Abstract: The invention provides a dielectric substrate; a ground conductor pattern is formed on one surface of the dielectric substrate and which has a ground conductor pattern omission portion; a strip conductor pattern formed on a surface of the dielectric substrate opposite to the surface having the ground conductor pattern; a conductor pattern for shorting of a waveguide formed so as to be continuously connected to the strip conductor pattern; connecting conductors for connecting the ground conductor pattern and the conductor pattern to each other within the dielectric substrate; and a waveguide connected to the dielectric substrate so as to correspond to the ground conductor pattern omission portion. Also, a microstrip line is constituted by the strip conductor pattern, the ground conductor pattern, and the dielectric substrate. Further, a dielectric waveguide shorting portion is constituted by the conductor pattern, the ground conductor pattern, and the connecting conductors.

Abstract: A first waveguide groove is formed in a sidewall of a main casing housing a first circuit board, and a second waveguide groove is formed in a sidewall of a sub-casing hermetically housing a second circuit board such that the first waveguide groove is in continuous connection with the second waveguide groove. Further, a lid is attached to the sidewall of the main casing so as to cover the first and the second waveguide grooves, and a probe provided on the second circuit board protrudes into the second waveguide groove. In addition, an inclined plane is formed at an end of the first waveguide groove so as to be in continuous connection with a through-hole provided in the lid.

Abstract: According to one embodiment of the invention, a planar transmission line transition system includes a coplanar waveguide transmission line that includes a first electrical path and a second electrical path. The planar transmission line transition system also includes a transmission line stub electrically connected in series to the first electrical path of the coplanar waveguide transmission line, wherein a signal output at a first connection of the transmission line stub is phase delayed approximately 180 degrees with respect to a signal input at a second connection of the transmission line stub. The planar transmission line transition system further includes a transmission line electrically connected to the second electrical path of the coplanar waveguide transmission line and the first connection of the transmission line stub.

Abstract: The invention proposes a transmitting/receiving device comprising at least one transition zone which comprises a means of transforming a polarized wave of a first polarization into an electrical signal; a second means of transforming an electrical signal into a polarized wave of the second polarization; and a first filtering zone placed between the antenna and the transition zone, the first filtering zone comprising a waveguide filter polarized in the second polarization direction, the said filter being transparent in the first polarization direction.

Abstract: A balun is constructed from a parallel pair of lines (coaxial or bifiler) that are bent to form a U-shape including a more curved (bent) section with two ends each of which are connected to a respective less curved (straight leg) section. One or more single hole ferrite beads are threaded over each respective pair of less curved sections of the pair of lines.

Abstract: A filter having an unbalanced terminal, a first stripline resonator of which one end is connected to the unbalanced terminal, a second stripline resonator placed to be electromagnetically coupled to the first stripline resonator, and balanced terminals and of which both ends are connected to the second stripline resonator, wherein the first stripline resonator and the second stripline resonator are connected by at least one impedance element, and the second stripline resonator is a ½ wavelength resonator substantially having ½ length of a wavelength of a resonance frequency.

Abstract: A dielectric device includes a dielectric substrate that includes at least one resonator unit. An external conductor film covers most of the outer surface of the dielectric substrate, except one end surface. The at least one resonator unit includes a first hole and a second hole. The first hole is provided in the dielectric substrate, extending from the end surface to an opposite surface, being open at the end surface and the opposite surface, and having a first internal conductor inside thereof. The second hole is provided in the dielectric substrate at a predetermined distance from the first hole, extends from the end surface toward the opposite surface, being open at the end surface, closed at the opposite surface, and having a second internal conductor inside thereof. The second internal conductor is connected to the first internal conductor at the end surface.

Abstract: It is described an image rejection, sub-harmonic frequency converter, realized in microstrip, particularly adapted to be used in mobile communication equipment, The converter avails of two identical sub-harmonic mixers employing each one or two pairs of diodes in antiparallel, obtained on a same silica substrate, and of a structure of hybrids performing appropriate phase combination adapted to suppress the image band in the converted signal. The mixers include filtering structures preferably consisting, but no limited to the same, of stubs &lgr;/4 long, at the local oscillator frequency, having a free end, in short or open circuit, respectively. According to an alternative embodiment, said stubs are replaced by appropriate filters implemented with concentrated structures (L and C) performing the same transfer function of the stubs in microstrip.

