Connectors And Interconnections Patents (Class 333/260)
  • Patent number: 12107309
    Abstract: An impedance matching device includes a first dielectric substrate; a first transmission line circuit; a first conductive pad which extends toward the first transmission line circuit on the first dielectric substrate to at least partially vertically overlap the first transmission line circuit: a first reference potential layer; and a first matching load which is electrically connected to the first conductive pad and has a first resistance. An area where the first conductive pad vertically overlaps the first transmission line circuit has a size configured such that a load reactance associated with the first transmission line circuit is equal to or less than a predetermined threshold and an absolute value of a difference between a load resistance associated with the first transmission line circuit and the first resistance is equal to or less than a predetermined resistance threshold.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: October 1, 2024
    Assignee: Outdoor Wireless Networks LLC
    Inventor: Fusheng Lv
  • Patent number: 12107310
    Abstract: A mode converter which converts between a mode of a post-wall waveguide and a mode of a line in which a strip-shaped conductor is formed on another substrate different from a substrate of the post-wall waveguide, is less likely to cause a transmission failure resulting from a change in environmental temperature. A mode converter (10) includes: a post-wall waveguide (PW) in which an opening (121) is provided in a wide wall (conductor layer 12); a dielectric substrate (15) having a main surface on which a strip-shaped conductor (16) is formed; and a joining member (solder 18) joining the wide wall (conductor layer 12) and the substrate (15), wherein in a plan view, the opening (121) and the strip-shaped conductor (16) overlap each other.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: October 1, 2024
    Assignee: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Patent number: 12107314
    Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: October 1, 2024
    Assignee: Intel Corporation
    Inventors: Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing, Henning Braunisch, Diego Correas-Serrano
  • Patent number: 12089357
    Abstract: An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package.
    Type: Grant
    Filed: October 3, 2022
    Date of Patent: September 10, 2024
    Assignee: TE CONNECTIVITY SOLUTIONS GmbH
    Inventors: Christopher William Blackburn, Jeffery Walter Mason, Nathan Lincoln Tracy, Clarence Leon Yu, Michael David Herring
  • Patent number: 12080936
    Abstract: An AESA (Active Electronically Scanned Array), including: a PCB (Printed Circuit Board) substrate having an obverse surface; TRMs (Transmit/Receive Modules) disposed on the obverse surface; thermal pedestals wherein each thermal pedestal includes a wall, having a wall height, including wall surfaces and one of the wall surfaces being a contact surface; and a TIM (Thermal Interface Material), having a TIM height, disposed between a respective contact surface of the thermal pedestals and the obverse surface. A plurality of the thermal pedestals are physically interconnected, the TIM is electrically and thermally conductive, and the wall height plus the TIM height is sufficient to suppress resonances of the TRMs below a frequency greater than a Tx and Rx frequency band of the TRMs.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: September 3, 2024
    Assignee: Hughes Network Systems, LLC
    Inventors: Michael Buckley, Tom Walter, Lal Mohan Bhowmik, Varada Rajan Komanduri
  • Patent number: 12068519
    Abstract: Disclosed are non-linear transmission lines using ferromagnetic materials to generate ferromagnetic resonance oscillations. In one aspect, a non-linear transmission line apparatus is disclosed. The apparatus includes an outer conductor having a first side and a second internally facing side, and an inner conductor positioned internal to the non-linear transmission line apparatus. The apparatus further includes a ferromagnetic material surrounding the inner conductor, wherein the ferromagnetic material comprises nanoparticles of an ?-polymorph of iron oxide expressed as ?-Fe2O3. The apparatus also includes a first dielectric material positioned between the outer conductor and the inner conductor, the dielectric material in contact with both the ferromagnetic material and with the second internally facing side of the outer conductor, wherein the outer conductor, the inner conductor, the dielectric material and the ferromagnetic material form the nonlinear transmission line.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: August 20, 2024
    Assignee: LAWRENCE LIVERMORE NATIONAL SECURITY, LLC
    Inventors: Joseph Devin Schneider, Alexander Adrian Baker, Jinkyu Han, Lars F. Voss
  • Patent number: 12068515
    Abstract: The present invention relates to a cavity filter and a connecting structure included therein.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: August 20, 2024
    Assignee: KMW INC.
