Abstract: A coil component includes a first outer magnetic body, a first outer insulator, a first inner magnetic body, an inner insulator, a second inner magnetic body, a second outer insulator, and a second outer magnetic body stacked sequentially, and a coil in the inner insulator and an internal magnetic body inside the coil. Volumes A, B, C, and D of the first and second outer insulators, the inner insulator, the coil, and the internal magnetic body, respectively, and volume E of the first outer magnetic body, the first inner magnetic body, the second inner magnetic body, and the second outer magnetic body satisfy 0.05?A?0.07, 0.2?B?0.4, 0.01?C?0.08, 0.03?D?0.05, and 0.4?E?0.71, where 0.05B?C?0.2B and A+B+C+D+E=1.

Abstract: An inductor includes a body including a support member having a first through-hole, a second through-hole, a first via-hole and a second via-hole, the first and second via-holes being spaced apart from the first and second through-holes, a first coil unit and a second coil unit disposed on one surface of the support member, a third coil unit and a fourth coil unit facing the one surface of the support member, and an encapsulant encapsulating the support member and the first to fourth coil units and including a magnetic material, and a first external electrode to a fourth external electrode respectively connected to the first to fourth coil units on an external surface of the body. The encapsulant includes a first encapsulant and a second encapsulant having magnetic permeability different from each other.

Abstract: A hybrid coil component in which a magnetic core generally included in a wire-wound type inductor and a core included in a multilayer type inductor are combined with each other. A winding coil may be wound around a magnetic core manufactured in advance and an encapsulant having a stacked structure of a plurality of magnetic sheets may encapsulate the winding coil wound around the magnetic core. In this case, a magnetic flux generated in the winding coil is arranged to be parallel to long axes of magnetic particles contained in the magnetic core and the encapsulant.

Abstract: A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.

Abstract: In the power transmission unit, a first coil pattern includes first inner side patterns, and first outer side patterns provided on the outer side of the first inner side patterns. A second coil pattern includes second inner side patterns, and second outer side patterns provided on the outer side of the second inner side patterns. The first and second coil patterns are configured such that the first inner side patterns and the second outer side pattern are connected, and the first outer side patterns and the second inner side patterns are connected. Then, the first and second coil patterns transfer power to the power transmission coil pattern of a power receiving unit in a contactless manner.

Abstract: A single-ended inductor comprises a first partial coil wound in a first direction; and a second partial coil wound in a second direction and adjoined the first partial coil; wherein, the second direction is opposite to the first direction to reduce the coupling of single-ended inductors and peripheral lines and reduce signal interference.

Abstract: The present embodiments relate generally to data communications, and more particularly to systems including high-speed serializer-deserializer circuits having TCOILs. One or more embodiments are directed to a four-terminal TCOIL structure that consumes the same amount of area on a chip as a traditional three-terminal structure, while providing more bandwidth and less reflection and group delay variation.

Abstract: A laminated electronic component having a coil formed in the laminated body of pluralities of laminated magnetic material layers and conductor patterns by electrically connecting the conductor patterns adjacent to each other via the magnetic material layers. The magnetic material layers contain a metal magnetic material. The coil has a first end portion close to a bottom surface of the laminated body and a second end portion distant from the bottom surface of the laminated body. The first end portion is electrically connected to a first external terminal disposed on the bottom surface of the laminated body. The second end portion is electrically connected to a second external terminal disposed on the bottom surface of the laminated body via an electrode disposed on a side surface of the laminated body. The electrode is covered with an insulator film.

Abstract: In a coil component, in an upper coil portion, a winding end portion constituting an end portion is connected to a lead-out conductor. Accordingly, the lead-out conductor can absorb heat from the winding end portion and can dissipate heat to the outside via a terminal electrode. Moreover, the lead-out conductor is formed to cover a winding adjacent portion. Accordingly, heat can also be absorbed from the winding adjacent portion and can be dissipated to the outside via the terminal electrode. That is, in the coil component described above, since the lead-out conductor absorbs heat not only from the winding end portion but also from the winding adjacent portion, improvement of heat dissipation properties is realized in the coil component.

