members and a connected portion where each of the flexure-vibration member is connected to the corresponding support members is ?/4, where ? is a wave length of a flexural vibration corresponding to a frequency of a natural vibration in the vibration plate.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: June 25, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Toshio Nishimura
  • Patent number: 10317426
    Abstract: An accelerometer has a plurality of proof masses and a plurality of sense electrodes, which collectively form at least two capacitors. A first sense drive signal is applied to a first capacitor and a second sense drive signal is applied to a second capacitor. Both of the sense drive signals have the same sense drive frequency. Capacitance signals are sensed from each of the first capacitor and second capacitor, and a common mode component of the capacitance signals is determined. A capacitor error is identified based on the common mode component.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: June 11, 2019
    Assignee: PANASONIC CORPORATION
    Inventors: Luca Coronato, Giacomo Gafforelli, Adolfo Giambastiani, Federico Mazzarella, Massimiliano Musazzi, Michele Folz
  • Patent number: 10256789
    Abstract: A displacement conversion mechanism of an embodiment is a displacement conversion mechanism which is provided with a base, a displacement element which is in contact with the base and is displaced in a first direction, a first displacement portion which is in contact with the displacement element and can be displaced in the first direction, a second displacement portion which connects to an end of the first displacement portion at a first connection portion, and connects to the base at a second connection portion, and a third displacement portion which connects to the other end of the first displacement portion, connects to an end portion of the second displacement portion at a fourth connection portion, and can be displaced in a second direction intersecting with the first direction.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: April 9, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroshi Takahashi, Junya Tanaka, Rie Katsuki, Hiroyuki Kayano, Noritsugu Shiokawa, Tamio Kawaguchi, Hiroaki Ikeuchi
  • Patent number: 10234288
    Abstract: A BAW gyroscope is configured to operate with two pairs of orthogonal modes instead of a single pair in order to mitigate the impact of changes in gaps (e.g., introduced from external stresses such as thermal gradients, external shocks, mechanical stress/torque, etc.). Specifically, the BAW gyroscope resonator is configured to be simultaneously driven to resonate with a two disparate resonant modes (referred to herein as the “fundamental” mode and the “compound” mode), with the same set of drive electrodes used to drive both resonant modes (i.e., all of the drive electrodes are used to drive the two drive modes). When the sensor experiences external rotation, energy couples from the driven modes of vibration to two corresponding orthogonal sense modes via the Coriolis force. The same set of sense electrodes is used to sense both sense modes (i.e., all of the sense electrodes are used to sense the two sense modes).
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: March 19, 2019
    Assignee: Analog Devices Global Unlimited Company
    Inventors: Siddharth Tallur, Sunil Ashok Bhave
  • Patent number: 10084426
    Abstract: An acoustic resonator includes a wafer and a first phononic crystal disposed on the wafer to define an acoustic waveguide so as to propagate an acoustic wave along a propagation direction. The first phononic crystal includes a first two-dimensional (2D) array of metal stripes having a first period on the propagation direction. The apparatus also includes a second phononic crystal and a third phononic crystal disposed on two sides of the first phononic crystal and having a different period from the first period. The second phononic crystal and the wafer define a first reflector to reflect the acoustic wave. The third phononic crystal and the wafer define a second reflector to reflect the acoustic wave.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: September 25, 2018
    Assignee: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: Bichoy W. Bahr, Dana Weinstein
  • Patent number: 10075148
    Abstract: A resonance circuit complex electronic component includes a first circuit element and a second circuit element defining a resonance circuit, an external connection terminal connected to outside, and a plurality of routing conductors connecting an external terminal of the first circuit element and an external terminal of the second circuit element to the external connection terminal, respectively. At least one of the plurality of routing conductors includes an inductor conductor extending in a direction not in parallel with a mounting surface.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: September 11, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takashi Iwamoto
  • Patent number: 10056877
