Abstract: A semiconductor device includes a semiconductor substrate, an insulating layer, a transformer formed in the insulating layer, and a wiring. The transformer includes a primary winding conductor, and a secondary winding conductor. The primary winding conductor is provided in a quadrangle spiral shape having a first center axis extending in a direction parallel to the surface of the semiconductor substrate inside the insulating layer, and configured by one conductor film selected from a group consisting of a vacuum deposition film, a chemical vapor deposition film and a sputtered film. The secondary winding conductor is provided in a quadrangle spiral shape having a second center axis inside the insulating layer while being spaced from the primary winding conductor in plan view of the semiconductor substrate, magnetically coupled with the primary winding conductor and configured by a conductor film.

Abstract: A multilayer substrate includes a lamination body including first and second resin substrates and a bonding layer that are hot-pressed. The first resin substrate includes a first surface provided with a first conductor pattern including a surface defined by a plated film, and a second surface provided with a second conductor pattern including a surface defined by a plated film. The second resin substrate includes a third surface provided with a third conductor pattern including a surface defined by a plated film, and a fourth surface provided with a fourth conductor pattern including a surface defined by a plated film. The first conductor pattern is located closer to a first outermost layer than the second conductor pattern. T1<T2 and T3<T4, where T1, T2, T3, and T4 respectively denote the thickness of the first, second, third, and fourth conductor patterns.

Abstract: In an embodiment, a coil component includes an insulator part and a coil part. The insulator part is constituted by an electrical insulation material, and is no more than 600 ?m long and no more than 600 ?m high. The coil part is wound around one axis and placed inside the insulator part. The coil part has an opening part constituted by straight line parts and curved line parts and whose shape as viewed from the one axis direction is an approximate rectangle, wherein the line length of the curved line parts along the inner periphery of the opening part is no more than 40% of the line length of the inner periphery of the opening part. The coil component can satisfy both a size reduction need and the properties need.

Abstract: The present disclosure provides a semiconductor structure having an ultra thick metal (UTM). The semiconductor structure includes a substrate, a metal layer over the substrate, and an UTM over the metal layer. An area density of the UTM is greater than 40% and a thickness of the UTM is equal to or greater than 6 micrometer. The present disclosure provides a method for manufacturing a semiconductor structure having a UTM. The method includes patterning a dielectric layer with a plurality of trenches by a first mask, patterning a photoresist positioning on a mesa between adjacent trenches by a second mask, and selectively plating conductive materials in the plurality of trenches.

Abstract: A coil component includes a body including a magnetic material; a support member disposed in the body; and a coil pattern on the support member in the body. The coil pattern may include a first conductor layer formed on the support member and having a planar spiral shape; a second conductor layer formed on the first conductor layer and having a volume of a lower portion greater than a volume of an upper portion; and a third conductor layer formed to cover the second conductor layer from the outside of the second conductor layer.

Abstract: A coil component includes a body in which a coil part is embedded. The coil part includes a support member, pattern walls formed on the support member, and coil patterns extending between the pattern walls on the support member, and the pattern walls include support portions having a width greater than an average width of the pattern walls.

Abstract: A power reception device includes: a power reception coil that receives power by magnetic resonance; a power reception circuit that converts power received by the power reception coil into direct current; a load circuit that operates by the power into which the power is converted by the power reception circuit; a first substrate on which the power reception coil and the power reception circuit are mounted; and a second substrate on which the load circuit is mounted, the second substrate being located outside the power reception coil as viewed in an axial direction of the power reception coil.

Abstract: An approach to creating a semiconductor chip including a semiconductor substrate with one or more topside metal layers and one or more backside metal layers. The approach creates the semiconductor chip with one or more semiconductor devices with wiring interconnects in the one or more topside metal layers on the semiconductor substrate and one or more inductors in the one or more backside metal layer. Furthermore, the approach creates the semiconductor chip with one or more through silicon vias extending through the semiconductor substrate connecting the one or more inductors in the one or more backside metal layers and the one or more semiconductor devices with wiring interconnects in the one or more topside metal layers on the semiconductor substrate.

