Abstract: A coaxial connector includes a base surface; a coaxial structure where a dielectric is between a central conductor and an outer conductor; and a protrusion protruding from the base surface. The central conductor includes a contact portion protruding from the base surface. In response to a substrate being inserted toward the base surface between the contact portion and the protrusion, the contact portion comes into contact with a conductor pattern formed on a surface of the substrate. The outer conductor includes a protruding conductor protruding from the base surface and not in contact with the substrate inserted between the contact portion and the protrusion.

Abstract: A floating connector and an assembly thereof are provided. The floating connector includes: a center conductive pin; an insulating seat which surrounds the center conductive pin; a mating side conductive shell which surrounds an outer periphery of the insulating seat; a movable conductive shell which is movably received in mating side conductive shell; an elastic element which elastically abuts against an upper end of the movable conductive shell; and an inner conductive shell which is interposed between the elastic element and the center conductive pin; the inner conductive shell has a fixing portion and a movable contacting portion, the fixing portion snaps on one of the mating side conductive shell and the movable conductive shell; the movable contacting portion slideably elastically abuts against the other of the mating side conductive shell and the movable conductive shell.

Abstract: A signal processing device may include a feeding apparatus having a first conductor configured to transmit a radio frequency signal; an insulating medium covering the first conductor; and a second conductor covering the insulating medium. The conductor may have first, second, and third portions. The third portion of the first conductor may be configured to be connected to the target apparatus to feed the radio frequency signal to the target apparatus and configured to form a capacitive impedance with the target apparatus, and the second portion of the first conductor may be configured to form an inductive impedance with the target apparatus. An absolute value of a sum of the capacitive impedance and the inductive impedance may be less than or equal to a preset impedance threshold.

Abstract: An electrical connector that connects circuit boards in a coplanar manner. The electrical connector includes a frame comprising a plate, and two platforms extending above the plate and substantially parallel to each other. A housing of the electrical connector holding conductive elements is coupled to the plate of the frame such that a top surface of the housing is substantially flush with top surfaces of the two platforms. The platforms of the frame have threaded holes extending therethrough such that screws can be inserted to hold one of the two platforms of the electrical connector to a first circuit board and the other one of the two platforms of the electrical connector to a second circuit board that is substantially edge aligned to the first circuit board. Such a configuration enables connecting circuit boards of various thicknesses in a coplanar manner.

Abstract: Toroidal high dielectric ceramic microwave tuning probes are sliding on the central conductor of a high power electro-mechanical microwave dual-probe coaxial load pull tuner and create high reflection factor over a wide frequency range. The probes are positioned horizontally using a remote translation mechanism and allow continuous coverage of the Smith chart over a high frequency and VSWR (reflection factor) range. A remotely adjustable attenuator is inserted adjacent to the test port and mitigates spurious high reflection. A de-embedding calibration allows full tuner characterization in a few minutes instead of several hours.

Abstract: An electronic circuit board including a plurality of electronic components mounted on the electronic circuit board and a plurality of electricity conductive paths for connecting the electronic components. The electronic circuit board further includes a plurality of electric connectors arranged in a bank along an edge of the electronic circuit board, wherein each one of the plurality of electric connectors is formed from the material of the board as a finger projecting outside the electronic circuit board. In line with either edge of each one of the electric connectors the electronic circuit board has a cut forming a gap and projecting into the board.

Abstract: A coplanar waveguide transmission line and a design method thereof are provided. The coplanar waveguide transmission line includes a first dielectric substrate, a center conductor strip, and two ground conductor strips. The first dielectric substrate has a first surface and a second surface opposite to each other. The center conductor strip and the ground conductor strips are stacked and fixed to the first surface. The center conductor strip includes a first segment and a second segment. A width of the first segment is greater than a width of the second segment, so that the first segment and the second segment form a step structure. A rectangular groove recessed toward the second surface is defined in the first surface, and a part of the center conductor strip is stacked and fixed to a side, distal from the second surface, of the rectangular groove to form a defected ground structure.

Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.

Abstract: The present invention relates to a cavity filter including: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein a part of the terminal portion, positioned between the electrode pad and the RF signal connecting portion, is elastically deformed to absorb assembly tolerance existing in a terminal insertion port. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevent disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

Abstract: In one example, a system includes a radio frequency port coupled to an external connector and a microstrip line coupled to the radio frequency port and one or more components mounted on a printed circuit board. The system further includes a short coupled to the microstrip line and a ground reference, wherein the short is coupled to the microstrip line proximate the radio frequency port.

Abstract: A sensor device is provided for measuring current in an electrical circuit of a PCB, including a coaxial connector mounted on a tab in the PCB having an inner conductor and a concentric outer conductor, where the tab is formed by a gap through the PCB along a portion of a perimeter surrounding the coaxial connector; a sidewall conductor formed on sidewalls of the tab and connected to ground plane; and resistors mounted on the PCB and arranged along the portion of the perimeter surrounding the coaxial connector, each resistor being connected between the inner conductor and the sidewall conductor. Current from the electrical circuit flows in a first direction through the ground plane creating a first magnetic field, and flows in a second direction between the sidewall conductor and the inner conductor through the resistors creating a second magnetic field, where the first and second magnetic field partially cancel.

Abstract: Generating, during a first and second signaling interval, an aggregated data signal by forming a linear combination of wire signals received in parallel from wires of a multi-wire bus, wherein at least some of the wire signals undergo a signal level transition during the first and second signaling interval; measuring a signal skew characteristic of the aggregated data signal; and, generating wire-specific skew offset metrics, each wire-specific skew offset metric based on the signal skew characteristic.

Abstract: A system may include a printed circuit board with a microstrip and a conductive structure surrounding the microstrip. The system may include a probe lead in communication with the conductive structure. The system may include a first contact pad electrically connected to the conductive structure and a second contact pad electrically connected to the conductive structure.

Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transfer rate beyond 4th generation (4G) communication such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit comprising multiple antenna elements constituting a subarray, and a network unit disposed beneath the antenna unit in multiple layers, the network unit comprising at least one transmission line configured to be branched to positions of the multiple antenna elements, a via hole extending through the multi-layer, and a stub structure disposed on an area adjacent to the via hole. The open stub structure designed on a first layer forming a ground plane, among the multiple layers, may include a first via pad disposed to be adjacent to the via hole, a first open stub extending from the first via pad in a first direction, and a first slot part configured to surround the first via pad and the first open stub.

Abstract: An assembly includes: first and second printed circuit boards (PCBs), the PCBs being disposed generally parallel to each other; a first coaxial connector mounted to the first PCB, the first coaxial connector comprising a first inner contact and a first outer connector body, the first outer connector body having a first thickness; and a second coaxial connector mounted to the second PCB, the second axial connector comprising, a second inner contact and a second outer connector body. The second outer connector body includes an engagement surface, the engagement surface being flexible in a direction normal to the second PCB, the engagement surface having a second thickness that is greater than the first thickness.

Abstract: A radio frequency (RF) waveguide housing includes a metal-diamond base with a first surface and a second surface opposite the first surface. The metal-diamond base includes an opening through a thickness of the metal-diamond base, and the opening includes a first side on a side of the first surface of the metal-diamond base and a second side on a side of the second surface of the metal-diamond base. The RF waveguide housing also includes an insert to be inserted in the opening and affixed to the metal-diamond base. The insert defines an interior volume within the opening of the metal-diamond base and a shape of the insert at the first side of the opening is configured to match an end of an RF waveguide coupled to the RF waveguide housing.

Abstract: A quasi-coaxial transmission line, a semiconductor package including the same and a method of manufacturing the same are disclosed. The quasi-coaxial transmission line includes a core, which is formed through an upper surface and a lower surface of a base substrate so as to transmit an electrical signal, and a shield, which is spaced apart from the core and which coaxially surrounds a side surface of the core, at least a portion of the shield being removed so as to form an open portion. The quasi-coaxial transmission line is capable of preventing distortion of an electrical signal at a portion thereof that is connected to an external circuit board and to reduce an area of a semiconductor package including the quasi-coaxial transmission line.