    Abstract: The invention provides a microelectromechanical resonator device comprising a support structure and a resonator manufactured on a (100) or (110) semiconductor wafer, wherein the resonator is suspended to the support structure and comprises at least one beam being doped to a doping concentration of 1.1*1020 cm?3 or more with an n-type doping agent and is being capable of resonating in a length-extensional, flexural resonance or torsional mode upon suitable actuation. In particular, the doping concentration and angle of the beam are chosen so as to simultaneously produce zero or close to zero second order TCF, and even more preferably zero or close to zero first and second order TCFs, for the resonator in said resonance mode, thus providing a temperature stable resonator.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: August 21, 2018
    Assignee: Teknologian tutkimuskeskus VTT Oy
    Inventors: Antti Jaakkola, Panu Pekko, Mika Prunnila, Tuomas Pensala
  • Patent number: 9991576
    Abstract: An electronic apparatus case including: a circuit board provided on a lower case, the circuit board having a plurality of signal lines in parallel, each specified area of the circuit board between each adjacent pair of the plurality of signal lines having a plurality of first through holes and a plurality of second through holes, the plurality of first and second through holes respectively being arranged in a first and a second lines at substantially equal interval of ? or less of a wavelength of signals propagating in the plurality of signal lines, the first line and the second line being arranged in parallel, each center of each of the plurality of first through holes and each center of each of the plurality of second through holes being shifted with a gap in a direction of the first line and the second line.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: June 5, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Makoto Taguchi, Noritoshi Ogawa, Tomoaki Satou, Hiroyuki Fujita, Hokuto Kakizaki
  • Patent number: 9991868
    Abstract: A micro-resonator employs a lid-integrated electrode to one or more of drive, sense and tune a vibrational resonant mode of a microelectromechanical systems (MEMS) resonator. The micro-resonator includes a lid attached to a base that provides a resonator cavity. The micro-resonator further includes the MEMS resonator extending from a surface of the base toward the lid within the resonator cavity. The lid-integrated electrode extends vertically from the lid into the resonator cavity toward the base. The vertically extending, lid-integrated electrode is positioned spaced from and adjacent to a side of the MEMS resonator to one or more of drive, sense and tune mechanical movement of the MEMS resonator.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: June 5, 2018
    Assignee: HRL Laboratories, LLC
    Inventors: Hung Nguyen, Raviv Perahia, Lian X. Huang, Srikanth Iyer
  • Patent number: 9991869
    Abstract: The invention concerns microelectromechanical resonators. In particular, the invention provides a resonator comprising a support structure, a doped semiconductor resonator suspended to the support structure by at least one anchor, and actuator for exciting resonance into the resonator. According to the invention, the resonator comprises a base portion and at least one protrusion extending outward from the base portion and is excitable by said actuator into a compound resonance mode having temperature coefficient of frequency (TCF) characteristics, which are contributed by both the base portion and the at least one protrusion. The invention enables simple resonators, which are very well temperature compensated over a wide temperature range.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: June 5, 2018
    Assignee: Teknologian tutkimuskeskus VTT Oy
    Inventors: Antti Jaakkola, Panu Pekko, Mika Prunnila, Tuomas Pensala
  • Patent number: 9958707
    Abstract: Systems and methods in accordance with embodiments of the invention implement electrically tunable metasurfaces.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: May 1, 2018
    Assignee: California Institute of Technology
    Inventor: Harry A. Atwater
  • Patent number: 9923545
    Abstract: A compound spring MEMS resonator includes a resonator body constructed using one or more spring unit cells forming a compound spring block and one or more compound spring blocks forming the resonator body. Each compound spring block is anchored at nodal points to ensure a high quality factor. The resonator body further includes masses attached to the open ends of the compound spring block and capacitively coupled to drive/sense electrodes. The dimensions of the spring unit cells, the number of spring unit cells for a compound spring block, the size and weight of the masses, and the length and width of the support beams are selected to realize a desired resonant frequency. Meanwhile, the number of compound spring blocks is selected to tune the desired electrical characteristics, such as impedance, of the MEMS resonator.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: March 20, 2018
