Abstract: Coaxial-to-microstrip transitions may include a microstrip line and coaxial-line assembly. The microstrip line includes a first dielectric having an aperture, a conductive strip disposed on one primary face of the first dielectric, and a ground plane disposed on the opposite primary face of the first dielectric. The coaxial-line assembly includes an outer conductor and an inner conductor. In some examples, the ground plane extends between the outer conductor and the inner conductor on a first side of the coaxial-line assembly proximate the conductive strip and an aperture cross section extends beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip. In some examples, the ground plane has a non-circular aperture. In some examples, the outer conductor encloses an area that is less than an area of the aperture. In some examples, the enclosed area has a width that is less than a corresponding width of the first aperture.

Abstract: A connector has data signal conductors for communicating data signals and voltage reference (power and ground) conductors for the signals' return currents. Voltage reference conductors carrying the same voltage level are coupled together at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals. Decoupling capacitors may alternatively or additionally be inserted between pairs of voltage reference conductors carrying high and low voltage levels at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals.

Abstract: In a microwave transition from a coaxial line (1) to a coplanar line system (3), in a longitudinal hole (5) of an outer conductor housing (6), the round inner conductor (4) of the coaxial line (1) continues in a planar inner conductor in the form of a narrow piece of foil (9), of an elastically flexible insulating material and metallised on at least one side. The end of this planar inner conductor (9, 10) then narrows in a transition section (16) to the width of a coplanar middle conductor (13; 20), with coplanar earthing areas (14, 15; 21, 22) on both sides.

Abstract: The invention relates to a coaxial connecting part which is used to connect a coaxial plug socket to a circuit carrier in an internal conductor. An elastically flexible bellows made of a conductive material is incorporated therein in order to keep axial and radial forces, occurring at the beginning of the socket, away from the substrate.

Abstract: An apparatus providing a low impedance transition from a pulse generator to one or more helical antennae. Conventional transition from coaxial-to-antenna causes energy loss. The present invention decreases that loss.

Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract: Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

Abstract: A spring loaded microwave interconnector (SLMI). The SLMI includes a waveguide probe head having a first side and opposite thereto a second side, the sides transverse to a central axis. A spring loaded coax central conductor coupled to the probe head first side and provides a distal conductive tip. The coax central conductor extends along the central axis. A dielectric sleeve is disposed about the coax central conductor adjacent to the first side. The distal conductive tip extending beyond the dielectric sleeve when in an extended position and is about flush with the dielectric sleeve when in a compressed poison. An multiport waveguide to multiport PCB assembly utilizing a plurality of SLMIs wherein the multiport waveguide and PCB have curved contours is also disclosed.

Abstract: A mechanism is provided for coupling a coaxial cable to a planar circuit to provide galvanic isolation between the coaxial cable and the planar circuit while providing low transmission loss and reflections between the coaxial cable and the circuit. The mechanism comprises a co-planar waveguide coupled to the coaxial cable, a microstrip line connected to the circuit, a galvanic isolation component and a ground plane. The co-planar waveguide, the microstrip line and the galvanic isolation component are formed on one side of a two-sided substrate. The ground plane is formed on the other side of the substrate and underlies at least a portion of the co-planar waveguide to form a grounded co-planar waveguide. The ground plane includes a notch underlying a portion of the co-planar waveguide to provide a transition region from the co-planar waveguide to the grounded co-planar waveguide.

Abstract: A microstrip line includes a signal strip conductor and a ground conductor. A coplanar line includes two regions. A first region includes a signal strip conductor which is connected to the signal strip conductor of the microstrip line via a wire or the like and a ground strip conductor which continues to the ground conductor. A second region is formed with a ground strip conductor formed above the ground strip conductor via a through hole. A transmission mode changes itself in the microstrip line, the first region of the coplanar line, and the second region of the coplanar line in the sequence as described. This enables converting the transmission mode efficiently from the microstrip line to the coplanar line.

Abstract: A substrate module includes a first substrate and a second substrate. The first substrate comprises a base material; a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material; a ground pattern on the rear surface of the base material; and an exposed portion in which the ground pattern on the substrate surface is exposed by partially cutting out the base material and the ground pattern on the substrate rear surface. The second substrate comprises a base material and a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material. In connecting a transmission line of the first substrate and that of the second substrate, the ground patterns of the first and second substrates are fused with each other at the exposed portion and fixed.

