Printed Circuit-type Coil Patents (Class 336/200)
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Patent number: 11783991Abstract: An inductor device includes a first inductor and a second inductor. The first inductor has a first winding and a second winding. The second inductor has a third winding and a fourth winding, and the second inductor is disposed adjacent to the first inductor, and the second inductor is coupled to the first inductor in an interlaced manner.Type: GrantFiled: August 28, 2020Date of Patent: October 10, 2023Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Hsiao-Tsung Yen, Ka-Un Chan
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Patent number: 11785724Abstract: A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, the core body includes a thin conductive layer on the insulating base film, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is 1/2 or more and 5 or less.Type: GrantFiled: June 29, 2021Date of Patent: October 10, 2023Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Hiroshi Ueda, Kousuke Miura, Yoshihito Yamaguchi, Yuka Urabe
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Patent number: 11783986Abstract: A resonant coil with integrated capacitance includes at least one separation dielectric layer and a plurality of conductor layers stacked in an alternating manner. Each of the plurality of conductor layers includes a first conductor sublayer and second conductor sublayer having common orientation and a sublayer dielectric layer separating the first and second conductor sublayers, each conductor layer having multiple discontinuities.Type: GrantFiled: August 14, 2020Date of Patent: October 10, 2023Assignee: THE TRUSTEES OF DARTMOUTH COLLEGEInventors: Phyo Aung Kyaw, Aaron Stein, Charles R. Sullivan
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Patent number: 11783990Abstract: In an embodiment, an integrated circuit die includes a semiconductor substrate, patterned metal layers compiled over the semiconductor substrate, and a tapered multipath inductor formed in the patterned metal layers. The tapered multipath inductor includes, in turn, an inductor input terminal, an inductor output terminal, and N number of parallel inductor tracks electrically coupled between the inductor input terminal and the inductor output terminal. The parallel inductor tracks wind or wrap around an inductor centerline to define a plurality of multipath inductor windings including an innermost winding and an outermost winding. The parallel inductor tracks further vary in track width when progressing from the outermost winding to the innermost winding of the plurality of multipath inductor windings.Type: GrantFiled: March 30, 2022Date of Patent: October 10, 2023Assignee: NXP B.V.Inventors: Thomas Jan Hoen, Yanyu Jin, Anne Johan Annema, Jos Verlinden
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Patent number: 11771897Abstract: The present invention relates to a system, its catheter and its method for providing electrical pulses and/or therapeutic or diagnostic liquids directly to a pituitary gland of a mammal. The catheter, containing an electrode or a microcannula or both, is moved through an endovascular route of a patient to his/her sinus cavernosus and then the distal end of the electrode or microcannula is moved through an opening in the distal end of the catheter and then through a perforation in the medial wall of the sinus cavernosus, to the pituitary gland.Type: GrantFiled: November 14, 2018Date of Patent: October 3, 2023Assignee: ACADEMISCH ZIEKENHUIS LEIDEN (H.O.D.N. LUMC)Inventors: Wouter R. Van Furth, Nienke R. Biermasz, Amir H. Zamanipoor Najafabadi
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Patent number: 11776734Abstract: A coil element according to one embodiment includes: an insulator body including first insulating layers and second insulating layers laminated in a stacking direction; first conductive patterns formed on the first insulating layers; and second conductive patterns formed on the second insulating layers. The insulator body includes a first end region situated at a top in the stacking direction, a second end region situated at a bottom in the stacking direction, and an intermediate region situated between the first end region and the second end region. The insulator body includes a first portion and a second portion that is an area other than the first portion. The first portion covers upper and lower surfaces of one or more intermediate first conductive patterns in the intermediate region among the plurality of first conductive patterns. The electrical resistivity of the first portion is higher than that of the second portion.Type: GrantFiled: July 19, 2019Date of Patent: October 3, 2023Assignee: Taiyo Yuden Co., Ltd.Inventors: Natsuko Sato, Tomoo Kashiwa
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Patent number: 11769620Abstract: The electronic component includes an element body having a mounting surface, an upper surface opposing the mounting surface, a first side surface, and a second side surface adjacent to the first side surface, and an outer conductor including a first portion extending along the first side surface and embedded in the element body so as to be exposed from the first side surface. The element body has a first chamfered portion at a corner portion connecting the upper surface and the first side surface, and a length of the first chamfered portion is longer than a thickness of the first portion of the outer conductor in a direction substantially orthogonal to the first side surface.Type: GrantFiled: November 17, 2020Date of Patent: September 26, 2023Assignee: Murata Manufacturing Co., Ltd.Inventor: Yasunari Nakashima
