Abstract: Electronic components and an electronic device comprising one or more of the electronic components, and a method of manufacturing the electronic components and an electronic device comprising one or more of the electronic components. As non-limiting examples, various aspects of this disclosure provide vertical interconnect components and various other vertical electronic components, and a method of manufacturing thereof, and an electronic device comprising one or more of the vertical interconnect components and various other vertical electronic components, and a method of manufacturing thereof.

Abstract: A transformer device includes first, second, and third windings, located in an insulating substrate by conductive vias joined together by conductive traces. Positions of the conductive vias are arranged so as to optimize the isolation properties of the transformer, and to improve the coupling of the transformer by increasing the leakage inductance and reducing the distributed capacitance. The transformer device is compact and is weakly coupled. The weak coupling between the windings reduces the likelihood of the transformer malfunctioning, particularly when used in a self-resonant converter circuit.

Abstract: A coil component that can be made thinner while ensuring sufficient magnetic characteristics includes a magnetic part, a conductor part, and multiple insulator parts. The magnetic part is constituted by magnetic alloy grains. The conductor part has multiple winding parts and is wound around one axis inside the magnetic part. The multiple insulator parts are each placed between the multiple winding parts, each having a winding shape that includes two joining surfaces that are respectively joined to two winding parts facing each other at least partially in the direction of the one axis, and are each constituted by electrically insulating grains.

Abstract: A planar transformer layer is provided. The planar transformer comprises distinct electrical connections and thermal connections. An assembly of layers for a planar transformer is also provided. An electronic energy conversion equipment item for a satellite provided with at least one planar transformer is also provided.

Abstract: A multilayer coil component includes magnetic layers and inner electrode layers that are alternately laminated on one another. The inner electrode layers are electrically connected to each other to constitute a helical coil conductor. The coil conductor is buried in an element body composed of the magnetic layers. Outer electrodes having folded portions are disposed on both end portions of the element body. The inner electrode layers of the coil conductor have protrusions protruding from both outer edges extending in a length direction of the element body.

Abstract: A taping electronic component array includes a tape including a long carrier tape, in which recesses are provided along a longitudinal direction, and a cover tape that is provided on the carrier tape to cover the recesses; and a first coil component and a second coil component, which are disposed in each of the recesses. The first coil component includes a first core and a first coil in which a first wire and a second wire are wound around the first core in a predetermined winding direction while twisted in a predetermined twist direction, and the second coil component includes a second core and a second coil in which the first wire and the second wire are wound around the second core in the predetermined winding direction while twisted in an opposite direction to the predetermined twist direction. Thus, degradation of manufacturing capacity is prevented.

Abstract: A transformer includes a magnetic core having an inner space, a coil unit disposed within the magnetic core and including a primary coil and a secondary coil in which layers formed with conductive patterns are laminated, and a base configured to receive the magnetic core and the coil unit. A portion of the base is inserted into and disposed in the coil unit to be interposed between an output terminal coupled to the secondary coil and the magnetic core.

Abstract: A microelectromechanical light emitter component comprises an emitter layer structure of the microelectromechanical light emitter component and an inductive structure of the microelectromechanical light emitter component. The inductive structure of the microelectromechanical light emitter component is configured to generate current in the emitter layer structure by electromagnetic induction, such that the emitter layer structure emits light. The emitter layer structure is electrically insulated from the inductive structure.

Abstract: An integrated inductor includes a first coil, a second coil, a third coil and a fourth coil. The first coil is disposed on a first layer of an integrated circuit structure. The second coil is disposed on the first layer and adjacent to the first coil, in which the first coil and the second coil have same number of turns. The third coil is disposed on a second layer of the integrated circuit structure and above the first coil. The fourth coil is disposed on the second layer and above the second coil, in which the third coil and the fourth coil have same number of turns. The first coil is coupled to and interlaced with the fourth coil disposed on the second layer. The second coil is coupled to and interlaced with the third coil disposed on the second layer.

Abstract: An electronic component having a main body includes a plurality of insulator layers laminated in a lamination direction. A primary coil is disposed in the main body and includes one or more primary coil conductor layers. A secondary coil is disposed in the main body and includes one or more secondary coil conductor layers. A tertiary coil is disposed in the main body and includes one or more tertiary coil conductor layers. The plurality of insulator layers includes a first insulator layer including a portion interposed between the primary coil conductor layer and the secondary coil conductor layer, a second insulator layer including a portion interposed between the secondary coil conductor layer and the tertiary coil conductor layer, and a third insulator layer including a portion interposed between the tertiary coil conductor layer and the primary coil conductor layer.

