Abstract: A transmission line structure having a pair of separated coplanar waveguide transmissions line section. A coupling circuit is coupled between the pair of coplanar waveguide transmissions line sections, the coupling circuit suppresses common mode signals therein and passes, substantially unsuppressed, differential mode signal transmission between the pair of coplanar waveguide transmissions line sections.

Abstract: The present disclosure provides an antenna and an electronic device using same. The antenna includes an antenna radiating element for radiating signals, a capacitive feed plate separated from and substantially parallel to the antenna radiating element for carrying out capacitive feed on the antenna radiating element, and a FPC antenna electrically connecting with the capacitive feed plate for feeding for the capacitive feed plate. The FPC antenna includes a plate-shaped main body, a feeding end, a ground end, an extending portion for being electrically connected with the capacitive feed plate, and a feeding strip extending vertically from the extending portion for improving the low-frequency performance of the antenna.

Abstract: A transit structure of a waveguide and a SIW is provided. According to the present invention, a SIW and a waveguide are directly connected so that when a signal is transited with a reduced loss and a signal is transmitted while satisfying a frequency band width required for an automotive radar. Further, signal transmission characteristic at every frequency in a bandwidth may be uniformly maintained. Further, an additional dielectric substrate is not required so that a reduced size, a reduced weight, and a reduced cost may be achieved and a process of bonding different substrates is not required.

Abstract: An antenna module having a side-edge balance-to-unbalance (BALUN). The antenna module may include a flexible substrate with one or more layers that may be configured to receive one first and second conductive patterns, the substrate may have opposed first and second ends which may define a longitudinal length and/or opposed side edges situated between the first and second ends. The first conductive pattern may form an antenna loop situated adjacent to the first end of the flexible substrate and be suitable for transmitting or receiving signals at one or more frequencies. The second conductive pattern may form at least part of the BALUN and may include one or more of a center portion, side portions which may extend from the center portion at opposite sides of the center portion, and electrically neutral slots situated between a corresponding side portion and the center portion.

Abstract: A signal splitter for creating at least two symmetrical equal-power signals from an input signal for use in an amplifier device includes at least one input terminal pair and at least two output terminal pairs. A primary conductor structure supplied from the at least one input terminal pair is provided for induction of a current flow in at least two secondary conductor structures each connected to an output terminal pair of the at least two output terminal pairs and the at least two secondary conductor structures. A center of a conductor length of each of the at least two secondary conductor structures is connected to ground, and the primary conductor structure and the at least two secondary conductor structures are realized as conductor tracks applied to a printed circuit board.

Abstract: Openings are formed by removing part of a ground conductor, and a differential signal line including signal line conductors is configured with some of the openings. In addition, a metal block is mounted thereon to cover the opening to thus configure a waveguide using the metal block and ground conductor as wall surfaces. A planar circuit to waveguide transition according to the above can achieve traveling wave conversions from a waveguide mode to a slot mode, and from the slot mode to a differential mode without utilizing resonance, which makes it possible to align a dominant direction of an electric field by the three ones; thus, a wider bandwidth can be expected. Thus, the wider bandwidth can be achieved with a simple layer structure.

Abstract: In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.

Abstract: This topic is related to a waveguide propagation apparatus, converting microstrip propagation to waveguide propagation, providing hermeticity on the mounting area, eliminating the cabling component causing degradation on the overall performance, involving at least a microwave module (2), and comprising a combination of a base part (3) and a cover part (4).

Abstract: A balun structure comprises an unbalanced input terminal, a first planar coil connected to the unbalanced input terminal, a second planar coil connected to the first planar coil, a third planar coil stacked in relation to the first planar coil, a first balanced output terminal connected to the third planar coil, a fourth planar coil stacked in relation to the second planar coil, and a second balanced output terminal connected to the fourth planar coil, wherein a first length of the first planar coil and a third length of the third planar coil differ by one twelfth to one twentieth of an operational wavelength and a second length of the second planar coil and a fourth length of the fourth planar coil differ by one twelfth to one twentieth of the operational wavelength.

Abstract: According to an embodiment, a circuit board includes a signal line including at least portion of a first conductive layer that has a first portion extending over a cavity in the circuit board from a first side of the cavity. The circuit board also includes a first plurality of conductive vias surrounding the cavity and the first plurality of vias include at least one blind via disposed adjacent to the first side of the cavity.