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Patent number: 11769616Abstract: Cables are magnetically attracted to magnets in straps and other items such as electronic devices. The cables may contain signal lines to convey power and/or data. Magnetic material that is attracted to magnetic fields may be incorporated into the signal lines and/or other structures in the cables. The straps may have flexible magnets and/or other magnets extending along their lengths. The magnets of the straps create magnetic fields that attract the cables. Electronic devices may also have housings that contain magnets to attract the cables. Using magnetic attraction, cables can be removably attached to straps and other items during operation of an electronic device, thereby helping to prevent tangling of the cables.Type: GrantFiled: March 23, 2021Date of Patent: September 26, 2023Assignee: Apple Inc.Inventors: Toria F. Yan, Liam R. Martinez, Yi H. Hsieh, Yunhe Huang, Zebinah P. Masse
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Patent number: 11769617Abstract: A laminated coil component in which the reliability can be improved by suppressing a decrease in the bonding strength between an extended conductor layer and an external electrode. The laminated coil component includes an element body; a coil placed inside the element body and including a plurality of coil conductor layers that are electrically connected; and an external electrode formed on an outer surface of the element body and electrically connected to the coil via an extended conductor layer electrically connected to the coil. The extended conductor layer has an average crystal grain size less than an average crystal grain size of each of the coil conductor layers.Type: GrantFiled: August 4, 2020Date of Patent: September 26, 2023Assignee: Murata Manufacturing Co., Ltd.Inventor: Takashi Sakai
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Patent number: 11766824Abstract: An apparatus for producing a three-dimensional multilayer object produces a three-dimensional multilayer object by partially applying energy to a conductive powder and thereby melting or sintering and curing the conductive powder. The apparatus for producing a three-dimensional multilayer object includes: a holding unit holding the conductive powder, and holding the cured three-dimensional multilayer object; an energy application unit applying energy to the conductive powder held by the holding unit; a probe disposed spaced apart from a surface layer portion of the cured three-dimensional multilayer object and detecting a flaw in the surface layer portion; and a probe moving mechanism relatively moving the probe with respect to the surface layer portion. The probe contains an excitation coil generating an eddy current in the surface layer portion, and a detection coil detecting a change in a magnetic field of the surface layer portion.Type: GrantFiled: May 25, 2018Date of Patent: September 26, 2023Assignee: IHI CorporationInventor: Takeru Oohashi
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Patent number: 11769619Abstract: A coil component includes a support substrate, a coil portion disposed on one surface of the support substrate and having one end and the other end connected by a plurality of turns, a body in which the support substrate and the coil portion are embedded, a lead portion extending from one end of the coil portion, and an auxiliary lead portion disposed between one end of the coil portion and the other end of the coil portion, and extending from the coil portion to be spaced apart from the lead portion, on one surface of the support substrate. The lead portion and the auxiliary lead portion are exposed to an external surface of the body to be spaced apart from each other.Type: GrantFiled: July 2, 2020Date of Patent: September 26, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Kwang Il Park
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Patent number: 11761987Abstract: A circuit interrupter includes separable contacts; an operating mechanism; an electronic trip unit; and a current sensor assembly including: a harvester circuit having a primary conductor through which input current passes, a secondary winding and a harvester core structured to saturate at a first input current level, a Rogowski coil structured to measure voltage at an output of the Rogowski coil, the measured voltage indicative of output current of the Rogowski coil, where linearity of the output of Rogowski coil deviates more than a deviation tolerance based at least in part on saturation of the harvester core at the first input current level, and a compensation coil arranged at 180 degree opposite to the secondary winding of the harvester core, the compensation coil structured to delay saturation of the harvester core until the input current reaches a second input current level higher than the first input current level.Type: GrantFiled: November 12, 2021Date of Patent: September 19, 2023Assignee: EATON INTELLIGENT POWER LIMITEDInventors: Rishabh Dixit, Theodore James Miller, Asish Das
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Patent number: 11764524Abstract: A terminal connector for attachment to a circuit board. The terminal connector comprises first and second terminals, each comprising a connection end for connection to respective contacts in the circuit board and a wire attachment formation for connecting a wire to the respective terminal. The terminal connector further comprises a ferrite core surrounding a section of both the first and second terminals between their terminal contacts and wire attachment formations. The ferrite core is directly connected to the terminals and is secured to the circuit board by the terminals when their connection ends are connected to the respective contacts in the circuit board.Type: GrantFiled: September 21, 2021Date of Patent: September 19, 2023Assignee: TDK-LAMBDA UK LIMITEDInventor: Radoslav Solc
