Abstract: An electrical interconnect system includes a first circuit board that includes at least one via, and a conductor configured to transmit an electrical current therethrough. The conductor includes a first signal contact extending from a conductor first end, and a dielectric cylinder configured to receive the conductor therethrough. The dielectric cylinder includes a first bellows element extending from a first end of the dielectric cylinder that is positioned adjacent to the first signal contact. The first bellows element and the dielectric cylinder are configured to form a substantially continuous outer conductor, wherein the conductor and the first bellows are configured to electrically interface to the via and maintain connection thereto using a biasing force.

Abstract: A printed circuit board (PCB) includes a differential pair having a first differential trace and a second differential trace, a first via having an upper cap and a lower cap, and a second via having an upper cap and a lower cap. The first differential trace includes a first segment and a second segment, the second differential trace includes a third segment and a fourth segment. The first and the third segments are electrically coupled to the upper caps of the first and the second vias respectively. The second and the fourth segments are electrically coupled to the lower caps of the first and the second vias respectively. The first and the third segments extend from corresponding upper caps in different directions, the second and the fourth segments extend from corresponding lower caps in different directions.

Abstract: A connector assembly includes, but is not limited to, a body having a top side and a bottom side. A bottom signal plate is connected to the bottom side and is configured for capacitive coupling to a conductor of a coplanar waveguide. A bottom grounding plate is connected to the bottom side and is spaced apart from the bottom signal plate. The bottom grounding plate is configured for capacitive coupling to a grounding plane of the coplanar waveguide. A first electrically conductive pathway is electrically connected to the bottom signal plate and extends to the top side. A second electrically conductive pathway is electrically connected to the bottom grounding plate and extends to the top side. A dielectric adhesive at least partially covers a bottom portion of the connector assembly.

Abstract: A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.

Abstract: Coaxial-to-microstrip transitions may include a microstrip line and coaxial-line assembly. The microstrip line includes a first dielectric having an aperture, a conductive strip disposed on one primary face of the first dielectric, and a ground plane disposed on the opposite primary face of the first dielectric. The coaxial-line assembly includes an outer conductor and an inner conductor. In some examples, the ground plane extends between the outer conductor and the inner conductor on a first side of the coaxial-line assembly proximate the conductive strip and an aperture cross section extends beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip. In some examples, the ground plane has a non-circular aperture. In some examples, the outer conductor encloses an area that is less than an area of the aperture. In some examples, the enclosed area has a width that is less than a corresponding width of the first aperture.

Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

Abstract: In one example, a hybrid surface mountable package includes a housing at least partially defining a sealed cavity, two microwave integrated circuits (MIC) chips positioned inside the sealed cavity, and a very-high-speed interconnect connecting the two MIC chips to each other. The very-high-speed interconnect includes strong coupling co-planar waveguide (CPWG) transmission lines.

Abstract: An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.

Abstract: In one example embodiment, a high-speed package includes first and second layers and a multi-channel non-coplanar interconnect. The first layer includes first and second sets of coplanar transmission lines. The second layer includes third and fourth sets of coplanar transmission lines. The multi-channel non-coplanar interconnect includes first and second channels. The first channel connects the first set of transmission lines to the third set of transmission lines. The second channel connects the second set of transmission lines to the fourth set of transmission lines.

Abstract: A phase adjustable adapter that can maintain its value of characteristic impedance in a manner that is independent of its electrical length. Embodiments of the adapter include a center conductor and an adapter body in surrounding relation to the center conductor so as to form an insulative gap. The adapter body has form factor that is defined by the ratio of an outer dimension of the adapter body to the length of the adapter body, where the form factor changes in accordance with the change in the length of the adapter body.

Abstract: A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnecting the first transmission line and the second transmission line. The conduit includes a signal conductor and an electrically grounded shield substantially surrounding the signal conductor. The conductor and the shield are positioned relative to each other to thereby comprise a means for lowpass filtering the signal. A cutoff frequency of the lowpass filtering is less than a third harmonic of the fundamental frequency.

Abstract: Signal modules and methods for electrically interfacing with an electronic device are provided. The signal module includes a dielectric and a conductor extending through a surface of the dielectric. The surface of the dielectric is located away from perpendicular relative to an axis of the conductor and is located based on an electromagnetic field produced as a result of a signal flowing through the conductor.