Abstract: A broadband interconnection device (10) used for interconnection between a first transmission line (100) and a second transmission line (200), has a substrate (300) with the first transmission line (100) defined at a first side (310) on a first surface (320), the first transmission line (100) including a signal conductor (120) and at least one ground conductor (121 or 122), a signal conductor (220) of the second transmission line (200) defined on an opposite side (340) of the first surface (310), and a ground plane (260) of the second transmission line (200) on an opposed surface (360), the signal conductor (120) of the first transmission line (100) being electrically connected to the signal conductor (220) of the second transmission line (200) on the first surface (320). On the opposed surface (360), the ground plane (260) of the second transmission line (200), has at least one protrusion (261) aligned with the signal conductor (120) of the first transmission line (100).

Abstract: The present invention is directed to enable mode conversion between a TEM mode and another mode to be performed among a plurality of waveguides. An RF module comprises: a microstrip line as a first waveguide for propagating electromagnetic waves in a TEM mode; and a waveguide having a multilayer structure as a second waveguide connected to the first waveguide, for propagating electromagnetic waves in another mode different from the TEM mode. An end of the first waveguide is directly or indirectly connected so as to be conductive to one of ground electrodes of the second waveguide from the direction orthogonal to the stacking direction of the ground electrodes. Since magnetic fields are coupled so that the direction of the magnetic field of the first waveguide and that of the magnetic field of the second waveguide match with each other in the E plane, mode conversion between the TEM mode and another mode to be excellently performed between the waveguides.

Abstract: The present invention relates to a waveguide structured package and a method of manufacturing the same. More particularly, there are provided a waveguide structured package capable of preventing generation of parasitic components due to bonding wires and reducing the processing time to reduce the production cost of the waveguide structured package by providing a probe, a microstrip-waveguide transition portion and a microstrip line within a semiconductor chip and thus making bonding wire unnecessary in manufacturing the waveguide structured package, and a method of manufacturing the waveguide structured package.

Abstract: A method relating to a balun for transmitting a high degree of high-frequency power where a metal sheet element is soldered onto the loop conductor tract of the symmetrical circuit loop, the conductor track being configured as a printed circuit. The metal sheet element is linked with a cooling element on the electrically cold mass point of the loop.

Abstract: A high power amplifier has a first balun propagating a half of an input signal to an in-phase output terminal, and also propagating a fourth of the input signal to first and second opposite-phase output terminals, the signal propagated to the first and second opposite-phase output terminals lagging 180 degrees behind the signal propagated to the in-phase output terminal; first and second power amplifier circuits connected to the first and second opposite-phase output terminals of the first balun and having the same characteristics;a third power amplifier circuit connected to the in-phase output terminal of the first balun and having output power substantially twice as much as the output power of the first or second power amplifier circuit; and a second balun having first and second opposite-phase input terminals for receiving the outputs of the first and second power amplifier circuits, having an in-phase input terminal for receiving the output of the third power amplifier circuit, combining the outputs of th

Abstract: A balun, which takes up very little space and which is economical to produce, consist of four interconnected planar lines. One end of a first line is configured as a first symmetrical terminal. The other end of the first line is connected to the adjacent end of the second adjacent line. The end of the second line that is connected to the first line forms an unsymmetrical terminal, while the other end of the second line is connected to ground. The end of the third line, which is adjacent to the second line, is connected to ground, this end being adjacent to the unsymmetrical terminal. The other end of the third line serves as a second symmetrical terminal. The end of the fourth line that is adjacent to the second symmetrical terminal is connected to ground, the other end being connected to the end of the second line that forms the unsymmetrical terminal.

Abstract: A microstrip-to-waveguide power combiner includes a dielectric substrate and at least two microstrip transmission lines formed thereon in which radio frequency signals are transmitted. The microstrip transmission lines terminate in microstrip launchers or probes at a microstrip-to-waveguide transition. A waveguide opening is positioned at the transition. A waveguide back-short is positioned opposite the waveguide opening at the transition. Isolation vias are formed within the dielectric substrate and around the transition and isolate the transition. A coaxial-to-waveguide power combiner is also disclosed.