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Patent number: 11763979Abstract: A coil component 1 includes a base body 10 having a mounting surface 10b, a coil conductor 25 wound around a coil axis X through a plurality of layers in the base body 10, where the coil conductor 25 has a first end 25a and a second end 25b, external electrodes 21 and 22 provided on the mounting surface 10b, a lead-out conductor 26 connecting the first end 25a of the coil conductor 25 and the external electrode 21, and a lead-out conductor 27 connecting the second end 25b of the coil conductor 25 and the external electrode 22. At least a portion of the lead-out conductor 26 is positioned within a first region R1 inside the coil conductor 25 in a radial direction when seen in a direction of the coil axis X.Type: GrantFiled: June 25, 2020Date of Patent: September 19, 2023Assignee: TAIYO YUDEN CO., LTD.Inventors: Takayuki Arai, Naoya Terauchi, Tomoo Kashiwa
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Patent number: 11761795Abstract: A measurement device for measuring an angular position of a movable body that is rotatable about an axis of rotation relative to a stationary body, the device comprising, facing each other, a movable portion with a first printed circuit having first tracks formed thereon defining a plurality of target patterns and a stationary portion with a second printed circuit having second tracks formed thereon defining a plurality of measurement patterns that are angularly distributed in regular manner. The target patterns are angularly distributed in irregular manner, the number of target patterns is not less than two, and the product of the number of target patterns multiplied by the number of measurement patterns is not less than twelve.Type: GrantFiled: September 3, 2020Date of Patent: September 19, 2023Assignees: SAFRAN LANDING SYSTEMS, SAFRAN ELECTRONICS & DEFENSEInventors: Didier Levavasseur, Thierry Bickard
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Patent number: 11763980Abstract: A coil component in which a crack is rarely generated around a coil conductor layer. The coil component includes an element body; and a coil provided in the element body and spirally wound along a first direction. The coil has a plurality of coil conductor layers stacked along the first direction. The element body has a vicinity area located in a vicinity of each of the coil conductor layers, and has a non-vicinity area other than the vicinity area. The vicinity area has a pore area rate less than a pore area rate in at least a part of the non-vicinity area.Type: GrantFiled: August 4, 2020Date of Patent: September 19, 2023Assignee: Murata Manufacturing Co., Ltd.Inventor: Takashi Sakai
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Patent number: 11763978Abstract: A coil component may include a body having one surface and the other surface facing each other; a wound coil embedded in the body; a first lead frame and a second lead frame, embedded in the body and each having one surface exposed to the one surface of the body to be spaced apart from each other; and a connection portion connecting at least one of the first and second lead frames and at least one end portion of the wound coil.Type: GrantFiled: August 5, 2019Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTDInventors: Ju Hwan Yang, Tae Jun Choi, Byung Soo Kang, Woo Chui Shin, Byeong Cheol Moon
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Patent number: 11761034Abstract: A method for real-time quantitative detection of single-type, target nucleic acid sequences amplified using a PCR in a microwell, comprising introducing in the microwell a sample comprising target nucleic acid sequences, magnetic primers, and labelling probes; performing an amplification cycle to form labelled amplicons; attracting the magnetic primers to a surface through a magnetic field to form a layer including labelled amplification products and free magnetic primers; and detecting the labelled amplification products in the layer with a surface-specific reading method.Type: GrantFiled: January 26, 2021Date of Patent: September 19, 2023Assignee: STMICROELECTRONICS S.r.l.Inventors: Lucio Renna, Clelia Carmen Galati, Natalia Maria Rita Spinella
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Patent number: 11756718Abstract: A transformer respectively includes a first isolation barrier, a first inductive element, a second isolation barrier, and a second inductive element. The first isolation barrier and second isolation barrier each comprise multiple isolation layers. The transformer also includes magnetic material including a top magnetic portion disposed above the first isolation barrier. The transformer also includes a bottom magnetic portion disposed below the second inductive element; The transformer further includes an intermediary magnetic portion extending from the top magnetic portion to the bottom magnetic portion via a through-hole within the first isolation barrier, first inductive element, second isolation barrier, and second inductive element. The transformer yet further includes at least one lateral magnetic portion extending from the top magnetic portion to the bottom magnetic portion.Type: GrantFiled: December 30, 2018Date of Patent: September 12, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Zhemin Zhang, Roberto Giampiero Massolini, Joyce Marie Mullenix
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Patent number: 11756723Abstract: A multilayer coil component includes a component element assembly in which an inner conductor is disposed and an outer electrode disposed on the surface of the component element assembly. The component element assembly includes a first dielectric glass layer in which the inner conductor is embedded and second dielectric glass layers that are thin layers disposed on respective principal surfaces of the first dielectric glass layer. The primary component of each of the first dielectric glass layer and the second dielectric glass layers is formed of a glass material and has a filler component containing at least quartz, and the second dielectric glass layers have a lower quartz content than the first dielectric glass layer.Type: GrantFiled: March 10, 2020Date of Patent: September 12, 2023Assignee: Murata Manufacturing Co., Ltd.Inventor: Naoyuki Murakami