    Inventors: Nam Shin Park, Joung Hoe Kim, Sung Ho Jang
  • Patent number: 12065263
    Abstract: A charge dissipation plate for aircraft electronic systems having a metal plate with machined through openings. A collar is integrally formed with each through opening. The collar extends upwardly from the plane of the plate and includes a threaded outer surface for receiving an electronic connector.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: August 20, 2024
    Assignee: Impcross Ltd
    Inventor: Martin Phelps
  • Patent number: 12068520
    Abstract: A coaxial microstrip line conversion circuit includes a housing part including a protrusion protruding into the interior, a microstrip line substrate, a coaxial line including central and ground conductor parts, and a solder layer. The microstrip line substrate includes a microstrip line, a dielectric body having a recess cut into a lower surface, and a ground conductive part bent along the cut surface. The microstrip line substrate is mounted to a bottom surface of the housing part so that the recess and the protrusion fit together. A vertical distance between a lowest position of the ground conductor part facing the central conductor part and a ground surface of the ground conductive part adjacent to the cut surface is less than a vertical distance between the lowest position and a ground surface of the ground conductive part adjacent to a region of the dielectric body where the recess is not provided.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: August 20, 2024
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION
    Inventor: Yasuaki Asahi
  • Patent number: 12057624
    Abstract: A vehicle pane includes a first substrate, at least one antenna structure and a connection region, wherein the antenna structure is arranged on a flexible film, wherein, additionally, a first line region is provided on the flexible film, wherein the connection region is arranged on a carrier, wherein, additionally, a second line region is provided on the carrier, wherein the flexible film has a first contact region and the carrier has a second contact region for the reciprocal connection of the first line region to the second line region, wherein the flexible film is routed around one end of the first substrate.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: August 6, 2024
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Varun Ramesh Kumar, Guillaume Francois, Thomas Holtstiege
  • Patent number: 12034232
    Abstract: An antenna module includes a dielectric substrate, a radiation electrode, a ground electrode, and a current-interrupting element. The radiation electrode is disposed in a layer of the dielectric substrate, and the ground electrode is disposed in another layer of the dielectric substrate. The current-interrupting element is electrically connected to the ground electrode. The current-interrupting element is configured to interrupt a current flowing through the ground electrode. The current-interrupting element has a first edge portion electrically connected to the ground electrode and a second edge portion left open and includes a planar electrode parallel to the ground electrode. The dimension of the current-interrupting element in the direction from the first edge portion to the second edge portion is about ?/4, where ? is the wavelength of a radio-frequency signal radiated from the radiation electrode.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: July 9, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryo Komura, Yoshiki Yamada
  • Patent number: 12027740
    Abstract: The present invention relates to a cavity filter.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: July 2, 2024
    Assignee: KMW INC.