Abstract: Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including a composite, the composite including: an elastic body having a plurality of through holes that penetrate therethrough in a thickness direction; and a conductive member, which is joined to an inner wall of each of the through holes, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, wherein at least a part of a vicinity of at least one of distal ends of the conductive member is hollow.

Abstract: A high-frequency line connection structure connects a coaxial line and a planar line. The high-frequency line connection structure includes a conductive base that is formed into a planar shape having a length that matches a length of the planar line along a lengthwise direction of a substrate, where the planar line is disposed on a surface of the conductive base, and a protrusion structure provided in a region, on the surface of the conductive base, adjacent to the coaxial line, the protrusion structure protruding from the surface of the conductive base, where the protrusion structure is in contact with a side surface of a region along the lengthwise direction of the substrate, where a ground conductive film with a smaller width out of a pair of ground conductive films of the planar line, is formed.

Abstract: The present disclosure relates to a waveguide section having at least one air-filled waveguide conducting tube having an electrically conducting inner wall. Each waveguide conducting tube comprises has a plug-in filter device with two or more electrically conducting elements arranged in series and spaced apart by a connecting arrangement. Each plug-in filter device is adapted to be retained in the corresponding waveguide conducting tube using a dielectric holding arrangement such that the electrically conducting elements are spaced apart from the waveguide conducting tube. The electrically conducting elements are arranged to be electromagnetically coupled such that passing a radio frequency is electromagnetically filtered.

Abstract: Generating, during a first and second signaling interval, an aggregated data signal by forming a linear combination of wire signals received in parallel from wires of a multi-wire bus, wherein at least some of the wire signals undergo a signal level transition during the first and second signaling interval; measuring a signal skew characteristic of the aggregated data signal; and, generating wire-specific skew offset metrics, each wire-specific skew offset metric based on the signal skew characteristic.

Abstract: The present invention relates to a cavity filter and, in particular, provides an advantage of preventing performance deterioration of an antenna device by efficiently absorbing an assembly tolerance which may occur due to assembly design and preventing an interruption of an electrical flow, by comprising: an RF signal connecting part provided to be spaced apart at a predetermined distance from an external member having an electrode pad formed on one surface thereof; a terminal part which electrically connects the electrode pad of the external member to the RF signal connecting part, while absorbing an assembly tolerance existing within the predetermined distance and simultaneously preventing an interruption of an electrical flow between the electrode pad and the RF signal connecting part; a dielectric body which is inserted into a terminal insertion hole so as to surround the outside of the terminal part; and an elastic member which has a portion of the edge supported by the dielectric body and which elastica

Abstract: An electronic device according to various embodiments of the present invention may comprise: a circuit substrate comprising a first layer including a first wire, a second wire formed at one side surface of the first wire along the first wire, and a third wire formed at the other side surface of the first wire along the first wire, a second layer including a ground plane formed along the first wire, the second wire, and the third wire and electrically connected to the second wire and the third wire, and an insulation layer disposed between the first layer and the second layer and having first permittivity; and a conductive member which is disposed above the first layer to have a dielectric-fillable interval space along the first wire and is electrically connected to the ground of the electronic device, the dielectric having second permittivity lower than the first permittivity.

Abstract: A data connector adapter includes a plug body having first and second plug connection ends, an electrically conductive plug shield and a contact carrier. The first and second plug connection ends respectively have first and second plug contact connection patterns for connecting first and second data connectors. The contact carrier is arranged between the plug connection ends and carries two first contacts and two second contacts respectively forming the first and second plug contact connection patterns. One of the first contacts in each case is electrically conductively connected to one of the second contacts via a contact connection section. The first and second contacts are surrounded at least in sections respectively by electrically insulating first and second carrier bodies having first and second dielectric constants ?R1, ?R2. Outer circumferential surfaces of the carrier bodies bear against an inner wall surface of the plug shield at least in sections.

