Abstract: Disclosed is an optical modulator module including an optical modulator configured to have a signal electrode and a ground electrode; a conductive package configured to accommodate the optical modulator and have electrical continuity with the ground electrode of the optical modulator; a substrate configured to have a ground electrode on a first surface thereof electrically connected to the package by solder or a conductive adhesive and have a signal electrode on another surface thereof; and a lead pin configured to electrically connect the signal electrode of the optical modulator to the signal electrode of the substrate.

Abstract: An improved phase shifter assembly is provided. The phase shifter assembly may comprise first and second sub-assemblies with certain common actuating elements. In one example, a first phase shifter sub-assembly is provided, the first phase shifter sub-assembly including a first phase shifter carrier, a first phase shifter printed circuit board mounted on the first phase shifter carrier, a first wiper printed circuit board coupled to an input of the first phase shifter printed circuit board and having at least a first end coupled to transmission lines on the first phase shifter printed circuit board, and at least one wiper support mechanically coupling the first wiper printed circuit board to the first phase shifter printed circuit board. A second phase shifter is similarly provided. Common actuating elements may include a pivot arm and a throw arm.

Abstract: A device interconnects two circuit boards each comprising electrical connection pads, and which are respectively placed in two cavities. The device includes intercavity microwave screening means. The device also comprises several electrical conductors that pass through the device from end to end and that are not soldered, the two ends of which conductors are respectively intended to make direct contact with the connection pads of the two circuit boards; and mechanical means for holding the two circuit boards against the device, at either end of the latter. The screening means are provided by a microwave absorber in contact with each conductor and surrounding it over all or some of its length.

Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

Abstract: A connection device for high frequency signals is disclosed. The connection device includes a printed circuit having an external face and a transmission line printed on the external face, and a coaxial connector surface mounted on the external face of the printed circuit. The transmission line is connected to the connector by means of a bump contact belonging to the transmission line. A central core of the connector is connected to the bump contact. The printed circuit has at least one internal ground plane disposed parallel to the external face and contributing to the matching of the transmission line. The internal ground plane defines a perforation therethrough that faces the bump contact.

Abstract: A transformer between waveguide and transmission-line includes a high-frequency circuit module, transmission-lines, a waveguide, and feed pins. The high-frequency circuit module has differential-pair terminals to input and output a differential signal. The transmission-lines are connected to the differential-pair terminals. The waveguide includes a first to third metal walls. The feed pins are connected to the transmission-lines inside of the waveguide. The feed pins have a first distance of approximately (?g/2) from each other. One of the feed pins has a second distance of approximately (?g*(1+2?)/4) from the third metal plane. “?g” is a wavelength in the waveguide and “?” is an integer which is equal or larger than “0”. Each of the feed pins has a third distance of approximately (a/2) from the first or second wall. “a” is length of the waveguide along the third metal wall.

Abstract: The invention relates to a multiple micro HF-contact arrangement with HF-connections for passing through or contacting in a housing opening or in a duct, in particular at the transition from coaxial line or microstrip line to a coplanar line. The HF-connection thus comprises at least two circuit boards arranged in a plane which may be connected to each other by means of a planar contact pin on one circuit board and at least one planar socket on the other circuit board.

Abstract: An apparatus for the transfer of broadband, high-frequency signals of a center wavelength (?c), including a conductor structure, which includes at least one signal path and two reference paths arranged symmetrically to the signal path. Together the conductor structure and the two reference paths form a coplanar line, with the conductor structure being arranged on two oppositely lying sides of at least one dielectric substrate layer of a predetermined thickness in such a manner that the conductor structure overlaps in predetermined coupling regions, whereby the coupling region of the conductor structure transfers the high-frequency signals by an electromagnetic coupling, wherein the thickness of the substrate layer (18) is smaller than ?c/4, and wherein multiple electromagnetic couplings are arranged serially one after the other. The apparatus enables a galvanic isolation having good transfer properties in the case of frequencies greater than 6 GHz.