Abstract: A coaxial cable splitter including an integral body with a first cable connection, a second cable connection and a third cable connection, each defining an axis. The second cable connection is a crimp sleeve, the first cable connection is a coaxial connector, and the axes are generally parallel to each other. The third cable connection is a coaxial cable connector and the axis is at an angle to the axes of the first and second cable connections. The first and third cable connections each include a center conductor which are electrically linked. The first and third cable connections each include an outer shell positioned about the center conductor which are electrically linked. A method of assembling a coaxial cable splitter with an integral body.

Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract: A connector has data signal conductors for communicating data signals and voltage reference (power and ground) conductors for the signals' return currents. Voltage reference conductors carrying the same voltage level are coupled together at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals. Decoupling capacitors may alternatively or additionally be inserted between pairs of voltage reference conductors carrying high and low voltage levels at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals.

Abstract: A compact end launch transition for providing a connection between a housing having an electrical terminator and a waveguide component and associated method are described. The transition includes a having a rear side presenting a substantially flat surface to abut the housing and has a front side having an aperture. An antenna located within the body is configured to interact with the aperture to form an end launch transition. An electrical connector is in electrical communication with the antenna and exposed from the rear side of the body to connect directly to the electrical terminator. This avoids the need to use cable to connect the housing and waveguide component and provides a particularly compact device.

Abstract: A system and method is provided for coupling a power source across a rotation boundary. A generator converts a DC source on the stationary side of a rotation boundary to a square-wave at a determined frequency. The generator output connects through a transmission line and a first transformer to a set of stator rings. A set of rotor rings form a set of coupling capacitors with the stator rings. The rotor rings connect through a second transformer and a transmission line to a non-linear circuit capable of converting the square-wave to a DC voltage and current that can power a load on the rotating side of the rotating boundary in which the power is nearly equal to the power available from the source on the stationary side of the rotation boundary.

Abstract: A coupling structure for coupling a device operable at a radio frequency with a body is formed of a polymeric material loaded with a conductive filler. A portion of the surface of the body defines a coupling area of a predetermined shape that receives a conductive pad having a shape and area corresponding to the predetermined shape and coupling area. The conductive pad is positioned on the surface of the body in non-penetrating contact with the body such that, in use, the pad and the body have an impedance, substantially capacitively reactive in nature, defined therebetween that is less than the impedance of the body at the operating frequency, thereby facilitating the transfer of electromagnetic energy at the operating radio frequency between the body and the pad.

Abstract: A motherboard includes a signal control chip, a signal switch chip connected to the signal control chip via a plurality of first transmission lines, and a complex connector configured for connecting to a first type of transmission device or a second type of transmission device. The signal control chip is connected to the complex connector via the first transmission lines and a plurality of second transmission lines. The signal switch chip is electrically connected to the complex connector via a plurality of third transmission lines. Each second transmission line is connected in series with a first resistor. Each third transmission line is connected in series with a second resistor. When the first type of transmission device is mounted on the complex connector, the signal switch chip and the second resistors are removed. When the second type of transmission device is mounted on the complex connector, the first resistors are removed.

Abstract: A mechanism is provided for coupling a coaxial cable to a planar circuit to provide galvanic isolation between the coaxial cable and the planar circuit while providing low transmission loss and reflections between the coaxial cable and the circuit. The mechanism comprises a co-planar waveguide coupled to the coaxial cable, a microstrip line connected to the circuit, a galvanic isolation component and a ground plane. The co-planar waveguide, the microstrip line and the galvanic isolation component are formed on one side of a two-sided substrate. The ground plane is formed on the other side of the substrate and underlies at least a portion of the co-planar waveguide to form a grounded co-planar waveguide. The ground plane includes a notch underlying a portion of the co-planar waveguide to provide a transition region from the co-planar waveguide to the grounded co-planar waveguide.

Abstract: A transmission line conversion apparatus connecting a parallel transmission line to a coplanar waveguide (CPW) is provided. To this end, the CPW including a transmission line composed of a signal line and a ground line which is formed on one surface of a dielectric substrate, and a parallel transmission line connected to the CPW, at a predetermined angle with respect to a substrate constituting the CPW, and composed of a signal line and a ground line, are proposed. In addition, the signal line of the CPW and the signal line of the parallel transmission line are connected to each other, and the ground line of the CPW and the ground line of the parallel transmission line are connected to each other. As such, by connecting the CPW to the parallel transmission line, a return loss can be minimized.

