Abstract: A surface mounting type planar magnetic device comprised of upper ferrite magnetic film, lower ferrite magnetic film and a planar coil interposed therebetween. For applying surface mount technology, an opening is formed in the upper ferrite magnetic film above a coil terminal portion and then, an external electrode conductive with the coil terminal portion through the opening is formed on the upper ferrite magnetic film. Further, this surface mounting type planar magnetic device is of a thin structure and can be mounted on the surface of a printed board. Its power loss is small, its inductance is large, its frequency characteristic is excellent, the disparity of the characteristic is small and its reliability is excellent.

Abstract: A system (10) comprising a planar transformer winding (16) also comprises an electromagnetic interference (EMI) suppressor arrangement (24) for suppressing common mode EMI generated by the transformer winding. The suppressor arrangement comprises a planar winding (28) which, in use, is energized in anti-phase relative to the system winding. The arrangement being such that the winding arrangement (24) is exposed to the system winding via a dielectric medium, thereby to provide capacitive coupling between the suppressor winding arrangement and the system, to suppress EMI generated by the system winding.

Abstract: A process for the production of an inductor device comprising the steps of forming a green sheet to form an insulating layer; forming a plurality of conductive coil pattern units on the surface of the green sheet in order that a plurality of unit sections each including a single coil pattern unit are arranged on the surface of the green sheet and each two coil pattern units adjoining in the substantially perpendicular direction to the longitudinal direction of the unit sections are arranged centro-symmetrically with respect to a center point of a vertical boundary line of adjoining unit sections; stacking a plurality of green sheets formed with the plurality of coil pattern units arranged in centro-symmetry and connecting the upper and lower coil pattern units separated by the green sheets to form a coil shape; and sintering the stacked green sheets.

Abstract: The present invention relates to inductors with improved inductance and quality factor. In one embodiment, a magnetic thin film inductor is disclosed. In this embodiment, magnetic thin film inductor includes a plurality of elongated conducting regions and magnetic material. The plurality of elongated conducting regions are positioned parallel with each other and at a predetermined spaced distance apart from each other. The magnetic material encases the plurality of conducting regions, wherein when currents are applied to the conductors, current paths in each of the conductors cause the currents to generally flow in the same direction thereby enhancing mutual inductance.

Abstract: A current transformer, includes, a Rogowski coil for detecting an alternating current of a main circuit, and outputting a measure of the alternating current as an analog-voltage signal, includes, a printed circuit board, a sensor unit and an optic transmission path.

Abstract: An inductive element (10) of an integrated circuit, comprising at least one turn (12), which is formed by an integrated elongated track (14) made of a conductive material, wherein the interior margin of the conductive track (14) comprises at least one recess (30). The invention makes it possible in particular to increase the inductivity of the element (10) in a given available space on the substrate of an integrated circuit.

Abstract: A high Q on-chip inductor includes a primary winding and an auxiliary winding that is coupled to receive a proportionally opposite representation of an input of the primary winding. Further, the auxiliary winding has an admittance that is greater than the admittance of the primary winding thereby yielding an asymmetry in the admittances. As such, a push/pull mechanism is obtained in a 2-port system (e.g., 1st and 2nd nodes of the primary winding) that produces a large Q factor for an on-chip inductor.

Abstract: An integrated bobbin transformer assembly includes a first planar assembly, a second planar assembly, and a connecting assembly. The first planar assembly includes a first winding. In one embodiment of the invention, the second planar assembly includes an additional first winding. The connecting assembly is integrated into the first planar assembly and the second planar assembly. The connecting assembly includes a second winding. A magnetic core magnetically couples a voltage from the second winding to the first winding. In an embodiment of the invention, the magnetic core magnetically couples a voltage from the second winding to the first winding and the additional first winding.

Abstract: A transformer balun is obtained that is symmetrical in structure, provides high current, or high voltage, amplification and has high coupling coefficients while maintaining minimal overall size. The balun structure includes primary and secondary metal windings at separate layer interfaces. The primary and secondary metal windings are symmetrical and can have any number of turns, which is only limited by integrated circuit area and capacitance. Accordingly, the, primary and secondary windings may be on as many layers as needed. Further, the primary and/or secondary may include a center tap ground, which enables the winding to be used as a differential port.