Abstract: A high frequency module includes: a semiconductor chip provided over a first surface side of a resin layer; a first waveguide provided over the first surface side of the resin layer and sealed together with the semiconductor chip by a resin; a wire provided over a second surface side of the resin layer and electrically coupled to the semiconductor chip and extending to a position of the first waveguide; a second waveguide bonded to the first waveguide; and a metal plate provided over the first surface side of the resin layer at a position opposite to the first waveguide and electrically coupled to the wire, wherein a part of the wire extending to the position of the first waveguide serves as an antenna coupler.

Abstract: A Marchand balun has a primary transmission line with a width smaller than the two secondary transmission lines. The two secondary transmission lines also have different widths and lengths. This arrangement provides an imbalance between the widths and lengths of the transmission lines. It has been found that this imbalance can enable improved amplitude unbalance and phase unbalance.

Abstract: Disclosed is an insulation circuit comprising: a first pattern formed on a first layer of a substrate, that receives high-frequency signals; a second pattern formed on this first layer next to the first pattern and that outputs the high-frequency signals received by the first pattern; a third pattern formed on a second layer different from the first layer of the substrate and connected with a signal ground, in such a way that the first and second patterns respectively overlap in plan view; and a fourth pattern formed on the second layer next to the third pattern and connected with a frame ground, in such a way that the first and second patterns respectively overlap in plan view.

Abstract: A compact microstrip to waveguide dual coupler transition includes a multilayer printed circuit board configured with a rectangular region on an upper surface of the multilayer printed circuit board, wherein the rectangular region has a pair of long edges and a pair of short edges; a transition probe configured on the upper surface of the multilayer printed circuit board, wherein a terminal of the transition probe extends into the rectangular region through a long edge of the rectangular region, and another terminal of the transition probe is electrically connected to a power amplifier; a first coupler probe configured on the upper surface of the multilayer printed circuit board, wherein a terminal of the first coupler probe extends into the rectangular region; and a second coupler probe configured on the upper surface of the multilayer printed circuit board, wherein a terminal of the second coupler probe extends into the rectangular region.

Abstract: A transition (100, 300) from microstrip to waveguide, the waveguide comprising first (120) and second (105, 105?, 105?) interior surfaces connected by side walls (115, 116) whose height (h1, h2, h3) is the shortest distance between said interior surfaces, and a microstrip structure (130, 135, 110) extending into the closed waveguide (105). The microstrip structure comprises a microstrip conductor (130, 135) on a dielectric layer arranged on said first interior surface. The microstrip conductor (130, 135) comprises and is terminated inside the closed waveguide by a patch (135). The height (h1) of the side walls (115, 116) along the distance that the microstrip conductor (130, 135) extends into the closed waveguide (105) being less than half of the greatest height (h3) beyond the microstrip structure's protrusion into the closed waveguide (105).

Abstract: A monolithic antenna element comprises a microstrip patch antenna and a ground plane, with a substrate between the patch antenna and the ground plane. A feeding via extends from the ground plane layer through the substrate to the patch antenna, connecting to the antenna distal from lateral edges of the antenna. A coplanar waveguide (CPW) feed line is formed in the ground plane layer, and interrupts and is electrically distinct from the ground plane. The CPW extends from a lateral edge of the ground layer to the feeding via. The antenna can be flip chip bonded to a CMOS die, reducing cost of millimeter wave transceivers, e.g. 57-64 GHz. The antenna is fabricated using standard PCB technology and a single substrate for the antenna. Antenna arrays can be fabricated. Appropriately designed antenna feeds, flip chip interconnects and antenna shape provide suitably broad antenna bandwidth, with relatively high efficiency.

Abstract: An antenna apparatus comprises a lower assembly and an upper assembly, which together forming a cavity to contain an RF circuit device. The upper assembly comprises a waveguide flange interface at an external surface of the upper assembly. The waveguide flange interface comprises a waveguide channel extending from the external surface to an internal surface forming a surface of the cavity. An opening of the waveguide channel at the internal surface is substantially centered about a first centerline of the upper assembly parallel with the external surface and offset from a second centerline of the upper assembly parallel with the external surface, whereby the second centerline perpendicular is to the first centerline. The upper assembly is removably attachable to the lower assembly in either of a first orientation or a second orientation, whereby the second orientation represents a 180 degree rotation of the upper assembly relative to the first orientation.