    Inventors: Nam Shin Park, Joung Hoe Kim, Sung Ho Jang
  • Patent number: 12028968
    Abstract: Provided is an example of a technology capable of accurately controlling impedance. Provided is a substrate including a first through hole that penetrates a substrate from a first face to a second face of the substrate, and is electrically connected to a transmission line through which a signal is transmitted, a second through hole that is provided adjacent to the first through hole in plan view of the substrate, penetrates the substrate from the first face to the second face, and is electrically connected to a ground, and an adjustment unit that adjusts a distance between the first through hole and the second through hole in plan view of the substrate to adjust an impedance of a connection end of the first through hole with the transmission line.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: July 2, 2024
    Assignee: SONY GROUP CORPORATION
    Inventor: Takahiro Shinojima
  • Patent number: 12018366
    Abstract: A substrate processing apparatus includes a processing chamber configured to accommodate a substrate, an injector, including a first connection port and a second connection port, wherein an inside of the injector communicates with an inside of the processing chamber, an exhaust pipe configured to exhaust the inside of the processing chamber, a source gas introducing pipe, connected to the first connection port, and configured to introduce a source gas into the injector, a cleaning gas introducing pipe configured to introduce a cleaning gas into the injector through one of the first connection port and the second connection port, and a vent pipe, connecting the exhaust pipe and the other of the first connection port and the second connection port, and configured to exhaust the inside of the injector.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: June 25, 2024
    Assignee: Tokyo Electron Limited
    Inventors: Shingo Hishiya, Sung Duk Son
  • Patent number: 12015185
    Abstract: Techniques regarding quantum transducers are provided. For example, one or more embodiments described herein can include an apparatus that can include a superconducting microwave resonator having a microstrip architecture that includes a dielectric layer positioned between a superconducting waveguide and a ground plane. The apparatus can also include an optical resonator positioned within the dielectric layer.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: June 18, 2024
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Abram L Falk, Chi Xiong, Swetha Kamlapurkar, Hanhee Paik, Jason S. Orcutt
  • Patent number: 12010790
    Abstract: A high-frequency circuit including a circuit board which bears at least one electronic component and a conductor structure, and including a waveguide structure manufactured separately from the circuit board. The waveguide structure is positioned on the circuit board in such a way that high-frequency signals are transferable between the conductor structure on the circuit board and the waveguide structure. The waveguide structure is held with the aid of press-fit pins on the circuit board.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: June 11, 2024
    Assignee: ROBERT BOSCH GMBH
    Inventors: Christian Hollaender, Klaus Baur, Gustav Klett, Klaus Voigtlaender, Michael Schoor, Ronny Ludwig
  • Patent number: 11967792
    Abstract: A coaxial connector includes a base surface; a coaxial structure where a dielectric is between a central conductor and an outer conductor; and a protrusion protruding from the base surface. The central conductor includes a contact portion protruding from the base surface. In response to a substrate being inserted toward the base surface between the contact portion and the protrusion, the contact portion comes into contact with a conductor pattern formed on a surface of the substrate. The outer conductor includes a protruding conductor protruding from the base surface and not in contact with the substrate inserted between the contact portion and the protrusion.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: April 23, 2024
    Assignees: AGC Inc., AGC GLASS EUROPE, AGC FLAT GLASS NORTH AMERICA, INC., AGC Vidros do Brasil Ltda.
    Inventor: Yoshiyuki Ikuma
  • Patent number: 11949195
    Abstract: A floating connector and an assembly thereof are provided. The floating connector includes: a center conductive pin; an insulating seat which surrounds the center conductive pin; a mating side conductive shell which surrounds an outer periphery of the insulating seat; a movable conductive shell which is movably received in mating side conductive shell; an elastic element which elastically abuts against an upper end of the movable conductive shell; and an inner conductive shell which is interposed between the elastic element and the center conductive pin; the inner conductive shell has a fixing portion and a movable contacting portion, the fixing portion snaps on one of the mating side conductive shell and the movable conductive shell; the movable contacting portion slideably elastically abuts against the other of the mating side conductive shell and the movable conductive shell.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: April 2, 2024
    Assignee: Molex, LLC
    Inventor: Feng Chen
  • Patent number: 11942673