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Patent number: 11756985Abstract: An exemplary embodiment of the present invention provides a planar inductor including a substrate, a first magnetic layer, a conductive coil, and a second magnetic layer. The first magnetic layer can be disposed on at least a portion of the substrate. The conductive coil can be disposed on a first portion of the first magnetic layer. The second magnetic layer can be disposed on a second portion of the first magnetic layer and on at least a portion of the conductive coil.Type: GrantFiled: November 16, 2017Date of Patent: September 12, 2023Assignees: Georgia Tech Research Corporation, NITTO DENKO CORPORATIONInventors: Markondeya Raj Pulugurtha, Yoshihiro Furukawa, Himani Sharma, Keiji Takemura, Rao R. Tummala, Teng Sun
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Patent number: 11756720Abstract: A coil component includes a coil portion embedded in a body, first and second lead-out portions connection to both end of the coil portion, respectively, and exposed from one surface of the body to be spaced apart from each other, and a support substrate supporting the coil portion and the first and second lead-out portions, and exposed from the one surface of the body. Each of the first and second lead-out portions includes a lead-out pattern and an auxiliary lead-out pattern disposed on one surface and the other surface of the support substrate, opposing each other, and exposed from the one surface of the body, respectively, and a connection via penetrating through the support substrate to connect the lead-out pattern and the auxiliary lead-out pattern to each other, and exposed from the one surface of the body.Type: GrantFiled: March 30, 2020Date of Patent: September 12, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Min Lee, Ju Hwan Yang, Yoon Mi Cha
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Patent number: 11749458Abstract: A ceramic electronic device includes a multilayer chip including a multilayer structure, a first cover layer and a second cover layer and having a parallelepiped shape, the multilayer structure having a structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and are alternately exposed to a first end face and a second end face of the multilayer chip, the first end face being opposite to the second end face, the first cover layer being provided on an upper face of the multilayer structure in a stacking direction, the second cover layer being provided on a lower face of the multilayer structure, a first external electrode formed on the first end face, and a second external electrode formed on the second end face. In this structure, a relationship of 0.20?R1/?{square root over (?)}(P12?C12)?0.80 is satisfied.Type: GrantFiled: January 26, 2022Date of Patent: September 5, 2023Assignee: TAIYO YUDEN CO., LTD.Inventor: Mikio Tahara
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Patent number: 11751330Abstract: A dielectric substrate may support conductive traces that form windings for a least one pole of a planar armature of an axial flux machine. At least a portion of the dielectric substrate, which is adapted to be positioned within an annular active area of the axial flux machine, may include a soft magnetic material. Such a planar armature may be produced, for example, by forming the conductive traces on the dielectric substrate, and filling interstitial gaps between the conductive traces with at least one epoxy material in which the soft magnetic material is embedded.Type: GrantFiled: July 27, 2022Date of Patent: September 5, 2023Assignee: E-Circuit Motors, Inc.Inventors: George Harder Milheim, Steven Robert Shaw, Ryan Terrence Duffy, Edward Charles Carignan
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Patent number: 11747951Abstract: The present disclosure relates to an electromagnetic induction film and a manufacturing method thereof, an electromagnetic induction panel and a manufacturing method thereof, and a touch display device. The method for manufacturing the electromagnetic induction film may include: arranging a plurality of first conductors in parallel along and spaced apart along a first direction on a substrate; arranging an insulating layer on the plurality of first conductors; arranging a plurality of second conductors in parallel and spaced apart along the first direction on the insulating layer; and electrically connecting head end areas of the first conductors to head end areas of the second conductors and electrically connecting tail end areas of the first conductors to tail end areas of the second conductors to form an electromagnetic induction coil spirally surrounding the insulating layer.Type: GrantFiled: August 31, 2020Date of Patent: September 5, 2023Assignee: SHENZHEN HITEVISION TECHNOLOGY CO., LTD.Inventor: Yunshen Chen
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Patent number: 11750247Abstract: An inductor circuit includes a receiver inductive circuit, a transmitter inductive circuit, and an antenna inductive circuit which are implemented on a single chip die; the receiver inductive circuit is disposed on a specific ring of a specific plane to form a ring shape; the transmitter inductive circuit and the antenna inductive circuit are disposed inside the specific ring and surrounded by the specific ring of the specific plane; and, a circuit area, occupied by the transmitter inductive circuit, inside the specific ring and on the specific plane, is larger than a circuit area occupied by the receiver inductive circuit and by the antenna inductive circuit.Type: GrantFiled: January 26, 2022Date of Patent: September 5, 2023Assignee: PixArt Imaging Inc.Inventors: Mu-Tsung Lai, Tung-Ying Chiang, Chien-An Hou, Chia-Pei Chen