Abstract: A common mode noise filter includes a non-magnetic body and first to third coil conductors provided inside the non-magnetic body. The second coil conductor is provided in a downward direction from the first coil conductor. The third coil conductor is provided in the downward direction from the second coil conductor. The first and third coil conductors deviate in a direction perpendicular to the downward direction with respect to the second coil conductor. At least one of the first and third coil conductors overlaps the second coil conductor viewing from the direction perpendicular to the downward direction. This common mode noise filter allows these coil conductors to be magnetically coupled to each other with a preferable balance, thereby preventing degradation of differential signals.

Abstract: A coil includes a resin substrate, a first coil structure formed on a first surface of the resin substrate, a second coil structure formed on a second surface of the resin substrate on the opposite side with respect to the first surface such that the second coil structure is formed at a position corresponding to the first coil structure, a third coil structure formed on the second surface such that the third coil structure is positioned adjacent to the second coil structure, and a fourth coil structure formed on the first surface such that the fourth coil structure is formed at a position corresponding to the third coil structure. The resin substrate is folded such that the second coil structure and the third coil structure oppose each other.

Abstract: A hybrid inductor includes an inductor body having a core part in which a coil part is disposed, and first and second cover parts having the core part interposed therebetween. The core part includes magnetic metal layers, and the first and second cover parts include ferrite layers.

Abstract: A coil component includes: a body; a coil part including a coil pattern embedded in the body and having at least one turn winding around on one direction; first and second external electrodes disposed on a surface of the body and connected to the coil part; and a shielding via having a permeability higher than that of the body and extending along the one direction in the body.

Abstract: An inductive sensor includes a core body, a coil wound on the core body, a cavity having a fixed volume within the core body, and an epoxy mixture filling a controlled portion of the fixed volume. The controlled portion of the fixed volume filled with the epoxy mixture controls an inductance of the sensor.

Abstract: A coil component includes a body including a support member having a through hole and a via hole, first and second coils disposed on first and second sides of the support member opposing each other and having coil patterns, and a magnetic material sealing the support member and the coil, and an external electrode disposed on an exterior surface of the body. The first coil includes at least a portion embedded in the support member, and a second coil is connected to the first coil through a via filling an interior of the via hole. Groove portions, recessed toward a center of the support member according to a shape of the first coil, are filled with a first conductive layer as a lowermost layer of the first coil. The second side of the support member is in contact with a lower surface of the second coil.

Abstract: A coil component includes a body, a coil disposed inside of the body and forming one coil track when being viewed in a laminated direction, external electrodes disposed on an outer surface of the body. The coil track includes corner portions and linear portions connecting the respective corner portions to each other, and a line width of the corner portion is greater than that of the linear portion.

Abstract: A printed circuit board includes at least one of a first coil pattern disposed on a first main surface and a second coil pattern disposed on a second main surface. The first coil pattern includes a first portion arranged between a first core portion and a second core portion. The second coil pattern includes a third portion arranged between the first core portion and the second core portion. A first heat transfer member is mounted on at least one of the first portion and the third portion. Therefore, temperature increase of at least one of the first portion and the third portion can be suppressed.

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

Abstract: In an electronic circuit board of a power conversion device or the like, heat interference between parts mounted on a multi-layer printed circuit board is suppressed in order to place the mounted parts close to each other. The mounted parts include a semiconductor element and a magnetic part formed by a coil pattern, which is made from a copper foil of the printed circuit board, and by a magnetic core. A screw fixing portions is placed in the surroundings of the semiconductor element and the coil pattern. A heat radiation pattern connected to the screw fixing portion is provided between and around the semiconductor element and the coil pattern when viewed from a direction perpendicular to a principal surface of the multi-layer printed circuit board. The screw fixing portion is connected to a cooler in a manner that gives the screw fixing portion heat conductance and electrical conductance.