Abstract: A miniaturized balun with a four-wire system may be constructed with laminated construct for coupling from an unbalanced transmission line to a balanced transmission line, wherein unbalanced signals are input from a first pair of middle substrates, whilst balanced signal outputs are set up on a second pair of substrates disposed above and below the first pair. The use of such laminated circuit board makes it possible to reduce the overall size of the balanced converter considerably and ideal to implement the converter circuit on an integrated device.

Abstract: A balancing/unbalancing (balun) structure for operating at frequency f1 includes a microstrip printed circuit board (PCB). A balun on the PCB includes two input ports are coupled to a differential signal. An isolated port is connected to ground through a matched resistance. An output port is coupled to a single-ended signal corresponding to the differential signal. A plurality of traces on the PCB connect the two input ports, the load connection port and a tap point to the output port. A f2 rejection filter on the PCB is wrapped around the balun and includes a first folded element with a transmission length of &lgr;2/4 and connected to the output port. A second folded element has a transmission length of &lgr;2/4 and connected to the tap point. A third folded element connects the tap point to the output port and has a transmission length of &lgr;2/4.

Abstract: A balancing/unbalancing (balun) structure includes a microstrip line printed circuit board (PCB). Two input ports are coupled to a differential signal. An isolated port is connected to ground through a resistance. An output port is coupled to a single-ended signal corresponding to the differential signal. A plurality of traces on the PCB connect the two input ports, the load connection port and the output port, wherein distance between adjacent traces is approximately twice PCB thickness.

Abstract: The present invention was accomplished in order to provide a waveguide/planar line converter, which enables a simplified assembling operation and accurate positioning of a signal line, comprising a housing having a waveguide and a waveguide/planar line conversion substrate with a signal line propagating high frequency signals formed on one main surface side and a ground formed on the other main surface side, wherein one end portion of the signal line of the waveguide/planar line conversion substrate is located in such a manner as to protrude into the waveguide, and the waveguide/planar line conversion substrate is arranged on the whole top surface of the housing with covering the mouth of the waveguide.

Abstract: A high-frequency module of the present invention includes a laminate ceramic layer including a first layer smaller in area than the other layers. Parts constituting high-frequency circuitry are mounted on the laminate ceramic layer. A single interface substrate is juxtaposed to the first layer and connects the high-frequency circuitry and a waveguide. A metallic casing supports the laminate ceramic substrate and interface substrate with ground held in contact. The metallic casing is formed with at least one waveguide hole. A cover covers the waveguide hole and forms a waveguide end cavity. The interface substrate is positioned on the second layer of the laminate ceramic substrate, which just underlies the first layer, at one side and protrudes from the metallic casing into the waveguide hole at the other side.

Abstract: According to the preferred exemplary embodiments of the present invention, a transmission line, such as microstrip, is connected to a waveguide using suspended stripline as an intermediate connection. This method results is a very low-loss transition, suitable for active microwave device applications such as low-noise receivers and transmitting devices such as power amplifiers.

Abstract: In general, the invention is directed to integration of passive radio frequency (RF) structures with at least one integrated circuit in a single integrated circuit (IC) package. An IC package in accordance with the invention may include, for example, a radio IC, a digital IC, a passive radio frequency balun as well as additional passive RF structures or ICs. Additionally, passive electronic components may further be incorporated in the IC package. For example, the IC package may include a resistor, capacitor, inductor or the like. The components of the IC package may be distributed throughout layers of a multi-layer IC package, such as a multi-layer ceramic package. The different ICs and the passive RF structures may be electrically coupled via conductive traces, which may be varied in thickness and length in order to match input and output impedances of the different ICs and passive RF structures.

Abstract: A circuit assembly suitable for RF signals has an integration plate and an RF distribution layer disposed adjacent to the integration plate. The RF distribution layer has an RF conductive layer between a first dielectric layer and a second dielectric layer. A DC distribution layer is disposed adjacent to the RF distribution layer. An RF input is coupled to the RF conductive layer. A module assembly includes an integrated circuit coupled to the RF conductive layer and the DC distribution layer. An RF output is coupled to the RF conductive layer.