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Patent number: 11747222Abstract: A method for manufacturing a deformation detection sensor that includes: preparing a plurality of thermoplastic resin layers, at least one of which has a main surface on which a conductive member is formed; laminating the plurality of thermoplastic resin layers; after lamination, integrally forming the plurality of thermoplastic resin layers by hot pressing to obtain a laminated body configured so that a transmission line is formed from a first portion of the conductive member and the laminated body; and attaching a piezoelectric film to the laminated body so that a piezoelectric element is formed from a second portion of the conductive member, the laminated body, and the piezoelectric film.Type: GrantFiled: December 21, 2022Date of Patent: September 5, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takashi Kihara, Jun Endo, Masamichi Ando
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Patent number: 11749444Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings of the core substrate, and through-hole conductors formed through the core substrate such that each of the through-hole conductors includes a metal film. The magnetic resin has through holes formed through the magnetic resin such that the through-hole conductors include a group of through-hole conductors formed in the through holes formed through the magnetic resin, and the magnetic resin includes an iron oxide filler in an amount of 60% by weight or more.Type: GrantFiled: April 14, 2020Date of Patent: September 5, 2023Assignee: IBIDEN CO., LTD.Inventors: Hiroaki Kodama, Kazuro Nishiwaki, Kazuhiko Kuranobu, Hiroaki Uno
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Patent number: 11742132Abstract: An electronic component includes an insulating layer that has a principal surface, a passive device that includes a low voltage pattern that is formed in the insulating layer and a high voltage pattern that is formed in the insulating layer such as to oppose the low voltage pattern in a normal direction to the principal surface and to which a voltage exceeding a voltage to be applied to the low voltage pattern is to be applied, and a shield conductor layer that is formed in the insulating layer such as to be positioned in a periphery of the high voltage pattern in plan view, shields an electric field formed between the low voltage pattern and the high voltage pattern, and suppresses electric field concentration with respect to the high voltage pattern.Type: GrantFiled: December 14, 2022Date of Patent: August 29, 2023Assignee: ROHM CO., LTD.Inventor: Kosei Osada
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Patent number: 11742126Abstract: An inductor includes a magnetic base body including soft magnetic metal particles containing iron, first and second external electrodes provided on the magnetic base body, and an internal conductor provided in the magnetic base body, with one end thereof electrically connected to the first external electrode and the other end thereof electrically connected to the second external electrode, the internal conductor extending linearly from the first external electrode to the second external electrode in plan view. The magnetic base body is configured so that a peak intensity ratio is 2 or more between a peak intensity of a first peak and a peak intensity of a second peak in a Raman spectrum obtained by using an excitation laser with a wavelength of 488 nm. The first peak is around a wave number of 712 cm?1, and the second peak is around a wave number of 1320 cm?1.Type: GrantFiled: March 26, 2020Date of Patent: August 29, 2023Assignee: TAIYO YUDEN CO., LTD.Inventors: Shunta Ishiwata, Shinsuke Takeoka
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Patent number: 11742131Abstract: A coil component includes a body, a coil portion disposed inside the body, a first external electrode and a second external electrode spaced apart from each other on one surface of the body and connected to the coil portion, a first insulating layer and a second insulating layer respectively connected to the one surface of the body, respectively disposed to side surfaces of the body to extend upwardly of the one surface of the body, and a third insulating layer and a fourth insulating layer respectively connected to the one surface of the body, respectively disposed on end surfaces of the body and each extending upwardly of the one surface of the body. A portion of each of the first and second external electrodes, exposed from the first to fourth insulating layers, is spaced apart from each of a plurality of edges of the one surface of the body.Type: GrantFiled: November 12, 2020Date of Patent: August 29, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Soo Kang, Yong Hui Li, Seung Mo Lim, Byeong Cheol Moon
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Patent number: 11742138Abstract: A method of manufacturing a wireless power reception apparatus includes: forming a lower tray that includes a thermally conductive material and accommodates and fix a coil winding; arranging a coil winding on the lower tray; forming a magnetic field shielding plate so as to accommodate and fix a plurality of magnetic tiles at predetermined intervals; forming a coupled member of a magnetic tiles-magnetic field shielding plate by arranging the plurality of magnetic tiles at the predetermined intervals on the magnetic field shielding plate; forming a thermally conductive polymer molding layer by applying a thermally conductive polymer molding solution to fill spaces between the coil winding and the coupled member of a magnetic tiles-magnetic field shielding plate and bonding the plurality of magnetic tiles and the coil winding such that the plurality of magnetic tiles are positioned over the coil winding; and curing the thermally conductive polymer molding layer.Type: GrantFiled: October 27, 2020Date of Patent: August 29, 2023Assignee: THE GAUSS INC.Inventor: Bong Gi You