Abstract: A connector comprises a coaxial connector and a metallic plate. The coaxial connector has an outer conductor, a dielectric material, a mounting wall, and a center conductor. The space between the two conductors is filled with the dielectric material. The center conductor is extended from the inside of the coaxial connector to the other side of the mounting wall. The metallic plate has a through hole and is attached to the mounting wall of the coaxial connector. The outside center conductor of the coaxial connector is placed within the through hole. Hence, the connector improves the transmission passband of the transition between a coaxial line and a microstrip line at high frequencies.

Abstract: A connector including a magnetic core and a cable. The cable includes a first conductor and a second conductor. The first conductor and the second conductor are wound around each other. The cable is wound a plurality of times through a center of and around the magnetic core. A first end of the first conductor and a first end of the second conductor are configured to connect to power line communication equipment. A second end of the first conductor and a second end of the second conductor are configured to connect to a power line.

Abstract: An interconnect for an RF detector coil comprises a substrate comprising strip of insulating material, a conducting layer formed on a first side of the substrate, and a ground layer formed on a second side of the substrate. At least one of the layers has a periodic pattern so that the conducting layer alternates along its length between capacitive regions which are opposite regions of the ground layer, and non-capacitive regions.

Abstract: In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant board coupled to the first circuit board, a second circuit board that includes integrated circuits and a second thermal spreader coupled to the integrated circuits of the second circuit board. The first circuit board and the first thermal spreader have a first thickness. The second daughter board and the second thermal spreader have a second thickness. The system further includes a second compliant board coupled to the second circuit board, a board assembly coupled to first and second compliant boards and a cold-plate assembly in contact with the first and second thermal spreaders. Either of the first or the second compliant boards is configured to expand or contract to account for the differences between the first and second thicknesses.

Abstract: A connector assembly includes, but is not limited to, a body having a top side and a bottom side. A bottom signal plate is connected to the bottom side and is configured for capacitive coupling to a conductor of a coplanar waveguide. A bottom grounding plate is connected to the bottom side and is spaced apart from the bottom signal plate. The bottom grounding plate is configured for capacitive coupling to a grounding plane of the coplanar waveguide. A first electrically conductive pathway is electrically connected to the bottom signal plate and extends to the top side. A second electrically conductive pathway is electrically connected to the bottom grounding plate and extends to the top side. A dielectric adhesive at least partially covers a bottom portion of the connector assembly.

Abstract: A transmission line and method for implementing includes a plurality of segments forming an electrical path and a continuous optical path passing through the segments. Discrete inductors are formed between and connect adjacent segments. The inductors are formed in a plurality of metal layers of an integrated circuit to balance capacitance of an optical modulator which includes the transmission line to achieve a characteristic impedance for the transmission line.

Abstract: An integrated circuit comprising: a substrate; a first transmission line arranged on the substrate, the first transmission line having a first termination; a die having a first surface on the substrate and an opposed second surface, the die being spaced from the first termination; a second transmission line arranged on the second surface of the die, the second transmission line having a second termination; and a bond wire connected between the first termination and the second termination configured to have a length half the wavelength of the signal central frequency.

Abstract: A lead terminal includes signal lead pins and GND lead pins. The signal lead pin connects one signal pattern on a flexible substrate and another signal pattern on a rigid substrate. The GND lead pin connects one GND pattern on the flexible substrate and another GND pattern in the rigid substrate. A holding member has an insulating property and holds pairs of the signal lead pins and the GND lead pins at a distance. One main part of the signal lead pin and another main part of the GND lead pin form a microstrip line structure.

Abstract: A magnetic field method for mitigating passive intermodulation distortion. The method is useful both for mitigating passive intermodulation and for easily locating dominant sources of it, even in shielded components.

Abstract: A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.