Abstract: A switching power converter includes a first and second switching device, an air core coupled inductor, and a controller. The air core coupled inductor includes a first winding electrically coupled to the first switching device and a second winding electrically coupled to the second switching device. The first and second windings are magnetically coupled. The controller is operable to cause the first and second switching devices to repeatedly switch between their conductive and non-conductive states at a frequency of at least 100 kilohertz to cause current through the first and second windings to repeatedly cycle, thereby providing power to an output port. The switching power converter may have a topology including, but not limited to, a buck converter topology, a boost converter topology, and a buck-boost converter topology.

Abstract: A coil component and a method of manufacturing the same are provided. The coil component may include a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a coil disposed on a surface of the support member and having a terminal exposed to at least one outer surface of the body part, and a conductive via connected to the terminal of the coil and penetrating through at least one end portion of the support member to thereby be exposed to the at least one outer surface of the body part.

Abstract: A magnetic field coupling element includes conductor patterns stacked with insulating layers interposed therebetween, and interlayer connection conductors that inter-connect the conductor patterns at predetermined positions. The conductor patterns include first, second, third, and fourth conductor patterns, and the interlayer connection conductors include first and second interlayer connection conductors. The first conductor pattern, the second conductor pattern, and the first interlayer connection conductor define a first coil, and the third conductor pattern, the fourth conductor pattern, and the second interlayer connection conductor define a second coil. The first coil and the second coil are disposed in a region of less than about ? of a stacking height of a multi-layer body including the insulating layers.

Abstract: Aspects generally relate to adjusting, or lowering, the Q of an inductor. In one embodiment, an integrated circuit includes an inductor and a conductive closed ring inside a periphery of the inductor. In another embodiment, there can be a plurality of closed rings inside the periphery of the inductor. The conductive closed rings are magnetically coupled to the inductor to adjust the Q.

Abstract: A multilayer coil component includes an element body; and a coil that is provided inside the element body and includes a plurality of coil conductors that are stacked in a stacking direction and are electrically connected to each other. Each coil conductor has a contact portion and a non-contact portion. A pair of the contact portions that are adjacent to each other in the stacking direction and contact each other form a contact region. In the coil, all the contact regions are located at different positions from each other when viewed in the stacking direction. The number of turns of the coil is represented by n (positive number). The number of stacked coil conductor layers is given by 2n+1.

Abstract: Embodiments of the present invention provide an inductively coupled filter and a WiFi module. The inductively coupled filter includes a first circuit, where the first circuit is disposed on a first substrate; and a second circuit, where the second circuit is disposed on a second substrate; and the first substrate and the second substrate are disposed opposite to each other, so that a coil inductor in the first circuit and a coil inductor in the second circuit form a mutual induction structure. In the inductively coupled filter in the embodiments of the present invention, the coil inductors are disposed on two substrates respectively. This can reduce an area occupied by the inductively coupled filter on each package substrate.

Abstract: An inductor includes a substrate, and a first coil pattern disposed on one surface of the substrate and having a spiral shape comprising a plurality of turns, wherein as the first coil pattern extends inwardly towards a center of the first coil pattern, a pattern width of the first coil pattern decreases while a center-to-center distance between two adjacent turns of the first coil pattern increases.

Abstract: A multilayer electronic component manufacturing method includes forming a multilayer body including a plurality of ceramic layers, and forming an outer electrode conductor layer on a bottom surface of the multilayer body. The method further includes forming a groove by removing at least a part of the outer electrode conductor layer in a part of the outer electrode conductor layer and a part of the bottom surface of the multilayer body after the outer electrode conductor layer is formed, and segmenting the multilayer body by dividing the multilayer body into a plurality of chip regions.