Abstract: A coaxial transition arrangement including a coaxial connector for connecting a coaxial cable to a multilayer package has an improved coaxial connector for accomplishing impedance matching and providing improved broadband performance. Impedance matching is provided by a metal disk structure comprising a plurality of metal disks mounted on a center conductor pin of the coaxial connector. The disks are mounted in spaced-apart relation on the center conductor pin and have different radiuses which decrease with increasing distance from the base of the center conductor pin. The coaxial connector has a shroud which is configured to accommodate the metal disk structure therein, as does the ring of ground vias forming a part of the multilayer package.

Abstract: Coaxial-to-microstrip transitions may include a microstrip line and coaxial-line assembly. The microstrip line includes a first dielectric having an aperture, a conductive strip disposed on one primary face of the first dielectric, and a ground plane disposed on the opposite primary face of the first dielectric. The coaxial-line assembly includes an outer conductor and an inner conductor. In some examples, the ground plane extends between the outer conductor and the inner conductor on a first side of the coaxial-line assembly proximate the conductive strip and an aperture cross section extends beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip. In some examples, the ground plane has a non-circular aperture. In some examples, the outer conductor encloses an area that is less than an area of the aperture. In some examples, the enclosed area has a width that is less than a corresponding width of the first aperture.

Abstract: The present invention relates to a transmission line to waveguide transition arrangement comprising a dielectric carrier material arrangement having a first main side and a second main side, the arrangement comprising a transition portion with an opening, having at least one edge and an electrically conducting border which follows the opening and is electrically connected to a ground metalization on the second main side. A transmission line conductor extends in the dielectric carrier material arrangement towards the border. The arrangement further comprises a transitional part with a border contact section having an outer circumference that essentially follows the border's shape except for a gap dividing the border contact section. The transitional part further comprises a conductor contact section which protrudes from the border contact section through the gap, contacting the end of the transmission line conductor and extending into the opening.

Abstract: A waveguide quick disconnect clamp includes a first arm and a second arm, both arms having a first end, a second end, and a jaw pivotally connected to the second end. Each of the first and second arm jaws has a generally flat engaging face defining two generally parallel elongated sections and a waveguide receiving recess therebetween. The second arm second end is pivotally connected to the first arm at a position intermediate the first arm first and second ends, and a threaded nut is pivotally connected to the first arm first end. The waveguide quick disconnect clamp also has an adjustment screw having a first end, a second end, and a threaded portion therebetween. The adjustment screw first end pivotally engages the second arm at a point intermediate the second arm first and second ends, and the threaded portion of the screw engages the threaded nut.

Abstract: A method for coupling a radio frequency electronic device (14) to a passive element (12), such as an antenna, the passive element including a body having an impedance at the operating frequency. the method comprises the steps of attaching a conductive pad having a shape and area corresponding to the predetermined shape and coupling area on the surface of passive element in a nonpenetrating manner, and electrically connecting the device to the conductive pad, such that, in use, the pad and the body have an impedance that is substantially capacitively reactive in nature defined therebetween, whereby the pad is electrically coupled to the body to facilitate: the transfer of electromagnetic energy at the operating radio frequency between the body and the pad. The conductive pad may take the form of a discrete conductive member attached to the passive element by an adhesive or by a biasing member. Alternatively, the conductive pad may take the form of a metallization layer formed on the passive element.

Abstract: A coaxial to transmission line connector has a connector and an attachment area with a windowed electrical attachment point that when soldered in place on a ground reference of an electrical device, creates an electrical and mechanical connection between an outer conductor of the coaxial to transmission line connector. The attachment area has at least one mechanical alignment point and a corresponding reference pivot point located substantially co-planar at the termination of the coaxial dielectric region at an edge of a PCB and a port of the coaxial to transmission line connector. The at least one mechanical alignment point and the corresponding reference pivot plane serve to automatically align the coaxial to transmission line connector to the electrical device. Opposite the attachment area is a dielectric area following termination of the outer conductor in the transition area of the microstrip transmission line.

Abstract: A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.

Abstract: Coaxial-to-microstrip transitions may include a microstrip line and coaxial-line assembly. The microstrip line includes a first dielectric having an aperture, a conductive strip disposed on one primary face of the first dielectric, and a ground plane disposed on the opposite primary face of the first dielectric. The coaxial-line assembly includes an outer conductor and an inner conductor. In some examples, the ground plane extends between the outer conductor and the inner conductor on a first side of the coaxial-line assembly proximate the conductive strip and an aperture cross section extends beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip. In some examples, the ground plane has a non-circular aperture. In some examples, the outer conductor encloses an area that is less than an area of the aperture. In some examples, the enclosed area has a width that is less than a corresponding width of the first aperture.