Abstract: A feedthrough for feeding a microwave signal through a wall of a casing comprises a signal waveguide having at least two portions having different cross-sections. The portion having the smaller cross-section is filled with plastically-deformable dielectric material which, under the action of pressure and heat, is bonded to the walls of the portion in which it is located. The dimensions of the portion are such as to provide an impedance match with the adjacent portions. An antenna couples electromagnetic energy between the waveguide and a strip transmission line. A metal cap seals the end of the waveguide and screens the antenna.

Abstract: In one example, a hybrid surface mountable package includes a housing at least partially defining a sealed cavity, two microwave integrated circuits (MIC) chips positioned inside the sealed cavity, and a very-high-speed interconnect connecting the two MIC chips to each other. The very-high-speed interconnect includes strong coupling co-planar waveguide (CPWG) transmission lines.

Abstract: Provided is a microwave module having a converter for improving transmission characteristics in a millimeter-wave band. When a microstrip transmission line and a conductor-backed coplanar waveguide (CBCPW) transmission line are connected by wire bonding, a change in impedance caused by wire bonding and an abrupt change in electric field components between the two transmission lines are reduced by the converter. Therefore, insertion loss and return loss are reduced, and transmission characteristics in a millimeter-wave band are improved.

Abstract: A mechanism for coupling a coaxial cable (108) to a planar circuit to provide galvanic isolation between the coaxial cable and the planar circuit while providing low transmission loss and reflections between the coaxial cable (108) and the circuit. The mechanism comprises a co-planar waveguide (211) coupled to the coaxial cable (108), a microstrip line (240) connected to the circuit, a galvanic isolation component (234) and a ground plane (222). The co-planar waveguide (211), the microstrip line (240) and the galvanic isolation component (234) are formed on one side (203) of a two-sided substrate (202). The ground plane (222) is formed on the other side (205) of the substrate (202) and underlies at least a portion of the co-planar waveguide (211) to form a grounded co-planar waveguide (221). The ground plane (222) includes a notch (224) underlying a portion of the co-planar waveguide (211) to provide a transition region (225) from the co-planar waveguide (211) to the grounded co-planar waveguide (221).

Abstract: Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

Abstract: The invention relates to a device for coupling low-frequency high-power ultrasound resonators by a tolerance-compensating force-transmitting connection having at least one contact surface between the at least two resonators on or proximate to the oscillation maximum of the oscillation to be transmitted by the coupling for the purpose of transmitting low-frequency ultrasound power between the resonators coupled in this manner.

Abstract: An electronic device includes a first transmission line, a second transmission line and a ground-coupling portion. The first transmission line is composed of a first signal line transmitting a given high frequency wave signal and a first ground. The second transmission line is composed of a second signal line transmitting the high frequency wave signal and a second ground. The ground-coupling portion couples the first ground and the second ground. A phase difference between the high frequency wave signals at both ends of the ground-coupling portion is substantially integral multiple of 180 degrees.

Abstract: A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.

Abstract: A method for coupling power across a non-conducting membrane. A generator converts a DC source on a first side of a non-conducting membrane to a square-wave at a determined frequency. The generator output connects to a transformer and onto a first set of capacitor plates on the first side of the membrane. A second set of plates on the second side of the membrane form a set of coupling capacitors wherein the non-conducting dielectric membrane becomes part of the coupling-capacitor dielectric material. The second set of plates connects to a transformer and onto a non-linear circuit that converts the square-wave to DC voltage and current that can power a load such that the power delivered is approximately equal to the power available from the DC source on the first side of the membrane. The coupling capacitors may be replaced by coupled coils with nearly the same power delivery effect.

Abstract: A printed circuit board (PCB) includes at least one signal layer, a ground layer, at least two signal lines, and at least one grounded line. The signal lines are arranged on the signal layer for transmitting signals. The grounded line is arranged on the signal layer and between the signal lines. A plurality of vias are defined in the grounded line, and the vias are connected to the ground layer. A distance between each two adjacent vias is so arranged that a resonant frequency of an electromagnetic wave transmitted on the grounded line must greater than a highest frequency of the signals transmitted on the signal lines. A related method for designing the PCB is also provided.

Abstract: In an embodiment of the invention, a package for high frequency waves mounted by a high frequency electronic circuit comprises an hermetic box-shaped high frequency package containing a high frequency electronic circuit in the inside and shielded by a conductor, an input terminal and an output terminal partly led out to the outside of the high frequency package, an input side feed-through section having one of its opposite ends connected to the input terminal and the other end connected to the high frequency electronic circuit and having a predetermined characteristic impedance; and an output side feed-through section having one of its opposite ends connected to the output terminal and the other end connected to the high frequency electronic circuit and having a characteristic impedance lower than the characteristic impedance of the input side feed-through section as viewed from the output terminal side.