Abstract: The cold pressure welding apparatus includes a first holding part capable of sandwiching a first flat conductor, a second holding part disposed opposite to the first holding part and capable of sandwiching a second flat conductor, and a drive part for moving the first holding part and the second holding part. The drive part can move the first holding part and the second holding part between a first direction separated position and a close position along a first direction. The drive part can move the first holding part and the second holding part between a second direction separated position and a sandwiching position along a second direction.

Abstract: A coil component includes a base body, and a coil disposed inside the base body and wound into a spiral shape. The coil includes a plurality of coil conductor portions and a plurality of lead-out conductor portions, both the conductor portions being laminated in a first direction. The lead-out conductor portions overlap, when viewed from the first direction, side gap portions given by regions of the base body on the outer side of the coil conductor portions in a radial direction. The base body includes a cavity between two among the coil conductor portions adjacent to each other in the first direction. The cavity includes a first cavity overlapping first one among the lead-out conductor portions in the first direction. The first cavity is present at a position away two or more pitches in the first direction from the first lead-out conductor portion overlapping the first cavity.

Abstract: A thin film type inductor includes first, second and third exposed portions exposed to a first end surface of a body and fourth, fifth and sixth exposed portions exposed to a second end surface of the body opposing the first end surface of the body among external surfaces of the body. The first, second and third exposed portions are formed to be exposed symmetrically to the fourth, fifth and sixth exposed portions opposing the first, second and third exposed portions, respectively.

Abstract: In order to easily sort failures due to short circuit between wires in an inductor, a semiconductor device includes a plurality of inductors (first inductor, second inductor) formed in a plurality of wiring layers. In each of the wiring layers, the metal layer of the first inductor and the metal layer of the second inductor respectively extend around the peripheral region from the inner periphery to the outer periphery in the same direction. The metal layer of the first inductor and the metal layer of the second inductor are arranged so as to be adjacent to each other.

Abstract: An integrated circuit includes a fluxgate magnetometer. The magnetic core of the fluxgate magnetometer is encapsulated with a layer of encapsulant of a nonmagnetic metal or a nonmagnetic alloy. The layer of encapsulate provides stress relaxation between the magnetic core material and the surrounding dielectric. A method for forming an integrated circuit has the magnetic core of a fluxgate magnetometer encapsulated with a layer of a nonmagnetic metal or nonmagnetic alloy to eliminate delamination and to substantially reduce cracking of the dielectric that surrounds the magnetic core.

Abstract: In a multilayer body including a plurality of laminated insulating material layers on which a plurality of coil patterns are provided, the plurality of coil patterns are connected to each other to form a coil having a coil axis parallel to a lamination direction. A pair of outer electrodes connected to the coil are disposed at both ends in the lamination direction. When a direction orthogonal to the lamination direction is defined in an up-down direction, the coil patterns are disposed within the multilayer body so as to be shifted to an upper side. At least a portion of a vertical projection image of the coil on a virtual plane orthogonal to the lamination direction does not overlap a vertical projection image of the outer electrodes on the virtual plane.

Abstract: An embedded magnetic inductor coil is at least partially exposed in a recess that seats an embedded multi-chip interconnect bridge die on the coil. The embedded multi-chip interconnect bridge die provides a communications bridge between a dominant semiconductive device and a first semiconductive device.

Abstract: A power inductor includes: a body including a magnetic material; an internal coil disposed in the body and including a plurality of coil patterns; and a sensing coil disposed on the body and facing the internal coil.

Abstract: An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 ?m, the wire pitch of the spiral wires is equal to or smaller than 10 ?m, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 ?m.

Abstract: An electronic component includes a body, a first inductor, and a low expansion portion. The body includes a laminated body including a plurality of insulating layers laminated in a lamination direction. The insulating layers contain a first resin as a material. The first inductor includes a first inductor conductor layer that adjoins one of the insulating layers. The low expansion portion has a coefficient of linear expansion lower than a coefficient of linear expansion of the plurality of insulating layers. The low expansion portion contains a second resin as a material. At least part of the low expansion portion is embedded in the laminated body. The second resin has a coefficient of linear expansion that is lower than a coefficient of linear expansion of the first resin.