    Abstract: A signal processing device may include a feeding apparatus having a first conductor configured to transmit a radio frequency signal; an insulating medium covering the first conductor; and a second conductor covering the insulating medium. The conductor may have first, second, and third portions. The third portion of the first conductor may be configured to be connected to the target apparatus to feed the radio frequency signal to the target apparatus and configured to form a capacitive impedance with the target apparatus, and the second portion of the first conductor may be configured to form an inductive impedance with the target apparatus. An absolute value of a sum of the capacitive impedance and the inductive impedance may be less than or equal to a preset impedance threshold.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: March 26, 2024
    Assignee: CommScope Technologies LLC
    Inventors: Jianpeng Lu, Hangsheng Wen
  • Patent number: 11929575
    Abstract: An electrical connector that connects circuit boards in a coplanar manner. The electrical connector includes a frame comprising a plate, and two platforms extending above the plate and substantially parallel to each other. A housing of the electrical connector holding conductive elements is coupled to the plate of the frame such that a top surface of the housing is substantially flush with top surfaces of the two platforms. The platforms of the frame have threaded holes extending therethrough such that screws can be inserted to hold one of the two platforms of the electrical connector to a first circuit board and the other one of the two platforms of the electrical connector to a second circuit board that is substantially edge aligned to the first circuit board. Such a configuration enables connecting circuit boards of various thicknesses in a coplanar manner.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: March 12, 2024
    Assignee: Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Jun Fan, Tao Zeng, Ki Ka Lau
  • Patent number: 11881646
    Abstract: An electronic circuit board including a plurality of electronic components mounted on the electronic circuit board and a plurality of electricity conductive paths for connecting the electronic components. The electronic circuit board further includes a plurality of electric connectors arranged in a bank along an edge of the electronic circuit board, wherein each one of the plurality of electric connectors is formed from the material of the board as a finger projecting outside the electronic circuit board. In line with either edge of each one of the electric connectors the electronic circuit board has a cut forming a gap and projecting into the board.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: January 23, 2024
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Marco Assale, Claudio D'Incà, Sergio Lanzone, Mara Cosentino, Angelo Rivara, Sergio Mosti
  • Patent number: 11879920
    Abstract: Toroidal high dielectric ceramic microwave tuning probes are sliding on the central conductor of a high power electro-mechanical microwave dual-probe coaxial load pull tuner and create high reflection factor over a wide frequency range. The probes are positioned horizontally using a remote translation mechanism and allow continuous coverage of the Smith chart over a high frequency and VSWR (reflection factor) range. A remotely adjustable attenuator is inserted adjacent to the test port and mitigates spurious high reflection. A de-embedding calibration allows full tuner characterization in a few minutes instead of several hours.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: January 23, 2024
    Inventor: Christos Tsironis
  • Patent number: 11848323
    Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: December 19, 2023
    Assignee: Micron Technology, Inc.
    Inventors: James E. Davis, John B. Pusey, Zhiping Yin, Kevin G. Duesman
  • Patent number: 11848474
    Abstract: A coplanar waveguide transmission line and a design method thereof are provided. The coplanar waveguide transmission line includes a first dielectric substrate, a center conductor strip, and two ground conductor strips. The first dielectric substrate has a first surface and a second surface opposite to each other. The center conductor strip and the ground conductor strips are stacked and fixed to the first surface. The center conductor strip includes a first segment and a second segment. A width of the first segment is greater than a width of the second segment, so that the first segment and the second segment form a step structure. A rectangular groove recessed toward the second surface is defined in the first surface, and a part of the center conductor strip is stacked and fixed to a side, distal from the second surface, of the rectangular groove to form a defected ground structure.
    Type: Grant
    Filed: July 18, 2023
    Date of Patent: December 19, 2023
    Assignee: LANSUS TECHNOLOGIES INC.
    Inventors: Shulun Li, Jiashuai Guo
  • Patent number: 11818836
    Abstract: In one example, a system includes a radio frequency port coupled to an external connector and a microstrip line coupled to the radio frequency port and one or more components mounted on a printed circuit board. The system further includes a short coupled to the microstrip line and a ground reference, wherein the short is coupled to the microstrip line proximate the radio frequency port.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: November 14, 2023
    Assignee: CommScope Technologies LLC
    Inventors: Rainer Friedrich, Johannes Steigert
  • Patent number: 11817643
    Abstract: The present invention relates to a cavity filter including: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein a part of the terminal portion, positioned between the electrode pad and the RF signal connecting portion, is elastically deformed to absorb assembly tolerance existing in a terminal insertion port. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevent disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: November 14, 2023
    Assignee: KMW INC.