Abstract: A high-speed feedthrough (HSFT) is disclosed for transmitting a signal having a highest frequency of at least 10 GHz between first and second locations separated by a vertical distance of at least approximately half of the shortest transmitted wavelength, and separated by a horizontal distance. A substrate structure includes multiple stacked layers. An RF transmission line is connected through the structure between the first and second locations for transmitting the signal. The RF transmission line comprises a series of sequentially connected horizontal conductors having lengths less than half of the effective wavelength and vertical conductors having heights less than one quarter of the effective wavelength, thereby spanning the horizontal and vertical distance between the two locations in a stairs-like shape through the structure's layers. Each conductor's geometry may deviate from standard 50 ohm buried strip lines and is optimized for complete 3-dimensional structure.

Abstract: Vias for differential signals are typically of a lower impedance than the signal lines connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. One or more embodiments of the present invention avoid impedance mismatch in circuits and achieve an advance in the art by providing a via with higher impedance through the addition of split ring resonators (SSRs) to each end of the via.

Abstract: In a microwave transition from a coaxial line (1) to a coplanar line system (3), in a longitudinal hole (5) of an outer conductor housing (6), the round inner conductor (4) of the coaxial line (1) continues in a planar inner conductor in the form of a narrow piece of foil (9), of an elastically flexible insulating material and metalized on at least one side. The end of this planar inner conductor (9, 10) then narrows in a transition section (16) to the width of a coplanar middle conductor (13; 20), with coplanar earthing areas (14, 15; 21, 22) on both sides.

Abstract: A connector for transmitting signals using electrostatic coupling, comprises an inner first conductor portion and an outer first conductor portion respectively connected to two signal lines, an inner electrode portion having a facing area larger than the cross-sectional area of the inner first conductor portion in the direction perpendicular to the direction of the common axis, an outer electrode portion outside it, an inner second conductor portion for electrically connecting between the inner first conductor portion and the inner electrode portion, and an outer second conductor portion outside it, wherein the ratio of outer diameter of the inner second conductor portion to inner diameter of the outer second conductor portion is set to provide substantially fixed characteristic impedance at every position along the direction of the common axis.

Abstract: A connector comprises a coaxial connector and a metallic plate. The coaxial connector has an outer conductor, a dielectric material, a mounting wall, and a center conductor. The space between the two conductors is filled with the dielectric material. The center conductor is extended from the inside of the coaxial connector to the other side of the mounting wall. The metallic plate has a through hole and is attached to the mounting wall of the coaxial connector. The outside center conductor of the coaxial connector is placed within the through hole. Hence, the connector improves the transmission passband of the transition between a coaxial line and a microstrip line at high frequencies.

Abstract: A coaxial transition includes a first conductor aligned along a first axis. The transition also includes a ground shield surrounding the first conductor such that a first gap exists between the first conductor and the ground shield. An electric field radiates between the first conductor and the ground shield through the first gap. The transition further includes a second conductor aligned along a second axis and coupled to the first conductor. The second conductor forms a second gap between the second conductor and a portion of the ground shield. A first portion of the electric field radiates between the second conductor and the ground shield through the second gap. The transition also includes a top ground plane aligned substantially parallel to the second conductor. A third gap exists between the top ground plane and the second conductor. The second gap and the third gap are substantially parallel with the second conductor therebetween.

Abstract: In one example embodiment, a coplanar waveguide signal transition element transitions high-speed signals between vertically stacked coplanar waveguide transmission lines. The signal transition element comprises one or more dielectric layers and a plurality of electrically conductive vias extending through at least a portion of the one or more dielectric layers. The vias include one or more signal vias and one or more ground vias that are configured to transition signals between the vertically stacked coplanar waveguide transmission lines. The signal transition element also comprises a ground plane disposed within the one or more dielectric layers and electrically coupled to the one or more ground vias. The ground plane has one or more openings through which the one or more signal vias respectively pass.

