Abstract: A directional coupler having (a) a first coupled microstrip section having a first terminus (T1) and a second terminus (T2), (b) a second coupled microstrip section having a first terminus at T2 and a second terminus (T3), and (c) a first phase-velocity-compensating capacitor connected across the conductors of the microstrip sections at T2 is disclosed. The coupler also may include a second phase-velocity-compensating capacitor connected at T1, and a third phase-velocity compensating capacitor connected across the conductors at T3.

Abstract: A semiconductor integrated circuit device with a balun which is formed above a conductive semiconductor substrate and which includes a dielectric film, an unbalanced line for transmitting an unbalanced signal, and balanced lines for transmitting a balanced signal. The unbalanced line is placed opposite to the balanced lines via a nano-composite film that is a region of the dielectric film. The nano-composite film, interposed between the unbalanced line and the balanced lines, has a relative permittivity higher than that of other regions of the dielectric film. This allows suppression of electromagnetic coupling of transmission lines or passive elements other than the balun, thereby providing a semiconductor device with a wide-band and small-size balun.

Abstract: Multi-layer in integrated transmission line circuits are provided having improved signal loss characteristics. A multi-layer integrated transmission line circuit, such as a stripline circuit or a microstrip circuit, comprises at least one reference layer; at least one conducting layer having one or more conducting strips, wherein the at least one conducting layer is separated from the at least one reference layer by a substrate; and at least one additional layer positioned between the at least one conducting layer and the at least one reference layer. The multi-layer integrated transmission line circuit may also comprise a dielectric insulating material, such as an organic material or a ceramic material. The additional layers increase a dielectric thickness of the multi-layer integrated transmission line circuit to reduce dielectric losses.

Abstract: A circuit device includes a multilayer circuit carrier, a first signal transmission line, a second signal transmission line, a signal line transition element, a first impedance transformer, and a second impedance transformer. The multilayer circuit carrier includes a first layer and a second layer. The first signal transmission line is on the surface of the first layer. The second signal transmission line is on the surface of the second layer. The signal line transition element passes through the first layer and the second layer, and has a first signal terminal and a second signal terminal. The first impedance transformer is on the surface of the first layer and electrically connected between the first signal transmission line and the first signal terminal. The second impedance transformer is on the surface of the second layer and electrically connected between the second signal transmission line and the second signal terminal.

Abstract: Provided is a 3-way balun for a double balanced mixer. This research provides a 3-way balun available for a planar-type double balanced mixer and a planar-type double balanced mixer employing the same. The 3-way balun includes a first output unit for receiving and outputting an input signal of a predetermined frequency; and second and third output units connected to the first output unit and outputting signals whose phase is different by 180 from a phase of a signal of the first output unit and amplitude is a half of an amplitude of the signal outputted from the first output unit.

Abstract: A system for transmitting or receiving signals may include a dielectric substrate having a major face, a communication circuit, and an electromagnetic-energy directing assembly. The circuit may include a transducer configured to convert between RF electrical and RF electromagnetic signals and supported in a position spaced from the major face of the substrate operatively coupled to the transducer. The directing assembly may be supported by the substrate in spaced relationship from the transducer and configured to direct EM energy in a region including the transducer and along a line extending away from the transducer and transverse to a plane of the major face.

Abstract: A high-frequency transmission line having low alternate current (AC) resistance is provided. One aspect of the present invention is a high-frequency transmission line disposed along a surface of an insulating support, wherein, letting F [Hz] be the frequency of an AC electric signal transmitted by the high-frequency transmission line and Ms [Wb/m] be the saturation magnetization per unit area, the frequency value F and the saturation magnification value per unit area Ms satisfy the following expression (1): Ms?(1.5×102)/F+5.7×10?8.

Abstract: An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices.

Abstract: A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.

Abstract: The invention relates to a high-frequency transmission line including a central conductive strip (6) associated with at least one conductive shielding plane (4), wherein at least a portion of the space between the conductive plane and the conductive strip comprises a ferroelectric material (10).