    Inventors: Nam Shin Park, Joung Hoe Kim, Sung Ho Jang
  • Patent number: 11785708
    Abstract: A sensor device is provided for measuring current in an electrical circuit of a PCB, including a coaxial connector mounted on a tab in the PCB having an inner conductor and a concentric outer conductor, where the tab is formed by a gap through the PCB along a portion of a perimeter surrounding the coaxial connector; a sidewall conductor formed on sidewalls of the tab and connected to ground plane; and resistors mounted on the PCB and arranged along the portion of the perimeter surrounding the coaxial connector, each resistor being connected between the inner conductor and the sidewall conductor. Current from the electrical circuit flows in a first direction through the ground plane creating a first magnetic field, and flows in a second direction between the sidewall conductor and the inner conductor through the resistors creating a second magnetic field, where the first and second magnetic field partially cancel.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: October 10, 2023
    Assignee: KEYSIGHT TECHNOLOGIES, INC.
    Inventors: Ryo Takeda, Bernhard Holzinger
  • Patent number: 11784782
    Abstract: Generating, during a first and second signaling interval, an aggregated data signal by forming a linear combination of wire signals received in parallel from wires of a multi-wire bus, wherein at least some of the wire signals undergo a signal level transition during the first and second signaling interval; measuring a signal skew characteristic of the aggregated data signal; and, generating wire-specific skew offset metrics, each wire-specific skew offset metric based on the signal skew characteristic.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: October 10, 2023
    Assignee: KANDOU LABS, S.A.
    Inventors: Roger Ulrich, Armin Tajalli, Ali Hormati, Richard Simpson
  • Patent number: 11768225
    Abstract: A system may include a printed circuit board with a microstrip and a conductive structure surrounding the microstrip. The system may include a probe lead in communication with the conductive structure. The system may include a first contact pad electrically connected to the conductive structure and a second contact pad electrically connected to the conductive structure.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: September 26, 2023
    Assignee: International Business Machines Corporation
    Inventors: Matteo Cocchini, Kyle Olson, Noah Singer
  • Patent number: 11742587
    Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transfer rate beyond 4th generation (4G) communication such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit comprising multiple antenna elements constituting a subarray, and a network unit disposed beneath the antenna unit in multiple layers, the network unit comprising at least one transmission line configured to be branched to positions of the multiple antenna elements, a via hole extending through the multi-layer, and a stub structure disposed on an area adjacent to the via hole. The open stub structure designed on a first layer forming a ground plane, among the multiple layers, may include a first via pad disposed to be adjacent to the via hole, a first open stub extending from the first via pad in a first direction, and a first slot part configured to surround the first via pad and the first open stub.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: August 29, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jungi Jeong, Chanju Park, Junhwa Oh, Sanghyuk Wi
  • Patent number: 11728599
    Abstract: An assembly includes: first and second printed circuit boards (PCBs), the PCBs being disposed generally parallel to each other; a first coaxial connector mounted to the first PCB, the first coaxial connector comprising a first inner contact and a first outer connector body, the first outer connector body having a first thickness; and a second coaxial connector mounted to the second PCB, the second axial connector comprising, a second inner contact and a second outer connector body. The second outer connector body includes an engagement surface, the engagement surface being flexible in a direction normal to the second PCB, the engagement surface having a second thickness that is greater than the first thickness.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: August 15, 2023
    Assignee: CommScope Technologies LLC
    Inventors: David J. Smentek, Troy I. Vanderhoof, Amit Kaistha, Thomas G. Sheehe
  • Patent number: 11682814
    Abstract: A radio frequency (RF) waveguide housing includes a metal-diamond base with a first surface and a second surface opposite the first surface. The metal-diamond base includes an opening through a thickness of the metal-diamond base, and the opening includes a first side on a side of the first surface of the metal-diamond base and a second side on a side of the second surface of the metal-diamond base. The RF waveguide housing also includes an insert to be inserted in the opening and affixed to the metal-diamond base. The insert defines an interior volume within the opening of the metal-diamond base and a shape of the insert at the first side of the opening is configured to match an end of an RF waveguide coupled to the RF waveguide housing.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: June 20, 2023
    Assignee: RAYTHEON COMPANY
    Inventors: Karl L. Worthen, James S. Wilson, Joshua Lamb