Abstract: An inductor with self-damping properties for use in multiple applications including for high power broadband frequency applications is provided by a coil having an input end and an output end and wound about a core of magnetically permeable material and an eddy current generator incorporated either at the time of manufacture or post manufacturing. The core can be air (e.g., a hollow coil of wire). Alternative core materials are iron, iron powder, steel laminations and other appropriate materials. The core may be incorporated into some form of frame whether I shaped, U shaped, E shaped or of an encapsulated shape arrangement. The inductor's Q value may be changed selectively by deliberately inducing eddy currents in preferred locations. The eddy currents are induced into the inductors and have the effect of introducing a back EMF which is designed and scaled appropriately to adjust the Q value at the desired frequency resulting is less phase distortion.

Abstract: A method of producing a chip inductor including the steps of inserting a conductive wire made of a metallic wire into a metallic mold, supporting both end portions of the conductive wire on support portions provided on inner surfaces of the metallic mold so as to position the conductive wire in the approximate center portion of the metallic mold, casting magnetic ceramic slurry into the metallic mold, molding the ceramic slurry case in the metallic mold by wet pressing to obtain a molding body having the conductive wire embedded therein, firing the molding body, and forming external electrodes on both end surfaces of the fired magnetic core such that the external electrodes are connected to both end portions of the conductive wire.

Abstract: A high Q inductive clement with low losses, high inductance and high efficiency is disclosed. The high Q inductive element with one or more inductive loops is formed over a silicon micro structure with thin support elements formed by deep plasma etching in bulk silicon. The support elements, which may have different configurations, such as walls or columns, provide mechanical stability to the inductive loops and reduce the parasitic capacitance and the losses to the substrate.

Abstract: An integrated circuit having an inducting device with a symmetric inductor. The inducting device comprises a first and second inductor. The first inductor is formed in a first conductive layer and is approximately symmetric about a plane of symmetry. The second inductor is formed in a second conductive layer that is at a select vertical distance from the first conductive layer. The second inductor is further approximately laterally aligned with the first inductor.

Abstract: A printed circuit transformer includes a first wiring layer, a second wiring layer, a primary conductive coil including a first conductive trace, a second conductive trace, a third conductive trace, and a fourth conductive trace, which are on the first wiring layer or the second wiring layer, a first via plug, a second via plug, and a third via plug for connecting the ends of the conductive traces in the primary conductive coil, and a secondary conductive coil including a fifth conductive trace, a sixth conductive trace, a seventh conductive trace, and a eighth conductive trace, which are on the first wiring layer or the second wiring layer, a fourth via plug, a fifth via plug, and a sixth via plug for connecting the ends of the conductive traces in the secondary conductive coil.

Abstract: A new structure is provided for the creation of an inductor on the surface of a silicon semiconductor substrate. The inductor is of spiral design and perpendicular to the plane of the underlying substrate. Conductor line width can be selected as narrow or wide, ferromagnetic material can be used to fill the spaces between the conductors of the spiral inductor. The spiral inductor of the invention can further by used in series or in series with conventional horizontal inductors.

Abstract: To reduce pattern resistance including a secondary winding in a power supply module having a pair of secondary windings transformer-coupled with a primary winding. The pair of secondary windings coupled with a primary winding through a transformer is drawn out in both directions each other, and further disposed on different layers. Also, output pattern films are disposed on both sides of the second and third layers, so that pattern films of wide shape can be produced.

Abstract: An integrated circuit transformer includes a first conductive segment, a second conductive segment, a fifth conductive segment, and a sixth conductive segment, all disposed inside a first insulating layer. The first conductive segment, the second conductive segment, the fifth conductive segment, and the sixth conductive segment are respectively symmetric to a first line. The transformer further includes a third conductive segment and a fourth conductive segment, both formed inside a second insulating layer. The third conductive segment and the fourth conductive segment are symmetric to a second line. The transformer further includes a fist connection conductive segment connecting the fifth conductive segment to the second conductive segment, and a second connection conductive segment connecting the sixth conductive segment to the first conductive segment.