Abstract: A connector has data signal conductors for communicating data signals and voltage reference (power and ground) conductors for the signals' return currents. Voltage reference conductors carrying the same voltage level are coupled together at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals. Decoupling capacitors may alternatively or additionally be inserted between pairs of voltage reference conductors carrying high and low voltage levels at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals.

Abstract: In a microwave transition from a coaxial line (1) to a coplanar line system (3), in a longitudinal hole (5) of an outer conductor housing (6), the round inner conductor (4) of the coaxial line (1) continues in a planar inner conductor in the form of a narrow piece of foil (9), of an elastically flexible insulating material and metallised on at least one side. The end of this planar inner conductor (9, 10) then narrows in a transition section (16) to the width of a coplanar middle conductor (13; 20), with coplanar earthing areas (14, 15; 21, 22) on both sides.

Abstract: The invention relates to a coaxial connecting part which is used to connect a coaxial plug socket to a circuit carrier in an internal conductor. An elastically flexible bellows made of a conductive material is incorporated therein in order to keep axial and radial forces, occurring at the beginning of the socket, away from the substrate.

Abstract: An apparatus providing a low impedance transition from a pulse generator to one or more helical antennae. Conventional transition from coaxial-to-antenna causes energy loss. The present invention decreases that loss.

Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract: Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

Abstract: A spring loaded microwave interconnector (SLMI). The SLMI includes a waveguide probe head having a first side and opposite thereto a second side, the sides transverse to a central axis. A spring loaded coax central conductor coupled to the probe head first side and provides a distal conductive tip. The coax central conductor extends along the central axis. A dielectric sleeve is disposed about the coax central conductor adjacent to the first side. The distal conductive tip extending beyond the dielectric sleeve when in an extended position and is about flush with the dielectric sleeve when in a compressed poison. An multiport waveguide to multiport PCB assembly utilizing a plurality of SLMIs wherein the multiport waveguide and PCB have curved contours is also disclosed.

Abstract: A microstrip line includes a signal strip conductor and a ground conductor. A coplanar line includes two regions. A first region includes a signal strip conductor which is connected to the signal strip conductor of the microstrip line via a wire or the like and a ground strip conductor which continues to the ground conductor. A second region is formed with a ground strip conductor formed above the ground strip conductor via a through hole. A transmission mode changes itself in the microstrip line, the first region of the coplanar line, and the second region of the coplanar line in the sequence as described. This enables converting the transmission mode efficiently from the microstrip line to the coplanar line.

Abstract: A mechanism is provided for coupling a coaxial cable to a planar circuit to provide galvanic isolation between the coaxial cable and the planar circuit while providing low transmission loss and reflections between the coaxial cable and the circuit. The mechanism comprises a co-planar waveguide coupled to the coaxial cable, a microstrip line connected to the circuit, a galvanic isolation component and a ground plane. The co-planar waveguide, the microstrip line and the galvanic isolation component are formed on one side of a two-sided substrate. The ground plane is formed on the other side of the substrate and underlies at least a portion of the co-planar waveguide to form a grounded co-planar waveguide. The ground plane includes a notch underlying a portion of the co-planar waveguide to provide a transition region from the co-planar waveguide to the grounded co-planar waveguide.

Abstract: A substrate module includes a first substrate and a second substrate. The first substrate comprises a base material; a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material; a ground pattern on the rear surface of the base material; and an exposed portion in which the ground pattern on the substrate surface is exposed by partially cutting out the base material and the ground pattern on the substrate rear surface. The second substrate comprises a base material and a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material. In connecting a transmission line of the first substrate and that of the second substrate, the ground patterns of the first and second substrates are fused with each other at the exposed portion and fixed.

Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract: A coaxial cable splitter including an integral body with a first cable connection, a second cable connection and a third cable connection, each defining an axis. The second cable connection is a crimp sleeve, the first cable connection is a coaxial connector, and the axes are generally parallel to each other. The third cable connection is a coaxial cable connector and the axis is at an angle to the axes of the first and second cable connections. The first and third cable connections each include a center conductor which are electrically linked. The first and third cable connections each include an outer shell positioned about the center conductor which are electrically linked. A method of assembling a coaxial cable splitter with an integral body.