Abstract: A method for reducing EM radiation comprises at least one first resonance line disposed on one of electric surfaces, which is disposed at a side of a transmission line structure on one of the electric surface. The resonance line crosses over a slot of another electric surface. The slot is etched on a corresponding electric surface. In addition, the transmission line structure crosses over the slot of the electric surface. Then, the first resonance line connects the electric surface having the slot with another electric surface. It can adjust at least one of a length, a width and a shape of the first resonance line, to make an input impedance seen from a crossed point between the transmission line structure and the slot approximately 0.

Abstract: A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction.

Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.

Abstract: According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.

Abstract: A high-frequency signal transmission line includes a body; a signal line including a first line portion provided to a first layer of the body, a second line portion provided to a second layer of the body alternately being connected; and a first ground conductor provided to the first layer or a third layer positioned on an opposite side of the second layer relative to the first layer, and also overlaid with a plurality of second line portions in planar view from a normal direction of a principal surface of the body, and also not overlaid with a plurality of the first line portions. A property impedance of the first line portion and a property impedance of the second line portion are different from each other.

Abstract: Apparatus and methods for tuning the phase of a signal communicated by an electrical conductor by adjustably varying a spacing between the electrical conductor and at least a portion of an electrically conductive ground plane that is disposed in spaced relationship with the electrical conductor.

Abstract: A waveguide of a multi-layer metal structure and a manufacturing method thereof are provided, the method including applying a plurality of metal layers on a substrate and a plurality of insulating layers respectively between the respective metal layers. Accordingly, it is possible to minimize conductive loss by dispersing current uniformly through wide regions between a signal line and ground lines.

Abstract: The invention relates to a stripeline for high-frequency signals, having a signal conductor and at least one earth conductor, both being disposed on a substrate made from an electrically insulating material. According to the invention at least one hole is made in the substrate, wherein said hole is at least partially filled with an electrically conducting material, wherein an electrically conducting connection is made from at least one earth conductor to the electrically conducting material.

Abstract: A printed circuit board includes an outer signal layer, a first ground layer, a first ground layer located below the outer signal layer, an inner signal layer located below the first ground layer, an second ground layer located below the inner signal layer, and a first differential signal transmission pair and a second differential signal transmission pair laid on the outer signal layer and the inner signal layer. A value h is equal to a distance between the inner signal layer and its closest ground layer. A distance between the first pair and the second pair is not more than h×3.

Abstract: A diplexer that can demultiplex and multiplex two signals having wide frequency bands, and a wireless communication module and a wireless communication apparatus using the same, are provided. A diplexer has a multilayer body including a first interlayer, a second interlayer and a third interlayer. On the first interlayer, first resonant electrodes are disposed in an interdigital form. On the second interlayer, a plurality of second resonant electrodes are disposed in an interdigital form. On the third interlayer, there are disposed an input coupling electrode that faces the input-stage first resonant electrode and the input-stage second resonant electrode in an interdigital form, a first output coupling electrode that faces the output-stage first resonant electrode in an interdigital form, and a second output coupling electrode that faces the output-stage second resonant electrode.

Abstract: A compact Ku band microwave diplexer configured as a three port surface mount component on a miniature alumina substrate. Input signals occurring at a common port having frequencies within a first pass band are passed to a second port while being isolated from signals occurring at a third port. Signals occurring at the third port are passed to the common port while being isolated from the signals at the second port. A microstrip dual spur line filter is used combined with open circuit stubs to provide enhanced second harmonic suppression on the transmit side, while using a coupled line microstrip filter on the receive side. This approach allows for compact size and automated component assembly through pick and place and reflow manufacturing techniques.