Abstract: A coupling arrangement for the transfer of a microwave signal includes a motherboard having a first substrate with a first microstrip conductor, and a module having a second substrate with a second microstrip conductor. The module is attached to the motherboard such that the motherboard conductor by means of a connection is in electrical contact with the module conductor, whereby the microwave signal may be transferred between the motherboard conductor and the module conductor. The connection includes the motherboard conductor connected to a substrate integrated waveguide on the motherboard, which substrate integrated waveguide is connected to the module conductor via a slot coupling.

Abstract: An adaptor for connecting a microstrip line and a waveguide is disclosed that includes a microstrip line part and a waveguide part. The microstrip line part includes a microstrip port pattern and a patch pattern on an upper portion of a substrate, where the patch pattern is joined to an end portion of the microstrip port pattern. The waveguide part includes a waveguide hole, for transferring a signal provided from the patch pattern; a channel hole, which is formed in an area for joining with the microstrip line part, is formed along a first direction orthogonal to a direction of the waveguide hole in correspondence to the microstrip port pattern, and is connected with the waveguide hole; and a stub hole, which is connected with the waveguide hole and is formed in an area for joining with the microstrip line part along a second direction opposite to the first direction.

Abstract: Provided is a transmission line transformer having increased signal efficiency. The transmission line transformer is formed on an integrated circuit (IC), wherein a first transmission line disposed in one direction. Second and third transmission lines have same length direction as the first transmission line and are spaced apart from each other in a lateral direction above or below the first transmission line. Accordingly, an area of the first transmission line and areas of the second and third transmission lines, which face each other, are increased, thereby improving a coupling factor. Also, since a secondary transmission line is divided into two regions and uses the second and third transmission lines that have narrower widths than the first transmission line, parasitic capacitance components generated between the first through third transmission lines and a semiconductor substrate may be decreased.

Abstract: A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mmWave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss.

Abstract: An antenna apparatus comprises a substrate with a microstrip-to-waveguide transition comprising a microstrip feedline extending between a first terminal point and a second terminal point at a first metal layer and comprising a microstrip element and a probe element. The microstrip element includes a connection segment extending from the first terminal point to a second point, a taper segment extending from the second point to a third point, and a continuous-width segment extending from the third point to a fourth point. The probe element extends from the fourth point to the second terminal point and has a width which is narrower than the continuous-width segment. The substrate further includes a waveguide opening comprising a region surrounding the probe element and includes a plurality of metal vias disposed at the perimeter of the waveguide opening and which extend from the first metal layer to the second metal layer.

Abstract: An electric transformer device (balun) is formed on a support plate having a first base face and an opposite second base face. The balun includes a first port (40) connectable to an electrical line for a differential signal and a second port connectable to an electrical line for a single-ended signal. A first printed conductive track is associated to the first base face of the support plate for connecting the first port to the second port. A printed conductive path is associated to the second base face of the support plate for connecting the first port to the second port. The printed conductive path is formed of a symmetric second and third printed conductive tracks.

Abstract: A waveguide converter includes a waveguide including a hollow section through which a signal is transmitted and a first opening formed on a cross section of the hollow section in a direction orthogonal to a transmission direction of the signal, and a circuit board including on a same surface a signal line, a conductor patch connected to the signal line, and a second opening surrounding the conductor patch. The waveguide is fixed onto the circuit board. The first opening surrounds the second opening. The conductor patch includes a rectangular section which has short sides in parallel with short sides of the first opening, and has a first long side and a second long side connected to the signal line in parallel with long sides of the first opening, and protruding portions which are provided so as to touch the short sides near both ends of the second long side, respectively.

Abstract: There is provided a differential mode amplifier driving circuit, including: a first port having one end connected to a single signal; a second port having one end connected to a differential signal; a first transmission line having one end grounded; and a third port having one end connected to the first transmission line and the other end connected to the differential signal.

Abstract: A compact endfire tapered slot antenna, which may be advantageously printed on a low permittivity Liquid Crystal Polymer substrate. The antenna features a microstrip-to-slot transition, in which the matching stubs of the slotline antenna feed and the microstrip input line are collinear. This is achieved using a 90° bend in the slotline. The antenna is consequently of smaller size, and has improved bandwidth over prior art geometries. The antenna may be carried on a fork-shaped metallic carrier, which gives it good rigidity, and may incorporate a metallic reflector, which increases its directive gain. The antenna is simpler to manufacture and a less costly alternative to conventional 60-GHz tapered slot antennas printed on multilayer LTCC substrates. It can be used both as an individual radiator as well as an element of an antenna array and is readily integrated with an RF module for use in future WPAN applications.