Abstract: A method of making a slow wave inductive structure includes forming a first conductive winding over a first substrate. The method further includes bonding a second substrate to the first substrate, wherein the second substrate has a thickness ranging from about 50 nanometers (nm) to about 150 nm, wherein a distance between the first conductive winding and the second substrate ranges from about 1 micron (?m) to about 2 ?m.

Abstract: A case for an electronic device wherein the electronic device has a receiver coil for wireless charging and the receiver coil is formed in between an inner circle and an outer circle, includes: a hard protective frame constructed to receive the electronic device therein wherein the hard protective frame faces the electronic device; and a metal plate constructed to be received in the recess. The metal plate is constructed to enable magnetic retention or attachment of the case to a support having a magnet. The metal plate has a rounded concave edge, and the metal plate does not overlap with the inner circle. Preferably, the rounded concave edge, the inner circle, and the outer circle are substantially symmetrical with respect to a same line.

Abstract: A printed circuit board includes a core layer having a through portion, a magnetic member disposed in the through portion and comprising a magnetic layer, a first coil pattern attached to one surface of the magnetic layer via an adhesive, and a first build-up layer covering at least a portion of the core layer, at least a portion of the magnetic member, and at least a portion of the first coil pattern, and disposed in at least a portion of the through portion.

Abstract: An inductor includes: a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked; and first and second external electrodes disposed on an external surface of the body, wherein the plurality of coil patterns are connected to each other through a coil connection portion and form a coil having both ends connected to the first and second external electrodes through a coil withdrawal portion, and wherein the coil connection portion is configured as a material having a higher thermal expansion coefficient than that of the insulating layers.

Abstract: A coil component includes a magnetic body and an external electrode disposed on an external surface of the magnetic body. The magnetic body includes a support member including a through hole, filled with a magnetic material, and a via hole, a coil disposed on at least one surface of the support member, and a magnetic material encapsulating the coil and the support member. A first conductive layer is disposed on a side surface of the via hole formed in the support member and the at least one surface of the support member. The via hole is filled with a portion of the second conductive layer disposed on the first conductive layer.

Abstract: A coil component including a multilayer body, at least one coil provided inside the multilayer body, and outer electrodes disposed on at least one surface of the multilayer body. The multilayer body includes a first magnetic layer, an insulating layer laminated on the first magnetic layer, and a second magnetic layer laminated on the insulating layer. The coil has, at both ends thereof, lead-out portions, each of which extends up to the surface of the multilayer body and is connected to a respective one of the outer electrodes. The outer electrodes are each present over surfaces of the first magnetic layer, the insulating layer, and the second magnetic layer, and a width of a portion of at least one of the outer electrodes contacting the insulating layer is larger than widths of each of portions of that outer electrode contacting the first and second magnetic layers.

Abstract: A chip inductor includes a sealing body having a mounting surface and a coil conductor sealed in an interior of the sealing body, wherein the coil conductor includes a first coil end exposed from the mounting surface of the sealing body, a second coil end exposed from the mounting surface of the sealing body, and a spiral portion of spiral form connected to the first coil end and the second coil end and routed along a normal direction of the mounting surface of the sealing body from the first coil end and the second coil end.

Abstract: This disclosure relates generally to substrates having three dimensional (3D) inductors and methods of manufacturing the same. In one embodiment, the 3D inductor is a solenoid inductor where the exterior edge contour of the winding ends is substantially the same and substantially aligned with the exterior edge contour of the exterior edge contour of conductive vias that connect the windings. In this manner, there is no overhang between the windings and the conductive vias. In another embodiment of the 3D inductor, via columns connect connector plates. The via column attachment surfaces of each of the conductive vias in each of the columns is the same and substantially aligned. In this manner, carrier pads are not needed and there is no overhand between the conductive vias.