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Patent number: 11742133Abstract: Provided is an electronic component including a secondary side coil including a plurality of coil parts, in which each of the coil parts includes: a plate-like base part; a leg part formed on the base part; and a pin part formed at a tip of the leg part.Type: GrantFiled: April 10, 2017Date of Patent: August 29, 2023Assignee: SONY CORPORATIONInventor: Hirofumi Nakazawa
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Patent number: 11735347Abstract: A pair of terminal electrodes 4 and 5 have electrode parts 4a and 5a and electrode parts 4b and 5b when viewed from a stacking direction, respectively. A plurality of connection conductors are disposed at positions not overlapping a plurality of coil conductors when viewed from the stacking direction. At least two of the plurality of connection conductors are disposed in a first region A1 or a second region A2 between the terminal electrodes 4 and 5 and an outer edge 9a of a coil 9 when viewed from the stacking direction. The first region A1 and the second region A2 overlap the electrode parts 4a and 5a when viewed from the facing direction of a pair of end surfaces 2a and 2b and overlap the electrode parts 4b and 5b when viewed from the facing direction of a pair of main surfaces 2c and 2d.Type: GrantFiled: June 15, 2020Date of Patent: August 22, 2023Assignee: TDK CORPORATIONInventors: Yuto Shiga, Hajime Kato, Kazuya Tobita, Youichi Kazuta, Noriaki Hamachi, Makoto Yoshino
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Patent number: 11735346Abstract: A multilayer substrate includes at least three coil conductors respectively patterned on different surfaces of a first main surface of a laminated body, a second main surface of the laminated body, and laminated interfaces of insulating base materials and that are arranged in a lamination direction. The at least three coil conductors include first and second coil conductors, and are connected in series between first and second external electrodes. A surface at which another coil conductor is provided is not interposed between two surfaces at which the first and second coil conductors are provided, respectively. Further, the first and second coil conductors are directly connected to the first and second external electrodes, respectively, without another coil conductor interposed therebetween.Type: GrantFiled: August 30, 2018Date of Patent: August 22, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Shingo Ito, Kuniaki Yosui
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Patent number: 11735355Abstract: An inductor includes a wire having a width W, and a first electrode and a second electrode continuous to each of both ends of the wire. The wire, the first electrode, and the second electrode are present on the same plane. The plane area S1 of the first electrode and the plane area S2 of the second electrode are a square value (W2) or more of the width W. An area in which the wire is disposed is positioned between the first electrode and the second electrode. The area has a length X in a longitudinal direction equal to a length L between the first electrode and the second electrode along a facing direction of the first electrode and the second electrode, and a length Y in a short-length direction in a direction perpendicular to the longitudinal direction. The length X in the longitudinal direction is 1.5 times or more of the length Y in the short-length direction.Type: GrantFiled: September 5, 2018Date of Patent: August 22, 2023Assignee: NITTO DENKO CORPORATIONInventor: Yoshihiro Furukawa
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Patent number: 11735352Abstract: According to one configuration, an inductor device comprises core material and at least a first electrically conductive path. The core material is fabricated from magnetically permeable material. The first electrically conductive path extends axially through the core material from a proximal end of the inductor device to a distal end of the inductor device. The core material is operable to confine first magnetic flux generated from first current flowing through the first electrically conductive path. The inductor device further includes a gap in the core material. The gap (gas or solid material) has a different magnetic permeability than the core material. Inclusion of the gap in the core material provides a way to tune an inductance of the inductor device and increase a magnetic saturation level of the inductor device. The core material includes any number of electrically conductive paths and corresponding gaps.Type: GrantFiled: July 10, 2020Date of Patent: August 22, 2023Assignee: Infineon Technologies Austria AGInventors: Danny Clavette, Gerald Deboy, Roberto Rizzolatti, Otto Wiedenbauer, Yong Zhou
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Patent number: 11735350Abstract: An inductor includes a body including a coil and a magnetic portion, and having two facing principal surfaces and side surfaces adjacent to the two principal surfaces. The coil includes a winding portion formed from a conductor and a pair of extended portions extended from the winding portion. The magnetic portion includes magnetic powder and contains the coil. The winding portion includes a first meandering portion and a second meandering portion each including straight portions continuously formed so as to extend substantially circularly from an outer side to an inner side of the body when the winding portion is seen through the principal surfaces of the body from the principal surfaces. The first and second meandering portions are continuously formed on the inner side of the body. The straight portions constituting the first meandering portion and the straight portions constituting the second meandering portion are disposed apart from each other.Type: GrantFiled: October 28, 2020Date of Patent: August 22, 2023Assignee: Murata Manufacturing Co., Ltd.Inventor: Jianxin Sheng