Abstract: A connector has data signal conductors for communicating data signals and voltage reference (power and ground) conductors for the signals' return currents. Voltage reference conductors carrying the same voltage level are coupled together at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals. Decoupling capacitors may alternatively or additionally be inserted between pairs of voltage reference conductors carrying high and low voltage levels at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals.

Abstract: A compact end launch transition for providing a connection between a housing having an electrical terminator and a waveguide component and associated method are described. The transition includes a having a rear side presenting a substantially flat surface to abut the housing and has a front side having an aperture. An antenna located within the body is configured to interact with the aperture to form an end launch transition. An electrical connector is in electrical communication with the antenna and exposed from the rear side of the body to connect directly to the electrical terminator. This avoids the need to use cable to connect the housing and waveguide component and provides a particularly compact device.

Abstract: A system and method is provided for coupling a power source across a rotation boundary. A generator converts a DC source on the stationary side of a rotation boundary to a square-wave at a determined frequency. The generator output connects through a transmission line and a first transformer to a set of stator rings. A set of rotor rings form a set of coupling capacitors with the stator rings. The rotor rings connect through a second transformer and a transmission line to a non-linear circuit capable of converting the square-wave to a DC voltage and current that can power a load on the rotating side of the rotating boundary in which the power is nearly equal to the power available from the source on the stationary side of the rotation boundary.

Abstract: A coupling structure for coupling a device operable at a radio frequency with a body is formed of a polymeric material loaded with a conductive filler. A portion of the surface of the body defines a coupling area of a predetermined shape that receives a conductive pad having a shape and area corresponding to the predetermined shape and coupling area. The conductive pad is positioned on the surface of the body in non-penetrating contact with the body such that, in use, the pad and the body have an impedance, substantially capacitively reactive in nature, defined therebetween that is less than the impedance of the body at the operating frequency, thereby facilitating the transfer of electromagnetic energy at the operating radio frequency between the body and the pad.

Abstract: A motherboard includes a signal control chip, a signal switch chip connected to the signal control chip via a plurality of first transmission lines, and a complex connector configured for connecting to a first type of transmission device or a second type of transmission device. The signal control chip is connected to the complex connector via the first transmission lines and a plurality of second transmission lines. The signal switch chip is electrically connected to the complex connector via a plurality of third transmission lines. Each second transmission line is connected in series with a first resistor. Each third transmission line is connected in series with a second resistor. When the first type of transmission device is mounted on the complex connector, the signal switch chip and the second resistors are removed. When the second type of transmission device is mounted on the complex connector, the first resistors are removed.

Abstract: A mechanism is provided for coupling a coaxial cable to a planar circuit to provide galvanic isolation between the coaxial cable and the planar circuit while providing low transmission loss and reflections between the coaxial cable and the circuit. The mechanism comprises a co-planar waveguide coupled to the coaxial cable, a microstrip line connected to the circuit, a galvanic isolation component and a ground plane. The co-planar waveguide, the microstrip line and the galvanic isolation component are formed on one side of a two-sided substrate. The ground plane is formed on the other side of the substrate and underlies at least a portion of the co-planar waveguide to form a grounded co-planar waveguide. The ground plane includes a notch underlying a portion of the co-planar waveguide to provide a transition region from the co-planar waveguide to the grounded co-planar waveguide.

Abstract: A transmission line conversion apparatus connecting a parallel transmission line to a coplanar waveguide (CPW) is provided. To this end, the CPW including a transmission line composed of a signal line and a ground line which is formed on one surface of a dielectric substrate, and a parallel transmission line connected to the CPW, at a predetermined angle with respect to a substrate constituting the CPW, and composed of a signal line and a ground line, are proposed. In addition, the signal line of the CPW and the signal line of the parallel transmission line are connected to each other, and the ground line of the CPW and the ground line of the parallel transmission line are connected to each other. As such, by connecting the CPW to the parallel transmission line, a return loss can be minimized.

Abstract: A feedthrough for feeding a microwave signal through a wall of a casing comprises a signal waveguide having at least two portions having different cross-sections. The portion having the smaller cross-section is filled with plastically-deformable dielectric material which, under the action of pressure and heat, is bonded to the walls of the portion in which it is located. The dimensions of the portion are such as to provide an impedance match with the adjacent portions. An antenna couples electromagnetic energy between the waveguide and a strip transmission line. A metal cap seals the end of the waveguide and screens the antenna.