Abstract: An inductor includes a body including a support member containing a through-hole, a coil disposed on the support member, and a magnetic material sealing the support member and the coil, and an external electrode disposed on an external surface of the body. The coil includes an upper coil and a lower coil disposed on an upper surface and a lower surface of the support member, respectively, and the upper coil and the lower coil are connected to each other by a connection pattern. The connection pattern surrounds at least portions of the upper coil and the lower coil and contacts a wall surface of the through-hole.

Abstract: In a common mode choke coil having a magnetic core, a decrease in peak value of a common mode impedance in a vicinity of its resonance frequency is suppressed. A common mode choke coil includes a non-magnetic layer, a first magnetic layer formed on a top surface of the non-magnetic layer, a second magnetic layer formed on a bottom surface of the non-magnetic layer, a magnetic core provided between the first magnetic layer and the second magnetic layer so that its axis extends in a top-bottom direction, a first coil conductor embedded in the non-magnetic layer and wound around the magnetic core, a second coil conductor embedded in the non-magnetic layer and wound around the magnetic core, and a first magnetic gap provided between a top surface of the magnetic core and a bottom surface of the first magnetic layer. The magnetic core is made of a ferrite material.

Abstract: Disclosed herein is an electronic component that includes: a base having a main surface; a passive element part formed on the main surface of the base; a magnetic resin layer formed on the main surface of the base so as to embed the passive element part therein, the magnetic resin layer having a surface extending substantially parallel to the main surface of the base; an insulating coat layer formed on a first area of the surface of the magnetic resin layer, the insulating coat layer having higher smoothness than the surface of the magnetic resin layer; and a terminal electrode formed on a second area of the surface of the magnetic resin layer and electrically connected to the passive element part.

Abstract: An inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate, and connects a plurality of circuit portions. The flexible substrate includes a rigid portion and a flexible portion, the rigid portion being wider than the flexible portion. The rigid portion includes the coil and a joining portion connected to another circuit. The coil includes two coil portions located at different positions in plan view, a flexible portion is located adjacent to one side of the rigid portion, and at least two coil portions of the plurality of coil portions are located on the one side when viewed from the joining portion.

Abstract: Substrate-side wiring electrode patterns 16, which form a part of a coil electrode 12, are provided on a wiring substrate 20, and as a result reductions in the size and profile of a resin insulating layer 31, in which a coil core 11 is buried, can be achieved. Therefore, reductions in the size and the profile of a coil module 1 can be achieved compared with a coil module of the related art which is formed by mounting a coil component on a wiring substrate. In addition, since the substrate-side wiring electrode patterns 16, which form a part of the coil electrode 12, are provided on the wiring substrate 20, the heat generated by a coil 10 can be efficiently released from the substrate-side wiring electrode patterns 16 to the wiring substrate 20. Therefore, the heat dissipation property of the coil module 1 can be improved at low cost.

Abstract: A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.

Abstract: Structures and methods for reducing physical space of two or three inductors while maintaining low magnetic coupling between the inductors are presented. According to one aspect, the inductors share their volume spaces and have (substantially) orthogonal far field magnetic vectors. According to another aspect, the inductors are fabricated on planar layers of a stacked structure that includes conductive and non-conductive layers. According to an additional aspect, a coil structure of one of the inductors passes through a volume space of another inductor. According to another aspect, coil structures of two of the inductors are interlaced. According to another aspect, relative placement of two coil structures of two inductors is based on a number of windings of one of the two coil structures above and below the other coil structure. According to another aspect, a shape of a coil structure of one inductor follows a near field magnetic vector of another inductor.