Abstract: An integrated circuit structure includes a substrate, an integrated inductor, multiple components, multiple metal interconnections, a first shielding structure, and a second shielding structure. The integrated inductor is substantially formed in a first layer of the integrated circuit structure. The metal interconnections are coupled to the integrated inductor and the components. The first shielding structure is formed between the first layer and the substrate and is substantially beneath the integrated inductor. The second shielding structure is formed between the first layer and the substrate, has substantially the same distribution as the metal interconnections, and is substantially beneath the metal interconnections. The first shielding structure and the second shielding structure are equipotential.

Abstract: The present disclosure discloses an inductor structure mounted on a PCB board and a voltage regulator module having the same. The inductor structure includes an inductor core and an inductor winding. The PCB board is provided with at least one hollow part, and the inductor structure further comprises a plurality of copper strips used as the inductor windings of the inductor structure. The copper strips are spaced apart in the hollow part so as to form a plurality of through holes, and the leg of the inductor core is correspondingly inserted into the through hole at the corresponding position of the hollow part.

Abstract: A thin film-type inductor includes a body having a coil, and a first external electrode and a second external electrode. The first and second external electrodes are each disposed on an external surface of the body. The coil includes a coil body and a via portion. The via portion is directly connected to the first external electrode. The coil body includes a base conductor layer in a lower portion and a plating layer in an upper portion.

Abstract: An inductance communication coil, including a conductor having at least one conductive turn, wherein a width of the conductor is wider at a first location relative to that at a second location. The conductor can be made out of metal. In some embodiments, the first location and the second location are on the same turn. In some embodiments, the conductor includes a plurality of turns, wherein the first location is at a first turn and the second location is at a second turn.

Abstract: In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.

Abstract: Embodiments describe a wireless charging device including: a housing having a charging surface, the housing including first and second walls defining an interior cavity; a transmitter coil arrangement disposed within the interior cavity; a plurality of cowlings for confining the plurality of planar transmitter coils in their respective positions; an interconnection structure positioned within the interior cavity between the transmitter coil arrangement and the second wall, the interconnection structure including a plurality of packaged electrical components mounted onto the interconnection structure; and a plurality of standoffs coupled to the interconnection structure and configured to electrically couple the transmitter coil arrangement to the plurality of packaged electrical components.

Abstract: An inductive component and a method for producing an inductive component are disclosed. In an embodiment, the inductive component includes a first core part having wound first and second wires and a second core part arranged on the first core part. In various embodiments the inductive component has a low mode conversion, a low inductance in differential-mode operation, a high inductance for common-mode signals, a constant characteristic impedance, a low capacitive coupling of the wires, and/or a low leakage inductance.

Abstract: A coil, such as, by way of example, an inductance communication coil, that includes a conductor including a first portion extending in a first level and a second portion extending in a second level, wherein the conductor includes a third portion located on a different level than that of the second portion, wherein an electrical path of the conductor is such that the second portion is located between the first portion and the third portion.

Abstract: A coil component includes a body part including an internal coil including one end and another end; a first external electrode connected to the one end of the internal coil; a second external electrode connected to the another end of the internal coil; and a third external electrode connected to a first point between the one end of the internal coil and the another end of the internal coil.

Abstract: An integrated magnetic inductor is provided with an inductor coil, magnetic film, and a substrate. The magnetic film can be placed between the neighboring inductor coils, and the thickness of the magnetic film is greater than the coil thickness. In addition, the magnetic film includes exchange-coupled magnetic materials. The exchange-coupled magnetic materials provide improved permeability and fFMR at the frequency of interest for the integrated magnetic inductor.

Abstract: Provided is a coil component including a coil portion that has at least one layer of ring-shaped planar coil portion including a coil-wound portion and an insulative resin layer which covers the periphery of the coil-wound portion within the same layer as the coil-wound portion, and an insulative resin layer overlapping the planar coil portion; and a covering portion that covers the coil portion. The insulative resin layer has a superimposing region overlapping a forming region of the planar coil portion and a protrusion region protruding from at least any one of an inner peripheral edge and an outer peripheral edge of the superimposing region, when viewed in the direction of overlapping the planar coil portion.