Abstract: In one example, a hybrid surface mountable package includes a housing at least partially defining a sealed cavity, two microwave integrated circuits (MIC) chips positioned inside the sealed cavity, and a very-high-speed interconnect connecting the two MIC chips to each other. The very-high-speed interconnect includes strong coupling co-planar waveguide (CPWG) transmission lines.

Abstract: Provided is a microwave module having a converter for improving transmission characteristics in a millimeter-wave band. When a microstrip transmission line and a conductor-backed coplanar waveguide (CBCPW) transmission line are connected by wire bonding, a change in impedance caused by wire bonding and an abrupt change in electric field components between the two transmission lines are reduced by the converter. Therefore, insertion loss and return loss are reduced, and transmission characteristics in a millimeter-wave band are improved.

Abstract: A mechanism for coupling a coaxial cable (108) to a planar circuit to provide galvanic isolation between the coaxial cable and the planar circuit while providing low transmission loss and reflections between the coaxial cable (108) and the circuit. The mechanism comprises a co-planar waveguide (211) coupled to the coaxial cable (108), a microstrip line (240) connected to the circuit, a galvanic isolation component (234) and a ground plane (222). The co-planar waveguide (211), the microstrip line (240) and the galvanic isolation component (234) are formed on one side (203) of a two-sided substrate (202). The ground plane (222) is formed on the other side (205) of the substrate (202) and underlies at least a portion of the co-planar waveguide (211) to form a grounded co-planar waveguide (221). The ground plane (222) includes a notch (224) underlying a portion of the co-planar waveguide (211) to provide a transition region (225) from the co-planar waveguide (211) to the grounded co-planar waveguide (221).

Abstract: Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

Abstract: The invention relates to a device for coupling low-frequency high-power ultrasound resonators by a tolerance-compensating force-transmitting connection having at least one contact surface between the at least two resonators on or proximate to the oscillation maximum of the oscillation to be transmitted by the coupling for the purpose of transmitting low-frequency ultrasound power between the resonators coupled in this manner.

Abstract: An electronic device includes a first transmission line, a second transmission line and a ground-coupling portion. The first transmission line is composed of a first signal line transmitting a given high frequency wave signal and a first ground. The second transmission line is composed of a second signal line transmitting the high frequency wave signal and a second ground. The ground-coupling portion couples the first ground and the second ground. A phase difference between the high frequency wave signals at both ends of the ground-coupling portion is substantially integral multiple of 180 degrees.

Abstract: A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.

Abstract: A method for coupling power across a non-conducting membrane. A generator converts a DC source on a first side of a non-conducting membrane to a square-wave at a determined frequency. The generator output connects to a transformer and onto a first set of capacitor plates on the first side of the membrane. A second set of plates on the second side of the membrane form a set of coupling capacitors wherein the non-conducting dielectric membrane becomes part of the coupling-capacitor dielectric material. The second set of plates connects to a transformer and onto a non-linear circuit that converts the square-wave to DC voltage and current that can power a load such that the power delivered is approximately equal to the power available from the DC source on the first side of the membrane. The coupling capacitors may be replaced by coupled coils with nearly the same power delivery effect.

Abstract: A printed circuit board (PCB) includes at least one signal layer, a ground layer, at least two signal lines, and at least one grounded line. The signal lines are arranged on the signal layer for transmitting signals. The grounded line is arranged on the signal layer and between the signal lines. A plurality of vias are defined in the grounded line, and the vias are connected to the ground layer. A distance between each two adjacent vias is so arranged that a resonant frequency of an electromagnetic wave transmitted on the grounded line must greater than a highest frequency of the signals transmitted on the signal lines. A related method for designing the PCB is also provided.

Abstract: In an embodiment of the invention, a package for high frequency waves mounted by a high frequency electronic circuit comprises an hermetic box-shaped high frequency package containing a high frequency electronic circuit in the inside and shielded by a conductor, an input terminal and an output terminal partly led out to the outside of the high frequency package, an input side feed-through section having one of its opposite ends connected to the input terminal and the other end connected to the high frequency electronic circuit and having a predetermined characteristic impedance; and an output side feed-through section having one of its opposite ends connected to the output terminal and the other end connected to the high frequency electronic circuit and having a characteristic impedance lower than the characteristic impedance of the input side feed-through section as viewed from the output terminal side.