Abstract: A balun and transformer system (201) is provided in which a balun (112) is cascaded between two 4:1 impedance transformers (102, 110) to form a 16:1 broadband impedance transformation for push-pull amplifier applications (200). The balun (112) is configured in a Marchand configuration. The balun and transformers (201) are formed with coupled lines realized with a very thin layer of ceramic. Additional coupling between the gap in the balun (112) is achieved by an embedded capacitor (260) built in the balun's ceramic. DC bias supply (294, 296) to the power amplifier (106) is achieved by using the hot plate of de-coupling capacitors (298, 299), which serve as a floating ground plane to the whole application (200).

Abstract: A coupled transmission line balun construction employs two pairs of planar interleaved spiral coils (3, 5 & 7, 9) formed on an electrically insulating or semi-insulating substrate (11) defining a planar structure. One coil in each pair is connected in series to define the input transmission line of the balun, with one end (8) of that transmission line being open circuit. The balun provides an ultra-wide bandwidth characteristic in the frequencies of interest for MMIC devices, is fabricated using the same techniques employed with fabrication of MMIC devices, and is of a physical size that lends itself to application within MMIC devices.

Abstract: The present invention provides a dielectric waveguide filter comprising a plurality of dielectric waveguide resonators in the form of rectangular parallelepiped-shaped blocks aligned as a single main body having opposite ends defined by respective the end blocks located thereat, and a pair of input and output electrodes provided in the end blocks, respectively. Each of the end blocks is formed with a protruding portion including a dielectric substance extended from that therein. A conductive strip line extending from the bottom surface of corresponding one of the end blocks to the edge region of the bottom surface of corresponding one of the protruding portions. The bottom surfaces have a region where the dielectric substance in contact with the both sides of the conductive strip line is exposed to outside. The conductive strip lines are coupled with micro-strip lines or co-planer lines on a printed circuit board having a given length to obtain an adequate matching between input and output signals.

Abstract: A switched loop RF radiator circuit, comprising a radiator element, a RF input/output (I/O) port, and a balun coupled between the radiator element and the (I/O) port. The balun includes a 180° switched loop circuit having transmission line legs coupled to a balun transition to provide a selectable phase shift, and a microelectromechanically machined (MEM) switch Many radiator circuits can be deployed in an electronically scanned antenna array.

Abstract: An object of the invention is to provide a high-frequency line-waveguide converter in which a distance between a grounding conductor and a radiating conductor and a thickness of a dielectric layer of a high-frequency line can be freely set. A high-frequency line-waveguide converter for converting a high-frequency line to a waveguide comprises a high-frequency line including a first dielectric layer; a line conductor; and a grounding conductor; an opening portion of the grounding conductor; a second dielectric layer; a radiating conductor; a connecting conductor; a shielding conductor portion; and a waveguide.

Abstract: A cascaded SAW filter system includes first and second SAW filters (12a, 12b) each including an input transducer (36, 36′) and an output transducer (37, 37′) on a piezoelectric substrate (38, 38′). Group delay and pass band ripples associated with a time spur at TD′ away from the main signal of the second filter (12b) cancel the group delay and pass band ripples associated with a time spur at TD away from the main signal of the first filter (12a) because: 1) the input and output transducers (36′, 37′) of the second filter (12a) are offset from those of the first filter (12a); 2) the center frequency (f0′) of the second filter (12b) is offset from the center frequency (f0) of the first filter (12a); 3) the perturbation region (P1) of the first filter (12a) is different from the perturbation region (P2) of the second filter (12b) or 3) a combination of 1), 2) and/or 3. The associated time spur echo of the cascaded response will also be canceled.