Abstract: Described herein are an apparatus, system, and method having a compact symmetrical transition structure for RF applications. The apparatus comprises: first and second ground planes each of which having respective truncated edges, the first and second ground planes being parallel to one another and separated by a multi-layer substrate; a strip line positioned between the first and second ground planes; and a symmetrical transition structure, coupled to the strip line and the first and second ground planes near their respective truncated edges, and further coupled to a broadside coupled line (BCL).

Abstract: A printed wiring board having at least one connector includes a dielectric substrate that has, on a first face, a first ground plane, and on a second face, at least two transmission lines between which the connector and a footprint are mounted. The footprint includes a first element positioned between the two transmission lines under the connector. The first element forming with the first ground plane, a capacitive element and, at each extremity of the first element, second elements forming with the first element, a self-inductive and capacitive element. The second elements each extending by a second ground plane, the second ground planes which are connected to the first ground plane.

Abstract: A high frequency and wide band impedance matching via is provided, applicable to multi-layer printed circuit boards, for example. The multi-layer circuit board may include several signal transmission traces, several ground layers, signal transmission vias and ground vias. The signal transmission traces and the ground layers may be sited on different circuit layers, and each signal transmission trace may be opposite to one of the ground layers. The signal transmission vias may be connected between the signal transmission traces. The ground vias may be connected between the ground layers. The ground vias may be opposite to the signal transmission vias, and the ground vias corresponding to the signal transmission vias may be sited to stabilize the characteristic impedance of the transmission traces.

Abstract: A coaxial to transmission line connector has a connector and an attachment area with a windowed electrical attachment point that when soldered in place on a ground reference of an electrical device, creates an electrical and mechanical connection between an outer conductor of the coaxial to transmission line connector. The attachment area has at least one mechanical alignment point and a corresponding reference pivot point located substantially co-planar at the termination of the coaxial dielectric region at an edge of a PCB and a port of the coaxial to transmission line connector. The at least one mechanical alignment point and the corresponding reference pivot plane serve to automatically align the coaxial to transmission line connector to the electrical device. Opposite the attachment area is a dielectric area following termination of the outer conductor in the transition area of the microstrip transmission line.

Abstract: The present invention provides a capacitive grounded RF coaxial cable to airstrip transition which comprises a conductive ground plane, an insulating gasket, a reflector plate and an insulating fixing component. The conductive ground plane, the insulating gasket and the reflector plate are attached uniformly and tightly in sequence and fixed together by the insulating fixing component. The outer surface of the conductive ground plane is connected conductively with the outer conductor of the RF coaxial cable. Preferably, the conductive ground plane is a metal plate and the insulating gasket is a plastic gasket. The capacitive grounded RF coaxial cable to airstrip transition further comprises at least one perforation penetrating the conductive ground plane, the insulating gasket and the reflector plate in sequence. The insulating fixing component includes at least one insulating rivet and at least one conductive supporting piece is arranged on the outer surface of the conductive ground plane.

Abstract: An electronic plug-in module for accommodation in a module rack with a mounting rail, wherein the plug-in module includes a circuit board, a front plate and a mounting device, the mounting device comprises a bearing part, a tensioning part and a fixation element, the bearing part is fixed on front plate, and the tensioning part is connected frictionally to the fixation element and the bearing part in such a manner that a force, by means of which the plug-in module is held with its front plate in a defined position relative to the module rack, is exerted onto the plug-in module transversely to the insertion direction of the plug-in module.

Abstract: A printed circuit board (PCB) includes a differential pair having a first differential trace and a second differential trace, a first via having an upper cap and a lower cap, and a second via having an upper cap and a lower cap. The first differential trace includes a first segment and a second segment, the second differential trace includes a third segment and a fourth segment. The first and the third segments are electrically coupled to the upper caps of the first and the second vias respectively. The second and the fourth segments are electrically coupled to the lower caps of the first and the second vias respectively. The first and the third segments extend from corresponding upper caps in different directions, the second and the fourth segments extend from corresponding lower caps in different directions.