Abstract: A connecting structure of a waveguide converter includes a circuit substrate in which a hollow waveguide that propagates a high frequency signal is formed in a pierced manner; and an antenna substrate that is layered on the circuit substrate, and in which a converter that is arranged at a connecting point with the hollow waveguide and a strip line that extends from the converter and that propagates the high frequency signal are provided. A choke circuit to shield a leak of the high frequency signal is arranged around the hollow waveguide on a surface of the circuit substrate opposing to the antenna substrate so as to surround the hollow waveguide keeping a predetermined interval from the hollow waveguide, and the circuit substrate and the antenna substrate are fixed to each other by adhesive that is arranged at a position outside the choke circuit, between the substrates.

Abstract: Provided is a coaxial waveguide converter and a ridge waveguide that are insusceptible to manufacturing variances over a broad bandwidth. The coaxial waveguide converter includes a ridge waveguide (10) including a ridge (11) and a coaxial line (20). A projection (12) projecting toward a side of a waveguide space (13) is provided in the ridge (11), an amount of projection of the projection (12) decreases gradually from an end surface of the ridge waveguide (10) on a side of the coaxial line along a waveguide direction and an inner conductor (21) of the coaxial line (20) is inserted in the through-hole (14) at a position displaced from a center of the ridge waveguide (10) in a direction perpendicular to a direction in which the projection (12) projects in the end surface of the ridge waveguide (10) on the side of the coaxial line.

Abstract: Disclosed is a balun circuit using defected ground structure. The balun circuit using a defected ground structure includes: a substrate; a ground surface formed on one surface of the substrate, the ground surface being formed with defect structure in a previously set shape; and two transmission lines formed on the other surface of the substrate opposing the ground surface, and separated from each other, and the defect structure of the ground surface is configured to have open circuit impedance characteristics, and one of the two transmission lines is grounded. An even mode signal is removed by using the defect ground structure having the open circuit impedance characteristics, and termination of total reflection characteristics is performed by using the grounding of one of the transmission lines. Accordingly, a balun circuit can be obtained which is small in size, has little loss at high frequency, and shows little change in characteristics due to the process error.

Abstract: A laminated waveguide diplexer includes an upper conductive layer having a first slot and a second slot; a first line crossing over the first slot; a first shielding conductor disposed over the first line; a plurality of first conductive pillars connecting the upper conductive layer and the first shielding conductor; a second line crossing over the second slot; a second shielding conductor disposed over the second line; and a plurality of second conductive pillars connecting the upper conductive layer and the second shielding conductor.

Abstract: A high frequency line-waveguide converter is provided which includes a first substrate including a first dielectric layer, a first conductive layer formed on a surface of the first dielectric layer, and a conductive pattern formed on the surface of the first dielectric layer that surrounds the second conductive layer. An antenna formed on a bottom surface of the first dielectric layer at a fixed interval from the second conductive layer. The high frequency line-waveguide converter also includes a second substrate including a third conductive layer and a fourth conductive layer separated by a second dielectric layer. An adhesion layer formed between the first substrate and second substrate, a shield conductive part formed by multiple vias between the conductive pattern and the fourth conductive layer, and a conductive waveguide in contact with the fourth conductive layer.

Abstract: A millimeter wave transmission device, the millimeter wave transmission device with (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.

Abstract: Apparatus for identifying a communicating mobile terminal comprises an electromagnetic coupling device, an ultra-wide-band radio subsystem and a monitoring subsystem. The electromagnetic coupling device defines an exclusive zone for electromagnetic coupling between the device and the communicating mobile terminal, The ultra-wide-band radiofrequency subsystem simulates the availability to communicate with the mobile terminal of at least one base station of a telecommunication network. The monitoring subsystem recognizes a unique digital signature of the communicating mobile terminal implementing samples of an electromagnetic trace of a message sent by the mobile terminal in attempt to connect to a simulated base station.

Abstract: A balance filter includes an unbalanced terminal, a first balanced terminal, a second balanced terminal, a ground terminal, an unbalanced-side coupling coil, a balanced-side coupling coil electromagnetically coupled to the unbalanced-side coupling coil, and an unbalanced-side capacitor. The unbalanced-side capacitor, the unbalanced-side coupling coil, and a portion of the balanced-side coupling coil define an LC parallel resonant circuit. A first end of the balanced-side coupling coil is a terminal having the same polarity as that of a first end of the unbalanced-side coupling coil. A second end of the unbalanced-side coupling coil is connected to the first end of the balanced-side coupling coil.