Abstract: An inductor element includes a wire-winding portion and a core portion. In the wire-winding portion, a conductor is wound in a coil shape. The core portion surrounds the wire-winding portion and contains a magnetic powder and a resin. The wire-winding portion includes an inner circumferential surface. A winding-wire inner circumferential neighboring region is a region of the core portion within a distance from the inner circumferential surface toward a winding axis of the wire-winding portion. An inner-core central region is a region of the core portion within a distance from the winding axis center toward an existing region of the wire-winding portion in an outward direction perpendicular to the winding axis center. S??S?1?5.0% is satisfied, where S?(%) and S?1(%) are respectively an area ratio of a magnetic powder in the inner-core central region and the winding-wire inner circumferential neighboring region.

Abstract: A multilayer electronic component manufacturing method includes forming a multilayer body including a plurality of ceramic layers, and forming a groove by removing a part of a bottom surface of the multilayer body. The method further includes segmenting the multilayer body by dividing the multilayer body into a plurality of chip regions, and forming an outer electrode conductor layer on the bottom surface of the multilayer body after formation of the groove and segmentation.

Abstract: Some features pertain to a device package that includes a die and a package substrate. The die includes a first switch. The package substrate is coupled to the die. The package substrate includes at least one dielectric layer, a primary inductor, and a first secondary inductor coupled to the first switch of the die. The first secondary inductor and the first switch are coupled to a plurality of interconnects configured to provide an electrical path for a reference ground signal. The primary inductor is configurable to have different inductances by opening and closing the first switch coupled to the first secondary inductor. In some implementations, the primary inductor is configurable in real time while the die is operational. In some implementations, the die further includes a second switch, and the package substrate further includes a second secondary inductor coupled to the second switch of the die.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a semiconductor die, a molding compound, a polymer layer, a conductive trace, a conductive via and an inductor. The semiconductor die is laterally surrounded by the molding compound. The polymer layer covers the semiconductor die and the molding compound. The conductive trace, the conductive via and the inductor are embedded in the polymer layer. The conductive via extends from a top surface of the conductive trace to a top surface of the polymer layer. The inductor has a body portion extending horizontally and a protruding portion protruded from the body portion. A total height of the body and protruding portions is substantially equal to a sum of a thickness of the conductive trace and a height of the conductive via. The height of the body portion is greater than the thickness of the conductive trace.

Abstract: The present invention is directed to electrical circuits. and more specially, inductor designs that reduce on-chip electromagnetic coupling in certain applications. In a specific embodiment, the present invention provides an inductor that includes coils that are configured to generate magnetic fields of opposite polarities. The electromagnetic fields generated by the inductor coils substantially cancel out with each other, thereby minimizing parasitic inductance of the inductor and reducing interference with operations of other components in an integrated circuit. There are other embodiments as well.

Abstract: In an embodiment, a coil component includes: an element body part 10; a coil conductor 36 constituted by first conductors 32 extending along the pair of end faces 16 and orthogonally to a bottom face 14, as well as second conductors 34 extending from one side, to the other side, of the pair of end faces and thereby connecting the multiple first conductors 32; lead conductor parts 38 electrically connected to two ends of the coil conductor, respectively; and a pair of external electrodes 50 electrically connected to the lead conductor parts; wherein at least one end of the coil conductor is electrically connected, via the lead conductor, to the external electrode at a top face 12 of the element body part; and the coil conductor extends from the at least the one end, using a second conductor, along and near the top face.

Abstract: A side surface of a flange part includes a central region having a straight surface and an outside region having an outside sloped surface. In the outside region, a ridge portion at which the outside sloped surface and an outside end surface are in contact with each other is chamfered into a first outside R surface. As a result, even when a swollen shape portion is formed at a location beyond the first outside R surface, the location where the swollen shape portion is formed is on the outside sloped surface, which is recessed from the straight surface toward the inside of the flange part. Thus, it is possible to reduce the degree and the probability of protruding of the swollen shape portion.

Abstract: Some aspects pertain to an inductor apparatus that includes a first metal layer including a plurality of first interconnects, a second metal including a plurality of second interconnects, a first dielectric layer between the first metal layer and the second metal layer, and an inductor. The inductor includes a plurality of vias, where the plurality of vias are configured to couple the plurality of first interconnects to the plurality of second interconnects. The inductor includes a plurality of inductor loops formed by the plurality of vias, the plurality of first interconnects and the plurality of second interconnects. The inductor further includes a first magnetic layer and a second magnetic layer, located between the first interconnects and the second interconnects; and a third magnetic layer and an optional fourth magnetic layer outside of the plurality of inductor loops.