    Assignee: Microchip Technology Incorporated
    Inventor: John Ryan Clark
  • Patent number: 9887685
    Abstract: A mechanical resonator includes a spring-mass system, wherein the spring-mass system comprises a phase-change material. The mechanical resonator typically comprises an electrical circuit portion, coupled to the phase-change material to alter a phase configuration within the phase-change material. Methods of operation are also disclosed.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: February 6, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Johan B. C. Engelen, Mark A. Lantz, Wabe W. Koelmans
  • Patent number: 9825610
    Abstract: In an embodiment, a tunable stiffness mechanical filter is provided including an input coupler to a negative stiffness structure with a negative stiffness characteristic, and further including a tuner for tuning the negative stiffness structure. An output sensor is located along the negative stiffness structure. The filter may include an amplifier and/or a driver coupled between the output sensor and the negative stiffness structure.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: November 21, 2017
    Assignee: HRL Laboratories, LLC
    Inventors: Christopher B. Churchill, Geoffrey P. McKnight, Raviv Perahia, Logan D. Sorenson, Guillermo Herrera
  • Patent number: 9823267
    Abstract: A microelectromechanical system (MEMS) acceleration sensor includes a mass bar, a first spring disposed on a first set of opposite sides of the mass bar and configured to secure the mass bar in a first direction, an interdigital structure disposed along a second set of opposite sides of the mass bar in a second direction perpendicular to the first direction, a detection electrode corresponding to the interdigital structure, and a second spring disposed on the second set of opposite sides and configured to secure the mass bar in the second direction. The first spring has a frame shape, and the second spring has an S-shape. Through the second spring, the acceleration sensor is less sensitive to acceleration on the other direction, so that the detection performance of the acceleration sensor is improved.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: November 21, 2017
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventor: Zhaowen He
  • Patent number: 9800222
    Abstract: A continuous or distributed resonator geometry is defined such that the fabrication process used to form a spring mechanism also forms an effective mass of the resonator structure. Proportional design of the spring mechanism and/or mass element geometries in relation to the fabrication process allows for compensation of process-tolerance-induced fabrication variances. As a result, a resonator having increased frequency accuracy is achieved.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: October 24, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Markus Lutz, Aaron Partridge
  • Patent number: 9774313
    Abstract: A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: September 26, 2017
    Assignee: SiTime Corporation
    Inventors: Charles I. Grosjean, Ginel C. Hill, Paul M. Hagelin, Renata Melamud Berger, Aaron Partridge, Markus Lutz
  • Patent number: 9695036
    Abstract: The present inventions, in one aspect, are directed to micromachined resonator comprising: a first resonant structure extending along a first axis, wherein the first axis is different from a crystal axis of silicon, a second resonant structure extending along a second axis, wherein the second axis is different from the first axis and the crystal axis of silicon and wherein the first resonant structure is coupled to the second resonant structure, and wherein the first and second resonant structures are comprised of silicon (for example, substantially monocrystalline) and include an impurity dopant (for example, phosphorus) having a concentrations which is greater than 1019 cm?3, and preferably between 1019 cm?3 and 1021 cm?3.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: July 4, 2017
    Assignee: SiTime Corporation
    Inventors: Renata Melamud Berger, Ginel C. Hill, Paul M. Hagelin, Charles I. Grosjean, Aaron Partridge, Joseph C. Doll, Markus Lutz
  • Patent number: 9685929
    Abstract: A MEMS/NEMS device having an adjustable frequency response comprises an array of electrostatically actuated resonators, an electrostatic actuation circuit, electrical detection means, and means adjusting the frequency response of the resonators. The device comprises resonators having a movable portion, electrically connected in series between a first biasing potential VB and a second biasing potential VB2, each resonator biased to a potential Vi between VB and VB2, depending on position in the series. The electrostatic actuation circuit comprises, for each resonator, an actuation electrode facing the movable portion, all electrodes being connected in parallel to a common control potential VIN, the actuation voltage of each resonator being equal to VIN?Vi. The detection means comprises a detection output common to all resonators, the output being connected to an output potential Vout.