Abstract: An electrical interconnect system includes a first circuit board that includes at least one via, and a conductor configured to transmit an electrical current therethrough. The conductor includes a first signal contact extending from a conductor first end, and a dielectric cylinder configured to receive the conductor therethrough. The dielectric cylinder includes a first bellows element extending from a first end of the dielectric cylinder that is positioned adjacent to the first signal contact. The first bellows element and the dielectric cylinder are configured to form a substantially continuous outer conductor, wherein the conductor and the first bellows are configured to electrically interface to the via and maintain connection thereto using a biasing force.

Abstract: A connector assembly includes, but is not limited to, a body having a top side and a bottom side. A bottom signal plate is connected to the bottom side and is configured for capacitive coupling to a conductor of a coplanar waveguide. A bottom grounding plate is connected to the bottom side and is spaced apart from the bottom signal plate. The bottom grounding plate is configured for capacitive coupling to a grounding plane of the coplanar waveguide. A first electrically conductive pathway is electrically connected to the bottom signal plate and extends to the top side. A second electrically conductive pathway is electrically connected to the bottom grounding plate and extends to the top side. A dielectric adhesive at least partially covers a bottom portion of the connector assembly.

Abstract: A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.

Abstract: Coaxial-to-microstrip transitions may include a microstrip line and coaxial-line assembly. The microstrip line includes a first dielectric having an aperture, a conductive strip disposed on one primary face of the first dielectric, and a ground plane disposed on the opposite primary face of the first dielectric. The coaxial-line assembly includes an outer conductor and an inner conductor. In some examples, the ground plane extends between the outer conductor and the inner conductor on a first side of the coaxial-line assembly proximate the conductive strip and an aperture cross section extends beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip. In some examples, the ground plane has a non-circular aperture. In some examples, the outer conductor encloses an area that is less than an area of the aperture. In some examples, the enclosed area has a width that is less than a corresponding width of the first aperture.

Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

Abstract: In one example, a hybrid surface mountable package includes a housing at least partially defining a sealed cavity, two microwave integrated circuits (MIC) chips positioned inside the sealed cavity, and a very-high-speed interconnect connecting the two MIC chips to each other. The very-high-speed interconnect includes strong coupling co-planar waveguide (CPWG) transmission lines.

Abstract: An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.

Abstract: In one example embodiment, a high-speed package includes first and second layers and a multi-channel non-coplanar interconnect. The first layer includes first and second sets of coplanar transmission lines. The second layer includes third and fourth sets of coplanar transmission lines. The multi-channel non-coplanar interconnect includes first and second channels. The first channel connects the first set of transmission lines to the third set of transmission lines. The second channel connects the second set of transmission lines to the fourth set of transmission lines.

Abstract: A phase adjustable adapter that can maintain its value of characteristic impedance in a manner that is independent of its electrical length. Embodiments of the adapter include a center conductor and an adapter body in surrounding relation to the center conductor so as to form an insulative gap. The adapter body has form factor that is defined by the ratio of an outer dimension of the adapter body to the length of the adapter body, where the form factor changes in accordance with the change in the length of the adapter body.

Abstract: A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnecting the first transmission line and the second transmission line. The conduit includes a signal conductor and an electrically grounded shield substantially surrounding the signal conductor. The conductor and the shield are positioned relative to each other to thereby comprise a means for lowpass filtering the signal. A cutoff frequency of the lowpass filtering is less than a third harmonic of the fundamental frequency.

Abstract: Signal modules and methods for electrically interfacing with an electronic device are provided. The signal module includes a dielectric and a conductor extending through a surface of the dielectric. The surface of the dielectric is located away from perpendicular relative to an axis of the conductor and is located based on an electromagnetic field produced as a result of a signal flowing through the conductor.