Abstract: An inductor component 1a includes a resin layer 3 and an inductor electrode 6. The inductor electrode 6 includes metal pins 7a to 7d that extend in the resin layer 3 with upper end surfaces thereof exposed from the upper surface 3a of the resin layer 3, and upper wiring plates 8a and 8b that are disposed on the upper surface 3a of the resin layer 3 and that connect upper end surfaces of the short metal pins 7a and 7c and upper end surfaces of the long metal pins 7b and 7d to each other. In this case, the inductor electrode 6 is formed of the metal pins 7a to 7d and wiring plates 8a to 8c that each have a specific electrical resistance lower than that of a conductive paste and plating, and the resistance of the entire inductor electrode 6 can be decreased.

Abstract: In a method of manufacturing an embedded magnetic component, a cavity is formed in an insulating substrate. One or more drops of adhesive are applied to the cavity and a magnetic core is inserted in the cavity. The cavity and the magnetic core are then covered with a first insulating layer. Through holes are formed through the first insulating layer and the insulating substrate, and plated up to form conductive vias. Metallic traces are added to exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and the conductive vias form the windings for an embedded magnetic component, such as a transformer or an inductor.

Abstract: Embodiments are generally directed to an integrated inductor with adjustable coupling. In some embodiments, an integrated inductor includes a first conductor and a second conductor; a first strip of magnetic material film below the first conductor and the second conductor; and a second strip of magnetic material film above the first conductor and the second conductor, wherein at least one of the first strip of magnetic material and the second strip of magnetic material includes a partial slot to partially separate a first section of the strip of magnetic material and a second section of the strip of magnetic material.

Abstract: An integrated circuit includes a fluxgate magnetometer. The magnetic core of the fluxgate magnetometer is encapsulated with a layer of encapsulant of a nonmagnetic metal or a nonmagnetic alloy. The layer of encapsulate provides stress relaxation between the magnetic core material and the surrounding dielectric. A method for forming an integrated circuit has the magnetic core of a fluxgate magnetometer encapsulated with a layer of a nonmagnetic metal or nonmagnetic alloy to eliminate delamination and to substantially reduce cracking of the dielectric that surrounds the magnetic core.

Abstract: A device includes a substrate, and a vertical inductor over the substrate. The vertical inductor includes a plurality of parts formed of metal, wherein each of the parts extends in one of a plurality of planes perpendicular to a major surface of the substrate. Metal lines interconnect neighboring ones of the plurality of parts of the vertical inductor.

Abstract: A method of manufacturing a laminated coil component is a method of manufacturing a laminated coil component provided with a laminate obtained by laminating a coil conductor forming a spiral coil and an insulator layer. The method of manufacturing a laminated coil component includes a step of providing a conductor pattern configured to become a coil conductor on a green sheet configured to become an insulator layer, and a step of laminating a plurality of green sheets provided with the conductor pattern. The conductor pattern includes a pair of first side surfaces opposed to each other in an orthogonal direction orthogonal to a laminating direction of the green sheet. At the step of laminating a plurality of green sheets, a depression is formed on at least one of the pair of first side surfaces.

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.

Abstract: A material-discerning sensing device includes an antenna, a capacitive proximity sensor, and a control circuit. The antenna includes multiple conductive loops and is configured to radiate a wireless signal. The antenna defines an interior region devoid of the conductive loops and an exterior region outside the conductive loops. The capacitive proximity sensor includes a conductive pattern provided within the interior region or within a projection of the interior region, as well as a conductive bar. The control circuit is configured to detect a change in a characteristic of an electrical signal from the capacitive sensor. The conductive pattern includes a longitudinal portion, a first plurality of parallel conductors extending away from the longitudinal portion in a first direction and orthogonal to the longitudinal portion, and a second plurality of parallel conductors extending away from the longitudinal portion in a second direction opposite the first direction.

Abstract: Disclosed herein is a coil component that includes a first planar spiral conductor; a second planar spiral conductor laminated on the first planar spiral conductor and wound in an opposite direction to the first planar spiral conductor; a first external terminal electrically connected to an outer peripheral end of the first planar spiral conductor; a second external terminal electrically connected to an outer peripheral end of the second planar spiral conductor; and a third external terminal electrically connected in common to inner peripheral ends of the first and second planar spiral conductors.