    Type: Grant
    Filed: November 5, 2014
    Date of Patent: June 20, 2017
    Assignee: Commissariat A L'Energie Atomique et aux Energies Alternatives
    Inventors: Julien Arcamone, Gregory Arndt
  • Patent number: 9660654
    Abstract: Synchronization of oscillators based on anharmonic nanoelectromechanical resonators. Experimental implimentation allows for unprecedented observation and control of parameters governing the dynamics of synchronization. Close quantitative agreement is found between experimental data and theory describing reactively coupled Duffing resonators with fully saturated feedback gain. In the synchonized state, a significant reduction in the phase noise of the oscillators is demonstrated, which is key for applications such as sensors and clocks. Oscillator networks constructed from nanomechanical resonators form an important laboratory to commercialize and study synchronization—given their high-quality factors, small footprint, and ease of co-integration with modern electronic signal processing technologies. Networks can be made including one-, two-, and three-dimensional networks. Triangular and square lattices can be made.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: May 23, 2017
    Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: Matthew Matheny, Michael L. Roukes, Michael C. Cross, Luis Guillermo Villanueva Torrijo, Rassul Karabalin
  • Patent number: 9630830
    Abstract: A MEMS resonator active temperature compensation method is provided. The MEMS resonator active temperature compensation method includes: a MEMS resonator is provided, wherein a structural resistance of the MEMS resonator is varied with an environmental temperature; a structural resistance shift value is formed by a variation of the environmental temperature; an electrical circuit is provided, wherein the electrical circuit is electrically connected with the MEMS resonator for providing an adjustment mechanism to the MEMS resonator; and a compensation value is provided from the adjustment mechanism for controlling the structural resistance shift value.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: April 25, 2017
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Sheng-Shian Li, Cheng-Chi Chen
  • Patent number: 9617146
    Abstract: A method of fabricating a nano resonator, includes forming a line pattern in a first substrate, and transferring the line pattern to a second substrate including a gate electrode. The method further includes forming a source electrode and a drain electrode on the transferred line pattern.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: April 11, 2017
    Assignees: Samsung Electronics Co., Ltd., KOREA UNIVERSITY INDUSTRIAL & ACADEMIC COLLABORATION FOUNDATION
    Inventors: Duck Hwan Kim, In Sang Song, Jea Shik Shin, Ho Soo Park, Jae-Sung Rieh, Byeong Kwon Ju
  • Patent number: 9608564
    Abstract: The present disclosure is directed a metamaterial circuit may further be coupled to a möbius strip resonator or a substrate integrated waveguide. The disclosure is also directed to a device having a tuning circuit and a metamaterial resonator operatively coupled to the tuning circuit. The metamaterial resonator operatively coupled to the tuning circuit may likewise be coupled to a möbius strip resonator or a substrate integrated waveguide.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: March 28, 2017
    Assignee: Synergy Microwave Corporation
    Inventors: Ajay Kumar Poddar, Ulrich L. Rohde
  • Patent number: 9602063
    Abstract: An amplifier with switchable and tunable harmonic terminations and a variable impedance matching network is presented. The amplifier can adapt to different modes and different frequency bands of operation by appropriate switching and/or tuning of the harmonic terminations and/or the variable impedance matching network.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: March 21, 2017
    Assignee: Peregrine Semiconductor Corporation
    Inventors: Gary Frederick Kaatz, Chris Olson
  • Patent number: 9602026
    Abstract: A microelectromechanical system (MEMS) device includes a temperature compensating structure including a first beam suspended from a substrate and a second beam suspended from the substrate. The first beam is formed from a first material having a first Young's modulus temperature coefficient. The second beam is formed from a second material having a second Young's modulus temperature coefficient. The body may include a routing spring suspended from the substrate. The routing spring may be coupled to the first beam and the second beam. The routing spring may be formed from the second material. The first beam and the second beam may have lower spring compliance than the routing spring. The MEMS device may be a resonator and the temperature compensating structure may have dimensions and a location such that the temperature compensation structure modifies a temperature coefficient of frequency of the resonator independent of a mode shape of the resonator.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: March 21, 2017
    Assignee: Silicon Laboratories Inc.