Abstract: A tunable electromagnetic transmission structure for effecting coupling of electromagnetic signals having a frequency includes: (a) a dielectric substrate having an opposing first side and second side; (b) at least one first conductive land occupying a first area on the first side; (c) at least two second conductive lands on the second side separated by at least one substantially linear channel; the at least one channel having a width established by the frequency; the at least two second conductive lands and the at least one channel occupying a second area generally in register with the first area; and (d) a tunable dielectric material at least substantially filling the at least one channel; the tunable dielectric layer being electrically coupled with at least two second conductive lands of the at least two second conductive lands.

Abstract: A circuit layout for a lumped element dual-balun (248) where the elements of the dual-balun (248) are patterned on a monolithic substrate (250) in a compact design. The dual-balun (248) includes four inductors (252, 254, 256, 258) and four capacitors (340, 342, 360, 388) electrically coupled together to provide two zero phase RF output signals and two 180° phase RF output signals. The inductors (252, 254, 256, 258) are symmetrically disposed in a rectangular area on the substrate (250). A first pair of the inductors (252, 254) is positioned at one end of the rectangular area, and a second pair of the inductors (256, 258) is positioned at an opposite end of the rectangular area. The capacitors (340, 342, 360, 388) are formed on the monolithic substrate (250) in a central circuit area (260) between the first pair (252, 254) and the second pair of inductors (256, 258).

Abstract: A monolithically integrable spiral balun comprises a substrate having first, second, third, and fourth transmission lines formed thereon. The first transmission line has a first end coupled to receive an input signal and has a second end. The first transmission line forms a spiral that winds in a first direction from its first end to its second end. The second transmission line has a first end and has a second end electrically coupled to the second end of the first transmission line. The second transmission line forms a second spiral that winds in a second direction from its first end to its second end. The third transmission line has a first end for providing a first output and a second end for coupling to a first potential. The third transmission line forms a third spiral that interleaves the first spiral and winds in the second direction from its first end to its second end. A fourth transmission line has a first end for providing a second output and a second end for coupling to a second potential.

Abstract: A stripline integrated circuit apparatus comprising a first ground plane, a stripline section positioned on the first ground plane, the stripline section including N stripline regions where N is a whole number greater than or equal to one, wherein each stripline region includes a stripline sandwiched therebetween a first dielectric layer with a thickness and a second dielectric layer with a thickness where each adjacent stripline is connected in parallel, wherein each adjacent stripline region is separated by a ground plane, a second ground plane positioned on the stripline region, and wherein the plurality of stripline sections are formed and electrically connected in series. The distances between the striplines and the ground planes are adjusted to vary the input and output impedance.

Abstract: A surface-mountable millimeter-wave waveguide filter is constructed using irises in a rectangular waveguide formed in a dielectric material such as glass. The filter structure is surface-mountable, has a single dielectric layer, and can be manufactured using a suitable monolithic microwave integrated circuit (MMIC) process. The filter has potential applications in millimeter-wave systems such as Local Multipoint Distribution System (LMDS) and Autonomous Cruise Control (ACC) radar for automobiles.

Abstract: A balun includes a first conductive layer disposed on a top surface of a substrate, a second conductive layer having a shorter length than the first conductive layer and disposed on the top surface of the substrate, the second conductive layer having first and second end portions, a substrate having a through hole electrically connected to the second end portion of the second conductive layer, and a third conductive layer disposed on a bottom surface of the substrate, the third conductive layer having a first end portion electrically connected to the second end portion of the second conductive layer via the through hole, and the third conductive layer being tapered from a maximum width at the second end portion thereof to a minimum width at the first end portion thereof.

Abstract: A transition from microstrip to waveguide comprises a rectangular waveguide and a microstrip structure formed by a resilient substrate (24) having a stripline (26) on one surface and a ground plane (44) on an opposite surface, the conductors (26, 44) being interconnected by viaholes. The substrate (24) is disposed between the side walls (36) and the floor (22) of the waveguide with the ground plane contacting the floor. The stripline extends from one end of the waveguide along a portion of its length. A tapered ridge (38) depends from the ceiling (34) of the waveguide and extends from the other end of the waveguide. A terminal end (40) of the ridge contacts a terminal portion of the stripline under mechanical pressure. The ridge (38) may have a choice of profiles such as triangular, half cosine and half cosine with a semicircular cut-out in the upright edge.

Abstract: A planar mode converter includes a rectangular waveguide, a microstrip feed-in circuit, and a microstrip feed-out circuit. The rectangular waveguide is filled with dielectric layers and surrounded with metal materials. The lowermost dielectric layer has usually largest thickness and dielectric constant. Except for the lowermost dielectric layer, each of the dielectric layers has a rectangular aperture at its front-end and back-end, respectively. The microstrip feed-in circuit is constituted by first, second and third metal strips, and a feed-in metal ground plane. The first metal strip and the feed-in metal ground plane form a feed-in signal line. The first, second and third metal strips are adhered to the top surface of the lowermost dielectric layer, and the feed-in metal ground plane is adhered to the bottom surface of the lowermost dielectric layer. The microstrip feed-out circuit is constituted of fourth, fifth and sixth metal strips, and a feed-out metal ground plane.

Abstract: A balun design incorporating the functions of a splitter (combiner) which can be employed in a high power amplifier circuit configuration. The balun is formed of a dielectric multilayer board with conductor patterns on each conductor pattern layer. The balun includes the propagation of a half of an input signal to an in-phase output terminal, and also propagating a fourth of the input signal to first and second opposite-phase output terminals, the signal propagated to the first and second opposite-phase output terminals lagging 180 degrees behind the signal propagated to the in-phase output terminal. The balun provides the output signals at the first and second opposite-phase output terminals 180° out of phase employing through holes in the main line and coupling lines for promoting electromagnetic coupling therebetween.

Abstract: A microstrip-to-waveguide power combiner includes a dielectric substrate and at least two microstrip transmission lines formed thereon in which radio frequency signals are transmitted. The microstrip transmission lines terminate in microstrip launchers or probes at a microstrip-to-waveguide transition. A waveguide opening is positioned at the transition. A waveguide back-short is positioned opposite the waveguide opening at the transition. Isolation vias are formed within the dielectric substrate and around the transition and isolate the transition. A coaxial-to-waveguide power combiner is also disclosed.

Abstract: A multilayer substrate ensuring transmission loss as low as when one double-sided substrate is used, while reducing noise, and an LNB converter are provided. The multilayer substrate includes a four-layer substrate having pattern layers sandwiching dielectric layers therebetween. The surface pattern layer provided with a signal line of the microstrip line has a projecting portion. The pattern layer provided with a ground pattern corresponding to the signal line has a portion at least overlapping a root portion of the projecting portion as seen from the top and constituting a surface layer on the other side opposite to the root portion, with no other pattern layer interposed between the relevant portions.

Abstract: A microwave applicator for applying electromagnetic radiation at microwave frequency includes a coaxial input for a microwave signal input and a waveguide for receiving and propagating the microwave signal input. Dielectric material is positioned within the waveguide and extends beyond the waveguide to form an antenna for radiating microwave energy. The coaxial input has direct in-line transition to the dielectric-filled waveguide. Preferably, this direct in-line transition is achieved by the central conductor of the coaxial input extending axially centrally into the waveguide so as to excite microwaves in the waveguide. A lateral conductor extends radially from the central conductor to assist the launch of the microwaves into the waveguide. Preferably, the applicator includes a temperature sensor which is directly connected to the coaxial input.

Abstract: The present invention relates to a four port hybrid comprising a first set (10) of N coupled transmission lines (10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H, 10I) and a second set (20) of N coupled transmission lines (20A, 20B, 20C, 20D, 20E, 20F, 20G, 20H, 20I) where N≧4. Said coupled transmission lines in said first set (10) are electrically connected to said coupled transmission lines in said second set (20) to form a first spiral shaped electrical conductive path, a second spiral shaped electrical conductive path and N−1 electrically isolated transposition portions (30, 40, 50, 60, 70, 80, 90, 110) of said first and second spiral shaped electrical conductive paths. A first end of the first spiral being an input port (P1). A first end of the second spiral being a port (P4) connectable to ground. A second end of the first spiral being a first output port (P3) and a second end of the second spiral being a second output port (P2).

Abstract: A probe assembly including a probe, a waveguide to transmission path transition, and a bias tee detachably connected to the probe.