Abstract: A coil electronic component includes: a plurality of coil layers including, respectively, coil patterns and connection patterns disposed outside the coil patterns and forming a stacking structure; conductive vias connecting the coil patterns formed on different levels to each other; and external electrodes electrically connected to the plurality of coil layers. The coil patterns of at least two of the plurality of coil layers may have the same shape and be electrically connected to each other in parallel.

Abstract: A flexible inductor includes a coil substrate having a first spiral conductor formed in or on a bottom surface, a first magnetic sheet laminated on a top surface of the coil substrate, and a second magnetic sheet laminated on the bottom surface of the coil substrate. The flexible inductor includes a plurality of outer electrodes including a first outer electrode and a second outer electrode that are disposed in a peripheral portion of the bottom surface of the coil substrate, and cutout portions each formed in an area between the first spiral conductor and each of the outer electrodes so as to penetrate through the coil substrate. The first outer electrode is electrically connected to an outermost end portion of the first spiral conductor. The second outer electrode is electrically connected to an innermost end portion of the first spiral conductor.

Abstract: An inductor array component includes a body including a plurality of coil portions a coil included in the coil portions, external electrodes connected to both end portions of the coil and disposed on an outer surface of the body, a first blocking layer disposed between the coil portions, and a second blocking layer disposed within the first blocking layer.

Abstract: A coil component includes a body including a magnetic material, a support member disposed inside the body, and a coil pattern disposed on the support member inside the body. The coil pattern includes a first conductive layer, having a planar spiral shape, and a second conductive layer, having a line width greater than a thickness thereof, while covering the first conductive layer. When viewed from a surface of the body cut in thickness and width directions, a line width of each of outermost and innermost patterns of the first conductive layer is different from a line width of at least one internal pattern disposed between the outermost and innermost patterns.

Abstract: Provided are: a metal magnetic material capable of reliably establishing insulation while realizing high saturation magnetic flux density; and an electronic component using the metal magnetic material and having low loss and good DC superimposition characteristics. The metal magnetic material for forming a component body of the electronic component comprises a metal magnetic alloy powder consisting of iron and silicon or containing iron, silicon and chromium; and an additional element added to the metal magnetic alloy powder, wherein the additional element is more easily oxidizable in the equilibrium state of oxidation-reduction reaction than the elements contained in the metal magnetic alloy powder. The component body (11) is internally formed with a coil pattern consisting of a plurality of coil conductor patterns (12A to 12C).

Abstract: A power conversion apparatus including a circuit board, a transformer, a first circuit, a second circuit, a first main coil, and a second main coil is provided. The transformer, the first circuit, and the second circuit are disposed on the circuit board. The transformer has a first winding and a second winding. The first circuit is coupled to and provides an input voltage to the first winding. The first end of the second winding is configured to provide an output voltage. The second circuit is coupled to the second winding. The first main coil is coupled to the first circuit. The second main coil is printed on the circuit board and coupled between the second circuit and a first reference potential terminal. The first main coil and the second main coil are electrically insulated from each other and magnetically coupled to each other.

Abstract: An electronic component includes a magnetic body, and first and second internal coil parts embedded in the magnetic body spaced apart from each other and including coil conductors disposed on first and second surfaces of a support member. First and second spacer parts are disposed between the first and second internal coil parts in upper and lower portions of the magnetic body, respectively, with an interval therebetween.

Abstract: Systems and methods for shielding a metal detector head include placement of conductive shielding around the coils of the head to reduce the effects of capacitance variation between the coils and their surroundings.

Abstract: An inductor includes a body including a coil part therein. The coil part includes a first coil layer electrically connected to a first via; a second coil layer disposed below the first coil layer and electrically connected to a second via displaced laterally from that of the first via; and a via connection layer disposed between the first coil layer and the second coil layer and electrically connected to the first and second vias.

Abstract: A multilayer chip bead includes: a body including a coil portion and cover layers disposed on upper and lower surfaces of the coil portion; first and second external electrodes disposed on external surfaces of the body; and a coil disposed in the coil portion, including coil patterns having a spiral shape and lead patterns, and having both end portions connected to the first and second external electrodes, respectively, through the lead patterns. A width of the lead pattern is smaller than that of the coil pattern.