  • Patent number: 11658374
    Abstract: A quasi-coaxial transmission line, a semiconductor package including the same and a method of manufacturing the same are disclosed. The quasi-coaxial transmission line includes a core, which is formed through an upper surface and a lower surface of a base substrate so as to transmit an electrical signal, and a shield, which is spaced apart from the core and which coaxially surrounds a side surface of the core, at least a portion of the shield being removed so as to form an open portion. The quasi-coaxial transmission line is capable of preventing distortion of an electrical signal at a portion thereof that is connected to an external circuit board and to reduce an area of a semiconductor package including the quasi-coaxial transmission line.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: May 23, 2023
    Assignee: KOREA ELECTRONICS TECHNOLOGY INSTITUTE
    Inventors: Jong Min Yook, Jun Chul Kim, Dong Su Kim
  • Patent number: 11637406
    Abstract: Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including a composite, the composite including: an elastic body having a plurality of through holes that penetrate therethrough in a thickness direction; and a conductive member, which is joined to an inner wall of each of the through holes, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, wherein at least a part of a vicinity of at least one of distal ends of the conductive member is hollow.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: April 25, 2023
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventor: Masatoshi Tsuchiya
  • Patent number: 11631506
    Abstract: A high-frequency line connection structure connects a coaxial line and a planar line. The high-frequency line connection structure includes a conductive base that is formed into a planar shape having a length that matches a length of the planar line along a lengthwise direction of a substrate, where the planar line is disposed on a surface of the conductive base, and a protrusion structure provided in a region, on the surface of the conductive base, adjacent to the coaxial line, the protrusion structure protruding from the surface of the conductive base, where the protrusion structure is in contact with a side surface of a region along the lengthwise direction of the substrate, where a ground conductive film with a smaller width out of a pair of ground conductive films of the planar line, is formed.
    Type: Grant
    Filed: May 27, 2019
    Date of Patent: April 18, 2023
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Hiromasa Tanobe, Satoshi Tsunashima
  • Patent number: 11611135
    Abstract: The present disclosure relates to a waveguide section having at least one air-filled waveguide conducting tube having an electrically conducting inner wall. Each waveguide conducting tube comprises has a plug-in filter device with two or more electrically conducting elements arranged in series and spaced apart by a connecting arrangement. Each plug-in filter device is adapted to be retained in the corresponding waveguide conducting tube using a dielectric holding arrangement such that the electrically conducting elements are spaced apart from the waveguide conducting tube. The electrically conducting elements are arranged to be electromagnetically coupled such that passing a radio frequency is electromagnetically filtered.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: March 21, 2023
    Assignee: Telefonaktiebolaget LM Ericsson (Publ)
    Inventor: Anatoli Deleniv
  • Patent number: 11563554
    Abstract: Generating, during a first and second signaling interval, an aggregated data signal by forming a linear combination of wire signals received in parallel from wires of a multi-wire bus, wherein at least some of the wire signals undergo a signal level transition during the first and second signaling interval; measuring a signal skew characteristic of the aggregated data signal; and, generating wire-specific skew offset metrics, each wire-specific skew offset metric based on the signal skew characteristic.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: January 24, 2023
    Assignee: KANDOU LABS, S.A.
    Inventors: Roger Ulrich, Armin Tajalli, Ali Hormati, Richard Simpson
  • Patent number: 11522260
    Abstract: The present invention relates to a cavity filter and, in particular, provides an advantage of preventing performance deterioration of an antenna device by efficiently absorbing an assembly tolerance which may occur due to assembly design and preventing an interruption of an electrical flow, by comprising: an RF signal connecting part provided to be spaced apart at a predetermined distance from an external member having an electrode pad formed on one surface thereof; a terminal part which electrically connects the electrode pad of the external member to the RF signal connecting part, while absorbing an assembly tolerance existing within the predetermined distance and simultaneously preventing an interruption of an electrical flow between the electrode pad and the RF signal connecting part; a dielectric body which is inserted into a terminal insertion hole so as to surround the outside of the terminal part; and an elastic member which has a portion of the edge supported by the dielectric body and which elastica
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: December 6, 2022
    Assignee: KMW INC.