Abstract: A microstrip to circular waveguide transition having an elongated circular waveguide portion and a stripline circuit portion disposed within the waveguide portion. The stripline includes a strip conductor disposed in a strip conductor plane. The strip conductor extends along a longitudinal axis of the circular waveguide portion from a first region of the transition to a longitudinally spaced second region of the transition. The stripline circuit portion includes a pair of overlying ground planes extending along the longitudinal axis from the first region to the second region, such pair of ground planes being disposed in overlying planes parallel to the strip conductor plane.

Abstract: Systems to provide and methods to design a printed lumped-distributed balun are presented. A lumped-distributed balun includes a single-ended port, a first differential port, a second differential port, a first phase shifter circuit, and a second phase shifter circuit. The first phase shifter circuit includes a first inductor and a first capacitor. The first inductor is coupled to the single-ended port and the first differential port. The first capacitor is coupled to the first differential port and is adapted to be coupled to ground potential. At least one of the first inductor and the first capacitor is implemented as a transmission line structure, such as microstrip. The second phase shifter circuit includes a second inductor and a second capacitor. The second inductor is coupled to the second differential port and is adapted to be coupled to ground potential. The second capacitor is coupled to the single-ended port and the second differential port.

Abstract: A transition piece for coupling a coaxial transmission line to a printed circuit (PC) transmission line. The transmission line terminates in a conductive pin projecting through a conductive coaxial ground plane. The transition piece consists of a conductive plate which is adapted to be fixed between the coaxial ground plane and a PC ground plane of the PC transmission line. The plate is in electrical contact with both the coaxial and PC ground planes while the conductive pin contacts a conductive strip of the PC transmission line. Furthermore, the plate has an opening which is shaped and aligned with the pin so that a transition-impedance of the transition piece is substantially equal to a line impedance of the coaxial and PC transmission lines.

Abstract: The present invention provides a high-frequency module device having a distributed constant circuit formed therein, the device comprising: a base board (2) having a high-frequency element layer forming surface (3) formed by performing flattening processing on an uppermost layer of a multilayer printed wiring part in which a printed wiring layer having a ground part and a dielectric insulating layer made of a dielectric insulating material are formed in a multilayer form on one major surface of a core board (6); and a high-frequency element layer part (5) having a passive element and a circuit element for receiving power or a signal supplied from the base board (2) via a dielectric insulating part made of a dielectric insulating material, on the high-frequency element layer forming surface (3) of the base board (2). The base board (2) has a distributed constant circuit (4) formed by pattern wiring.

Abstract: The invention relates to a method of resolving collisions between at an arrangement with a flat board comprising microwave integrated modules and at least one microstrip lines for guiding a signal on said flat board and a waveguide for guiding the signal out of the flat board. According to the present invention the flat board is perforated at the intersection between the flat board and the waveguide, a stand-alone piece of comprising a microstrip line termination and being adjusted over the perforation, the microstrip line termination coinciding with the extremity of one microstrip line on the flat board.

Abstract: A microstrip to circular waveguide transition having an elongated circular waveguide portion and a stripline circuit portion disposed within the waveguide portion. The stripline includes a strip conductor disposed in a strip conductor plane. The strip conductor extends along a longitudinal axis of the circular waveguide portion from a first region of the transition to a longitudinally spaced second region of the transition. The stripline circuit portion includes a pair of overlying ground planes extending along the longitudinal axis from the first region to the second region, such pair of ground planes being disposed in overlying planes parallel to the strip conductor plane.

Abstract: A monolithically integrable spiral balun comprises a substrate having first, second, third, and fourth transmission lines formed thereon. The first transmission line has a first end coupled to receive an input signal and has a second end. The first transmission line forms a spiral that winds in a first direction from its first end to its second end. The second transmission line has a first end and has a second end electrically coupled to the second end of the first transmission line. The second transmission line forms a second spiral that winds in a second direction from its first end to its second end. The third transmission line has a first end for providing a first output and a second end for coupling to a first potential. The third transmission line forms a third spiral that interleaves the first spiral and winds in the second direction from its first end to its second end. A fourth transmission line has a first end for providing a second output and a second end for coupling to a second potential.