Abstract: An inductor includes a coil including a winding portion and an lead-out portion, a body constituted by a magnetic member and enclosing the coil, a protection layer disposed on a surface of the body, and an outer electrode. The body has a bottom surface, a top surface, two end surfaces, two side surfaces, and first and second R-chamfered sections. The outer electrode includes first and second electrode regions. The first electrode region is located on the bottom surface and is electrically connected to the lead-out portion. The second electrode region is located on the protection layer on each end surface. The number of conductive particles in the first electrode region intersecting with a unit length of a straight line perpendicular to the bottom surface is greater than that in the second electrode region intersecting with a unit length of a straight line perpendicular to the end surface.

Abstract: An inductor includes a planar laminated magnetic core and a conductive winding. The planar magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The non-magnetic layer includes an insulating layer that is disposed between first and second interface layers. The conductive winding turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The inductor can be integrated into a multilevel wiring network in a semiconductor integrated circuit to form a microelectronic device, such as a transformer, a power converter, or a microprocessor.

Abstract: Disclosed herein is a coil component that includes a substrate having a first surface and a first spiral coil spirally wound in a plurality of turns formed on the first surface of the substrate. Each of the turns has a first circumference region in which a radial position is substantially fixed and a first shift region in which a radial position is shifted. Each of inner and outer peripheral ends of the first spiral coil is positioned at the first shift region.

Abstract: A coil electronic component includes a body including ferrite, a coil portion embedded in the body, external electrodes electrically connected to the coil portion, and a magnetic permeability adjusting layer disposed in the body and including ferrite having a Curie temperature lower than that of the ferrite included in the body.

Abstract: A structure comprises a semiconductor integrated circuit, an inductor, and a magnetic flux closure layer. The inductor is integrated into a multilevel wiring network in the semiconductor integrated circuit. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic flux closure layer is disposed within about 100 ?m of a face of the planar laminated magnetic core, the face of the planar magnetic core parallel to a principal plane of the planar laminated magnetic core. A second magnetic flux closure layer can be disposed within about 100 ?m of an opposing face of the planar laminated magnetic core.

Abstract: Provided is a coil pattern formed on at least one surface of a substrate and including a first plating film formed on the substrate and a second plating film formed to cover the first plating film, a method of forming the coil pattern, and a chip device provided with the coil pattern.

Abstract: An inductor and method for making the same are provided. The inductor includes a coil formed from a conductor and having a serpentine shape. The coil may have an “S”-shape. The coil has two leads extending from opposite ends of the coil. An inductor body surrounds the coil and portions of the leads. The leads may be wrapped around the body to create contact points on the exterior of the inductor.

Abstract: Micro-fabricated coils are described. In some situations, the micro-fabricated coils include interleaved coils. In some situations, pairs of interleaved coils are stacked with respect to each other, separated by an insulating material. In some situations, the interleaved coils have an S-shape. The interleaved coils may be employed in a galvanic isolator.

Abstract: In a planar coil element, a dead space in a non-overlapping region is reduced by designing a total width of a first resin wall and a first turn located in the non-overlapping region to be narrow, more specifically, by designing the total width to be narrower than a total width of a second turn outside the first turn and a second resin wall located inside the turn and also than a total width of a third turn on the outer side and a third resin wall located inside the turn. As a result, a volume of a magnetic element body in a magnetic core portion of a coil can be increased, and an, inductance value, which is a magnetic characteristic, can also be improved.

Abstract: A method of making an inductor includes forming a plurality of first metal layers on a substrate and an ILD. The method includes patterning a plurality of trenches in the ILD, depositing a magnetic material, and depositing another layer of ILD. The method further includes patterning a plurality of vias adjacent to the trenches filled with the magnetic material, and patterning trenches in the another layer of ILD. The trenches in the another layer of ILD include first portions arranged over, adjacent to and substantially parallel the plurality of first metal layers, and the second portions arranged substantially perpendicular to the first portions, extending from both ends of the first portions, and oriented in opposite directions such that the second portions are continuous with the plurality of vias. The method includes depositing a metal in the plurality of vias and the trenches in the another layer of ILD.

Abstract: A coil component includes a body and external electrodes disposed on an external surface of the body. The body includes a support member including a through hole and a via hole, a coil including embedded coil patterns embedded in the support member and conductor layer disposed on the embedded coil patterns, and a magnetic material encapsulating the support member and the coil.

Abstract: An on-chip transformer circuit is disclosed. The on-chip transformer circuit comprises a primary winding circuit comprising at least one turn of a primary conductive winding arranged as a first N-sided polygon in a first dielectric layer of a substrate; and a secondary winding circuit comprising at least one turn of a secondary conductive winding arranged as a second N-sided polygon in a second, different, dielectric layer of the substrate. In some embodiments, the primary winding circuit and the secondary winding circuit are arranged to overlap one another at predetermined locations along the primary conductive winding and the secondary conductive winding, wherein the predetermined locations comprise a number of locations less than all locations along the primary conductive winding and the secondary conductive winding.

Abstract: The disclosure provides at least an apparatus, system and method for providing a flexible planar inductive coil, such as may be embedded in a product. The apparatus, system and method may include at least one conformable substrate, and a matched function ink set, printed onto at least one substantially planar face of the at least one substrate. This printing may form at least one layer of additive conductive traces capable of receiving current flow from at least one source and layered into successive ones of the conductive traces about a center axis within a plane of the at least one conformable substrate.

Abstract: Distributions of on-chip inductors for monolithic voltage regulation are described. On-chip voltage regulation may be provided by integrated voltage regulators (IVRs), such as a buck converter with integrated inductors. On-chip inductors may be placed to ensure optimal voltage regulation for high power density applications. With this technology, integrated circuits may have many independent voltage domains for fine-grained dynamic voltage and frequency scaling that allows for higher overall power efficiency for the system.

Abstract: One object of the present invention is to provide a compact coil component with superior characteristics. An electronic component according one embodiment includes an insulator and a coil portion. The insulator is formed of a non-magnetic material. The insulator includes a width direction in a first axial direction, a length direction in a second axial direction, and a height direction in a third axial direction. The coil portion includes a circumference section. The circumference section is wound around the first axial direction. The coil portion is arranged inside the insulator. The first ratio of a height to a length of the insulator is 1.5 times or less of a second ratio of a height between first inner peripheral portions of the circumference section along the third axial direction with respect to a length between second inner peripheral portions of the circumference section along the second axial direction.

Abstract: The present invention discloses an electronic module. The electronic module comprises: a substrate, having a top surface and a bottom surface; a plurality of coils on the top surface of the substrate, wherein each coil comprises a corresponding first end and a corresponding second end; and a molding body, disposed on the substrate to encapsulate said coils, wherein said corresponding first end and said corresponding second end of each coil are electrically coupled to a corresponding first electrode and a corresponding second electrode of the electronic module.

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces facing in a first axis direction, first and second end surfaces facing in a second axis direction, and first and second internal electrodes; a first external electrode including a first cover portion covering the first end surface, and a first extended portion extending from the first cover portion to the second main surface; and a second external electrode including a second cover portion covering the second end surface, and a second extended portion extending from the second cover portion to the second main surface, the multi-layer ceramic electronic component satisfying that, when T1 represents a dimension of the ceramic body in the first axis direction and T2 represents a dimension of each extended portion in the first axis direction, T1+T2 is 50 ?m or less, and T2/(T1+T2) is 0.32 or less.

Abstract: A coil component includes a body, a coil part embedded in the body, and an insulating layer covering the body. First and second plating electrodes are disposed between the body and the insulating layer, are connected to the coil part, and are disposed to be spaced apart from each other on one surface of the body. First and second through electrodes penetrate through the insulating layer to thereby be connected to the first and second plating electrodes, respectively.