Abstract: Ultra-wideband 180° hybrids for feeding a radiator of one band of a dual-band dual-polarization cellular basestation antenna are disclosed. The hybrid comprises: metal plates configured in parallel as groundplanes, and a dielectric substrate disposed between plates. First and second metallizations are implemented on opposite exterior surfaces of substrate and are shorted together to keep metal tracks at same potential to form conductor. Plates and first and second metallizations form first stripline circuit implementing matched splitter with short-circuit shunt stub Sum input port is provided at one end and two output ports are provided at opposite ends. Branches of matched splitter narrow to provide gap between output tracks. Third metallization is disposed within substrate. First, second and third metallizations form second stripline circuit. Tracks of third metallization comprise quarter-length transformers of different widths.

Abstract: Embodiments of the present invention relate to the technical field of RF circuits, and in particular, to a balun. In an embodiment of the present invention, a balun is provided which comprises at least two coaxial cables, each of which is wound into at least one loop, and the inner and outer conductors of one end of all coaxial cables are connected respectively to each other and the inner and outer conductors of the other end are also connected to each other. The novel balun according to the embodiments of the present invention has a small size but a large power capacity and low cost, and can be used in a magnetic field environment.

Abstract: An unbalanced-balanced conversion circuit element includes an inductor connected in series between an unbalanced terminal and a first balanced terminal. The first balanced terminal side of the inductor is grounded via a capacitor. A capacitor is connected in series between the unbalanced terminal and a second balanced terminal. An inductor is connected between the first balanced terminal side of the inductor and the second balanced terminal side of the capacitor. In a laminate defining the unbalanced-balanced conversion circuit element, the capacitor is spaced far from a mounting surface of the laminate in comparison with other circuit elements.

Abstract: A waveguide includes: a waveguide portion including a first surface and a second surface that are opposed to each other; a first transmission line provided on the first surface of the waveguide portion; a second transmission line provided on the second surface of the waveguide portion; and a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.

Abstract: A multi-layer circuit board with a waveguide to microstrip transition structure includes a laminated structure having a plurality of dielectric layers, a top metal frame disposed over the laminated structure, a microstrip line disposed over the laminated structure, a bottom metal frame underlying the laminated structure, and a plurality of conductors electrically connecting the top metal frame and the bottom metal frame. The top metal frame defines a top cavity, the bottom metal frame defines a bottom cavity corresponding to the top cavity, and the microstrip line extends into the top cavity. The laminated structure includes an upper dielectric layer and at least one lower dielectric layer, wherein top cavity exposes a top surface of the upper dielectric layer, and the bottom cavity exposes a bottom surface of the at least one lower dielectric layer.

Abstract: A waveguide/planar line transducer of the present invention includes a waveguide that transmits electromagnetic waves through an opening portion, and a multiplayer substrate that includes a plurality of conductive layers.

Abstract: According to the invention there is provided a balun including: a slotline which is coupled to an input line and an output line, in which at least a portion of the slotline is sandwiched between a first and a second layer of dielectric material.

Abstract: A balun transformer includes an unbalanced terminal, two balanced terminals, a directional coupler, a low pass filter, and a high pass filter. The directional coupler includes first, second, third and fourth terminals. The first terminal is connected to the unbalanced terminal. A predetermined phase difference exists between the output signal of the second terminal and the output signal of the third terminal. The second terminal is connected to the first terminal by a line constituting the directional coupler. The low pass filter is connected between the second terminal and one of the balanced terminals. The high pass filter is connected between the third terminal and the other balanced terminal.

Abstract: A measuring bridge (1) provides a first matching pad (2), a second matching pad (3) and a third matching pad (4), wherein all matching pads (2, 3, 4) comprise at least three resistors (21, 22, 23, 31, 32, 33, 41, 42, 43) which are arranged in a T-structure. A second resistor (32) of the second matching pad (3) is connected to a second resistor (22) of the first matching pad (2), and a third resistor (43) of the third matching pad (4) is connected to a third resistor (23) of the first matching pad (2). A second resistor (42) of the third matching pad (4) can be connected to a device under test (7). A third resistor (33) of the second matching pad (3) can be connected to a calibration standard (5), and a first resistor (31, 41) of the second and the third matching pad (3, 4) are connected in each case to a signal input of an element (11) which suppresses a common-mode component on its two signal inputs.