Abstract: An inductor element is formed by helically winding a first conductor and a second conductor by causing both conductors to hold on the condition in parallel to each other. In this case, by causing the first conductor to intersect the second conductor at a predetermined position to replace individual positions. By virtue of this arrangement, individual length of the first and second conductors substantially equal to each other, whereby forming up such an inductor element characterized by less loss of current and higher Q values.

Abstract: In accordance with the invention, a high quality magnetic device is produced without manual intervention by the step of providing a substrate including an aperture and conductive coil extending peripherally around the aperture and bonding together two parts of a magnetic body extending through the aperture. The two parts have substantially planar mating surfaces, and the bonding is effected by securing one of the parts to the substrate, applying adhesive to the portion of its mating surface exposed within the aperture, and pressing the mating surface of the second part into contact with the mating surface of the first part. During pressing, the mating surfaces are rotated in a reciprocating fashion to spread the adhesive into a thin, highly uniform film.

Abstract: In an I-conductor for the high-frequency or microwave systems, two uniform cores are disposed parallel to each other with a gap therebetween and a coil is disposed on each core in such a way that, when energized by an HF current, a magnetic circuit through the two cores is generated by way of the gap at one end of the arrangement. The magnetic field forming windings are uniform. As cores, magnetically anisotropic materials may be used.

Abstract: An electrical component employing a metalized composite film with a heat-seal layer is disclosed. The use of the heat-seal layer in the disclosed configuration allows a wound film capacitor integral with a primary coil to be made without there being a need to impregnate the wound film unit with an epoxy or other resin, thus saving substantial manufacturing time.

Abstract: A method for producing an on-chip signal transforming device. The method includes providing a substrate, and laying a first conductive layer above the substrate, wherein the first conductive layer has a plurality of interleaved inductors. The method then includes laying a second conductive layer above the substrate, wherein the second conductive layer has at least one inductor.

Abstract: A coil for a particularly compact coil for an electrical machine, in which coil an electrical conductor is wound with a number of turns, which are arranged one above the other in a number of layers, with the turns in a first layer being arranged parallel alongside one another, and the turns in a second layer being inclined through a predetermined inclination angle (a), with respect to the turns in the first layer, at a predetermined point and being arranged parallel alongside one another.

Abstract: A winding for a transformer or coil includes a ribbon electrical conductor and at least one ribbon insulation material layer fitted thereto or applied as ribbon material thereto. The conductor and the insulating material layer are wound to form turns around a winding core along a winding axis. The individual turns of the winding have a predetermined winding angle with respect to the winding axis. A number of turns are located axially alongside one another form one layer, and at least two radially adjacent layers of turns are provided. A first layer of turns is radially adjacent to a second layer produced by changing the winding direction by folding the electrical conductor and the insulating material layer. The total angle, which is produced by the folding, between the longitudinal direction of the ribbon insulating material in the first layer and the corresponding direction of the second layer corresponds to twice the winding angle.

Abstract: Metallic coils sheets (34, 36, 38) are planar and include center windows (34a, 36a, 38a). Slits (34b, 36b, 38b) extend outward through the respective sheets from the windows. Connection terminals (34c, 34d; 36c, 36d; 38c, 38d) are provided on the sheets at locations facing across the respective slits. The metallic coil sheets are stacked, and adjacent ones of the stacked metallic coil sheets are electrically connected by means of the connection terminals. A core (60, 62) is disposed in the windows of the stacked metallic coil sheets. The metallic coil sheets are individually covered with an insulating coating.

Abstract: The present invention describes a planar transformer having a plurality of juxtaposed magnetic cores as well as a two-layer printed circuit board for spiralling a plurality of windings. Each arm of a plurality of juxtaposed magnetic cores respectively goes through a corresponding hole in the middle of these windings, to magnetically couple the current in the main winding to the other windings.