Abstract: A balanced-unbalanced transformer includes: a balanced transmission line including paired transmission lines; an unbalanced transmission line; and two lead transmission lines connected to two neighboring end portions of four end portions of the paired transmission lines at a right angle to the paired transmission lines, wherein one of the two lead transmission lines has a first electrode face which faces the other of the two lead transmission lines, the other of the two lead transmission lines has a second electrode face which faces the one of the two lead transmission lines, and the first electrode face and the second electrode face are electrode faces of a capacitor.

Abstract: Provided are assemblies and processes for efficiently coupling wideband differential signals between balanced and unbalanced circuits. The assemblies include a broadband balun having an unbalanced transmission line portion, a balanced transmission line portion, and a transition region disposed between the unbalanced and balanced transmission line portions. The unbalanced transmission line portion includes at least one ground and a pair of conductive signal traces, each isolated from ground. The balanced portion does not include an analog ground. The transition region effectively terminates the analog ground, while also smoothly transitioning or otherwise shaping transverse electric field distributions between the balanced and unbalanced portions. Beneficially, the balun is free from resonant features that would otherwise limit operating bandwidth, allowing it to operate over a wide bandwidth of 10:1 or greater.

Abstract: A waveguide comprises an inner conductor arranged in a first layer, a pair of outer conductors comprising a first outer conductor and a second outer conductor, and a pair of slotted shields comprising a first slotted shield and a second slotted shield. The first slotted shield and the second slotted shield are arranged in a second layer with a spacing in between to form a section of a ground shield, wherein the second layer is parallel to the first layer. The first slotted shield is connected to the first outer conductor and the second slotted shield is connected to the second outer conductor.

Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.

Abstract: A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.

Abstract: A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction.

Abstract: An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically connected together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes.

Abstract: A circuit converts a single-ended signal to differential signals that are balanced to have the same amplitudes and opposite phases. The circuit includes a balance tunable balun, a detector, and a controller. The balance tunable balun has a primary winding, a secondary winding, a control input, and a switched resistor-capacitor (RC) network. The primary winding receives the single-ended signal and the secondary winding outputs the differential signals. The control input receives a control signal and the switched RC network tunes an output imbalance of the balun responsive to this control signal. The detector detects the output imbalance and the controller generates the control signal to control the switched RC network to reduce that output imbalance. The circuit produces well balanced differential signals over a wide range of signal frequencies, even when asymmetries, process variations, or parasitic capacitance in the balun would otherwise result in imbalance.

Abstract: A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.

Abstract: The invention provides a transmission noise suppressing structure and a wiring board capable of suppressing a transmission noise transferred through a power supply line, stabilizing a power supply voltage, and reducing signal transmission line cross talk transmitted through the power supply line or a ground layer without being affected by a resistive layer. A transmission noise suppressing structure includes a power supply line and a signal transmission line arranged apart from each other on the same surface; a ground layer arranged apart from the power supply line and the signal transmission line; and a resistive layer arranged apart from the power supply line and the ground layer. The resistive layer has an area (I) which faces the power supply line and an area (II) which does not face the power supply line. The resistive layer and the signal transmission line are apart from each other.

Abstract: Techniques, apparatus and systems for a multiple pole multiple throw (MPMT) RF switch device based on composite left and right handed (CRLH) metamaterial structures.

Abstract: Intermodulation distortion (IMD) is known to be an impediment to progress in superconductor-based filter technology. The present invention's methodology for reducing IMD can open doors to heretofore unseen practical applications involving high temperature superconductor (HTS) filters. Typical inventive practice includes (a) increasing the thickness d, and/or (b) changing the operation temperature T, of the filter's HTS film. The film's thickness d is increased in such a way as to decrease the IMD power PIMD in accordance with the material-independent proportionate relationship PIMD?1/d1.5-6. The film's operation temperature T is bettered or optimized in accordance with the material-independent proportionate relationship PIMD?(?O(T))10(K(2)(T))2/(?O(T))6, and further in accordance with three individual material-dependent relationships, namely, between operation temperature T and each of linear penetration depth ?O, gap maximum ?O, and kernel K(2).