Abstract: Provided are a new connection structure connecting a high frequency circuit and a waveguide which allows a substrate opening size to be made common without causing deterioration of a transmission line conversion characteristic, and a manufacturing method of the connection structure. The connection structure includes a module substrate (1) on which the high frequency circuit (11) is mounted and a transmission line conversion means (9, 7) is provided between the high frequency circuit and the waveguide (3), a waveguide conductor (8) in which the waveguide is formed, and a mother substrate (2) which is provided on the waveguide conductor and includes an opening having a size larger than an opening size (d) of the waveguide, and the module substrate is fixed to the mother substrate so as to cover the opening of the mother substrate and a choke is formed utilizing a space among the module substrate, the mother substrate, and the waveguide conductor.

Abstract: Various embodiments may provide a monolithic transformer for a radio frequency (RF) power amplifier module, such as a microwave frequency power amplifier module. The transformer may include a plurality of pairs of edge-coupled transmission lines, with individual pairs including first and second edge-coupled transmission lines. The first transmission lines may include first ends coupled with one another and second ends coupled with an input terminal of the transformer. The second transmission lines may include first ends coupled with the input terminal and second ends coupled with an output terminal of the transformer. The transformer may pass a communication signal from the input terminal to the output terminal, and provide a first impedance at the input terminal and a second impedance at the output terminal. The second impedance may be higher than the first impedance (e.g., by a factor of four).

Abstract: A distributed differential coupler, including a first conductive line and two second conductive lines coupled to the first one, each second conductive line including two conductive sections electrically in series, their respective junctions points being intended to be grounded.

Abstract: A waveguide coupling, in particular for a radar level indicator having a waveguide, a carrier plate and at least one feed line, wherein the waveguide is placed on a first side of the carrier plate on the carrier plate, the feed line is guided on and/or in the carrier plate into the inner area of the waveguide and the feed line terminates with an end in the inner area of the waveguide. The carrier plate is continuous in the inner area of the waveguide and thus extends beyond the end of the feed line, an electrically conductive coupling element is arranged near the end of the feed line on and/or in the carrier plate, so that the coupling element is capacitively coupled with the feed line and the coupling element serves to couple electromagnetic waves led into the waveguide via the feed line in the waveguide.

Abstract: A balun includes an input port, a first output port, a second output port and a coupling microstrip group including an input line connected to the input port, a first output line connected to the first output port, a first coupling line, a second output line connected to the second output port and a second coupling line. The input line includes a first coupling section connected to the input port, a second coupling section opposite to the first coupling section and a connecting section connected between the first coupling section and the second coupling section. An unbalanced signal is transformed into a first balanced signal via coupling among the first coupling section, the first output line and the first coupling line. An unbalanced signal is transformed into a second balanced signal via coupling among the second coupling section, the second output line and the second coupling line.

Abstract: A semiconductor device has an RF balun formed over a substrate. The RF balun includes a first conductive trace wound to exhibit inductive properties with a first end coupled to a first terminal of the semiconductor device and second end coupled to a second terminal of the semiconductor device. A first capacitor is coupled between the first and second ends of the first conductive trace. A second conductive trace is wound to exhibit inductive properties with a first end coupled to a third terminal of the semiconductor device and second end coupled to a fourth terminal of the semiconductor device. The first conductive trace is formed completely within the second conductive trace. The first conductive trace and second conductive trace can have an oval, circular, or polygonal shape separated by 50 micrometers. A second capacitor is coupled between the first and second ends of the second conductive trace.

Abstract: A band-pass filter has a plurality of frequency band channels each including a first inductor having a first terminal coupled to a first balanced port and a second terminal coupled to a second balanced port. A first capacitor is coupled between the first and second terminals of the first inductor. A second inductor has a first terminal coupled to a first unbalanced port and a second terminal coupled to a second unbalanced port. The second inductor is disposed within a first distance of the first inductor to induce magnetic coupling. A second capacitor is coupled between the first and second terminals of the second inductor. A third inductor is disposed within a second distance of the first inductor and within a third distance of the second inductor to induce magnetic coupling. A second capacitor is coupled between first and second terminals of the third inductor.