Abstract: A dielectric connector, for coupling radio-frequency signals from a signal generating device disposed inside an explosion-proof housing to a signal receiving device arranged outside the housing. The connector is configured to be sealingly inserted in an opening in the housing, and adapted to receive, from the inside of the housing, at least one internal conducting member, and receive, from the outside of the housing, at least one external conducting member. At least one of the conducting members is partly inserted in the connector and reactive (capacitive and/or inductive) coupling and galvanic separation is provided between the signal generating device and the signal receiving device. A combination of strong reactive coupling and secure operation in hazardous environments is enabled through the dielectric connector according to the present invention.

Abstract: Terminal electrodes 9 for carrying a high frequency device 3 are formed on a surface of a circuit board having its reverse surface covered with a reverse surface conductor layer 6, and a plurality of signal lines 2 for exchanging a signal between the high frequency device 3 and an external circuit are formed thereon. The terminal electrode 9 is arranged at the center of the circuit board, and the signal lines 2 radially extends from the terminal electrode 9. Electromagnetic interference between the signal lines 2 can be reduced, so that out-of-band attenuation characteristics and isolation characteristics can be satisfactorily exhibited in a case where the high frequency device 3 is a duplexer.

Abstract: A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.

Abstract: In some embodiments, an circuit card includes an electronic circuit substrate, a ground plane on the electronic circuit substrate, first and second differential signal pads on the electronic circuit substrate, a ground return signal pad associated with the first and second differential signal pads, the ground return signal pad being connected to the ground plane on the electronic substrate, and a cutout structure on the ground plane positioned near a location where the ground return signal pad connects to the ground plane, wherein the cutout structure is configured to direct a ground return path associated with the first and second differential signal pads to the ground return signal pad associated with the first and second differential signal pads. Other embodiments are disclosed and claimed.

Abstract: This disclosure concerns systems and devices configured to implement impedance matching schemes in a high speed data transmission environment. In one example, an electrical connection system is provided that includes a circuit board upon which are disposed a one or more signal contact pads, each of which is configured to communicate with a complementary element of an external electrical device such that a respective shunt capacitance is defined. One or more of the signal contact pads define at least one open portion through which communication signals cannot pass. The open portions of the one or more signal contact pads are configured to reduce a shunt capacitance that is defined at the coupling of each signal contact pad and corresponding connector. As well, one or more signal lines are likewise disposed on the circuit board such that each signal line is connected to a respective one of the signal contact pads. The circuit board finally includes one or more ground contact pads and power contact pads.

Abstract: A signal transmission structure is at the edge of a circuit board, and the circuit board is connected with a coaxial cable connector through the signal transmission structure. The coaxial cable connector has a signal pin and a plurality of supporting pins for clipping the circuit board. The signal transmission structure includes a reference plane and a conductive layer. The reference plane with a non-conductive area is inside the circuit board. The conductive layer is disposed on the surface of the circuit board and above one side of the reference plane. The conductive layer includes a signal pad and a signal line. The signal line is connected with the signal pad, and the signal pad is further connected with the signal pin of the coaxial connector. The projections of the signal pad and the portion of the signal line on the reference plane are in the non-conductive area.

Abstract: A method for impedance matching between differential vias and associated transmission lines is provided. The method includes: deducing a relationship of a space between the differential vias, and a radius of the differential vias while a characteristic impedance of the differential vias matches a characteristic impedance of the differential transmission lines; and determining the space and the radius according to the relationship between the space and the radius.

Abstract: A spring loaded microwave interconnector (SLMI). The SLMI includes a waveguide probe head having a first side and opposite thereto a second side, the sides transverse to a central axis. A spring loaded coax central conductor coupled to the probe head first side and provides a distal conductive tip. The coax central conductor extends along the central axis. A dielectric sleeve is disposed about the coax central conductor adjacent to the first side. The distal conductive tip extending beyond the dielectric sleeve when in an extended position and is about flush with the dielectric sleeve when in a compressed poison. An multiport waveguide to multiport PCB assembly utilizing a plurality of SLMIs wherein the multiport waveguide and PCB have curved contours is also disclosed.