Abstract: One object of the present invention is to provide a magnetic coupling coil component having a high coupling coefficient between coils of different lines and facilitating insulation between the coils. A coil component according to one embodiment includes: an insulator body including first insulating layers and second insulating layers stacked together in a lamination direction; first conductive patterns formed on the first insulating layers; and second conductive patterns formed on the second insulating layers. The insulator body includes a first end region, a second end region, and an intermediate region positioned between the first end region and the second end region. The first end region includes the first insulating layers only, the second end region includes the second insulating layers only, and the intermediate region includes the first insulating layers and the second insulating layers arranged alternately in the lamination direction.

Abstract: A wireless charging coil is provided herein. The wireless charging coil comprising a first stamped coil having a first spiral trace, the first spiral trace defining a first space between windings, and a second stamped coil having a second spiral trace, the second spiral trace defining a second space between windings, wherein the first stamped coil and second stamped coil are planar to and interconnected with one another, such that the first stamped coil is positioned within the second space of the second stamped coil, and the second stamped coil is positioned within the first space of the first stamped coil.

Abstract: A coil component includes a body part in which a plurality of body sheets are stacked, an internal coil disposed in the body part and including a plurality of internal electrode patterns each disposed on a respective one of the plurality of body sheets, and an external electrode part electrically connected to both ends of the internal coil. A first internal area of a first internal electrode pattern disposed on one of the plurality of body sheets is smaller than a second internal area of a second internal electrode pattern disposed on another of the plurality of body sheets.

Abstract: An inductive position-measuring device includes a scanning element and a graduation element, rotatable about an axis relative to the scanning element. The scanning element has exciter lead(s), a first receiver track, including receiver line(s), extending according to a first periodic pattern having a first period along a first direction, and a second receiver track, including receiver line(s). The graduation element includes a graduation track, extending in the circumferential direction and including a graduation period. An electromagnetic field generated by the exciter lead(s) with the aid of the graduation track is able to be modulated, so that an angular position is detectable with the aid of the receiver line of the first receiver track, and a position of the graduation element in the first direction relative to the scanning element is detectable with the aid of the receiver line of the second receiver track.

Abstract: A device for inductively transferring electrical energy and/or data from a primary-sided carrier to at least one positionable secondary-sided recipient includes at least one primary-sided coil arrangement, which inductively interacts with at least one secondary-sided coil arrangement. Meander-shaped windings of a predeterminable winding number of the primary-sided and/or secondary-sided coil arrangement are arranged on at least one flexible carrier by embroidering a high frequency strand, and the meander-shaped windings have straight courses in the region of crossovers of the embroidered high frequency strands.

Abstract: A pad forms a connection terminal suitable for coupling circuit elements integrated in a chip to circuits outside the chip itself. At least one inductor is provided for use in the reception/transmission of electromagnetic waves or for supplying the chip with power or both. The connection pad and inductor are combined in a structure which reduces overall occupied area. A magnetic containment structure surrounds the structure to contain a magnetic field of the inductor.

Abstract: An inductor includes a body including a coil and an encapsulant and an external electrode on an outer surface of the body. The encapsulant includes a first core surrounding the coil and a second core surrounding the first core. The first core includes a magnetic powder having high current characteristics, and the second core includes a magnetic powder having high capacity characteristics.

Abstract: A light emitting device includes a flexible substrate, a plurality of LEDs arranged on the flexible substrate to emit light in a main direction perpendicular to both a longitudinal direction and a transversal direction of the flexible substrate a plurality of folds provided such that the flexible substrate is folded resulting in the main direction in which the light from at least one LED is rotated around the longitudinal axis or the transversal axis of the flexible substrate over a desired angle ?.

Abstract: Some embodiments include apparatuses having a switching circuit included in a buck converter; an output node; an inductor including a first portion having a first terminal coupled to the switching circuit, a second portion having a second terminal coupled to the output node, and a third terminal between the first and second portions; and a capacitor coupled to the second terminal, the second terminal to couple to a first additional capacitor, and the third terminal to couple to a second additional capacitor.