Abstract: An interconnection includes a circuit board assembly and a hybrid cable assembly. The circuit board assembly includes first and second outer layer assemblies and an intermediate layer assembly. The first and second outer layer assemblies each include an electrically conductive layer. A cable-receiving space is formed at a first side edge of the circuit board assembly. The hybrid cable assembly includes a dielectric waveguide system having a core and a cladding and being configured to transmit a radar wave in a frequency range from about 70 to about 300 GHz. A first conductor system configured to transmit power and/or data is disposed adjacent to the dielectric waveguide system and includes an electrically conductive inner conductor assembly inserted into the cable-receiving space and galvanically connected to a first inner-conductor connection region. The core of the dielectric waveguide system is inserted into the cable-receiving space and disposed at a waveguide connection region.

Abstract: An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package.

Abstract: A high-frequency line connection structure 1 for connecting a coaxial line and a planar line includes a conductive second adhesion layer that is formed along edges of a pair of first conductive thin films of the planar line. Furthermore, end portions of the pair of first conductive thin films and an end portion of a second conductive thin film that is adjacent to the coaxial line are disposed to coincide with a position of an inner wall of a columnar penetrating hole formed in an outer conductor.

Abstract: A connector block comprised of a plurality of spring-embedded blind mate connector assemblies. Each of the spring-embedded blind mate connector assemblies can be comprised of a first connector extending in a first direction and a second connector extending in a second direction opposite the first direction, where the first connector and the second connector can have a common axis and can be operatively coupled to pass a signal between opposite ends of the spring-embedded blind mate connector assembly. The first connector can include a captivator, a connection extension, and a spring between the captivator and the second connector, where the spring can abut the captivator and have an outer diameter no greater than an outer diameter of the captivator.

Abstract: The present disclosure relates to a testing device comprising a bracket including a first groove and a second groove parallel to each other, wherein the first groove and the second groove run through an inner surface of the bracket perpendicularly to a thickness direction of the testing device; a plate assembly including a first plate and a second plate parallel to each other, wherein the first plate is disposed within the first groove and fits closely within the first groove along a length direction and a thickness direction of the testing device, the second plate is disposed within the second groove, with a gap present in the second groove along a length direction and/or a thickness direction of the testing device; a connector array including a plurality of connector assemblies disposed on the plate assembly in a predetermined pattern, wherein each of the plurality of connector assemblies is connected between the first plate and the second plate; and a displacing tool disposed on the bracket and/or the plat

Abstract: The disclosure relates to research (No. GK17N0100, millimeter wave 5G mobile communication system development) that was conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017. An Radio Frequency (RF) package module according to various embodiments and an electronic device including the RF package module are provided. The RF package module according to an embodiment includes a sub module including an Radio Frequency Integrated Chip (RFIC); an antenna configured to transmit and receive a signal wirelessly through a predetermined metal pattern; and a multi-layer circuit board including a plurality of layers in which a signal via for transferring the signal between the RFIC and the antenna and one or more ground vias are formed, wherein the antenna is spaced from the one or more ground vias by one or more anti-pads.

Abstract: What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.

Abstract: The present invention relates to a circuit board arrangement including a circuit board, whose metallization comprises at least one coplanar stripline for supplying signals to a radiator, in particular a mobile communication radiator. In this circuit board arrangement, the circuit board comprises a field converter, which is electrically connected to the coplanar stripline and which conducts a coaxial field through at least one layer of the circuit board and converts it into the coplanar stripline field of the coplanar stripline.

Abstract: A connector for a photovoltaic cell includes a conductive portion and an insulating portion, wherein the conductive portion is wrapped with the insulating portion; the conductive portion includes a conductor and a cable line, and a retaining ring is arranged on the outer circumferential surface of the conductor; the insulating portion includes a shell body, a basket-shaped fastener and a front sleeve; a first inner step surface and a second inner step surface are arranged in an inner cavity of the shell body; the front sleeve has an annular head part which sleeves the conductor; a first outer step surface is arranged at a tail part of the front sleeve, and props against the first inner step surface; the inner diameter of the head part of the front sleeve is larger than the outer diameter of the conductor and less than the outer diameter of the retaining ring.

Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

Abstract: A negative coupling structure applied in a dielectric waveguide filter includes an elongated blind hole formed on a first surface of a dielectric body for building the negative coupling structure, and tuning holes formed on the first surface or a second surface of the dielectric body. A first coupling portion configured to be corresponsive to a bottom wall of the elongated blind hole, a second coupling portion configured to be corresponsive to a side wall of the elongated blind hole, and a common coupling portion connected between the bottom wall and the side wall are provided to define a negative coupling structure in the dielectric body, so as to provide both capacitive coupling and inductive coupling and a negative coupling and achieve the effects of reducing the weight and volume of the dielectric waveguide filter and providing good performance, simple structure and easy manufacture.

Abstract: One example includes an antenna system. The antenna system includes a plurality of printed boards arranged in layers and including a first printed board and a second printed board. The first printed board includes a resonator and the second printed board includes a shield. The antenna system also includes at least one conductive via that extends through each of the plurality of printed boards and is coupled to a transceiver. The at least one conductive via can cooperate with the resonator to at least one of transmit a wireless signal from the transceiver via the antenna system or receive the wireless signal at the transceiver via the antenna system.

Abstract: A tunable probe includes a first resonator, a second resonator spaced from the first resonator, and a cross-couple extending from the first resonator to the second resonator. The cross-couple includes a first substrate and a second substrate disposed between the first and second resonator to create a capacitance between the first and second resonators. The cross-couple further includes a wire connecting the first and second substrates and a dielectric surrounding the wire.

Abstract: A chip comprising a bonding pad region and a transmission section. The bonding pad region has a first impedance, and is configured for electrical connection to an external transmission line. The transmission section extends away from the bonding pad region and has a second impedance. The bonding pad region is configured to enable field confinement and field matching between the bonding pad region and the external transmission line, and the second impedance is not equal to the first impedance.

Abstract: An ultra-high frequency super thin coaxial RF connector assembly comprising a combination of an ultra-high frequency super thin coaxial RF board side connector and an ultra-high frequency super thin coaxial RF wire side connector, wherein the arrangement of a traditionally conventional board side connector center terminal is omitted for the ultra-high frequency super thin coaxial RF board side connector, for the ultra-high frequency super thin coaxial RF wire side connector to transfer an RF signal to a circuit board directly without using an RF board side center terminal.

Abstract: A method for a vertical transition between a coaxial structure and a microstrip line features a slot in the ground plane of the microstrip line and near one end of its signal line. Multiple through holes are created at the substrate within the slot. The multiple through holes include a transition hole next to the end of the signal line, and at least a second hole. The transition hole and the slot are managed to establish a first eccentric configuration to achieve field transformation between the coaxial structure and the microstrip line, which would reduce the insertion loss of the vertical transition at higher frequencies and increase its 1-dB passband. The second hole and the slot are arranged to create a second eccentric configuration, and the second hole is used to relocate a resonance response caused by the slot towards higher frequencies to further increase the 1-dB passband.

Abstract: A wireless power supply device that wirelessly supplies power from a stator side to a plurality of power-receiving antennas disposed on a rotor rotated about an axis (O) at intervals in a circumferential direction includes: an oscillator (90) that oscillates a high-frequency signal; and an annular power transmitter (71) that has a leaky waveguide (80) in which a plurality of radiating portions (83) that radiate the high-frequency signal as a radio wave are arranged in the circumferential direction and extend in a circular arc shape in the circumferential direction.

Abstract: A computing device includes a first connector near a first wall. The first connector is in communication with a chip package positioned apart for the first wall via a first cable. The chip package includes a chip supported by a support layer. The chip can be supported by a substrate and/or a circuit board. A second connector can be positioned near a second wall and can also be in communication with the chip package via a second cable. If desired, the substrate or circuit board can include a signal board connector that is configured to engage board connectors terminated to ends of the first and second cables.

Abstract: A male internal conductor and a female internal conductor are reliably connected. When female-side and male-side dielectric bodies (16, 41) approach each other in an opposing positional relationship, a tab (32) of a male internal conductor (30) is inserted into a female-side dielectric body (41) and connected to a female internal conductor (42). The female-side dielectric body (41) has an opposing surface (41S) facing the male-side dielectric body (16) and formed with a female-side positioning portion (47). The male-side dielectric body (16) has an opposing surface (22S) facing the female-side dielectric body (41) and formed with a male-side positioning portion (25) which is disposed ahead of the tab (32) and which can be fitted with the female-side positioning portion (47) in a state where the tab (32) is not in contact with the female-side dielectric body (41).

Abstract: An electrically conductive shield for a microwave transmission line-electrical connector interconnect region wherein the microwave transmission line is connected to the electrical connector. An elastic, dielectric material is disposed between opposing surfaces of the dielectric structure and the housing. An electrically conductive material is disposed on an outer surface of the elastic, dielectric material to provide an electrically conductive shield. The electrically conductive shield is disposed over the opposing surfaces of the dielectric structure and the housing.

Abstract: A multi-section probe and a tapered probe for impedance tuners to broaden the band width of the probes and hence the band width of the tuners. Each section of the multi-section probe has a nominal length equal to one quarter wavelength at a midpoint of the operating band. The tapered probe has a length equivalent to a plurality of one quarter wavelengths of the frequency midpoint. The multi-section probe and the tapered probe are configured to transform the characteristic impedance of the tuner transmission line step-by-step or continuously to a target impedance value.

Abstract: A cable and a high-frequency device are provided to reduce passive intermodulation interference. The cable includes a strip line and a coaxial line. The strip line includes (in an outer-to-inner sequence) a strip-line outer conductor, a strip-line signal cavity, and a strip-line inner conductor. The coaxial line includes (in an outer to inner sequence) a coaxial-line outer conductor, a first insulation medium, and a coaxial-line inner conductor. The cable further includes a coupling ground plane provided with a coupling aperture portion. The coaxial line is disposed in the coupling aperture portion, the coaxial-line outer conductor is coupled to the coupling ground plane, the strip-line outer conductor is connected to the coupling ground plane, and the strip-line inner conductor is connected to the coaxial-line inner conductor.

Abstract: An optical subassembly includes: a conductor plate having a pair of penetration holes, both penetrating the conductor plate from an outer surface to an inner surface; a pair of lead terminals fixed in the two respective penetration holes and passing through the pair of penetration holes; a wiring board with a pair of wiring patterns arranged on a surface; and a plurality of bonding wires electrically connecting the pair of lead terminals and the pair of wiring patterns. A cross section of the pair of lead terminals on the inner surface side is larger than a cross section on the outer surface side. End faces on the inner surface side are situated within a range from +180 ?m to ?100 ?m to the inner side from the inner surface of the conductor plate in a direction perpendicular to the inner surface.

Abstract: A high current connector, having an inner conductor contact for carrying current, an outer conductor part, and an isolator part which keeps the inner conductor contact spaced apart from the outer conductor part, wherein a resiliently compressible damping element is provided on the connector in such a way that, when a complementary counterpart connector is inserted into the connector, the element is resiliently compressible in an insertion direction and the mobility of the isolator part is reduced with respect to the inner conductor contact and/or with respect to the outer conductor part. This feature is used to eliminate play between the affected parts to lessen material wear.

Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.

Abstract: A connector and an electronic device having the connector are disclosed. The connector includes: a housing formed with an insulator and mounted at a substrate in order to process a digital signal; a pair of sockets that process a Radio Frequency (RF) signal; a pair of terminals formed at a sub PCB in order to process the RF signal; and a signal processor that processes the RF signal and the digital signal. Various embodiments of the present disclosure are possible.