Abstract: A laminated balun transformer includes first line elements which are connected in series through a relay terminal, to constitute an unbalanced transmission line. Other line elements each constitute a balanced transmission lines. Strip lines are electromagnetically coupled to constitute a coupler. Similarly, other line elements are electromagnetically coupled to constitute a coupler. A ground terminal is connected to the balanced transmission lines, which are constituted by a pair of the line elements. Meanwhile, a shield terminal is connected to leading portions of shield electrodes. These two terminals are electrically independent of each other.

Abstract: An inductor of the invention has a laminated structure in which an insulating layer and a wiring layer are laminated alternately on a semiconductor substrate. The laminated structure includes at least two wiring layers and an insulating layer interposed between them. A first wiring layer has a first winding part and a second winding part wound around on the same plane, which are disposed adjacently to each other. A second wiring layer has a wiring part having a single path from one terminal thereof to the other. The first and second winding parts are electrically connected to the wiring part. When a voltage is applied between one terminal of the first winding part and one terminal of the second winding part, currents flow in the first and second winding parts are in the opposite directions.

Abstract: One configuration of the present invention is a radio frequency transformer board that has a planar dielectric substrate having a first surface, an opposite second surface, and a transformer. The transformer includes a first elongate conductor disposed on the first surface and having a first end and a second end, a second elongate conductor disposed on the second surface and having a first end and a second end. The first end of the first conductor and the second end of the second conductor are disposed proximate an edge of the substrate and spaced apart from one another along the edge. The second end of the first conductor and the first end of the second conductor are electrically shorted to one another proximate the edge of the substrate.

Abstract: A coil module applied in a transformer. The coil module includes at least one conductive wire and an insulating encapsulator. A portion of the conductive wire is wound into coils of a certain loop number. The coils are encapsulated by the insulating encapsulator. A metal core is provided when manufacturing a transformer. Desired coil modules are selected and installed onto the transformer so as to surround the metal core of the transformer. The coil modules are thus connected in series or in parallel for forming a desired specification of the transformer.

Abstract: An on-chip differential multi-layer inductor includes a 1st partial winding on a 1st layer, a 2nd partial winding on the 1st layer, a 3rd partial winding on a 2nd layer, a 4th partial winding on the 2nd layer, and an interconnecting structure. The 1st and 2nd partial windings on the 1st layer are operably coupled to receive a differential input signal. The 3rd and 4th partial windings on the 2nd layer are each operably coupled to a center tap. The interconnecting structure couples the 1st, 2nd, 3rd and 4th partial windings such that the 1st and 3rd partial windings form a winding that is symmetrical about the center tap with a winding formed by the 2nd and 4th partial windings. By designing the on-chip differential multi-layer inductor to have a desired inductance value, a desired Q factor, and a desired operating rate, a desired resonant frequency and corresponding desired capacitance value can be determined.

Abstract: An inductor is fabricated on a substrate having a top surface and a bottom surface. The inductor includes a plurality of holes extending through the substrate, wherein the plurality of holes interconnect the top surface and the bottom surface of the substrate. The inductor also includes a plurality of conductive posts formed in the plurality of holes and a plurality of conductive segments formed on the top surface and on the bottom surface that interconnect the conductive posts such that a continuous conductive coil is formed. The inductor also includes a magnetic core that occupies substantially the entire volume enclosed by the conductive coil.

Abstract: A method for arranging unit inductors of an inductor having metal wiring that can make a full use of self-inductance and mutual-inductance which are determined based on the proportion of the area of an unit inductor and the proportion of the overlapping area with another unit inductor, and an inductor adopting the unit inductor arranging method.

Abstract: A transformer comprises E-type core parts, a cylindrical core part, a second substrate, first substrates, and an insulating sheet. Each of the second substrate and the fist substrates includes a penetration hole. A coil is wired around the penetration hole. The second substrate is wrapped with an insulating sheet, together with the cylindrical core part. The second substrate and the cylindrical core part are sandwiched between cylindrical core legs of the core parts, through the insulating sheet.