    Inventors: Joung Hoe Kim, Sang Yoong Kim
  • Patent number: 11503702
    Abstract: An electronic device according to various embodiments of the present invention may comprise: a circuit substrate comprising a first layer including a first wire, a second wire formed at one side surface of the first wire along the first wire, and a third wire formed at the other side surface of the first wire along the first wire, a second layer including a ground plane formed along the first wire, the second wire, and the third wire and electrically connected to the second wire and the third wire, and an insulation layer disposed between the first layer and the second layer and having first permittivity; and a conductive member which is disposed above the first layer to have a dielectric-fillable interval space along the first wire and is electrically connected to the ground of the electronic device, the dielectric having second permittivity lower than the first permittivity.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: November 15, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Eunseok Hong
  • Patent number: 11489290
    Abstract: A data connector adapter includes a plug body having first and second plug connection ends, an electrically conductive plug shield and a contact carrier. The first and second plug connection ends respectively have first and second plug contact connection patterns for connecting first and second data connectors. The contact carrier is arranged between the plug connection ends and carries two first contacts and two second contacts respectively forming the first and second plug contact connection patterns. One of the first contacts in each case is electrically conductively connected to one of the second contacts via a contact connection section. The first and second contacts are surrounded at least in sections respectively by electrically insulating first and second carrier bodies having first and second dielectric constants ?R1, ?R2. Outer circumferential surfaces of the carrier bodies bear against an inner wall surface of the plug shield at least in sections.
    Type: Grant
    Filed: February 15, 2021
    Date of Patent: November 1, 2022
    Assignee: ERICH JAEGER GMBH + CO. KG
    Inventor: Klaus Markefka
  • Patent number: 11482766
    Abstract: An interconnection includes a circuit board assembly and a hybrid cable assembly. The circuit board assembly includes first and second outer layer assemblies and an intermediate layer assembly. The first and second outer layer assemblies each include an electrically conductive layer. A cable-receiving space is formed at a first side edge of the circuit board assembly. The hybrid cable assembly includes a dielectric waveguide system having a core and a cladding and being configured to transmit a radar wave in a frequency range from about 70 to about 300 GHz. A first conductor system configured to transmit power and/or data is disposed adjacent to the dielectric waveguide system and includes an electrically conductive inner conductor assembly inserted into the cable-receiving space and galvanically connected to a first inner-conductor connection region. The core of the dielectric waveguide system is inserted into the cable-receiving space and disposed at a waveguide connection region.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: October 25, 2022
    Assignee: MD ELEKTRONIK GMBH
    Inventor: Martin Huber
  • Patent number: 11477904
    Abstract: An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: October 18, 2022
    Assignee: TE CONNECTIVITY SOLUTIONS GmbH
    Inventors: Christopher William Blackburn, Jeffery Walter Mason, Nathan Lincoln Tracy, Clarence Leon Yu, Michael David Herring
  • Patent number: 11394100
    Abstract: A high-frequency line connection structure 1 for connecting a coaxial line and a planar line includes a conductive second adhesion layer that is formed along edges of a pair of first conductive thin films of the planar line. Furthermore, end portions of the pair of first conductive thin films and an end portion of a second conductive thin film that is adjacent to the coaxial line are disposed to coincide with a position of an inner wall of a columnar penetrating hole formed in an outer conductor.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: July 19, 2022
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Hiromasa Tanobe, Satoshi Tsunashima
  • Patent number: 11381044
    Abstract: A connector block comprised of a plurality of spring-embedded blind mate connector assemblies. Each of the spring-embedded blind mate connector assemblies can be comprised of a first connector extending in a first direction and a second connector extending in a second direction opposite the first direction, where the first connector and the second connector can have a common axis and can be operatively coupled to pass a signal between opposite ends of the spring-embedded blind mate connector assembly. The first connector can include a captivator, a connection extension, and a spring between the captivator and the second connector, where the spring can abut the captivator and have an outer diameter no greater than an outer diameter of the captivator.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: July 5, 2022