Abstract: An inductor component includes a plurality of stacked layer structures made of component carrier material with electrically conductive plate structures, and a plurality of electrically conductive interconnect structures connecting the electrically conductive plate structures to thereby form an inductance with multiple windings.

Abstract: An inductor device includes a resin film, a first base conductor layer formed on one surface of the resin film and having a first pad, a second base conductor layer formed on the other surface of the resin film and having a second pad, a through-hole penetrating from the first pad to the second pad, a through conductor filled in the through-hole and provided to connect the first pad and the second pad each other, a first insulating layer formed on the one surface of the resin film and having an opening arranged on the first base conductor layer, and a first conductor part formed on the first base conductor layer in the opening of the first insulating layer. A first conductor pattern layer includes the first base conductor layer and the first conductor part. The first conductor pattern layer has a convex sectional shape.

Abstract: A filter component having an ESD protection function that includes a mounting inductor component and a base board. An ESD protection element and a capacitor are formed in the base board, which includes a semiconductor substrate, and front and back rewiring layers. First and second mounting component connection terminal conductors to which the mounting inductor component is connected are formed on an outer surface of the front rewiring layer. Moreover, a first, second and third external connection terminal conductors are formed on an outer surface of the back rewiring layer. The ESD protection element is formed in the semiconductor substrate and the capacitor is formed in one of the front rewiring layer or the back rewiring layer.

Abstract: An inductor component has an element body, a coil disposed in the element body, and first and second external electrodes disposed in the element body and electrically connected to the coil. The element body includes a first end surface and a second end surface opposite to each other and a bottom surface connected between the first end surface and the second end surface. The first external electrode is formed on the first end surface side of the bottom surface while the second external electrode is formed on the second end surface side of the bottom surface. A first end of the coil is connected to an end portion on the first end surface side of the first external electrode while a second end of the coil is connected to an end portion on the second end surface side of the second external electrode.

Abstract: A communication circuit for communication over a voltage isolation barrier, the communication circuit including a pulse driven transformer coupled to a current sensing input, wherein information is transferred in the current domain and wherein during the information transfer, the receiver input is made low ohmic, a current pulse transformer including a primary winding, a core, and a secondary winding, a resistor in parallel with the secondary winding, a current sensor having a low ohmic input to receive a pulse from the secondary winding, and a signal processing unit to extract information from the received pulse.

Abstract: A coil component includes: a first coil layer; and a second coil layer disposed on the first coil layer, wherein the first coil layer includes a first insulating layer and a first coil conductor embedded in the first insulating layer, the second coil layer includes a second insulating layer and a second coil conductor embedded in the second insulating layer, the first and second coil conductors are electrically connected to each other by a through-conductor formed in the first insulating layer, and cavities vertically penetrating through the first and second coil layers are provided in core regions of the first and second coil layers, respectively.

Abstract: In a multilayer coil component, an end of a lower coil layer and an end of a connecting part are directly overlapped, and the end of the lower coil layer includes a contact edge positioned on a side of the connecting part and being in contact with the connecting part and a non-contact edge positioned on a side opposite to the connecting part and not being in contact with the connecting part. Then, the contact edge and the non-contact edge are not overlapped when viewed from a laminated direction. Consequently, a propagation distance of a crack becomes longer as compared with the case where an end face is parallel to the laminated direction, effectively suppressing advance of the crack. Suppressed advance of a crack in this manner makes the multilayer coil component provide a high component strength as a whole.