Abstract: An integrated circuit transformer. A substrate supporting multiple layers of materials of an integrated circuit is provided with a first metallization layer comprising a first set of turns of a primary winding of a transformer, and a second set of turns of a secondary winding of the transformer. A insulation layer is deposited over the first metallization layer, and a second metallization layer bearing a second set of turns of the primary winding, and an optional third set of turns of a second secondary winding. A via connection connects one end of the first set of turns of the primary winding to the second turns of the primary winding located on the second metallization layer. The result is a transformer structure where the primary winding is provided on multiple layers and each secondary winding is confined to a single layer.

Abstract: The present invention discloses a distributed power amplifier topology and device that efficiently and economically enhances the power output of an RF signal to be amplified. The power amplifier comprises a plurality of push-pull amplifiers interconnected in a novel circular geometry that preferably function as a first winding of an active transformer having signal inputs of adjacent amplification devices driven with an input signal of equal magnitude and opposite phase. The topology also discloses the use of a secondary winding that matches the geometry of primary winding and variations thereof that serve to efficiently combine the power of the individual power amplifiers. The novel architecture enables the design of low-cost, fully-integrated, high-power amplifiers in the RF, microwave, and millimeter-wave frequencies.

Abstract: The object of the invention is to provide a slotted current acquisition coil according to the Rogowski principle in which the printed circuit board base of the measuring coil can be opened to insert an electrical conductor to be measured without having to interrupt the latter. To this end, the two printed circuit board segments linked together by a hinge are opened. Twisting a single-piece printed circuit board also opens the arrangement for inserting the conductor to be measured.

Abstract: A laminated electronic component comprising: a plurality of parallel first conductive patterns, which are laminated via a magnetic layer to a plurality of parallel second conductive patterns, the first and second conductive patterns being alternately connected to each other via through-holes, thereby forming a spiral coil inside a laminated body, the axis of the spiral coil being parallel to a mount face; wherein the magnetic layer, provided between the plurality of first conductive patterns and the plurality of second conductive patterns, comprises non-magnetic sections which are provided at positions corresponding to ends of the conductive patterns and extend parallel to the axis of the coil, and a method for manufacturing the same.

Abstract: An inductive component, such as a transformer, is made by applying conductive tracks onto a thin, foldable substrate (10) and then Z-folding the substrate so that the conductive tracks from a coil. A ferrite core is then placed through the coil. In order to maximise the current capacity of the transformer, there are electrical connections between leaves not only around each fold line (14) where the track traverses the fold line, but also between specially prepared areas X-X of the tracks which end up facing each other from adjacent folds once the substrate has been folded.

Abstract: A planar inductor having at least a helical coil and a coating of ferromagnetic material deposited on a flat carrier. The inductance and/or the magnetic coupling of a plurality of coils or windings of the inductor can be set precisely through the ferromagnetic material, which is inside an insulant window that is fixed to the carrier, being deposited on the carrier during the coating process.

Abstract: A flat coil assembly (10) comprising at least one electrically conductive layer (12) arranged in a substantially uniplanar spiral arrangement of loops with a void in a center of the spiral, and a core (14) made from mu-metal, wherein the core extending on one side of the uniplanar spiral arrangement over at least a first portion of the loops from an external loop to an internal loop, crossing over, through the void in the center and extending over at least a second portion of the loops on the other side of the uniplanar spiral arrangement.

Abstract: An method of manufacturing an inductor having a large current capacity which includes a magnetic sintered body formed via wet pressing treatment and a coil assembly disposed within the magnetic sintered body. The coil assembly is defined by a substantially cylindrical magnetic core member which is wound by a coil. Both ends of the coil of the coil assembly are respectively and electrically connected to an input electrode and an output electrode which are respectively disposed on two mutually facing end surfaces of the magnetic sintered body.

Abstract: The coil and coil system is provided for integration in a microelecronic circuit. The coil is placed inside an oxide layer of a chip, and the oxide layer is placed on the substrate surface of a substrate. The coil comprises one or more windings, whereby the winding(s) is/are formed by at least segments of two conductor tracks, which are each provided in spatially spaced-apart metalization levels, and by via-contacts which connect these conductor track(s) and/or conductor track segments. In order to be able to produce high-quality coils, a coil is produced with the largest possible coil cross-section, whereby a standard metalization, especially a standard metalization using copper, can, however, be used for producing the oil. To this end, the via contacts are formed from a stack of two ore more via elements arranged one above the other. Parts of the metalization levels can be located between the via elements.