    Inventors: Emmanuel P. Quevy, Daniel N. Koury, Jr.
  • Patent number: 9573799
    Abstract: A MEMS device (40) includes a base structure (42) and a microstructure (44) suspended above the structure (42). The base structure (42) includes an oxide layer (50) formed on a substrate (48), a structural layer (54) formed on the oxide layer (50), and an insulating layer (56) formed over the structural layer (54). A sacrificial layer (112) is formed overlying the base structure (42), and the microstructure (44) is formed in another structural layer (116) over the sacrificial layer (112). Methodology (90) entails removing the sacrificial layer (112) and a portion of the oxide layer (50) to release the microstructure (44) and to expose a top surface (52) of the substrate (48). Following removal, a width (86) of a gap (80) produced between the microstructure (44) and the top surface (52) is greater than a width (88) of a gap (84) produced between the microstructure (44) and the structural layer (54).
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: February 21, 2017
    Assignee: NXP USA, Inc.
    Inventors: Andrew C. McNeil, Yizhen Lin, Lisa Z. Zhang
  • Patent number: 9515608
    Abstract: A multimode oscillator comprising: a resonator including: a moving element; actuators of the moving element according to two symmetric and antisymmetric resonance modes; several detectors of the displacement of the moving element; polarization circuitry of the detectors by signals out of phase with each other; a first calculator carrying out a first operation conserving the frequential components of the first mode and cancelling those of the second mode; a second calculator carrying out a second operation conserving the frequential components of the second mode and cancelling those of the first mode; and in which the resonator and the calculators form two self-oscillating loops making the oscillator resonate simultaneously in the two modes.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: December 6, 2016
    Assignee: Commissariat a l'energie atomique et aux energies alternatives
    Inventors: Guillaume Gourlat, Gerard Billiot, Patrick Villard
  • Patent number: 9509279
    Abstract: A filter device includes a first LC parallel resonance circuit having a first inductance and connected between a line connecting an input terminal and an output terminal and a ground potential, a second LC parallel resonance circuit having a second inductance and connected between the line and the ground potential, and at least one elastic wave resonator that is connected between an end portion of the first LC parallel resonance circuit and an end portion of the second LC parallel resonance circuit. Attenuation-frequency characteristics of an LC filter including the first LC parallel resonance circuit, the second LC parallel resonance circuit, and a capacitive property and attenuation-frequency characteristics of the at least one elastic wave resonator are used.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: November 29, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Koji Nosaka
  • Patent number: 9484884
    Abstract: Mechanical resonators for making timepieces have the drawback of not being simultaneously efficient, compact, and inexpensive. The invention is a planar structure of a mechanical resonator (100) that is suitable for reducing bulkiness and manufacturing cost and comprises a bar (R) vibrating in longitudinal expansion/compression resonance and two beams, (12) each vibrating simultaneously in longitudinal expansion/compression and it bending oscillation in the plane of the structure and connected to the bar by a connection element (11) on the median plane (?) of the bar, thereby enabling the effects of the transverse deformations of the bar, due to the Poisson ratio of the material, to not be transmitted to the attachment pads (PF) of the resonator. Thus, the quality factor of the resonator can be very high.
    Type: Grant
    Filed: February 13, 2014
    Date of Patent: November 1, 2016
    Assignee: Office National D'Etudes Et De Recherches Aerospatials
    Inventors: Olivier Le Traon, Denis Janiaud, Rachid Taibi, Claude Chartier, Vincent Gaudineau, Marc Pernice
  • Patent number: 9419477
    Abstract: Disclosed is a wireless power transmitter that includes a resonator that provides charging electric power to a wireless power receiver and a metal layer spaced apart from the resonator by a preset interval, with a line width of the resonator being smaller than the preset interval between the resonator and the metal layer.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: August 16, 2016
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Joon-Il Kim, Hong-Kweun Kim, Se-Ho Park
  • Patent number: 9412815
    Abstract: A semiconductor device includes a substrate having at least one electrically insulating portion. A first graphene electrode is formed on a surface of the substrate such that the electrically insulating portion is interposed between a bulk portion of the substrate and the first graphene electrode. A second graphene electrode formed on the surface of the substrate. The electrically insulating portion of the substrate is interposed between the bulk portion of the substrate and the second graphene electrode. The second graphene electrode is disposed opposite the first graphene electrode to define an exposed substrate area therebetween.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: August 9, 2016
    Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, KARLSRUHE INSTITUTE OF TECHNOLOGY, TAIWAN BLUESTONE TECHNOLOGY LTD.