Abstract: A coaxial transition arrangement including a coaxial connector for connecting a coaxial cable to a multilayer package has an improved coaxial connector for accomplishing impedance matching and providing improved broadband performance. Impedance matching is provided by a metal disk structure comprising a plurality of metal disks mounted on a center conductor pin of the coaxial connector. The disks are mounted in spaced-apart relation on the center conductor pin and have different radiuses which decrease with increasing distance from the base of the center conductor pin. The coaxial connector has a shroud which is configured to accommodate the metal disk structure therein, as does the ring of ground vias forming a part of the multilayer package.

Abstract: The present invention relates to a transmission line to waveguide transition arrangement comprising a dielectric carrier material arrangement having a first main side and a second main side, the arrangement comprising a transition portion with an opening, having at least one edge and an electrically conducting border which follows the opening and is electrically connected to a ground metalization on the second main side. A transmission line conductor extends in the dielectric carrier material arrangement towards the border. The arrangement further comprises a transitional part with a border contact section having an outer circumference that essentially follows the border's shape except for a gap dividing the border contact section. The transitional part further comprises a conductor contact section which protrudes from the border contact section through the gap, contacting the end of the transmission line conductor and extending into the opening.

Abstract: Coaxial-to-microstrip transitions may include a microstrip line and coaxial-line assembly. The microstrip line includes a first dielectric having an aperture, a conductive strip disposed on one primary face of the first dielectric, and a ground plane disposed on the opposite primary face of the first dielectric. The coaxial-line assembly includes an outer conductor and an inner conductor. In some examples, the ground plane extends between the outer conductor and the inner conductor on a first side of the coaxial-line assembly proximate the conductive strip and an aperture cross section extends beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip. In some examples, the ground plane has a non-circular aperture. In some examples, the outer conductor encloses an area that is less than an area of the aperture. In some examples, the enclosed area has a width that is less than a corresponding width of the first aperture.

Abstract: A waveguide quick disconnect clamp includes a first arm and a second arm, both arms having a first end, a second end, and a jaw pivotally connected to the second end. Each of the first and second arm jaws has a generally flat engaging face defining two generally parallel elongated sections and a waveguide receiving recess therebetween. The second arm second end is pivotally connected to the first arm at a position intermediate the first arm first and second ends, and a threaded nut is pivotally connected to the first arm first end. The waveguide quick disconnect clamp also has an adjustment screw having a first end, a second end, and a threaded portion therebetween. The adjustment screw first end pivotally engages the second arm at a point intermediate the second arm first and second ends, and the threaded portion of the screw engages the threaded nut.

Abstract: A method for coupling a radio frequency electronic device (14) to a passive element (12), such as an antenna, the passive element including a body having an impedance at the operating frequency. the method comprises the steps of attaching a conductive pad having a shape and area corresponding to the predetermined shape and coupling area on the surface of passive element in a nonpenetrating manner, and electrically connecting the device to the conductive pad, such that, in use, the pad and the body have an impedance that is substantially capacitively reactive in nature defined therebetween, whereby the pad is electrically coupled to the body to facilitate: the transfer of electromagnetic energy at the operating radio frequency between the body and the pad. The conductive pad may take the form of a discrete conductive member attached to the passive element by an adhesive or by a biasing member. Alternatively, the conductive pad may take the form of a metallization layer formed on the passive element.

Abstract: A coaxial to transmission line connector has a connector and an attachment area with a windowed electrical attachment point that when soldered in place on a ground reference of an electrical device, creates an electrical and mechanical connection between an outer conductor of the coaxial to transmission line connector. The attachment area has at least one mechanical alignment point and a corresponding reference pivot point located substantially co-planar at the termination of the coaxial dielectric region at an edge of a PCB and a port of the coaxial to transmission line connector. The at least one mechanical alignment point and the corresponding reference pivot plane serve to automatically align the coaxial to transmission line connector to the electrical device. Opposite the attachment area is a dielectric area following termination of the outer conductor in the transition area of the microstrip transmission line.

Abstract: A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.