Abstract: A coil component includes a coil having inner and outer circumferential surfaces, a pair of end surfaces, and a core surrounding at least a part of a periphery of the core. A cross section is where the coil component is cut by a plane, when each of coil sections is divided into eight regions by four straight lines extending along the inner circumferential surface, the outer circumferential surface and the end surfaces. In the cross section, first core members positioned at four corner regions, second core members positioned at an inner side of the inner circumferential surface and an outer side of the outer circumferential surface, and third core members, positioned at outer sides of the end surfaces form the core. At least one of the second and third core members has a magnetic permeability lower than that of the first core member in a zero magnetic field.

Abstract: A multilayer ceramic capacitor includes an element body in which a dielectric layer and an internal electrode layer are laminated; a first external electrode that is provided at one end of the element body and is connected to a part of the internal electrode layer; and a second external electrode that is provided at an other end of the element body and is connected to that part of the internal electrode layer which is not connected to the first external electrode, in which the first external electrode and the second external electrode each have a linear groove.

Abstract: A coil electronic component includes a magnetic body in which a coil having leads exposed to side surfaces of the coil is disposed. External terminals are connected to the leads and disposed on outer surfaces of the magnetic body. Additionally, the external terminals are folded to have side surface portions which are disposed on end surfaces of the magnetic body, and bottom surface portions which are disposed on a bottom surface of the magnetic body.

Abstract: An inductor includes a printed wiring board (PWB) and a plurality of electrically-conductive heat pipes operatively connected to the PWB. The PWB includes electrically conductive traces electrically connected to the plurality of electrically-conductive heat pipes. The traces and plurality of electrically conductive heat pipes form an inductor winding. A method of manufacturing an inductor includes mounting a plurality of electrically conductive heat pipes to a printed wiring board (PWB), wherein the PWB includes electrically conductive traces to connect the plurality of electrically-conductive heat pipes to form an inductor winding.

Abstract: A coil component includes a magnetic portion that includes metal particles and a resin material, a coil conductor embedded in the magnetic portion and having a core portion, and outer electrodes electrically connected to the coil conductor. The magnetic portion includes an outer coating and a magnetic base having a protrusion portion. The protrusion portion is inserted into the core portion. The filling factor of the metal particles in the magnetic base is higher than the filling factor of the metal particles in the outer coating.

Abstract: A wireless power supply coil unit for transmitting or receiving power wirelessly includes a coil having a hollow portion and a coil axis in a vertical direction, a first magnetic body having an opening at a position corresponding to the hollow portion of the coil, a second magnetic body having a plate-like shape and arranged in the hollow portion of the coil on one side of the first magnetic body, and an insulating plate interposed between the first magnetic body and the second magnetic body. The coil unit has high surface stiffness of the magnetic bodies and prevents or reduces dielectric breakdown between contact surfaces of the magnetic bodies.

Abstract: An inductor includes a body including insulating layers stacked therein, in which coil patterns are respectively disposed on the insulating layers, and first and second external electrodes disposed on an external surface of the body, wherein the coil patterns are connected to each other by a plurality of coil connecting portions, and opposing ends thereof are connected to the first and second external electrodes through coil lead portions, respectively, to form a coil, the coil patterns include outer coil patterns disposed in an outer portion of the body and inner coil patterns disposed in an inner portion, a first coil connecting portion connects the outer coil patterns and a second coil connecting portion connects one coil pattern of the outer coil patterns and another coil pattern of the inner coil patterns, and the first and second coil connecting portions are disposed in a staggered manner.

Abstract: The systems and methods described herein provide for the fabrication of semiconductor package substrates having magnetic inductors formed in at least a portion of the through-holes formed in the semiconductor package substrate. Such magnetic inductors are formed without exposing the magnetic material disposed in the through-hole to any wet chemistry (desmear, electro-less plating, etc.) processes by sealing the magnetic material with a patterned sealant (e.g., patterned dry film resist) which seals the magnetic material prior to performing steps involving wet chemistry on the semiconductor package substrate. Such beneficially minimizes or even eliminates the contamination of wet chemistry reagents by the magnetic material should the magnetic material remain exposed during the wet chemistry processes. The patterned sealant is removed subsequent to the semiconductor package processing steps involving wet chemistry.