    Inventors: Phaedon Avouris, Christos Dimitrakopoulos, Damon B. Farmer, Mathias B. Steiner, Michael Engel, Ralph Krupke, Yu-Ming Lin
  • Patent number: 9413329
    Abstract: A method and system for providing a surface acoustic wave band reject filter are disclosed. According to one aspect, a surface acoustic wave band reject filter includes a substrate having electrode bars and bonding pads formed on the substrate. The filter further includes at least one die having a side facing the substrate. A plurality of surface acoustic wave resonators are formed on the at least one die formed on the substrate. Solder balls formed on a side of the at least one die facing the substrate are positioned to engage bonding pads on the substrate. The plurality of surface acoustic wave resonators collectively exhibit a band reject filter response.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: August 9, 2016
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventor: Chunyun Jian
  • Patent number: 9363897
    Abstract: Provided is a substrate with built-in electronic component including a component storage layer and two buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The two buildup layers each include an insulating layer and a via portion. The insulating layer is adjacent to the cover portion and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface. The insulating layer of one of the two buildup layers is formed to be in contact with the terminal surface and the first surface.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: June 7, 2016
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Yuichi Sugiyama, Tatsuro Sawatari, Yusuke Inoue, Masashi Miyazaki
  • Patent number: 9327969
    Abstract: Carbon nanostructures can be formed into polymer composites that are electrically conductive and highly reflective of microwave radiation, thereby facilitating transmission of the microwave radiation. Microwave transmission assemblies containing carbon nanostructures can include an elongate structure containing elongate opposing surfaces that extend the length of the elongate structure and that are spaced apart from one another with a channel region defined in between. The elongate opposing surfaces include a polymer composite containing a polymer matrix and a plurality of carbon nanostructures. Each carbon nanostructure can include a plurality of carbon nanotubes that are branched, crosslinked, and share common walls with one another.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: May 3, 2016
    Assignee: Applied NanoStructured Solutions, LLC
    Inventors: Tushar K. Shah, John Morber
  • Patent number: 9318998
    Abstract: An integrated circuit device includes a multi-port piezoelectric-on-semiconductor microelectromechanical resonator, which is configured to support independent and concurrent piezoelectric transduction of multiple resonance modes. The resonator includes a semiconductor resonator body (e.g., Si body) suspended opposite an underlying recess in a substrate. Opposite ends of the semiconductor resonator body are anchored to the substrate. The resonator body may be formed so that a plan layout view of a portion of the semiconductor resonator body is dumbbell-shaped to thereby support acoustic energy trapping of multiple high-Q resonance modes.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: April 19, 2016
    Assignee: Georgia Tech Research Corporation
    Inventors: Roozbeh Tabrizian, Farrokh Ayazi
  • Patent number: 9319800
    Abstract: An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: April 19, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seog-woo Hong, Hyung-jae Shin, Dong-sik Shim, Byung-gil Jeong, Seok-whan Chung
  • Patent number: 9246472
    Abstract: The invention relates to an acoustic volume wave resonator including a mounting, a resonating substrate, and a diaphragm. The mounting comprises an internal cavity and an internal electrode, so as to form a gap area between the internal electrode and a portion of the diaphragm. The resonating substrate is configured to generate longitudinal mode acoustic waves vibrating at the work frequency of the resonator, when an electrostatic field having a sinusoidal component at a work frequency is generated in the gap area by applying a differential voltage between the diaphragm or the first surface of the resonating substrate on the one hand and the internal electrode on the other hand.