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: Anthony Jonathan Bednarz, Marc T. Angelucci, Ilya Gershkovich, Mohsin Peeran, Robert C. Hosler
  • Patent number: 11372059
    Abstract: The present disclosure relates to a testing device comprising a bracket including a first groove and a second groove parallel to each other, wherein the first groove and the second groove run through an inner surface of the bracket perpendicularly to a thickness direction of the testing device; a plate assembly including a first plate and a second plate parallel to each other, wherein the first plate is disposed within the first groove and fits closely within the first groove along a length direction and a thickness direction of the testing device, the second plate is disposed within the second groove, with a gap present in the second groove along a length direction and/or a thickness direction of the testing device; a connector array including a plurality of connector assemblies disposed on the plate assembly in a predetermined pattern, wherein each of the plurality of connector assemblies is connected between the first plate and the second plate; and a displacing tool disposed on the bracket and/or the plat
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: June 28, 2022
    Assignee: CommScope Technologies LLC
    Inventors: Mulan Huang, Jin Liu, Qiuliang Wang, Yujun Zhang
  • Patent number: 11357114
    Abstract: What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: June 7, 2022
    Assignee: BorgWarner Ludwigsburg GmbH
    Inventors: Sisay Tadele, Helmut Hoppe, Alexander Dauth, Gerd Bräuchle
  • Patent number: 11357099
    Abstract: The disclosure relates to research (No. GK17N0100, millimeter wave 5G mobile communication system development) that was conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017. An Radio Frequency (RF) package module according to various embodiments and an electronic device including the RF package module are provided. The RF package module according to an embodiment includes a sub module including an Radio Frequency Integrated Chip (RFIC); an antenna configured to transmit and receive a signal wirelessly through a predetermined metal pattern; and a multi-layer circuit board including a plurality of layers in which a signal via for transferring the signal between the RFIC and the antenna and one or more ground vias are formed, wherein the antenna is spaced from the one or more ground vias by one or more anti-pads.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: June 7, 2022
    Assignees: Samsung Electronics Co., Ltd., Ajou University Industry-Academic Cooperation Foundation
    Inventors: Kwang-Hyun Baek, Sangwook Park, Dong Gun Kam, Young-ju Lee
  • Patent number: 11289796
    Abstract: The present invention relates to a circuit board arrangement including a circuit board, whose metallization comprises at least one coplanar stripline for supplying signals to a radiator, in particular a mobile communication radiator. In this circuit board arrangement, the circuit board comprises a field converter, which is electrically connected to the coplanar stripline and which conducts a coaxial field through at least one layer of the circuit board and converts it into the coplanar stripline field of the coplanar stripline.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: March 29, 2022
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Andreas Vollmer, Dan Fleancu
  • Patent number: 11251559
    Abstract: A connector for a photovoltaic cell includes a conductive portion and an insulating portion, wherein the conductive portion is wrapped with the insulating portion; the conductive portion includes a conductor and a cable line, and a retaining ring is arranged on the outer circumferential surface of the conductor; the insulating portion includes a shell body, a basket-shaped fastener and a front sleeve; a first inner step surface and a second inner step surface are arranged in an inner cavity of the shell body; the front sleeve has an annular head part which sleeves the conductor; a first outer step surface is arranged at a tail part of the front sleeve, and props against the first inner step surface; the inner diameter of the head part of the front sleeve is larger than the outer diameter of the conductor and less than the outer diameter of the retaining ring.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: February 15, 2022
    Assignee: ZHEJIANG RENHE PHOTOVOLTAIC TECHNOLOGY CO., LTD.
    Inventors: Lijun Duan, Li Su
  • Patent number: 11145947
    Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: October 12, 2021
    Assignee: Microfabrica Inc.
    Inventors: Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser