Abstract: A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit board.

Abstract: A test fixture configured to receive an electrical connector is provided that includes a circuit board having a mounting area configured to be joined to an electrical connector. The circuit board has at least two layers. Contacts are provided on the circuit board, and traces extend from the contacts, wherein traces joined to adjacent contacts are distributed between the at least two layers.

Abstract: An interconnection includes a microcircuit package having a slot, and a receiving feature. A bead ring is fitted into the receiving feature. A center conductor extends through a dielectric support disposed in the bead ring and through the slot. The center conductor forms a coaxial transmission structure in cooperation with the bead ring and the dielectric support, and forms a slab line transmission structure in cooperation with the slot.

Abstract: A RF interconnect comprising a dielectric resonator is disclosed. The dielectric resonator may be included in an interconnect housing. The dielectric resonator includes metalized side surfaces useful for securing the dielectric resonator in an aperture formed in the interconnect housing. The dimensions or material selected for the dielectric resonator may be predetermined to enable the dielectric resonator to operate as a filter or waveguide, as desired.

Abstract: A signal transmission structure is provided. The signal transmission structure includes a circuit board, a coaxial cable connector, and a conductive layer; the aforementioned circuit board includes at least one alignment through hole, a signal pad, and a signal trace connected to the signal pad. Additionally, the signal pad and the signal trace are disposed on a surface of the circuit board. In addition, the alignment through hole passes through the circuit board. The coaxial cable connector is located on a surface of the circuit board. The coaxial cable connector has a signal pin and at least an alignment pin, and the alignment pin is inserted into the alignment through hole. The conductive layer is located between one end of the signal pin and the signal pad, and the signal pin is electrically connected to the signal pad via the conductive layer.

Abstract: The present invention relates to a connection structure in which an inner conductor is combined with a detachable impedance compensator as well as a coaxial connector, an extendible pin and an impedance compensator used for the connection structure. Further, this invention relates to a microwave device connected both electrically and mechanically with the connection structure. An impedance compensation thereof means compensates electric discontinuities between the inner conductor and the extendible pin by mechanical arraying with a microwave device to be combined with the connection structure, whereby the protrusion formed at the impedance compensation means satisfies the conditions, b?a/5 and c?2b, when diameter of the impedance compensation means is a, thickness thereof is b, and size of the protrusion is c.

Abstract: A distributed interconnect and a method is provided for interconnecting electrical components which minimizes coupling inductance and increases bandwidth. The interconnect includes a transmission line with a first and second conductive transmission element. The first conductive transmission element is disposed between a first and second terminal, and has an impedance characteristic that increases from the first terminal to the second terminal. The second conductive transmission element is disposed between a third and fourth terminal, and has an impedance characteristic that increases from the third terminal to said fourth terminal. The conductive transmission elements are furthermore positioned in parallel alignment with respect to each other.

Abstract: An adaptor includes a connector interface having a first coaxial structure with a first center pin configured to be coupled to a first center conductor of a first coaxial transmission line and a second coaxial structure with a second center pin configured to be coupled to a second center conductor of a second coaxial transmission line. A nut surrounds the first coaxial structure and the second coaxial structure.

Abstract: Apparatus and methods for capacitively coupled device input/output are disclosed. In one embodiment, a connector module includes a first member having at least one first conductive lead disposed therein. A dielectric portion is coupled to an end portion of the at least one first conductive lead. A second member has at least one second conductive lead disposed therein. The first and second members are coupled such that respective end portions of the first and second conductive leads are operatively positioned and spaced apart by the dielectric portion. The dielectric portion is adapted to capacitively couple the respective end portions of the first and second conductive leads and to allow signals to be transmitted therethrough.

Abstract: A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise forming, in a circuit board, a via hole that bridges a first trace and a second trace. The method may also comprise forming a channel in a sidewall of the via hole. The method may further comprise filling the via hole and the channel with a conductive material. The method may additionally comprise removing the conductive material from the via hole without depleting the channel, thereby forming an interconnect that couples the first trace to the second trace.

Abstract: An impedance-matching electrical connection system, for use with high-frequency communication signals, includes a circuit board and a plurality of contact pads mounted on the circuit board. The contact pads are for coupling with a plurality of complementary connectors of an external electrical device. Each coupling is associated with an excess shunt capacitance. The electrical connection system further includes a plurality of inductive traces mounted on the circuit board, each of which is connected to a respective contact pad, and is associated with a compensating series inductance. Additionally, the electrical connection system includes a plurality of signal lines mounted on the circuit board, each of which is connected to a respective inductive trace. Each inductive trace is configured so that its associated compensating series inductance substantially offsets the excess shunt capacitance associated with the coupling between the contact pad connected to the inductive trace and a complementary connector.

Abstract: Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

Abstract: A slot transmission line patch connector, capable of bridging one or more slot transmission lines is comprised of an elongated dielectric connector body. The dielectric connector body is formed to have one or more slot transmission lines. Each transmission line formed in the dielectric body has first and second ends, each of which mates with corresponding first and second slot transmission lines. Alternate embodiments contemplate a dielectric body to which is attached one or more slot transmission line substrates, each of which supports one or more slot transmission lines. Each of the slot transmission line substrates provide one or more slot transmission lines that each bridge or “patch” together two, separate slot transmission lines together.

Abstract: Methods of assembling a coupler are provided in which a first printed circuit board is provided, and a second printed circuit board is then surface mounted on the first printed circuit board. The first printed circuit board and the second printed circuit board are then electrically and mechanically connected to provide a coupler having a shielded region defined between the first printed circuit board and the second printed circuit board. The shielded region at least partly surrounds a coupler circuit disposed therein.

Abstract: Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, ot reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

Abstract: An ultrafast sampler includes a series of Schottky diodes configured with a coplanar waveguide to form a nonlinear transmission line (NLTL) that compresses a local oscillator input to form a series of strobe pulses. Strobe pulses of opposite polarity are capacitively coupled to sampling diodes to obtain samples of a signal applied to a signal input. The samples are directed along an intermediate frequency waveguide to, for example, a signal processor such as an oscilloscope, for storage and analysis. The intermediate frequency waveguide is configured so that conductors of the intermediate frequency waveguide receive signal samples of a common polarity and strobe samples of opposite polarities so that portions of strobe pulses delivered to a signal processor are distinguished from signal samples.

Abstract: A board-to-board electrical connector is so constructed that when connectors 2 and 3 are fitted to each other, capacitive coupling plates 24 and 34 are brought into the state in which they partly confront each other, with a space between each other, and also a coupling capacitance between the capacitive coupling plates 24 and 34 is adjusted by adjusting an area formed by partly confronting portions of the capacitive coupling plates 24 and 34 and a distance between the partly confronting portions of the capacitive coupling plates 24 and 34. With this construction, the board-to-board electrical connector having a specified band-pass characteristic is achieved.

Abstract: A transition piece for coupling a coaxial transmission line to a printed circuit (PC) transmission line. The transmission line terminates in a conductive pin projecting through a conductive coaxial ground plane. The transition piece consists of a conductive plate which is adapted to be fixed between the coaxial ground plane and a PC ground plane of the PC transmission line. The plate is in electrical contact with both the coaxial and PC ground planes while the conductive pin contacts a conductive strip of the PC transmission line. Furthermore, the plate has an opening which is shaped and aligned with the pin so that a transition-impedance of the transition piece is substantially equal to a line impedance of the coaxial and PC transmission lines.

Abstract: A coaxial interface to a planar transmission structure of a printed circuit board (“PCB”) is provided in a shielded edge launch connector. The shielded edge launch connector is suitable for use in surface mount technology (“SMT”) applications. A center pin of the shielded edge launch connector is soldered to a solder pad on the PCB, which couples the center pin to a center conductor of the planar transmission structure. Shielding incorporated in the shielded edge launch connector is soldered to ground areas on a surface of PCB, electromagnetically shielding the center and providing a ground path to wrap ground current around the center pin from the surface of the PCB. Wrapping the ground current to a surface of the PCB reduces the sensitivity of the high-frequency performance of the system to PCB thickness and edge tolerances, providing improved impedance continuity.

Abstract: A scalable and compact computer system of three-dimensional subsystems each having capacitive couplers on its external surfaces for transmitting and receiving electrical signals to and from adjacent subsystems. Each surface having an electrically non-conducting substrate, one or more electrically conducting pads on the substrate, and electrical leads for coupling the pads to the subsystem's circuits. Two adjacent pads, each from a different subsystem, form a capacitive coupler to carry the signals between the subsystems. The pads are covered by a low-loss dielectric material having a large dielectric constant for improved signal transmission. A differential signal may be supported using two capacitive couplers to respectively carry the positive and negative signals of the differential signal. The subsystems might be replaced or left in place when they failed. Additional subsystems might be added to the system to expand its capacity.

Abstract: A insulation displacement connector (IDC) patch panel includes a circuit (PC) board with interdigitated capacitance for balancing out inherent capacitance found within IDCs of the panel and conventional plug connectors coupled to the panel. Unwanted cross-talk signals are reduced as a consequence.

Abstract: An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board.

Abstract: Microwave signals are coupled from a microwave module to a microstrip transmission line, each installed on a chassis plate. The microwave signals are fed through the bottom or side of the microwave module using a feedthrough pin mounted in the module. The feedthrough pin extends from the microwave module interior into a channel defined in the chassis plate and to a microstrip line on the opposite side of the plate. An electrically conductive gasket is placed about the feedthrough pin between the microwave module and chassis plate to reduce signal leakage and enhance ground continuity. An insulating sleeve is installed about the feedthrough pin in the chassis plate channel and provides a nominal clearance (e.g., 0.005 inches) within that channel to allow for manufacturing and assembly tolerances and to enable feedthrough impedance to be substantially insensitive to the position of the feedthrough pin and insulating sleeve within the channel.

Abstract: A second strip conductor is located, in a lamination direction of a multilayer substrate, at a is different position from that of a first strip conductor. A first grounding conductor and a second grounding conductor are disposed sequentially in the lamination direction of the multilayer substrate and sandwich the first strip conductor and the second strip conductor. The first grounding conductor includes a first grounding conductor portion for a wiring prohibited area in which no wiring may be placed, and a second grounding conductor portion for an area other than the wiring prohibited area. The second grounding conductor portion is positioned, in the lamination direction of the multilayer substrate, at a location is different from that of the first grounding conductor portion.

Abstract: This invention relates to the reduction of insertion losses and by consequence maximization of reflection factors for on-wafer load pull testing of high power or low noise transistor chips, using as much a direct integration as possible between the slotted airline of the tuners and low loss probes, said probes being either modified commercial probes or probes made as an extension of the tuner slotted airline itself.

Abstract: A coaxial connection is electromagnetically shielded at an interface between a surface mountable coaxial connector and a planar circuit operating in the radio frequency (RF) and microwave frequency ranges. In addition or alternatively, the coaxial connection reduces a potential impedance mismatch associated with attaching a coaxial transmission line of the coaxial connector to a planar transmission line of the planar circuit.

Abstract: A cut via is formed in an end of a multilayer circuit board of the first transmission line, and a clearance is provided between the cut via and a ground pattern for achieving an impedance matching between the first and second transmission lines. The cut via of a first transmission line which may be a stripline or a microstrip line, and an electrode of the second transmission line are connected to each other, and ground patterns of the first and second transmission lines are connected to each other. The first and second transmission lines have respective signal lines positioned substantially coaxially with each other.

Abstract: A coaxial transmission line having intermediary segments of equal lengths and equidistant insulator supports is provided. The transmission line segment and insulator support spacing is designed to cause any reflection artifacts to occur outside or between desired channel bands.

Abstract: A connector providing an offset interconnect has a dielectric body with first and second longitudinally opposed and laterally offset portions and an internal cavity. An offset electrically conductive path is disposed within the internal cavity. The offset electrically conductive path extends from the first portion of the dielectric body to the second portion of the dielectric body. A compressible conductor is disposed within the internal cavity in the second portion of the dielectric body.

Abstract: An IC socket receives an IC provided with arrayed terminals. In the IC socket, a conductive block is formed with a first face opposing to the received IC, and a plurality of holes arrayed in association with the terminals of the received IC. Each of a plurality of contact probes is disposed in each of the holes, and is provided with a conductive pipe, and a conductive plunger, retractably provided at a first end of the pipe, the plunger being to be brought into contact with an associated one of the terminals. A retainer provided with an insulative member through which the pipe is coaxially held within an associated one of the holes while forming a gap between an outer periphery of the pipe and an interior wall of the associated one of the holes. At least one of the contact probes to be brought into contact with an RF signal terminal among the terminals of the received IC is retained by the retainer.

Abstract: A surface mount technology (“SMT”) apparatus for use in routing radio frequencies (“RF”) between cavities that require a high level of isolation on a single printed circuit board (“PCB”). The SMT part is attached to the PCB over a stripline-ready trace which transitions to microstrip before and after the SMT stripline part to maintain consistent characteristic impedance. When presented with a high isolation need between two cavities using microstrip transmission lines, the proposed stripline SMT apparatus under the isolation wall will tend to provide the necessary isolation. The present invention provides a repeatable and reliable interconnect while improving the electrical match between the two cavities. Furthermore, the invention removes the costs associated with manually forming and soldering cables between PCBs.

Abstract: An improved connecting device produces an electrical connection between two antenna element arrangements which are offset with respect to one another. The connecting device has a housing arrangement which forms an outer conductor. The housing arrangement has a base, circumferential side wall sections with two opposite longitudinal side walls, and preferably two transverse side walls, which are provided opposite one another at the ends. An inner conductor holder is provided in the holding area which is formed by the circumferential side wall sections. An inner conductor is inserted into the inner conductor holder. The inner conductor is electrically conductively separated and/or isolated from the housing arrangement and/or from the inner conductor holder.

Abstract: A rotary non-contact connector and a non-rotary non-contact connector enable data transmission in a non-contact mode by radio transmitters-receivers by combining rotary transformers or stationary transformers and radio transmitters-receivers, and providing power systems with buffer functions by a storage means to receive supplied electric power. Each of the rotary non-contact connector and the non-rotary non-contact connector has first and second radio transmitters-receivers provided between a rotor and an annular stator of a rotary transformer and between first and second stationary members of a stationary transformer to permit two-way radio data communication in a non-contact mode. Furthermore, storage means are provided to implement a buffering function for a power system.

Abstract: A concentric ‘conductor within a via’ RF interconnect architecture, has an inner via through which at least one RF signal conductor passes. The inner conductive via is coaxially formed within and stably coaxially aligned within an outer conductive via, which serves as a coaxial ground plane that completely surrounds the inner conductive via. The outer conductive via passes through dielectric layers of microstrip or stripline structures on opposite sides of a multi printed circuit laminate.

Abstract: A connector interface provides high-frequency differential connection to a balanced cable or balanced electronic device, such as a balanced probe. The connector interface includes two coaxial structures in a single connector. When the connector interface is used in a package launch, the closeness of the center pins of the two coaxial structures facilitate connection to a balanced circuit. When used in conjunction with a balanced vector network analyzer, the connector interface can simplify calibration and testing of devices by reducing the number of connections to the calibration standards or devices being tested, and provide improved measurement accuracy.

Abstract: There is provided a thin and small size connector-less optical transmission module M which assures excellent high frequency characteristic. This optical transmission module comprises transmission line substrates and a coaxial cable for connecting these transmission line substrates and is connected to the transmission line substrate via a contact sleeve which is provided with projections fixed to the external conductor of the coaxial cable and projected in the extending direction of the coaxial cable. Since an electromagnetic field mode alleviating portion formed of a dielectric material is provided to the core wire of the coaxial cable, the thin and small size optical transmission module M can assure less amount of radiation of an interference electromagnetic wave, high frequency characteristic through connection with the coaxial cable.

Abstract: An improved radio-frequency or network connection including a basic module having two or more basic signal coupling surfaces, and a network module having two or more network signal coupling surfaces. The basic module has a basic ground coupling surface, and the network module has a network ground coupling surface. In the operating state, the basic ground coupling surface is capacitively RF coupled to the network ground coupling surface, and is aligned parallel thereto.

Abstract: An apparatus and method stabilizes a pair of parallel coaxial lines for an antenna having a tower. An upper portion of each coaxial line is suspended from the tower. A lower end of the coaxial lines is free to move vertically relative to the tower. The apparatus has an expandable element disposed along a first portion of the length of one coaxial line and a frame which rigidly ties together the two coaxial lines at a second portion of each of the lines below the expandable element. One type of expandable element includes telescoping inner conductors and telescoping outer conductors.

Abstract: A microwave device includes a circuit board having a microstrip layer, a ground plane, and a dielectric layer therebetween. The circuit board has a shield receiving slot for longitudinally receiving the end of a shield conductor of a coaxial cable. The coaxial cable also has an inner conductor having an end that extends longitudinally outwardly from the end of the shield conductor. The microstrip layer has an inner conductor contact adjacent the shield receiving slot that connects to the end of the inner conductor. The device may include a conductive layer in the shield receiving slot to connect to the ground plane. The shield receiving slot may have a T shape and extend through the circuit board. The device may include a mounting fixture connecting an end of the shield conductor to the circuit board.

Abstract: An interface to a microcircuit formed on a substrate supporting a ground plane. The substrate supports a dielectric structure having gold coated sloped sidewalls electrically connected to the ground plane. A transmission line, connected to the microcircuit, is supported by the dielectric structure. A coaxial cable is connected to the transmission line. The coaxial cable having an end stripped at an angle substantially the same as the sloped side walls of the dielectric structure, wherein the exposed length of the center conductor is bonded to the transmission line, and the outer conductor of the coax cable is bonded to the gold plating on the dielectric structure such that the angled portion of the coax cable mates with the bevel of the thick film dielectric.

Abstract: The present invention relates to optimization of communication equipment with respect to size and undesired signal interference. To this aim a ceramic feedthrough interconnection assembly is proposed in order to transport an electrical information signal to and from a communication capsule. In addition to at least one signal lead (103a, 103b) for communicating an electrical information signal, the assembly contains at least one auxiliary lead and a shield (103c, 103d, 104, 104a, 104b, 104f) that electrically shields the at least one signal lead (103a, 103b) from the at least one auxiliary lead. The shield (103c, 103d, 104, 104a, 104b, 104f) has such dimensions (d1, d2) and is positioned at such distance (d3, d4, d12) from the at least one signal lead (103a, 103b) that the electrical information signal experiences a well-defined and substantially constant impedance in the assembly. This in turn, minimizes the risk of undesired signal reflections. At the same time the assembly allows a high lead density, i.e.

Abstract: A superconducting signal transmission apparatus provided with a vacuum container 11, a superconducting electronic device 12 provided in the vacuum container 11, an input side transmission line 13 and output side transmission line 14 for connection to the superconducting electronic device 12 through the vacuum container 11, and a cooling mechanism (15, 16, 17) for cooling the superconducting electronic device 12 and further having a heat cutoff signal transmission unit 20 inserted at least at part of the input side and output side transmission lines 13 and 14. The heat cutoff signal transmission unit 20 is comprised of a substrate 31 and a flat circuit body 30 provided with a signal transmission line 32 and ground layer (33, 33-1, 33-2). The substrate 31 is comprised of a dielectric material having a small heat conductivity. The conductor portions forming the signal transmission line 32 and the ground layer are formed with thin thicknesses enabling suppression of the inflow of heat from the outside.

Abstract: A filtered button DC interconnect employing a compressible conductor such as a finely wound wire mesh imbedded within a series of dielectric and ferrite cylinders. The compressible conductor is captivated within the series of dielectric and ferrite cylinders to ensure proper contact with mating surfaces of interconnected circuits. The interconnect serves as an RF filter by providing rejection of RF and microwave frequencies between the interconnected circuits.

Abstract: A frequency selective low loss transmission system for communicating a signal using a coaxial cable of one impedance to a device of different impedance. A connector with a matching transformer is integral to the connector which terminates with a standard interface. The invention also includes a coupling mechanism to couple the coaxial cable with the connector. The invention can also include series open stub conductors for capacitive coupling to the conductors of the coaxial cable. In addition to low losses over a broad frequency range, the connector facilitates connector installation due to the series open stub conductor while reducing cost and complexity of both coaxial cable and connector.

Abstract: A coaxial module includes a conductive housing, front and rear coaxial connectors, and circuitry disposed within the housing including a removable surge protector device. The circuitry within the housing includes a circuit board, including a cutout. Disposed within the cutout is the surge protector device. The surge protector device includes pins for mounting to an edge mount of the circuit board, and the housing includes a removable cover to allow access to the cutout and the surge protector device.

Abstract: An apparatus and method for protecting die corners in a semiconductor integrated circuit. At least one irregular seal ring having two sides can be configured, wherein the irregular seal ring is located at a corner of a die utilized in fabricating a semiconductor integrated circuit. A dummy configuration for stress relief can then be arranged, wherein the dummy configuration is located at the two sides of the at least one irregular seal ring, thereby protecting the corner of the die against thermal stress and the semiconductor integrated circuit against moisture and metallic impurities. The irregular seal ring can be configured to generally comprise a non-rectangular seal ring. The irregular seal preferably comprises an octangular seal ring.

Abstract: Method and apparatus for interfacing a circuit, such as a microcircuit, with an IC. The circuit is formed on a thick film dielectric structure supported by a substrate having a cut out to receive the IC. A ground plane is formed on the substrate. The thick film dielectric structure abuts the cut out with an area having at least two projections forming at least one recess, the edge of the recess having a conductive layer in electrical communication with the ground plane. A conductive pad on top of the dielectric structure is in electrical communication with the conductive layer in the recess. A ground connection on the IC is connected to the conductive pad thereby grounding the IC.

Abstract: A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure, a microstrip structure, a stripline structure, or the like. The cable can be coupled to destination components using a variety of connection techniques, e.g., direct bonding to a circuit substrate, direct soldering to a flip chip, mechanical attachment to a component, or integration with a circuit substrate. The cable can also be terminated with any number of known or standardized connector packages, e.g., SMA, GPPO, or V connectors.

Abstract: A capacitive signal coupling device to link an antenna radiating element to a peripheral device is disclosed. The capacitive signal coupling device includes a support and at least one conductive element on a first surface of the support. The conductive element is positioned to align with the radiating element of an antenna system and also includes a connector to enable a peripheral device to be connected to a transceiver antenna system without violating the integrity of the transceiver unit itself or without interrupting the operation of the transceiver system.

Abstract: A device for a coaxial connection that is intended to connect a coaxial cable (6) to the conductive pattern (3a) of a circuit board and contains an outer conductor (1) with an inner conductor (4) that is insulated relative thereto. The device contains a longitudinal coupling element (8) that is axially slidably mounted in a recess (4a) in the inner conductor (4;6a) and arranged so as to be in capacitive communication with the inner conductor (4;6a) and connected to the conductive pattern (3a). A layer (7) of insulating material is arranged between the coupling element (8) and the recess (4a).