    Type: Grant
    Filed: July 6, 2012
    Date of Patent: January 26, 2016
    Assignees: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, UNIVERSITE DE FRANCHE-COMTE
    Inventors: Bernard Dulmet, Mihaela Ivan, Sylvain Ballandras
  • Patent number: 9233833
    Abstract: A MEMS element includes: a substrate; a first electrode formed above the substrate; and a second electrode having a support portion and a beam portion, the support portion being formed above the substrate, the beam portion extending from the support portion, being formed in a state of having a gap between the first electrode and the beam portion, and being capable of vibrating in a thickness direction of the substrate. The width of the beam portion decreases with distance from a base of the beam portion toward a tip of the beam portion. The central length of the beam portion is larger than the lengths of ends of the beam portion. The width of the base of the beam portion is larger than the central length of the beam portion.
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: January 12, 2016
    Assignee: Seiko Epson Corporation
    Inventor: Ryuji Kihara
  • Patent number: 9209380
    Abstract: Embodiments described herein may provide an acoustic wave device, a method of fabricating an acoustic wave device, and a system incorporating an acoustic wave device. The acoustic wave device may include a transducer disposed on a substrate, with a contact coupled with the transducer. The acoustic wave device may further include a wall layer and cap that define an enclosed opening around the transducer. A via may be disposed through the cap and wall layer over the contact, and a top metal may be disposed in the via. The top metal may form a pillar in the via and a pad on the cap above the via. The pillar may provide an electrical connection between the pad and the contact. In some embodiments, the acoustic wave device may be formed as a wafer-level package on a substrate wafer.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: December 8, 2015
    Assignee: TriQuint Semiconductor, Inc.
    Inventors: Suzanne Combe, Kurt Steiner, Alan S. Chen, Charles E. Carpenter, Ian Yee, Jean Briot, George Grama
  • Patent number: 9169117
    Abstract: According to an exemplary embodiment, a method of forming a Micro Electro Mechanical System (MEMS) device is provided. The method includes the following operations: providing a substrate; forming a catalyst layer over the substrate; patterning the catalyst layer; forming a carbon nanotube based on the catalyst layer; forming a getter layer over the carbon nanotube and the substrate; and etching back the getter layer to expose the carbon nanotube. According to an exemplary embodiment, a method of forming a MEMS device is provided. The method includes the following operations: providing a substrate; forming a catalyst island over the substrate; heating the substrate and the catalyst island; contacting the catalyst island with a carbon-containing gas to form a carbon nanotube; forming a getter layer over the carbon nanotube and the substrate; and etching back the getter layer to expose the carbon nanotube.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: October 27, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chin-Wei Liang, Cheng-Yuan Tsai, Chia-Shiung Tsai
  • Patent number: 9154108
    Abstract: The present invention is directed towards a self-polarized capacitive micromechanical resonator apparatus and fabrication method. The apparatus includes a body member capable of retaining a polarization charge in the absence of a polarization voltage source. By creating potential wells or charge traps on the surface of the resonant body member through a nitrogen diffusing process, charges may be trapped in the charge traps. Unless perturbed externally, the charges remain trapped thus enabling a self-polarization technique without the need for any externally applied polarization voltage.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: October 6, 2015
    Inventors: Farrokh Ayazi, Ashwin Samarao
  • Patent number: 9139417
    Abstract: A high temperature micro-glassblowing process and a novel inverted-wineglass architecture that provides self-aligned stem structures. The fabrication process involves the etching of a fused quartz substrate wafer. A TSG or fused quartz device layer is then bonded onto the fused quartz substrate, creating a trapped air pocket or cavity between the substrate and the TSG device layer. The substrate and TSG device layer 14 are then heated at an extremely high temperature of approximately 1700° C., forming an inverted wineglass structure. Finally, the glassblown structure is cut or etched from the substrate to create a three dimensional wineglass resonator micro-device. The inverted wineglass structure may be used as a high performance resonator for use as a key element in precision clock resonators, dynamic MEMS sensors, and MEMS inertial sensors.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: September 22, 2015
    Assignee: The Regents of the University of California
    Inventors: Alexander A. Trusov, Doruk Senkal, Andrei M. Shkel
  • Patent number: 9123825
    Abstract: A method for fabricating an integrated circuit includes providing a semiconductor substrate with a pad layer overlying the semiconductor substrate and a photoresist layer overlying the pad layer, exposing the photoresist layer to a split laser beam to form a plurality of parallel linear void regions in the photoresist layer, and etching the pad layer and the semiconductor substrate beneath the plurality of parallel linear void regions to form a plurality of extended parallel linear void regions. The method further includes depositing a first dielectric material over the semiconductor substrate, patterning a photoresist material over the semiconductor substrate to cover a portion of the semiconductor substrate, and etching portions of the pad layer, the first dielectric material, and the semiconductor substrate. Still further, the method includes depositing a second dielectric material into the second void regions.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: September 1, 2015
    Assignee: GLOBALFOUNDRIES, INC.