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Patent number: 11735518Abstract: A method of making a semiconductor device, includes: forming a first molding layer on a substrate; forming a first plurality of vias in the first molding layer; forming a first conductive line over the first molding layer, wherein the first conductive line is laterally disposed over the first molding layer and a first end of the conductive line aligns with and is electrically coupled to a first via of the first plurality of vias; forming a second molding layer above the first molding layer; and forming a second plurality of vias in the second molding layer, wherein a second via of the second plurality of vias aligns with and is electrically coupled to a second end of the conductive line, and wherein the second plurality of vias, the conductive line, and the first plurality of vias are electrically coupled to one another.Type: GrantFiled: November 1, 2019Date of Patent: August 22, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shih-Wei Liang, Hung-Yi Kuo, Hao-Yi Tsai, Ming-Hung Tseng, Hsien-Ming Tu
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Patent number: 11728089Abstract: A coil component includes a body; a wound coil disposed in the body, and having a plurality of turns and first and second lead-out portions exposed to the surfaces of the body; a noise removing portion spaced apart from the wound coil, and including a pattern portion having a first end portion and a second end portion spaced apart from each other and forming an open loop, and a third lead-out portion connected to the pattern portion and exposed to one surface of the body; an insulating layer disposed between the wound coil and the noise removing portion; and first to third external electrodes disposed on the surfaces of the body, spaced apart from one another, and connected to the first to third lead-out portions, respectively, wherein one of the plurality of turns of the wound coil has a line width greater than a thickness thereof.Type: GrantFiled: August 4, 2020Date of Patent: August 15, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jin Lee, Dong Hwan Lee, Chan Yoon, Sang Soo Park, Hye Mi Yoo, Hwi Dae Kim
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Patent number: 11728289Abstract: An electronic device includes a magnetic assembly with a multilevel lamination or metallization structure having a core layer, dielectric layers and conductive features formed in metal layers on or between the dielectric layers in respective planes of orthogonal first and second directions and stacked along an orthogonal third direction. The conductive features include first and second patterned conductive features forming first and second windings, first and second conductive capacitor plates, and first and second conductive field plates, in which the first conductive capacitor plate is between the first conductive field plate and the core layer along the third direction and the second conductive capacitor plate is between the second conductive field plate and the core layer along the third direction.Type: GrantFiled: May 26, 2021Date of Patent: August 15, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventor: Enis Tuncer
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Patent number: 11721474Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on at least one surface of the support substrate, and a lead-out pattern disposed on at least one surface of the support substrate and connected to the coil pattern. An encapsulant encapsulates at least portions of the support substrate, the coil pattern, and the lead-out pattern, and at least one protrusion protrudes from one side surface of the coil pattern. External electrodes are disposed externally on the encapsulant and connected to the lead-out pattern. The lead-out pattern is configured to extend in a thickness direction of the support substrate and to cover a side surface of the support substrate.Type: GrantFiled: October 3, 2019Date of Patent: August 8, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Hyuk Jung, Yu Jong Kim, Young Sun Kim, Dong Seob Lee
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Patent number: 11721473Abstract: A coil component includes a body, an insulating substrate embedded in the body and including an insulating resin, and first and second substrate protection layers covering respective surfaces of the insulating substrate to protect the insulating substrate and including a ceramic. A coil portion includes first and second coil patterns respectively disposed on the first and second substrate protection layers. Each of the first and second coil patterns includes a first conductive layer, disposed on the respective first or second substrate protection layer, and a second conductive layer disposed on the first conductive layer to expose a side surface of the first conductive layer.Type: GrantFiled: August 26, 2019Date of Patent: August 8, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Joung Gul Ryu, Ji Man Ryu, Byeong Cheol Moon