Abstract: There is provided a low loss slow wave transmission line that can be miniaturized. A slow wave transmission line of the present invention has a configuration which includes a repeated arrangement of a low impedance line and a high impedance line and in which the high impedance line is longer than the low impedance line in terms of a line length.

Abstract: A coplanar waveguide transition includes a substrate, a first coplanar waveguide on a first side of the substrate, and a second coplanar waveguide on a second side of the substrate. The coplanar waveguide transition includes a first, a second, and a third via through the substrate electrically coupling the first coplanar waveguide to the second coplanar waveguide. The coplanar waveguide transition includes voids through the substrate between the first, second, and third vias and edges of the first coplanar waveguide and edges of the second coplanar waveguide.

Abstract: For integration into a CMOS/BICMOS process, a high-frequency waveguide structure, a diode-bridge structure and an imaging/spectroscopy system and a method for manufacturing a high-frequency waveguide structure are provided, wherein a height of each of a first and a second conducting lines (11, 12) is higher than a width of each of the first and the second conducting lines (11, 12). The first and second conducting lines (11, 12) form a slotline waveguide, wherein the third conducting line (13) together with the first and the second conducting lines (11, 12) form a (co-)planar waveguide.

Abstract: A circuit device includes a substrate 11, and a transmission line 10. The transmission line 10 includes a dielectric film 13 formed on the substrate 11, and a signal line formed on the dielectric film 13. The dielectric film 13 includes a nano-composite film in which particles of a first material are dispersed in a second material.

Abstract: The invention relates to a high-frequency transmission line including a conductive tape (6) associated with a shielding surface (4) that is placed under the line structure and is divided into parallel microstrips in a direction generally orthogonal to the direction of the line, said microstrips being movable relative to the conductive tape.

Abstract: This disclosure relates to a transmission line for high performance radio frequency (RF) applications. One such transmission line can include a bonding layer configured to receive an RF signal, a barrier layer, a diffusion barrier layer, and a conductive layer proximate to the diffusion barrier layer. The diffusion barrier layer can have a thickness that allows a received RF signal to penetrate the diffusion barrier layer to the conductive layer. In certain implementations, the diffusion barrier layer can be nickel. In some of these implementations, the transmission line can include a gold bonding layer, a palladium barrier layer, and a nickel diffusion barrier layer.

Abstract: An electromagnetic field coupling structure that is used in a microwave band frequency band, includes: a laminated body in which an inner dielectric layer 23 is sandwiched and laminated between a plurality of inner conductor layers 12 and 15 which become a plurality of ground layers; a pair of outer dielectric layers 21 and 25 facing each other with the laminated body interposed therebetween; and a pair of outer conductor layers 11 and 16 facing each other with the pair of outer dielectric layers 21 and 25 interposed therebetween. The laminated body is provided with a hole S which penetrates the inner dielectric layer 23 and the inner conductor layers 12 and 15 which become the plurality of ground layers, and the inner conductor layers 12 and 15 which become the plurality of ground layers are electrically connected via a tubular metal film 3 formed on an inner wall of the hole S, whereby the pair of outer conductor layers 11 and 16 are electromagnetically coupled.

Abstract: An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically coupled together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes.

Abstract: A differential mode transmission line with a weak coupling structure is presented. The differential mode transmission line with a weak coupling structure includes a first transmission line and a second transmission line. The first transmission line includes a first wiring portion, a second wiring portion, and a third wiring portion. The second transmission line also includes a first wiring portion, a second wiring portion, and a third wiring portion. The wiring portions of the present disclosure are connected through connection portions, and the connection portions are designed as a corner structure. Due to the characteristics of the corner structure of the present disclosure, a pitch between the second wiring portions is greater than that between the first wiring portions or the third wiring portions, thereby generating a weak coupling structure to suppress common mode noises.