    Inventors: Sven Beyer, Alexander Ebermann, Carsten Grass, Jan Hoentschel
  • Patent number: 9117934
    Abstract: A fabricated electromechanical device is disclosed herein. An exemplary device includes, a substrate, at least one layer of a high-transconductance material separated from the substrate by a dielectric medium, a first electrode in electrical contact with the at least one layer of a high-transconductance material and separated from the substrate by at least one first supporting member, a second electrode in electrical contact with the layer of a high-transconductance material and separated from the substrate by at least one second supporting member, where the first electrode is electrically separate from the second electrode, and a third electrode separated from the at least one layer of high-transconductance material by a dielectric medium and separated from each of the first electrode and the second electrode by a dielectric medium.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: August 25, 2015
    Assignee: The Trustees of Columbia University In The City of New York
    Inventors: Sami Rosenblatt, James Hone, Changyao Chen
  • Patent number: 9054673
    Abstract: A resonator fabrication method is provided. A method includes providing a plurality of electrode patterns disposed apart from each other on a substrate using a nano-imprint technique; and forming an extended electrode pattern connected to a plurality of electrode patterns, and forming a nano structure laid across an extended electrode patterns. Therefore, a nano-electromechanical system (NEMS) resonator is easily fabricated at a nanometer level.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: June 9, 2015
    Assignees: Samsung Electronics Co., Ltd., Korea University Industrial and Academic Collaboration Foundation
    Inventors: Yun-kwon Park, Byeoung-ju Ha, Byeong-Kwon Ju, Jae-sung Rieh, In-sang Song, Jin-woo Lee, Jea-shik Shin, Young-min Park
  • Patent number: 9041463
    Abstract: An amplifier system has an amplifier for amplifying a plurality of input signals from a plurality of different channels, and a plurality of demodulators each operatively coupled with the amplifier for receiving amplified input signals from the amplifier. Each demodulator is configured to demodulate a single amplified input channel signal from a single channel of the plurality of different channels. The system thus also has a plurality of filters, coupled with each of the demodulators, for mitigating the noise.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: May 26, 2015
    Assignee: Analog Devices, Inc.
    Inventor: Howard R. Samuels
  • Publication number: 20150123745
    Abstract: A MEMS/NEMS device having an adjustable frequency response comprises an array of electrostatically actuated resonators, an electrostatic actuation circuit, electrical detection means, and means adjusting the frequency response of the resonators. The device comprises resonators having a movable portion, electrically connected in series between a first biasing potential VB and a second biasing potential VB2, each resonator biased to a potential Vi between VB and VB2, depending on position in the series. The electrostatic actuation circuit comprises, for each resonator, an actuation electrode facing the movable portion, all electrodes being connected in parallel to a common control potential VIN, the actuation voltage of each resonator being equal to VIN?Vi. The detection means comprises a detection output common to all resonators, the output being connected to an output potential Vout.
    Type: Application
    Filed: November 5, 2014
    Publication date: May 7, 2015
    Inventors: Julien ARCAMONE, Gregory ARNDT