Abstract: A signal transmission structure for connecting a coaxial cable connector is provided. The coaxial cable connector has a signal pin. The signal transmission structure includes a reference plane and a conductive layer, and the conductive layer is located on one side of the reference plane. Moreover, the conductive layer includes a signal perforated pad, a first line segment, a second line segment, and a compensation pad. The signal pin is suitable for threading the signal perforated pad. The first line segment is connected to the signal perforated pad, and the compensation pad is connected between the first line segment and the second line segment.

Abstract: A waveguide quick disconnect clamp includes a first arm and a second arm, both arms having a first end, a second end, and a jaw pivotally connected to the second end. Each of the first and second arm jaws has a generally flat engaging face defining two generally parallel elongated sections and a waveguide receiving recess therebetween. The second arm second end is pivotally connected to the first arm at a position intermediate the first arm first and second ends, and a threaded nut is pivotally connected to the first arm first end. The waveguide quick disconnect clamp also has an adjustment screw having a first end, a second end, and a threaded portion therebetween. The adjustment screw first end pivotally engages the second arm at a point intermediate the second arm first and second ends, and the threaded portion of the screw engages the threaded nut.

Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

Abstract: A solution to the problem of creating a controlled impedance coaxial connection to a quasi-coaxial transmission line at a location interior to a substrate and not along an edge is to radially butt-mount the connector to via-like structure on the backside of the substrate. By butt-mounting we mean that the connector itself does not extend into the substrate, but is attached to its surface. The via-like structure includes a conductor that extends through the substrate and into the confines of the quasi-coaxial transmission line proper, where it electrically connects to the center conductor of the quasi-coaxial transmission line. The butt-mounting of the coaxial connector may be accomplished with solder or conductive epoxy.

Abstract: A multilayer interconnection board (10) comprises a dielectric substrate (11), a through-hole (15), a signal line (12) having a large width section (12A) and a small width section (12B) connected with the through-hole (15), and a ground layer (13, 14). A length L (mm) of the small width section (12B) meets the formula of 0<L?(3×1010)/(F×??), wherein, ? denotes the dielectric constant of the dielectric substrate (11) and F (Hz) denotes the frequency of a signal transmitted through the signal line (12). The ratio (W2/W1) of a line width W2 of the small width section (12B) relative to a line width W1 of the large width section (12A) is determined to be smaller as the length of a stub portion of the through-hole (15) becomes larger.

Abstract: A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise forming, in a circuit board, a via hole that bridges a first trace and a second trace. The method may also comprise forming a channel in a sidewall of the via hole. The method may further comprise filling the via hole and the channel with a conductive material. The method may additionally comprise removing the conductive material from the via hole without depleting the channel, thereby forming an interconnect that couples the first trace to the second trace.

Abstract: A flexible capacitive coupler assembly includes a flexible dielectric substrate assembly having a front surface and a rear surface, the front surface having thereon a macroscopic metal capacitive pad. A package supports the flexible dielectric substrate. An electrical connection is made to package wiring or leads on the flexible dielectric substrate to establish electrical contact with a computer subsystem.

Abstract: A printed board includes: an impedance matching member disposed along the periphery of a plurality of connecting pins for connecting a connector to signal lines on the printed board, the plurality of connecting pins being arranged in row and column directions; and a connecting portion for connecting the impedance matching member to a ground line of the printed board. The printed board according to the present invention is capable of suppressing the impedance mismatching of an ordinary connector having no special shield or the like for impedance matching.

Abstract: A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers interspersed between the non-conductive layers, vias extending through the non-conductive layers and the conductive layers, radio frequency absorbing material within each of the vias, where the radio frequency absorbing material is at a conductive layer within the printed circuit board at which a conductive trace is not connected to a via, an insulating layer over each radio frequency absorbing material, and a cylindrical conductive material within via and over each insulating layer.

Abstract: A communications interface accessory for an electric power system arrester is described.

Abstract: A flexible print cable includes signal lines and ground lines. The signal lines and the ground lines are disposed alternately on each of an upper surface and an under surface of a film. The positions of the signal lines on the upper surface correspond to the positions of the ground lines on the under surface. The positions of the signal lines on the under surface correspond to the positions of the ground lines on the upper surface. The ground lines are wider than the signal lines. An edge part of one of the ground lines on the upper surface in a width direction overlaps a part of one of the ground lines on the under surface. Another edge part of the ground line on the upper surface in the width direction overlaps a part of another one of the ground lines on the under surface.