Abstract: An on-chip signal transforming device includes a substrate and a first conductive layer above the substrate, wherein the first conductive layer has a plurality of interleaved inductors. The device further includes a second conductive layer above the substrate, wherein the second conductive layer has at least one inductor.

Abstract: An inductor is integrated in VLSI and ULSI technology products for very high frequency applications. The inductor is in a microstrip transmission line configuration which can be designed in a form of straight line, spiral line or Meander line. The inductor is formed by shorting the microstrip center conductor to the lower level ground plane at one end of the transmission line. This results in an inductance which, for a given design of transmission line, and in a specified frequency range, is independent of frequency, within the operating design range. The microstrip transmission line provides an inductance which could be used on any type of substrate, with either low or high resistivity. The microstrip transmission line could utilize two or all of the metal wiring levels of the technology, allowing a wide range of inductance and quality factor design tradeoffs.

Abstract: A silicon-based inductor in a semiconductor is disclosed. One embodiment provides for an inductor having a metal region comprising turns. The metal region has spacing between adjacent turns. The width of the spacing varies. The spacing is pre-determined to optimize the performance of the inductor by reducing eddy currents in the turns and reducing eddy currents induced in a substrate. One embodiment provides for an inductor having a spiral structure. The spiral structure may have a number of turns with the spacing between the turns of the inductor being larger near the inside of the spiral structure. A large spacing between the inductor's inner turns may serve to reduce both conductor eddy currents and the induced substrate current. Thus, the structure improves the inductor's overall performance.

Abstract: A coil device includes a first magnetic substrate, a laminated body disposed on the first magnetic substrate and having insulating layers, coil patterns, and at least one through-hole, a magnetic layer covering the upper surface of the laminated body, an adhesive layer disposed on the magnetic layer, and a second magnetic substrate disposed on the adhesive layer and bonded to the magnetic layer via the adhesive layer. The insulating layers defining an insulator and the coil patterns for forming a coil are alternately stacked so that the coil patterns are arranged in the insulator, the through-hole is located at an area where the coils are not located and extends from the upper surface of the laminated body to the first magnetic substrate. The magnetic layer has at least one portion extending through the through-hole to contact the first magnetic substrate. The adhesive layer is nonmagnetic, and the laminated body is sandwiched between the first and second substrates.

Abstract: The present invention provides a coil component includes: a coil section having a through hole and composed of a plurality of ring sections formed of a metallic flat plate disposed in a plane, connected to each other at ring connecting sections, having slits formed by cutting part of the ring sections, and bent at the ring connecting sections and placed one on top of another, terminals connected to the coil section, and a package member covering the coil section and projecting the terminals therefrom. With this structure, the coil component operates in a high-frequency region, ensuring an inductance and infinitesimal direct-current resistance while being adaptable to a large current, and can be miniaturized.

Abstract: The manufacturing method for components of the inductive type, in particular inductance coils, transformers or antennae, consists in making by micro-machining simultaneously on a first substrate made of magnetic material a plurality of first parts (1) connected to each other by connecting elements (2) or a connecting support, inserting on the arms (8a, 8b, 8c) of these first parts (1) a printed multi-layered plate (4, 5) having openings for the arms and metal windings ending in at least two contact pads (7a, 7b), in placing and securing a second substrate made of magnetic material on the first substrate and the plate, said second substrate having undergone micro-machining to obtain second parts (13) complementary to the first parts. These second parts are connected to each other by connecting elements or a connecting support.

Abstract: The present invention relates to inductors with improved inductance and quality factor. In one embodiment, a magnetic thin film inductor is disclosed. In this embodiment, magnetic thin film inductor includes a plurality of elongated conducting regions and magnetic material. The plurality of elongated conducting regions are positioned parallel with each other and at a predetermined spaced distance apart from each other. The magnetic material encases the plurality of conducting regions, wherein when currents are applied to the conductors, current paths in each of the conductors cause the currents to generally flow in the same direction thereby enhancing mutual inductance.