Abstract: A structure for a signal line has the signal line having a base, a lower insulating layer formed at an upper surface of the base, a semiconductor layer disposed along a pathway at an upper surface of the lower insulating layer, at least a part of the semiconductor layer configured to transmit a signal, an upper insulating layer formed at an upper surface of the semiconductor layer, at least a part of the upper insulating layer being mounted along the semiconductor layer; and a strip conductor formed at an upper surface of the upper insulating layer, at least a part of the strip conductor being mounted along the upper insulating layer.

Abstract: A micro-strip transmission line capable of reducing far-end crosstalk is provided. The micro-strip transmission line having a serpentine shape is capable of reducing the far-end crosstalk of the transmission line by increasing capacitive coupling between neighboring transmission lines by allowing parallel micro-strip transmission lines to have serpentine shapes. In the structure of the micro-strip transmission line having the serpentine shape, it is possible to reduce the far-end crosstalk of the transmission line by increasing capacitive coupling between neighboring transmission lines by allowing parallel micro-strip transmission lines to have serpentine shapes.

Abstract: A thermally conductive stripline RF transmission cable has a flat inner conductor surrounded by a dielectric layer that is surrounded by an outer conductor. The dielectric layer may include a base polymer and a thermally conductive material to increase a thermal conductivity of the cable. A thermal conductivity of the dielectric layer may be increased between a midsection of the inner conductor and the outer conductor. A jacket may surround the outer conductor, the jacket including a base polymer and a thermally conductive material. Additional conductors may be applied within the dielectric layer and/or in the jacket, proximate the outer conductor.

Abstract: A stripline RF transmission cable has a flat inner conductor surrounded by a dielectric layer that is surrounded by an outer conductor. A jacket with an attachment feature surrounds the outer conductor. The attachment feature may be a fin aligned parallel or normal to the inner conductor. The attachment feature may be continuous or periodic along a longitudinal extent of the cable. The attachment feature may include male and female portions dimensioned to couple with one another, enabling adjacent cables to be attached to one another.

Abstract: A stripline RF transmission cable has a generally planar inner conductor surrounded by a dielectric layer that is surrounded by a corrugated outer conductor. The corrugations may be, for example, annular or helical. The outer conductor has a top section and a bottom section which transition to a pair of edge sections that interconnect the top section with the bottom section. The top section, bottom section and the inner conductor may be provided with generally equal widths. A spacing between the inner conductor and the dielectric layer may be reduced proximate a mid section of the inner conductor. The inner conductor may also be corrugated generally normal to a longitudinal extend of the inner conductor.

Abstract: A radio frequency (RF) transition for a three dimensional molded RF structure is provided. In one embodiment, the invention relates to a radio frequency (RF) transition for an RF structure, the RF transition includes an assembly having a first flexible layer, a second flexible layer, and a third flexible layer, wherein a first section of the assembly includes a microstrip transmission line, wherein a second section of the assembly includes a dielectric stripline transmission line, and wherein a third section of the assembly includes a suspended substrate stripline transmission line.

Abstract: In some embodiments, the technology includes a balun. The balun includes an un-balanced line, a balanced line, a double-y transition section, a first connection section, and a second connection section. The un-balanced line includes a ground trace and a signal trace. The balanced line includes a first and second signal trace. The double-y transition section includes a first slot trace and a second slot trace. The first slot trace couples the ground trace of the un-balanced line to the first signal trace of the balanced line. The second slot trace couples the signal trace of the un-balanced line to the second signal trace of the balanced line. The first connection section couples the first slot trace to the first signal trace of the balanced line. The second connection section couples the second slot trace to the second signal trace of the balanced line.

Abstract: Transmission lines for electronic devices such as microstrip and stripline transmission lines may be provided that include patterned conductive lines and a conductive paint in the patterned conductive lines. The transmission lines may include one or more planar ground conductors. The ground conductors may include conductive lines arranged in a crosshatch pattern with spaces between the conductive lines. The ground conductors may also include conductive paint in spaces within the crosshatched pattern. The ground conductors may form one or more ground planes for the transmission lines.