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Patent number: 11721475Abstract: A coil component includes a body; a support substrate embedded in the body; and a coil portion disposed on the support substrate and embedded in the body, and including a lead-out pattern disposed on one surface of the support substrate, and an auxiliary lead-out pattern disposed on the other surface of the support substrate and corresponding to the lead-out pattern. The auxiliary lead-out pattern includes an external surface exposed from a surface of the body and an internal surface opposing the external surface, and the body includes an anchor portion disposed inside the auxiliary lead-out pattern.Type: GrantFiled: October 30, 2019Date of Patent: August 8, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Joung Gul Ryu, Ju Hwan Yang
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Patent number: 11721477Abstract: A shielded transformer winding assembly includes a first winding formed on a circuit board. The circuit board includes at least two first board alignment elements formed therein and a casing including an inner portion and one or more tabs that extend outwardly from the inner portion the tabs arranged to form a notch between them. The assembly also includes a lower winding spacer disposed in one of the tabs that includes a stepped mounting member including first and second mounting member portions. The second mounting member portion has a smaller outer perimeter than and extends from the first mounting member portion. The first winding is disposed within the casing and on the lower winding spacer such that the second mounting member portion extends through one of the at least two first board alignment elements and wherein the first printed circuit board is supported by the first mounting member portion.Type: GrantFiled: April 23, 2020Date of Patent: August 8, 2023Assignee: RAYTHEON COMPANYInventor: Lev Volfson
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Patent number: 11715722Abstract: Fabrication of a bondwire inductor between connection pads of a semiconductor package using a wire bonding process is disclosed herein. To that end, the bondwire inductor is fabricated by extending a bondwire connecting two connection pads of the semiconductor package around a dielectric structure, e.g., a dielectric post or posts, disposed between the connection pads a defined amount. In so doing, the bondwire inductor adds inductance between the connection pads, where the added inductance is defined by factors which at least include the amount the bondwire extends around the dielectric structure. Such additional inductance may be particularly beneficial for certain semiconductor devices and/or circuits, e.g., monolithic microwave integrated circuits (MMICs) to control or supplement impedance matching, harmonic termination, matching biasing, etc.Type: GrantFiled: April 30, 2020Date of Patent: August 1, 2023Assignee: WOLFSPEED, INC.Inventors: Kenneth P. Brewer, Warren Brakensiek
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Patent number: 11715978Abstract: A coil arrangement for the wireless electromagnetic transmission of energy includes a carrier which forms a main direction of extent. On the carrier element, are attached in succession in the main direction of extent and connected to one another. The carrier element comprises a ferrite material and at least one desired parting location which is designed as a perforation and/or notch arrangement. The coil arrangement can be easily adapted in a flexible way to a rotatable component and attached thereto. This makes easy wireless electromagnetic transmission of energy possible.Type: GrantFiled: July 28, 2020Date of Patent: August 1, 2023Assignee: Würth Elektronik eiSos GmbH & Co. KGInventors: Cem Som, Christopher Schaffelhofer
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Patent number: 11710593Abstract: A multilayer coil component includes an element body including a plurality of metal magnetic particles, and a plurality of coil conductors. The plurality of coil conductors is disposed in the element body. The plurality of coil conductors is separated from each other in a predetermined direction and electrically connected to each other. The plurality of coil conductors includes one pair of side surfaces opposing each other in the predetermined direction. Surface roughness of the one pair of side surfaces is less than 40% of an average particle size of the plurality of metal magnetic particles.Type: GrantFiled: March 12, 2020Date of Patent: July 25, 2023Assignee: TDK CORPORATIONInventors: Shinichi Sato, Takahiro Sato, Yusuke Nagai, Mitsuharu Koike, Kazuhiro Miura, Seiichi Nakagawa, Shinichi Kondo, Takashi Suzuki
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Patent number: 11710596Abstract: A coil device includes a conductive wire forming a coil, a coil base having a groove for accommodating the conductive wire, and a stopper being separate from the coil base and attached to the coil base to cover the conductive wire. The stopper includes a base portion attached to the coil base at a position adjacent the groove, and a distal end portion integrated with the base portion to cover the conductive wire. The base portion of the stopper is rotatable. Alternatively, the distal end portion of the stopper is deformable.Type: GrantFiled: September 21, 2016Date of Patent: July 25, 2023Assignee: IHI CORPORATIONInventor: Kenji Nishimura
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Patent number: 11710996Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate such that the coils are positioned substantially in a row between the first end and second end of the flexible substrate. The coils are formed such that the number of coils is K and that the coils include the first coil positioned close to the first end and the K-th coil positioned to form a predetermined distance between the K-th coil and the second end, where K is an integer equal to or greater than 2.Type: GrantFiled: August 24, 2021Date of Patent: July 25, 2023Assignee: IBIDEN CO., LTD.Inventors: Haruhiko Morita, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno